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    文看懂MIS封裝 4

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    文看懂MIS封裝 4

    Uploaded by

    slouvac
    86 views1 page

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    文看懂MIS封裝-4

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    文看懂MIS封裝 4

    Uploaded by

    slouvac

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    © All Rights Reserved
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    of 1

    圖3：矽品的倒裝MIS BGA封裝（FC-MISBGA）

    來來源：TechSearch International，矽品精密SPIL

    隨著時間的推移， MIS業務規模開始迅速成長。2017年年，
    僅芯智聯聯（MISpak）⼀一家就預計出貨25億顆，⽽而在2010
    年年，其出貨量量僅2000萬顆。在MIS封裝領域，芯智聯聯
    （MISpak）宣稱其⼤大約有30多家終端顧客。當然這中間
    還沒包括其他MIS供應商的出貨量量。

    圖4：芯智聯聯MIS基板出貨量量

    來來源：芯智聯聯MISpak

    MIS與傳統 IC封裝基板不同。傳統封裝採⽤用的是有機基
    板，這是基於PCB類材料的多層基板技術。在封裝中，晶

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