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Service Manual TV LG 32lj550 PDF
Service Manual TV LG 32lj550 PDF
LED TV
SERVICE MANUAL
CHASSIS : LA75M
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .................
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.................... 2
SAFETY PRECAUTIONS
PRECAUTIONS ...................
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.............. 3
SERVICING
SERVICING PRECAUT
PRECAUTIONS
IONS .................
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........... 4
SPECIFICA
SPECIFICATION ..................
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...........66
SOFTWARE
SOFTWARE UPDA
UPDATE
TE ...................
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..................... 8
EXPLODED
EXPLODED VIEW ...................
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..... 11
DISASSEMBLY .................
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........ 12
Copyright © LG Electronics. Inc. All rights reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright © LG Electronics. Inc. All rights reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 2. After removing an electrical assembly equipped with ES
manual and its supplements and addenda, read and follow the devices, place the assembly on a conductive surface such as
SAFETY PRECAUTIONS on page 3 of this publication. aluminum foil, to prevent electrostatic charge buildup or expo-
NOTE : If unforeseen circumstances create conict between the sure of the assembly.
following servicing precautions and any of the safety precautions 3. Use only a grounded-tip soldering iron to solder or unsolder ES
on page 3 of this publication, always follow the safety precautions. devices.
Remember: Safety First. 4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
General Servicing Precautions electrical charges sufcient to damage ES devices.
1. Always unplug the receiver AC power cord from the AC power 5. Do not use freon-propelled chemicals. These can generate
source before; electrical charges sufcient to damage ES devices.
a. Removing or reinstalling any component, circuit board mod- 6. Do not remove a replacement ES device from its protective
ule or any other receiver assembly. package until immediately before you are ready to install it.
b. Disconnecting or reconnecting any receiver electrical plug or (Most replacement ES devices are packaged with leads electri-
other electrical connection. cally shorted together by conductive foam, aluminum foil or
c. Connecting a test substitute in parallel with an electrolytic comparable conductive material).
capacitor in the receiver. 7. Immediately before removing the protective material from the
CAUTION:: A wrong part substitution or incorrect polarity
CAUTION leads of a replacement ES device, touch the protective material
installation of electrolytic capacitors may result in an explo- to the chassis or circuit assembly into which the device will be
sion hazard. installed.
2. Test high voltage only by measuring it with an appropriate CAUTION:: Be sure no power is applied to the chassis or circuit,
CAUTION
high voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged replace-
Do not test high voltage by "drawing an arc". ment ES devices. (Otherwise harmless motion such as the
3. Do not spray chemicals on or near this receiver or any of its brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted oor can generate static electricity suf -
suf -
4. Unless specied otherwise in this service manual, clean cient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10 % (by volume) Acetone and 90 % 1. Use a grounded-tip, low-wattage soldering iron and appropriate
(by volume) isopropyl alcohol (90 % - 99 % strength) tip size and shape that will maintain tip temperature within the
CAUTION:: This is a ammable mixture.
CAUTION range or 500 °F to 600 °F.
Unless specied otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500 °F to 600 °F)
lead. b. Heat the component lead until the solder melts.
Always remove
remove the test receiver
receiver ground
ground lead last.
last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test xtures specied in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION:: Do not connect the test xture ground strap to any
CAUTION board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500 °F to 600 °F)
Some semiconductor (solid-state) devices can be damaged eas- b. First, hold the soldering iron tip and solder the strand against
ily by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some eld-effect transistors component lead and the printed circuit foil, and hold it there
and semiconductor “chip” components. The following techniques only until the solder ows onto and around both the compo -
should be used to help reduce the incidence of component dam- nent lead and the foil.
age caused by static by static electricity. CAUTION:: Work quickly to avoid overheating the circuit
CAUTION
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. Alter- splashed solder with a small wire-bristle brush.
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
Copyright © LG Electronics. Inc. All rights reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement 3. Solder the connections.
Some chassis circuit boards have slotted holes (oblong) through CAUTION: Maintain original spacing between the replaced
which the IC leads are inserted and then bent at against the cir - component and adjacent components and the circuit board to
cuit foil. When holes are the slotted type, the following technique prevent excessive component temperatures.
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique Circuit Board Foil Repair
as outlined in paragraphs 5 and 6 above. Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
Removal board causing the foil to separate from or "lift-off" the board. The
1. Desolder and straighten each IC lead in one operation by following guidelines and procedures should be followed whenever
gently prying up on the lead with the soldering iron tip as the this condition is encountered.
solder melts.
2. Draw away the melted solder with an anti-static suction-type At IC Connections
solder removal device (or with solder braid) before removing To repair a defective copper pattern at IC connections use the
the IC. following procedure to install a jumper wire on the copper pattern
Replacement side of the circuit board. (Use this technique only on IC connec-
1. Carefully insert the replacement IC in the circuit board. tions).
2. Carefully bend each IC lead against the circuit foil pad and
solder it. 1. Carefully remove the damaged copper pattern with a sharp
3. Clean the soldered areas with a small wire-bristle brush. knife. (Remove only as much copper as absolutely necessary).
(It is not necessary to reapply acrylic coating to the areas). 2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
"Small-Signal" Discrete Transistor 3. Bend a small "U" in one end of a small gauge jumper wire and
Removal/Replacement carefully crimp it around the IC pin. Solder the IC connection.
1. Remove the defective transistor by clipping its leads as close 4. Route the jumper wire along the path of the out-away copper
as possible to the component body. pattern and let it overlap the previously scraped end of the
2. Bend into a "U" shape the end of each of three leads remaining good copper pattern. Solder the overlapped area and clip off
on the circuit board. any excess jumper wire.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding At Other Connections
leads extending from the circuit board and crimp the "U" with Use the following technique to repair the defective copper pattern
long nose pliers to insure metal to metal contact then solder at connections other than IC Pins. This technique involves the
each connection. installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement 1. Remove the defective copper pattern with a sharp knife.
1. Heat and remove all solder from around the transistor leads. Remove at least 1/4 inch of copper, to ensure that a hazardous
2. Remove the heat sink mounting screw (if so equipped). condition will not exist if the jumper wire opens.
3. Carefully remove the transistor from the heat sink of the circuit 2. Trace along the copper pattern from both sides of the pattern
board. break and locate the nearest component that is directly con-
4. Insert new transistor in the circuit board. nected to the affected copper pattern.
5. Solder each transistor lead, and clip off excess lead. 3. Connect insulated 20-gauge jumper wire from the lead of the
6. Replace heat sink. nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Diode Removal/Replacement Carefully crimp and solder the connections.
1. Remove defective diode by clipping its leads as close as pos- CAUTION:: Be sure the insulated jumper wire is dressed so the
CAUTION
sible to diode body. it does not touch components or sharp edges.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Copyright © LG Electronics. Inc. All rights reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification
No Item Specication Remark
1 Receiving system ATSC / NTSC-M, 64 & 256 QAM
2 Available Channel VHF : 02~13
UHF : 14~69
DTV : 02-69
CATV : 01~135
CADTV : 01~135
3 Input Voltage AC 100 ~ 240V@ 50/60Hz AC 120V, 50/60Hz on the label (USA)
4 Market North America
Copyright © LG Electronics. Inc. All rights reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. External Input Support Format
5.1. Component 2D input(Y, C B /PB)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
2 720*480 15.75 60.00 13.5135 SDTV ,DVD 480I
3 720*480 31.47 59.94 27.00 SDTV 480P
4 720*480 31.50 60.00 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 67.432 59.94 148.352 HDTV 1080P
10 1920*1080 67.50 60.00 148.50 HDTV 1080P
Copyright © LG Electronics. Inc. All rights reserved. -7- LGE Internal Use Only
Only for training and service purposes
SOFTWARE UPDATE
1. USB 2. NSU
(1) Insert the USB memory Stick to the USB port (This Function is needed to connect to the internet)
(2) Automatically detect the SW Version and show the below
message (1) Menu -> All Settings -> General -> About This TV
(3) Click [YES]: initiate the download and install of the update.
(2) Click [CHEK FOR UPDATES] : system check newest
version
(4) Click [Check Now]: move to “About This TV” page for
update
(5) TV is updating
(3) Click [DOWNLOAD AND INSTALL]
(4) TV is updating
(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option
Copyright © LG Electronics. Inc. All rights reserved. -8- LGE Internal Use Only
Only for training and service purposes
Standard Repair Process
Established
Error B. Power error date
symptom
No power Revised date 6/16
A17 A18
DC Power on Replace
Check Power LED Y Normal N Check Power Y
by pressing Power Key OK? Power
Logo LED On? operation? On ‘”High”
On Remote control B/D
. Stand-By: Red or Turn On
N Y
. Operating: Turn Off
Check Power cord Replace Main B/D
was inserted properly
A18
N Measure voltage of each output of Power B/D
Normal?
Y
Y Y
Normal Replace Main B/D
voltage?
Close Normal
Check ST-BY 7.8V
Y
voltage? N
A18
Replace Power B/D
N
Replace Power
B/D
6
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process
Established
Error B. Power error date
symptom
Off when on, off while viewing, power auto on/off Revised date 7/16
A19
N Y
Check A/C cord Error? Check Power Off CPU
Replace Main B/D Normal? End
Mode Abnormal
7
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process
Established
Error C. Audio error date
symptom
No audio/ Normal video Revised date 8/16
A20 A21+A18
Check user N Check Main B+ Y
No audio Normal
menu > Off 13V of Power
Screen normal voltage
Speaker off Board
Y N
Check N
Disconnection Replace MAIN Board End
Speaker
disconnection
Y
Replace Speaker
8
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process
Established
Error C. Audio error date
symptom
Wrecked audio/ discontinuation/noise Revised date 9/16
Wrecked audio/
A21+A18
Check and replace
Discontinuation/ Check audio
speaker and
Noise for B+ Voltage (13V)
connector
Check input all audio
signal Y Y
Signal
-RF
normal? Wrecked audio/
-External Input Normal
signal Discontinuation/
N Replace Main B/D voltage?
Noise only
for D-TV
N
Wrecked audio/
Discontinuation/
Replace Power B/D
Noise only
for Analog
(When RF signal is not
received)
Request repair to external Wrecked audio/ Replace Main B/D End
cable/ANT provider Discontinuation/
Noise only
for External Input
(In case of N
External Input Connect and check Normal
signal error) other external audio?
Check and fix device
external device Y
9
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process
Replace R/C
10
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process Detail Technical Manual
Error Established
symptom A. Video error_Color error date
Revised
Content Check Link Cable(VX1) reconnection condition A7
date
<ALL MODELS>
Check the contact condition of the Link Cable, especially dust or mis insertion.
A7
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process Detail Technical Manual
Error Established
symptom
A. Video error_Color error
date
Revised
Content Adjustment Test pattern - ADJ Key A8
date
Checking item : 1. Defective pixel 2. Residual image 3. MODULE error (ADD-BAR,SCAN BAR..)
4.Video error (Classification of MODULE or Main-B/D!)
A8
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Appendix : Exchange Main Board (1)
Solder defect, CNT Broken Solder defect, CNT Broken Solder defect, CNT Broken
A - 1/5
Copyright 2017LGElectronics
© Inc. Allrights
reserved. LGE
Internal
UseOnly
Onlyfortraining
andservice
purposes
Standard Repair Process Detail Technical Manual
Error Established
symptom C. Audio error_No audio/Normal video
date
Voltage and speaker checking method Revised
Content A21
when there is no audio date
<32LJ550B-UA>
1 SPK_R-
2 SPK_R+
3 SPK_L-
4 SPK_L+
3.Connect the tester RX1 to the speaker terminal and if you hear the Chik Chik sound when you touch the
GND and output terminal, the speaker is normal.
A21
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process Detail Technical Manual
Error Established
symptom D. Function error date
Revised
Content Remote control operation checking method A22
date
A22
Copyright ©2017
LGElectronics
Inc.Allrightsreserved. LGEInternal
UseOnly
Onlyfortraining
andservicepurposes
Standard Repair Process Detail Technical Manual
Error Established
symptom D. Function error date
Revised
Content Remote control operation checking method A22
date
A23/A24
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