ENGINEERING WORKSHOP

NAME: Arsalan Ahmed

ID: aa03980
SECTION: T2
DATE PERFORMED: 15th January 2018
DATE SUBMITTED: 22th January 2018
INSTRUCTOR’s NAME: Zeeshan Nafees

EXPERIMENT # 1:
INTRODUCTION TO SOLDERING AND
DESOLDERING TECHNIQUES.
Introduction/Purpose:
The main purpose of this lab is to make students learn the important techniques of
Soldering and Desoldering which are used to make solid connections between
components on a circuit and “glue” the circuit components permanently together that
result in better circuits as these circuits are more durable and have strong connections
as compared to the circuits made using a large number of wires.
For this purpose, the students will be heating a special kind of wire (solder) at a very
high temperature and form paths using this solder wire that will serve as connections
between the different components of the circuit on a Veroboard.

EQUIPMENTS:
• Soldering Station.
• Soldering Sucker.

MATERIAL USED:
• Soldering Flux
• Soldering Wire
• Vero Board.
• Sprit Liquid.
• High Temperature Foam

Method:
1. Place all the required components of the circuit on the Veroboard according to
the given schematic.
2. Plug in the soldering iron to the power supply and give it some time to get heated.
3. Once the soldering iron is hot enough take the soldering wire and soldering iron,
place the tip of soldering iron directly on the wire, holding it against the legs of
every component of the circuit protruding from the other side of the Veroboard.
4. Apply the melted solder wire on to the Veroboard such that the soldering wire
falls on the pins/legs of the component, making a joint and fixing the component
to the Veroboard.
5. Repeat step 4 for all the components and also, for forming paths (connections)
between the pins/legs of the components of the circuit.
6. In case if there is a faulty joint, we de-solder the joint by first heating up the part
which is wrongly soldered. Then, using de-soldering equipment (sucker or wick),
we remove the solder and then solder again correctly.
Figures:
Figure 1: Schematic

Figure 2: Circuit made during the workshop (Front View)

Figure 3: (Back View)

Result:
The circuit for the given schematic was successfully implemented using the soldering
and de-soldering techniques as the joints of the components were perfectly attached to
the Veroboard making a complete and working circuit. The diagram of my circuit in
working condition is attached above in figures 2 and 3 .

Post Lab Task:

1. Implement 555 Timer IC Based Circuit as shown in the figure on Vero-
board.
Figure 6: Schematic

Figure 5: Circuit made for the post-lab task (Front View)

Figure 6: Back View

2. What is Soldering?
Ans. Soldering is a process in which two or more items (usually metal) are joined
together by melting and putting a filler metal (solder) into the joint, the filler metal
having a lower melting point than the adjoining metal.
3. What is Solder?
Solder is an alloy of tin and lead with composition of tin (60%) and lead (40%). Solder
alloy melts at around 200 °C. Solder is used extensively in electronics to make complex
circuits by joining the components together and making connections between them by
melting it at high temperature using soldering station.
4. What is a cold solder Joint? Discuss its causes & appearance?
A 'Cold Solder Joint' is one where the solder did not melt completely. Cold joints are
unreliable and are often characterized by a rough or lumpy surface. The solder bond will
not be strong and cracks develop in the joint over time which could be broken after a
little while which may lead to circuit dysfunction. Cold joints can usually be repaired by
simply re-heating of the joint with a hot iron until the solder flows. A properly pre-
heated soldering iron with sufficient power will help prevent cold joints.
5. What we exactly do to move a soldered component to a different location
on the board?
We first melt the solder at that component by heating it with solder iron. Then, we use
the de-soldering equipment (sucker or wick) and extract the solder while it is in the
melted state. This process is called de-soldering. Next, we relocate the component to the
right place and solder it again.