A REPORT SUBMITTED TO THE AREA CONSORTIUM 2014

Mechanical Performance of various Pb-free

alloys
Shantanu Joshi, Babak Arfaei

Abstract-
With the extensive use of Pb-free solder in electronic assemblies, there is a growing concern about the reliability of the solder joint. The
integrity of the intermetallic compounds formed during the reflow process, at the component–pad interface is one of the critical
determinants of joint reliability. Studies indicate that the brittle fracture of intermetallic compound (IMC) at the component-pad interface
makes Pb-free solder joints more vulnerable to failure. Pb-free alloys with a high content of Sn and high reflow temperatures; experience
accelerated and thicker intermetallic formation at the interface. An initial study was conducted to study the mechanical strength of lead-
free solder joints. The work reported here examines the shear strength of various lead-free alloys on standard pad metallurgies such as
Cu-OSP and Electroless Nickel Immersion Gold (ENIG) and compares their performance against the standard eutectic Sn/Pb alloy. The
effect of isothermal aging was evaluated on shear strength and further on failure modes. Most of the industry reports observed that the
low speed shear test was not successful in generating bond failures, as the failure typically happened in the bulk of the solder joint.
However, a high speed shear test may succeed in demonstrating the brittle fracture as they replicate high strain rate events. Shearing of
various Pb-free alloys in various sizes reflowed on suitable sized Solder Mask Defined (SMD) pads were studied in as-reflowed and after
isothermal aging. Shear strength was evaluated by shear testing the joints using an DAGE 4000 and DAGE 4000HS. The maximum load
data was analyzed to provide insight into the mechanical strength of solder joints. The results indicated that the failure mechanism was
ductile and there were no indication of brittle failure even after isothermal aging at 125°C for eutectic SnPb solder alloy. For most of the
Pb-free alloys, there appeared to be a transition to brittle failure mode After 500 hours of aging, but there were no indication of a 100
percent brittle failure.

also be extremely disruptive. To seek an alternative

1 INTRODUCTION
With portable and hand-held electronic products
advancing rapidly towards miniaturization and
lightweight, the impact reliability performance of the
board-to-package interconnections has become
increasingly important. The Interconnections
between ball grid array (BGA) packages and the
motherboard of such products are usually formed
without underfill support. When such portable
products drop to the ground, the board-to-package
interconnections will be Subject to an impact load
with high strain rate and therefore easily fail. With
the trend towards product miniaturization, the solder
ball sizes and product structure become smaller and
thinner.
The density of the components on the
motherboard, however, may become higher. This
makes the impact reliability of the interconnections
even worse. To date, the commercially available
mechanical tests for the interconnection reliability in
the microelectronic packaging industry are a shear
test, a pull test, a peel-off test [1] and a board level
drop impact test [2]. The first three tests evaluate the
bulk or bond strength of the solder joints, but not the
impact toughness and are therefore unable to induce
the desired mode of failure testing in dropping
impact due to their low shear speed limitations.
The board level drop impact test is capable
of qualifying the component – board interconnection
under impact testing. However, it is a very costly and
time-consuming procedure, and requires a lot of
manpower for measurement and failure analysis.
The shock and noise accompanying the tests may
simpler and cheaper impact testing method.
Stresses and strains on solder joints drive
solder joint failures in electronic assemblies. These
stresses can be induced by either thermal changes
or by mechanical working of the assembly. These
stresses have a direct impact on the reliability of the
assembled solder joint. Thus, it is extremely
important to evaluate the mechanical strength of an
assembled solder joint. There are several different
mechanical tests that can be performed on
electronic components to simulate and study the
forces that affect reliability of solder joints [4].
Siviour et al. conducted a component level
impact shear test using the split hopkinson bar
technique in which the inferior impact fracture
strength of SnAgCu solder was tested and
compared to that of the eutectic SnPb solder. Date
et al. carried out impact tests using a miniature
Charpy pendulum in which the pendulum set-up
allowed the test shear rate to vary between 0.1
mm/s and 1.4 m/s. The fracture energy of the solder
joint was taken to be equal to the decrease in kinetic
energy of the pendulum after it had struck the solder
joint. However, a drawback of the method is that
only the fracture energy is provided and no
information on the fracture strength is measured. [3]
Shear testing has been used in the past to
determine the mechanical robustness of the solder
joint as shear strength is more likely to control the
thermal mechanical fatigue resistance [5].The
schematic of typical shear test is shown in Figure 1.
Figure 1. Typical Shear Testing [6]

Shear testing imparts a horizontal shear

force on the solder joint and monitors its mechanical
response. The advantage of shear testing is that the Figure 2. Drop test performance for various Pb-free
tests can be performed in shorter time duration as alloys at 0.35m drop height with Cu-OSP/ NiAu pad
compared to thermal cycling where the parts are metallurgy. Note superior performance of alloys
subjected to cyclic temperature changes which could doped with Mn and Ti. [6]
easily take a few months to complete. The
disadvantage of shear testing is that it cannot be
used to predict fatigue. Often shear testing is used
for comparative analysis between different process
parameters. [5]

Among lead-free solder systems being developed,

Sn–Ag–Cu alloys (SAC) are considered as the new
standard. However, there are still some
shortcomings needing to be overcome. By means of
alloying modification, a lot of effort has been made to
improve the microstructure and thermal behavior of
SAC solders, as well as the interfaces and reliability
of SAC joints. Among the alloying additives, RE (rare
earth) elements are able to retard the growth of
intermetallic compounds (IMCs) at interfaces during
soldering or aging. They are also beneficial to
wetting and mechanical properties [7]. Transition
metals (TM), such as Ni, Cr, Co, Fe and Zn, have Figure 3. Accelerated thermal cycle test
also attracted considerable attention, because they performance for various Pb-free alloys in
can provide a marked improvement in -40°C/125°C with Cu-OSP/ NiAu pad metallurgy.
microstructural modification and mechanical Note superior performance of alloys doped with Mn
performance [7-10]. Notably, it was recently and Ce.
demonstrated that doping with a small amount of
Mn, Ti significantly enhanced the drop test To clarify the effect of minor alloying on the
performance of SAC solder joints as shown in shear strength and subsequently on failure modes,
Figure 2[9]. In another report Liu et al. demonstrated minor doped SAC solder balls bonded with
comparable or better performance of SAC alloys commercial substrates Cu-OSP and ENIG were
doped with Mn and Ce in accelerated thermal cycle prepared as test samples in this work. The influence
testing as shown in Figure 3 [10]. of alloying additives, solder volume, substrate
materials, isothermal aging and shear speed on the
shear strength responses were studied.

2 TEST METHODOLOGY
Low speed (1mm/s) shear testing of solder joints
was done using DAGE4000 and high speed (1m/s)
by DAGE4000HS. Figure 1 shows the setup used
for low speed shear testing while Figure 2 shows
that of high speed.
Figure 4: DAGE 4000 Tester used for performing
low speed testing.
Figure 5: DAGE 4000HS Tester used for performing
high speed testing.
The setup converts the vertical compressive
forces from the DAGE to a horizontal shear force
which is applied parallel to the surface of the Printed
Circuit Board (PCB). The tests followed the JEDEC
JESD22-B117A standard [11]. A shearing pin applies
a shear force on the solder joint. The position of the
shearing pin is critical in getting an accurate
estimation of the shear strength of the solder joint.
The shear height was calculated for different
combinations of solder ball size and pad size from
the formula:
Where, V is volume of the solder balls in microns 3, h
is the solder ball height in microns; s is the pad
diameter in microns. The shear height is taken as
10% of the solder ball height calculated by the
formula and is in close agreement with JEDEC
standard, which specifies less than 25% of the
solder height [11]. The table 1 below shows the
shear heights for various combinations of the ball
and pad size.
Table 1: Shear height for different ball and pad
combinations
Solder joints of different lead-free alloys
were formed by reflowing preformed solder spheres
of different nominal diameters on appropriate solder
mask defined (SMD) pads as described in Table 1.
Flux was first deposited on the pads by stencil
printing process prior to placing the solder spheres
on pads by hand (tweezers). Table 2 shows various
different alloys investigated in this study.
Table 2: Different alloys investigated in the study
The pad metallurgies evaluated were
Cu-OSP and Electroless Nickel Immersion Gold
(ENIG). The shear strength was determined for as
assembled solder joints and after isothermal aging at
125 °C after 500 hours. The aging temperature was
chosen to be 125 °C as it best represents the
maximum temperature that the parts may
experience and also to simulate the reliability tests
used for automotive parts [4]. The test was carried
out in two different test speeds, low speed at 1mm/s
and high speed at 1m/s. Two different speeds are
chosen to see the effect of strain rate on the failure
modes of various SnPb and Pb-free alloys. The
experimental plan is shown in figure 6.
The failure surfaces were inspected in situ
through instrument’s microscope. Higher
magnification images were taken using FEI
Environmental Scanning Electron Microscope
(SEM). The failures were then quantified and graphs
were plotted for the comparisons.

Figure 6. Experimental plan for the study.
3 RESULTS AND DISCUSSION
We know that Sn-Ag-Cu alloys are strain
rate sensitive. So, it is interesting to see the change
in failure modes as a function of shear speed.
The JEDEC standard recognizes 2 relevant
failure modes: Mode 1, Ductile (“Solder ball fracture
at or above the surface of the solder mask within the
bulk solder material.”) and Mode 4, Interfacial Break
(“The break is at the solder – intermetallic interface
or intermetallic - base metal interface. The interfacial
fracture may extend across the entire pad or be the
dominant failure mode at the tool contact region”) as
shown in figure 7 [4][11].
Figure 7. Two failure modes as per standard [11]
The failure mechanism of a solder joint after
shear testing is important as it indicates the factors
involved. For this reason, although the JEDEC
failure modes were noted down, a second
classification system was used as well. In it, the
failure modes were classified into four, instead of
two categories. Cases where a mixed-mode failure
occurred were characterized as “quasi-brittle” or
“quasi-ductile” depending on whether the failure
mode was more than 50% interfacial or less. When
less than 10% of a mode appeared on a surface, it
was ignored, and the failure was characterized as
brittle or ductile. The last criterion was used because
most interfacial failures left a tiny sliver of solder next
to the solder mask at the point of “exit” of the tool.
[12]
In low speed testing, irrespective of the pad
metallurgy, solder ball size, isothermal aging
conditions, 100 percent bulk solder failures were
recorded. But, different failure modes were observed
after shear testing at high speed as:
 Bulk Solder
 Quasi Ductile (>50% ductile)
 Quasi Brittle (>50% Brittle)
 Intermetallic Compound
 Pad Cratering.
The different failure modes are shown in figure 8.
Figure 8. Different failure modes after high speed
testing a) Bulk Solder, b) Quasi Ductile c)
Intermetallic Compound d) Pad Cratering. Note the
shear direction marked in the center of the image.
A. Low Speed Testing
In our study, we dealt with many alloys in various
different sizes, different pad finishes and aging
condition so there were many different combinations
in which the results could have been analyzed.
Instead of showing all the alloys and in all the sizes
only some of the interesting ones here and results
for the remaining ones are listed in Appendix A.

We saw some interesting behavior for some alloys

as a function of aging, surface finish, size in low
speed shear testing.

1. Sensitivity to Aging:
The shear stress was significantly less for SAC105
after aging for 3 weeks at 125°C than that of
SAC105 with Manganese on Cu-OSP substrate as
shown in Figure 9. The difference is evident and
statistically significant at 95% confidence interval.
That means that SAC105 is more sensitive to aging
than SAC105 + Mn. We can even see from the
figure that for SAC105+Mn the shear stress was
hardly reduced. The reduction for the same is not
significant.

Figure 10. Graph showing variation in shear

strength on ENIG surface finish as a function of
aging. Note the similar performance by SAC105 and
SAC105Mn.

2. Sensitivity to Surface Finish

Some conventional alloys like SAC305 are very
sensitive to the surface finish. Figure 11 shows the
shear strength of 20 mil as well as 12 mil SAC305 in
both as-reflowed and aged conditions. It is evident
that the shear stress for 12 mil SAC305 sample
dropped significantly after aging for 3 weeks for
125°C where as it did not for 20 mil sample on Cu-
OSP substrate.

Figure 9. Graph showing variation in shear strength

on Cu-OSP surface finish as a function of aging.
Note higher sensitivity of SAC105 than that of
SAC105Mn

On the contrary, same alloys on ENIG substrate

behave quite differently. Not only the shear strengths
of them are significantly higher than their
counterparts on Cu-OSP substrate but there is no
significant difference in the shear strength values
between as-reflowed samples and aged samples
either for SAC105 or for SAC105Mn.
Figure 11. Graph showing variation in shear
strength on Cu-OSP surface finish as a function of
aging. Note higher sensitivity of SAC105 than that of
SAC105Mn

On the contrary, if SAC305 is reflowed on

Electroless Nickel Immersion Gold surface finished
substrate, there was no significant reduction in the
shear stress was recorded after aging as compared
to the as-reflowed sample for both 20 mil as well as
12mil.
recorded. We can still see more than 95% bulk
solder failures for 12mil SN100C after aging 3 weeks
at 125°C.

Figure 12. Graph showing different failure mode

Figure 11. Graph showing variation in shear percentages for 20 mil- SN100C alloy on Cu-OSP
strength on Cu-OSP surface finish as a function of surface finish as a function of aging. Note the
aging. Note higher sensitivity of SAC105 than that of increase in percentage for quasi brittle failures.
SAC105Mn

B. High Speed Testing

In our study, many alloys in various different sizes,
different pad finishes and aging conditions were
tested so there were many different combinations in
which the results could have been analyzed. Instead
of showing all the alloys and in all the sizes only
some of the interesting ones here and results for the
remaining ones are listed in Appendix B.

As the strain rate increases, the failure mode may

change from conventional bulk solder to intermetallic
compound, pad cratering or combination of them.
We saw some interesting behavior for some alloys
as a function of aging, surface finish, size and will
discuss them briefly.
1. Effect of Size (Cu-OSP):
To see the effect of size on Cu-OSP substrate the
alloys were tested at 1m/s (High Speed). 16 solder
balls were tested for each alloy in both as-reflowed
as well after aging conditions. Figure 12 shows the
various percentages of failures for 20 mil SN100C
alloy. It can be clearly seen that more than half of the
failures were bulk solder in as-reflowed condition but
after aging the alloy the percentages are quite
different. From the figure, it is evident that less than
10% of the failures were bulk solder ones after
aging.
On the contrary, we can see totally different trend for
the same alloy but in 12 mil size. Figure 13 shows
the various failure mode percentages for 12 mil
SN100C alloy in both as reflowed as well as after
aging conditions. We can clearly see that all of the
failures in as-reflowed conditions are bulk solder.
After aging very few pad cratering failures were
Figure 13. Graph showing different failure mode
percentages for 12 mil- SN100C alloy on Cu-OSP
surface finish as a function of aging. Note very high
bulk solder failures even after aging.
2. Effect of Size (ENIG):
Same experiment was carried on ENIG surface
finish for different alloys. Figure 14 shows different
percentages of various failure modes for 20 mil
SN99CN alloy. From the figure, it can be clearly
observed that after aging the predominant failure
mode is quasi brittle. That means that the
intermetallic bond is getting weaker after aging the
sample.
On the other hand, 12 mil sample of the same
SN99CN alloy on ENIG substrate behaves quite
differently. In as-reflowed condition, the predominant
failure mode is quasi ductile that means more than
half of the failure is through the bulk. But after aging
the sample, it can be observed from Figure 15 that
the predominant failure mode is bulk solder.
Figure 14. Graph showing different failure mode
percentages for 20 mil- SN99CN alloy on ENIG
surface finish as a function of aging. Note the
presence of quasi brittle failures.
Figure 15. Graph showing different failure mode
percentages for 12mil- SN99CN alloy on ENIG
surface finish as a function of aging. Note the
presence of bulk solder failures after aging.
3. Effect of Surface Finish:
To see the effect of surface finish on the failure
mode, the alloys were tested on two different surface
finishes namely Cu-OSP and ENIG. The alloys were
tested for both as-reflowed as well as after aging
them for 3 weeks at 125°C.
Figure 16 shows different failure modes for 20mil-
SAC305 on Cu-OSP substrate for both as reflowed
as well as for aged condition. Similar comparison is
shown in Figure 17 for same 20mil SAC305 alloy but
on ENIG substrate.
It can be seen from the two figures that, in as
reflowed condition, the failure modes are similar as
in the predominant failure mode is either bulk solder
or quasi ductile. But the alloys show very different
behavior after 3 weeks of aging at 125°C.
It can be clearly seen that the percentage for bulk
solder failure is increased in case of SAC305 alloy
reflowed on Cu-OSP substrate after aging as shown
in Figure 16. But for the same alloy reflowed on
ENIG substrate, we can see increase in the
percentages of both quasi brittle as well as
intermetallic failures as per Figure 17.
Figure 16. Graph showing different failure mode
percentages for 20mil SAC 305 on Cu-OSP surface
finish as a function of aging. Note the increase in
percentage of bulk solder failures.
Figure 17. Graph showing different failure mode
percentages for 20mil SAC 305 on ENIG surface
finish as a function of aging. Note the increase in
percentage of quasi brittle failures
Even after the microelectronics industry saw the
transition from SnPb to Pb-free solders, there is no
wonder why military and medical industry is still
exempted. In our study, we tested 20 mil eutectic
SnPb solder alloy in as-reflowed condition as well as
after aging it for 3 weeks at 125°C. We carried out
the test in both Cu-OSP as well as on ENIG
substrate. In all the conditions, the failure recorded
was bulk solder, as per figure 18.
Figure 18. Graph showing different failure mode
percentages for 20mil SnPb on both Cu-OSP and
ENIG surface finishes as a function of aging. Note
100% bulk solder failure in every condition.
4 CONCLUSION
The shear strength of various lead-free alloys on
different pad metallurgies was evaluated and
compared. Both low speed (1mm/s) and high speed
(1m/s) testing were carried out on all the alloys.
The failure mode observed after low speed shear
testing for all the solder alloys were ductile failure
with the failure through the bulk solder. It was
recorded for all the alloys in both as-reflowed as well
as after 3 weeks of aging at 125°C.
We saw change in the failure mode after testing at
1m/s. The failure mode was shifted to brittle failure.
We saw some exceptions where the failure mode
was shifted to bulk solder.
Currently work is being conducted to correlate the
performance of various alloys to various
microstructural aspects such as thickness of
intermetallic compound, dendrite arm spacing,
presence of interlaced Sn grains, etc.
REFERENCES
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Tu, "Ductile-to-brittle transition in Sn-Zn solder joints
measured by impact test," Scripta Materialia, Vol. 51,
2004, pp.641-645
2. JEDEC Standard, “Board Level Drop Test Method
of Components for Handheld Electronic Products”,
JESD22-B111, July 2003
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“Influence of trace alloying elements on the ball
impact test reliability of SnAgCu solder joints”,
Microelectronics Reliability, Vol. 52, 2012, pp.180–
189
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Binghamton, NY, September 1998
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Various Pb-Free Solder Alloys”, AREA Consortium
Presentation, Feb 2013.
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Uan J-Y “Alloying modification of Sn–Ag–Cu solders
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Superior Drop Test Performance”, Proceedings of
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Test Performance of SAC-Ti Solders and Its
Mechanism”, 2008 Electronic Components and
Technology Conference, pp.452-458
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A., Huang A., Chen S., Lee J C-B, “Achieving High
Reliability Low Cost Lead-Free SAC Solder Joints
Via Mn or Ce Doping”, 2009 Electronic Components
and Technology Conference, pp. 994-1007
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 Appendix A

Table 1: Shear Stress values for all the alloys in low speed testing.

Cu-OSP ENIG Cu-OSP ENIG

Shear Stress- Shear Stress- Shear Stress- Shear Stress-
As Reflowed As Reflowed Aged Aged
(gms/mils2) (gms/mils2) (gms/mils2) (gms/mils2)
Sr. Ball Pad Std. Std. Std. Std.
Alloy Mean Mean Mean Mean
no. Size Size Dev Dev Dev Dev
1 SnPb 20 mil 16 mil 2.69 0.11 3.67 0.09 2.94 0.10 3.49 0.13
2 SAC305 20 mil 16 mil 3.99 0.29 3.85 0.33 3.41 0.59 3.61 0.28
3 SAC105 20 mil 16 mil 3.61 0.22 3.61 0.39 1.66 0.25 3.84 0.29
4 SAC105Mn 20 mil 16 mil 3.35 0.39 3.29 0.39 3.18 0.46 3.70 0.25
5 SN100C 20 mil 16 mil 3.31 0.18 3.68 0.19 3.01 0.17 3.50 0.33
6 SN99CN 20 mil 16 mil 3.38 0.30 4.01 0.51 3.21 0.41 3.71 0.32

7 SAC305 12 mil 10 mil 3.68 0.28 4.64 0.31 1.20 0.15 4.34 0.30
8 SAC105 12 mil 10 mil 2.82 0.23 4.05 0.29 1.03 0.16 4.45 0.44
9 SAC105Mn 12 mil 10 mil 3.17 0.40 4.05 0.32 3.12 0.36 4.04 0.40
10 SN100C 12 mil 10 mil 2.96 0.18 3.98 0.21 2.74 0.17 4.20 0.23
11 SN99CN 12 mil 10 mil 3.04 0.37 4.31 0.39 2.92 0.35 3.93 0.47

12 SAC105 Ti 30 mil 24 mil 3.08 0.29 3.06 0.62 2.85 0.55 3.11 0.22
13 SAC + Al 18 mil 16 mil 4.01 0.24 4.00 0.36 3.61 0.33 3.95 0.46
14 LF35 8 mil 6 mil 3.72 0.39 4.64 0.42 3.66 0.34 3.74 0.37
 Appendix B

Table 1: Percentages of various failure modes for all the alloys after high speed shear testing on Cu-OSP
substrate

Cu-OSP Cu-OSP

Time Zero Aged

Sr. Ball Pad
Alloy IMC QB QD BS PC IMC QB QD BS PC
no Size Size
1 SnPb 20 mil 16 mil 0.0 0.0 0.0 100.0 0.0 0.0 0.0 0.0 100.0 0.0

2 SAC305 20 mil 16 mil 35.7 14.3 0.0 50.0 0.0 0.0 18.8 37.5 43.8 0.0

3 SAC105 20 mil 16 mil 0.0 18.8 12.5 68.8 0.0 0.0 0.0 0.0 100.0 0.0

4 SAC105Mn 20 mil 16 mil 0.0 0.0 25.0 75.0 0.0 6.3 0.0 12.5 81.3 0.0

5 SN100C 20 mil 16 mil 7.1 21.4 7.1 64.3 0.0 12.5 62.5 18.8 6.3 0.0

6 SN99CN 20 mil 16 mil 20.0 26.7 26.7 26.7 0.0 37.5 18.8 0.0 43.8 0.0

7 SAC305 12 mil 10 mil 23.5 41.2 0.0 35.3 0.0 0.0 31.3 0.0 68.8 0.0

8 SAC105 12 mil 10 mil 6.3 12.5 0.0 81.3 0.0 5.9 41.2 0.0 52.9 0.0

9 SAC105Mn 12 mil 10 mil 0.0 12.5 0.0 87.5 0.0 0.0 0.0 0.0 100.0 0.0

10 SN100C 12 mil 10 mil 0.0 0.0 0.0 100.0 0.0 7.1 0.0 0.0 92.9 0.0

11 SN99CN 12 mil 10 mil 0.0 0.0 0.0 100.0 0.0 0.0 10.5 5.3 84.2 0.0

12 SAC105 Ti 30 mil 24 mil 0.0 0.0 0.0 56.3 43.8 0.0 0.0 0.0 25.0 75.0

13 SAC + Al 18 mil 16 mil 0.0 13.3 6.7 80.0 0.0 0.0 23.5 0.0 76.5 0.0

14 LF35 8 mil 6 mil 0.0 0.0 0.0 100.0 0.0 0.0 0.0 0.0 100.0 0.0
Table 2: Percentages of various failure modes for all the alloys after high speed shear testing on ENIG substrate

ENIG ENIG
Time Zero Aged
Sr. Ball Pad
Alloy IMC QB QD BS PC IMC QB QD BS PC
no. Size Size
1 SnPb 20 mil 16 mil 0.0 0.0 0.0 100.0 0.0 0.0 0.0 0.0 100.0 0.0
2 SAC305 20 mil 16 mil 85.7 14.3 0.0 0.0 0.0 64.3 21.4 14.3 0.0 0.0
3 SAC105 20 mil 16 mil 0.0 42.9 57.1 0.0 0.0 14.3 14.3 35.7 35.7 0.0
4 SAC105Mn 20 mil 16 mil 14.3 7.1 50.0 28.6 0.0 0.0 0.0 7.1 92.9 0.0
5 SN100C 20 mil 16 mil 21.4 14.3 64.3 0.0 0.0 0.0 0.0 42.9 57.1 0.0
6 SN99CN 20 mil 16 mil 14.3 0.0 78.6 7.1 0.0 35.7 64.3 0.0 0.0 0.0

7 SAC305 12 mil 10 mil 21.4 42.9 14.3 21.4 0.0 46.2 53.8 0.0 0.0 0.0
8 SAC105 12 mil 10 mil 0.0 0.0 0.0 100.0 0.0 0.0 23.1 38.5 38.5 0.0
9 SAC105Mn 12 mil 10 mil 0.0 0.0 0.0 100.0 0.0 0.0 7.1 21.4 71.4 0.0
10 SN100C 12 mil 10 mil 21.4 0.0 57.1 21.4 0.0 0.0 0.0 0.0 100.0 0.0
11 SN99CN 12 mil 10 mil 7.1 14.3 78.6 0.0 0.0 9.1 0.0 27.3 63.6 0.0

12 SAC105 Ti 30 mil 24 mil 28.6 14.3 14.3 35.7 7.1 0.0 30.8 15.4 15.4 38.5
13 SAC + Al 18 mil 16 mil 14.3 85.7 0.0 0.0 0.0 71.4 28.6 0.0 0.0 0.0
14 LF35 8 mil 6 mil 0.0 0.0 0.0 100.0 0.0 92.3 7.7 0.0 0.0 0.0