Embedded Product Development

CHAPTER 1: COMPANY PROFILE

1. BACKGROUND OF THE COMPANY
BDGtronix is an embedded electronic product design and manufacturing company mainly
focusing on the home and industrial automation front. They specialize in innovative
product design and provide embedded solutions for the customer specific requirements.

BDGtronix started in the year 2016 at Bangalore, India, by a professional team headed by
Mr. BL Gowda with his several years of hands on experience in the industry, with the
mission of designing innovative embedded electronic products to solve the real industrial
problems with optimized cost.

They handle electronic system hardware and software design for a wide range of
applications and believe in constant improvement and enhancement of their services by
setting up a separate technical and management team to better serve the customer.

Their product development life cycle provides a structured approach for revisiting,
reviewing and improving the internal effectiveness and efficiency of a product while also
evaluating and improving its value to the customer.

Their products include RF remote control system for lights and fans, remote operated
dental chairs, biometric security systems, integrated automation system which includes
fire alarm sensing and indication and sprinkler control, compound gate control using
remote control / mobile App, CCTV monitoring, water monitoring system for tank/Sump
etc.

Contact information:

Website: www.bdgtronix.com

Email address: hrinfo@bdgtronix.com / bdgtronix@gmail.com

Mobile number: +91 9620799400 /+91 7019842036

Address: #33, 1st cross road, Krishna reddy layout, Bommanahalli, Bangalore-560068

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CHAPTER 2: INTRODUCTION
1. SUMMARY
VTU mandates a compulsory internship of one month for B.E. final year students at a
reputed organisation. This report is a short description of the one-month long internship
carried out at BDGtronix, Bangalore from July 8th 2019 to August 7th 2019. Since the
company is involved in embedded electronic product design and manufacturing, the role
of a trainee embedded product development engineer was assigned to me.

The work was mainly concentrated on the embedded product development life cycle
which includes proof of concept, hardware / component selection, schematic design, PCB
soldering, programming and testing. In addition, a project on IR remote controlled light
bulb was assigned and successfully completed within the stipulated time

The microcontroller of choice was the PIC16F877A, which was chosen due to its
convenience and ease of programming. The code was written and compiled on the
MPLAB IDE and all circuit simulations were carried out in Proteus software. The
schematics were designed on OrCAD and the final proof-of-concept prototype was
soldered on a PCB and tested accordingly. Subsequently, a detailed report of the project
was prepared and submitted to the company.

2. OBJECTIVE AND SCOPE OF THE INTERNSHIP

The objective of this internship was to understand the scope and complexities involved in
any embedded product development and to understand the intricacies of project
management, system design and development and system testing.

At the beginning of the internship, a set of learning goals were formulated that included:

• Understanding the functioning and working of an embedded systems-based start-

up company.
• Checking if this domain of work is a possibility for future interests.
• Applying academic knowledge received, in a practical environment.
• Recognising skills and knowledge necessary to be gained for working in a
professional environment.
• Acquiring experience by working with people who are intimately associated with
the industry.

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Regarding the scope of the internship, in a future where everything is going to be digital,
automatic and connected, the contribution of embedded systems engineers is going to be
tremendous. It is expected that the embedded systems industry will be valued at US$360
billion by the end of 2020. To enter into a career in embedded systems, the major
requirements are good understanding of theory and application of microcontrollers like
PIC, 8051, AVR etc and deep and sound knowledge in programming language C -
especially embedded C. The internship opportunity with BDGtronix which is involved in
embedded product development was a great chance for learning and developing these
skills.
This internship report in broad-spectrum contains four chapters which shall try to explain
the month-long experience at BDGtronix, Bangalore. In the following chapters, a
reflection of the work carried out during the internship period along with the learning
goals achieved are described. Also described in depth is the project on IR remote
controlled light bulb. Finally, a conclusion on the internship experience along with future
scope is given.

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CHAPTER 3: DESCRIPTION OF INTERNSHIP

1. LITERATURE SURVEY

1.1 Embedded System

An embedded system employs a combination of hardware and software to perform a

specific function. Contrast this with a general-purpose computer such as a PC which can
be used for any number of applications. Since embedded systems perform specific tasks,
design engineers can optimize it by reducing the size and cost of the product. Embedded
systems are often mass produced, so the cost savings may be multiplied by millions of
items.

The core of any embedded system is formed by one or several microprocessors or

microcontroller programmed to perform a small number of tasks. The software on an
embedded system is semi-permanent and is called as firmware.

Examples of embedded systems include ATMs, printers, engine controllers, disk drives,
cell phones, TV set top boxes, washing machines, microwave ovens, air conditioners etc.

1.2 Embedded Product Development Life Cycle

Embedded Product Development Life Cycle (EDLC) is an “analysis-design-

implementation” based standard problem solving approach for embedded product
development. In any product development application, the first and foremost step is to
figure out what product needs to be developed (analysis), next you need to figure out a
good approach for building it (design) and last but not least, you need to develop it
(implementation).

EDLC is essential for understanding the scope and complexity of the work involved in
any embedded product development. It defines the interaction and activities among
various groups of a product development sector including project management, system
design and development (hardware, firmware and enclosure design and development),
system testing, release management and quality assurance. The standards imposed by
EDLC on a product development provides uniformity in development approaches.

EDLC has three primary objectives, namely

• Ensure that high quality products are delivered to end user.

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• Risk minimalization and defect prevention in product development through

project management.
• Maximize the productivity.

Figure 1:Embedded Product Development Life Cycle

1.3 Microprocessor (MPU)

A microprocessor is a general purpose digital central processing unit (CPU). Although
popularly known as a computer on a chip, it is in no sense a complete digital computer.
Its design contains an arithmetic and logical unit (ALU), a program counter (PC), stack
pointer (SP), general purpose registers, clock timing circuit and interrupt circuits.

Figure 2: Block Diagram of Microprocessor

1.4 Microcontrollers (MCU)

A microcontroller is a true computer on a chip. Its design incorporates all the features
found in microprocessor and also has the other added features needed to make a complete
computer like RAM, ROM and I/O ports.

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Figure 3: Block Diagram of Microcontroller

1.5 PIC16F877A Microcontroller:

Figure 4: Pin Diagram of PIC16F877A

The PIC microcontroller PIC16F877A is one of the most renowned 8-bit microcontrollers
in the industry. This microcontroller is very convenient to use and the programming of
this controller is also easy (only 35 single word instruction set). It has a total number of
40 pins and there are 33 pins for input and output. One of the main advantages of PIC
controller is that the program can be written/erased as many times as possible because it
incorporates FLASH memory technology.

PIC16F877A finds its applications in a huge number of devices. It is used in remote

sensors, security and safety devices, home automation and many industrial instruments.
The PIC16F877A features 256 bytes of EEPROM data memory which makes it possible
to store some of the data like transmitter codes and receiver frequencies permanently.

Its low cost combined with its advanced features like 2 Comparators, 8 channels of 10-bit
Analog-to-Digital (A/D) converter, 2 capture/compare/PWM functions, synchronous

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serial port that can be configured as either 3-wire Serial Peripheral Interface (SPI) or the
2-wire Inter-Integrated Circuit (I²C) bus and a Universal Asynchronous Receiver
Transmitter (UART) make it ideal for more advanced level A/D applications in
automotive, industrial, appliances and consumer applications.

The maximum current each port can source or sink is around 100 mA. Therefore, current
limit for each GPIO pin of PIC16F877A is 20 mA.

Key Features:

CPU 8-bit

Number of Pins 40

Operating Voltage 4.2 to 5.5V

Number of I/O Pins 33

ADC Module 8 Ch, 10-bit

External Oscillator Up to 20 MHz

Internal Oscillator Nil

Timer Modules 8-bit (2), 16-bit (1)

DAC Module Nil

Comparators 2

Program memory type FLASH

Program memory (KB) 14 KB

Data EEPROM 256 bytes

Communication Protocols UART, SPI, I2C

CPU speed (MIPS) 5 MIPS

Table 1: Key Features of PIC16F877A

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1.6 Programming Model of PIC16F877A

In programming model of PIC16F877A we have different types of registers available and
these registers are used to temporarily store data. The information could be a byte of data
to be processed or an address pointing to the data to be fetched. The majority of registers
in PIC are 8-bit registers.

Figure 5: Register Bank of PIC16F877A

First thing you will notice is that it is split into two - Bank 0 and Bank 1. Bank 1 is used
to control the actual operation of the PIC, for example to tell the PIC which bits of Port A
are input and which are output. Bank 0 is used to manipulate the data. An example is as
follows: Let us say we want to make one bit on Port A high. First, we need to go to Bank
1 to set the particular bit, or pin, on Port A as an output. We then come back to Bank 0
and send a logic 1 (bit 1) to that pin.

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The most common registers in Bank 1 we are going to use are STATUS, TRISA and
TRISB. The first allows us to come back to Bank 0, TRISA allows us to select which pins
on Port A are output and which are input, TRISB allows us to select which pins on Port B
are output and which are input. The SELECT register in Bank 0 allows us to switch to
Bank 1.

STATUS

To change from Bank 0 to Bank 1 we tell the STATUS register. We do this by setting bit
5 of the STATUS register to 1. To switch back to Bank 0, we set bit 5 of the STATUS
register to 0. The STATUS register is located at address 03h.

TRISA and TRISB.

These are located at addresses 85h and 86h respectively. To program a pin to be an output
or an input, we simply send a 0 or a 1 to the relevant bit in the register.

So, on Port A we have 5 pins, and hence 5 bits. If We wanted to set one of the pins to
input, we send a ‘1’ to the relevant bit. If We wanted to set one of the pins to an output,
we set the relevant bit to ‘0’. The bits are arranged in exactly the same way as the pins, in
other words bit 0 is RA0, bit 1 is RA1, bit 2 is RA2 and so on. Let’s take an example. If
We wanted to set RA0, RA3 and RA4 as outputs, and RA1 and RA2 as inputs, we send
this: 00110 (06h).

Port A Pin RA4 RA3 RA2 RA1 RA0

Bit Number 4 3 2 1 0

Binary 0 0 1 1 0

Table 2: PIC16F877A input/output ports configuration

The same goes for TRISB.

PORTA and PORTB

To send one of our output pins high, we simply send a ‘1’ to the corresponding bit in our
PORTA or PORTB register. The same format follows as for the TRISA and TRISB
registers. To read if a pin is high or low on our port pins, we can perform a check to see if
the particular corresponding bit is set to high (1) or set to low (0).

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2. SOFTWARE/HARDWARE TOOLS USAGE

2.1 MPLAB IDE

MPLAB Integrated Development Environment (IDE) is a free,

integrated toolset for the development of embedded applications
employing Microchip’s PIC microcontrollers. MPLAB IDE runs as
a 32-bit application on Microsoft Windows, is easy to use and
includes a host of free software components for fast application
development and super-charged debugging.

Given below are the steps to create and load new projects on MPLAB.

Create Project:
1. Go to Project on the toolbar ► Project Wizard…
2. When a window appears, click Next.
3. Choose the type of device that you want to use and click Next. (choose
PIC16F877A)
4. Select “Simulator” under Hardware tools when asked to select a tool.
5. Open the XC8 plus box, if not already open, and select an installed version of the
XC8 compiler and click Next.
6. Choose a destination where the project you create can be saved and type the
project name. After that, click Next.
7. Add the existing file (source file, header file) to the project by selecting the
directory folder where the files are located and add to the project created. For
source file, it will be *.c file while header file will be *.h file.
8. Click Finish.

Load Project:

1. Go to Programmer ► Select Programmer ► Choose PICkit 3

2. Right click on the project title ► choose Build

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2.2 PICkit 3 In-Circuit Debugger

Figure 6: PICkit3 in-Circuit Debugger

PICkit 3 is a programmer for PIC microcontrollers made by Microchip Technology. They
are used to program and debug microcontrollers, as well as program EEPROM. The
PICkit3 is connected to the design engineer’s PC using a USB interface and can be
connected to the target via a Microchip (RJ-11) debug connector.

2.3 Proteus circuit design and simulation software

Proteus is a simulation and design software developed
by Labcenter Electronics for electrical and electronic
circuit design.

It is a software suite used to draw schematics and

simulate the circuits in real time. The simulation allows
the user access during run time, thus providing real time simulation.

Starting New Design:

1. Open Proteus software and select New design in File menu.
2. A pop-up appears asking to select the template. It is similar to selecting the paper
size while printing. For now, select default or according to the layout size of the
circuit.
3. An untitled design sheet will be opened.
4. To Select components, Click on the component mode button.
5. Click on Pick from Libraries. It shows the categories of components available and
a search option to enter the part name.

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6. Select the components from categories or type the part name in Keywords text
box.
7. The selected components will appear in the devices list. Select the component and
place it in the design sheet by left-click.
8. Place all the required components and route the wires i.e., make connections.
9. After connecting the circuit, click on the play button to run the simulation.

2.4 OrCAD Capture

OrCAD Capture is one of the most widely used schematic
design solutions for the creation and documentation of
electrical circuits. It is one of the most powerful design
environments for taking today’s product creation from concept to production. It is a fast
and intuitive PCB schematic design solution.

2.5 Embedded C Programs (Using Proteus and MPLAB)

1. Blinking LED

Figure 7: Blinking LED schematic

Code:
#include <xc.h>
void main(void)
{
TRISB=0x00; // Set port B pin as output
RB7=1; // LED is ON & in PORT B RB7 is used
return;
}

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2. LED ON/OFF using switch

Figure 8: LED on/off using switch schematic

Code:

#include <xc.h>
void main(void)
{
TRISB=0x00; // Set port B pins as OUTPUT
TRISC=0xFF; // Set port C pins as INPUT
while (1)
{
if (RC7==1) // when switch is pressed
{
RB7=1; // LED is ON (RB7 is connected to RB7 in port B)
}
else // when switch is pressed
{
RB7=0; // LED is OFF
}
}
return;
}

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3. Seven Segment display

Figure 9: Seven Segment Display Schematic

Code:

#include <xc.h>
void delay_ms (int k) // delay generation
{
int i,j;
for(i=0;i<k;i++)
{
for (j=0;j<5; j++);
}
}
int main () {
char seg_code [] ={0xc0,0xf9,0xa4,0xb0,0x99,0x92,0x82,0xf8,0x80,0x90};
// 0xc0=0,0xf9=1,0xa4=2,0xb0=3,0x99=4,0x92=5,0x82=6,0xf8=7,0x80=8,0x99=9
int i;
TRISD = 0x00;
PORTD = 0x00;
while (1)
{
for (i = 0; i <= 9; i++)
{
PORTD = seg_code[i]; //initialize seg_code
delay_ms(1000);
}
}
}

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3. PROJECT ON IR REMOTE CONTROLLED BULB

3.1 Project Overview
Remote Controlled automation uses IR sensors to control home appliances using a
TV/DVD/VCD remote. Home appliances like fan, light, radio, cooler, music system,
home theatres etc can be turned ON/OFF using a remote. Remote Controlled home
automation is expected to work in a range of 10 meters without barriers/walls in between.
The IR rays transmitted by the TV remote control will be received by IR receiver
installed in the circuit. A microcontroller accesses the appliance’s mains and controls the
load thereby controlling it. An LED would display the status of the particular appliance
whether the device is ON or OFF.

The main aim of this system is to use it in existing domestic area for switching the LED
lamp ON/OFF through the conventional switches or the TV remote.

Figure 10: Product Representation

3.1.1 Applications
The main application of this circuit is that we can control any appliance by using a single
remote control. This is very helpful for elderly people as well as for those who are unable
to walk either due to physical disabilities or due to accidents.
Another major use of our project is that we can turn off the operating devices all together
at one shot by just pressing the power button. It is time saving as it is operated by a
remote. It is more secure as there is no direct contact with the appliance.
Main areas of application of this product are,

• Apartments
• Old age homes

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• Commercial Shops
• Hospital wards
• Hostels
• Offices
• Hotels
• Single houses
• Farm houses

3.1.2 Features
• Universal remote control
• Compact
• Low cost

3.2 Hardware Implementation

3.2.1 Block Diagram

Figure 11: Block Diagram

This circuit is designed to control LED bulb using any IR remote. The remote transmits
infrared signal which is received by the IR sensor interfaced to the PIC microcontroller.
The system operates the LED lamp on the command transmitted from the remote. The
program on the microcontroller is written to generate output based on the input signal to
operate a relay through a relay driver.

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3.2.2 Components required

COMPONENT QUANTITY
PIC16F877A microcontroller 1
TSOP58456 IR sensor 1
TV/DVD/VCD remote 1
Relay 12 Volt 1
Bulb with holder 1
Voltage Regulator 7805 1
Voltage Regulator 7812 1
20 MHz crystal 1
Transistor BC848 1
LED 1
Diode 1N4007 1
Push button switch 1
Resistors (4.7k,1k,270,10k) 6
Capacitors (0.1uF,10uF,22pF,100nF,2200uF) 7
Transformer 12-0-12 1

Table 3: Components Required

3.2.3 Wiring Diagram

Figure 12: Wiring Diagram

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Working:

Here we are giving 230V AC power supply. The AC voltage will go to the primary
winding of the step down transformer, then the output of the transformer will be given to
the bridge rectifier which will convert the AC voltage into DC voltage, after which the
DC voltage will be applied to the filter capacitor and then the output of capacitor will be
ripple free DC voltage. That output voltage is applied to the 7805 voltage regulator which
will give us constant +5V DC voltage for microcontroller and 7812 voltage regulator
which gives us constant +12V DC for relay. The outputs of the sensor interfacing circuits
and switch will be given to the microcontroller as inputs i.e. RD0 and RD7 and the
microcontroller will give the output to pin RB1.

3.2.4 SCHEMATIC of the OrCAD

Figure 13: Power Supply Schematic

Circuit working:
The PIC microcontroller operates at +5V and the Relays operate at +12V, hence we use a
transformer to step down the 230V AC and rectify it using a bridge rectifier. This
rectified DC voltage is then regulated to +12V and +5V by using the regulator ICs 7812
and 7805 respectively.

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Figure 14: Main Circuit Schematic

Circuit working:
The working of this circuit is fairly simple to understand. When a button is pressed on the
IR Remote it sends a sequence of pulses using 56 KHz modulating frequency. These
pulses are received by the TSOP58456 IR sensor and then read by the Controller. The
Controller then performs a relative operation by triggering the relay and the result is
indicated by on-board LED.

IR sensor is an electronic device which is used to sense heat & objects. It works with the
sensing of IR radiations and variation in heat in its nearby surroundings. IR sensors are
classified into two types such as photo IR sensor and thermal IR sensor.

A thermal infrared sensor detects the change of heat from its nearby objects. The photo IR
sensor uses a photo diode to sense IR radiations.

To trigger the relay, we make use of transistors like BC848 which can act as an electronic
switch to turn ON/OFF the relay based on the signal from the PIC microcontroller.

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3.2.5 IR Receiver Module: TSOP58456

Features:
• Improved immunity against HF and RF noise
• Low supply current
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against optical noise Figure 15: TSOP58456 IR Receiver
• Insensitive to supply voltage ripple and noise

Application: Remote control

Best choice for: (1) RC-5 (2) RC-6 (3) Panasonic (4) NEC (5) Sharp (6) r-step (7)
Thomson RCA

Carrier frequency: 38 KHz

Minimum burst length: 10 cycles/burst

Pins: 1 = OUT, 2 = GND, 3 = VS

Typical characteristics:

Figure 16: Characteristics of IR transmission

The infrared transmission protocol uses pulse distance encoding of the bits. Each pulse is
a 562.5µs long with carrier frequency of 38 KHz. Logic bits are transmitted as follows:

Logic 0: 562.5µs pulse burst followed by a 562.5µs space, with a total transmit time of
1125µs (562.5 x 2).
Logic 1: 562.5µs pulse burst followed by a 1687.5µs (562.5 x 3) space, with a total
transmit time of 2250µs

The complete IR transmission is started by 9 ms burst followed by 4.5ms space. Here

PIC16F877A microcontroller is used to decode the pulse sent by IR remote controls.
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3.2.6 Relay

Figure 17: Relay pin diagram

A relay is an electro mechanical switch, it consists of a coil. When a small current flow
through the coil, magnetic field is induced that causes the switch to move, to close or
open the electrical connection. Typically, a Relay is used to control High voltage (AC or
DC) circuit using small DC voltage circuit without any direct electrical connection
between them. It means, high voltage circuit and low DC voltage circuit are magnetically
linked but electrically separated.

3.2.7 Output driver circuit:

Figure 18: Output driver circuit

Relay cannot be driven directly from the microcontroller pin because microcontroller
I/O pin is only able to support up to max 20mA of current and high fly back voltage
generated from the inductive load can damage the microcontroller I/O pins, So transistor
BC848 is used to drive the relay and transistor is driven from the microcontroller output
pin based the logic built in the program.

Relay coil current requirement:

Relay part number Leone, SC10-SDC12V
Relay coil resistance 400 ohms
Relay coil operating voltage 12V
Relay coil current requirement I =V/R =5V/400 ohm= 12.5mA
Table 4: Relay coil current requirement

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3.2.8 Freewheel diode or Fly back diodes:

A Fly back diode is also called as freewheeling diode. Here catch diode
1N4007 is used to eliminate fly back, when the abrupt voltage spike is witnessed across
the inductive load when the supply current abruptly reduced. It helps the circuit from
getting damaged.

3.3 Software Implementation

Figure 19: Flowchart

The program flow is as follows- The controller waits for the arrival of IR pulses from
remote control. If the set of pulses are sensed by IR sensor, controller drives relay module
which in turn switches on the bulb. Similarly, another set of pulses will drive the relay to
switch off the bulb.

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3.4 Testing and Results

Figure 20: Lamp OFF

Figure 21: Lamp ON after button pressed

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Figure 22: Lamp ON after remote-control button pressed

The above figures show the testing and results of the project. The hardware and software
implementations were successfully completed and the prototype was constructed. It was
tested for errors and debugged accordingly.

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CHAPTER 4: CONCLUSION AND FUTURE SCOPE

1. Conclusion

The internship at BDGtronix, Bangalore provided an insight on embedded product

development and recent trends in the industry. The learning goals initially set were met.
This internship also helped me in my overall personality development by my interaction
with many trainees and the staff members. It provided industrial exposure and working
experience with established professionals.

1.1 Key Learnings

• Basics of Embedded System
• Medium Level circuit designing involving PIC microcontroller
• Circuit simulation and fault diagnosis using proteus software
• PCB designing and embedded C programming
• Introduction to various electronic components

1.2 Learning Goals Achieved

• Enhancement in technical knowledge

• Work experience with professionals in the industry
• Industrial Exposure

2. Future Scope

Remote controlled home automation has a vast and great scope with limitless
applications in this technology driven world. The system can be made more efficient
and handier by making it applicable for varied range of devices. The basic motive of the
system is to access the home appliances smartly and to reduce human efforts. This
system can be enhanced by using a radio frequency technology like Wi-Fi where the
operational range will be independent of line of sight distance with IR type of remote
control.

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BIBLIOGRAPHY

1. All material & facts about the PIC16F877A: PIC16F87XA Data Sheet by Microchip
Technology, Inc. 2003
2. MPLAB X IDE User’s Guide by Microchip Technology, Inc. 2015
3. John B. Peatman, Design with PIC microcontrollers, Pearson, 2002
4. Vaibhava Mishra, Sumegha Sahu, Infrared Remote-Control Switch, International
Journal of advanced Research in Computer Science and Software Engineering, 2017
5. P. van der Linden; Expert C Programming, Prentice Hall, 1994

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WEEKLY REPORT
WEEK 1
During the first week, following a detailed orientation about the company’s line of work
and its internship program which basically summarized the embedded product
development life cycle, the interns were divided into groups and assigned projects based
on different products that the company wanted to develop. It was here that the project on
developing an IR remote controlled bulb was assigned. This was followed by a survey
into the already existing products in the market and the target demographic for whom the
product would be developed for. The requirements of our product were listed which
included functional requirements, hardware requirements, electrical requirements,
environmental requirements and mechanical requirements. Keeping the requirements in
mind, a block diagram and wiring diagram were developed and drawn on a KG cardboard
sheet.

WEEK 2
The second week was spent on brushing up on the basic concepts of electronic circuits
which included KVL, KCL, transformer basics, BJTs, MOSFETs, voltage regulators,
filters, op-amps etc. and embedded systems which included microprocessors and
microcontrollers. A seminar on the software design life cycle was conducted which
included defining the software requirements, requirement analysis, design, coding,
testing, deployment and maintenance. The next few days were spent on revising C
programming (datatypes, operators, loops, functions & pointers) and practicing basic C
programs and introduction to embedded C. The microcontroller i.e. PIC16F877A was
finalised and its datasheet and programming model were studied in depth. Proteus circuit
design and simulation software was installed on our systems and schematics for a number
of circuits were created and simulated.

WEEK 3
The circuits that were simulated were verified by constructing them on the bread board.
MPLAB IDE was installed and a number of programs were written and compiled. The
code was then dumped to the microcontroller using PICKit 3 and verified, A seminar was
conducted on component selection by exploring the websites of distributers like DigiKey
and Mouser which dealt with applying various filters for part search and selection. There
was also a session on EMI/EMC consideration for a product and the various international
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standards that an electronic product must adhere to before being introduced into the
market. Appropriate components like transistors, sensors, relay etc. for our project were
selected and their characteristics were studied by referring to their data sheets. A
functional circuit diagram was constructed and the circuit was soldered onto the PCB
board.

WEEK 4
A seminar was conducted on PCB manufacturing, assembly and testing which was highly
informative. Then, the flowchart for our project was constructed. The code for the
working of our project was written and debugged several times on MPLAB IDE. It was
dumped into the microcontroller and the circuit was tested and the results were verified.
We had another seminar on VLSI design flow which is the sequence of processes
involved in the making of an integrated circuit. We were shown how to create a detailed
database for our projects with separate sections like management, technical, testing and
deliveries which gave us an idea of how projects are managed in the industry. The block
diagram, wiring diagram and circuit diagrams were prepared using OrCAD. Finally, a
project report had to be prepared and submitted to the company.

Dept. of ECE, JIT 2019-20 Page 28