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M - A L P: T F T 3G 4G A: Ixed Signal Ctive Oad Ull He Ast Rack To and Mplifiers
M - A L P: T F T 3G 4G A: Ixed Signal Ctive Oad Ull He Ast Rack To and Mplifiers
M - A L P: T F T 3G 4G A: Ixed Signal Ctive Oad Ull He Ast Rack To and Mplifiers
Mixed-signal active
load Pull: the Fast
track to 3g and 4g
aMPliFiers
T
he current trend towards increased data a widely established tool. In these systems, the
rates in mobile services has direct impli- (harmonic) reflection coefficients offered to
cations for the power amplifiers operat- the device under test are “physically” varied
ing in these systems, which now need to be not to find the optimum (harmonic) loading con-
only efficient but also wideband and, above all, ditions at the device input and output. With
linear. To operate efficiently, an amplifying de- this optimum set of loading conditions the fi-
vice needs to see its optimum terminations at nal matching circuit for the active device can
the input and output. Although basic amplifier be designed. Load-pull systems can be divided
theory suggests that an almost infinite number into two main categories: passive and active.
of harmonics need to be controlled to establish
a particular device class of operation (such as Passive Tuner-based sysTems2,3
(inv.) Class B, E, F),1 in practice, control of A typical passive load-pull configuration,
the fundamental, second and third harmonic shown in Figure 1a, makes use of sliding
is most of the time sufficient to achieve high mechanical probes to tune the reflection co-
performance. Furthermore, in order to operate efficient. The bias tee placed after the tuner
linearly, the active device requires—in addition reduces the impact of its losses, but yields
to a proper control at its fundamental and har- larger memory effects due to the baseband
monic impedances—the correct baseband or inductance. These kinds of systems are cur-
envelope impedance, which, in the circuit im- rently still the preferred industry large-signal
plementation, is mostly determined by the bi- test bench choice, due to their simplicity and
asing networks at the device input and output. high power handling capabilities. Unfortu-
Since active devices operate in a large-sig- nately, passive load-pull setups are constrained
nal/nonlinear mode when reaching high effi- by losses in the tuners, connecting cables and
ciency operation, the properties of the device wafer probes, which limit the magnitude of the
under test (DUT) cannot simply be extrapo- reflection coefficients that these systems can
lated from small-signal measurements. Con- provide to the DUT.
sequently, active devices intended for large-
signal operation need to be characterized un-
der the exact same conditions as in their final Mauro Marchetti
application. To address this need, harmonic Anteverta Microwave B.V.
load-pull measurement systems have become Delft, The Netherlands
FROM FROM
LO LO
RF @ f0
RF @ f0
ON-WAFER CONFIGURATION
PA @ f0 PA @ f0
TO DC TO DC
DUT
BIAS BIAS
INPUT TEE TEE OUTPUT
SECTION SECTION
I V BASEBAND I V
PA @ 2f0 PA @ 2f0
TO DC TO DC
DUT
BASEBAND I V BASEBAND I V
PracTicaL imPLemenTaTion
The block diagram of the system im-
plementation is shown in Figure 5. The
wideband reflection coefficients at the
DUT reference planes are measured
by coupling the traditional mixer-based
super-heterodyne down-conversion
used in conventional VNAs with wide-
114 Visit http://mwj.hotims.com/28494-73 • See us at EuMW Stand 62 MICROWAVE JOURNAL SEPTEMBER 2010
T echnical F eaTure
s Fig. 6 Source and load reflection coefficients at the device refer- ACLR2 Ch. 2 -39.6 dBc -39.2 dBc
ence plane. significant performance degradation for the measured ac-
MHz for the fundamental source and load and 4.6°/ tive device when the electrical delay is present in the reflec-
MHz for the 2nd harmonic source and load tion coefficients. This is also evident from Figure 7, which
Figure 6 illustrates the source and load matching condi- shows the power spectral density at the device output refer-
tions in the fundamental (2.1225 to 2.1575 GHz) and har- ence plane for the fundamental and 2nd harmonic frequency
monic (4.245 to 4.315 GHz) frequency range provided to bands. Note that a 5 dB output power drop and close to 8
the active device under test, with electrical delay (open sym- percent degradation of the power added efficiency (PAE)
bols) and without electrical delay (filled symbols). Note that can be observed, when compared to the case with no electri-
the filled markers represent the source and loading condi- cal delay. It is important to stress that this performance deg-
tions for the two-carrier W-CDMA signal without any elec- radation is a measurement artifact, the result of an incorrect
trical delay, yielding completely overlapping points in the measurement, which would mislead the user in judging the
Smith chart. As shown in Figure 6, for the case with electri- device performance.
cal delay, the fundament load trajectory has been shifted,
acTive Load injecTion PoWer and LineariTy
such that the optimum matching condition is now centered
at 2.135 GHz. This was required to avoid the unstable region To provide the DUT with a specific ΓL, a certain in-
of the active device. jection power is needed, which not only depends on the
It is important to note that this is a comparison to the “best output power of the DUT and the desired ΓL, but also on
possible case” of a classical closed-loop active load-pull sys- the output impedance of the device.10 When considering
tem, since practical closed-loops will be subject to amplitude high-power devices, with output impedances in the or-
variations within the control frequency bands. Moreover, der of few Ohms, the required injection power to cover
oscillation condi- the desired Smith chart area can be extremely high (2 to
WITHOUT DELAY
tions in closed-loop 10 times higher than the maximum output power of the
WITH DELAY
systems for these DUT). To overcome this issue, typically, a pre-matching
OUTPUT POWER SPECTRAL
–10
very large band- is used, which converts the 50 Ω impedance of the system
to a value that is much closer to the output impedance of
DENSITY (dBm/Hz)
–20
widths are difficult
–30
to avoid, due to the the DUT, thus reducing the power requirement of the load
–40 usage of wideband injection amplifier.
–50 loop filters. Passive To give an example, a DUT with an output impedance
load-pull systems of 2 Ω and an available output power of 200 W requires,
–60
will have a com- when the system impedance is pre-matched to 10 Ω, an
–70
2.125 2.135 2.145 2.155 parable variation injection power of 360 W to synthesize a load impedance
FREQUENCY (GHz) of the reflection of 1 Ω. Reducing the system pre-matched impedance to
(a)
coefficients versus 5 Ω lowers the required injection power for the same load
frequency than the condition to 142.2 W.
OUTPUT POWER SPECTRAL
–20
closed-loop system When considering multi-tone or modulated signals, the
situation becomes more complicated as the linearity of the
DENSITY (dBm/Hz)
The measure- 2 2 2
(1 − Γ DUT ) ZDUT + Z0 Z − ZSYS
s Fig. 7 Measured output power spec- ment results are = 3Pb , fund ⋅ ⋅ L − 2IP3,a
tral density vs. frequency of a NXP GEN6 2 2 2
(1 − Γ SYS ) ZSYS + Z0 ZDUT + ZL
2 2
INCORRECT IM3
–25
MEASUREMENT
yield an actual IM3
–30 of the DUT of -30.35 references
dBc. From Figure 1. S.C. Cripps, RF Power Amplifier Design for Wireless Communications,
–35 CORRECT IM3 Artech House Inc., Norwood, MA, 1999.
MEASUREMENT 9, it can be seen 2. Maury Microwave Application Note 5C-081, “Cascading Tuners for High-
–40
that this level (a cor- VSWR and Harmonic Load Pull,” January 2009.
–45 rect measurement) 3. C. Tsironis, R. Meierer, B. Hosein, T. Beauchamp and R. Jallad, “MPT, a Uni-
75 73 71 69 67 65 63 61 59
versal Multi-purpose Tuner,“ 2005 Automatic RF Techniques Group Confer-
OIP3 INJECTION AMPLIFIER (dBm) is only achieved for ence Digest, pp. 113-117.
sufficiently high IP3 4. G.P. Bava, U. Pisani and V. Pozzolo, “Active Load Technique for Load-pull
s Fig. 9 Harmonic balance simulated IM3 of the injection am- Characterization at Microwave Frequencies,” Electronic Letters, Vol. 18, No.
level vs. output IP3. 4, February 18, 1982, pp. 178-180.
plifier. When the
5. Y. Takayama, “A New Load-pull Characterization Method for Microwave
AVERAGE PAE (%) FOR 30 W OUTPUT POWER
injection amplifier Power Transistors,” 1976 IEEE MTT-S International Microwave Symposium
ACPR (dB) FOR 30 W OUTPUT POWER is less linear, it will Digest, pp. 218-220.
introduce significant 6. M. Marchetti, M. Pelk, K. Buisman, E. Neo, M. Spirito and L.C.N. de
0
Vreede, “Active Harmonic Load Pull with Realistic Wideband Communica-
IM3 products, which tion Signals,” IEEE Transactions on Microwave Theory and Techniques, Vol.
–0.1
can be approximated 56, No. 12, Part 2, December 2008, pp. 2979-2988.
–0.2 by Equation 4, and 7. 3GPP TS 25.104 V4.1.0 (2001-06), 3rd Generation Partnership Project;
Technical Specification Group Radio Access Networks; UTRA (BS) FDD;
–0.3 are also plotted in Radio Transmission and Reception.
33
32. .7 Figure 9. Note that 8. 3GPP TS 25.141 V4.1.0 (2001-06), 3rd Generation Partnership Project;
–0.4 3
30.
29. 9 IM3 cancelation ef- Technical Specification Group Radio Access Networks; Base station confor-
–0.5 5 fects can also occur. mance testing (FDD)
262.8.2
2 8 9. M. Spirito, M. Pelk, F. van Rijs, S.J.C.H. Theeuwen, D. Hartskeerl and
24.5.4 –34.9 Consequently, to
–0.6 212 2 0 L.C.N. de Vreede, “Active Harmonic Load Pull for On-wafer Out-of-band
. .0 –34.3
19.2
9
–33.3
–32.2
have reliable linear- Device Linearity Optimization,” IEEE Transactions on Microwave Theory
–0.7
–31.2 ity measurements in and Techniques, Vol. 54, No. 12, Part 1, December 2006, pp. 4225-4236.
10. Z. Aboush, C. Jones, G. Knight, A. Sheikh, H. Lee, J. Lees, J. Benedikt and
–0.8
–0.5 –0.3 –0.1 0.1
a conventional active P.J. Tasker, “High Power Active Harmonic Load-pull System for Character-
load-pull setup, even ization of High Power 100 W Transistors,” 2005 European Microwave Con-
s Fig. 10 Measured load-pull contours of when pre-matching ference Digest, pp. 609-612.
average power added efficiency and ACPR is used, the injection
for an averaged output power of 30 W.