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Light metal compound casting

J.M.PAPIS Konrad, F.LOEFFLER Joerg and J.UGGOWITZER Peter


Citation: Science in China Series E-Technological Sciences 52, 46 (2009); doi: 10.1007/s11431-008-0345-9

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Light metal compound casting


Konrad J. M. PAPIS†, Joerg F. LOEFFLER & Peter J. UGGOWITZER
ETH Zurich, Laboratory of Metal Physics and Technology, Wolfgang-Pauli-Str. 10, 8093 Zurich, Switzerland

‘Compound casting’ simplifies joining processes by directly casting a metallic melt onto a solid metal
substrate. A continuously metallurgic transition is very important for industrial applications, such as
joint structures of spaceframe constructions in transport industry. In this project, ‘compound casting’
of light metals is investigated, aiming at weight-saving. The substrate used is a wrought aluminium
alloy of type AA5xxx, containing magnesium as main alloying element. The melts are aluminium alloys,
containing various alloying elements (Cu, Si, Zn), and magnesium. By replacing the natural oxygen
layer with a zinc layer, the inherent wetting difficulties were avoided, and compounds with flawless
interfaces were successfully produced (no contraction defects, cracks or oxides). Electron microscopy
and EDX investigations as well as optical micrographs of the interfacial areas revealed their continu-
ously metallic constitution. Diffusion of alloying elements leads to heat-treatable microstructures in the
vicinity of the joining interfaces in Al–Al couples. This permits significant variability of mechanical
properties. Without significantly cutting down on wettability, the formation of low-melting intermetallic
phases (Al3Mg2 and Al12Mg17 IMPs) at the interface of Al–Mg couples was avoided by applying a protec-
tive coating to the substrate.

compound, casting, aluminium alloys, magnesium alloys, interface structure

1 Introduction persist during the casting procedure and inhibit the for-
mation of the continuous metallic junction needed for a
Lightweight construction in the transport industry helps ‘compound cast’ part.
reduce weight and thus save fuel. To optimize perform- The present work focuses on eliminating the oxide
ance, a combination of materials is the most efficient layer and the development of a coating which will in-
method, because one material alone is often insufficient. hibit repassivation and thus make the aluminium sub-
Light metals are not easy to join, though. Weak links strate’s surface wettable by metallic melts[2]. Light metal
arise at the joints, such as rivets, welds or brazing con-
couples (Al–Al and Al–Mg) were produced by com-
nections. Furthermore, the natural oxide layer on alu-
pound casting on laboratory scale.
minium, for example, is thermodynamically stable and
inert, has a melting point much higher than the bulk ma-
2 Experimental procedures
terial, and is not easily wettable by metallic melts.
If a metallic melt is cast onto or around a solid metal 2.1 Substrate coatings
shape, forming a diffusion reaction zone and thus a con- One very efficient way to remove the natural oxide layer
tinuous metallic transition, one talks about compound from aluminium and to prevent its formation after the
casting[1]. A prerequisite is the formation of zones where treatment is the application of the so-called zincate
the cast alloy’s components diffuse into the solid mate- process[3 6]. It replaces the Al2O3 layer with a metallic

rial, partly via the formation of solid solutions and partly


Received June 22, 2008; accepted August 22, 2008
via the formation of intermetallic phases. If the alumin- doi: 10.1007/s11431-008-0345-9
ium oxide layer remains on the substrate’s surface it will †
Corresponding author (email: konrad.papis@mat.ethz.ch)

Sci China Ser E-Tech Sci | Jan. 2009 | vol. 52 | no. 1 | 46-51
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Zn film with a thickness of several hundred nanometers, oxide hull off the molten metal. For this purpose, a
via two parallel chemical reactions[2,4,7]. First, the oxide quartz glass tube with a diameter of 6 mm was narrowed
layer is removed by etching, while metallic Al oxidizes at one end. 300 mg of the alloy was melted inside this
and dissolves, Zn anions are reduced and deposit as a tube, and pushed out using a plunger. Upon dropping
dense metallic layer in the second reaction[8]. The solu- onto the substrate’s surface, none of the oxide layer de-
tion used in this work was a single solution containing bris from the melt was present at the interface, and the
NaOH and Zn anions, and was applied in ambient con- sample was immediately pulled out of the heated area to
ditions. cool down. The atmosphere was Ar6 (99.9999% Ar, with
Prior to immersion in this zincate solution, the sub- previous evacuation to at least 5×10−5 mbar), with a fur-
strate had to be pre-treated. As the substrate was re- nace temperature of 700℃. This setup was used for all
ceived in rolled condition, the outermost microns (‘roll- the materials described here.
ing layers’) had to be removed. The samples were thus
2.3 Heat treatment procedures and diffusion simu-
cleaned in a mild pickle solution at 55℃ to remove car- lations for Al–Al couples
bon contaminations, and subsequently the aluminium
To determine diffusion zone dimensions and the degree
oxide layer was etched away in a strong alkaline NaOH
of interdiffusion of alloying elements experimentally,
solution (pH > 13) for 2 min at 55℃. The pickling layer,
Al–Al couples were heat treated and the interface’s me-
which was built up during this process, was removed by
chanical properties were investigated. According to the
etching in 35% nitric acid. Between each of these im-
industry heat treatments, T5 and T6 states (without and
portant cleaning processes, the samples were rinsed in
with solution annealing before artificial ageing, respec-
deionized water for 2 min.
tively) were established for the interface compositions,
This zincate treatment removed the aluminium oxide
where heat treatable compositions formed after sample
layer permanently, but did not yet yield the good wetting
production. In Table 1, these heat treatments are listed.
properties needed for successful compound casting. For
The ageing temperatures and times varied for each cou-
Al–Al compound casting, the coating thickness was in-
ple composition according to treatments for commercial
creased to 10 μm via zinc galvanizing. For Al–Mg
alloys with similar compositions[10].
compounds, another coating had to be applied to prevent
Diffusion zone extensions, and thus the area of ex-
the excessive formation of brittle intermetallic phases.
pected hardness increase, were verified by one-dimen-
Manganese was chosen for this purpose, and a 5-μm
sional diffusion simulations. These were performed us-
thick Mn layer was deposited via galvanizing[9].
ing DICTRA software[11], with thermodynamic data
2.2 Wetting experiments taken from COST II and aluminium alloys’ mobility
Aluminium-based alloy AlMg1 (AA5005; 1.0 Mg, 0.4 databases[12,13]. For solidification simulations, starting
Fe, 0.25 Si, 0.15 Mn――all in mass-%) platelets of temperatures were chosen to lie below the solidus of the
20 mm × 10 mm × 2 mm were used as substrate for wet- substrate and above the liquidus of the melts. It was not
ting experiments. The melts for Al–Al compounds were possible to perform simulations with AlMg1/Al99.98%
pure 99.98%-aluminium (Al), aluminium alloys with couples, as the substrate’s solidus is lower than the liq-
7 mass-% Si (AlSi7), 7 mass-% Cu (AlCu7) and uidus of Al. A cooling rate of 1 K/s was used for casting
7 mass-% Zn (AlZn7), respectively. For Al–Mg, only simulations, and solution annealing simulations were
pure 99.98%-magnesium was used. performed with 500℃ for 30 min. A planar solidifica-
The setup for wetting experiments comprises a hori- tion front, no significant influence of convection and the
zontal furnace with a device designed both to drop me- presence of only fcc and liquid phases were the simpli-
tallic melts onto a substrate and to break and shear the fying assumptions made.
Table 1 Parameters for sample production and heat-treatment procedures
Cast alloy Solution annealing (only for T6) Ageing temp. (℃) Ageing steps (aged 1―aged 5) (h) Ageing time for T6 (expected) (h)
AlCu7 190 3, 6, 9, 12, 15 9
500℃
AlSi7 170 3, 6, 9, 12, 15 9
0.5 h
AlZn7 120 8, 16, 24, 32, 40 24
air
Al 170a) 3, 6, 9, 12, 15 9a)
a) These numbers were taken to be comparable to at least one of the other specimens.

Konrad J.M. PAPIS et al. Sci China Ser E-Tech Sci | Jan. 2009 | vol. 52 | no. 1 | 46-51 47

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3 Results and discussion mass-% Mg, whereas the Mg concentration in the bulk
is too low to form precipitates. Figures 1(g) and 1(h)
3.1 Al–Al: Wetting experiments, diffusion and me-
show the reference couples’ interface, where the latent
chanical properties
heat release at 660℃ causes a partial (150 μm deep)
AlMg1 showed a much improved wettability when zin- melting of the substrate’s surface, which re-solidifies the
cate treated and Zn galvanized. Flawless interfaces were forming eutectic intermetallics with the elements present
obtained (no pores, oxide inclusions, or cracks), as in this commercial AA5005 alloy.
shown in Figure 1. Narrow transitions from substrate to In Table 2, the concentration limits of alloying ele-
the melt was observed in every sample, with a little ments for commercial age-hardenable aluminium alloys
second phase showing up in AlMg1/AlZn7 samples. The are listed. With these required minimum element con-
reference AlMg1/Al couples show a 150 μm wide zone centrations, hardening precipitates can form. These are
where the substrate was melted by the pure Al droplet β′ (Mg2Si), S′ (Al2CuMg) and η′ (Zn2Mg)[14], for the
during the casting process. corresponding couple compositions.
Alloying elements of the substrate (Mg) and the melts The concentration profiles in Figure 2 were obtained
(Cu, Si, Zn) can form precipitates in the diffusion zones. from DICTRA simulations. The as-cast state is repre-
Hardness measurements can reveal diffusion zone sented by the dashed curve, and the solid curves show
widths after artificial ageing, which can be verified by the composition profiles after solution annealing. Inter-
subsequent diffusion simulations using DICTRA software. diffusion of alloying elements occurs in the vicinity of
AlMg1/AlSi7 couples exhibit the widest diffusion zone, the interface. During solidification, Si and Mg diffuse as
and AlMg1/AlCu7 the narrowest. Both show concentra- far as 100 μm into the adjacent area, whereas Cu and Zn
tion gradients in the interfacial region, which can be only come as far as 30 μm. These values were nearly
seen as continuous transition from the single-phase sub- doubled (200 μm and 50 μm, respectively) after solution
strate to the partially eutectic droplets in optical micro- annealing.
graphs (Figures 1(a)-1(d)). The second phase directly at When the values from Table 2 are compared to these
the interface in AlMg1/AlZn7 couples (Figures 1(e)- concentration profiles, one can expect a hardness in-
1(f)) arises from the presence of 2.5 mass-% Zn and 0.5 crease in these areas, that have a composition above the

Figure 1 Optical microscopy micrographs of compound cast samples: AlMg1 substrate and Al-alloys with 7% Cu (a, b); 7% Si (c, d); 7% Zn (e, f); and
pure Al (g, h).

Table 2 Lower and upper concentration limits of alloying elements in commercial aluminium alloys
Wrought and casting Al-alloy series mass-% Cu, Si, Zn mass-% Mg
2xxx/2xx 0.1―>7 Cu 0.1―1.8
6xxx/3xx 0.2―>7 Si 0.2―1.5
7xxx/7xx 0.8―>7 Zn 1.5―4.0

48 Konrad J.M. PAPIS et al. Sci China Ser E-Tech Sci | Jan. 2009 | vol. 52 | no. 1 | 46-51

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Figure 2 Concentration profiles after solidification (dashed lines) and after solution annealing (solid lines). The substrate is to the left of the interface; the
droplets are on the right; (a) AlCu7, (b) AlSi7, (c) AlZn7.

lower limits in Table 2. For T6 conditions, diffusion for AlMg1/AlZn7 couples, where the second phase is
zone widths of 30 μm (Cu in AlMg1/AlCu7) and 100 μm located at the interface only. The optimum ratio of al-
(Si in AlMg1/AlSi7) into the substrate, and 100 μm (Mg loying elements for the formation of S′ precipitates in
in AlMg1/AlCu7) and 70 μm (Mg in AlMg1/AlSi7) into AlMg1/AlCu7 couples lies at the interface, but the peak
the droplet can be predicted. For T5, these zones are less is shifted towards the droplet. This can be explained by
wide, with values of 20, 50, 50 and 30 μm in the same the presence of Q′ (Al2Cu) precipitations in the droplet
order as before. Not enough magnesium was provided area. From the composition of β′ (Mg2Si), one would
from the substrate to form a significant amount of η′ expect the hardness peak to lie on the substrate’s side of
(Zn2Mg) precipitates in AlMg1/AlZn7 couples, which the interface, which is not the case. This can be ex-
leads to a small hardness increase only at the interface. plained by the optimum ratio of magnesium to silicon in
The hardness profile for the AlMg1/AlCu7 couple is incoherent β″ precipitations of 1:1[15].
shifted towards the droplet side, and for the AlMg1/ A peak in the substrate of the reference couple indi-
AlSi7 couple slightly towards the substrate. The meas- cates the partial melt-up of the material with a partially
ured hardness profiles of all the couples at T5 and T6 eutectic solidification, leading to a hardness increase of
states are shown in Figure 3. about 100 μm into the bulk, and is even more pro-
At the T6 state (Figure 3(a)), hardness profiles are nounced without solution annealing (Figure 3(b)).
shown half a millimeter to either side of the interface. At the T5 state of Al–Al couples, the hardness pro-
One would expect the hardness peaks to lie on the inter- files are displayed in a region of 150 μm to both sides of
face, but consulting Figures 2 and 3, this is only the case the interface, the substrate and the droplet material. The

Figure 3 Hardness profiles T6 (a) and T5 (b), measured across the interface (former substrate surface at position 0) of all sample compositions.

Konrad J.M. PAPIS et al. Sci China Ser E-Tech Sci | Jan. 2009 | vol. 52 | no. 1 | 46-51 49

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Cu containing samples are the hardest both in the sub- veals the presence of mainly Al8Mn and γ2 at the borders
strate (due to a higher ageing temperature compared to to the bulk Al substrate and the Mn layer, respectively.
the other couples) and in the droplet. This is due to the The μ and Al11Mn4 IMPs appear as well, which are hard
formation of AlCu species, as described for T6 condi- to detect with EDX. The BSE (backscattered electron)
tions. There, the droplet even reached a higher hardness. image (Figure 4) suggests the presence of at least three
A gradual change in hardness from substrate to the of these intermetallics. In the β-Mn area, the concentra-
droplet was measured, with the interface hardness lying tion of Al ranges from 2 to 16 at-%. The amount of
in between these values (75 HV), indicating that no sig- oxygen in this layer is below 5%.
nificant blending of the alloying elements had taken
place (compared to T6, where there is a peak of hardness
at the interface). AlMg1/AlSi7 couples show a little peak
at the interface. This indicates a small amount of inter-
diffusion of Si and Mg, forming MgSi precipitates as
described above. The same is true for Zn containing cou-
ples, which exhibit the peak hardness at the interface.
This big difference at the interface is explained by the
appearance of a second phase after casting. A very dif-
ferent image can be drawn for the samples with pure Figure 4 SEM image of the Al-Mn-Mg interface, featuring a 6-μm thick
aluminium. The substrate was once again partially IMP layer. On the right, EDX mappings for Mg, Mn and Al are shown.
melted to a depth of about 150 μm upon contact with the
droplet, causing this commercial alloy to solidify with a 4 Conclusions
certain amount of eutectic phase. There, the hardness
reaches a high maximum (86 HV) compared to the sub- Compound casting of various light metals was investi-
strate and droplet values of 50 HV and 21 HV, respec- gated on a laboratory scale. Through adequate surface
tively. treatments and coatings, the AlMg1 substrate’s wettabil-
ity was improved in a way that the couples of Al–Al and
3.2 Al–Mg: Wetting experiments and interface
Al–Mg were successfully produced. Interfaces showed
characterization
very low (Al–Mg) to no (Al–Al) formation of IMPs, and
Keeping in mind that a ‘compound cast’ structure re- other defects, such as oxide inclusions, contraction cavi-
quires a metallurgically continuous bonding (i.e. free ties or cracks.
from cracks or oxides), the manganese coating is essential The combined coating of zincate treatment and elec-
for Al–Mg compounds, for various reasons: With its rela- trolytically-deposited zinc for Al–Al compounds offers
tively high melting point, its sufficient solubility in Mg major advantages compared to other approaches to join-
――which ensures a good wettability by that metal―― ing light metals[1,16,17]. Zones with heat-treatable compo-
and without forming IMPs, the Mn coating acts as a good sitions were formed in regions ranging up to 200 μm to
connection to the melt droplet. Towards the Al- based both sides of the interface, which could be quantified by
substrate, IMPs may form, but because this reaction microhardness indents after heat-treatment procedures.
happens through diffusion in the solid state, the com- Mechanical properties of the interfacial area can thus be
pound’s integrity is assured, when they are kept thin. adapted to the field of a future component′s application.
As shown in Figure 4, a layer of IMPs starts to grow DICTRA simulations yielded diffusion zone dimensions
in-between the AlMg1 substrate and the Mn coating at of about 50―200 μm, which coincides well with the
process temperatures (around 700℃). It becomes obvi- experimental findings, and can help to reduce the vol-
ous through EDX measurements, that there is a gradient ume of future wetting experiments with other alloys.
in Mn and Al concentrations through this ~6 μm thick The zincate treatment is the most important process
IMP layer and in the Mn coating. The Al–Mn phase dia- step also for surface preparation of the substrate for
gram shows, that multiple IMPs (Al8Mn, λ, μ, Al11Mn4, Al–Mg compounds. This treatment is followed by elec-
γ2) may form. Analysis of the obtained EDX-data re- trolytic deposition of an Mn layer of several microns

50 Konrad J.M. PAPIS et al. Sci China Ser E-Tech Sci | Jan. 2009 | vol. 52 | no. 1 | 46-51

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