CHAPTER 13- PROCESSES FOR ELECTRONIC I1.

visual inspection of joints 550

I2. incoming inspection 550
PRODUCTS I3. solderability testing 550
A. Printed Circuit Boards (PCBs) 519
J. Repair and Touch-up 551
A1. making bare printed circuit boards 519
K. Integrated Circuits (ICs)
A1a. resists and photoresists 520
(Microcircuits or Chips) 551
A1b. subtractive process for making
K1. material preparation - making
wiring patterns on the board 521
ultra-pure silicon 551
A1c. additive method 522
K2. making a single crystal of silicon 552
A1d. making photo masters and masks 522
K2a. slicing into wafers 553
A1e. screen printing the masks 523
K2b. polishing the wafers 553
A1f. stripping resists from printed
K2c. other wafer preparation operations 554
circuit boards 524
K3. wafer fab 554
A2. other board operations 524
K3a. layering 555
A2a. hole making in boards 524
K3a1. oxidation of silicon 556
A2b. contact finger plating 524
K3a2. nitridation 556
A2c. solder fusing 524
K3a3. chemical vapor deposition (CVD) 556
A2d. solder masks 524
K3a3a. epitaxy 557
A2e. separating boards (depanelling) 525
K3a4. vacuum deposition 557
A2f. silkscreen identification 525
K3a5. sputtering 557
A3. multilayer boards 525
K3a6. adding thick films 557
A4. making flexible printed circuit boards 527
K3a7. adding protective layers 558
B. Wiring and Populating Boards 527
K3b. patterning 558
B1. populating boards with through-hole
K3b1. lithography 558
connections 527
K3b1a. making masks 560
B2. assembling surface mounted components 528
K3b1b. applying resist
B2a. dispensing adhesives 530
(photoresist film) 560
B2b. using solder paste 530
K3b1c. expose and develop the resist 562
B2b1. syringe dispensing of solder paste
K3b2. etching 563
(pressure dispensing) 530
K3b2a. wet etching with liquid
B2b2. pin transfer dispensing
etchants (wet chemical
of solder paste 531
etching) 563
B2b3. screen printing of solder paste 531
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B2b4. stencil dispensing of solder paste 532
K3b2b. dry etching 564
B2b5. submerged disk dispensing
K3b2b1. plasma etching 564
of solder paste 532
K3b2b2. ion beam etching
B2b6. dip coating of solder paste 532
(sputter etching or
B2b7. roller coating of solder paste 533
ion milling) 564
B2c. using solder preforms 533
K3b2b3. reactive ion
B3. cleaning prior to soldering 533
etching (RIE) 565
B4. prebaking before soldering 533
K3b3. stripping photoresist from wafers 565
C. Soldering Processes 534
K3c. doping (dopant defusion) 566
C1. flux application 534
K3d. heat treating 568
C1a. dip fluxing 534
K3d1. annealing 568
C1b. brush application of flux 534
K3d2. alloying 568
C1c. foam flux application 534
K4. wafer testing and sorting 568
C1d. spray application of flux 534
K5. packaging (assembly) of chips 569
C1e. wave fluxing 534
K5a. backside preparation 570
C1f. roller fluxing 535
K5b. dicing (die separation) 570
C1g. cored solder fluxing 535
K5c. chip insertion and fastening
C1g1. making flux cored wire solder 535
to the package 570
C2. preheating 535
K5d. wire bonding 570
C3. dip soldering 536
K5e. closing and sealing the package 571
C4. drag soldering 536
K5f. lead plating and trimming 571
C5. wave soldering 537
K5g. marking and final testing 571
C6. reflow methods 538
K6. other methods of connecting the integrated
C6a. oven heating for reflow 538
circuit to the board 573
C6b. vapor-phase soldering 539
K6a. chip on board (COB) technology 573
C6c. laser soldering 540
K6b. conductive adhesive connections 573
C7. hot gas soldering 541
K6c. tape automated bonding (TAB) 573
C8. soldering iron soldering 541
K6d. flip-chips 574
C9. using lead-free solders 541
L. Making Discrete Devices 575
D. Cleaning After Soldering 541
L1. making resistors 575
D1. solvent cleaning 542
L2. making capacitors 576
D2. water washing 542
L3. making inductors (chokes, choke coils) 578
D3. semi-aqueous cleaning 543
L4. making transformers 578
E. Making Solder Paste 544
L5. making discrete transistors and diodes 582
E1. making solder powder by gas atomization 544
M. Conformal Coatings 582
E2. spinning disk powder making 545
N. Other Chip Configurations 582
E3. ultrasonic method of powder making 546
N1. multiple integrated circuit packages (multichip
E4. screen classification of powder 546
devices, assemblies, modules [MCM], system
E5. air classification of powder 547
in a package (SIP) or packages)
E6. inspection of powder 547
E7. mixing solder paste 547
E8. inspection of paste 547
F. Ball Grid Arrays 549
G. Fluxes for Electronics 549
H. Tinning 550
I. Quality Control and Inspection Operations 550