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Visible Penetrant Testing Using Solvent-Removable Process: Standard Practice For
Visible Penetrant Testing Using Solvent-Removable Process: Standard Practice For
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This practice is under the jurisdiction of ASTM Committee E07 on Nonde- For referenced ASTM standards, visit the ASTM website, www.astm.org, or
structive Testing and is the direct responsibility of Subcommittee E07.03 on Liquid contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Penetrant and Magnetic Particle Methods. Standards volume information, refer to the standard’s Document Summary page on
Current edition approved Feb. 15, 2010. Published March 2010. Originally the ASTM website.
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approved in 1987. Last previous edition approved in 2005 as E1220 - 05. DOI: Available from The American Society for Nondestructive Testing (ASNT), P.O.
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Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
DRY
(See 7.1.3.2) Dry
REMOVE Solvent
(See 7.1.5) Wipe-Off
DRY
(See 7.1.6) Dry
DEVELOP Nonaqueous
(See 7.1.7) Wet or Liquid
Aqueous
Film Developer
Developer
DRY
(See 7.1.6) Dry
EXAMINE
(See 7.1.8) Examine
Mechanical
Wash
Detergent
POST CLEAN
(See 7.1.10 and Practice
E165, Annex on Post
Cleaning) Dry
Outgoing Parts
FIG. 1 Solvent-Removable Visible Penetrant Examination General Procedure Flowsheet
ceramic in the densified condition. When only loose surface Surface Conditioning and Annex on Acid Etching in Test
residuals are present, these may be removed by wiping the Method E165 for general precautions relative to surface
surface with clean lint-free cloths. However, precleaning of preparation.)
metals to remove processing residuals such as oil, graphite, NOTE 2—When agreed between purchaser and supplier, grit blasting
scale, insulating materials, coatings, and so forth, should be without subsequent etching may be an acceptable cleaning method.
done using cleaning solvents, vapor degreasing or chemical (Warning—Sand or shot blasting may possibly close indications and
removing processes. Surface conditioning by grinding, ma- extreme care should be used with grinding and machining operations.)
chining, polishing or etching shall follow shot, sand, grit and NOTE 3—For structural or electronic ceramics, surface preparation by
vapor blasting to remove the peened skin and when penetrant grinding, sand blasting and etching for penetrant examination is not
entrapment in surface irregularities might mask the indications recommended because of the potential for damage.
of unacceptable discontinuities or otherwise interfere with the 7.1.3 Removal of Surface Contaminants:
effectiveness of the examination. For metals, unless otherwise 7.1.3.1 Precleaning—The success of any penetrant exami-
specified, etching shall be performed when evidence exists that nation procedure is greatly dependent upon the surface and
previous cleaning, surface treatments or service usage have discontinuity being free of any contaminant that might interfere
produced a surface condition that degrades the effectiveness of with the penetrant process. All parts or areas of parts to be
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the examination. (See Annex on Mechanical Cleaning and inspected must be clean and dry before the penetrant is applied.
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sensitivity of the examination. A minimum light intensity at the decided between supplier and user on a case by case basis.
examination site of 100 fc (1000 lux) is recommended. 8.2 Elevated Temperature Examination—Where penetrant
7.1.8.2 Housekeeping—Keep the examination area free of examination is performed on parts that must be maintained at
interfering debris. Practice good housekeeping at all times. elevated temperature during examination, special materials and
7.1.9 Evaluation—Unless otherwise agreed upon, it is nor- processing techniques may be required. Such examination
mal practice to interpret and evaluate the discontinuity indica- requires qualification in accordance with 9.2. Manufacturer’s
tion based on the size of the stain created by the developer’s recommendations should be observed.
absorption of the penetrant (see Reference Photographs E433).
7.1.10 Post Cleaning—Post cleaning is necessary in those 9. Qualification and Requalification
cases where residual penetrant or developer could interfere 9.1 Personnel Qualification—Unless otherwise specified by
with subsequent processing or with service requirements. It is client/supplier agreement, all examination personnel shall be
particularly important where residual penetrant examination qualified/certified in accordance with a written procedure
materials might combine with other factors in service to conforming to the latest edition of Recommended Practice
produce corrosion. A suitable technique, such as a machine SNT-TC-1A, ANSI/ASNT-CP-189, NAS-410, or MIL-STD-
wash, vapor degreasing, solvent soak, or ultrasonic cleaning 410.
may be employed (see Test Method E165, Annex on Post 9.2 Procedure Qualification—Qualification of procedure
Cleaning). In the case of developers, it is recommended that if using conditions or times differing from those specified or for
post cleaning is necessary, it be carried out as promptly as new materials may be performed by any of several methods
possible after examination so that it does not fix on the part. and should be agreed upon by the contracting parties. A test
(Warning—Developers should be removed prior to vapor piece containing one or more discontinuities of the smallest
degreasing. Vapor degreasing can bake developer on parts.) relevant size is used. The test piece may contain real or
simulated discontinuities, providing it displays the character-
8. Special Requirements istics of the discontinuities encountered in production exami-
8.1 Impurities: nations.
8.1.1 When using penetrant materials on austenitic stainless 9.3 Nondestructive Testing Agency Qualification—If a
steels, titanium, nickel-base or other high-temperature alloys, nondestructive testing agency as described in Practice E543 is
the need to restrict impurities such as sulfur, halogens, and used to perform the examination, the agency shall meet the
alkali metals must be considered. These impurities may cause requirements of Practice E543.
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