CALCULATION OF CABLE IMPEDANCES (Flat Formation)

A. Calculation Conditions:
1) Reference Standard IEC 60287 & Electric Cable Handbook BICC 3rd Ed.
2) System Volatage [kV]
3) Frequency [Hz]
4) Maximum Operating Conductor Temperature [°C]
5) Nominal Conductor Cross Section Area [mm²]
6) Conductor Material
7) Sheath Bonding Method Cross bonding
8) Cable Arrangement Flat Formation
9) Axial Cable Distance of Phase

B. Calculation Procedure:

1) AC Resistance of Conductor at Maximum Temperature

1.1) DC Resistance of conductor at maximum temperature

𝑅𝑥=𝑅20 [ 1+ 𝛼(𝜃𝑚𝑎𝑥 −20)] [Ω/m]

where,
R 20 : DC resistance of conductor at 20 °C [Ω/m]
a : Temperature coefficient of conductor
θmax : Maximum conductor temperature [°C]

1.2) Skin Effect Factor

λs =

For 0 < Xs ≤ 2.8

𝜆𝑠 = (𝑋_𝑠^4)/(192+0.8𝑋_𝑠^4 )

For 2.8 < Xs ≤ 3.8

𝜆𝑠 = −0.136−0.0177𝑋𝑠+0.563 𝑋_𝑠^2

For Xs ˃ 3.8

𝜆𝑠 = 0.354𝑋𝑠− 0. 733

𝑋_𝑠^2= 8𝜋𝑓/𝑅_𝑥 〖 10 〗 ^(−7) 𝐾_𝑠

Where,
𝑓 : System frequency [Hz]
 Ks : Factor used in calculating skin effect
Xs :

1.3) Proximity Effect Factor

𝜆_𝑝 = (𝑋_𝑝^4)/(192+0.8𝑋_𝑝^4 ) (𝑑_1/𝑆)2

[0.312(𝑑_1/𝑆)2 + 1.18/((𝑋_𝑝^4)/(192+0.8𝑋_𝑝^4 )
+0.27)]

𝑋_𝑝^2= 8𝜋𝑓/𝑅_𝑥 〖 10 〗 ^(−7) 𝐾_𝑝

Where,
d1 : Conductor diameter [mm]
Kp : Factor used in calculating proximity effect
S : Axial distance of the conductor [mm]

1.4) AC Resistance at maximum conductor temperature

𝑅_𝑎𝑐= 𝑅_𝑥 (1+ 𝜆_𝑠+𝜆_𝑝 ) [Ω/m]

2) Inductive Reactance between conductors

𝑋_𝐿=2𝜋𝑓∙𝐿∙ 〖 10 〗 ^(−3) [Ω/km]

Where,
𝑓 : System frequency [Hz]
L : Inductance between conductors [mH/km]
𝐿 =0.2 ln⁡〖 (2𝑆/𝑑)+𝐾 〗
[mH/km]

K : Constant factor
S : Axial Spacing between conductors
For Flat Formation S is multiplied by 1.26 [mm]
d1 : Conductor diameter [mm]

3) Positive (Negative) Phase Sequence Impedance

𝑍=√(𝑅_𝑎𝑐^2+𝑋_𝐿^2 )
[Ω/km]

Where,
Rac : AC resistance of conductor [Ω/km]
XL : Inductive reactance between conductors [Ω/km]
 4) Zero Sequence Resistance per phase
4.1) AC Resistance of Conductor at 20°C
for Zero sequence proximity effect is neglected

𝑅_𝑎𝑐= 𝑅_𝑥 (1+ 𝜆_𝑠 ) [Ω/m]

where,
𝑅𝑥=𝑅20 [ 1+ 𝛼(𝜃𝑚𝑎𝑥 −20)] ∴𝑅𝑥=𝑅20
Since at 20°C therefore
R 20 : DC resistance of conductor at 20 °C [Ω/m]
λs : Skin Effect

4.2) Resistance of Metallic Layer

𝑅_(𝑆 )= (𝑅_𝑇×𝑅_𝐿𝑆)/(𝑅_𝑇+𝑅_𝐿𝑆 )
[Ω/m]

4.2.1) Resistance of Copper Wire Shield at 20°C

𝑅_𝑐𝑤𝑠= ( 𝜌_𝑐𝑤𝑠 √(1+ ((𝜋 𝑑_𝑛)/𝑙_𝑛 )^2 ) {1+𝛼_𝑐𝑤𝑠 (𝜃_𝑐𝑤𝑠−20)})/((𝜋/4)×(𝑑_𝑐𝑤𝑠^2×𝑁_𝑐𝑤𝑠 ) )

[Ω/m]

Where,
acws : Temperature coefficient of copper wire shield
θcws : Copper wire shield temperature [°C]
dcws : Diameter of copper wire shield [m]
Ncws : Number of copper wire shield [Nos]
rcws : Resistivity of copper wire shield [Ω.m]
dn : Mean diameter of Copper wire shield [m]
Ln : Lay Length of Copper wire shield [m]

4.2.2) Resistance of Copper Tape at 20°C

𝑅_𝐶𝑇= ( 𝜌_𝐶𝑇 √(1+ ((𝜋 𝑑_𝑛1)/𝑙_𝑛1 )^2 ) {1+𝛼_𝐶𝑇 (𝜃_𝐶𝑇−20)})/((𝑡_𝐶𝑇×𝑤_𝐶𝑇 ) )

[Ω/m]

Where,
aCT : Temperature coefficient of copper tape [°C]
θCT : Copper Tape temperature [°C]
wCT : Width of Copper tape [m]
tCT : Thickness of Copper Tape [m]
rcws : Resistivity of Copper Tape [Ω.m]
dn1 : Mean diameter of Copper Tape [m]
 Ln1 : Lay Length of Copper Tape [m]

4.2.3) Combined Resistance of Copper wire shield and Copper tape at 20°C

𝑅_𝑇=(𝑅_𝑐𝑤𝑠×𝑅_𝐶𝑇)/ [Ω/m]
(𝑅_𝑐𝑤𝑠+𝑅_𝐶𝑇 )

4.2.4) Resistance of Lead Sheath at 20°C

𝑅_𝐿𝑆=(4 𝜌_(𝐿𝑆 ) {1+𝛼_𝐿𝑆 (𝜃_𝐿𝑆−20)})/((𝜋)∙(𝑑_𝐿𝑆2^2−𝑑_𝐿𝑆1^2 ) ) 〖∙ 10 〗 ^6

[Ω/m]

Where,
aLS : Temperature coefficient of Lead Sheath
θLS : Lead Sheath temperature [°C]
d LS1
2
: Inner Diameter of Lead Sheath [mm]
d LS2
2
: Outer Diameter of Lead Sheath [mm]
rLS : Resistivity of Lead Sheath [Ω.m]

4.2.5) Equivalent Resistance of Metallic Sheath at 20°C

𝑅_(𝑆 )= (𝑅_𝑇×𝑅_𝐿𝑆)/(𝑅_𝑇+𝑅_𝐿𝑆 )
[Ω/m]

4.3) Zero Sequence Resistance per phase

𝑅_0=𝑅_𝐴𝐶+𝑅_𝑆 [Ω/km]

5) Zero Sequence Reactance per phase

𝑋_0=2𝜋𝑓∙𝐿∙ 〖 10 〗 ^(−3) [Ω/km]

Where,
𝑓 : System frequency [Hz]
L : Inductance between conductors [mH/km]
𝐿 =0.2 ln⁡〖 (𝐷/𝑑)+𝐾 〗
[mH/km]

K : Constant factor
D : Mean Diameter of Sheath (CWS&LEAD) [mm]
𝐷=𝐷_𝑜𝑢𝑡𝐿𝐸𝐴𝐷−𝑡_(𝐶𝑊𝑆&𝐿𝐸𝐴𝐷)
𝑡_(𝐶𝑊𝑆&𝐿𝐸𝐴𝐷)= (𝐷_𝑜𝑢𝑡𝐿𝐸𝐴𝐷−𝐷_𝑖 )∕2 [mm]
DoutLEAD : Outer Diameter of Lead Sheath [mm]
d1 : Conductor diameter [mm]
 6) Zero Sequence Impedance per phase
𝑍_0=√(𝑅_0^2+𝑋_0^2 )
[Ω/km]

Where,
R0 : Zero sequence resistance per phase [Ω/km]
X0 : Zero Sequence reactance per phase [Ω/km]

7) Surge Impedance
𝑍_ =(60/√𝜀)×ln⁡(𝐷_𝑖/𝑑_𝑐𝑠 )
[Ω]

Where,
Ɛ : Relative permitivity of Insulation
Di : External diameter of insulation [mm]
dcs : Diameter of conductor screen [mm]

C. Tabulation of Calculated Results

Positive(Negative) Sequence Impedance 0.014+0.225j 0.2254

Zero Sequence Impedance 0.069+0.063j 0.0934

Surge Impedance 21.818

Handbook BICC 3rd Ed.
220
50
90
2000
Copper
Cross bonding
Flat Formation
600

1.15E-05

9.00E-06 Value taken from IEC 60228 Table 2

3.93E-03 Value taken from IEC 60287 1-1 Table 1
90

0.201

2.01E-01

3.640081

0.189524

6.789

50
 0.62 New Value taken From IEC 60287 1-1 Table 2 Revision 2014
2.606

2.25E-03

4.052

54.8
0.37 Value Taken from IEC 60287 1-1 Table 2
600

1.38E-05

0.224592

50
0.7149

0.7149 From Electric Cables Handbook, 3rd Edition BICC

No of wires K
0.0514 3 0.0778
7 0.0642
756 19 0.0554
54.8 37 0.0528
61 and over 0.0514
1 (Solid) 0.05
Hollow core 0.0383

0.2254

0.0140
0.2250
 1.08E-05

9.00E-06
0.201

5.78E-05

8.99E-05

3.93E-03
20
0.002
68
1.724E-08
0.1123
0.72

2.10E-01

3.93E-03
20
0.0025
0.0001
1.724E-08
0.1144
 0.125

8.98E-05

1.62E-04

4.00E-03
20
116.3
123.3
2.14E-07

5.78E-05

6.87E-02

0.063401

50
2.02E-01

2.02E-01

0.0514
116.25

7.05
123.3
54.8
 0.0934

0.0690
0.0630

21.818

2.5
105.2
59.2

[Ω/km]

[Ω/km]

[Ω]
CALCULATION OF CABLE IMPEDANCES (Trefoil Formation)

A. Calculation Conditions:
1) Reference Standard IEC 60287 & Electric Cable Handbook BICC 3rd Ed.
2) System Volatage [kV]
3) Frequency [Hz]
4) Maximum Operating Conductor Temperature [°C]
5) Nominal Conductor Cross Section Area [mm²]
6) Conductor Material
7) Sheath Bonding Method Cross bonding
8) Cable Arrangement Trefoil Formation
9) Axial Cable Distance of Phase [mm]

B. Calculation Procedure:

1) AC Resistance of Conductor at Maximum Temperature

1.1) DC Resistance of conductor at maximum temperature

𝑅𝑥=𝑅20 [ 1+ 𝛼(𝜃𝑚𝑎𝑥 −20)] [Ω/m]

where,
R 20 : DC resistance of conductor at 20 °C [Ω/m]
a : Temperature coefficient of conductor
θmax : Maximum conductor temperature [°C]

1.2) Skin Effect Factor

λs =

For 0 < Xs ≤ 2.8

𝜆𝑠 = (𝑋_𝑠^4)/(192+0.8𝑋_𝑠^4 )

For 2.8 < Xs ≤ 3.8

𝜆𝑠 = −0.136−0.0177𝑋𝑠+0.563 𝑋_𝑠^2

For Xs ˃ 3.8

𝜆𝑠 = 0.354𝑋𝑠− 0. 733

𝑋_𝑠^2= 8𝜋𝑓/𝑅_𝑥 〖 10 〗 ^(−7) 𝐾_𝑠

Where,
𝑓 : System frequency [Hz]
 Ks : Factor used in calculating skin effect
Xs :

1.3) Proximity Effect Factor

𝜆_𝑝 = (𝑋_𝑝^4)/(192+0.8𝑋_𝑝^4 ) (𝑑_1/𝑆)2

[0.312(𝑑_1/𝑆)2 + 1.18/((𝑋_𝑝^4)/(192+0.8𝑋_𝑝^4 )
+0.27)]

𝑋_𝑝^2= 8𝜋𝑓/𝑅_𝑥 〖 10 〗 ^(−7) 𝐾_𝑝

Where,
d1 : Conductor diameter [mm]
Kp : Factor used in calculating proximity effect
S : Axial distance of the conductor [mm]

1.4) AC Resistance at maximum conductor temperature

𝑅_𝑎𝑐= 𝑅_𝑥 (1+ 𝜆_𝑠+𝜆_𝑝 ) [Ω/m]

2) Inductive Reactance between conductors

𝑋_𝐿=2𝜋𝑓∙𝐿∙ 〖 10 〗 ^(−3) [Ω/km]

Where,
𝑓 : System frequency [Hz]
L : Inductance between conductors [mH/km]
𝐿 =0.2 ln⁡〖 (2𝑆/𝑑)+𝐾 〗
[mH/km]

K : Constant factor
S : Axial Spacing between conductors [mm]
d1 : Conductor diameter [mm]

3) Positive (Negative) Phase Sequence Impedance

𝑍=√(𝑅_𝑎𝑐^2+𝑋_𝐿^2 )
[Ω/km]

Where,
Rac : AC resistance of conductor [Ω/km]
XL : Inductive reactance between conductors [Ω/km]
 4) Zero Sequence Resistance per phase
4.1) AC Resistance of Conductor at 20°C
for Zero sequence proximity effect is neglected

𝑅_𝑎𝑐= 𝑅_𝑥 (1+ 𝜆_𝑠 ) [Ω/m]

where,
𝑅𝑥=𝑅20 [ 1+ 𝛼(𝜃𝑚𝑎𝑥 −20)] ∴𝑅𝑥=𝑅20
Since at 20°C therefore
R 20 : DC resistance of conductor at 20 °C [Ω/m]
λs : Skin Effect

4.2) Resistance of Metallic Layer

𝑅_(𝑆 )= (𝑅_𝑇×𝑅_𝐿𝑆)/(𝑅_𝑇+𝑅_𝐿𝑆 )
[Ω/m]

4.2.1) Resistance of Copper Wire Shield at 20°C

𝑅_𝑐𝑤𝑠= ( 𝜌_𝑐𝑤𝑠 √(1+ ((𝜋 𝑑_𝑛)/𝑙_𝑛 )^2 ) {1+𝛼_𝑐𝑤𝑠 (𝜃_𝑐𝑤𝑠−20)})/((𝜋/4)×(𝑑_𝑐𝑤𝑠^2×𝑁_𝑐𝑤𝑠 ) )

[Ω/m]

Where,
acws : Temperature coefficient of copper wire shield
θcws : Copper wire shield temperature [°C]
dcws : Diameter of copper wire shield [m]
Ncws : Number of copper wire shield [Nos]
rcws : Resistivity of copper wire shield [Ω.m]
dn : Mean diameter of Copper wire shield [m]
Ln : Lay Length of Copper wire shield [m]

4.2.2) Resistance of Copper Tape at 20°C

𝑅_𝐶𝑇= ( 𝜌_𝐶𝑇 √(1+ ((𝜋 𝑑_𝑛1)/𝑙_𝑛1 )^2 ) {1+𝛼_𝐶𝑇 (𝜃_𝐶𝑇−20)})/((𝑡_𝐶𝑇×𝑤_𝐶𝑇 ) )

[Ω/m]

Where,
aCT : Temperature coefficient of copper tape [°C]
θCT : Copper Tape temperature [°C]
wCT : Width of Copper tape [m]
tCT : Thickness of Copper Tape [m]
rcws : Resistivity of Copper Tape [Ω.m]
dn1 : Mean diameter of Copper Tape [m]
 Ln1 : Lay Length of Copper Tape [m]

4.2.3) Combined Resistance of Copper wire shield and Copper tape at 20°C

𝑅_𝑇=(𝑅_𝑐𝑤𝑠×𝑅_𝐶𝑇)/ [Ω/m]
(𝑅_𝑐𝑤𝑠+𝑅_𝐶𝑇 )

4.2.4) Resistance of Lead Sheath at 20°C

𝑅_𝐿𝑆=(4 𝜌_(𝐿𝑆 ) {1+𝛼_𝐿𝑆 (𝜃_𝐿𝑆−20)})/((𝜋)∙(𝑑_𝐿𝑆2^2−𝑑_𝐿𝑆1^2 ) ) 〖∙ 10 〗 ^6

[Ω/m]

Where,
aLS : Temperature coefficient of Lead Sheath
θLS : Lead Sheath temperature [°C]
d LS1
2
: Inner Diameter of Lead Sheath [mm]
d LS2
2
: Outer Diameter of Lead Sheath [mm]
rLS : Resistivity of Lead Sheath [Ω.m]

4.2.5) Equivalent Resistance of Metallic Sheath at 20°C

𝑅_(𝑆 )= (𝑅_𝑇×𝑅_𝐿𝑆)/(𝑅_𝑇+𝑅_𝐿𝑆 )
[Ω/m]

4.3) Zero Sequence Resistance per phase

𝑅_0=𝑅_𝐴𝐶+𝑅_𝑆 [Ω/km]

5) Zero Sequence Reactance per phase

𝑋_0=2𝜋𝑓∙𝐿∙ 〖 10 〗 ^(−3) [Ω/km]

Where,
𝑓 : System frequency [Hz]
L : Inductance between conductors [mH/km]
𝐿 =0.2 ln⁡〖 (𝐷/𝑑)+𝐾 〗
[mH/km]

K : Constant factor
D : Mean Diameter of Sheath (CWS&LEAD) [mm]
𝐷=𝐷_𝑜𝑢𝑡𝐿𝐸𝐴𝐷−𝑡_(𝐶𝑊𝑆&𝐿𝐸𝐴𝐷)
𝑡_(𝐶𝑊𝑆&𝐿𝐸𝐴𝐷)= (𝐷_𝑜𝑢𝑡𝐿𝐸𝐴𝐷−𝐷_𝑖 )∕2 [mm]
DoutLEAD : Outer Diameter of Lead Sheath [mm]
d1 : Conductor diameter [mm]
 6) Zero Sequence Impedance per phase
𝑍_0=√(𝑅_0^2+𝑋_0^2 )
[Ω/km]

Where,
R0 : Zero sequence resistance per phase [Ω/km]
X0 : Zero Sequence reactance per phase [Ω/km]

7) Surge Impedance
𝑍_ =(60/√𝜀)×ln⁡(𝐷_𝑖/𝑑_𝑐𝑠 )
[Ω]

Where,
Ɛ : Relative permitivity of Insulation
Di : External diameter of insulation [mm]
dcs : Diameter of conductor screen [mm]

C. Tabulation of Calculated Results

Positive(Negative) Sequence Impedance 0.014+0.117j 0.1178

Zero Sequence Impedance 0.069+0.063j 0.0934

Surge Impedance 21.818

Handbook BICC 3rd Ed.
220
50
90
2000
Copper
Cross bonding
Trefoil Formation
136

1.15E-05

9.00E-06 Value taken from IEC 60228 Table 2

3.93E-03 Value taken from IEC 60287 1-1 Table 1
90

0.201

2.01E-01

3.640081

0.189524

6.789

50
 0.62 New Value taken From IEC 60287 1-1 Table 2 Revision 2014
2.606

4.45E-02

4.052

54.8
0.37 Value Taken from IEC 60287 1-1 Table 2
136

1.43E-05

0.116811

50
0.371822

0.371822 From Electric Cables Handbook, 3rd Edition BICC

No of wires K
0.0514 3 0.0778
136 7 0.0642
54.8 19 0.0554
37 0.0528
61 and over 0.0514
1 (Solid) 0.05
Hollow core 0.0383

0.1178

0.0140
0.1170
 1.08E-05

9.00E-06
0.201

5.78E-05

8.99E-05

3.93E-03
20
0.002
68
1.724E-08
0.1123
0.72

2.10E-01

3.93E-03
20
0.0025
0.0001
1.724E-08
0.1144
 0.125

8.98E-05

1.62E-04

4.00E-03
20
116.3
123.3
2.14E-07

5.78E-05

6.87E-02

0.063401

50
2.02E-01

2.02E-01

0.0514
116.25

7.05
123.3
54.8
 0.0934

0.0690
0.0630

21.818

2.5
105.2
59.2

[Ω/km]

[Ω/km]

[Ω]