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OFC Paper 1
OFC Paper 1
OFC Paper 1
Total Marks:100
Q.1: Consist of 15 MCQs of 1 mark each: (15)
1. Transducer is a device which converts waves:
a) Sound to Electrical b) Electrical to Sound c) A & B
2. Cleaver is used for?
a) Cleaning b) splicing c) cutting
3. Right pattern for fiber colors is?
a) Green, brown, white b) slate, red, yellow c) blue, orange, green
4. Rectifier is device that converts
a) AC into DC b) DC into AC c) Electrical to light
5. Wavelength of SM Fiber?
A) 1310—1550um b) 1310—1550pm c) 1310—1550nm
6. Fiber’s types by propagation/transmission
a) 5 b) 4 c) 2
7. Core & cladding refractive Indices are?
a) equal b) core>cladding c) core<cladding
8. Unit of wavelength is?
a) neber b) lemda c) meter
9. optical fiber is a
a) source b) medium c) light
10. Depth of direct buried cable?
a) 2 feet b) 15 feet c) 6 feet
11. Photo diode converts?
a) Sound to Electrical b) Electrical to Sound c) Light to Electrical
12. Networks at customer end is?
a) switching network b) access network c) LAN network
13. Light travel by optical fiber in it’s…………….?
a) Tubes b) core c) cladding
14. In optical fiber network repeaters required after the distance
a) 20km b) 100 km c) 120km
15. optical fiber that layed on sea bed is?
a) duct b) marine c) external
Q. 2 Fill in the blanks (15)
1. LASER……………………………………………………………………
2. ONU……………………………………………………………………
3. FSM……………………………………………………………………
4. APD……………………………………………………………………
5. OFC……………………………………………………………………
6. OFS……………………………………………………………………
7.ODF……………………………………………………………………
8. SM……………………………………………………………………
9. MM …………………………………………………………………….
10. PC……………………………………………………………………
11. OTDR……………………………………………………………………
12. OLT……………………………………………………………………
13. CATV……………………………………………………………………
14. LAN……………………………………………………………………
15. TIR…………………………………………………………………
LONG Questions: (Solve any 3 Questions each question contain 10 marks) (30)
1. Draw & explain Direct buried installation process?
2. Write note on brief history of fiber optics?
3. Write fiber optical advantages over other mediums in details?
4. Explain fusion splicing steps and full process in detail?