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FGL40N120AND 1200V NPT IGBT

February 2008

tm
FGL40N120AND
1200V NPT IGBT
Features Description
• High speed switching Employing NPT technology, Fairchild’s AND series of IGBTs
provides low conduction and switching losses. The AND series
• Low saturation voltage : VCE(sat) = 2.6 V @ IC = 40A
offers an solution for application such as induction heating (IH),
• High input impedance motor control, general purpose inverters and uninterruptible
power supplies (UPS).
• CO-PAK, IGBT with FRD : trr = 75ns (typ.)

Applications
Induction Heating, UPS, AC & DC motor controls and general
purpose inverters.

TO-264
G C E E

Absolute Maximum Ratings


Symbol Parameter FGL40N120AND Units
VCES Collector-Emitter Voltage 1200 V
VGES Gate-Emitter Voltage ±25 V
Collector Current @TC = 25°C 64 A
IC
Collector Current @TC = 100°C 40 A
ICM(1) Pulsed Collector Current 160 A
IF Diode Continuous Forward Current @TC = 100°C 40 A
IFM Diode Maximum Forward Current 240 A
Maximum Power Dissipation @TC = 25°C 500 W
PD
Maximum Power Dissipation @TC = 100°C 200 W
Short Circuit Withstand Time,
SCWT 10 µs
VCE = 600V, VGE = 15V, TC = 125°C
TJ Operating Junction Temperature -55 to +150 °C
TSTG Storage Temperature Range -55 to +150 °C
Maximum Lead Temp. for Soldering
TL 300 °C
Purposes, 1/8” from Case for 5 seconds
Notes:
(1) Pulse width limited by max. junction temperature

Thermal Characteristics
Symbol Parameter Typ. Max. Units
RθJC(IGBT) Thermal Resistance, Junction-to-Case -- 0.25 °C/W
RθJC(DIODE) Thermal Resistance, Junction-to-Case -- 0.7 °C/W
RθJA Thermal Resistance, Junction-to-Ambient -- 25 °C/W

©2008 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com


FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FGL40N120AND FGL40N120AND TO-264 - - 25

Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted

Symbol Parameter Conditions Min. Typ. Max. Units

Off Characteristics
BVCES Collector-Emitter Breakdown Voltage VGE = 0V, IC = 1mA 1200 -- -- V
BVCES/ Temperature Coefficient of Breakdown
VGE = 0V, IC = 1mA -- 0.6 -- V/°C
∆TJ Voltage
ICES Collector Cut-Off Current VCE = VCES, VGE = 0V -- -- 1 mA
IGES G-E Leakage Current VGE = VGES, VCE = 0V -- -- ±250 nA

On Characteristics
VGE(th) G-E Threshold Voltage IC = 250µA, VCE = VGE 3.5 5.5 7.5 V
IC = 40A, VGE = 15V -- 2.6 3.2 V
Collector to Emitter IC = 40A, VGE = 15V,
VCE(sat) -- 2.9 -- V
Saturation Voltage TC = 125°C
IC = 64A, VGE = 15V -- 3.15 -- V

Dynamic Characteristics
Cies Input Capacitance -- 3200 -- pF
VCE = 30V, VGE = 0V
Coes Output Capacitance -- 370 -- pF
f = 1MHz
cres Reverse Transfer Capacitance -- 125 -- pF

Switching Characteristics
td(on) Turn-On Delay Time -- 15 -- ns
tr Rise Time -- 20 -- ns
td(off) Turn-Off Delay Time -- 110 -- ns
VCC = 600V, IC = 40A,
tf Fall Time RG = 5Ω, VGE = 15V, -- 40 80 ns
Inductive Load, TC = 25°C
Eon Turn-On Switching Loss -- 2.3 3.45 mJ
Eoff Turn-Off Switching Loss -- 1.1 1.65 mJ
Ets Total Switching Loss -- 3.4 5.1 mJ
td(on) Turn-On Delay Time -- 20 -- ns
tr Rise Time -- 25 -- ns
td(off) Turn-Off Delay Time -- 120 -- ns
VCC = 600V, IC = 40A,
tf Fall Time RG = 5Ω, VGE = 15V, -- 45 -- ns
Eon Turn-On Switching Loss Inductive Load, TC = 125°C -- 2.5 -- mJ
Eoff Turn-Off Switching Loss -- 1.8 -- mJ
Ets Total Switching Loss -- 4.3 -- mJ
Qg Total Gate charge -- 220 330 nC
VCE = 600V, IC = 40A,
Qge Gate-Emitter Charge -- 25 38 nC
VGE = 15V
Qgc Gate-Collector Charge -- 130 195 nC

2 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Electrical Characteristics of DIODE T C = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Units


IF = 40A TC = 25°C -- 3.2 4.0
VFM Diode Forward Voltage V
TC = 125°C -- 2.7 --
TC = 25°C -- 75 112
trr Diode Reverse Recovery Time nS
TC = 125°C -- 130 --

Diode Peak Reverse Recovery IF = 40A, TC = 25°C -- 8 12


Irr A
Current di/dt = 200A/µs TC = 125°C -- 13 --
TC = 25°C -- 300 450
Qrr Diode Reverse Recovery Charge nC
TC = 125°C -- 845 --

3 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Typical Performance Characteristics
Figure 1. Typical Output Characteristics Figure 2. Typical Saturation Voltage
Characteristics
300 150
TC = 25°C
20V Common Emitter
17V VGE = 15V
250 15V
TC = 25°C
120
TC = 125°C
Collector Current, IC [A]

Collector Current, IC [A]


200 12V
90

150

60
100 VGE = 10V

30
50

0 0
0 2 4 6 8 10 0 2 4 6
Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]

Figure 3. Saturation Voltage vs. Case Figure 4. Load Current vs. Frequency
Temperature at Variant Current Level
5 80
Common Emitter VCC = 600V
VGE = 15V Load Current : peak of square wave
70
Collector-Emitter Voltage, VCE [V]

4 60
80A
Load Current [A]

50

3 40
40A
30

2 20
IC = 20A
Duty cycle : 50%
10
TC = 100°C
Power Dissipation = 100W
1 0
25 50 75 100 125 0.1 1 10 100 1000

Case Temperature, TC [°C] Frequency [kHz]

Figure 5. Saturation Voltage vs. VGE Figure 6. Saturation Voltage vs. VGE
20 20
Common Emitter Common Emitter
TC = 25°C TC = 125°C
Collector-Emitter Voltage, VCE [V]

Collector-Emitter Voltage, VCE [V]

16 16

12 12

8 8

80A 80A
4 4 40A
40A

IC = 20A IC = 20A
0 0
0 4 8 12 16 20 0 4 8 12 16 20

Gate-Emitter Voltage, VGE [V] Gate-Emitter Voltage, VGE [V]

4 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Typical Performance Characteristics (Continued)

Figure 7. Capacitance Characteristics Figure 8. Turn-On Characteristics vs. Gate


Resistance
6000
Common Emitter
VGE = 0V, f = 1MHz
5000 TC = 25°C
100
Ciss

Switching Time [ns]


4000
Capacitance [pF]

tr

3000

2000 Common Emitter


td(on)
Coss VCC = 600V, VGE = ±15V
IC = 40A
1000 Crss TC = 25°C
TC = 125°C
0 10
1 10 0 10 20 30 40 50 60 70

Collector-Emitter Voltage, VCE [V] Gate Resistance, RG [Ω ]

Figure 9. Turn-Off Characteristics vs. Figure 10. Switching Loss vs. Gate Resistance
Gate Resistance

Common Emitter Common Emitter


VCC = 600V, VGE = ±15V, IC = 40A VCC = 600V, VGE = ±15V
1000
TC = 25°C IC = 40A
td(off)
TC = 125°C TC = 25°C
10
TC = 125°C
Switching Loss [mJ]
Switching Time [ns]

Eon

100

Eoff
tf

10
0 10 20 30 40 50 60 70 0 10 20 30 40 50 60 70

Gate Resistance, RG [Ω] Gate Resistance, RG [Ω]

Figure 11. Turn-On Characteristics vs. Figure 12. Turn-Off Characteristics vs.
Collector Current Collector Current

Common Emitter Common Emitter


VGE = ±15V, RG = 5Ω VGE = ±15V, RG = 5Ω

100 TC = 25°C tr TC = 25°C


TC = 125°C TC = 125°C
td(off)
Switching Time [ns]
Switching Time [ns]

100

tf

td(on)

10

20 30 40 50 60 70 80 20 30 40 50 60 70 80

Collector Current, IC [A] Collector Current, IC [A]

5 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Typical Performance Characteristics (Continued)

Figure 13. Switching Loss vs. Collector Current Figure 14. Gate Charge Characteristics
16
Common Emitter Common Emitter
VGE = ±15V, RG = 5Ω RL = 15Ω
14
TC = 25°C Vcc = 200V
10 Eon TC = 25°C
600V

Gate-Emitter Voltage, VGE [V]


TC = 125°C 12
Switching Loss [mJ]

10
400V

Eoff 8

1
6

0.1 0
20 30 40 50 60 70 80 0 50 100 150 200 250

Collector Current, IC [A] Gate Charge, Qg [nC]

Figure 15. SOA Characteristics Figure 16. Turn-Off SOA

Ic MAX (Pulsed)
100 50µs
Ic MAX (Continuous)
100µs 100
Collector Current, Ic [A]

Collector Current, IC [A]

10 1ms

DC Operation

1
10

Single Nonrepetitive
0.1 o
Pulse Tc = 25 C
Curves must be derated
linearly with increase Safe Operating Area
o
in temperature VGE = 15V, TC = 125 C
0.01 1
0.1 1 10 100 1000 1 10 100 1000

Collector - Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]

Figure 17. Forward Characteristics Figure 18. Reverse Recovery Current


10

100
di/dt = 200A/µs
Reverse Recovery Currnet , Irr [A]

8
o
TJ = 125 C
Forward Current , IF [A]

6
10
o
TJ = 25 C
4

di/dt = 100A/µs
1

2
o
TC = 125 C
o
TC = 25 C
0.1 0
0 1 2 3 4 5 6 0 10 20 30 40 50 60 70

Forward Voltage , VF [V] Forward Current , IF [A]

6 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Typical Performance Characteristics (Continued)

Figure 19. Stored Charge Figure 20. Reverse Recovery Time


100 400

Stored Recovery Charge , Qrr [nC]


Reverse Recovery Time , trr [ns]

90
300 di/dt = 200A/µs
di/dt = 200A/µs
80

200
70 di/dt = 100A/µs

di/dt = 100A/µs
60 100

50
0 10 20 30 40 50 60 70 0
Forward Current , IF [A] 0 10 20 30 40 50 60 70

Forward Current , IF [A]

Figure 21. Transient Thermal Impedance of IGBT

1
Thermal Response [Zthjc]

0.1 0.5

0.2

0.1

0.01 0.05 Pdm


Pdm

t1
t1
0.02
t2
t2
0.01
single pulse Duty
Dutyfactor
factorDD==t1
t1//t2
t2
Peak
PeakTj Pdm××Zthjc
Tj==Pdm Zthjc++TTCC
1E-3
1E-5 1E-4 1E-3 0.01 0.1 1 10

Rectangular Pulse Duration [sec]

7 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
Mechanical Dimensions

TO-264
20.00 ±0.20

6.00 ±0.20
(4.00)
(2.00)
(8.30) (8.30)
(1.00)
(9.00)
(9.00)

(0.50)
(11.00)

(R

ø3.3
2.0

20.00 ±0.20
0)

0 ±0

(R1
.20

.00
1.50 ±0.20

)
(2.00)

(7.00) (7.00)

4.90 ±0.20
2.50 ±0.10

(1.50)
(1.50) (1.50)
20.00 ±0.50

2.50 ±0.20 3.00 ±0.20

+0.25
1.00 –0.10

+0.25
5.45TYP 5.45TYP 0.60 –0.10 2.80 ±0.30
[5.45 ±0.30] [5.45 ±0.30]
5.00 ±0.20
3.50 ±0.20

(0.15)
(2.80)
(1.50)

Dimensions in Millimeters

8 www.fairchildsemi.com
FGL40N120AND Rev. A2
FGL40N120AND 1200V NPT IGBT
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global
subsidianries, and is not intended to be an exhaustive list of all such trademarks.
ACEx® FPS™ PDP-SPM™ SupreMOS™
Build it Now™ FRFET® Power220® SyncFET™
CorePLUS™ Global Power ResourceSM POWEREDGE® ®
CROSSVOLT™ Green FPS™ Power-SPM™ The Power Franchise®
CTL™ Green FPS™ e-Series™ PowerTrench®
Current Transfer Logic™ GTO™ Programmable Active Droop™ tm

EcoSPARK® i-Lo™ QFET® TinyBoost™


EZSWITCH™ * IntelliMAX™ QS™
™ TinyBuck™
ISOPLANAR™ QT Optoelectronics™
TinyLogic®
MegaBuck™ Quiet Series™ TINYOPTO™
®
MICROCOUPLER™ RapidConfigure™
tm
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TinyPWM™
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FACT Quiet Series™ MillerDrive™ STEALTH™
µSerDes™
FACT® Motion-SPM™ SuperFET™
UHC®
FAST® OPTOLOGIC® SuperSOT™-3 Ultra FRFET™
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UniFET™
FlashWriter® * ® SuperSOT™-8
tm
VCX™

* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY


FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:
1. Life support devices or systems are devices or systems which, 2. A critical component in any component of a life support, device
(a) are intended for surgical implant into the body or (b) or system whose failure to perform can be reasonably
support or sustain life, and (c) whose failure to perform when expected to cause the failure of the life support device or
properly used in accordance with instructions for use provided system, or to affect its safety or effectiveness.
in the labeling, can be reasonably expected to result in a
significant injury to the user.

PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition
This datasheet contains the design specifications for product development.
Advance Information Formative or In Design
Specifications may change in any manner without notice.
This datasheet contains preliminary data; supplementary data will be pub-
Preliminary First Production lished at a later date. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves
No Identification Needed Full Production
the right to make changes at any time without notice to improve design.
This datasheet contains specifications on a product that has been discontin-
Obsolete Not In Production ued by Fairchild Semiconductor. The datasheet is printed for reference infor-
mation only. Rev. I33

9 www.fairchildsemi.com
FGL40N120AND Rev. A2

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