Compressing

Based from Kehr and Schoelzel (1965) also found a sharp decrease in the resistance of
the mat to compression as increased quantities of water were sprayed on the mat surface. This,
again, was the result of the reduced compressive strength of wood at higher moisture levels

According to Strickler (1959) the time required for heating the mat core decreased with
increasing surface moisture content. At higher surface moisture contents (above 15 percent) the
MOR and MOE decreased when the core was at 9 percent moisture content. The internal bond
also decreased but the thickness swelling improved as the surface moisture content increased.
Strickler (1959) showed that the time required for heating the mat core decreased with increasing
surface moisture content. At higher surface moisture contents (above 15 percent) the MOR and
MOE decreased when the core was at 9 percent moisture content, The internal bond also
decreased but the thickness swelling improved as the surface moisture content increased.

Based from Lehmann et al. (1973) with a catalyzed urea-formaldehyde adhesive, a

centerline temperature above 200° F for 0.25 minute was sufficient to cure the adhesive. The rate
of heat transfer to the center controlled the total pressing time for a given board; therefore,
shorter press times were obtained with higher press temperatures, “steam shock” 34 treatments,
and thinner boards. In the same study, phenol-formaldehyde resins were found to have a slower
curing rate than the urea-formaldehyde binders. In this case, 1.75 minutes above 220° F was
required to satisfactorily cure the adhesive in the core. The catalysts used in this study
(methylethyl ketone hydroperoxide, potassium chromate, and phenol-resorcinol resin) were not
effective in reducing press times of the phenol-formaldehyde adhesives. The data appeared to
indicate that phenol-formaldehyde adhesives are much more adversely affected by high moisture
levels in the curing zone than are the ureaformaldehyde resins.

Based from Lynam (1959) longer press cycles at lower temperatures were desirable
because less water was removed from the board and the subsequent moisture adsorption from the
atmosphere was reduced. Long press cycles also allowed more water to escape but Lynam
(1959) believed long cycles at lower temperatures were better than short cycles at higher
temperatures, because less water was evaporated and the remaining water was more uniformly
distributed in the finished board. He has no experimental data in this report on which to base his
conclusions.

According to Heebink et al. (1972) satisfactory urea-formaldehyde-bonded

particleboards could be produced when the center temperature was above 220° F for 0.5 to 0.7
minute. They also reported a decrease in total pressing times of 1 to 2 minutes when the press
temperature was increased from 375° to 475° F. This higher temperature allowed faster heat
transfer and’ shifted the maximum density region toward the interior, so the internal bond
strength increased and the bending strength decreased. He also reported that a moisture
distribution of 5 percent in the mat plus a 5 percent surface spray allowed the core to reach 220°
F in a shorter time period than required for mats with a uniform moisture distribution of 10
percent for two different press temperatures and two different closing rates. However, the
vertical density gradient data show a lower gradient for the boards with the uniform moisture
content of 10 percent, although this comparison of density gradients is confounded with adhesive
and press temperature differences. Heebink et al. (1972) reported 10 to 12 percent to be the
optimum moisture content for mats with uniform distributions. Lower moisture contents required
higher pressures to consolidate the mat and were characterized by poor interparticle bonding.
Higher moisture contents necessitated longer press cycles to allow sufficient moisture to escape.

According to Maku and Hamada (1955) found a decreased thickness swelling and water
absorption as the moisture content of the chips increased. However, it is unclear from the report
whether the mats were pressed at high moisture contents or whether they were conditioned to 12
to 13 percent after blending at higher moisture contents.

According to Otlev (1971) the moisture content of particleboard core and surfaces after
pressing to be 11 to 13 percent and 3 to 5 percent, respectively. Moisture sprayed on the surface
did not produce higher center moisture content but did speed the rate of resin curing.