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Ad9680 PDF
Ad9680 PDF
Tx OUTPUTS
FD_A
DETECT
JESD204B
SERDOUT0±
FAST
ENOB = 10.8 bits at 10 MHz SIGNAL
MONITOR
4
SERDOUT1±
SERDOUT2±
DNL = ±0.5 LSB FD_B
SERDOUT3±
11752-001
400 Ω, 200 Ω, 100 Ω, and 50 Ω differential
AGND DRGND DGND SDIO SCLK CSB
2 GHz usable analog input full power bandwidth
Figure 1.
95 dB channel isolation/crosstalk
Amplitude detect bits for efficient AGC implementation PRODUCT HIGHLIGHTS
2 integrated wideband digital processors per channel
1. Wide full power bandwidth supports IF sampling of signals
12-bit NCO, up to 4 half-band filters
Differential clock input up to 2 GHz.
Integer clock divide by 1, 2, 4, or 8 2. Buffered inputs with programmable input termination eases
Flexible JESD204B lane configurations filter design and implementation.
Small signal dither 3. Four integrated wideband decimation filters and numerically
controlled oscillator (NCO) blocks supporting multiband
APPLICATIONS receivers.
Communications 4. Flexible serial port interface (SPI) controls various product
Diversity multiband, multimode digital receivers features and functions to meet specific system requirements.
3G/4G, TD-SCDMA, W-CDMA, GSM, LTE 5. Programmable fast overrange detection.
General-purpose software radios
6. 9 mm × 9 mm, 64-lead LFCSP.
Ultrawideband satellite receivers
Instrumentation
Radars
Signals intelligence (SIGINT)
DOCSIS 3.0 CMTS upstream receive paths
HFC digital reverse path receivers
TABLE OF CONTENTS
Features .............................................................................................. 1 FIR Filters General Description ............................................... 58
Applications ....................................................................................... 1 Half-Band Filters ........................................................................ 59
Functional Block Diagram .............................................................. 1 DDC Gain Stage ......................................................................... 61
Product Highlights ........................................................................... 1 DDC Complex to Real Conversion ......................................... 61
Revision History ............................................................................... 3 DDC Example Configurations ................................................. 62
General Description ......................................................................... 5 Digital Outputs ............................................................................... 65
Specifications..................................................................................... 6 Introduction to the JESD204B Interface ................................. 65
DC Specifications ......................................................................... 6 JESD204B Overview .................................................................. 65
AC Specifications.......................................................................... 7 Functional Overview ................................................................. 66
Digital Specifications ................................................................... 9 JESD204B Link Establishment ................................................. 67
Switching Specifications ............................................................ 10 Physical Layer (Driver) Outputs .............................................. 68
Timing Specifications ................................................................ 11 JESD204B Tx Converter Mapping ........................................... 71
Absolute Maximum Ratings.......................................................... 13 Configuring the JESD204B Link .............................................. 73
Thermal Characteristics ............................................................ 13 Deterministic Latency.................................................................... 76
ESD Caution ................................................................................ 13 Subclass 0 Operation.................................................................. 76
Pin Configuration and Function Descriptions ........................... 14 Subclass 1 Operation.................................................................. 76
Typical Performance Characteristics ........................................... 16 Multichip Synchronization............................................................ 78
AD9680-1250 .............................................................................. 16 Normal Mode .............................................................................. 78
AD9680-1000 .............................................................................. 20 Timestamp Mode ....................................................................... 78
AD9680-820 ................................................................................ 25 SYSREF± Input ........................................................................... 80
AD9680-500 ................................................................................ 30 SYSREF± Setup/Hold Window Monitor ................................. 82
Equivalent Circuits ......................................................................... 34 Latency ............................................................................................. 84
Theory of Operation ...................................................................... 36 End to End Total Latency .......................................................... 84
ADC Architecture....................................................................... 36 Example Latency Calculation ................................................... 84
Analog Input Considerations.................................................... 36 Test Modes ....................................................................................... 85
Voltage Reference ....................................................................... 42 ADC Test Modes ........................................................................ 85
Clock Input Considerations ...................................................... 43 JESD204B Block Test Modes..................................................... 86
ADC Overrange and Fast Detect.................................................. 45 Serial Port Interface ........................................................................ 88
ADC Overrange .......................................................................... 45 Configuration Using the SPI ..................................................... 88
Fast Threshold Detection (FD_A and FD_B) ......................... 45 Hardware Interface ..................................................................... 88
Signal Monitor ................................................................................ 46 SPI Accessible Features .............................................................. 88
SPORT Over JESD204B ............................................................. 47 Memory Map .................................................................................. 89
Digital Downconverter (DDC) ..................................................... 49 Reading the Memory Map Register Table............................... 89
DDC I/Q Input Selection .......................................................... 49 Memory Map Register Table ..................................................... 90
DDC I/Q Output Selection ....................................................... 49 Applications Information ............................................................ 104
DDC General Description ........................................................ 49 Power Supply Recommendations........................................... 104
Frequency Translation.................................................................... 55 Exposed Pad Thermal Heat Slug Recommendations .......... 104
Frequency Translation General Description .............................. 55 AVDD1_SR (Pin 57) and AGND (Pin 56 and Pin 60) ............ 104
DDC NCO Plus Mixer Loss and SFDR ................................... 56 Outline Dimensions ..................................................................... 105
Numerically Controlled Oscillator........................................... 56 Ordering Guide ........................................................................ 105
FIR Filters ........................................................................................ 58
Rev. E | Page 2 of 105
Data Sheet AD9680
REVISION HISTORY
3/2019—Rev. D to Rev. E Changes to ADC Test Modes Section ........................................... 78
Changes to Figure 146 ....................................................................50 Changes to Table 36 ........................................................................ 83
Changes to Ordering Guide ........................................................... 97
11/2017—Rev. C to Rev. D
Changes to Table 2............................................................................. 7 3/2015—Rev. A to Rev. B
Change to Junction Temperature Range, Table 6 ........................13 Added AD9680-820 ........................................................... Universal
Changes to Figure 17 ......................................................................17 Changes to Features Section ............................................................ 1
Changes to Figure 18 ......................................................................18 Changes to Table 1 ............................................................................ 5
Changes to Figure 34 ......................................................................20 Changes to Table 2 ............................................................................ 6
Changes to Figure 65 and Figure 66 .............................................26 Changes to Table 3 ............................................................................ 8
Changes to Figure 67 and Figure 68 .............................................27 Changes to Table 4 ............................................................................ 9
Changes to Figure 118 to Figure 120 ............................................38 Added Figure 14; Renumbered Sequentially ............................... 15
Added Deterministic Latency Section, Subclass 0 Operation Added AD9680-820 Section and Figure 31 Through Figure 36.... 19
Section, Subclass 1 Operation Section, Deterministic Latency Added Figure 37 Through Figure 42 ............................................ 20
Requirements Section, Setting Deterministic Latency Registers Added Figure 43 Through Figure 48 ............................................ 21
Section, and Figure 171; Renumbered Sequentially ...................75 Added Figure 49 Through Figure 54 ............................................ 22
Added Figure 172 and Figure 173 .................................................76 Added Figure 55 .............................................................................. 23
Changes to Multichip Synchronization Section ..........................77 Changes to Figure 69 and Figure 70 ............................................. 26
Added Normal Mode Section, Timestamp Mode Section, and Changes to Input Buffer Control Registers (0x018, 0x019, 0x01A,
Figure 174 .........................................................................................77 0x935, 0x934, 0x11A) Section, Table 9, and Figure 93 .................... 31
Added Figure 175 ............................................................................78 Added Figure 99 Through Figure 100 .......................................... 33
Added SYSREF± Input Section, SYSREF± Control Features Changes to Table 10 ........................................................................ 34
Section, and Figure 176 to Figure 179 ..........................................79 Changes to Clock Jitter Considerations Section ......................... 37
Added Figure 180 and Figure 181 .................................................80 Added Figure 112 ............................................................................ 37
Added Latency Section, End to End Total Latency Section, Changes to Digital Downconverter (DDC) Section ................... 42
Example Latency Calculation Section, and Table 29 to Changes to Table 17 ........................................................................ 51
Table 31 .............................................................................................83 Changes to Table 36 ........................................................................ 77
Updated Outline Dimensions ......................................................103 Changes to Ordering Guide ........................................................... 91
Changes to Ordering Guide .........................................................103
12/2014—Rev. 0 to Rev. A
11/2015—Rev. B to Rev. C Added AD9680-500 ........................................................... Universal
Added AD9680-1250 ......................................................... Universal Changes to Features Section and Figure 1 ..................................... 1
Changes to Features Section ............................................................ 1 Changes to General Description Section ....................................... 4
Change to General Description Section ......................................... 4 Changes to Specifications Section and Table 1 ............................. 5
Changes to Table 1............................................................................. 5 Changes to AC Specifications Section and Table 2 ....................... 6
Changes to Table 2............................................................................. 6 Changes to Digital Specifications Section ..................................... 8
Changes to Table 4............................................................................. 9 Changes to Switching Specifications Section and Table 4 ........... 9
Changes to Table 5...........................................................................10 Changes to Table 6, Thermal Characteristics Section, and
Changes to Figure 4......................................................................... 11 Table 7 ............................................................................................... 11
Changes to Pin 14 Description, Table 8 .......................................14 Change to Digital Inputs Description, Table 8 ............................ 13
Added AD9680-1250 Section and Figure 6 to Figure 29; Added AD9680-1000 Section, Figure 10, and Figure 11;
Renumbered Sequentially ..............................................................15 Renumbered Sequentially .............................................................. 14
Changes to Figure 113 ....................................................................34 Changes to Figure 6 to Figure 9 .................................................... 14
Changes to Analog Input Considerations Section ......................35 Added Figure 12 to Figure 14 ........................................................ 15
Changes to Table 9...........................................................................36 Changes to Figure 15 to Figure 17 ................................................ 15
Changes to Input Buffer Control Registers (0x018, 0x019, Changes to Figure 18 to Figure 21 ................................................ 16
0x01A, 0x935, 0x934, 0x11A) Section ..........................................37 Changes to Figure 25 and Figure 29 ............................................. 17
Added Figure 118 to Figure 120 ....................................................37 Changes to Figure 30 ...................................................................... 18
Changes to Table 10 ........................................................................40 Deleted Figure 35, Figure 36, and Figure 38................................ 19
Changes to Table 17 ........................................................................57 Added AD9680-500 Section and Figure 31 to Figure 54 ............. 19
Rev. E | Page 3 of 105
AD9680 Data Sheet
Changes to Analog Input Considerations Section and Changes to Table 17........................................................................ 45
Differential Input Configurations Section .................................. 25 Changes to Table 19 to Table 20 ................................................... 46
Added Input Buffer Control Registers (0x018, 0x019, 0x01A, Changes to Table 22........................................................................ 47
0x935, 0x934, 0x11A) Section, Figure 66, Figure 68, and Table 9; Changes to Table 23........................................................................ 49
Renumbered Sequentially.............................................................. 26 Changes to JESD204B Link Establishment Section ................... 53
Changes to Analog Input Buffer Controls and SFDR Added Figure 105 to Figure 110 ................................................... 56
Optimization Section and Figure 67 ............................................ 26 Changes to Example 1: Full Bandwidth Mode Section ............. 60
Added Figure 69 to Figure 72........................................................ 27 Added Multichip Synchronization Section, Figure 115 to
Added Figure 73 to Figure 75........................................................ 28 Figure 117, and Table 28 ................................................................ 62
Changes to Table 10 ........................................................................ 28 Added Test Modes Section and Table 29 to Table 33 ................. 66
Added Input Clock Divider ½ Period Delay Adjust Section and Changes to Reading the Memory Map Register Table Section ...... 70
Clock Fine Delay Adjust Section .................................................. 30 Changes to Table 36........................................................................ 71
Changes to Figure 83 and Temperature Diode Section ............. 31 Changes to Power Supply Recommendations Section,
Added Signal Monitor Section and Figure 86 to Figure 89 ...... 33 Figure 118, and Exposed Pad Thermal Heat Slug
Changes to Table 11 ........................................................................ 39 Recommendations Section............................................................ 83
Changes to Table 12 to Table 14.................................................... 40 Changes to Ordering Guide .......................................................... 84
Changes to Table 16 ........................................................................ 41
Deleted Figure 65 and Figure 66................................................... 45 5/2014—Revision 0: Initial Version
GENERAL DESCRIPTION
The AD9680 is a dual, 14-bit, 1.25 GSPS/1 GSPS/820 MSPS/ function in the communications receiver. The programmable
500 MSPS analog-to-digital converter (ADC). The device has threshold detector allows monitoring of the incoming signal
an on-chip buffer and sample-and-hold circuit designed for low power using the fast detect output bits of the ADC. If the input
power, small size, and ease of use. This device is designed for signal level exceeds the programmable threshold, the fast detect
sampling wide bandwidth analog signals of up to 2 GHz. The indicator goes high. Because this threshold indicator has low
AD9680 is optimized for wide input bandwidth, high sampling latency, the user can quickly turn down the system gain to avoid
rate, excellent linearity, and low power in a small package. an overrange condition at the ADC input.
The dual ADC cores feature a multistage, differential pipelined Users can configure the Subclass 1 JESD204B-based high speed
architecture with integrated output error correction logic. Each serialized output in a variety of one-, two-, or four-lane
ADC features wide bandwidth inputs supporting a variety of configurations, depending on the DDC configuration and the
user-selectable input ranges. An integrated voltage reference acceptable lane rate of the receiving logic device. Multiple device
eases design considerations. synchronization is supported through the SYSREF± and
The analog input and clock signals are differential inputs. Each SYNCINB± input pins.
ADC data output is internally connected to two digital down- The AD9680 has flexible power-down options that allow
converters (DDCs). Each DDC consists of up to five cascaded significant power savings when desired. All of these features can
signal processing stages: a 12-bit frequency translator (NCO), be programmed using a 1.8 V to 3.3 V capable, 3-wire SPI.
and four half-band decimation filters. The DDCs are bypassed The AD9680 is available in a Pb-free, 64-lead LFCSP and is
by default. specified over the −40°C to +85°C industrial temperature range.
In addition to the DDC blocks, the AD9680 has several This product is protected by a U.S. patent.
functions that simplify the automatic gain control (AGC)
SPECIFICATIONS
DC SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate for each speed grade, AIN = −1.0 dBFS, clock divider = 2, default SPI settings, TA = 25°C, unless otherwise noted.
Table 1.
AD9680-500 AD9680-820 AD9680-1000 AD9680-1250
Parameter Temp Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
RESOLUTION Full 14 14 14 14 Bits
ACCURACY
No Missing Codes Full Guaranteed Guaranteed Guaranteed Guaranteed
Offset Error Full −0.3 0 +0.3 −0.3 0 +0.3 −0.31 0 +0.31 −0.31 0 +0.31 % FSR
Offset Matching Full 0 0.3 0 0.23 0 0.23 0 0.3 % FSR
Gain Error Full −6 0 +6 −6 0 +6 −6 0 +6 −6 0 +6 % FSR
Gain Matching Full 1 5.1 1 5.5 1 4.5 1 4.5 % FSR
Differential Nonlinearity Full −0.6 ±0.5 +0.7 −0.7 ±0.5 +0.8 −0.7 ±0.5 +0.8 −0.8 ±0.5 +0.8 LSB
(DNL)
Integral Nonlinearity (INL) Full −4.5 ±2.5 +5.0 −3.3 ±2.5 +4.3 −5.7 ±2.5 +6.9 −6 ±3 +6 LSB
TEMPERATURE DRIFT
Offset Error Full −3 −10 −12 −15 ppm/°C
Gain Error Full ±25 ±54 ±13.8 92 ppm/°C
INTERNAL VOLTAGE
REFERENCE
Voltage Full 1.0 1.0 1.0 1.0 V
INPUT-REFERRED NOISE
VREF = 1.0 V 25°C 2.06 2.46 2.63 3.45 LSB rms
ANALOG INPUTS
Differential Input Voltage Full 1.46 2.06 2.06 1.46 1.70 1.94 1.46 1.70 1.94 1.46 1.58 1.94 V p-p
Range (Programmable)
Common-Mode Voltage 25°C 2.05 2.05 2.05 2.05 V
(VCM)
Differential Input 25°C 1.5 1.5 1.5 1.5 pF
Capacitance 1
Analog Input Full Power 25°C 2 2 2 2 GHz
Bandwidth
POWER SUPPLY
AVDD1 Full 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 V
AVDD2 Full 2.44 2.50 2.56 2.44 2.50 2.56 2.44 2.50 2.56 2.44 2.50 2.56 V
AVDD3 Full 3.2 3.3 3.4 3.2 3.3 3.4 3.2 3.3 3.4 3.2 3.3 3.4 V
AVDD1_SR Full 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 V
DVDD Full 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 V
DRVDD Full 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 1.22 1.25 1.28 V
SPIVDD Full 1.7 1.8 3.4 1.7 1.8 3.4 1.7 1.8 3.4 1.7 1.8 3.4 V
IAVDD1 Full 435 467 605 660 685 720 785 880 mA
IAVDD2 Full 395 463 490 545 595 680 675 780 mA
IAVDD3 Full 87 101 125 140 125 142 125 142 mA
IAVDD1_SR Full 15 22 15 18 16 18 17 20 mA
IDVDD 2 Full 145 152 205 246 208 269 250 325 mA
IDRVDD1 Full 190 237 200 240 200 225 220 300 mA
IDRVDD (L = 2 Mode) 25°C 140 N/A 3 N/A3 N/A3 mA
ISPIVDD Full 5 6 5 6 5 6 5 6 mA
AC SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate for each speed grade, AIN = −1.0 dBFS, clock divider = 2, default SPI settings, TA = 25°C, unless otherwise noted.
Table 2.
AD9680-500 AD9680-820 AD9680-1000 AD9680-1250
Parameter 1 Temp Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
ANALOG INPUT FULL SCALE Full 2.06 1.7 1.7 1.58 V p-p
NOISE DENSITY 2 Full −153 −153 −154 −151.5 dBFS/Hz
SIGNAL-TO-NOISE RATIO
(SNR) 3
fIN = 10 MHz 25°C 69.2 67.2 67.2 63.6 dBFS
fIN = 170 MHz Full 67.8 69.0 65.6 67.0 65.1 66.6 61.5 63.2 dBFS
fIN = 340 MHz 25°C 68.6 66.5 65.3 62.8 dBFS
fIN = 450 MHz 25°C 68.0 65.1 64.0 62.2 dBFS
fIN = 765 MHz 25°C 64.4 64.0 62.6 61.1 dBFS
fIN = 985 MHz 25°C 63.8 63.4 61.5 59.2 dBFS
fIN = 1950 MHz 25°C 60.5 59.7 57.0 55.5 dBFS
SNR AND DISTORTION RATIO
(SINAD)3
fIN = 10 MHz 25°C 69.0 67.1 67.1 63.5 dBFS
fIN = 170 MHz Full 67.6 68.8 65.2 66.8 65.0 66.4 61.4 62.8 dBFS
fIN = 340 MHz 25°C 68.4 66.3 65.2 62.6 dBFS
fIN = 450 MHz 25°C 67.9 64.7 63.8 61.8 dBFS
fIN = 765 MHz 25°C 64.2 63.5 62.5 60.8 dBFS
fIN = 985 MHz 25°C 63.6 62.7 61.4 58.2 dBFS
fIN = 1950 MHz 25°C 60.3 58.7 56.4 51.5 dBFS
EFFECTIVE NUMBER OF BITS
(ENOB)
fIN = 10 MHz 25°C 11.2 10.9 10.8 10.3 Bits
fIN = 170 MHz Full 10.9 11.1 10.5 10.8 10.5 10.7 9.9 10.1 Bits
fIN = 340 MHz 25°C 11.1 10.7 10.5 10.1 Bits
fIN = 450 MHz 25°C 11.0 10.5 10.3 10.0 Bits
fIN = 765 MHz 25°C 10.4 10.3 10.1 9.8 Bits
fIN = 985 MHz 25°C 10.3 10.1 9.9 9.4 Bits
fIN = 1950 MHz 25°C 9.7 9.5 9.1 8.3 Bits
DIGITAL SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate for each speed grade, AIN = −1.0 dBFS, clock divider = 2, default SPI settings, TA = 25°C, unless otherwise noted.
Table 3.
Parameter Temperature Min Typ Max Unit
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance Full LVDS/LVPECL
Differential Input Voltage Full 600 1200 1800 mV p-p
Input Common-Mode Voltage Full 0.85 V
Input Resistance (Differential) Full 35 kΩ
Input Capacitance Full 2.5 pF
SYSREF INPUTS (SYSREF+, SYSREF−)
Logic Compliance Full LVDS/LVPECL
Differential Input Voltage Full 400 1200 1800 mV p-p
Input Common-Mode Voltage Full 0.6 0.85 2.0 V
Input Resistance (Differential) Full 35 kΩ
Input Capacitance (Differential) Full 2.5 pF
LOGIC INPUTS (SDI, SCLK, CSB, PDWN/STBY)
Logic Compliance Full CMOS
Logic 1 Voltage Full 0.8 × SPIVDD V
Logic 0 Voltage Full 0 0.5 V
Input Resistance Full 30 kΩ
LOGIC OUTPUT (SDIO)
Logic Compliance Full CMOS
Logic 1 Voltage (IOH = 800 µA) Full 0.8 × SPIVDD V
Logic 0 Voltage (IOL = 50 µA) Full 0 0.5 V
SYNCIN INPUT (SYNCINB+/SYNCINB−)
Logic Compliance Full LVDS/LVPECL/CMOS
Differential Input Voltage Full 400 1200 1800 mV p-p
Input Common-Mode Voltage Full 0.6 0.85 2.0 V
Input Resistance (Differential) Full 35 kΩ
Input Capacitance Full 2.5 pF
LOGIC OUTPUTS (FD_A, FD_B)
Logic Compliance Full CMOS
Logic 1 Voltage Full 0.8 × SPIVDD V
Logic 0 Voltage Full 0 0.5 V
Input Resistance Full 30 kΩ
DIGITAL OUTPUTS (SERDOUTx±, x = 0 TO 3)
Logic Compliance Full CML
Differential Output Voltage Full 360 770 mV p-p
Output Common-Mode Voltage (VCM)
AC-Coupled 25°C 0 1.8 V
Short-Circuit Current (IDSHORT) 25°C −100 +100 mA
Differential Return Loss (RLDIFF) 1 25°C 8 dB
Common-Mode Return Loss (RLCM)1 25°C 6 dB
Differential Termination Impedance Full 80 100 120 Ω
1
Differential and common-mode return loss are measured from 100 MHz to 0.75 × baud rate.
SWITCHING SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate for each speed grade, AIN = −1.0 dBFS, default SPI settings, TA = 25°C, unless otherwise noted.
Table 4.
AD9680-500 AD9680-820 AD9680-1000 AD9680-1250
Parameter Temp Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
CLOCK
Clock Rate (at Full 0.3 4 0.3 4 0.3 4 0.3 4 GHz
CLK+/CLK− Pins)
Maximum Sample Rate 1 Full 500 820 1000 1250 MSPS
Minimum Sample Rate 2 Full 300 300 300 300 MSPS
Clock Pulse Width High Full 1000 609.7 500 400 ps
Clock Pulse Width Low Full 1000 609.7 500 400 ps
OUTPUT PARAMETERS
Unit Interval (UI) 3 Full 80 200 80 121.95 80 100 80 80 ps
Rise Time (tR) (20% to 25°C 24 32 24 32 24 32 24 32 ps
80% into 100 Ω Load)
Fall Time (tF) (20% to 80% 25°C 24 32 24 32 24 32 24 32 ps
into 100 Ω Load)
PLL Lock Time 25°C 2 2 2 2 ms
Data Rate per Channel 25°C 3.125 5 12.5 3.125 8.2 12.5 3.125 10 12.5 3.1215 12.5 12.5 Gbps
(NRZ) 4
LATENCY 5
Pipeline Latency Full 55 55 55 55 Clock
cycles
Fast Detect Latency Full 28 28 28 28 Clock
cycles
Wake-Up Time 6
Standby 25°C 1 1 1 1 ms
Power-Down 25°C 4 4 4 4 ms
APERTURE
Aperture Delay (tA) Full 530 530 530 530 ps
Aperture Uncertainty Full 55 55 55 55 fS rms
(Jitter, tJ)
Out-of-Range Recovery Full 1 1 1 1 Clock
Time cycles
1
The maximum sample rate is the clock rate after the divider.
2
The minimum sample rate operates at 300 MSPS with L = 2 or L = 1.
3
Baud rate = 1/UI. A subset of this range can be supported.
4
Default L = 4. This number can be changed based on the sample rate and decimation ratio.
5
No DDCs used. L = 4, M = 2, F = 1.
6
Wake-up time is defined as the time required to return to normal operation from power-down mode.
Timing Diagrams
APERTURE
DELAY
SAMPLE N
ANALOG
INPUT N – 54 N+1
SIGNAL N – 55
N – 53
N – 52 N – 51 N–1
CLK–
CLK+
CLK–
CLK+
SERDOUT0–
A B C D E F G H I J A B C D E F G H I J A B C D E F G H I J CONVERTER0 MSB
SERDOUT0+
SERDOUT1–
A B C D E F G H I J A B C D E F G H I J A B C D E F G H I J CONVERTER0 LSB
SERDOUT1+
SERDOUT2–
A B C D E F G H I J A B C D E F G H I J A B C D E F G H I J CONVERTER1 MSB
SERDOUT2+
SERDOUT3–
A B C D E F G H I J A B C D E F G H I J A B C D E F G H I J CONVERTER1 LSB
SERDOUT3+
11752-002
CLK+
tSU_SR tH_SR
SYSREF–
11752-003
SYSREF+
CSB
11752-004
SDIO DON’T CARE R/W A14 A13 A12 A11 A10 A9 A8 A7 D7 D6 D3 D2 D1 D0 DON’T CARE
AVDD1_SR
SYSREF+
SYSREF–
AVDD1
AVDD2
AVDD2
AVDD1
AVDD1
AVDD1
AVDD2
AVDD2
AVDD1
AGND
AGND
CLK+
CLK–
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVDD1 1 48 AVDD1
AVDD1 2 47 AVDD1
AVDD2 3 46 AVDD2
AVDD3 4 45 AVDD3
VIN–A 5 44 VIN–B
VIN+A 6 43 VIN+B
AVDD3 7 42 AVDD3
AVDD2 8
AD9680 41 AVDD2
TOP VIEW
AVDD2 9 (Not to Scale) 40 AVDD2
AVDD2 10 39 AVDD2
AVDD2 11 38 SPIVDD
V_1P0 12 37 CSB
SPIVDD 13 36 SCLK
PDWN/STBY 14 35 SDIO
DVDD 15 34 DVDD
DGND 16 33 DGND
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
FD_A
FD_B
DRGND
SERDOUT0–
SERDOUT0+
SERDOUT1–
SERDOUT1+
SERDOUT2–
SERDOUT2+
SERDOUT3–
SERDOUT3+
DRGND
DRVDD
SYNCINB–
SYNCINB+
DRVDD
NOTES
11752-005
1. EXPOSED PAD. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE
PACKAGE PROVIDES THE GROUND REFENCE FOR AVDDx. THIS EXPOSED
PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION.
AMPLITUDE (dBFS)
–50 –50
–70 –70
–90 –90
–110 –110
–130 –130
11752-606
11752-609
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 6. Single-Tone FFT with fIN = 10.3 MHz Figure 9. Single-Tone FFT with fIN = 450.3 MHz
AMPLITUDE (dBFS)
–50 –50
–70 –70
–90 –90
–110 –110
–130 –130
11752-607
11752-610
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 7. Single-Tone FFT with fIN = 170.3 MHz Figure 10. Single-Tone FFT with fIN = 765.3 MHz
0
AIN = –1dBFS AIN = –1dBFS
–10
SNR = 62.8dBFS SNR = 59.7dBFS
ENOB = 10.1 BITS –20 ENOB = 9.6 BITS
SFDR = 76dBFS SFDR = 74dBFS
–30 BUFFER CURRENT = 3.5× BUFFER CURRENT = 5.5×
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–40
–50
–60
–70
–80
–90
–110 –100
–130 –120
11752-608
11752-611
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 8. Single-Tone FFT with fIN = 340.3 MHz Figure 11. Single-Tone FFT with fIN = 985.3 MHz
–40
SNR/SFDR (dBFS)
75
–60
70
–80
65
–100
SNR
–120 60
11752-612
11752-615
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 1000 1020 1040 1060 1080 1100 1120 1140 1160 1180 1200 1220 1240 1260
FREQUENCY (MHz) SAMPLE RATE (MHz)
Figure 12. Single-Tone FFT with fIN = 1205.3 MHz Figure 15. SNR/SFDR vs. fS, fIN = 170.3 MHz; Buffer Control 1 (0x018) = 3.5×
0 85
AIN = –1dBFS 3.5× SNR (dBFS)
SNR = 56.6dBFS 3.5× SFDR (dBFS)
–20 ENOB = 9.0 BITS 4.5× SNR (dBFS)
SFDR = 67dBFS 80 4.5× SFDR (dBFS)
BUFFER CURRENT = 7.5×
AMPLITUDE (dBFS)
SNR/SFDR (dBFS)
–40
75
–60
70
–80
65
–100
–120 60
11752-616
11752-613
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 10.3 147.3 212.3 290.3 355.3 433.3 511.3 589.3 667.3
FREQUENCY (MHz) INPUT FREQUENCY (MHz)
Figure 13. Single-Tone FFT with fIN = 1602.3 MHz Figure 16. SNR/SFDR vs. fIN; fIN < 700 MHz;
Buffer Control 1 (0x018) = 3.5× and 4.5×
0 80
AIN = –1dBFS
SNR = 55.4dBFS
–20 ENOB = 8.8 BITS
SFDR = 63dBFS 75 SFDR
BUFFER CURRENT = 8.5×
AMPLITUDE (dBFS)
–40
SNR/SFDR (dBFS)
70
–60
65
–80
SNR
60
–100
–120 55
11752-614
11752-617
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 628.3 706.6 784.3 862.3 940.3 1018.3 1096.3 1174.3 1252.3
FREQUENCY (MHz) INPUT FREQUENCY (MHz)
Figure 14. Single-Tone FFT with fIN = 1954.3 MHz Figure 17. SNR/SFDR vs. fIN; 650 MHz < fIN < 1.3 GHz;
Buffer Control 1 (0x018) = 6.5×
–40
SFDR
65
–60
60
–80
SNR
55
–100
50
11752-618
1252.3 1356.3 1460.3 1564.3 1668.3 177.23 1876.3 1980.3 –120
11752-622
–90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6 0
INPUT FREQUENCY (MHz)
INPUT AMPLITUDE (dBFS)
Figure 18. SNR/SFDR vs. fIN; 1.3 GHz < fIN < 2GHz; Figure 21. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
Buffer Control 1 (0x018) = 8.5× fIN1 = 184 MHz and fIN2 = 187 MHz
0 0
AIN1 AND AIN2 = –7dBFS IMD3 (dBc)
SFDR = 82dBFS IMD3 (dBFS)
IMD2 = 84dBFS –20 SFDR (dBFS)
–20
IMD3 = 82dBFS SFDR (dBc)
–40
–60
–60
–80
–80
–100
–100 –120
–120 –140
11752-623
11752-095
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 –90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6 0
FREQUENCY (MHz) INPUT AMPLITUDE (dBFS)
Figure 19. Two-Tone FFT; fIN1 = 184 MHz, fIN2 = 187 MHz Figure 22. Two-Tone IMD3/SFDR vs. Input Amplitude (AIN) with
fIN1 = 449 MHz and fIN2 = 452 MHz
0 120
AIN1 AND AIN2 = –7dBFS
SFDR = 78dBFS
IMD2 = 78dBFS 100
–20
IMD3 = 78dBFS
BUFFER CURRENT = 5.5× 80
AMPLITUDE (dBFS)
–40
SNR/SFDR (dB)
60
–60 40
20
–80
0
SNR (dBFS)
–100 SNR (dBc)
–20
SFDR (dBc)
SFDR (dBFS)
–120 –40
11752-624
11752-096
0 78.125 156.250 234.375 312.500 390.625 468.750 546.875 625.000 –90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6 0
FREQUENCY (MHz) INPUT AMPLITUDE (dBFS)
Figure 20. Two-Tone FFT; fIN1 = 449 MHz, fIN2 = 452 MHz Figure 23. SNR/SFDR vs. Analog Input Level, fIN = 170.3 MHz
NUMBER OF HITS
75
SNR/SFDR (dBFS)
800000
70 600000
65 400000
SNR
60 200000
55 0
11752-625
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N–9
N–8
N–7
N–6
N–5
N–4
N–3
N–2
N–1
N
N + 10
N – 10
–48 –38 –28 –18 –8 2 12 22 32 42 52 62 72 82 92 102 112
11752-628
TEMPERATURE (°C)
CODE
Figure 24. SNR/SFDR vs. Temperature, fIN = 170.3 MHz Figure 27. Input-Referred Noise Histogram
4 4.00
3 3.95
3.90
2
3.85
1 POWER (W)
INL (LSB)
3.80
0
3.75
–1
3.70
–2
3.65
–3 3.60
–4 3.55
11752-626
11752-629
0 2000 4000 6000 8000 10000 12000 14000 16000 –48 –38 –28 –18 –8 2 12 22 32 42 52 62 72 82
OUTPUT CODE TEMPERATURE (°C)
Figure 25. INL, fIN = 10.3 MHz Figure 28. Power Dissipation vs. Temperature
0.4 4.0
0.3
3.9
0.2
POWER DISSIPATION (W)
3.8
0.1
DNL (LSB)
3.7
0
3.6
–0.1
3.5
–0.2
–0.3 3.4
–0.4 3.3
11752-627
11752-630
0 2000 4000 6000 8000 10000 12000 14000 16000 1000 1020 1040 1060 1080 1100 1120 1140 1160 1180 1200 1220 1240 1260
OUTPUT CODE SAMPLE RATE (MHz)
Figure 26. DNL, fIN = 15 MHz Figure 29. Power Dissipation vs. fS
AMPLITUDE (dBFS)
–50 –50
–70 –70
–90 –90
–110 –110
–130 –130
11752-100
11752-103
0 100 200 300 400 500 0 100 200 300 400 500
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 30. Single-Tone FFT with fIN = 10.3 MHz Figure 33. Single-Tone FFT with fIN = 450.3 MHz
AIN = –1dBFS
–10 AIN = –1dBFS
SNR = 66.6dBFS
SNR = 62.6dBFS
ENOB = 10.7 BITS
ENOB = 10.1 BITS
SFDR = 85dBFS
SFDR = 82dBFS
–30 BUFFER CONTROL 1 = 3.0×
BUFFER CONTROL 1 = 6.0×
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–50
–70
–90
–110
–130
11752-101
11752-104
0 100 200 300 400 500 0 100 200 300 400 500
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 31. Single-Tone FFT with fIN = 170.3 MHz Figure 34. Single-Tone FFT with fIN = 765.3 MHz
0
AIN = –1dBFS AIN = –1dBFS
–10
SNR = 65.3dBFS SNR = 60.5dBFS
ENOB = 10.5 BITS ENOB = 9.9 BITS
SFDR = 85dBFS –20 SFDR = 80dBFS
–30 BUFFER CONTROL 1 = 3.0× BUFFER CONTROL 1 = 6.0×
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–40
–50
–60
–70
–90 –80
–110 –100
–130 –120
11752-102
11752-105
0 100 200 300 400 500 0 100 200 300 400 500
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 32. Single-Tone FFT with fIN = 340.3 MHz Figure 35. Single-Tone FFT with fIN = 985.3 MHz
–40 80
SNR/SFDR (dBFS)
–60
75
–80
70
SNR (dBFS)
–100
65
–120
11752-107
0 100 200 300 400 500 60
11752-201
FREQUENCY (MHz) 700 750 800 850 900 950 1000 1050 1100
SAMPLE RATE (MHz)
Figure 36. Single-Tone FFT with fIN = 1293.3 MHz Figure 39. SNR/SFDR vs. fS, fIN = 170.3 MHz; Buffer Control 1 (0x018) = 3.0×
0 90
AIN = –1dBFS
SNR = 57.7dBFS
ENOB = 9.2 BITS 85
–20 SFDR = 70dBFS
BUFFER CONTROL 1 = 8.0×
80
AMPLITUDE (dBFS)
–40
SNR/SFDR (dBFS) 75
–60 70
65
–80
60
–100 1.5× SFDR (dBFS)
1.5× SNR (dBFS)
55
3.0× SFDR (dBFS)
3.0× SNR (dBFS)
–120 50
11752-108
11752-216
0 100 200 300 400 500 10.3 63.3 100.3 170.3 225.3 302.3 341.3 403.3 453.3 502.3
FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz)
Figure 37. Single-Tone FFT with fIN = 1725.3 MHz Figure 40. SNR/SFDR vs. fIN; fIN < 500 MHz;
Buffer Control 1 (0x018) = 1.5× and 3.0×
0 100
AIN = –1dBFS
SNR = 57.0dBFS
–20 ENOB = 9.1 BITS 90
SFDR = 69dBFS
BUFFER CURRENT = 6.0×
SNR/SFDR (dBFS)
AMPLITUDE (dBFS)
–40
80
–60
70
–80
60
–100 4.0× SFDR
4.0× SNRFS
6.0× SFDR
6.0× SNRFS
–120 50
11752-506
11752-218
Figure 38. Single-Tone FFT with fIN = 1950.3 MHz Figure 41. SNR/SFDR vs. fIN; 500 MHz < fIN < 1 GHz;
Buffer Control 1 (0x018) = 4.0× and 6.0×
AMPLITUDE (dBFS)
SNR/SFDR (dBFS)
–40
80
SFDR –60
70
–80
SNR
60
–100
50 –120
11752-206
11752-219
978.5 1065.0 1142.4 1220.0 1297.3 1374.8 1452.2 0 100 200 300 400 500
ANALOG INPUT FREQUENCY (MHz) FREQUENCY (MHz)
Figure 42. SNR/SFDR vs. fIN; 1 GHz < fIN < 1.5 GHz; Figure 45. Two-Tone FFT; fIN1 = 338 MHz, fIN2 = 341 MHz
Buffer Control 1 (0x018) = 6.0×
100 20
SFDR (dBc)
SFDR (dBFS)
0 IMD3 (dBc)
IMD3 (dBFS)
90
80 –40
SFDR –60
70
–80
60 –100
SNR
–120
50
11752-220
11752-207
–90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6
ANALOG INPUT FREQUENCY (MHz)
INPUT AMPLITUDE (dBFS)
Figure 43. SNR/SFDR vs. fIN; 1.5 GHz < fIN < 2 GHz; Figure 46. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
Buffer Control 1 (0x018) = 7.5× fIN1 = 184 MHz and fIN2 = 187 MHz
0 20
AIN1 AND AIN2 = –7dBFS SFDR (dBc)
SFDR = 87dBFS SFDR (dBFS)
IMD2 = 93dBFS 0 IMD3 (dBc)
–20 IMD3 = 87dBFS IMD3 (dBFS)
BUFFER CONTROL 1 = 3.0×
SNR/SFDR (dBc AND dBFS)
–20
AMPLITUDE (dBFS)
–40
–40
–60
–60
–80 –80
–100
–100
–120
–120
11752-205
–90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6
FREQUENCY (MHz)
INPUT AMPLITUDE (dBFS)
Figure 44. Two-Tone FFT; fIN1 = 184 MHz, fIN2 = 187 MHz Figure 47. Two-Tone IMD3/SFDR vs. Input Amplitude (AIN) with
fIN1 = 338 MHz and fIN2 = 341 MHz
60
INL (LSB)
50
0
40
30
–1
20
10
0 SFDR (dBFS) –2
SFDR (dBc)
–10 SNR (dBFS)
SNR (dBc)
–20 –3
11752-209
11752-211
–90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6 0 0 2000 4000 6000 8000 10000 12000 14000 16000
INPUT AMPLITUDE (dBFS) OUTPUT CODE
Figure 48. SNR/SFDR vs. Analog Input Level, fIN = 170.3 MHz Figure 50. INL, fIN = 10.3 MHz
100 0.6
0.4
90
SFDR
SNR/SFDR (dBFS)
0.2
80 DNL (LSB)
0
70
SNR
–0.2
60
–0.4
50
11752-210
11752-212
0 2000 4000 6000 8000 10000 12000 14000 16000
TEMPERATURE (°C)
OUTPUT CODE
Figure 49. SNR/SFDR vs. Temperature, fIN = 170.3 MHz Figure 51. DNL, fIN = 15 MHz
20000 3.30
3.20
15000
3.15
3.10
10000
3.05
3.00
5000
2.95
2.90
11752-215
0 700 750 800 850 900 950 1000 1050 1100
11752-213
N–6 N–5 N–4 N–3 N–2 N–1 N N+1 N+2 N+3 N+4 N+5 N+6 SAMPLE RATE (MHz)
CODE
Figure 52. Input-Referred Noise Histogram Figure 54. Power Dissipation vs. fS
3.40
L=4
M=2
F=1
3.35
POWER DISSIPATION (W)
3.30
3.25
3.20
3.15
11752-214
AMPLITUDE (dBFS)
–40 –40
–60 –60
–80 –80
–100 –100
11752-510
–120
11752-507
–120
0 82 164 246 328 410 0 82 164 246 328 410
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 55. Single-Tone FFT with fIN = 10.3 MHz Figure 58. Single-Tone FFT with fIN = 450.3 MHz
0 0
AIN = –1dBFS AIN = –1dBFS
SNR = 67.0dBFS SNR = 64.0dBFS
–20 ENOB = 10.8 BITS –20 ENOB = 10.3 BITS
SFDR = 83dBFS SFDR = 79dBFS
BUFFER CONTROL 1 = 2.0× BUFFER CONTROL 1 = 6.5×
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–40 –40
–60 –60
–80 –80
–100 –100
–120
11752-511
11752-508
–120
0 82 164 246 328 410 0 82 164 246 328 410
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 56. Single-Tone FFT with fIN = 170.3 MHz Figure 59. Single-Tone FFT with fIN = 765.3 MHz
0 0
AIN = –1dBFS AIN = –1dBFS
SNR = 66.5dBFS SNR = 63.4dBFS
–20 ENOB = 10.7 BITS –20 ENOB = 10.1 BITS
SFDR = 86dBFS SFDR = 74dBFS
BUFFER CONTROL 1 = 3.0× BUFFER CONTROL 1 = 8.5×
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–40 –40
–60 –60
–80 –80
–100 –100
11752-512
–120
11752-509
–120
0 82 164 246 328 410 0 82 164 246 328 410
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 57. Single-Tone FFT with fIN = 340.3 MHz Figure 60. Single-Tone FFT with fIN = 985.3 MHz
–40
SNR/SFDR (dBFS)
75
–60 70
SNR
65
–80
60
–100
55
11752-513
11752-516
–120 50
0 82 164 246 328 410 500 550 600 650 700 750 800 850 900
FREQUENCY (MHz) SAMPLE RATE (MHz)
Figure 61. Single-Tone FFT with fIN = 1205.3 MHz Figure 64. SNR/SFDR vs. fS, fIN = 170.3 MHz;
Buffer Control 1 (0x018) = 3.0×
0 95
AIN = –1dBFS
SNR = 60.5dBFS 90
–20 ENOB = 9.5 BITS
SFDR = 68dBFS 85
BUFFER CONTROL 1 = 7.5×
AMPLITUDE (dBFS)
75
–60
70
–80
65
60
–100
55 SFDR
SNR
11752-514
–120
0 82 164 246 328 410 50
11752-517
10.3
65.5
95.3
125.4
150.3
170.3
180.3
210.5
240.3
270.3
301.3
330.3
340.7
360.3
390.3
420.3
450.3
FREQUENCY (MHz)
Figure 62. Single-Tone FFT with fIN = 1720.3 MHz Figure 65. SNR/SFDR vs. fIN; fIN < 450 MHz;
Buffer Control 1 (0x018) = 3.0×
0 85
SFDR
AIN = –1dBFS
SNR = 59.7dBFS 80
–20 ENOB = 9.5 BITS
SFDR = 69dBFS
BUFFER CONTROL 1 = 8.5× 75
AMPLITUDE (dBFS)
SNR/SFDR (dBFS)
–40
70
–60
SNR
65
–80
60
–100 55
11752-518
50
11752-515
–120
0 82 164 246 328 410 450.3 480.3 510.3 515.3 610.3 766.3 810.3 985.3
FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz)
Figure 63. Single-Tone FFT with fIN = 1950.3 MHz Figure 66. SNR/SFDR vs. fIN; 450 MHz < fIN < 1 GHz;
Buffer Control 1 (0x018) = 6.5×
AMPLITUDE (dBFS)
70 –40
SNR/SFDR (dBFS)
–60
65
SNR
–80
60
–100
55
11752-527
–120
50
11752-519
0 82 164 246 328 410
985.3 1022.3 1110.3 1205.3 1315.3 1420.3 1510.3 FREQUENCY (MHz)
ANALOG INPUT FREQUENCY (MHz)
Figure 67. SNR/SFDR vs. fIN; 1 GHz < fIN < 1.5 GHz; Figure 70. Two-Tone FFT; fIN1 = 338 MHz, fIN2 = 341 MHz
Buffer Control 1 (0x018) = 6.5×
75 0
IMD3 (dBc)
IMD3 (dBFS)
–20 SFDR (dBc)
70
–40
65
–60
SNR
60
–80
55
–100
11752-520
50
11752-528
–120
1510.3 1600.3 1720.3 1810.3 1920.3 1950.3 –87 –81 –75 –69 –63 –57 –51 –45 –39 –33 –27 –21 –15 –9
ANALOG INPUT FREQUENCY (MHz) INPUT AMPLITUDE (dBFS)
Figure 68. SNR/SFDR vs. fIN; 1.5 GHz < fIN < 2 GHz; Figure 71. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
Buffer Control 1 (0x018) = 8.5× fIN1 = 184 MHz and fIN2 = 187 MHz
0 0
AIN1 AND AIN2 = –7dBFS
IMD3 (dBc)
SFDR = 90dBFS
IMD3 (dBFS)
–20 IMD2 = 90dBFS –20
SFDR (dBc)
IMD3 = 91dBFS
SFDR/IMD3 (dBc AND dBFS)
SFDR (dBFS)
BUFFER CURRENT = 3.0×
AMPLITUDE (dBFS)
–40 –40
–60 –60
–80 –80
–100 –100
–120
11752-529
11752-535
–120
0 82 164 246 328 410 –87 –81 –75 –69 –63 –57 –51 –45 –39 –33 –27 –21 –15 –9
FREQUENCY (MHz) INPUT AMPLITUDE (dBFS)
Figure 69. Two-Tone FFT; fIN1 = 184 MHz, fIN2 = 187 MHz Figure 72. Two-Tone IMD3/SFDR vs. Input Amplitude (AIN) with
fIN1 = 338 MHz and fIN2 = 341 MHz
105 2.0
90 1.5
SNR/SFDR (dBc AND dBFS)
75
1.0
60
INL (LSB)
0.5
45
0
30
–0.5
15
SNR (dBc) –1.0
0
SNR (dBFS)
SFDR (dBc) –1.5
–15
SFDR (dBFS)
–2.0
11752-534
11752-521
–30
0 2000 4000 6000 8000 10000 12000 14000 16000
0
–5
–95
–90
–85
–80
–75
–70
–65
–60
–55
–50
–45
–40
–35
–30
–25
–20
–15
–10
OUTPUT CODE
INPUT AMPLITUDE (dBFS)
Figure 73. SNR/SFDR vs. Analog Input Level, fIN = 170.3 MHz Figure 75. INL, fIN = 10.3 MHz
90 0.25
SNR (dBFS)
SFDR (dBFS) 0.20
85 0.15
0.10
80
SNR/SFDR (dBFS)
0.05
DNL (LSB)
0
75
–0.05
–0.10
70
–0.15
65 –0.20
–0.25
60
11752-533
–0.30
11752-530
–45 –30 –15 –5 5 15 25 45 65 85 0 2000 4000 6000 8000 10000 12000 14000 16000
TEMPERATURE (°C) OUTPUT CODE
Figure 74. SNR/SFDR vs. Temperature, fIN = 170.3 MHz Figure 76. DNL, fIN = 15 MHz
2.9
1000000
POWER (W)
800000 2.8
600000
2.7
400000
2.6
200000
11752-531
0 2.5
11752-522
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N–9
N–8
N–7
N–6
N–5
N–4
N–3
N–2
N–1
N
N + 10
N – 10
500
525
550
575
600
625
650
675
700
725
750
775
800
825
850
875
900
CODE SAMPLE RATE (MHz)
Figure 77. Input-Referred Noise Histogram Figure 79. Power Dissipation vs. fS ; L = 4, M = 2, F = 1 for fS ≥ 625 MSPS and
L = 2, M = 2, F = 2 for fS < 625 MSPS (Default SPI)
2.90
2.88
2.86
POWER (W)
2.84
2.82
2.80
2.78
11752-532
2.76
–45 –30 –15 –5 5 15 25 45 65 85
TEMPERATURE (°C)
AMPLITUDE (dBFS)
–60 –60
–80 –80
–100 –100
–120 –120
–140 –140
11752-135
11752-132
0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 80. Single-Tone FFT with fIN = 10.3 MHz Figure 83. Single-Tone FFT with fIN = 450.3 MHz
0 0
AIN = −1dBFS AIN = −1dBFS
SNR = 68.9dBFS SNR = 64.7dBFS
–20 ENOB = 11 BITS –20 ENOB = 10.4 BITS
SFDR = 88dBFS SFDR = 80dBFS
BUFFER CONTROL 1 = 2.0× BUFFER CONTROL 1 = 5.0×
–40 –40
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–60 –60
–80 –80
–100 –100
–120 –120
–140 –140
11752-133
11752-136
0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 81. Single-Tone FFT with fIN = 170.3 MHz Figure 84. Single-Tone FFT with fIN = 765.3 MHz
0 0
AIN = −1dBFS
AIN = −1dBFS
SNR = 68.5dBFS
ENOB = 10.9 BITS SNR = 64.0dBFS
–20 –20 ENOB = 10.3 BITS
SFDR = 83dBFS
BUFFER CONTROL 1 = 4.5× SFDR = 76dBFS
BUFFER CONTROL 1 = 5.0×
–40 –40
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–60 –60
–80 –80
–100 –100
–120 –120
–140 –140
11752-134
11752-137
0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 82. Single-Tone FFT with fIN = 340.3 MHz Figure 85. Single-Tone FFT with fIN = 985.3 MHz
SNR/SFDR (dBFS)
AMPLITUDE (dBFS)
–60 80
–80 75
–100 70 SNR
–120 65
–140 60
11752-141
11752-138
0 25 50 75 100 125 150 175 200 225 250 300 320 340 360 380 400 420 440 460 480 500 530 550
FREQUENCY (MHz) SAMPLE FREQUENCY (MHz)
Figure 86. Single-Tone FFT with fIN = 1310.3 MHz Figure 89. SNR/SFDR vs. fS, fIN = 170.3 MHz; Buffer Control 1 = 2.0×
0 100
AIN = −1dBFS
SNR = 61.5dBFS
–20 ENOB = 9.8 BITS
SFDR = 69dBFS 90
BUFFER CONTROL 1 = 8.0×
–40
AMPLITUDE (dBFS)
–80
70
–100
60
–120 2.0× SNR
2.0× SFDR
4.5× SNR
4.5× SFDR
–140 50
11752-142
11752-139
0 25 50 75 100 125 150 175 200 225 250 10.3 95.3 150.3 180.3 240.3 301.3 340.7 390.3 450.3
FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz)
Figure 87. Single-Tone FFT with fIN = 1710.3 MHz Figure 90. SNR/SFDR vs. fIN; fIN < 500 MHz;
Buffer Control 1 (0x018) = 2.0× and 4.5×
0 100
AIN = −1dBFS
SNR = 60.8dBFS
–20 ENOB = 9.6 BITS
SFDR = 68dBFS 90
BUFFER CONTROL 1 = 8.0×
–40
AMPLITUDE (dBFS)
SNR/SFDR (dBFS)
80
–60
–80
70
–100
60
–120 4.0× SNR
4.0× SFDR
8.0× SNR
8.0× SFDR
–140 50
11752-143
11752-140
0 25 50 75 100 125 150 175 200 225 250 450.3 480.3 510.3 515.3 610.3 765.3 810.3 985.3 1010.3
FREQUENCY (MHz) ANALOG INPUT FREQUENCY (MHz)
Figure 88. Single-Tone FFT with fIN = 1950.3 MHz Figure 91. SNR/SFDR vs. fIN; 500 MHz < fIN < 1 GHz;
Buffer Control 1 (0x018) = 4.0× and 8.0×
70 –40
65 –60
60 –80
55 –100
50 –120
11752-144
11752-148
1010.3 1205.3 1410.3 1600.3 1810.3 1950.3 –90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12
ANALOG INPUT FREQUENCY (MHz) INPUT AMPLITUDE (dBFS)
Figure 92. SNR/SFDR vs. fIN; 1 GHz < fIN < 2 GHz; Figure 95. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
Buffer Control 1 (0x018) = 7.0× and 8.0× fIN1 = 184 MHz and fIN2 = 187 MHz
0 0
AIN1 AND AIN2 = –7dBFS SFDR (dBc)
SFDR = 88dBFS SFDR (dBFS)
IMD2 = 94dBFS IMD3 (dBc)
–20 IMD3 = 88dBFS –20 IMD3 (dBFS)
BUFFER CONTROL 1 = 2.0×
SFDR/IMD3 (dBc AND dBFS)
AMPLITUDE (dBFS)
–40 –40
–60 –60
–80 –80
–100 –100
–120 –120
11752-149
11752-146
0 50 100 150 200 250 –90 –81 –72 –63 –54 –45 –36 –27 –18 –9
FREQUENCY (MHz) AMPLITUDE (dBFS)
Figure 93. Two-Tone FFT; fIN1 = 184 MHz, fIN2 = 187 MHz Figure 96. Two-Tone IMD3/SFDR vs. Input Amplitude (AIN) with
fIN1 = 338 MHz and fIN2 = 341 MHz
0 110
AIN1 AND AIN2 = –7dBFS
SFDR = 88dBFS 100
IMD2 = 88dBFS
–20 IMD3 = 89dBFS 90
BUFFER CONTROL 1 = 4.5× 80
SNR/SFDR (dBc AND dBFS)
AMPLITUDE (dBFS)
–40 70
60
50
–60
40
30
–80
20
10
–100 SFDR (dBFS)
0
SNR (dBFS)
–10 SFDR (dBc)
SNR (dBc)
–120 –20
11752-147
11752-150
0 50 100 150 200 250 –90 –80 –70 –60 –50 –40 –30 –20 –10 0
FREQUENCY (MHz) INPUT AMPLITUDE (dBFS)
Figure 94. Two-Tone FFT; fIN1 = 338 MHz, fIN2 = 341 MHz Figure 97. SNR/SFDR vs. Analog Input Level, fIN = 170.3 MHz
NUMBER OF HITS
85 600000
500000
80
400000
75 300000
200000
70 SNR
100000
65 0
11752-151
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N–9
N–8
N–7
N–6
N–5
N–4
N–3
N–2
N–1
N
N + 10
N – 10
–40 –15 10 35 60 85
11752-154
TEMPERATURE (°C)
OUTPUT CODE
Figure 98. SNR/SFDR vs. Temperature, fIN = 170.3 MHz Figure 101. Input-Referred Noise Histogram
3.0 2.32
L=4
2.5 M=2
F=1
2.30
2.0
1.5
2.28
POWER (W)
1.0
INL (LSB)
0.5 2.26
0
2.24
–0.5
–1.0
2.22
–1.5
–2.0 2.20
11752-152
11752-155
0 2000 4000 6000 8000 10000 12000 14000 16000 –45 –35 –5 15 25 45 65 85
OUTPUT CODE TEMPERATURE (°C)
Figure 99. INL, fIN = 10.3 MHz Figure 102. Power Dissipation vs. Temperature
0.8 2.37
L = 4, M = 2, F = 1
L = 2, M = 2, F = 2
0.6 2.32
2.27
0.4
2.22
0.2
POWER (W)
2.17
DNL (LSB)
0 2.12
–0.2 2.07
2.02
–0.4
1.97
–0.6
1.92
–0.8 1.87
11752-153
11752-156
0 2000 4000 6000 8000 10000 12000 14000 16000 300 320 340 360 380 400 420 440 460 480 500 520 540
OUTPUT CODE SAMPLE RATE (MHz)
Figure 100. DNL, fIN = 15 MHz Figure 103. Power Dissipation vs. fS
EQUIVALENT CIRCUITS
AVDD3
AVDD3
VIN+x
200Ω
28Ω
67Ω
200Ω
28Ω
67Ω
DRVDD
11752-014
x = 0, 1, 2, 3
(SPI)
DRGND
DVDD
1kΩ
SYNCINB+
AVDD1
25Ω 20kΩ
CLK+
DGND
LEVEL
TRANSLATOR VCM = 0.85V
DVDD 20kΩ
AVDD1
VCM
25Ω 1kΩ
CLK– SYNCINB–
11752-015
20kΩ 20kΩ SYNCINB± PIN
11752-012
CONTROL (SPI)
VCM = 0.85V DGND
AVDD1_SR
1kΩ
SYSREF+ SPIVDD
20kΩ ESD
PROTECTED
SPIVDD
LEVEL
TRANSLATOR VCM = 0.85V 1kΩ
SCLK
AVDD1_SR 20kΩ 30kΩ
1kΩ ESD
SYSREF– PROTECTED
11752-016
11752-013
SPIVDD SPIVDD
ESD ESD
PROTECTED PROTECTED
30kΩ
1kΩ PDWN/ 1kΩ
CSB STBY
11752-017
11752-020
Figure 110. CSB Input Figure 113. PDWN/STBY Input
SPIVDD AVDD2
ESD ESD
PROTECTED SDO SPIVDD PROTECTED
1kΩ SDI
SDIO V_1P0
30kΩ
ESD ESD
PROTECTED PROTECTED
11752-021
11752-018
V_1P0 PIN
CONTROL (SPI)
SPIVDD
ESD
PROTECTED
FD
JESD LMFC
FD_A/FD_B
JESD SYNC~
TEMPERATURE DIODE
ESD (FD_A ONLY)
PROTECTED
11752-019
THEORY OF OPERATION
The AD9680 has two analog input channels and four JESD204B into sample mode, the signal source must be capable of charging
output lane pairs. The ADC is designed to sample wide bandwidth the sample capacitors and settling within one-half of a clock cycle.
analog signals of up to 2 GHz. The AD9680 is optimized for wide A small resistor, in series with each input, can help reduce the peak
input bandwidth, high sampling rate, excellent linearity, and transient current injected from the output stage of the driving
low power in a small package. source. In addition, low Q inductors or ferrite beads can be placed
The dual ADC cores feature a multistage, differential pipelined on each leg of the input to reduce high differential capacitance at
architecture with integrated output error correction logic. Each the analog inputs and, thus, achieve the maximum bandwidth of
ADC features wide bandwidth inputs supporting a variety of the ADC. Such use of low Q inductors or ferrite beads is required
user-selectable input ranges. An integrated voltage reference when driving the converter front end at high IF frequencies.
eases design considerations. Either a differential capacitor or two single-ended capacitors
can be placed on the inputs to provide a matching passive network.
The AD9680 has several functions that simplify the AGC
This ultimately creates a low-pass filter at the input, which limits
function in a communications receiver. The programmable
unwanted broadband noise. For more information, refer to the
threshold detector allows monitoring of the incoming signal
AN-742 Application Note, the AN-827 Application Note, and
power using the fast detect output bits of the ADC. If the input
the Analog Dialogue article “Transformer-Coupled Front-End
signal level exceeds the programmable threshold, the fast detect
for Wideband A/D Converters” (Volume 39, April 2005). In
indicator goes high. Because this threshold indicator has low
general, the precise values depend on the application.
latency, the user can quickly turn down the system gain to avoid
an overrange condition at the ADC input. For best dynamic performance, the source impedances driving
VIN+x and VIN−x must be matched such that common-mode
The Subclass 1 JESD204B-based high speed serialized output data
settling errors are symmetrical. These errors are reduced by the
lanes can be configured in one-lane (L = 1), two-lane (L = 2),
common-mode rejection of the ADC. An internal reference
and four-lane (L = 4) configurations, depending on the sample
buffer creates a differential reference that defines the span of the
rate and the decimation ratio. Multiple device synchronization
ADC core.
is supported through the SYSREF± and SYNCINB± input pins.
Maximum SNR performance is achieved by setting the ADC
ADC ARCHITECTURE to the largest span in a differential configuration. In the case
The architecture of the AD9680 consists of an input buffered of the AD9680, the available span is programmable through
pipelined ADC. The input buffer is designed to provide a the SPI port from 1.46 V p-p to 2.06 V p-p differential, with
termination impedance to the analog input signal. This 1.58 V p-p differential being the default for the AD9680-1250,
termination impedance can be changed using the SPI to meet 1.70 V p-p differential being the default for the AD9680-1000
the termination needs of the driver/amplifier. The default and AD9680-820, and 2.06 V p-p differential being the default
termination value is set to 400 Ω. The equivalent circuit diagram of for the AD9680-500.
the analog input termination is shown in Figure 104. The input Differential Input Configurations
buffer is optimized for high linearity, low noise, and low power.
There are several ways to drive the AD9680, either actively or
The input buffer provides a linear high input impedance (for passively. However, optimum performance is achieved by
ease of drive) and reduces kickback from the ADC. The buffer is driving the analog input differentially.
optimized for high linearity, low noise, and low power. The
For applications where SNR and SFDR are key parameters,
quantized outputs from each stage are combined into a final
differential transformer coupling is the recommended input
14-bit result in the digital correction logic. The pipelined
configuration (see Figure 115 and Table 9) because the noise
architecture permits the first stage to operate with a new input
performance of most amplifiers is not adequate to achieve the
sample; at the same time, the remaining stages operate with the
true performance of the AD9680.
preceding samples. Sampling occurs on the rising edge of the clock.
For low to midrange frequencies, a double balun or double
ANALOG INPUT CONSIDERATIONS
transformer network (see Figure 115 and Table 9) is recom-
The analog input to the AD9680 is a differential buffer. The mended for optimum performance of the AD9680. For higher
internal common-mode voltage of the buffer is 2.05 V. The frequencies in the second or third Nyquist zones, it is better
clock signal alternately switches the input circuit between to remove some of the front-end passive components to ensure
sample mode and hold mode. When the input circuit is switched wideband operation (see Figure 115 and Table 9).
11752-168
NOTES
1. SEE TABLE 9 FOR COMPONENT VALUES.
Input Common Mode Using the 0x018, 0x019, 0x01A, 0x11A, 0x934, and 0x935 registers,
The analog inputs of the AD9680 are internally biased to the the buffer behavior on each channel can be adjusted to optimize the
common mode as shown in Figure 116. The common-mode SFDR over various input frequencies and bandwidths of interest.
buffer has a limited range in that the performance suffers greatly Input Buffer Control Registers (0x018, 0x019, 0x01A,
if the common-mode voltage drops by more than 100 mV. 0x935, 0x934, 0x11A)
Therefore, in dc-coupled applications, set the common-mode
The input buffer has many registers that set the bias currents and
voltage to 2.05 V, ±100 mV to ensure proper ADC operation.
other settings for operation at different frequencies. These bias
The full-scale voltage setting must be at a 1.7 V p-p differential
currents and settings can be changed to suit the input frequency
if running in a dc-coupled application.
range of operation. Register 0x018 controls the buffer bias current
Analog Input Buffer Controls and SFDR Optimization to help with the kickback from the ADC core. This setting can be
The AD9680 input buffer offers flexible controls for the analog scaled from a low setting of 1.0× to a high setting of 8.5×. The
inputs, such as input termination, buffer current, and input full- default setting is 3.0× for the AD9680-1000 and AD9680-820,
scale adjustment. All the available controls are shown in Figure 116. and 2.0× for the AD9680-500. These settings are sufficient for
AVDD3 operation in the first Nyquist zone for the products. When the
AVDD3
input buffer current in Register 0x018 is set, the amount of
VIN+x
current required by the AVDD3 supply changes. This relationship
is shown in Figure 117. For a complete list of buffer current
3pF 1.5pF AVDD3 settings, see Table 39.
200Ω
200Ω
28Ω
67Ω
400Ω VCM
BUFFER
10pF
200Ω
200Ω
28Ω
67Ω
AVDD3 AVDD3
VIN–x
AIN CONTROL
SPI REGISTERS
3pF 1.5pF (0x008, 0x015,
0x016, 0x018,
0x019, 0x01A,
11752-169
0x11A, 0x934,
0x935)
250 75
AD9680-1250,
AD9680-1000,
AND
AD9680-820
SFDR (dBFS)
IAVDD3 (mA)
200 70
AD9680-500
150 65
100 60 3.5×
4.5×
5.5×
6.5×
50 55
11752-632
11752-341
1.5× 2.5× 3.5× 4.5× 5.5× 6.5× 7.5× 8.5× 602.3 680.3 758.3 836.3 914.3 992.3 1070.3 1148.3 1226.3
BUFFER CONTROL 1 SETTING INPUT FREQUENCY (MHz)
Figure 117. IAVDD3 vs. Buffer Control 1 Setting in Register 0x018 Figure 119. Buffer Current Sweeps, AD9680-1250 (SFDR vs. IBUFF);
600 MHz < fIN < 1300 MHz; Front-End Network Shown in Figure 115
The 0x019, 0x01A, 0x11A, and 0x935 registers offer secondary
76
bias controls for the input buffer for frequencies >500 MHz.
Register 0x934 can be used to reduce input capacitance to achieve 74
11752-633
internal to the ADC for high frequency operation. For frequencies 1304.3 1408.3 1512.3 1616.3 1720.3 1824.3 1928.3
INPUT FREQUENCY (MHz)
greater than 500 MHz, it is recommended to operate the ADC core
Figure 120. Buffer Current Sweeps, AD9680-1250 (SFDR vs. IBUFF);
at a 1.46 V full-scale setting irrespective of the speed grade. This 1300 MHz < fIN < 2000 MHz; Front-End Network Shown in Figure 115
setting offers better SFDR without any significant penalty in SNR.
Figure 121, Figure 122, and Figure 123 show the SFDR vs.
Figure 118, Figure 119, and Figure 120 show the SFDR vs. analog input frequency for various buffer settings for the
analog input frequency for various buffer settings for the AD9680-1000. The recommended settings shown in Table 10
AD9680-1250. The recommended settings shown in Table 10 were used to take the data while changing the contents of
were used to take the data while changing the contents of Register 0x018 only.
Register 0x018 only. 90
85
2.5× 85
3.5×
4.5×
80 5.5× 80
75
SFDR (dBFS)
SFDR (dBFS)
75
70
65
70
60
65 55 1.5×
3.0×
4.5×
50
11752-170
10.3 147.3 212.3 290.3 355.3 433.3 511.3 589.3 667.3 ANALOG INPUT FREQUENCY (MHz)
INPUT FREQUENCY (MHz)
Figure 121. Buffer Current Sweeps, AD9680-1000 (SFDR vs. IBUFF);
Figure 118. Buffer Current Sweeps, AD9680-1250 (SFDR vs. IBUFF); fIN < 500 MHz; Front-End Network Shown in Figure 115
fIN < 500 MHz; Front-End Network Shown in Figure 115
65
95
60
90
55
85
50
80
SFDR (dBFS)
45
75
40
11752-172
503.4 677.6 851.9 1026.2 1200.5 1374.8 70
ANALOG INPUT FREQUENCY (MHz)
65
Figure 122. Buffer Current Sweeps, AD9680-1000 (SFDR vs. IBUFF);
500 MHz < fIN < 1500 MHz; Front-End Network Shown in Figure 115 60 1.5×
2.0×
80 3.0×
55
4.5×
75
50
11752-523
10.3
65.5
95.3
125.4
150.3
170.3
180.3
210.5
240.3
270.3
301.3
330.3
340.7
360.3
390.3
420.3
450.3
70
ANALOG INPUT FREQUENCY (MHz)
65
SFDR (dBFS)
50
80
4.5×
5.5×
45 6.5× 75
7.5×
8.5×
SFDR (dBFS)
40
11752-173
11752-524
The SFDR can be improved by backing off of the full scale level.
420.3
450.3
480.3
510.3
515.3
610.3
766.3
810.3
985.3
1022.3
Figure 124 shows the SFDR and SNR vs. full-scale input level at ANALOG INPUT FREQUENCY (MHz)
different high frequencies for the AD9680-1000. Figure 126. Buffer Current Sweeps, AD9680-820 (SFDR vs. IBUFF);
80
1.65GHz
80 500 MHz < fIN < 1000 MHz; Front-End Network Shown in Figure 115
1.52GHz
1.76GHz
1.95GHz
1.9GHz
75 75
SFDR (dBFS)
70 70
SNR (dBc)
65 65
1.52GHz
1.65GHz
60 1.76GHz 60
1.9GHz
1.95GHz
55 55
11752-174
–3 –2 –1
INPUT LEVEL (dBFS)
Figure 124. SNR/SFDR vs. Analog Input Level vs. Input Frequencies, AD9680-1000
70 85
SFDR (dBFS)
SFDR (dBFS)
65 80
60 75
70
55
65
11752-175
11752-525
50 450.3 480.3 510.3 515.3 610.3 765.3 810.3 985.3
1022.3
1110.3
1205.3
1315.3
1420.3
1510.3
1600.3
1720.3
1810.3
1920.3
1950.3
ANALOG INPUT FREQUENCY (MHz)
ANALOG INPUT FREQUENCY (MHz) Figure 129. Buffer Current Sweeps, AD9680-500 (SFDR vs. IBUFF);
450 MHz < fIN < 1000 MHz; Front-End Network Shown in Figure 115
Figure 127. Buffer Current Sweeps, AD9680-820 (SFDR vs. IBUFF);
1000 MHz < fIN < 2000 MHz; Front-End Network Shown in Figure 115 80
Figure 128, Figure 129, and Figure 130 show the SFDR vs. 75
100
55
90
50
4.0×
5.0×
80 45 6.0×
7.0×
SFDR (dBFS)
8.0×
70 40
11752-176
1010.3 1205.3 1410.3 1600.3 1810.3 1950.3
ANALOG INPUT FREQUENCY (MHz)
60
Figure 130. Buffer Current Sweeps, AD9680-500 (SFDR vs. IBUFF);
50 1 GHz < fIN < 2 GHz; Front-End Network Shown in Figure 115
1.0×
40 1.5×
2.0×
3.0×
4.5×
30
11752-145
1
The input termination can be changed to accommodate the application with little or no impact to ac performance.
2
The input capacitance can be set to 1.5 pF to achieve wider input bandwidth but results in slightly lower ac performance.
3
N/A means not applicable.
11752-106
SPI REGISTER –50 0 25 90
(0x025, 0x02,
V_1P0 AND 0x024) TEMPERATURE (°C)
(0x025, 0x02,
AND 0x024)
ADR130 is a good option for providing the 1.0 V reference.
Figure 131. Internal Reference Configuration and Controls Figure 133 shows how the ADR130 can be used to provide the
external 1.0 V reference to the AD9680. The grayed out areas
The SPI Register 0x024 enables the user to either use this internal
show unused blocks within the AD9680 while using the
1.0 V reference, or to provide an external 1.0 V reference. When
ADR130 to provide the external reference.
using an external voltage reference, provide a 1.0 V reference.
The full-scale adjustment is made using the SPI, irrespective of
INTERNAL
V_1P0 FULL-SCALE
ADR130 VOLTAGE
GENERATOR ADJUST
1 NC NC 6
2 GND SET 5
INPUT V_1P0
3 VIN VOUT 4
0.1µF 0.1µF
FULL-SCALE
11752-032
CONTROL
11752-038
Another option is to ac couple a differential CML or LVDS REG 0x10B
signal to the sample clock input pins, as shown in Figure 135
Figure 137. Clock Divider Circuit
and Figure 136.
3.3V The AD9680 clock divider can be synchronized using the
71Ω 10pF external SYSREF± input. A valid SYSREF± causes the clock
divider to reset to a programmable state. This synchronization
33Ω 33Ω
Z0 = 50Ω 0.1µF
feature allows multiple devices to have their clock dividers
CLK+ aligned to guarantee simultaneous input sampling. See the
ADC
Memory Map section for more information.
11752-036
CLK–
Z0 = 50Ω 0.1µF
Input Clock Divider ½ Period Delay Adjust
Figure 135. Differential CML Sample Clock
The input clock divider inside the AD9680 provides phase delay
in increments of ½ the input clock cycle. Register 0x10C can be
0.1µF 0.1µF
CLOCK INPUT CLK+ CLK+ programmed to enable this delay independently for each channel.
LVDS
100Ω ADC Changing this register does not affect the stability of the
DRIVER
0.1µF
JESD204B link.
CLOCK INPUT CLK– CLK–
50Ω1 50Ω1
0.1µF
Clock Fine Delay Adjust
The AD9680 sampling edge instant can be adjusted by writing to
11752-037
80 Temperature Diode
70
The AD9680 contains a diode-based temperature sensor for
60
measuring the temperature of the die. This diode can output a
50 voltage and serve as a coarse temperature sensor to monitor the
40 internal die temperature.
30
The temperature diode voltage can be output to the FD_A pin
11752-039
0.80
input frequency for different clock induced jitter values. The
SNR can be estimated by using the following equation: 0.75
0.60
11752-353
60
55 25fs
50fs
75fs
100f s
50 125f s
150f s
175f s
200f s
11752-526
45
10 100 1K 10K
INPUT FREQUENCY (MHz)
UPPER THRESHOLD
DWELL TIME
TIMER RESET BY
RISE ABOVE
LOWER LOWER THRESHOLD
THRESHOLD
MIDSCALE
SIGNAL MONITOR
The signal monitor block provides additional information about Peak Magnitude (dBFS) = 20log(Peak Detector Value/213)
the signal being digitized by the ADC. The signal monitor The magnitude of the input port signal is monitored over a
computes the peak magnitude of the digitized signal. This programmable time period, which is determined by the signal
information can be used to drive an AGC loop to optimize the monitor period register (SMPR). The peak detector function is
range of the ADC in the presence of real-world signals. enabled by setting Bit 1 of Register 0x270 in the signal monitor
The results of the signal monitor block can be obtained either control register. The 24-bit SMPR must be programmed before
by reading back the internal values from the SPI port or by activating this mode.
embedding the signal monitoring information into the After enabling peak detection mode, the value in the SMPR is
JESD204B interface as special control bits. A global, 24-bit loaded into a monitor period timer, which decrements at the
programmable period controls the duration of the decimated clock rate. The magnitude of the input signal is
measurement. Figure 142 shows the simplified block diagram compared with the value in the internal magnitude storage
of the signal monitor block. register (not accessible to the user), and the greater of the two
FROM
SIGNAL MONITOR
PERIOD REGISTER DOWN IS
is updated as the current peak level. The initial value of the
MEMORY
MAP
(SMPR)
0x271, 0x272, 0x273
COUNTER COUNT = 1?
magnitude storage register is set to the current ADC input signal
LOAD magnitude. This comparison continues until the monitor period
timer reaches a count of 1.
CLEAR LOAD
FROM
MAGNITUDE SIGNAL TO SPORT OVER When the monitor period timer reaches a count of 1, the 13-bit
STORAGE MONITOR JESD204B AND
INPUT REGISTER HOLDING
REGISTER
MEMORY MAP peak level value is transferred to the signal monitor holding
LOAD
register, which can be read through the memory map or output
11752-087
COMPARE through the SPORT over the JESD204B interface. The monitor
A>B
period timer is reloaded with the value in the SMPR, and the
Figure 142. Signal Monitor Block countdown restarts. In addition, the magnitude of the first
The peak detector captures the largest signal within the input sample is updated in the magnitude storage register, and
observation period. The detector only observes the magnitude the comparison and update procedure, as explained previously,
of the signal. The resolution of the peak detector is a 13-bit continues.
value, and the observation period is 24 bits and represents
converter output samples. The peak magnitude can be derived
by using the following equation:
1-BIT
CONTROL
BIT
15-BIT CONVERTER RESOLUTION (N = 15) (CS = 1)
EXAMPLE
CONFIGURATION 1
(N' = 16, N = 15, CS = 1)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
CTRL
S[14] S[13] S[12] S[11] S[10] S[9] S[8] S[7] S[6] S[5] S[4] S[3] S[2] S[1] S[0] [BIT 2]
X X X X X X X X X X X X X X X X
1
CONTROL
BIT 1 TAIL
14-BIT CONVERTER RESOLUTION (N = 14) (CS = 1) BIT
EXAMPLE
CONFIGURATION 2
(N' = 16, N = 14, CS = 1)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
CTRL
S[13] S[12] S[11] S[10] S[9] S[8] S[7] S[6] S[5] S[4] S[3] S[2] S[1] S[0] [BIT 2]
TAIL
X X X X X X X X X X X X X X X
X
11752-088
SERIALIZED SIGNAL MONITOR
FRAME DATA
5-BIT SUB-FRAMES
5-BIT IDLE
SUB-FRAME IDLE IDLE IDLE IDLE IDLE
(OPTIONAL) 1 1 1 1 1
5-BIT DATA
START
MSB 0 P[12] P[11] P[10] P[9]
SUB-FRAME
5-BIT DATA
START
LSB 0 P[0] 0 0 0
SUB-FRAME
11752-089
80 SAMPLE PERIOD
PAYLOAD #3
25-BIT FRAME (N)
DATA DATA
IDENT. MSB DATA DATA LSB IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE
80 SAMPLE PERIOD
PAYLOAD #3
25-BIT FRAME (N + 1)
80 SAMPLE PERIOD
PAYLOAD #3
25-BIT FRAME (N + 2)
DATA DATA
IDENT. DATA DATA IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE IDLE
11752-090
MSB LSB
Figure 145. SPORT over JESD204B Signal Monitor Example with Period = 80 Samples
DCM = BYPASS OR 2
DCM = BYPASS OR 2
DCM = BYPASS OR 2
COMPLEX TO REAL
REAL/I I REAL/I
CONVERTER 0
CONVERSION
(OPTIONAL)
GAIN = 0dB
DCM = 2
NCO
HB4 FIR
HB3 FIR
HB2 FIR
HB1 FIR
OR 6dB
+
MIXER
(OPTIONAL)
REAL/Q Q Q CONVERTER 1
ADC
REAL/I SAMPLING SYSREF±
AT fS
DDC 1
DCM = BYPASS OR 2
DCM = BYPASS OR 2
DCM = BYPASS OR 2
REAL/I I REAL/I
COMPLEX TO REAL
CONVERTER 2
CONVERSION
(OPTIONAL)
GAIN = 0dB
DCM = 2
NCO
HB4 FIR
HB3 FIR
HB2 FIR
HB1 FIR
OR 6dB
+
MIXER
(OPTIONAL)
OUTPUT INTERFACE
I/Q CROSSBAR MUX
REAL/Q Q Q CONVERTER 3
SYSREF±
DDC 2
DCM = BYPASS OR 2
DCM = BYPASS OR 2
DCM = BYPASS OR 2
COMPLEX TO REAL
REAL/I I REAL/I
CONVERTER 4
CONVERSION
(OPTIONAL)
GAIN = 0dB
DCM = 2
HB4 FIR
HB3 FIR
HB2 FIR
HB1 FIR
NCO
OR 6dB
+
MIXER
(OPTIONAL)
REAL/Q Q Q CONVERTER 5
ADC
REAL/Q SAMPLING
AT fS SYSREF±
DDC 3
DCM = BYPASS OR 2
DCM = BYPASS OR 2
DCM = BYPASS OR 2
COMPLEX TO REAL
REAL/I I REAL/I
CONVERTER 6
CONVERSION
(OPTIONAL)
GAIN = 0dB
DCM = 2
NCO
HB4 FIR
HB3 FIR
HB2 FIR
HB1 FIR
OR 6dB
+
MIXER
(OPTIONAL)
REAL/Q Q Q CONVERTER 7
11752-041
SYSREF SYNCHRONIZATION SYSREF±
CONTROL CIRCUITS
Figure 147 shows an example usage of one of the four DDC the chip decimation ratio sample rate. Whenever the NCO
blocks with a real input signal and four half-band filters (HB4, frequency is set or changed, the DDC soft reset must be issued.
HB3, HB2, and HB1). It shows both complex (decimate by 16) If the DDC soft reset is not issued, the output may potentially
and real (decimate by 8) output options. show amplitude variations.
When DDCs have different decimation ratios, the chip Table 11, Table 12, Table 13, Table 14, and Table 15 show the
decimation ratio (Register 0x201) must be set to the lowest DDC samples when the chip decimation ratio is set to 1, 2, 4, 8,
decimation ratio of all the DDC blocks. In this scenario, or 16, respectively.
samples of higher decimation ratio DDCs are repeated to match
–fS/32 fS/32
–fS/2 –fS/3 –fS/4 –fS/8 –fS/16 DC fS/16 fS/8 fS/4 fS/3 fS/2
BANDWIDTH OF
DIGITAL FILTER INTEREST IMAGE
RESPONSE BANDWIDTH OF INTEREST (–6dB LOSS DUE TO
(–6dB LOSS DUE TO NCO + MIXER)
NCO + MIXER)
–fS/32 fS/32
–fS/2 –fS/3 –fS/4 –fS/8 –fS/16 DC fS/16 fS/8 fS/4 fS/3 fS/2
FILTERING STAGE
HB4 FIR HB3 FIR HB2 FIR HB1 FIR
4 DIGITAL HALF-BAND FILTERS
(HB4 + HB3 + HB2 + HB1) HALF- HALF- HALF- HALF-
BAND BAND BAND BAND
I FILTER FILTER FILTER FILTER
I
2 2 2
6dB GAIN TO
COMPENSATE FOR
NCO + MIXER LOSS
11752-042
–fS/32 fS/32
–fS/8 –fS/16 DC fS/16 fS/8
1
DCM means decimation.
1
DCM means decimation.
1
DCM means decimation.
If the chip decimation ratio is set to decimate by 4, DDC 0 is set to use HB2 + HB1 filters (complex outputs decimate by 4), and DDC 1 is
set to use HB4 + HB3 + HB2 + HB1 filters (real outputs decimate by 8), then DDC 1 repeats its output data two times for every one
DDC 0 output. The resulting output samples are shown in Table 16.
Table 16. DDC Output Samples when Chip DCM 1 = 4, DDC 0 DCM1 = 4 (Complex), and DDC 1 DCM1 = 8 (Real)
DDC 0 DDC 1
DDC Input Samples Output Port I Output Port Q Output Port I Output Port Q
N I0 [N] Q0 [N] I1 [N] Not applicable
N+1
N+2
N+3
N+4 I0 [N + 1] Q0 [N + 1] I1 [N + 1] Not applicable
N+5
N+6
N+7
N+8 I0 [N + 2] Q0 [N + 2] I1 [N] Not applicable
N+9
N + 10
N + 11
N + 12 I0 [N + 3] Q0 [N + 3] I1 [N + 1] Not applicable
N + 13
N + 14
N + 15
1
DCM means decimation.
FREQUENCY TRANSLATION
FREQUENCY TRANSLATION GENERAL DESCRIPTION Variable IF Mode
Frequency translation is accomplished by using a 12-bit NCO and mixers are enabled. NCO output frequency can be
complex NCO along with a digital quadrature mixer. The used to digitally tune the IF frequency.
frequency translation translates either a real or complex input 0 Hz IF (ZIF) Mode
signal from an intermediate frequency (IF) to a baseband
Mixers are bypassed and the NCO is disabled.
complex digital output (carrier frequency = 0 Hz).
fS/4 Hz IF Mode
The frequency translation stage of each DDC can be controlled
individually and supports four different IF modes using Bits[5:4] of Mixers and NCO are enabled in special down mixing by fS/4
the DDC control registers (Register 0x310, Register 0x330, mode to save power.
Register 0x350, and Register 0x370). These IF modes are Test Mode
• Variable IF mode Input samples are forced to 0.999 to positive full scale. NCO is
• 0 Hz IF (ZIF) mode enabled. This test mode allows the NCOs to directly drive the
• fS/4 Hz IF mode decimation filters.
• Test mode Figure 148 and Figure 149 show examples of the frequency
translation stage for both real and complex inputs.
cos(ωt)
ADC + DIGITAL MIXER + NCO REAL ADC REAL 12-BIT 90°
SAMPLING COMPLEX
REAL INPUT—SAMPLED AT fS AT fS
NCO 0°
–sin(ωt)
Q
BANDWIDTH OF BANDWIDTH OF
INTEREST IMAGE INTEREST
–fS/32 fS/32
–fS/2 –fS/3 –fS/4 –fS/8 –fS/16 DC fS/16 fS/8 fS/4 fS/3 fS/2
–fS/32 fS/32
DC
–fS/32 fS/32
DC
–sin(ωt)
2 ADCs + QUADRATURE DIGITAL REAL 90° 12-BIT 90°
MIXER + NCO PHASE NCO 0° COMPLEX
COMPLEX INPUT—SAMPLED AT fS Q
I
Q ADC I +
Q Q Q
SAMPLING
+
AT fS
BANDWIDTH OF
INTEREST
IMAGE DUE TO
ANALOG I/Q
MISMATCH
–fS/32 fS/32
–fS/2 –fS/3 –fS/4 –fS/8 –fS/16 DC fS/16 fS/8 fS/4 fS/3 fS/2
–fS/32 fS/32
11752-044
DC
DDC NCO PLUS MIXER LOSS AND SFDR can be set up by providing a frequency tuning word (FTW) and
a phase offset word (POW).
When mixing a real input signal down to baseband, 6 dB of loss
is introduced in the signal due to filtering of the negative image. Setting Up the NCO FTW and POW
An additional 0.05 dB of loss is introduced by the NCO. The The NCO frequency value is given by the 12-bit twos
total loss of a real input signal mixed down to baseband is 6.05 dB. complement number entered in the NCO FTW. Frequencies
For this reason, it is recommended that the user compensate for between −fS/2 and fS/2 (fS/2 excluded) are represented using the
this loss by enabling the additional 6 dB of gain in the gain stage following frequency words:
of the DDC to recenter the dynamic range of the signal within
• 0x800 represents a frequency of –fS/2.
the full scale of the output bits.
• 0x000 represents dc (frequency is 0 Hz).
When mixing a complex input signal down to baseband, the • 0x7FF represents a frequency of +fS/2 – fS/212.
maximum value each I/Q sample can reach is 1.414 × full scale
after it passes through the complex mixer. To avoid overrange The NCO frequency tuning word can be calculated using the
of the I/Q samples and to keep the data bit widths aligned with following equation:
real mixing, 3.06 dB of loss (0.707 × full scale) is introduced in Mod( fC , f S )
NCO _ FTW = round 212
the mixer for complex signals. An additional 0.05 dB of loss is fS
introduced by the NCO. The total loss of a complex input signal
mixed down to baseband is −3.11 dB. where:
NCO_FTW is a 12-bit twos complement number representing
The worst case spurious signal from the NCO is greater than the NCO FTW.
102 dBc SFDR for all output frequencies. fS is the AD9680 sampling frequency (clock rate) in Hz.
NUMERICALLY CONTROLLED OSCILLATOR fC is the desired carrier frequency in Hz.
The AD9680 has a 12-bit NCO for each DDC that enables the Mod( ) is a remainder function. For example, Mod(110,100) =
frequency translation process. The NCO allows the input 10, and for negative numbers, Mod(–32, 10) = –2.
spectrum to be tuned to dc, where it can be effectively filtered round( ) is a rounding function. For example, round(3.6) = 4,
by the subsequent filter blocks to prevent aliasing. The NCO and for negative numbers, round(–3.4)= –3.
FIR FILTERS
FIR FILTERS GENERAL DESCRIPTION Table 17 shows the different bandwidth options by including
different half-band filters. In all cases, the DDC filtering stage of
There are four sets of decimate-by-2, low-pass, half-band, finite
the AD9680 provides less than −0.001 dB of pass-band ripple and
impulse response (FIR) filters (HB1 FIR, HB2 FIR, HB3 FIR,
and HB4 FIR, shown in Figure 146). These filters follow the >100 dB of stop-band alias rejection.
frequency translation stage. After the carrier of interest is tuned Table 18 shows the amount of stop-band alias rejection for
down to dc (carrier frequency = 0 Hz), these filters efficiently lower multiple pass-band ripple/cutoff points. The decimation ratio
the sample rate while providing sufficient alias rejection from of the filtering stage of each DDC can be controlled individually
unwanted adjacent carriers around the bandwidth of interest. through Bits[1:0] of the DDC control registers (0x310, 0x330,
HB1 FIR is always enabled and cannot be bypassed. The HB2, 0x350, and 0x370).
HB3, and HB4 FIR filters are optional and can be bypassed for
higher output sample rates.
HALF-BAND FILTERS
The AD9680 offers four half-band filters to enable digital signal
processing of the ADC converted data. These half-band filters HB3 Filter
can be bypassed and can be individually selected.
The second decimate-by-2, half-band, low-pass, FIR filter (HB3)
HB4 Filter uses an 11-tap, symmetrical, fixed coefficient filter implementation,
The first decimate-by-2, half-band, low-pass FIR filter (HB4) uses optimized for low power consumption. The HB3 filter is only used
an 11-tap, symmetrical, fixed-coefficient filter implementation, when complex outputs (decimate by 8 or 16) or real outputs
optimized for low power consumption. The HB4 filter is only used (decimate by 4 or 8) are enabled; otherwise, the filter is bypassed.
when complex outputs (decimate by 16) or real outputs (decimate Table 20 and Figure 151 show the coefficients and response of
by 8) are enabled; otherwise, the filter is bypassed. Table 19 and the HB3 filter.
Figure 150 show the coefficients and response of the HB4 filter.
Table 20. HB3 Filter Coefficients
Table 19. HB4 Filter Coefficients HB3 Coefficient Normalized Decimal Coefficient
HB4 Coefficient Normalized Decimal Coefficient Number Coefficient (18-Bit)
Number Coefficient (15-Bit) C1, C11 0.006554 859
C1, C11 0.006042 99 C2, C10 0 0
C2, C10 0 0 C3, C9 −0.050819 −6661
C3, C9 −0.049316 −808 C4, C8 0 0
C4, C8 0 0 C5, C7 0.294266 38,570
C5, C7 0.293273 4805 C6 0.500000 65,536
C6 0.500000 8192
0
0
–20
–20
MAGNITUDE (dB)
–40
MAGNITUDE (dB)
–40
–60
–60
–80
–80
–100
–100
–120
11752-046
–120 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
NORMALIZED FREQUENCY (× π RAD/SAMPLE)
11752-045
MAGNITUDE (dB)
–40
only used when complex outputs (decimate by 4, 8, or 16) or
real outputs (decimate by 2, 4, or 8) are enabled; otherwise, the –60
filter is bypassed.
–80
Table 21 and Figure 152 show the coefficients and response of
the HB2 filter. –100
11752-048
HB2 Coefficient Normalized Decimal Coefficient 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
NORMALIZED FREQUENCY (× π RAD/SAMPLE)
Number Coefficient (19-Bit)
C1, C19 0.000614 161 Figure 153. HB1 Filter Response
–40
C12, C44 0 0
–60
C13, C43 −0.005039 −5284
C14, C42 0 0
–80
C15, C41 0.008491 8903
–100 C16, C40 0 0
C17, C39 −0.013717 −14,383
–120 C18, C38 0 0
11752-047
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 C19, C37 0.021591 22,640
NORMALIZED FREQUENCY (× π RAD/SAMPLE)
C20, C36 0 0
Figure 152. HB2 Filter Response
C21, C35 −0.033833 −35,476
HB1 Filter C22, C34 0 0
The fourth and final decimate-by-2, half-band, low-pass FIR C23, C33 0.054806 57,468
filter (HB1) uses a 55-tap, symmetrical, fixed coefficient filter C24, C32 0 0
implementation, optimized for low power consumption. The C25, C31 −0.100557 −105,442
HB1 filter is always enabled and cannot be bypassed. Table 22 C26, C30 0 0
and Figure 153 show the coefficients and response of the HB1 C27, C29 0.316421 331,792
filter. C28 0.500000 524,288
0dB I
OR
6dB
cos(ωt)
–
sin(ωt)
0dB Q
OR
6dB
LOW-PASS
Q FILTER 0dB Q Q
2 OR
6dB 11752-049
HB1 FIR
1
fS is the ADC sample rate. Bandwidths listed are <−0.001 dB of pass-band ripple and >100 dB of stop-band alias rejection.
2
The NCOs must be synchronized either through the SPI or through the SYSREF± pin after all writes to the FTW or POW registers have completed, to ensure the proper
operation of the NCO. See the NCO Synchronization section for more information.
DIGITAL OUTPUTS
INTRODUCTION TO THE JESD204B INTERFACE • K is the number of frames per multiframe
The AD9680 digital outputs are designed to the JEDEC standard (AD9680 value = 4, 8, 12, 16, 20, 24, 28, or 32 )
JESD204B, serial interface for data converters. JESD204B is a • S is the samples transmitted/single converter/frame cycle
protocol to link the AD9680 to a digital processing device over a (AD9680 value = set automatically based on L, M, F, and N΄)
serial interface with lane rates of up to 12.5 Gbps. The benefits • HD is the high density mode (AD9680 = set automatically
of the JESD204B interface over LVDS include a reduction in based on L, M, F, and N΄)
required board area for data interface routing, and an ability to • CF is the number of control words/frame clock cycle/
enable smaller packages for converter and logic devices. converter device (AD9680 value = 0)
JESD204B OVERVIEW Figure 155 shows a simplified block diagram of the AD9680
JESD204B link. By default, the AD9680 is configured to use
The JESD204B data transmit block assembles the parallel data
two converters and four lanes. Converter A data is output to
from the ADC into frames and uses 8-bit/10-bit encoding as
SERDOUT0± and/or SERDOUT1±, and Converter B is output
well as optional scrambling to form serial output data. Lane
to SERDOUT2± and/or SERDOUT3±. The AD9680 allows
synchronization is supported through the use of special control
other configurations such as combining the outputs of both
characters during the initial establishment of the link. Additional
converters onto a single lane, or changing the mapping of the
control characters are embedded in the data stream to maintain
A and B digital output paths. These modes are set up via a quick
synchronization thereafter. A JESD204B receiver is required to
configuration register in the SPI register map, along with
complete the serial link. For additional details on the JESD204B
additional customizable options.
interface, refer to the JESD204B standard.
By default in the AD9680, the 14-bit converter word from each
The AD9680 JESD204B data transmit block maps up to two
converter is broken into two octets (eight bits of data). Bit 13
physical ADCs or up to eight virtual converters (when DDCs
(MSB) through Bit 6 are in the first octet. The second octet
are enabled) over a link. A link can be configured to use one,
contains Bit 5 through Bit 0 (LSB) and two tail bits. The tail bits
two, or four JESD204B lanes. The JESD204B specification refers
can be configured as zeros or a pseudorandom number
to a number of parameters to define the link, and these parameters
sequence. The tail bits can also be replaced with control bits
must match between the JESD204B transmitter (the AD9680
indicating overrange, SYSREF±, or fast detect output.
output) and the JESD204B receiver (the logic device input).
The two resulting octets can be scrambled. Scrambling is
The JESD204B link is described according to the following
optional; however, it is recommended to avoid spectral peaks
parameters:
when transmitting similar digital data patterns. The scrambler
• L is the number of lanes/converter device (lanes/link) uses a self-synchronizing, polynomial-based algorithm defined
(AD9680 value = 1, 2, or 4) by the equation 1 + x14 + x15. The descrambler in the receiver is
• M is the number of converters/converter device (virtual a self-synchronizing version of the scrambler polynomial.
converters/link) (AD9680 value = 1, 2, 4, or 8)
The two octets are then encoded with an 8-bit/10-bit encoder.
• F is the octets/frame (AD9680 value = 1, 2, 4, 8, or 16)
The 8-bit/10-bit encoder works by taking eight bits of data (an
• N΄ is the number of bits per sample (JESD204B word size)
octet) and encoding them into a 10-bit symbol. Figure 156
(AD9680 value = 8 or 16)
shows how the 14-bit data is taken from the ADC, how the tail
• N is the converter resolution (AD9680 value = 7 to 16)
bits are added, how the two octets are scrambled, and how the
• CS is the number of control bits/sample octets are encoded into two 10-bit symbols. Figure 156 illustrates
(AD9680 value = 0, 1, 2, or 3)
the default data format.
CONVERTER 1
11752-050
SYSREF±
SYNCINB±
Figure 155. Transmit Link Simplified Block Diagram Showing Full Bandwidth Mode (Register 0x200 = 0x00)
JESD204B
INTERFACE
TEST PATTERN
(REG 0x573, JESD204B DATA
REG 0x551 TO LINK LAYER TEST
JESD204B REG 0x558) PATTERNS
LONG TRANSPORT REG 0x574[2:0]
TEST PATTERN
REG 0x571[5]
SERDOUT0±
ADC TEST PATTERNS SERIALIZER
SERDOUT1±
(RE0x550, FRAME SCRAMBLER 8-BIT/10-BIT
REG 0x551 TO CONSTRUCTION 1 + x14 + x15 ENCODER
REG 0x558) (OPTIONAL) a b i j a b i j
OCTET 0
OCTET 1
OCTET 0
OCTET 1
11752-051
C2
CONTROL BITS C1
C0
11752-052
SYSREF±
SYNCINB±
FUNCTIONAL OVERVIEW required. The following equation can be used to determine the
number of tail bits within a sample (JESD204B word):
The block diagram in Figure 157 shows the flow of data
through the JESD204B hardware from the sample input to the T = N΄ – N – CS
physical output. The processing can be divided into layers that Data Link Layer
are derived from the open source initiative (OSI) model widely
The data link layer is responsible for the low level functions
used to describe the abstraction layers of communications
of passing data across the link. These include optionally
systems. These layers are the transport layer, data link layer,
scrambling the data, inserting control characters for multichip
and physical layer (serializer and output driver).
synchronization/lane alignment/monitoring, and encoding
Transport Layer 8-bit octets into 10-bit symbols. The data link layer is also
The transport layer handles packing the data (consisting of responsible for sending the initial lane alignment sequence
samples and optional control bits) into JESD204B frames that (ILAS), which contains the link configuration data used by the
are mapped to 8-bit octets. These octets are sent to the data link receiver to verify the settings in the transport layer.
layer. The transport layer mapping is controlled by rules derived
from the link parameters. Tail bits are added to fill gaps where
K K R D D A R Q C C D D A R D D A R D D A D
END OF
MULTIFRAME
11752-053
START OF START OF LINK START OF
ILAS CONFIGURATION DATA USER DATA
PHYSICAL LAYER (DRIVER) OUTPUTS to half the DRVDD supply of 1.2 V (VCM = 0.6 V). See Figure 160
Digital Outputs, Timing, and Controls for dc coupling the outputs to the receiver logic.
DRVDD 100Ω
The AD9680 physical layer consists of drivers that are defined in DIFFERENTIAL
TRACE PAIR
the JEDEC Standard JESD204B, July 2011. The differential digital SERDOUTx+
outputs are powered up by default. The drivers use a dynamic 100Ω RECEIVER
11752-055
input to result in a nominal 300 mV p-p swing at the receiver
OUTPUT SWING = 300mV p-p VCM = DRVDD/2
(see Figure 159). Alternatively, single-ended 50 Ω termination
can be used. When single-ended termination is used, the Figure 160. DC-Coupled Digital Output Termination Example
termination voltage is DRVDD/2. Otherwise, 0.1 µF ac coupling If there is no far-end receiver termination, or if there is poor
capacitors can be used to terminate to any single-ended voltage. differential trace routing, timing errors can result. To avoid such
VRXCM timing errors, it is recommended that the trace length be less
than six inches, and that the differential output traces be close
DRVDD 100Ω 50Ω 50Ω together and at equal lengths.
DIFFERENTIAL
SERDOUTx+
0.1µF TRACE PAIR
Figure 161 to Figure 166 show an example of the digital output
data eye, time interval error (TIE) jitter histogram, and bathtub
100Ω OR RECEIVER
curve for one AD9680 lane running at 10 Gbps and 6 Gbps,
SERDOUTx–
0.1µF respectively. The format of the output data is twos complement
by default. To change the output data format, see the Memory Map
11752-054
OUTPUT SWING = 300mV p-p VCM = VRXCM section (Register 0x561 in Table 39).
Figure 159. AC-Coupled Digital Output Termination Example De-Emphasis
The AD9680 digital outputs can interface with custom ASICs De-emphasis enables the receiver eye diagram mask to be met
and FPGA receivers, providing superior switching performance in conditions where the interconnect insertion loss does not
in noisy environments. Single point-to-point network topologies meet the JESD204B specification. Use the de-emphasis feature
are recommended with a single differential 100 Ω termination only when the receiver is unable to recover the clock due to
resistor placed as close to the receiver inputs as possible. The excessive insertion loss. Under normal conditions, it is disabled
common mode of the digital output automatically biases itself to conserve power. Additionally, enabling and setting too high a
de-emphasis value on a short link can cause the receiver eye
Rev. E | Page 68 of 105
Data Sheet AD9680
diagram to fail. Use the de-emphasis setting with caution Phase-Locked Loop
because it can increase electromagnetic interference (EMI). See The phase-locked loop (PLL) is used to generate the serializer
the Memory Map section (Register 0x5C1 to Register 0x5C5 in clock, which operates at the JESD204B lane rate. The status of
Table 39) for more details. the PLL lock can be checked in the PLL locked status bit
(Register 0x56F, Bit 7). This read only bit lets the user know if
the PLL has achieved a lock for the specific setup. The JESD204B
lane rate control, Bit 4 of Register 0x56E, must be set to
correspond with the lane rate.
400 1
300 1–2
200 1–4
VOLTAGE (mV)
100 1–6
BER
0 1–8
Tx EYE
MASK
–100 1–10
–200 1–12
–300
1–14
–400
1–16
11752-500
11752-502
–100 –80 –60 –40 –20 0 20 40 60 80 –0.5 –0.4 –0.3 –0.2 –0.1 0 0.1 0.2 0.3 0.4 0.5
TIME (ps) UI
Figure 161. Digital Outputs Data Eye, External 100 Ω Terminations Figure 163. Digital Outputs Bathtub Curve, External 100 Ω Terminations
at 10 Gbps at 10 Gbps
12000 400
300
10000
200
VOLTAGE (mV)
8000 100
HITS
0
Tx EYE
6000 MASK
–100
4000 –200
–300
2000
–400
11752-503
11752-501
Figure 162. Digital Outputs Histogram, External 100 Ω Terminations Figure 164. Digital Outputs Data Eye, External 100 Ω Terminations
at 10 Gbps at 6 Gbps
7000 1–2
6000 1–4
4000 1–6
HITS
BER
4000 1–8
3000 1–10
2000 1–12
1000 1–14
0 1–16
11752-504
11752-505
–4 –3 –2 –1 0 1 2 3 4 –0.5 –0.4 –0.3 –0.2 –0.1 0 0.1 0.2 0.3 0.4 0.5
TIME (ps) UI
Figure 165. Digital Outputs Histogram, External 100 Ω Terminations Figure 166. Digital Outputs Bathtub Curve, External 100 Ω Terminations
at 6 Gbps at 6 Gbps
DIGITAL DOWNCONVERSION
M=2
I
CONVERTER 0
DIGITAL JESD204B
REAL REAL DOWN L LANES
ADC Tx
CONVERSION
Q
CONVERTER 1
11752-058
Q CONVERTER 1
ADC
ADC A DDC 0
REAL/I REAL/I REAL/I
SAMPLING I I
CONVERTER 0
AT fS
REAL/Q Q
Q Q
CONVERTER 1
DDC 1
REAL/I REAL/I
I I
CONVERTER 2
REAL/Q Q
Q Q
I/Q CONVERTER 3 OUTPUT
CROSSBAR INTERFACE
MUX DDC 2
REAL/I REAL/I
I I
CONVERTER 4
REAL/Q Q
Q Q
CONVERTER 5
ADC B DDC 3
REAL/Q REAL/I REAL/I
SAMPLING I I
CONVERTER 6
11752-059
AT fS REAL/Q Q
Q Q
CONVERTER 7
See the Example 1: Full Bandwidth Mode section and the CMOS
transport layer settings are valid for a given chip mode. REAL/I 14-BIT L
JESD204B
AT
LANES
Example 1: Full Bandwidth Mode 1Gbps CONVERTER 0 AT UP TO
12.5Gbps
JESD204B
Chip application mode = full bandwidth mode (see Figure 169). TRANSMIT
INTERFACE
REAL/Q 14-BIT CONVERTER 1
• Two 14-bit converters at 1000 MSPS AT
1Gbps
• Full bandwidth application layer mode
FAST
• No decimation DETECTION
11752-060
JESD204B output configuration is as follows:
CMOS
• Two virtual converters required (see Table 26) Figure 169. Full Bandwidth Mode
• Output sample rate (fOUT) = 1000/1 = 1000 MSPS
Example 2: ADC with DDC Option (Two ADCs Plus Four
JESD204B supported output configurations (see Table 26) DDCs)
include: Chip application mode = four-DDC mode. (see Figure 170).
• N΄ = 16 bits • Two 14-bit converters at 1 GSPS
• N = 14 bits • Four DDC application layer mode with complex outputs
• L = 4, M = 2, and F = 1, or L = 4, M = 2, and F = 2 (quick (I/Q)
configuration = 0x88 or 0x89) • Chip decimation ratio = 16
• CS = 0 to 2 • DDC decimation ratio = 16 (see Table 15).
• K = 32
• Output serial line rate = 10 Gbps per lane, low line rate JESD204B output configuration is as follows:
mode disabled • Virtual converters required = 8 (see Table 26)
• Output sample rate (fOUT) = 1000/16 = 62.5 MSPS
11752-061
SYSREF SYNCHRONIZATION
CONTROL CIRCUITS
DETERMINISTIC LATENCY
Both ends of the JESD204B link contain various clock domains buffering to achieve consistent latency across lanes (or even
distributed throughout each system. Data traversing from one multiple devices), and also to achieve a fixed latency between
clock domain to a different clock domain can lead to power cycles and link reset conditions.
ambiguous delays in the JESD204B link. These ambiguities lead Deterministic Latency Requirements
to nonrepeatable latencies across the link from one power cycle
Several key factors are required for achieving deterministic
or link reset to the next. Section 6 of the JESD204B specification
latency in a JESD204B Subclass 1 system:
addresses the issue of deterministic latency with mechanisms
defined as Subclass 1 and Subclass 2. • SYSREF± signal distribution skew within the system must
be less than the desired uncertainty for the system.
The AD9680 supports JESD204B Subclass 0 and Subclass 1
• SYSREF± setup and hold time requirements must be met
operation. Register 0x590, Bit 5 sets the subclass mode for the
for each device in the system.
AD9680; the default mode is the Subclass 1 operating mode
• The total latency variation across all lanes, links, and
(Register 0x590, Bit 5 = 1). If deterministic latency is not a
devices must be ≤1 LMFC period (see Figure 171). This
system requirement, Subclass 0 operation is recommended and
includes both variable delays and the variation in fixed
the SYSREF± signal may not be required. Even in Subclass 0
delays from lane to lane, link to link, and device to device
mode, the SYSREF± signal may be required in an application
in the system.
where multiple AD9680 devices must be synchronized with each
other. This topic is addressed in the Timestamp Mode section. Setting Deterministic Latency Registers
SUBCLASS 0 OPERATION The JESD204B receive buffer in the logic device buffers data
If there is no requirement for multichip synchronization while starting on the LMFC boundary. If the total link latency in the
operating in Subclass 0 mode (Register 0x590, Bit 5 = 0), the system is near an integer multiple of the LMFC period, it is possible
SYSREF± input can be left disconnected. In this mode, the that from one power cycle to the next, the data arrival time at
relationship of the JESD204B clocks between the JESD204B trans- the receive buffer may straddle an LMFC boundary. To ensure
mitter and receiver are arbitrary but does not affect the ability of the deterministic latency in this case, a phase adjustment of the
receiver to capture and align the lanes within the link. LMFC at either the transmitter or receiver must be performed.
Typically, adjustments to accommodate the receive buffer are
SUBCLASS 1 OPERATION made to the LMFC of the receiver. In the AD9680, this adjustment
The JESD204B protocol organizes data samples into octets, frames, can be made using the LMFC offset bits (Register 0x578, Bits[4:0]).
and multiframes as described in the Transport Layer section. These bits delay the LMFC in frame clock increments, depending
The local multiframe clock (LMFC) is synchronous with the on the F parameter, which is the number of octets per lane per
beginnings of these multiframes. In Subclass 1 operation, the frame). For F = 1, every 4th setting (0, 4, 8, …, and so on) results
SYSREF± signal synchronizes the LMFCs for each device in a in a 1-frame clock shift. For F = 2, every other setting (0, 2, 4, …,
link or across multiple links (within the AD9680, SYSREF± also and so on) results in a 1-frame clock shift. For all other values
synchronizes the internal sample dividers), as shown in Figure 171. of F, each setting results in a 1-frame clock shift.
The JESD204B receiver uses the multiframe boundaries and
SYSREF
DEVICE CLOCK
All LMFCs
11752-064
Tx LOCAL LMFC
DATA
(AT Tx INPUT) ILAS DATA
DATA
(AT Rx INPUT) ILAS DATA
11752-702
Tx LMFC MOVED (DELAYING THE ARRIVAL OF DATA RELATIVE
TO THE GLOBAL LMFC) SO THE RECEIVE BUFFER RELEASE
TIME IS ALWAYS REFERENCED TO THE SAME LMFC EDGE
Rx LOCAL LMFC
11752-703
MULTICHIP SYNCHRONIZATION
The flowchart shown in Figure 175 describes the internal method is used for synchronization of multiple channels and/or
mechanism for multichip synchronization in the AD9680. devices. In timestamp mode, the clocks are not reset but
There are two methods by which multichip synchronization can instead, the coinciding sample is time stamped using the
take place, as determined by the chip synchronization mode bit JESD204B control bits of that sample. To operate in timestamp
(Register 0x1FF , Bit 0). Each method involves different mode, these additional settings are necessary:
applications of the SYSREF± signal. • Continuous or N-shot SYSREF enabled (0x120[2:1] = 1 or 2)
NORMAL MODE • At least one control bit must be enabled (CS > 0,
The default sate of the chip synchronization mode bit is 0, Register 0x58F, Bits[7:6] = 1, 2, or 3)
which configures the AD9680 for normal chip synchronization. • Set the function for one of the control bits to SYSREF
The JESD204B standard specifies the use of SYSREF± to provide • Register 0x559, Bits[2:0] = 5 if using Control Bit 0
deterministic latency within a single link. This same concept, when • Register 0x559, Bits[6:4] = 5 if using Control Bit 1
applied to a system with multiple converters and logic devices, can • Register 0x55A, Bits[2:0] = 5 if using Control Bit 2
also provide multichip synchronization. In Figure 175, this is Control bits must be enabled MSB first. In other words, if only
referred to as normal mode. Following the process outlined in the using one control bit (CS = 1), Control Bit 2 must be enabled. If
flowchart ensures that the AD9680 is configured appropriately. two control bits are sued, then Control Bits[2:1] must be enabled.
Consult the logic devices user intellectual property (IP) guide to Figure 174 provides an illustration of how the input sample
ensure that the JESD204B receivers are configured appropriately. coincident with SYSREF is time stamped and ultimately output
TIMESTAMP MODE of the ADC. In this example, there are two control bits and
Control Bit 1 is the bit indicating which sample was coincident
For all AD9680 full bandwidth operating modes, the SYSREF
with the SYSREF rising edge. Note that the pipeline latencies for
input can also be used to timestamp samples. This is another
each channel are identical. If so desired, the SYSREF timestamp
method by which multiple channels and multiple devices can
delay register (0x123) can be used to adjust the timing of which
achieve synchronization. This is especially effective when
sample is time stamped.
synchronizing multiple devices to one or more logic devices.
The logic devices simply buffer the data streams, identify the Note that time stamping is not supported by any AD9680
time stamped samples and align them. When the chip operating modes that use decimation.
synchronization mode bit (0x1FF [0]) is set to 1, the timestamp
N
AINA N–1 N+1
N – 1 00 N 01 N + 1 00 N + 2 00 N + 3 00
N+3 CHANNEL A
N+2
N
N–1 N+1 CHANNEL B N – 1 00 N 01 N + 1 00 N + 2 00 N + 3 00
AINB
N+3
N+2
2 CONTROL BITS
11752-704
Figure 174. AD9680 Timestamping—CS = 2 (Register 0x58F, Bits[7:6] = 2), Control Bit 1 is SYSREF± (Register 0x559, Bits[6:4] = 5)
N-SHOT SYSREF±
RESET SYSREF SYSREF MODE IGNORE
SYSREF± IGNORE NO YES SYSREF± YES
ENABLED? ASSERTED? MODE COUNTER
COUNTER (0x120) (0x120) EXPIRED?
(0x121)
CONTINUOUS YES
MODE
CLEAR SYSREF
IGNORE COUNTER
AND DISABLE SYSREF
(CLEAR BIT 2 IN 0x0120)
UPDATE
SETUP/HOLD
DETECTOR STATUS
(0x128)
NO NO NO
NO
RAMP
TEST SYSREF± RESETS
MODE YES RAMP TEST
NORMAL BACK TO START
MODE ENABLED? MODE
(0x550) GENERATOR
NO
NO NO
SIGNAL
MONITOR ALIGN SIGNAL DDC NCO ALIGN DDC
YES ALIGNMENT YES NCO PHASE
ALIGNMENT MONITOR BACK TO START
ENABLED? COUNTERS ENABLED? ACCUMULATOR
(0x26F) (0x300)
11752-112
NO NO
must have a minimum width of two CLK± periods. If the clock 117ps HOLD
REQUIREMENT
divider (Register 0x10B, Bits[2:0]) is set to a value other than
–96ps
11752-706
SAMPLE POINT
continuous SYSREF± signal (Register 0x120, Bits[2:1] = 1), the KEEP OUT WINDOW
period of the SYSREF± signal must be an integer multiple of the Figure 176. SYSREF± Setup and Hold Time Requirements; SYSREF± Low to
LMFC. Derive the LMFC using the following formula: High Transition Using the Rising Edge Clock (Default)
LMFC = ADC Clock/S × K SETUP
REQUIREMENT
11752-707
The input clock divider, DDCs, signal monitor block, and SYSREF SYSREF
SAMPLE POINT
JESD204B link are all synchronized using the SYSREF± input Figure 177. SYSREF± Low to High Transition Using Falling Edge Clock
when in normal synchronization mode (Register 0x1FF, Bits[1:0] = Capture (Register 0x0120, Bit 4 = 1’b0 and Register 0x0120, Bit 3 = 1’b1)
0). The SYSREF± input can also be used to time stamp an ADC SETUP
sample to provide a mechanism for synchronizing multiple
REQUIREMENT
117ps HOLD
AD9680 devices in a system. For the highest level of timing –96ps
REQUIREMENT
11752-708
SAMPLE POINT
SYSREF± Control Features section). SYSREF
SYSREF± Control Features Figure 178. SYSREF± High to Low Transition Using Rising Edge Clock Capture
(Register 0x0120, Bit 4 = 1’b1 and Register 0x0120, Bit 3 = 1’b0)
SYSREF± is used, along with the input clock (CLK±), as part of
SETUP
a source synchronous timing interface and requires setup and REQUIREMENT
hold timing requirements of 117 ps and −96 ps, relative to the 117ps HOLD
REQUIREMENT
input clock (see Figure 176). The AD9680 has several features to –96ps
SAMPLE POINT
SYSREF
allows the SYSREF± signal to be sampled using either the rising
edge or falling edge of the input clock. Figure 176, Figure 177, Figure 179. SYSREF± High to Low Transition Using Falling Edge Clock
Capture (Register 0x0120, Bit 4= 1’b1 and Register 0x0120, Bit 3 = 1’b1)
Figure 178, and Figure 179 show all four possible combinations.
The third SYSREF± related feature available is the ability to
ignore a programmable number (up to 16) of SYSREF± events.
CLK
SYSREF
11752-079
IGNORE FIRST THREE SYSREFs SAMPLE THE FOURTH SYSREF
Figure 180. SYSREF± Ignore Example; SYSREF± Ignore Count Bits (Register 0x0121, Bits[3:0]) = 3
SYSREF SKEW WINDOW = ±3
SYSREF SKEW WINDOW = ±2
SYSREF SKEW WINDOW = ±1
SYSREF SKEW WINDOW =0
CLK
11752-080
SYSREF
When in continuous SYSREF± mode (Register 0x120, Bits[2:1] = is ±1 sample clock cycles, meaning that, as long as SYSREF± is
1), the AD9680 monitors the placement of the SYSREF± leading captured within ±1 sample clock cycle of the clock that is aligned
edge compared to the internal LMFC. If the SYSREF± edge is with LMFC, the link continues to operate normally. If the SYSREF±
captured with a clock edge other than the one that is aligned has jitter, which can cause a misalignment between SYSREF± and
with LMFC, the AD9680 initiates a resynchronization of the the LMFC, the system continues to run without a resynchro-
link. Because the input clock rates for the AD9680 can be up to nization, while still allowing the device to monitor for larger
4 GHz, the AD9680 provides another SYSREF± related feature errors not caused by jitter. For the AD9680, the positive and
that makes it possible to accommodate periodic SYSREF± negative skew window is controlled by the SYSREF± window
signals where cycle accurate capture is not feasible or not negative bits (Register 0x0122, Bits[3:2]) and the SYSREF±
required. For these scenarios, the AD9680 has a programmable window positive bits (Register 0x0122, Bits[1:0]). Figure 181
SYSREF± skew window that allows the internal dividers to shows information on the location of the skew window settings
remain undisturbed, unless SYSREF± occurs outside the skew relative to Phase 0 of the internal dividers. Negative skew is defined
window. The resolution of the SYSREF± skew window is set in as occurring before the internal dividers reach Phase 0 and positive
sample clock cycles. If the SYSREF± negative skew window is 1 skew is defined after the internal dividers reach Phase 0.
and the positive skew window is 1, then the total skew window
0xF
0xE
0xD
0xC
0xB
0xA
0x9
REG 0x128[3:0] 0x8
0x7
0x6
0x5
0x4
0x3
0x2
0x1
0x0
CLK±
INPUT
SYSREF± VALID
INPUT
FLIP-FLOP
HOLD (MIN) FLIP-FLOP
SETUP (MIN)
11752-113
FLIP-FLOP
HOLD (MIN)
CLK±
INPUT
SYSREF± VALID
INPUT
FLIP-FLOP
FLIP-FLOP SETUP (MIN)
11752-114
HOLD (MIN)
FLIP-FLOP
HOLD (MIN)
LATENCY
END TO END TOTAL LATENCY Table 29. Latency Through the ADC and DSP Blocks
Total latency in the AD9680 is dependent on the various digital Latency (No. of
signal processing (DSP) and JESD204B configuration modes. Encode Clocks),
Latency is fixed at 26 encode clocks through the ADC itself; ADC Application Mode ADC+DSP Total
however, the latency through the DSP and JESD204B blocks can Full Bandwidth 29
vary greatly, depending on the configuration. Therefore, total DDC (HB1) 78
latency must be calculated based on the DSP options selected (no mixer, complex outputs)
and the JESD204B configuration. DDC (HB2 + HB1) 132
(no mixer, complex outputs)
Table 29 shows the combined latency through the ADC and DDC (HB3 +HB2 + HB1) 232
DSP blocks (including data formatting) for the different (no mixer, complex outputs)
application modes supported by the AD9680. Table 30 shows DDC (HB4 + HB3 + HB2 + HB1) 432
the latency through the JESD204B block for each JESD204B (no mixer, complex outputs)
configuration and the various decimation modes supported for DEC2 + NSR 57
those modes. For both tables, latency is in units of the encode NSR 35
clock. Latency through the JESD204B clock can also be affected VDR 33
by the decimation ratio in some JESD204B configurations.
Table 31 shows the latency for these modes for each of the EXAMPLE LATENCY CALCULATION
possible decimation ratios. For a configuration where the ADC application mode is full
bandwidth, the decimation ratio = 2, L = 4, M = 2, F = 1, and
S = 1 (JESD204B mode),
Latency = 29 + 30 = 59 encode clocks
TEST MODES
ADC TEST MODES If the application mode is set to select a DDC mode of
operation, the test modes must be enabled for each DDC
The AD9680 has various test options that aid in the system level
enabled. The test patterns can be enabled via Bit 2 and Bit 0 of
implementation. The AD9680 has ADC test modes that are
Register 0x0327, Register 0x0347, and Register 0x0367,
available in Register 0x0550. These test modes are described in
depending on which DDC(s) are selected. The (I) data uses the
Table 36. When an output test mode is enabled, the analog section
test patterns selected for Channel A, and the (Q) data uses the
of the ADC is disconnected from the digital back end blocks,
test patterns selected for Channel B. For DDC3 only, the (I) data
and the test pattern is run through the output formatting block.
uses the test patterns from Channel A, and the (Q) data does
Some of the test patterns are subject to output formatting, and
not output test patterns. Bit 0 of Register 0x0387 selects the
some are not. The pseudorandom number (PN) generators
Channel A test patterns to be used for the (I) data. For more
from the PN sequence tests can be reset by setting Bit 4 or Bit 5
of Register 0x0550. These tests can be performed with or information, see the AN-877 Application Note, Interfacing to
without an analog signal (if present, the analog signal is High Speed ADCs via SPI.
ignored); however, they do require an encode clock.
JESD204B
INTERFACE
TEST PATTERN
(REG 0x573, JESD204B DATA
REG 0x551 TO LINK LAYER TEST
JESD204B REG 0x558) PATTERNS
LONG TRANSPORT REG 0x574[2:0]
TEST PATTERN
REG 0x571[5]
SERDOUT0±
ADC TEST PATTERNS SERIALIZER
SERDOUT1±
(RE0x550, FRAME SCRAMBLER 8-BIT/10-BIT
REG 0x551 TO CONSTRUCTION 1 + x14 + x15 ENCODER
REG 0x558) (OPTIONAL) a b i j a b i j
OCTET 0
OCTET 1
OCTET 0
OCTET 1
11752-051
C2
CONTROL BITS C1
C0
Table 38. JESD204B Sample Input for M = 2, S = 2, N' = 16 (Register 0x0573[5:4] = 'b00)
Frame Converter Sample Alternating 1/0 Word
Number Number Number Checkerboard Toggle Ramp PN9 PN23 User Repeat User Single
0 0 0 0x5555 0x0000 (x) % 216 0x496F 0xFF5C UP1[15:0] UP1[15:0]
0 0 1 0x5555 0x0000 (x) % 216 0x496F 0xFF5C UP1[15:0] UP1[15:0]
0 1 0 0x5555 0x0000 (x) % 216 0x496F 0xFF5C UP1[15:0] UP1[15:0]
0 1 1 0x5555 0x0000 (x) % 216 0x496F 0xFF5C UP1[15:0] UP1[15:0]
1 0 0 0xAAAA 0xFFFF (x +1) % 216 0xC9A9 0x0029 UP2[15:0] UP2[15:0]
1 0 1 0xAAAA 0xFFFF (x +1) % 216 0xC9A9 0x0029 UP2[15:0] UP2[15:0]
1 1 0 0xAAAA 0xFFFF (x +1) % 216 0xC9A9 0x0029 UP2[15:0] UP2[15:0]
1 1 1 0xAAAA 0xFFFF (x +1) % 216 0xC9A9 0x0029 UP2[15:0] UP2[15:0]
2 0 0 0x5555 0x0000 (x +2) % 216 0x980C 0xB80A UP3[15:0] UP3[15:0]
2 0 1 0x5555 0x0000 (x +2) % 216 0x980C 0xB80A UP3[15:0] UP3[15:0]
2 1 0 0x5555 0x0000 (x +2) % 216 0x980C 0xB80A UP3[15:0] UP3[15:0]
2 1 1 0x5555 0x0000 (x +2) % 216 0x980C 0xB80A UP3[15:0] UP3[15:0]
3 0 0 0xAAAA 0xFFFF (x +3) % 216 0x651A 0x3D72 UP4[15:0] UP4[15:0]
3 0 1 0xAAAA 0xFFFF (x +3) % 216 0x651A 0x3D72 UP4[15:0] UP4[15:0]
3 1 0 0xAAAA 0xFFFF (x +3) % 216 0x651A 0x3D72 UP4[15:0] UP4[15:0]
3 1 1 0xAAAA 0xFFFF (x +3) % 216 0x651A 0x3D72 UP4[15:0] UP4[15:0]
4 0 0 0x5555 0x0000 (x +4) % 216 0x5FD1 0x9B26 UP1[15:0] 0x0000
4 0 1 0x5555 0x0000 (x +4) % 216 0x5FD1 0x9B26 UP1[15:0] 0x0000
Table 39. Physical Layer 10-Bit Input (Register 0x0573, Bits[5:4] = 'b01)
10-Bit Symbol Alternating 1/0 Word
Number Checkerboard Toggle Ramp PN9 PN23 User Repeat User Single
0 0x155 0x000 (x) % 210 0x125 0x3FD UP1[15:6] UP1[15:6]
1 0x2AA 0x3FF (x + 1) % 210 0x2FC 0x1C0 UP2[15:6] UP2[15:6]
2 0x155 0x000 (x + 2) % 210 0x26A 0x00A UP3[15:6] UP3[15:6]
3 0x2AA 0x3FF (x + 3) % 210 0x198 0x1B8 UP4[15:6] UP4[15:6]
4 0x155 0x000 (x + 4) % 210 0x031 0x028 UP1[15:6] 0x000
5 0x2AA 0x3FF (x + 5) % 210 0x251 0x3D7 UP2[15:6] 0x000
6 0x155 0x000 (x + 6) % 210 0x297 0x0A6 UP3[15:6] 0x000
7 0x2AA 0x3FF (x + 7) % 210 0x3D1 0x326 UP4[15:6] 0x000
8 0x155 0x000 (x + 8) % 210 0x18E 0x10F UP1[15:6] 0x000
9 0x2AA 0x3FF (x + 9) % 210 0x2CB 0x3FD UP2[15:6] 0x000
10 0x155 0x000 (x + 10) % 210 0x0F1 0x31E UP3[15:6] 0x000
11 0x2AA 0x3FF (x + 11) % 210 0x3DD 0x008 UP4[15:6] 0x000
Data Link Layer Test Modes Test patterns inserted at this point are useful for verifying the
The data link layer test modes are implemented in the AD9680 functionality of the data link layer. When the data link layer
as defined by Section 5.3.3.8.2 in the JEDEC JESD204B test modes are enabled, disable SYNCINB± by writing 0xC0
specification. These tests are shown in Register 0x574 Bits[2:0]. to Register 0x0572.
MEMORY MAP
READING THE MEMORY MAP REGISTER TABLE Logic Levels
Each row in the memory map register table has eight bit An explanation of logic level terminology follows:
locations. The memory map is divided into four sections: the • “Bit is set” is synonymous with “bit is set to Logic 1” or
Analog Devices SPI registers (Register 0x000 to Register 0x00D), “writing Logic 1 for the bit.”
the analog input buffer control registers, the ADC function • “Clear a bit” is synonymous with “bit is set to Logic 0” or
registers, the DDC function registers, and the digital outputs “writing Logic 0 for the bit.”
and test modes registers. • X denotes a don’t care bit.
Table 39 (see the Memory Map Register Table section) documents
Channel-Specific Registers
the default hexadecimal value for each hexadecimal address shown.
The column with the heading Bit 7 (MSB) is the start of the Some channel setup functions, such as the input termination
default hexadecimal value given. For example, Address 0x561, (Register 0x016), can be programmed to a different value for
the output mode register, has a hexadecimal default value of each channel. In these cases, channel address locations are
0x01, which means that Bit 0 = 1, and the remaining bits are 0s. internally duplicated for each channel. These registers and bits
This setting is the default output format value, which is twos are designated in Table 39 as local. These local registers and bits
complement. For more information on this function and others, can be accessed by setting the appropriate Channel A or Channel B
see Table 39. bits in Register 0x008. If both bits are set, the subsequent write
affects the registers of both channels. In a read cycle, set only
Open and Reserved Locations Channel A or Channel B to read one of the two registers. If both
All address and bit locations that are not included in Table 39 bits are set during an SPI read cycle, the device returns the value
are not currently supported for this device. Write unused bits of for Channel A. Registers and bits designated as global in Table 39
a valid address location with 0s unless the default value is set affect the entire device and the channel features for which
otherwise. Writing to these locations is required only when part independent settings are not allowed between channels. The
of an address location is unassigned (for example, Address 0x561). settings in Register 0x005 do not affect the global registers and bits.
If the entire address location is open (for example, Address 0x13),
SPI Soft Reset
do not write to this address location.
After issuing a soft reset by programming 0x81 to Register 0x000,
Default Values the AD9680 requires 5 ms to recover. When programming the
After the AD9680 is reset, critical registers are loaded with AD9680 for application setup, ensure that an adequate delay is
default values. The default values for the registers are given in programmed into the firmware after asserting the soft reset and
the memory map register table, Table 39. before starting the device setup.
APPLICATIONS INFORMATION
POWER SUPPLY RECOMMENDATIONS plane must have several vias to achieve the lowest possible
resistive thermal path for heat dissipation to flow through the
The AD9680 must be powered by the following seven supplies:
bottom of the PCB. These vias must be solder filled or plugged.
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR =
The number of vias and the fill determine the resulting θJA
1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, and SPIVDD = 1.80 V.
For applications requiring an optimal high power efficiency and measured on the board.
low noise performance, it is recommended that the ADP2164 To maximize the coverage and adhesion between the ADC and
and ADP2370 switching regulators be used to convert the 3.3 V, PCB, partition the continuous copper plane by overlaying a
5.0 V, or 12 V input rails to an intermediate rail (1.8 V and 3.8 V). silkscreen on the PCB into several uniform sections. This
These intermediate rails are then postregulated by very low provides several tie points between the ADC and PCB during
noise, low dropout (LDO) regulators (ADP1741, ADM7172, the reflow process, whereas using one continuous plane with no
and ADP125). Figure 185 shows the recommended power partitions only guarantees one tie point. See Figure 186 for a
supply scheme for the AD9680. PCB layout example. For detailed information on packaging
AVDD1 and the PCB layout of chip scale packages, see the AN-772
1.8V ADP1741 1.25V
Application Note, A Design and Manufacturing Guide for the
Lead Frame Chip Scale Package (LFCSP).
AVDD1_SR
1.25V
DVDD
ADP1741 1.25V
DRVDD
1.25V
SPIVDD
(1.8V OR 3.3V)
3.6V AVDD3
ADP125
3.3V
11752-063
Figure 185. High Efficiency, Low Noise Power Solution for the AD9680
11752-064
first and then tap it off and isolate it with a ferrite bead or a filter
choke, preceded by decoupling capacitors for AVDD1_SR, DVDD,
Figure 186. Recommended PCB Layout of Exposed Pad for the AD9680
and DRVDD, in that order. This is shown as the optional path
in Figure 185. The user can employ several different decoupling AVDD1_SR (PIN 57) AND AGND (PIN 56 AND PIN 60)
capacitors to cover both high and low frequencies. These capacitors AVDD1_SR (Pin 57) and AGND (Pin 56 and Pin 60) can be
must be located close to the point of entry at the PCB level and used to provide a separate power supply node to the SYSREF±
close to the devices, with minimal trace lengths. circuits of AD9680. If running in Subclass 1, the AD9680 can
EXPOSED PAD THERMAL HEAT SLUG support periodic one-shot or gapped signals. To minimize the
RECOMMENDATIONS coupling of this supply into the AVDD1 supply node, adequate
supply bypassing is needed.
The exposed pad on the underside of the ADC must be connected
to AGND to achieve the best electrical and thermal performance
of the AD9680. Connect an exposed continuous copper plane
on the PCB to the AD9680 exposed pad, Pin 0. The copper
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
9.10
9.00 SQ 0.30
8.90 0.25
PIN 1 P IN 1
INDICATOR 0.18 IN D IC ATO R AR E A OP T IO N S
AREA (SEE DETAIL A)
49 64
48 1
0.50
BSC 7.70
EXPOSED 7.60 SQ
PAD
7.50
33 16
32 17
TOP VIEW
0.45 0.20 MIN
BOTTOM VIEW
0.40
7.50 REF
0.35
0.80
FOR PROPER CONNECTION OF
0.75 SIDE VIEW
THE EXPOSED PAD, REFER TO
0.05 MAX
0.70 THE PIN CONFIGURATION AND
0.02 NOM FUNCTION DESCRIPTIONS
COPLANARITY SECTION OF THIS DATA SHEET.
SEATING 0.08
PLANE 0.203 REF
09-25-2018-A
PKG-004396
ORDERING GUIDE
Model 1 Temperature Range Package Description 2 Package Option
AD9680BCPZ-1250 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZ-1000 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZ-820 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZ-500 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZRL7-1250 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZRL7-1000 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZRL7-820 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680BCPZRL7-500 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP] CP-64-15
AD9680-1250EBZ Evaluation Board for AD9680-1250
AD9680-1000EBZ Evaluation Board for AD9680-1000
AD9680-LF1000EBZ Evaluation Board for AD9680-1000 with 1 GHz Bandwidth
AD9680-820EBZ Evaluation Board for AD9680-820
AD9680-LF820EBZ Evaluation Board for AD9680-820 with 1 GHz Bandwidth
AD9680-500EBZ Evaluation Board for AD9680-500
AD9680-LF500EBZ Evaluation Board for AD9680-500 with 1 GHz Bandwidth
1
Z = RoHS Compliant Part.
2
The AD9680-1250EBZ, AD9680-1000EBZ, AD9680-820EBZ, and AD9680-500EBZ evaluation boards are optimized for the full analog input frequency range of 2 GHz.