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44 | Macromol. Symp. 2017, 371, 44–49 DOI: 10.1002/masy.

201600036

Effect of Sodium Bicarbonate in Fabrication of


Carbon Black-Filled Epoxy Porous for Conductive
Application
Anusha Leemsuthep, Nurul Ain Mohd Nayan, Zunaida Zakaria,
Du Ngoc Uy Lan*

Summary: Carbon black-filled epoxy porous (CBEP) was fabricated by using single
emulsion technique. Mixture of epoxy, polyamide hardener, sodium bicarbonate (as
blowing agent) and carbon black (as conductive filler) was dropped into a heated
corn oil at 160  C (containing free of polyunsaturated fatty acids). The epoxy-oil
system was stirred at 1000 rpm for 1 hour. Because of the immiscibility of epoxy
mixture and corn oil, droplets of epoxy mixture were formed. Initial epoxy droplets
were broken into small droplets due to the applied shear (from stirring). Receiving
heat from oil phase, the decomposition of sodium bicarbonate and the curing
reaction of epoxy and polyamide occurred simultaneously so CBEP was formed. It
was found that sodium bicarbonate exhibited a significant effect on the
morphology, thermal and conductivity properties of CBEP. Increase of sodium
bicarbonate’s content from 4 phr to 12 phr could produce larger epoxy particle size in
CBEP. However, CBEP using 20 phr of sodium bicarbonate’s content had the lowest
particle size. The content of 20 phr could induce an early and strong decomposition
reaction in the initial epoxy droplets, which broke them into smaller size; hence the
smaller particle size was obtained after curing. This fact was evident from the result
of bulk density, where higher sodium bicarbonate content induced lower bulk
density of CBEP. Furthermore, CBEP using higher sodium bicarbonate content also
exhibited better electrical conductivity.

Keywords: blowing agents; carbon black; conductivity; macroporous polymers;


polyamide-epoxy adduct

Introduction composites are the high dosage of conduc-


tive filler required and the high density of
Conductive polymer composites are very conductive filler, which could cause filler’s
important nowadays due to the explosion sediment and poor dispersion. In solution,
of electrical devices.[1,2] To prepare con- conductive microsphere is considered as
ductive polymer composites, normally one of the most advanced conductive
conductive filler is directly dispersed into materials having low density and being
polymer matrix. The conductivity behav- used at the low content in conductive
iour of the composite, then depends greatly composites.[5] Conductive microspheres
on the dispersion of conductivity filler in attracted a considerable interest from
the polymer.[3,4] Most common problems researchers and industry due to their
for preparation of conductive polymer advantages such economic, low density
and better electrical properties.[6,7] They
have been widely used in electronic and
School of Materials Engineering, Universiti Malaysia
medical application.[8,9] One of the most
Perlis, Kompleks Pusat Pengajian Jejawi II, 02600 Arau,
Perlis, Malaysia common conductive microspheres is metal
Fax: (þ04) 979 8178; E-mail: uylan@unimap.edu.my coated microsphere, which could be

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Macromol. Symp. 2017, 371, 44–49 | 45

produced by mussel-inspired surface func- Experimental Section


tionalization.[10] The process involves do-
pamine oxidative self-polymerization and Materials
electroless plating. Besides, copper coating Epoxy resin DER 331 and polyamide A062
poly(vinylamine) hollow particles was also from DOW chemical were used to produce
reported to be fabricated by the electroless epoxy porous. Epoxy resin DER 331 has
plating technique.[11] Actually, the fabrica- epoxide equivalent weight of 182–192,
tion of these conductive microspheres density and viscosity at 25  C of
involves to two processes, firstly micro- 1.16 g/cm3 and 11–14 Pas. Polyamide
sphere preparation and coating process in A062 has equivalent weight per H active
sequence. The prepartion of microsphere is of 110, density and viscosity at 25  C of
quite challenging. 0.96 g/cm3 and 35–45 Pas, respectively.
Microspheres is commonly fabricated White crystalline powder of sodium bicar-
from single emulsion technique. Because bonate from HmbG Chemicals having
of the immiscibility of two liquids, the density of 2.22 g/cm3 was used as the
droplets of one liquid are formed and blowing agent. Corn oil was purchased
being dispersed throughout the other as from Yee Lee Corporation Sdn. Bhd.,
called a single emulsion system. Bakar which contained free of polyunsaturated
et al. produced micro-balloons based on fatty acids. Carbon black N330 (HAF) was
phase separation of epoxy mixture and purchased from Chemicals. Inc. Carbon
silicone oil to form epoxy droplet dis- black has iodine absorption number of
persed in the heated silicone oil.[12] 82  5 g/kg and CTAB surface area of
Blowing agent was mixed with epoxy 79–87 103 m2/kg.
mixture in advanced. These epoxy mixture
droplets formed sphere particles in sili- Preparation of Carbon Black Filled Epoxy
cone oil, which had blown via the Porous (CBEP)
decomposition of blowing agent and A reversed ratio of epoxy and polyamide
simultaneously cured via crosslinking pro- was used of 1:2 in weight (as called
cess to form epoxy micro-balloons by polyamide-epoxy adduct). The total weight
receiving heat from silicone oil. The use of epoxy and polyamide was considered as
of reversed ratios of epoxy and polyamide one hundred parts (100 phr). Epoxy was
as called polyamide-epoxy adduct induces mixed with sodium bicarbonate by using
a low crosslink density of the cured matrix, over-head stirrer with the speed of 300 rpm
so that it was able to be cured and blown for 3 minutes. Carbon black N330 was
simultaneously under decomposition of added and mixed at speed of 300 rpm for
the blowing agent to form epoxy another 3 minutes. Afterward, polyamide
macroporous. was added and stirred for 2 minutes at the
The purpose of this paper is to aim same speed. Epoxy mixture was dropped
production of conductive macroporous into corn oil heated at temperature of
in one in-situ process. It means that 160  C and stirred at 1000 rpm for 1 hour.
both processes of forming microsphere The volume ratio of epoxy mixture to corn
and dispersing the conductive filler oil was 1:9. Foaming and curing process
occurred simultaneously. The sodium were occurred in epoxy droplets during
bicarbonate was used as blowing agent being stirred in hot oil phase to produce the
and carbon black was used as conduc- epoxy porous. The mixture of epoxy porous
tive filler. This research proposes single and corn oil was allowed to cool down to
emulsion technique as a simple process 80  C. The epoxy porous was filtered and
to produce conductive epoxy macro- washed five times with detergent solution
porous, which have cell wall containing at 60  C. The ratio of detergent to water is
dispersed carbon black as conductive 1:20. The detergent solution was changed
filler. every 15 minutes. Drying and post-cure

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46 | Macromol. Symp. 2017, 371, 44–49

process of epoxy porous were carried out at active of 95, density and viscosity at 25  C of
80  C for 4 hours in a conventional oven. 1.03 g/cm3 and 3–6 Pas, respectively. The
weight ratio of epoxy and polyamine was
Characterization 10:5. Amount of 20 phr CBEP was added
Bulk density of CBEP was measured into 100 phr of epoxy-polyamine binder.
according to ASTM D7481-09. 100 ml of The mixture was casted into PP mold with
CBEP was measured using cylinder of dimension of 24  20  4 mm and allowed
100 ml. The mass of 100 ml CBEP was to harden at room temperature for 24
weight. Bulk density was calculated by hours. Electrical conductivity test of CBEP
using mass diving to volume. Bulk density was obtained by using Keithley 4200
was reported as an average of five measure- Semiconductor Characterization System.
ments. Particle density of CBEP was The samples were measured using two
measured by using gas pycnometer density probes I–V measurement system. The
analyser, AccuPyc II 1340 V1.0.5. The distance between two probes was 5 mm.
testing was carried out at room tempera- The voltage was varied from 0 to 10 V. A
ture using the chamber of 10 cm3 and control epoxy carbon black composite
Helium gas. The morphology of CBEP (using equivalent carbon black content in
was observed using a scanning electron CBEP) was prepared and its conductivity
microscope, model JSM 6260 LE JOEL. was also measured (Figure 1).
CBEP was coated with gold/platinum layer
to avoid electrostatic charging during
examination. Image J software was used Results and Discussion
to analyze SEM images; and the average
diameter of CBEP was determined by Thermal Behavior of Sodium Bicarbonate
counting 100 particles. Differential scan- Decomposed temperature of sodium bicar-
ning calorimetry (DSC) of sodium bicar- bonate was investigated by using differen-
bonate and CBEP was done in temperature tial scanning calorimetry and reported in
range from 25–200  C with a heating rate Figure 2. The decomposed curve started
10  C/min under nitrogen atmosphere. from 120  C and had the peak temperature
Thermo-gravimetric analyzer (TGA) of at 160.69  C. Therefore, sodium bicarbon-
CBEP was done by using Pyris Diamond ate was expected to fully decompose at
TGA from PerkinElmer in temperature 160  C temperature of corn oil and CBEP
range from 25–600  C with a heating rate could be obtained. The decomposition of
at 20  C/min under a nitrogen flow of sodium bicarbonate as shown in reaction
50 ml/min.
For conductive testing, epoxy DER331
and polyamine was used as a binder.
Polyamine has equivalent weight per H

Figure 2.
SEM images of CBEP: (a) CBEP-4SD at 1000X
Figure 1. (b) CBEP-12SD at 1000X (c) CBEP-20SD at 1000X and
DSC curves of sodium bicarbonate powder. (d) CBEP-20SD at 3000X.

ß 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim www.ms-journal.de


Macromol. Symp. 2017, 371, 44–49 | 47
Table 1.
Effect of sodium bicarbonate content on the bulk density, skeleton density and particle size of carbon
black-filled epoxy porous (CBEP).
Composition CBEP-4SD CBEP-12SD CBEP-20SD
Bulk density [g/cm3] 0.208  0.003 0.174  0.004 0.168  0.002
Skeleton density [g/cm3] 1.188  0.002 1.208  0.004 1.237  0.004
Particle size [mm] 4.820  2.191 5.481  2.591 4.333  2.151

(R1) as below[13]: content from 4 phr to 12 phr causes CBEP’s


bulk density decrease obviously. CBEP-
2 NaHCO3 ! CO2 þ H2 O
12SD also has larger particles compared to
þ Na2 CO3 ðR1Þ
CBEP-4SD. It means higher blowing agent
content produces the greater number of
Morphology Analysis epoxy hollow micro-spheres. However,
During emulsion, shear stress from high using above 12 phr sodium bicarbonate,
stirring speed would split the initial epoxy CEBP’s bulk density is slightly reduced. A
drop into many small droplets dispersing comparison on volume of all CBEP in a
in oil phase. Receiving heat from corn oil, same mass was carried out. In which, the
both curing reaction of epoxy and poly- mass of 100 ml CBEP-20SD (having the
amide as well as the decomposition of lowest bulk density) was measured, and
sodium bicarbonate would occur simulta- the volumes of CBEP-4SD and CBEP-
neously. The decomposition of sodium 12SD in the same mass were measured by
bicarbonate produced a growing decom- using 100 ml cylinders. Figure 3 showed the
posed gas, which induced an internal small particle size of CBEP-20SD could
pressure inside epoxy droplets. This inter- occupy more volume compared to the
nal pressure (depending on the blowing others. In contrast, particle density of
agent content) would expand the epoxy CBEP increases with higher sodium bicar-
droplets or could burst them out into many bonate content. This indicated that the
smaller ones flocculating each other. They sodium carbonate by-product of decompo-
were solidified after the curing reaction sition reaction of blowing agent could
completed. As seen in Figure 2, CBEP remain inside CBEP.
composed of many microspheres and
micro hollow sphere, which adhere to
each other.[14] This assumption was evi-
dent from the particle size of CBEP, which
increased from CBEP-4SD to CBEP-
12SD (expanding) but reduced in CBEP-
20SD (bursting) (as Table 1). The
suggested mechanism is also supported
from the epoxy particle in rod morphology
of CBEP-20SD (Figure 2(d)). The rod
type – epoxy particle could present the
spreading out epoxy droplets due to the
high content decomposed gas of CBEP
using 20 phr sodium bicarbonate.

Density Analysis
The bulk density and particle density of
CBEP demonstrates in Table 1. It shows Figure 3.
that increase in sodium bicarbonate Volume of CBEP in a same mass.

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48 | Macromol. Symp. 2017, 371, 44–49
Table 2.
Thermogravimetric analysis of CBEP with different sodium bicarbonate content.
Composition Tonset [ C] T50%wt [ C] Residual mass [%] TDTG at 1st peak [ C] TDTG at 2nd peak [ C]
CBEP-4SD 218.16 432.25 11.604 314.00 508.99
CBEP-12SD 227.61 446.59 12.465 314.99 512.61
CBEP-20SD 230.94 464.26 15.767 313.65 518.24

Thermo-Gravimetric Analyzer (TGA) temperature at 50% weight loss. The


Table 2 shows thermal resistance behav- enhancement could be originated from
iour of CBEP prepared from different higher porosity of CBEP using higher
contents of sodium bicarbonate. The blowing agent content. As shown in
results of TGA weight loss and derivative Figure 4(b), significant degradation in the
thermograms (DTG) of CBEPs are first peak of CBEP-4SD is detected. The
reported in Figure 4(a) and (b), respec- first degradation peak temperature belongs
tively. Based on Figure 4(a), no decom- to the dehydration of —OH groups and
posed peak of sodium bicarbonate at degradation of C¼O of epoxy structure.
around 160  C is also detected (similar to The second degradation peak could be
the DSC curves of CBEPs, which proves carbon backbone of epoxy structure.
that all blowing agent had decomposed
during emulsion stage). Thermal behaviour Conductivity behavior of CBEP filled
of CBEP exhibits two decomposition epoxy – polyamine matrix
stages. The first stage is around The electrical conductivities of epoxy
240–320  C and the second stage is around composite filled CBEP (epoxy/CBEP)
400–550  C. It shows that an increase of and epoxy composite filled carbon black
sodium bicarbonate content enhanced the (epoxy/CB) in equivalent weight as control
thermal resistance of CBEP on the onset are reported in Figure 5. As proposed,
degradation temperature and the conductivity of epoxy/CBEP was signifi-
cant higher than that of control epoxy/CB
composite. Actually, the equivalent weight
of CB was 3.33%. Therefore, the conduc-
tive of the control epoxy/CB composite was
low, which had written as the common
problem in the introduction. In epoxy/
CBEP, carbon black was dispersing on the
CBEP surface and established the inter-
connection to conduct the electrical

Figure 4. Figure 5.
(a) Degradation weight of CBEPs as a function of Electrical conductivity of epoxy/CBEP and control
temperature. (b) Derivative weight loss of CBEPs as a epoxy/CB composite in equivalent carbon black
function of temperature. content.

ß 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim www.ms-journal.de


Macromol. Symp. 2017, 371, 44–49 | 49

current. Therefore the conductivity of produce epoxy porous to accelerate the


epoxy/CBEP composites was enhanced. gelling time will be investigated.
It is proven from the higher volume
occupied of CBEP-20SD (compared to
others in the same mass as seen in Figure 3) Acknowledgement: The authors would like to
meaning better carbon black dispersion in acknowledge Ministry of Higher Education
Malaysia for providing the ERGS grant (grant
CBEP-20SD. Hence, CBEP-20SD per-
no: 9010-00030) that has made this work
formed the higher electrical conductivity possible.
compared to CBEP-4SD and CBEP-12SD.

Conclusion [1] A. Murat, T. Karazehir, A. Sezai Sarac, Curr. Phys.


Chem. 2012, 2, 224.
Carbon black filled epoxy porous as [2] M. O. Khan, Thermally Conductive Polymer Compo-
sites for Electronic Packaging Applications Applications,
sphere-packing of epoxy micro-particles/
University of Toronto, 2012.
epoxy hollow micro-sphere was prepared [3] M. El Hasnaoui, A. Triki, M. P. F. Graça, M. E. Achour,
via single emulsion technique. In details, L. C. Costa, M. Arous, J. Non. Cryst. Solids 2012, 358,
initial epoxy drops were split into small 2810.
epoxy droplets dispersing in heated corn oil [4] P. H. Xu, Y. H. Wu, D. D. Yang, J. R. Wang, H. Q. Xie,
by the stirring shear stress. Because of Rev. Adv. Mater. Sci. 2011, 27, 173.
decomposed gas of blowing agent, these [5] L. I. Chernyshev, V. V. Skorokhod, Powder Metall.
Met. Ceram. 42, 88.
droplets were able blown at low content of
[6] D. L. Gao, M. S. Zhan, Appl. Surf. Sci. 2009, 255, 4185.
sodium bicarbonate (4–12 phr), but further [7] W.-C. Liaw, Y.-L. Cheng, M.-K. Chang, W.-F. Lien,
burst into smaller droplets at high content H.-R. Lai, Polym. J. 2015, 48, 91.
of sodium bicarbonate (20 phr). Completed [8] E. H. Chan, Development and Characterization of
curing was to solidify these droplets and Thermally Conductive Polymeric Composites for Elec-
form the epoxy porous particles. It was tronic Packaging Applications, 2011.
found that, the higher the sodium bicar- [9] M. Lee, Polymer 2002, 43, 4307.
[10] W. Wang, Y. Jiang, Y. Liao, M. Tian, H. Zou,
bonate content, the greater the number of
L. Zhang, J. Colloid Interface Sci. 2011, 358, 567.
epoxy micro-particles and the lower bulk [11] J. H. Han, B. M. Koo, K. Do Suh, Colloid. Surf. A
density was. CBEP with lower bulk density Physicochem. Eng. Asp. 2010, 363, 105.
exhibited better thermal properties of [12] A. A. Bakar, Du Ngoc Uy Lan, B. Azahari, Z. M. Ariff,
CBEP. The advantage of CBEP was Mater. Lett. 2009, 63, 827.
proven from the electrical conductivity [13] B. Biswas, B.K. Kandola, a. R. Horrocks, D. Price,
Polym. Degrad. Stab. 2007, 92, 765.
performance. The epoxy composite using
[14] Hand book of Advanced Ceramics: Materials,
CBEP improved significantly the electrical Applications, Processing, and Properties, 2nd edition,
conductivity compared to epoxy composite S. Somiya, Ed., Academic Press, 2013.
filled carbon black in an equivalent content. [15] N. N. Najib, Z. M. Ariff, N. a. Manan, A. A. Bakar,
Further work using higher temperature to C. S. Sipaut, J. Phys. Sci. 2009, 20, 13.

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