Advances in Interconnect Technologies: An International Journal (AITIJ)

http://airccse.com/aitij/index.html

Call for papers

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original

and significant contributions relating to the theory, design, performance and reliability of
interconnect, including materials, analysis, modeling and simulation of interconnect. The journal
proposes to stimulate the development of latest technology in industry and academia. High
quality review papers and short communications are also acceptable.

Topics of the interests

• Emerging Materials
• CNT/ Graphene Interconnects
• Modeling and Simulation
• Testing
• RFIC
• Optical Interconnects
• Wireless Interconnects
• Microstrip Lines
• Analog and Mixed Signals
• Dedicated Software and Systems for Developing Interconnect Technology
• On-Chip and Off-Chip Interconnects
• EMC/EMI
• FPGA/ASICs
• Fabrication Techniques
• Neural Networks
• Parasitics Issues
• Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through Email: aitijjournal@airccse.com.
Submissions must be original and should not have been published previously or be under
consideration for publication while being evaluated for this Journal.

Important Dates

 Submission Deadline : February 14, 2020

 Notification : March 14, 2020
 Final Manuscript Due : March 22, 2020
 Publication Date : Determined by the Editor-in-Chief

Contact Us

Here’s where you can reach us: aitijjournal@yahoo.com or aitijjournal@airccse.com

For other details please visit: http://airccse.com/aitij/index.html