Product End-of-Life Disassembly Instr uctions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]
HP 2509m Flat Panel Monitor

Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 1
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin 0
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights, 4
scanner lamps, switches, batteries {Backlight
Assembly (I
type)
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 1
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 27
Electrolytic Capacitors / Condensers measuring 1
greater than 2.5 cm in diameter or height
External electrical cables and cords 4
Gas Discharge Lamps 4
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos 0

EL-MF877-00 Page 1
Template Revision A
Components, parts and materials containing 0
refractory ceramic fibers
Components, parts and materials containing 0
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1: Bushing Screwdriver (HEX5.5MM)
Description #2: Crossing Screwdriver 2#
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Lay the monitor on the desk, remove the VESA mounting cover with hand.
2. Unlock the 4 screws which they fix the VESA mounting by 2# screwdriver.
3. Unlock the 4 screws which they fix the stand by 2# screwdriver.
4. Remove the front bezel with hand from product
5. Remove the backcover with hand from Product.
6. Seprate the Keypad and backcover with hand
7. Unlock the 2 screws which they fix the chassis and panel, and then pull the LVDS out .
8. Unlock 2 screws for DVI port, D-SUB port, Power port, and 7 screws which they fix between chassis and PCA
boards, power board and IF board. Pull the wires out.
9. Unlock the 2 screws which they fix between the bottom-side and the base, and then unlock the 12 screws which they
fix between the base and base-cover.
10. Remove the arm-rear and then unlock the 4 screws which they fix between the arm-front and the rion.
11. To see the detail process are as attached files including assemble panel.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. System disassembly methods :

2. Panel disassembly methods:

EL-MF877-00 Page 2
Template Revision A
Action Tool Photo

Whole
set
N/A
assem
bly
Action Tool Photo

Remov
e the
coin
VESA
cover
Action Tool Photo

#2
Remov Crossi
e the 4 ng
screws Screw
Driver
Action Tool Photo

#2
Remov Crossi
e the 4 ng
screws Screw
Driver
Action Tool Photo

Remov
e the hand
bezel
Action Tool Photo

Remov
e the Sharp
HP object
LOGO
Action Tool Photo

Separa
te the
bucket
assem
bly &
panel
assem hand
bly
Pull
out the
keypad
cable
Action Tool Photo
Remov
e the
SUB-
bezel
from
the
bucket
assem
bly
hand
Take
out the
KEYP
AD BD
from
the
bucket
assem
bly
Action Tool Photo
Remov
e the
mid
cover
from
the
bucket
assem Hand
bly and a
sharp
Remov object
e the
OSD &
power
button
from
the mid
cover
Action Tool Photo

Remov
e6
#2
screws
Crossi
which
ng
fix the
Screw
2
Driver
speake
rs
Action Tool Photo

Remov
e5
screws
which
fix
#2
metal
Crossi
shield
ng
Pull Screw
out the Driver
metal
Hand
shield
from
the
chassi
s
Action Tool Photo

Remov
e4
screws
which
lock
the #2
chassi Crossi
s& ng
panel Screw
Pull Driver
out the Hand
light
cable
from
the PI
BD
Action Tool Photo
Remov
e2
screws
which
lock
the AC
socket #2
Pull Crossi
out the ng
LVDS Screw
cable Driver

Remov hand
e the 4
screws
which
DVI &
VGA
connec
tor
Action Tool Photo

Remov
e7
#2
screws
Crossi
which
ng
lock
Screw
the
Driver
PI/IF
BD
Action Tool Photo

N/A N/A

VIEW
Action Tool Photo

Pull
out the
cables
from
the
hooks Hand

Take
out the
PCBA
S
Action Tool Photo

Stand
assem N/A
bly
Action Tool Photo

Unlock
#2
six
Crossi
screws
ng
which
Screw
fix the
Driver
Base
Action Tool Photo

Remov
e six
rubber
foots
#2
and
Crossi
unlock
ng
two
Screw
screws
Driver
which
fix the
Base
Cover
Action Tool Photo

Unlock
#2
the
Crossi
screw
ng
which
Screw
fix the
Driver
POM
Action Tool Photo

Unlock
the
#2
four
Crossi
screws
ng
which
Screw
fix the
Driver
Arm
front
Action Tool Photo

Unlock
two
M 8.0
nuts
spanne
which
r
fix the
Hinge
 Method of Lamp Ass’y disassembly on LM250WF1-TLA1

Step1 : Rear side view Step2 : Unfix the screws(3points) Step3 : Remove the Cover Shield

Step4 : Separate wires from the tape Step5 : Dismantle the case top(Down) Step6 : Dismantle the case top(left/right)

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 Method of Lamp Ass’y disassembly on LM250WF1-TLA1

Step7 : Separate case top(push the case Step8 : Separate Board Assy Step9 : Unfix the BL Screw
top because of damages on COF)

Step10 : Remove S/Main Step11 : remove the Optical Sheets Step12 : Grip the hole on the Lamp
housing using a pincette.

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 Method of Lamp Ass’y disassembly on LM250WF1-TLA1

Step13 : Pull the Lamp Ass’y to outside Step14 : Separate remaining part of Final : Lamp Ass’y
about 10cm using pencette. Lamp Ass’y from Cover bottom using
your hand.

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