This document outlines the specifications for plant production of printed circuit boards (PCBs), including general parameters, production parameters, CNC drilling/routing parameters, surface finish parameters, and special requirements. Key details include supporting PCB sizes up to 12x15 inches with up to 16 layers, minimum track widths of 6-8 mils, aspect ratios of 6:1 for drilled holes, and surface finishes of HASL or ENIG. Buried vias and blind vias are possible for R&D purposes only. Quality standards include IPC 6012D, IPC 600J, and IPC 7711/21. Specifications beyond what is listed require discussion with Smart PCBs to take the project as research
This document outlines the specifications for plant production of printed circuit boards (PCBs), including general parameters, production parameters, CNC drilling/routing parameters, surface finish parameters, and special requirements. Key details include supporting PCB sizes up to 12x15 inches with up to 16 layers, minimum track widths of 6-8 mils, aspect ratios of 6:1 for drilled holes, and surface finishes of HASL or ENIG. Buried vias and blind vias are possible for R&D purposes only. Quality standards include IPC 6012D, IPC 600J, and IPC 7711/21. Specifications beyond what is listed require discussion with Smart PCBs to take the project as research
This document outlines the specifications for plant production of printed circuit boards (PCBs), including general parameters, production parameters, CNC drilling/routing parameters, surface finish parameters, and special requirements. Key details include supporting PCB sizes up to 12x15 inches with up to 16 layers, minimum track widths of 6-8 mils, aspect ratios of 6:1 for drilled holes, and surface finishes of HASL or ENIG. Buried vias and blind vias are possible for R&D purposes only. Quality standards include IPC 6012D, IPC 600J, and IPC 7711/21. Specifications beyond what is listed require discussion with Smart PCBs to take the project as research