EC442: PROJECT II

CREDITS = 15 (L=0, T=0, P=15)

Course Objectives :

To implement the project in the field of embedded system design, signal processing, image
processing, information and communication technology, digital VLSI design and antenna and
microwave link etc.

Teaching and Assessment Scheme:

Teaching Scheme Credits Assessment Scheme

Theory Practical Total

L T P C Marks
ESE CE ESE CE
300
0 0 15 15 0 0 180 120

Details of Assessment Instruments under CE Practical Component :

Term work Viva

[20] [30]
Attendance/ Project Work Planning Performance evaluation of the project /
/Presentations/Project Poster Report/Prototype/Questions & Answers

Course Guidelines:

1. The Project shall exclusively be carried out at Industries/Organizations/Premier

Institutes/Colleges other than BIRLA VISHVAKARMA MAHAVIDYALAYA etc. Student
shall physically be present at Industry/Organization/Premier Institute/Other College etc.

2. The maximum number of the students permitted for the Project shall be decided by the
Departmental Academic Committee (DAC) in each year. Subsequently, it shall be approved by
the respective Board of Studies.

3. Allocation of the students to Industries/Organizations/Premier Institutes/Other Colleges shall

be based on Merit Marks (i.e. CPI of the student). Details of the offering / selection of the
industries etc. shall be decided by the Departmental Academic Committee (DAC).
Subsequently, it shall be approved by the respective Board of Studies.

4. For UDP project one faculty guide is appointed and for IDP project two guides (one
 Faculty and other industry person) shall be appointed.

5. The student will not accept any stipend from the industry in which student is carrying
Out the project.

6. Internal Guide shall closely monitor the progress of the Project.

7. The maximum teaching load of a faculty for guiding any form of Project (Internal
Guide/s) shall not be more than four hrs. /wk.

Course Outcomes:

1. Apply the knowledge of electronics and communication engineering to the solution of

electronics and communication engineering problems/project.
2. Review the research literature of selected project, and analyze complex engineering
problems reaching substantiated conclusions.
3. Use research-based knowledge and research methods, including design of experiments,
analysis and interpretation of data to design electronics and communication project.
4. Apply appropriate techniques, resources, and modern engineering and IT tools including
prediction and modeling to design electronics circuits using relevant software and hardware
for embedded, IOT, signal processing and communication based application.
5. Understand the impact of the electronics communication engineering solutions to societal
and environmental contexts, ethical principles and norms of the engineering practice.
6. Function effectively as an individual, and as a member or leader in diverse teams to manage
projects, communicate effectively and effective presentations of projects.

Course Articulation Matrix:

Course PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12 PSO13 PSO14 PSO15
Outcomes
CO.1 3 2 2 2 2 2 2 2 2 2 2 1 3 1 1
CO.2 2 3 2 2 2 2 2 2 1 1 2 1 2 1 1
CO.3 2 2 3 2 1 2 2 2 2 2 2 1 2 1 3
CO.4 2 2 2 2 3 1 2 2 1 1 1 1 1 1 2
CO.5 2 2 2 2 2 3 2 3 1 1 2 1 1 1 2

CO.6 1 1 1 2 2 2 2 2 3 3 3 1 1 1 1

Avg.
2 2 2 2 2 2 2 2.16 1.66 1.66 2 1 1.66 1 1.66
Delivery Methods:

1. Guided to the students for implantation of the project through various software tools and
preparation of hardware model etc.
2. Guided to the students regarding IDP/UDP projects, preparation of work planning of
project, Poster presentation event, research paper writing and patent draft excersie (PDE)
etc.

Constituent COs in Assessment Tools:

Sr. Course Assessment tools

No Outcomes
1. CO.1 Exam, Presentation, Software/Hardware Model
2. CO.2 Exam, Presentation, Software/Hardware Model
3. CO.3 Exam, Presentation, Software/Hardware Model
4. CO.4 Exam, Presentation, Software/Hardware Model
5. CO.5 Exam, Presentation, Software/Hardware Model
6. CO.6 Exam, Presentation, Software/Hardware Model