2012.

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Technical data
Pb-FREE SOLDER PASTE TLF-SERIES
LFSOLDER   GP-216-HF17   Halogen Free
1.Introduction (2) Product packing unit
LFSOLDER GP-216-HF17 is a Pb-free and cleaning-free The standard of the packing unit of this product is 500g.
solder paste used Pb-free spherical solde powder and
flux. Since this solder paste contains no Pb, the usage of (3) Quality guarantee period
hazardous materials is reduced, furthermore, the 90 days after manufactured if stored, hermetically
and the safe workplace are protected. As its flux residue sealed under 10℃.
contains no halides, it can be remained on the PCB
cleaning. 4. Physical properties
(1) Appearance of solder powder
Fig.1 shows the appearance of the solder powder taken by
SEM photography.

2.Outstanding features
● Pb-free (Sn/Ag/Cu series) solder alloy is used.
● Excellent wettability for electronic component and land p
● Stable printability with little change in viscosity
  during continuous printing.
● Having a good solderability even in air reflow.
● Excellent solderability can be attained for a high peak
　 temperature.
● Superior reliability is provided by no washing. ３０μm
　 heater and conveyor during reflowing.

Fig.1 SEM photograph of solder powder

3. Outline of product (2)Particle size distribution of solder powder

(1) Product characteristics Shown in Fig.2 is the result of particle size distribution
The characteristics of LFSOLDER GP-216-HF17 of solder powder as measured in accordance with JIS Z
is shown in Table 1: 3284(1994):
Table 1 Characteristics
Items Characteristics Test methods
Alloy composition Sn96.8/Ag0.3/Cu0.7/Bi2.0/In0.2 JIS Z 3282（1999）
According to DSC
Melting point 210∼224℃
measurement
Particle size of According to laser
20-36µm
solder powder diffraction method
Flux content 12.5% JIS Z 3284 (1994)
Chlorine content※ 0.0％ JIS Z 3197 (1999)
Annex 6 to JIS Z
3284 (1994)
Viscosity 200Pa・s Viscometer, type Fig.2 Particle size distribution of solder powder by
PCU, manufactured laser diffraction method
by Malcom., at 25℃ Measuring equipment: LS-230 as manufactured by
※
Result of examination in flux. Coulter

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(3) Characteristics (5) Slumping during preheating
Table3 shows the thixotropic index and the non-recovery Solder balls and bridges tend to occur if solder paste has
rate of viscosity as measured in accordance with JIS Z a large slumping during printing and heating. Fig.4
3284(1994). shows the conditions after printing of LFSOLDER
GP-216-HF17 and the state of slumping when heated
Table 3 Thixotropy index and non-recovery ratio of viscosity after printing:
Item Measured values
Thixotropy index 0.57
non-recovery ratio of viscosity(％) 1.2

(4) Temperature dependency

The relationship between temperature and viscosity is
shown in Fig.3 The viscosity changes with the After printing After heating
temperature and as s result the printability. Therefore it
is important to control the temperature of the working Fig.4 Slumping after printing and after heating
environment. Metal mask: 0.2 mm t
Slit interval: 0.1, 0.2, 0.3, 0.4mm (from the left side)
Heating temperature: 150℃, 1min

(6)Tackiness
The change in the tackiness of solder paste as measured
in accordance with JIS Z 3284 (1994) is shown in Fig.5
2
Tackiness Force (N)

1.5

Fig.3 Relationship between temperature and viscosity 1

Viscometer: PCU manufactured by Malcom
0.5

0
0 6 12 18 24
Time (h)

Fig.5 Change in tackiness

Measuring device: Tackiness tester, TK-1,
manufactured by Malcom
Press speed: 2.0 mm/s
Press force: 0.49 N
Peeling speed: 10.0 mm/s
Press time: 0.2 s

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5. Reliability 6. Printability
(1) Insulation resistance test (1) Appropriate printing conditions
Shown in Fig.6 is the change in the values of insulation Squeegee hardness : 80-90 °(Polyurethane)
resistance measured in accordance with JIS Z 3284 Printing speed : 20-50 mm／s
(1994). Squeegee material : Urethane, Metal(SUS)
Having practically no decline in the values of insulation Printing pressure :15∼40N
resistance, the film shows a good insulation.
1.E+15
(2) Continuous Printability
1.E+14 85℃ 85％RH Blank
Fig.8 shows the conditions of continuous printing on
85℃ 85％RH Specimen
1.E+13
sections on 0.26mm φ dots. An excellent printability is
Insulation resistance( Ω)

1.E+12

1.E+11
shown, with no bleeding from the beginning to the 10th
1.E+10 sheet:
1.E+09

1.E+08

1.E+07 First sheet

0 250 500 750 1000
Holding time（h）
0.26
Fig.6 Change in the values of insulation resistance
㎜
measured in accordance with JIS Z 3284(1994).
φ
Board: JIS comb type electrode board, type 2.
printed with solder paste and re-flowed by
10th sheet
reflow soldering system are used as test boards.
Measurement: Inside tank, measuring voltage DC100 V

Fig.8 Continuous printability at 0.26mmφ

dots, with no wiping of the back of plate
(2) Migration test Squeegee : SUS,  Printing speed : 30mm／s
The results of migration test measured in accordance with Metal mask:0.10mmt
JIS Z 3284 (1994) are shown in Fig.7. No decline is seen Environments : 23-25℃ (40-60％RH)
in the value of insulation resistance, and no occurrence of
migration or corrosion is observed. 7. Shelf life
1.E+15 The change in viscosity during storage at temperature of
Insulation resistance（ Ω ）

1.E+14 85 ℃ 85 ％RH Blank

1.E+13 85 ℃ 85 ％RH Specimen

10℃ is shown in Fig.9. It can be seen that the product is
1.E+12
excellent in stability with no change in viscosity from the
1.E+11
1.E+10 time of manufacture.
1.E+09
1.E+08
1.E+07
0 250 500 750 1000

Holding time（h）

Fig.7 Migration test in accordance with JIS Z 3284 (1994)

Boards : JIS comb type electrode boards, type 2.
printed with solder paste and re-flowed by reflow
soldering system are used as test boards.
Voltage: DC 50V
Measurement: Inside tank, measuring voltage DC 100V

Fig.9 Change in viscosity during storage,

temperature at 10℃
Viscometer : PCU type manufactured by Malcom

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8. Recommended reflow profile 9. Cautions for safety and health
Shown in Fig.10 is a recommended temperature profile
for air reflow. Beware of sudden rise in preheat a) Store in refrigerator to maintain characteristics of
temperature as it will cause slumping of solder paste LFSOLDER GP-216-HF17 Series.
which tends to result in solder balls.
b) Break the seal after returning to room temperature
without fail, before use. In case of 500 kg container, it
will take approximately one to two hours at 25℃.
Temperature(℃)

c) Physiological interaction varies by individuals. As a

prudent policy, therefore, care, should beexercised not
to inhale gas of fume of solvent emitted during
operations and not to have your skin exposed
Time(s) (especially mucous membrane and other parts
vulnerable to stimuli) for a long time.
Fig.10 Recommended temperature profile for air reflow
d) This paste is contains the organic solvent, but it is no
flammable.
a) Preheat
Set the temperature rising speed A at a rate of 1-3 ℃ per e) If the paste sticks to the skin, wipe it off
second. Rapid temperature raising in pre-heat zone tends with ethanol and the like, and wash thoroughly
to cause solder balls. with soapy water.
It will be appropriate if pre-heat time B were set in the
range from 60 to 100 seconds. If pre-heat is insufficient, ※ Please refer to MSDS before you use this
rather large solder balls tend to be caused. Conversely, solder paste.
if it is excessive, fine balls and large balls are caused in
clusters.
Pre-heat ending temperature C would be appropriate if it The physical chemistry-character among written contents
were set in the range from 150 to 190 ℃ . If the etc. is not a guarantee value. The evaluation of danger
temperature is too low, non-melting tends to be caused and noxiousness is based and makes material,
often after reflow. information, and the data, etc. which can be acquired
now. However, it is not because all material was covered
b) Heating and note handling enough, please. As for notes, it is the
If the temperature rise is too fast it may cause excessive one intended for usual handling.
slump of the solder paste. Set the peak temperature D in Special handling is not assumed. Please observe the
the range from 235 to 245℃. restriction of related various regulations, and use after
Adjust the melting time, the time at over 220 ℃ , E to executing suitable safety measures for the usage. Before
be from 30 to 60 seconds. using it in your company, it is related with process
conditions or reliability.
c) Cooling Please conduct sufficient examination surely performed.
Careful about slow cooling as it may cause the positional
shift of parts and decline in joining strength at times.

※ Perform adequate test in advance as the

reflow temperature profile will vary
according to the conditions of parts and
boards and the specifications of the reflow
furnace.

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Dealer:

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