PROBLEM 5.

8
KNOWN: The temperature-time history of a pure copper sphere in an air stream.
FIND: The heat transfer coefficient between the sphere and the air stream.
SCHEMATIC:

ASSUMPTIONS: (1) Temperature of sphere is spatially uniform, (2) Negligible radiation

exchange, (3) Constant properties.
3
PROPERTIES: Table A-1, Pure copper (333K):  = 8933 kg/m , cp = 389 J/kgK, k = 398
W/mK.
ANALYSIS: The time-temperature history is given by Eq. 5.6 with Eq. 5.7.
 t  t  1
 exp    where Rt  As   D 2
i  R t Ct  hAs
 D3
C t   Vc p V
6
  T  T .
Recognize that when t = 69s,
  t   55  27  C

 t   69s 
  0.718  exp     exp   
i  66  27  C  t   t 
and solving for  t find
 t  208s.
Hence,

h
 Vcp

 
8933 kg/m3  0.01273 m3 / 6 389J/kg  K
As t  0.0127 2 m 2  208s
h  35.3 W/m 2  K. <
COMMENTS: Note that with Lc = Do/6,
hLc 0.0127
Bi   35.3 W/m 2  K  m/398 W/m  K  1.88 10-4 .
k 6
Hence, Bi < 0.1 and the spatially isothermal assumption is reasonable.
 PROBLEM 5.13
KNOWN: Wafer, initially at 100°C, is suddenly placed on a chuck with uniform and constant
temperature, 23°C. Wafer temperature after 15 seconds is observed as 33°C.
FIND: (a) Contact resistance, R ′′tc , between interface of wafer and chuck through which helium slowly
flows, and (b) Whether R ′′tc will change if air, rather than helium, is the purge gas.

SCHEMATIC:

PROPERTIES: Wafer (silicon, typical values): ρ = 2700 kg/m3, c = 875 J/kg⋅K, k = 177 W/m⋅K.
ASSUMPTIONS: (1) Wafer behaves as a space-wise isothermal object, (2) Negligible heat transfer from
wafer top surface, (3) Chuck remains at uniform temperature, (4) Thermal resistance across the interface
is due to conduction effects, not convective, (5) Constant properties.
ANALYSIS: (a) Perform an energy balance on the wafer as shown in the Schematic.
E& ′′in − E& ′′out + E& g = E& st (1)

−q′′cond = E& ′′st (2)

T ( t ) − Tc dT
− w = ρ wc w (3)
R ′′tc dt
Separate and integrate Eq. (3)

t dt T dTw Tw ( t ) − Tc ⎡ t ⎤
−∫ = w ∫ (4) = exp ⎢ − ⎥ (5)
0 ρ wcR ′′tc Twi Tw − Tc Twi − Tc ⎣ ρ wcR ′′tc ⎦
Substituting numerical values for Tw(15s) = 33°C,
o
( 33 − 23) C = exp ⎢ −
⎡ 15s ⎤
⎥ (6)
(100 − 23)o C ⎢⎣ 2700 kg m3 × 0.758 ×10−3 m × 875 J kg ⋅ K × R ′′tc ⎥⎦

R ′′tc = 0.0041m 2 ⋅ K W <

(b) R ′′tc will increase since kair < khelium. See Table A.4.

COMMENTS: Note that Bi = Rint/Rext = (w/k)/ R ′′tc = 0.001. Hence the spacewise isothermal
assumption is reasonable.
 PROBLEM 5.60

KNOWN: Long rod with prescribed diameter and properties, initially at a uniform temperature, is heated
in a forced convection furnace maintained at 750 K with a convection coefficient of h = 1000 W/m2⋅K.
FIND: (a) The corresponding center temperature of the rod, T(0, to), when the surface temperature T(ro,
to) is measured as 550 K, (b) Effect of h on centerline temperature history.
SCHEMATIC:

ASSUMPTIONS: (1) One-dimensional, radial conduction in rod, (2) Constant properties, (3) Rod, when
initially placed in furnace, had a uniform (but unknown) temperature, (4) Fo ≥ 0.2.

ANALYSIS: (a) Since the rod was initially at a uniform temperature and Fo ≥ 0.2, the approximate
solution for the infinite cylinder is appropriate. From Eq. 5.52b,

( )
θ * r* , Fo = θ o* ( Fo ) J 0 ζ1r*( ) (1)

where, for r* = 1, the dimensionless temperatures are, from Eq. 5.34,

T ( ro , t o ) − T∞ T ( 0, t o ) − T∞
θ * (1, Fo ) = θ o* ( Fo ) = (2,3)
Ti − T∞ Ti − T∞
Combining Eqs. (2) and (3) with Eq. (1) and rearranging,

T ( ro , t o ) − T∞ T ( 0, t o ) − T∞
= J 0 (ζ1 ⋅1)
Ti − T∞ Ti − T∞
1
T ( 0, t o ) = T∞ + ⎡T ( ro , t o ) − T∞ ⎤⎦
J 0 (ζ 1 ) ⎣
(4)

The eigenvalue, ζ1 = 1.0185 rad, follows from Table 5.1 for the Biot number

hro 1000 W m ⋅ K ( 0.060 m 2 )

2
Bi = = = 0.60 .
k 50 W m ⋅ K

From Table B-4, with ζ1 = 1.0185 rad, J0(1.0185) = 0.7568. Hence, from Eq. (4)

1
T ( 0, t o ) = 750 K + [550 − 750] K = 486 K <
0.7568

(b) Using the IHT Transient Conduction Model for a Cylinder, the following temperature histories were
generated.
Continued...
 PROBLEM 5.60 (Cont.)

500

Centerline temperature, To(K)

400

300
0 100 200 300 400

Time, t(s)

h = 100 W/m^2.K
h = 500 W/m^2.K
h = 1000 W/m^2.K

The times required to reach a centerline temperature of 500 K are 367, 85 and 51s, respectively, for h =
100, 500 and 1000 W/m2⋅K. The corresponding values of the Biot number are 0.06, 0.30 and 0.60.
Hence, even for h = 1000 W/m2⋅K, the convection resistance is not negligible relative to the conduction
resistance and significant reductions in the heating time could still be effected by increasing h to values
considerably in excess of 1000 W/m2⋅K.

COMMENTS: For Part (a), recognize why it is not necessary to know Ti or the time to. We require that
Fo ≥ 0.2, which for this sphere corresponds to t ≥ 14s. For this situation, the time dependence of the
surface and center are the same.
 PROBLEM 5.87
KNOWN: Tile-iron, 254 mm to a side, at 150°C is suddenly brought into contact with tile over a
subflooring material initially at Ti = 25°C with prescribed thermophysical properties. Tile adhesive
softens in 2 minutes at 50°C, but deteriorates above 120°C.
FIND: (a) Time required to lift a tile after being heated by the tile-iron and whether adhesive temperature
exceeds 120°C, (2) How much energy has been removed from the tile-iron during the time it has taken to
lift the tile.
SCHEMATIC:

ASSUMPTIONS: (1) Tile and subflooring have same thermophysical properties, (2) Thickness of
adhesive is negligible compared to that of tile, (3) Tile-subflooring behaves as semi-infinite solid
experiencing one-dimensional transient conduction.
PROPERTIES: Tile-subflooring (given): k = 0.15 W/m⋅K, ρcp = 1.5 × 106 J/m3⋅K, α = k/ρcp = 1.00 ×
10-7 m2/s.
ANALYSIS: (a) The tile-subflooring can be approximated as a semi-infinite solid, initially at a uniform
temperature Ti = 25°C, experiencing a sudden change in surface temperature Ts = T(0,t) = 150°C. This
corresponds to Case 1, Figure 5.7. The time required to heat the adhesive (xo = 4 mm) to 50°C follows
from Eq. 5.60
T ( x o , t o ) − Ts ⎛ xo ⎞
= erf ⎜ ⎟
Ti − Ts ⎜ 2 (α t )1/ 2 ⎟
⎝ o ⎠
⎛ ⎞
50 − 150 ⎜ 0.004 m ⎟
= erf ⎜ ⎟
25 − 150
⎜
⎝ (
⎜ 2 1.00 × 10−7 m 2 s × t 1/ 2 ⎟
o ⎟
⎠ )
(
0.80 = erf 6.325t o−1/ 2 )
to = 48.7s = 0.81 min
using error function values from Table B.2. Since the softening time, Δts, for the adhesive is 2 minutes,
the time to lift the tile is
t l = t o + Δt s = ( 0.81 + 2.0 ) min = 2.81min . <
To determine whether the adhesive temperature has exceeded 120°C, calculate its temperature at t l =
2.81 min; that is, find T(xo, t l )
⎛ ⎞
T ( x o , t l ) − 150 ⎜ 0.004 m ⎟
= erf ⎜ ⎟
25 − 150
⎜
⎝ ( )
⎜ 2 1.0 × 10−7 m 2 s × 2.81× 60s 1/ 2 ⎟
⎟
⎠
Continued...
 PROBLEM 5.87 (Cont.)

T ( x o , t l ) − 150 = −125erf ( 0.4880 ) = −125 × 0.5098

T ( x o , t l ) = 86o C <
Since T(xo, t l ) < 120°C, the adhesive will not deteriorate.
(b) The energy required to heat a tile to the lift-off condition is
t
Q = ∫ l q′′x ( 0, t ) ⋅ As dt .
0
Using Eq. 5.61 for the surface heat flux q s′′ (t) = q ′′x (0,t), find

t k ( Ts − Ti ) dt 2k ( Ts − Ti )
Q=∫ l As = As t1/
l
2
0
(πα ) 1/ 2 t1/ 2
(πα ) 1/ 2

o
2 × 0.15 W m ⋅ K (150 − 25 ) C
× ( 0.254 m ) × ( 2.81× 60s )
2 1/ 2
Q= = 56 kJ <
( )
1/ 2
π ×1.00 ×10−7 m 2 s

COMMENTS: (1) Increasing the tile-iron temperature would decrease the time required to soften the
adhesive, but the risk of burning the adhesive increases.

(2) From the energy calculation of part (b) we can estimate the size of an electrical heater, if operating
continuously during the 2.81 min period, to maintain the tile-iron at a near constant temperature. The
power required is
P = Q t l = 56 kJ 2.81× 60s = 330 W .
Of course a much larger electrical heater would be required to initially heat the tile-iron up to the
operating temperature in a reasonable period of time.