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Bridgeswitch Family Datasheet PDF
Bridgeswitch Family Datasheet PDF
Bridgeswitch Family Datasheet PDF
• Internal dual level thermal overload protection Figure 1. Typical 3-Phase Inverter Schematic (BRD126X).
• Self-configuring system level monitoring input
• Four level DC bus undervoltage
• DC bus overvoltage
• System temperature
• Adaptive dead time
• Simultaneous conduction lockout protection
Status Interface
• Bi-directional bussed open Drain single wire interface Figure 2. InSOP-24C Package (Top and Bottom Sides).
• Reports status updates to system MCU
• Successful power-up
• Internal over-current or temperature faults Product Family
• System level faults
• Includes device identification FREDFET DC Continuous Phase
Product 3
• Status query through system MCU Output Current1 RMS Current2
• Device fault reset through system MCU BRD1160C /
1.0 A 0.22 A
BRD1260C
Applications
• 2- or 3-phase high-voltage PM and BLDC motor drives BRD1161C /
1.7 A 0.50 A
• Up to 400 W typical inverter output power BRD1261C
• Appliances including dish washers and refrigerators BRD1163C /
3.0 A 0.75 A
• Condenser fans in high efficiency air conditioners BRD1263C
Description BRD1165C /
5.5 A 1.00 A
BRD1265C
The BridgeSwitch™ family of integrated half-bridges dramatically BRD1167C /
simplifies the development and production of high-voltage inverter 11.5 A 1.33 A
BRD1267C
driven 2- or 3-phase PM or BLDC motor drives. It incorporates two
Table 1. Product Family.
high-voltage N-channel power FREDFETs with low and high-side drivers Notes:
in a single small-outline package. The internal power FREDFETs offer 1. Continuous DC output current per FREDFET, calculated at 25 °C case and
ultra-soft and ultrafast diodes ideally suited for hard switched inverter 125 °C junction temperature. Normally limited by internal circuitry
2. Continuous phase RMS current, internal self-supply, 340 V bus, trapezoidal
drives. Both drivers are self-supplied eliminating the need for an
commutation with 12 kHz high-side PWM, PCB heat sinking with 50 °C case
external auxiliary power supply. BridgeSwitch provides a unique temperature rise.
instantaneous phase current output signal simplifying implementation of 3. Package: InSOP-24C.
sensor-less control schemes. The low-profile, compact footprint surface
cycle current limit for both FREDFETs and two level thermal overload
mount package offers extended creepage distances and allows heat
protection. External system level monitoring includes DC bus sensing
sinking of both power FREDFETs through the printed circuit board.
with four undervoltage levels and one overvoltage level as well as
BridgeSwitch offers internal fault protection functions and external driving external sensors such as an NTC. The bi-directional bussed
system level monitoring. Internal fault protection includes cycle-by- single wire status interface reports observed status changes.
BPH REGULATOR HD
14.5 V
DIGITAL
ANALOG BUILDING BLOCK:
PROCESS FOR HS SYSTEM
VOLTAGE SUPPLY, REFERENCE VOLTAGE,
TESTING AND COMMUNICATION
REFERENCE CURRENT, CLK
TRIM
XH CURRENT LIMIT
PROGRAM
SenseFET
Power
GATE LOGIC FREDFET
CURRENT DRIVER
LIMIT
ISNS
HS RECEIVER
HB
BPL
INH
INH/INL ANALOG BUILDING BLOCK:
INL CONTROL VOLTAGE SUPPLY, REFERENCE VOLTAGE,
REFERENCE CURRENT, CLK
ID CHIP
CONFIGURATION
DIGITAL FAULT
COMMUNICATION FAULT
LOGIC
SM LINE AND
TEMPERATURE
MONITOR
XL SenseFET
CURRENT LIMIT Power
PROGRAM GATE LOGIC FREDFET
CURRENT DRIVER
LIMIT
ISNS
SG
LS
PI-8296a-120117
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BridgeSwitch
BPH REGULATOR HD
14.5 V
DIGITAL
ANALOG BUILDING BLOCK:
PROCESS FOR HS SYSTEM
VOLTAGE SUPPLY, REFERENCE VOLTAGE,
TESTING AND COMMUNICATION
REFERENCE CURRENT, CLK
TRIM
XH CURRENT LIMIT
PROGRAM
SenseFET
Power
GATE LOGIC FREDFET
CURRENT DRIVER
LIMIT
ISNS
HS RECEIVER
HB
BPL
INH
INH/INL ANALOG BUILDING BLOCK:
INL CONTROL VOLTAGE SUPPLY, REFERENCE VOLTAGE,
REFERENCE CURRENT, CLK
FAULT
ID CHIP
CONFIGURATION
DIGITAL IPH
COMMUNICATION FAULT
LOGIC
GAIN
SM LINE AND
TEMPERATURE
MONITOR
XL SenseFET
CURRENT LIMIT Power
PROGRAM GATE LOGIC FREDFET
CURRENT DRIVER
LIMIT
ISNS
SG
LS
PI-8296-091917
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BridgeSwitch
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BridgeSwitch
BridgeSwitch Functional Description RSL and RSH in Figure 6). External supply voltage VSUP is greater than
bypass shunt regulator voltage VBPX(SHUNT) plus the voltage drop of
BridgeSwitch combines two high-voltage power FREDFETs, gate bootstrap diode DSH. A typical value is VSUP = 17 V. Resistors RSL and
drivers and controllers into a single package. The FREDFETs are RSH limit the external supply current to less than 12 mA (1.5 - 2 mA
connected in a half-bridge configuration where their diode structure recommended). Shorting BPL pins or BPH pins from separate devices
(ultra-soft and ultra-fast recovery) makes them ideal for hard- directly together is not recommended.
switched inverter-based motor drivers.
BYPASS LOW-SIDE Pin and HIGH-SIDE Pin
To reduce external components, the drive controllers feature integrated Undervoltage Threshold
high-voltage current sources, allowing them to draw current directly The BYPASS LOW-SIDE pin and BYPASS HIGH-SIDE pin undervoltage
from the high-voltage DC Bus. The high-side controller provides circuitries disable the respective power FREDFET when either the
high-side status updates to the low-side controller which generates BYPASS LOW-SIDE pin voltage or the BYPASS HIGH-SIDE pin voltage
an instantaneous phase-current output signal (BRD126X). This drops below VBPL-VBPL(HYST) or VBPH-VBPH(HYST), respectively, in steady-state
unique capability allows the implementation of a sensor-less operation. Once either the BYPASS LOW-SIDE pin voltage or the
motor-control scheme. The controllers also ensure that the FREDFET BYPASS HIGH-SIDE pin voltage fall below this threshold, it must rise
turn-off is faster than turn-on resulting in an optimal balance back up to VBPL or VBPH, respectively to enable power FREDFET switching.
between thermal performance and EMI.
BYPASS LOW-SIDE Pin and HIGH-SIDE Pins
BridgeSwitch offers integrated fault protection and system level Capacitor Selection
monitoring via a bi-directional bussed single-wire status interface. Capacitors connected to the BYPASS LOW-SIDE pin and BYPASS
Internal fault protection includes cycle-by-cycle current limit for both HIGH-SIDE pin supply bias current for the low-side and the high-side
FREDFETs as well as two-level thermal overload protection. controller and deliver the required Gate charge for turning on the
BridgeSwitch offers sophisticated DC-bus sensing, providing four low-side or the high-side power FREDFET. The BYPASS HIGH-SIDE pin
undervoltage levels and one overvoltage level, and can also support capacitor supplies the high-side controller bias current over a time
external sensors such as an NTC. Figure 3 shows the functional block interval which is a function of the high-side commutation duty ratio and
diagram of the device along with key features. PWM frequency. The recommended maximum voltage ripple at the
BYPASS HIGH-SIDE pin capacitor over this time interval is 250 mV. The
BYPASS LOW-SIDE Pin and HIGH-SIDE Pin Regulator
minimum required capacitance value for both bypass low-side and
The BYPASS LOW-SIDE pin and the BYPASS HIGH-SIDE pin have
bypass high-side is 0.33 mF. The recommended bypass low-side
internal regulators that charge the BYPASS LOW-SIDE pin capacitor
capacitance is 1 mF.
and the BYPASS HIGH-SIDE pin capacitor to VBPL and VBPH, respec-
tively. A current source connected to HIGH-SIDE DRAIN charges the Given application operating conditions determine the required bypass
BYPASS LOW-SIDE capacitor. Another current source connected to high-side capacitance to keep ripple voltage below 250 mV. Figure 7
HIGH-SIDE DRAIN charges the BYPASS HIGH-SIDE capacitor depicts the minimum recommended BYPASS HIGH-SIDE pin capaci-
whenever the low-side power FREDFET turns on. Both current sources tance as function of high-side commutation duty ratio DHS and PWM
start charging once the HD pin voltage reaches VHD(START) (min. 50 V). frequency.
The BYPASS LOW-SIDE and the BYPASS HIGH-SIDE pins are the
internal supply voltage nodes for the low-side and the high-side 100
PI-8309-080918
f(PWM)
controllers and Gate drivers. When the low-side or the high-side 100
power FREDFETs are on, the device operates from the energy stored 500
in the BYPASS LOW-SIDE pin capacitor or the BYPASS HIGH-SIDE pin 1000
6000
capacitor, respectively. 10000
10
BPH Pin Capacitance (µF)
16000
In addition, there are shunt regulators clamping the BYPASS LOW-SIDE 20000
pin to VBPL(SHUNT) and the BYPASS HIGH-SIDE pin to VBPH(SHUNT) when
current is provided to the BYPASS LOW-SIDE pin and the BYPASS
HIGH-SIDE pin from an external DC source through resistors (see
1
HV Bus
HD 0.1
BPH
CBPH
RSH HB
DSH
BPL 0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
RSL CBPL
SG LS Maximum High-Side Commutation Duty Ratio DHS(MAX)
VSUP +
-
Figure 7. BYPASS HIGH-SIDE Pin Capacitance vs. High-Side Commutation
Duty Ratio and PWM Frequency.
PI-8313-110518
Note that multilayer chip capacitors (MLCC) can exhibit a significant
DC bias characteristic. Selecting a BYPASS HIGH-SIDE pin capacitor
Figure 6. External BPL Pin and BPH Pin Power Supply Example.
(according to Figure 7) needs to take the possible capacitance
reduction into account when biasing at VBPH. Refer to the respective
capacitor data sheet for details.
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BridgeSwitch
Minimum Low-Side Commutation Duty Ratio DLS(MIN)
PI-8310-080918
0.085
tBPLC
VHD
0.080
VBPL tINLS
0.075
VINL
f(PWM)
20000
16000
0.070 10000
6000
1000 VHB
500
100
0.065
0.1 1 10 100
BPH Pin Capacitance (µF)
VBPH
Figure 8. Minimum Low-Side Commutation Duty Ratio vs. BYPASS HIGH-SIDE
Pin Capacitance and Low-Side PWM Frequency to Ensure Sufficient
High-Side Self-Supply Current (High-Side Commutation Duty Ratio
≤ 0.95).
VFAULT
The BYPASS HIGH-SIDE pin capacitor recharges every time the
low-side power FREDFET turns on. To ensure sufficient high-side
self-supply current, the low-side power FREDFET on-time, as a
function of chosen BYPASS HIGH-SIDE capacitance, low-side
commutation duty ratio DLS and PWM frequency, should meet the t0 t1 t2 t3 t4
minimum low-side commutation duty ratio requirement DLS(MIN) shown
in Figure 8. Note the maximum recommended voltage ripple of PI-8297-120117
250 mV across the bypass high-side capacitor restricts the choice of
possible capacitance values at lower PWM frequencies. Figure 9. Recommended Power-Up Sequence with Self-supplied Operation.
• Internal current source starts charging BPL pin capacitor once HD pin voltage reaches VHD(START)
t1
• System MCU may start setting low-side power FREDFET control signal INL to high
• BPH pin voltage reaches VBPH with respect to HB pin (typically 14.5 V).
t3 • Device starts communicating successful power-up through FAULT pin.
Note: The device does not send a status update if the internal power-up sequence did not complete successfully.
• BridgeSwitch is ready for state operation (indicated by communicated status update starting at time point t3)
t4
• System MCU turns off low-side power FREDFET
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BridgeSwitch
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BridgeSwitch
tDLH tDHL
(ON)
HS GATE LS GATE (ON)
50% 50%
DRIVE (OFF) DRIVE (OFF)
tDLH
(ON)
HS GATE 50%
DRIVE (OFF)
a) b)
PI-8299-091917
Figure 11. Adaptive Dead Time a) INL and /INH Inputs Tied Together b) INL and /INH Inputs Separate.
PI-8300b-051519
The BridgeSwitch high-side controller provides status updates to the FREDFET
low-side controller. The status update communicates triggered device Switching Disabled
level protection such as high-side power FREDFET over current or 1.2
low-side power FREDFET over-temperature warning or shutdown. It
also includes detected device faults such as XH pin short or open circuit 1.1
Current Limit Normalized to ILIM(DEF)
The recommended operating range for the actual set current limit A detected short-circuit at the XL pin will eventually cause the HS
level is 42% to 100% of ILIM(DEF) and a resistance range for R XL or R XH FREDFET switching to cease as well because the BPH pin capacitor is
of 44.2 kΩ to 133 kΩ. only re-charged when the LS FREDFET turns on. The normalized
current limit level continues to fall below 42% down to 0% of ILIM(DEF) for
FREDFET switching is disabled for R XL or R XH values smaller than 35 kΩ R XL or R XH values greater than 133 kΩ. This provides protection against
and the device reports either a LS driver not ready or a HS driver not possible XL pin or XH pin open circuit faults where the effective current
ready status update through the FAULT pin (refer to Table 4). This limit threshold is 0. However, below 42% the specified current limit
prevents inverter malfunction in case the programming resistor is level tolerance is not guaranteed.
accidentally short-circuited. The device continues to accept LS
FREDFET turn-on signals in case it detects a short-circuit at the XH pin. Adding capacitors to the XL pin or XH pin is not recommended.
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BridgeSwitch
Device Over-Temperature Protection The Phase Current Output Gain gIPH and the resistor RIPH connected to
BridgeSwitch devices feature an integrated dual level thermal overload the PHASE CURRENT OUTPUT determine the voltage amplitude VIPH at
protection. The device monitors the temperature of the low-side power a given phase current IPHASE:
FREDFET every time it turns on. It will send a status update through
the STATUS COMMUNICATION pin as soon as it reaches the lower V IPH = R IPH × IPHAS E × gIPH
Device Warning Temperature level TWA (see Table 4 for details). The Maximum permissible voltage amplitude of VIPH is 3.0 V.
device disables FREDFET switching permanently once the FREDFET
External Current Sensing
temperature exceeds the Device Shutdown Temperature threshold TSD
BRD116X devices support discrete low-side FREDFET current sensing
to prevent device damage. Additionally it will report the over-tempera-
through an external current sense resistor in series with the LS pin.
ture fault through the FAULT pin. System level monitoring through the
Figure 14 depicts one possible implementation example.
SYSTEM MONITOR pin continues and the device will report any
additionally occurring status changes through the STATUS COMMUNICA- Voltage VSHUNT is a direct representation of the motor winding current
TION pin. The system MCU can re-enable FREDFET switching by IMOTOR. Resistor R1 and R2 set the gain of external amplifier U1.
sending the fault latch reset command through the FAULT bus (see Resistor R3, C1, C2, and C3 provide noise filtering. Resistor R4 adds
Table 7 for details). Alternatively operation may resume after a full a DC offset VOFFSET to the amplifier U1 output signal VOP.
power-up sequence initiated by the system MCU.
Phase Current Information Output
BridgeSwitch BRD126X devices feature instantaneous motor winding
phase current information through a resistor connected to the PHASE HD
CURRENT OUTPUT pin. The voltage across the small signal resistor is
a direct representation of the low-side power FREDFET Drain to Source
channel current. The system MCU can digitize this voltage and use it HB
for instance as an input for a chosen motor control algorithm. The vOFFSET
device supports either independent phase current information through IMOTOR
individual IPH pin resistors or a composite phase current signal through R4
SG LS
interconnected IPH pins with a single resistor as shown in Figure 13.
R3 U1
+
R1
VSHUNT
System µC C3 C2 VOP
RSHUNT
R2
C1
IPH IPH IPH
HB 1 HB 2 HB 3 PI-8565-120417
RIPH1 RIPH2 RIPH3
Figure 14. External Current Sense Example Circuit (BRD116X).
SG SG SG
R1 V × R 3 + IMOTOR × R SHUNT × R 4
V OP = a 1 + R 2 k OFFSET
a)
R3 + R 4
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BridgeSwitch
In case the SM pin current exceeds IOV for at least tD(OV) (typically 80 µs),
High-Voltage BridgeSwitch terminates the current low-side or high-side power
Bus FREDFET on-time and reports the fault to the system MCU through the
FAULT pin. It ignores any subsequent FREDFET turn-on signals
received at either INL or /INH until the SM pin current has dropped by
at least IOV(HYST) for the duration of tD(OV). The FAULT pin reports a status
RHV1 update once the high-voltage bus overvoltage condition has cleared.
The system MCU may decide to stop sending turn-on signals to other
BridgeSwitch devices in the inverter until the bus OV fault condition has
SM
Bus tD(OV) cleared and the bus sensing device provided a status update accord-
UV/OV FAULT ingly. A full power-up sequence is recommended after the bus OV fault
Sense Logic clears. High-side BYPASS capacitors may have discharged due to the
tD(UV) disabled low-side FREDFET switching during the bus OV fault. Table 3
lists exemplary high-voltage bus monitoring thresholds with three
different sensing resistor RHV1 values.
SG PI-8302-040517
6 MΩ 7 MΩ 8 MΩ
Sensing Resistor R HV1
Figure 15. High-Voltage Bus Monitoring with SYSTEM MONITOR Pin. Bus Voltage UV or OV Threshold
IOV (typically 60 µA) 362 V 422 V 482 V
The bus voltage sensing circuitry has five distinct current thresholds as
shown in Figure 16. Thresholds IUV55, IUV70, IUV85, and IUV100 are used to IUV100 (typically 35 µA) 212 V 247 V 282 V
detect high-voltage bus undervoltage conditions. Threshold IOV is used
to detect a high-voltage bus overvoltage condition. The device reports IUV85 (typically 30 µA) 182 V 212 V 242 V
a high-voltage bus fault through the STATUS COMMUNICATION pin IUV70 (typically 25 µA) 152 V 177 V 202 V
anytime the current into the SM pin either drops below one of the four
undervoltage thresholds or if it exceeds the overvoltage threshold (see IUV55 (typically 20 µA) 122 V 142 V 162 V
Table 4 for details).
Table 3. Effective High-Voltage Bus Monitoring Thresholds.
Using multiple sense resistors with different values on more than one
device increases the bus voltage sensing granularity further. Overvolt-
age protection can be disabled by limiting the current into the SM pin to
less than the IOV threshold through Zener diode VR1 and resistor RHV2 as
shown in Figure 18. Bus undervoltage sensing remains active in this
configuration.
IOV(HYST) Adding a small capacitor (maximum 100 pF) to the SM pin can improve
bus monitoring accuracy in noisy environments.
ISM
System Level Temperature Monitoring
I OV
An undervoltage condition has to be present for at least tD(UV) (typically Current source ITM (typically 96 µA) periodically injects a current into the
40 ms) before it is reported to the system MCU. The device also NTC thermistor RNTC. Its resistance falls with the temperature rising.
communicates if a given undervoltage condition clears for at least tD(UV). Once the voltage level at the SM pin drops below V TH(TM) (typically 1.2 V),
the detected system level over-temperature fault is communicated
Note, during a bus brown-out condition, the device will report for through the FAULT-pin after delay timer tD(TM) expires (see Table 4 for
instance a UV 70% status update if the bus voltage falls below 177 V for details). The resistance of thermistor RNTC(TSYS) at the desired system
at least tD(UV) with a 7 MW sensing resistance (refer to Tables 3 and 4). over-temperature threshold TSYS determines R2:
If in this example the bus voltage recovers and rises above 177 V for at
least tD(UV), the UV 70% condition clears and the device will report a UV R 2 = 12.5 k Ω – R NTC (T SYS )
85% status update.
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BridgeSwitch
BPL Vz > 50 V
recommended
for VR1
ITM
STM
RHV1
SM
tD(TM) FAULT HD
+
Logic
-t RHV2
O
RNTC VTH(TM)
SM
VR1
R2 SG LS
SG
PI-8304-040517 PI-8312-040517
Figure 17. External Component Thermal Monitoring with SYSTEM MONITOR Pin. Figure 18. High-Voltage Bus Monitoring with Overvoltage Protection Disabled.
RUP
VUP
GND ID SG ID SG ID SG
PI-8305-040517
Figure 19. Single Wire Status Communication Bus with Device ID Programming.
Status Communication Bus of multiple fault conditions to the system MCU. Grouping status
BridgeSwitch communicates status updates, including device or system conditions also allows reporting if a given fault condition has cleared.
level faults, to the system MCU through its open Drain FAULT pin. All Cleared fault reporting applies to system level faults (bits 0, 1, and 2)
FAULT pins connect to a single bus minimizing the number of pins and to low-side FREDFET thermal warning and loss if internal
occupied at the system MCU as shown Figure 19. The bus is pulled up communication (bits 3 and 4). The status register entry in the
to the system supply voltage through pull-up resistance RUP. The bottom row (7-bit word “000 00 0 0”) encodes Device Ready status
minimum pull-up resistance RUP the STATUS COMMUNICATION pin can and is used to communicate a successful power-up sequence. The
drive is 2 kΩ for VUP = 3.3 V or VUP = 5 V. Pull-up resistance RUP should device also sends it to acknowledge a status request sent by the
not exceed 100 kΩ. system MCU in case no fault condition is present at the time (see
Table 7 for details). The parity bit is generated using odd parity.
Status Word
BridgeSwitch uses a 7-bit word followed by a parity bit to report a Table 5 lists examples of possible status update codes the device may
status update (refer to Figure 21 for the timing diagram). Table 4 communicate to the system MCU and the resulting transmit time for
summarizes how various conditions are encoded. The 7-bit word the respective status update. Transmission times range from 290 µs
consists of five blocks with status changes grouped together that to 470 µs.
cannot occur at the same time. This enables simultaneous reporting
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BridgeSwitch
Transmit Time
Fault 7-Bit Word Parity Bit
tTRANSMIT1
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BridgeSwitch
Device ID tID ID Pin Connection Figure 20 summarizes the status communication flowchart for all
three cases listed above.
1 40 µs Connected to BPL pin
2 60 µs Floating Besides a status query, the system micro-controller can also send a
command to reset the status register (see Table 7 and steps 16 and 17
3 80 µs Connected to SG pin in Figure 20). A power-up sequence is recommended after sending the
System MCU 160 µs n/a reset command (refer to Figure 9).
no yes
yes
14. VFAULT<VFAL
4. Send Device ID for tSYSID? no no
5. Release
(FAULT Pin<VFAL) FAULT Pin
for tID
yes
15. VFAULT >VFAH?
yes
PI-8306-050418
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BridgeSwitch
Figure 21 depicts the bit stream timing diagram BridgeSwitch uses for a The device communicates each detected status update only once. It
status update communication. The two logic states are encoded with also reports a status change for all system level faults to the system
two different voltage signal high-time periods at the STATUS COMMUNI- MCU. This includes DC bus undervoltage and overvoltage conditions
CATION pin followed by a low-time period tLO (typically 10 µs). A logic and external temperature monitor faults. It also reports all status level
“1” is encoded with a period tBIT1 (typically 40 µs) and a logic “0” is changes for device internal faults with the exception of the LS power
encoded with a period tBIT0 (typically 10 µs). FREDFET thermal shutdown fault (a cleared LS power FREDFET thermal
warning is reported).
Each time BridgeSwitch detects a status change, it loads the actual
FAULT register into the Transmit register (see step 2 in Figure 20) and Status Query and Fault Latch Reset
proceeds with a status update transmission. The device monitors the STATUS COMMUNICATION pin for possible
commands sent by the system MCU once it is mission mode. This
The device starts a status update transmission only if the bus has could be a status update inquiry (see step 15 in Figure 20) by the
been idle for at least the Steady State Time Period tSS (typically 80 µs) MCU through it pulling the bus low for a period of tSYSID (typically 160 µs).
to ensure that no other device uses the bus already (see step 3 in Or it could be a command to reset the device status register including
Figure 20). over-temperature shutdown latch and to enter the power-up
A status update transmission starts always with bus arbitration initiated sequence mode (see step 17 in Figure 20) by pulling the FAULT bus
by the communicating device. It pulls the FAULT pin low for its assigned low for a period of tLARES (2x tSYSID = typically 320 µs). Note, a
Device ID Time Period tID (refer to Table 6), releases the pin and then power-up sequence (refer to Figure 9) is recommended after the MCU
verifies that the communication bus stays high (see steps 4 to 6 in has sent a latch reset command. This ensures that the bypass
Figure 20). If this is the case, the device has won bus arbitration and high-side voltage is at the nominal level before switching resumes.
can proceed with transmitting its status update (see steps 7 to 10 in Table 7 summarizes available system MCU commands.
Figure 20). If the bus stays low after sending its ID, another device
started a transmission attempt (or bus arbitration) at the same time. Bus Pulldown Period Command
In this case the device will make another communication attempt by tSYSID Status query
proceeding back to step 3 in Figure 20. After each completed transmis-
sion the device will idle for tIDLE (typically 2 × tSS = 160 µs) before Status register including
starting a new communication. This enables other devices on the bus tLARES (2x tSYSID) over-temperature latch reset and
to communicate a possible occurred status change or to respond to a power-up sequence mode
status inquiry sent by the system MCU. Table 7. System MCU Commands.
System
Clock
FAULT 0 1 0 0 0 0 0 0
Bus
PI-8307-032917
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BridgeSwitch
Application Example system microcontroller board and this inverter. This design demon-
A High Efficiency, 300 W, Three-Phase Inverter strates high efficiency across a wide load range and does not require
a low voltage supply thanks to the self-biased operation of the
The schematic shown in Figure 22 is a 3-phase inverter using three BRD1265C devices. The inverter offers a variety of device fault
BRD1265C devices. The design is capable of driving a high-voltage, protections and system level telemetry. Fault protection on a device
3-phase brushless DC (BLDC) motor from a rectified AC input voltage. level includes low-side and high-side FREDFET cycle-by-cycle current
The design is rated for a continuous input power of 300 W and 1 ARMS limit protection and a two level thermal overload warning and
phase current at a DC input voltage of 340 V and 12 kHz PWM protection. System level telemetry includes high-voltage DC bus
switching frequency without requiring a heat sink thanks to its full monitoring and system level thermal monitoring. A simple, single
load efficiency of greater than 98%. The inverter design supports wire interface communicates all observed status updates to the
various motor control schemes through proper interface between a system microcontroller.
F1 RT1
HV+ 3.15 A 2.5 Ω
t
O
C3
220 nF R3 HD
C1 C2 500 V 3 MΩ
22 µF 220 nF 1% C4
450 V 500 V 4.7 µF
R4 25 V HS
HV- R25 2 MΩ FREDFET
0Ω 1%
C5 R9 PHASE U
100 pF HS 44.2 kΩ
R5 BPH Drive
50 V XH 1%
2 MΩ
FAULT U 1% J4
SM HB
R1 FAULT
PWMUH 10 Ω LS
J1
/INH LS FREDFET
R22 Drive
CON8 INL
VDD U 4.7 kΩ R2 &
1 PWMUL IPH
10 Ω Control
FAULT U BPL
U1
2
BRD1265C
PWMUH
3 IPH U
PWMUL ID SG XL LS
4 R7
0Ω R8
5 R6 44.2 kΩ
10 kΩ C6
IPH U 1%
1%
6 1 µF
35 V
7
J2 R23
CON8 4.7 kΩ
VDD V
1 C7
FAULT V 220 nF HD
2 500 V
3
PWMVH C8
4.7 µF
PWMVL 25 V
4 HS
FREDFET
5
R14 PHASE V
IPH V HS 44.2 kΩ
6 BPH Drive XH 1%
7
FAULT V J5
8
SM HB
R10 FAULT
J3 R24 PWMVH 10 Ω LS
CON8 4.7 kΩ /INH LS FREDFET
VDD W INL Drive
1
R11 &
FAULT W PWMVL IPH
Control
2 10 Ω
BPL
PWMWH U2
3 BRD1265C
PWMWL IPH V
4 SG XL
ID LS
C9
5 1 µF R13
IPH W R12 35 V 44.2 kΩ
6
10 kΩ 1%
7
1%
C10
220 nF HD
500 V
C11
4.7 µF
25 V
HS
RT2 FREDFET
100 kΩ
R21 PHASE W
HS 44.2 kΩ
t
O
BPH Drive
R17 XH 1%
FAULT W 4.75 kΩ
1% J6
SM HB
R15 FAULT
PWMWH 10 Ω LS
/INH LS FREDFET
INL Drive
R16 IPH
&
PWMWL 10 Ω Control
BPL
U3
BRD1265C
IPH W
ID SG XL LS
C12
1 µF R20
R18 35 V R19 44.2 kΩ
10 kΩ 0Ω 1%
1%
PI-8702-091818
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BridgeSwitch
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Rev. I 01/20 www.power.com
BridgeSwitch
XL and XH Resistors
The XL resistor is placed near the XL pin and returns to the SG pin.
The XH resistor is placed near the XH pin with a minimized loop area
to the high-side return reference, the HB pin.
XH Resistor XL Resistor
IPH Resistors
The IPH resistor is closely placed to the IPH pin. The length of PCB
traces carrying the IPH signal to the system microcontroller should be
kept as short as possible to avoid noise pick up and maintain signal
integrity. The IPH resistor references to the SG pin.
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BridgeSwitch
IPH Resistor
Signal ground
Signal Ground
Power Ground
The LS pin serves as the power ground. It is good practice to
connect the LS pin to a ground plane, which connects to the bulk
capacitor negative terminal and acts as ground shield.
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BridgeSwitch
HD plane
HD Decoupling
Capacitor
HB Plane
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BridgeSwitch
Thermal Resistance
Thermal Resistance (qJA)3: inSOP-24C Package Notes:
BRD1x60C.....................80 °C/W1, 65 °C/W2 1. Exposed pads soldered to 0.36 sq. in. (232 mm²), 2 oz. (610 g/m²)
BRD1x61C.....................78 °C/W1, 63 °C/W2 copper clad.
BRD1x63C.....................74 °C/W1, 59 °C/W2 2. Exposed pads soldered to 1.0 sq. in. (645 mm²), 2 oz. (610 g/m²)
BRD1x65C.....................68 °C/W1, 53 °C/W2 copper clad.
BRD1x67C.....................63 °C/W1, 51 °C/W2 3. Both power switches each dissipating half the total power.
Conditions
Low-Side SOURCE = 0 V
Parameter Symbol Min Typ Max Units
TJ = -20 °C to 125 °C
(Unless Otherwise Specified)
Bypass Supply Function
VBPL TJ = 25 °C
BYPASS Voltages 13.8 14.5 15.2 V
VBPH See Note D
IBPL = IBPH = 6 mA
BYPASS Shunt VBPL(SHUNT)
TJ = 25 °C 14.5 15.3 16.1 V
Regulator Voltages VBPH(SHUNT)
See Note D
ICH1(LS) VBPL = 0
3.0
VHD-to-LS = 50 V
BYPASS Low-Side TJ = 25 °C
VBPL = 14.5 V mA
Charge Current
ICH2(LS) VHD-to-LS ≥ 100 V 1.7
See Note C
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Rev. I 01/20 www.power.com
BridgeSwitch
Conditions
Low-Side SOURCE = 0 V
Parameter Symbol Min Typ Max Units
TJ = -20 °C to 125 °C
(Unless Otherwise Specified)
Bypass Supply Function (cont.)
VBPH-to-HB = 0
ICH1(HS) 1.8
VHD-to-HB = 50 V
BYPASS High-Side VHB = VLS
VBPH-to-HB = 14.5 V mA
Charge Current TJ = 25 °C
ICH2(HS) VHD-to-HB ≥ 100 V 10
See Note C
High-Side and Low-Side FREDFET Control
INL Pull-Down Current IINL VINL = 2.5 V 0 1 1.15
µA
/INH Pull-Up Current IINH VINH = 2.5 V -1.15 -1 0
Input Voltage High VIH 2.5 V
Input Voltage Low VIL 0.8 V
Dead Time Low Off to VBPL= VBPH = 14.5 V, VDS = 325 V, ID = 0.1 A
tDLH 470 588 705 ns
High On See Figures 11 and 23
Dead Time High Off VBPL = VBPH = 14.5 V, VDS = 325 V, ID = 0.1 A
tDHL 470 588 705 ns
to Low On See Figure 11
FREDFET Junction
TSD See Note C 143 150 157 °C
Shutdown Temperature
Current Limit
tILD See Note B 150 ns
Delay Time
Leading Edge
tLEB See Note B 300 ns
Blanking Time
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BridgeSwitch
Conditions
Low-Side SOURCE = 0 V
Parameter Symbol Min Typ Max Units
TJ = -20 °C to 125 °C
(Unless Otherwise Specified)
Device Protection and System Level Monitoring (cont.)
R XL = R XH = 44.2 kΩ , TJ = 25 °C,
Phase Current Output
tIPH ID(LS) = 0.75x ILIM(DEF), di/dt = 250 mA/ms 500 ns
Delay Time
ON-time ≥ 2 ms, See Notes B, I
High-Voltage Bus OV
IOV TJ = 25 °C 57 60 63 µA
Threshold Current
High-Voltage Bus OV
tD(OV) See Note C 80 µs
Delay Time
High-Voltage Bus OV
IOV(HYST) 4 µA
Turn-Off Hysteresis
SM Pin configured as
System Over-Tempera-
V TM(TH) external temperature sense 1.14 1.2 1.26 V
ture Threshold
See Figure 17
Over-Temperature
tD(TM) See Note B and C 1 ms
Delay Time
Temperature Monitor
ITM 96 µA
Output Current
Temperature Monitor
tON(TM) See Note C 10 ms
Current On-Time
Temperature Monitor
DITM See Note B and C 1 %
Current Duty Ratio
Status Communication Bus
FAULT Pin Voltage High VFAH RUP = 267 Ω, VUP = 3.3 V 2.5 V
FAULT Pin Voltage Low VFAL RUP = 267 Ω, VUP = 3.3 V 0.8 V
FAULT Pin Current Sink IFAS RUP = 267 Ω, VUP = 3.3 V, See Note F 3 mA
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BridgeSwitch
Conditions
Low-Side SOURCE = 0 V
Parameter Symbol Min Typ Max Units
TJ = -20 °C to 125 °C
(Unless Otherwise Specified)
Status Communication Bus (cont.)
VID = VBPL 38 40 42 µs
Device ID VFAULT < VFAL
tID VID = Floating 57 60 63 µs
Time Period TJ = 25 °C
VID = VSD 76 80 84 µs
High-Side DRAIN
VHD(START) 50 V
Supply Voltage
VDS = 540 V
OFF-State Drain
IDSS TJ = 100 °C 65 µA
Leakage Current
See Note H
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BridgeSwitch
Conditions
Low-Side SOURCE = 0 V
Parameter Symbol Min Typ Max Units
TJ = -20 °C to 125 °C
(Unless Otherwise Specified)
Power FREDFETs Channel and Diode (cont.)
TJ = 25 °C 1.60
BRD1x60, IS = 0.5 A
See Note C TJ = 100 °C 1.42
TJ = 25 °C 1.49
BRD1x61, IS = 0.7 A
See Note C TJ = 100 °C 1.22
TJ = 25 °C 1.46
BRD1x63, IS = 1 A
Diode Forward Voltage VSD V
See Note C TJ = 100 °C 1.13
TJ = 25 °C 1.09
BRD1x65, IS = 1 A
See Note C TJ = 100 °C 0.91
BRD1x67, IS = 1 A TJ = 25 °C 0.91
See Note C TJ = 100 °C 0.80
BRD1x60, IS = 0.5 A
120
di/dt = 50 A/µs
BRD1x61, IS = 0.75 A
100
di/dt = 50 A/µs
VR = 400 V
Diode Reverse BRD1x63, IS = 1 A
tRR TJ = 125 °C 130 ns
Recovery Time di/dt = 50 A/µs
See Note C
BRD1x65, IS = 1 A
120
di/dt = 75 A/µs
BRD1x67, IS = 1 A
130
di/dt = 75 A/µs
NOTES:
A. Total current consumption is the sum of IBPL(S1) or IBPH(S1) and IDSS when both FREDFETs are off and the sum of IBPL(S2) or IBPH(S2) and IDSS when
one FREDFET is switching (20 kHz maximum commutation frequency assumed).
B. Guaranteed by design. Not tested in production.
C. Guaranteed through characterization. Not tested in production.
D. Bypass shunt regulator voltage exceeds bypass voltage guaranteed by design.
E. Tested in a typical 3-phase inverter application circuit. Normally limited by internal circuitry.
F. Measured indirectly during device timing tests.
G. Assumes control input /INH was high for an idling period of tIDLE > tDHL. The required minimum INL high time for internal communication
increases by tDHL - tIDLE if tIDLE < tDHL (refer to Figure 24).
H. Controller BYPASS pin voltage at VBPL + 0.1 V or VBPH + 0.1 V during FREDFET off-state.
I. IPH output connected to a 10 kW resistor in parallel to series RC network of 8 kW and 7 pF.
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BridgeSwitch
50%
/INH
t DHL
50% 50%
INL
(ON)
LS Gate (OFF)
Drive t RR
10%
IRRM
VHB
90% 90%
t VF t VR
10% 10%
ID
t ON t OFF
PI-8308-082318
tINLH(COM)
VHB
Figure 24. Minimum INL High Time Required for Device Internal High-Side Status Update a) tIDLE > tDHL b) tIDLE < tDHL.
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BridgeSwitch
1.1 100
PI-8315-040417
PI-8316B-082619
Scaling Factors:
90 BRD1X60 0.5
80
Breakdown Voltage
BRD1X63 2.0
70 BRD1X65 4.0
BRD1X67 7.5
60
1.0 50
40
30
20
10
0.9 0.9
-50 -25 0 25 50 75 100 125 150 0 100 200 300 400 500
Junction Temperature (°C) Drain Voltage (V)
Figure 25. Power FREDFET Breakdown vs. Temperature. Figure 26. Power FREDFET COSS vs. Voltage.
PI-8801-110518 PI-8317-101218
2.0 50 2.0 50
IF = 0.5 A IF = 0.75 A
1.5 VRR = 400 V 0 1.5 VRR = 400 V 0
di/dt = 50 A/µs di/dt = 50 A/µs
1.0 TJ = 125 °C -50 Diode Current (A) 1.0 TJ = 125 °C -50
-100 -100
0.5 0.5
-150 -150
0.0 0.0
-200 -200
-0.5 -0.5
-250 -250
-1.0 -1.0
-300 -300
-1.5 -1.5 -350
-350
-2.0 -400 -2.0 -400
PI-8318-101218 PI-8319-091218
2.0 50 2.0 50
IF = 1 A IF = 1 A
1.5 VRR = 400 V 0 1.5 VRR = 400 V 0
di/dt = 50 A/µs di/dt = 75 A/µs
-50 1.0 -50
1.0 TJ = 125 °C TJ = 125 °C
Diode Current (A)
-100 -100
0.5 0.5
-150 -150
0.0 0.0
-200 -200
-0.5 -0.5
-250 -250
-1.0 -1.0
-300 -300
-1.5 -350 -1.5 -350
-2.0 -400 -2.0 -400
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BridgeSwitch
PI-8317b-082719
2.0 50 1.1
PI-8728-093019
Default Current Limit ILIM(DEF)
IF = 1 A
1.5 VRR = 400 V 0
di/dt = 75 A/µs
Bode Diode Current (A)
(Normalized to 25 °C)
1.0 -50
TJ = 125 °C
0.5 -100
0.0 -150
-0.5 -200 1.0
-1.0 -250
-1.5 -300 BRD1X60
BRD1X61
-2.0 -350 BRD1X63
BRD1X65
-2.5 -400 BRD1X67
-3.0 -450 0.9
0 100 200 300 -50 -25 0 25 50 75 100 125 150
Time (ns) Junction Temperature (°C)
Figure 31. Typical Reverse Recovery (BRD1X67). Figure 32. Default Current Limit vs. Temperature.
1.1 1.1
PI-8729-093019
PI-8906-100719
Normalized Normalized
Reduced Current Limit ILIM(RED)
1.0 1.0
BRD1X60
BRD1X61
BRD1X63
BRD1X65
BRD1X67
0.9 0.9
-50 -25 0 25 50 75 100 125 150 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Junction Temperature (°C) Normalized di/dt
Figure 33. Reducted Current Limit vs. Temperature. Figure 34. Default Current Limit vs. di/dt.
BRD1260 BRD1260
Phase Current Output Gain
Phase Current Output Gain
BRD1261 BRD1261
BRD1263 BRD1263
(Normalized to 25 °C)
BRD1265 BRD1265
BRD1267 BRD1267
1.0 1.0
0.9 0.9
-50 -25 0 25 50 75 100 125 150 0.2 0.6 1
Junction Temperature (°C) Low-Side FREDFET Current
Figure 35. Phase Current Output Gain vs. Temperature (Normalized to ILIM(DEF))
Figure 36. Phase Current Output Gain vs. Low-Side FREDFET
Current.
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BridgeSwitch
1.1 1.1
PI-8732-091218
PI-8733-091218
HV Bus UV Threshold Currents
IUV55/IUV70/
(Normalized to 25 °C)
1.0 1.0
0.9 0.9
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) Junction Temperature (°C)
Figure 37. HV Bus UV Threshold Current vs. Temperature. Figure 38. HV Bus OV Threshold Current vs. Temperature.
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Rev. I 01/20 www.power.com
InSOP-24C
www.power.com
3.35 Ref.
2.59
5 Lead Tips
DETAIL A
2X 24 13 0.15 C
0.10 C B
2
10.80 13.63 5.69 Ref.
4.70 Ref.
3.00 Ref.
0.28 Ref.
0.65 Ref. 0.65 Ref.
3.20 Ref. 3.20 Ref.
0.25 H
1 12 0.15 C 0.45 Ref.
12 Lead Tips 2
Gauge
Pin #1 I.D. 3 4 A 9.40 Plane
0.30
16X Seating Plane
0.75 0.20
2X 0.10 C A 0.76 C
0.25 M C A B 0° – 8° Ref. 0.15
0.81 0.00
0.51 Standoff
TOP VIEW BOTTOM VIEW
Seating 1 24
Plane CL
C
1.45 0.10 C
0.75 2.40
1.25 Coplanarity: 17 Leads
3.19
Body Thickness
4.80
1.65
Notes:
1. Dimensioning and Tolerancing per ASME Y14.5M – 1994.
2.40
0.41
2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive
of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch
between the top and bottom of the plastic body. Maximum mold protrusion is 0.18 mm per side. 12 13
1.58 1.58
3. Dimensions noted are inclusive of plating thickness. 3.42 4.50 3.42
4. Does not include inter-lead flash or protrusions. Note: The PCB footprint shown is the minimum recommended layout for basic thermal, mechanical
and electrical interconnect, including package-to-PCB creepage. Modifications are expected, based on
5. Dimensions in millimeters. application-specific requirements, to add copper areas for improved thermal performance or reduce
for increased on-PCB creepage.
6. Datums A & B to be determined at Datum H.
7. Exposed pad size and location dimensions are for reference only. PCB PAD LAYOUT
BridgeSwitch
PI-8294-051619
29
POD-InSOP-24C Rev C
Rev. I 01/20
BridgeSwitch
PACKAGE MARKING
InSOP-24C
BRD1265C C
M7C151A D
A
1815 B
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Rev. I 01/20 www.power.com
BridgeSwitch
BRD1160C 3
BRD1161C 3
BRD1163C 3
BRD1165C 3
BRD1167C 3
BRD1260C 3
BRD1261C 3
BRD1263C 3
BRD1265C 3
BRD1267C 3
Latch-up at 125 °C JESD78D > ±100 mA or > 1.5 × VMAX on all pins
ANSI/ESDA/JEDEC
Charge Device Model ESD > ±500 V on all pins
JS-002-2014
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www.power.com Rev. I 01/20
Revision Notes Date
E Code A release. 10/18
Updated Figure 6 and 2nd paragraph under BYPASS LOW-SIDE Pin and HIGH-SIDE Pin Regulator section on page 5.
F 11/18
Updated Figure 27 and edited text from middle row of Results column in ESD and Latch-Up Table.
Updated HB Pin voltage in Abs Max Ratings table, ICH1(HS) Condition right column parameter text and added new
G 01/19
Figure 33 Performance Curve on page 27.
H Minor text changes, Updated Figure 12, ICH1(HS) Condition top right column, ILIM(RED) Min, Typ & Max value parameters. 05/19
I Added BRD1167C and BRD1267C parts. 01/20
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failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or
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of the life support device or system, or to affect its safety or effectiveness.
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