SHARP ELEK/ MeLec o1v 45€ 0 6280298 oouzeze TH
couplers C317 Series
Photocoup 1-41-83
PC317 Seri Opaque’, Mini-Flat Package, Gen-
PIES | eral Puroose Photocoupler
Features Applications
1. Opaque type, mini-flat package 1, Hybrid substrates that require high density
PC317 (I-channel) — PC3D17 (2-channel) mounting
PC3Q17 (é-channel) 2, Programmable controllers
2. Subminiature type
(The volume is smaller than that of our
‘conventional DIP type by as far as 30%,)
3. Current transfer ratio
CTR: MIN. 50% at Ip=5mA, Vex=5V
4, Isolation voltage between input and output
Va: 2,500Vems
+ Bmpolys double transfer mold technology.
™ Outline Dimensions (Unit : mm)
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BeRthode B Collector
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— Le BOVE Collector
Anade @D Cathose =
Erntter Go) Collector
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254SHARP ELEK/ MELEC DIV 45€
Photocouplers
Fig. 2 Collector Power Dissipation vs.
Ambient Temperature
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Arbiea temperature Ta CC)
Forward Current vs, Forward Voltage
of 380796 oovesa0 of
C317 Series
1-41-83
Fig. 3. Peak Forward Current vs. Duty
Ratio
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Pea forward caret In (A)
fer soe hore
Duty rato
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Fig, 5 Current Transfer Ratio vs.
Forward Current
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Fig. 6 Collector Current ve Fig. 7 Relative Current Transfer Ratio vs.
Gollector-emitter Voltage Ambient Femperature
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Photocorirs
Fig. 8 Collector-emitter Saturation Voltage
vs, Ambient Temperature
Iy=20mA
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CCliectoremiter saturation voltage
ol
so eo
Ambint temperature Ta (C)
Fig, 10 Response Time vs. Load Resistance
Response te ty tet es)
or Or nt
Lond existance Re (xO)
0
Test Circuit for Response Time
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C317 Series
7-41-83
Fig 9 Collector Dark Current vs.
Ambient Temperature
av
ao
Ambit taneratre Te (O)
Fig, 11 Collector-emitter Saturation
Voltage vs. Forward Current
Coltectoremiter saturation voltage
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Scan 1%
a
Forward curent fe (mal
Package Specification of PC300 Series (1-