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  • ATS Company Presentation - August - 2019 E Final-3

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    AT&S generated over 75% of its revenue in the 2018/19 fiscal year from high-end technologies like HDI and any-layer printed circuit boards as well as embedding and integrated circuit substrates. Specifically, about 30% of AT&S's revenue came from high-end HDI PCBs and IC substrates with the remaining 70% from complementary technologies like single-sided, double-sided, and multilayer PCBs along with flex and RF PCBs.

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    AT&S generated over 75% of its revenue in the 2018/19 fiscal year from high-end technologies like HDI and any-layer printed circuit boards as well as embedding and integrated circuit substrates. Specifically, about 30% of AT&S's revenue came from high-end HDI PCBs and IC substrates with the remaining 70% from complementary technologies like single-sided, double-sided, and multilayer PCBs along with flex and RF PCBs.

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    21 views1 page

    ATS Company Presentation - August - 2019 E Final-3

    Uploaded by

    slouvac
    AT&S generated over 75% of its revenue in the 2018/19 fiscal year from high-end technologies like HDI and any-layer printed circuit boards as well as embedding and integrated circuit substrates. Specifically, about 30% of AT&S's revenue came from high-end HDI PCBs and IC substrates with the remaining 70% from complementary technologies like single-sided, double-sided, and multilayer PCBs along with flex and RF PCBs.

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    Strategic focus on high-end technologies

    AT&S Revenue structure in FY 2018/19 – based on technologies

    High-end technology share > 75%


    HDI and any-layer PCBs,
    Embedding, IC substrates
    High-end
    HDI PCBs and
    IC substrates
    ~ 30%
    Complementary technology
    share: < 25%
    SS, DS, ML,
    Single-sided (SS), double-sided (DS), multilayer- (ML),
    Flex, RF
    flex and rigid-flex (RF) PCBs
    ~ 70%

    Structure of general PCB market – based on technologies


    Source: Prismark, AT&S

    Company Presentation 7

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