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Irfr6215Pbf Irfu6215Pbf: V - 150V R 0.295 I - 13A
Irfr6215Pbf Irfu6215Pbf: V - 150V R 0.295 I - 13A
Irfr6215Pbf Irfu6215Pbf: V - 150V R 0.295 I - 13A
IRFU6215PbF
Standard Pack
Base part number Package Type Orderable Part Number
Form Quantity
IRFU6215PbF I-Pak Tube 75 IRFU6215PbF
Tube 75 IRFR6215PbF
IRFR6215PbF D-Pak
Tape and Reel Left 3000 IRFR6215TRLPbF
Thermal Resistance
Symbol Parameter Typ. Max. Units
RJC Junction-to-Case ––– 1.4
RJA Junction-to-Ambient ( PCB Mount) ––– 50 °C/W
RJA Junction-to-Ambient ––– 110
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IRFR/U6215PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage -150 ––– ––– V VGS = 0V, ID = -250µA
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– -0.20 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 0.295 VGS = -10V, ID = -6.6A
RDS(on) Static Drain-to-Source On-Resistance
––– ––– 0.58 VGS = -10V, ID = -6.6A TJ =150°C
VGS(th) Gate Threshold Voltage -2.0 ––– -4.0 V VDS = VGS, ID = -250µA
gfs Forward Trans conductance 3.6 ––– ––– S VDS = -50V, ID = -6.6A
––– ––– -25 VDS = -150V, VGS = 0V
IDSS Drain-to-Source Leakage Current µA
––– ––– -250 VDS = -120V,VGS = 0V,TJ =150°C
Gate-to-Source Forward Leakage ––– ––– -100 VGS = -20V
IGSS nA
Gate-to-Source Reverse Leakage ––– 100 VGS = 20V
Qg Total Gate Charge ––– ––– 66 ID = -6.6A
Qgs Gate-to-Source Charge ––– ––– 8.1 nC VDS = -120V
Qgd Gate-to-Drain Charge ––– ––– 35 VGS = -10V, See Fig. 6 and 13
td(on) Turn-On Delay Time ––– 14 ––– VDD = -75V
tr Rise Time ––– 36 ––– ID = -6.6A
ns
td(off) Turn-Off Delay Time ––– 53 ––– RG = 6.8
tf Fall Time ––– 37 ––– RD = 12See Fig. 10
Between lead
LD Internal Drain Inductance ––– 4.5 –––
,6mm (0.25in.)
nH
from package
LS Internal Source Inductance ––– 7.5 –––
and center of die contact
Ciss Input Capacitance ––– 860 ––– VGS = 0V
Coss Output Capacitance ––– 220 ––– pF VDS = -25V
Crss Reverse Transfer Capacitance ––– 130 ––– ƒ = 1.0MHz,See Fig. 5
Notes:
Repetitive rating; pulse width limited by max. junction temperature. (See Fig.11)
starting TJ = 25°C, L = 14mH, RG = 25, IAS = -6.6A.(See Fig.12)
ISD -6.6A, di/dt -620A/µs, VDD V(BR)DSS, TJ 175°C
Pulse width 300µs; duty cycle 2%.
This is applied for I-PAK, LS of D-PAK is measured between lead and center of die contact.
Uses IRF6215 data and test conditions.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994.
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IRFR/U6215PbF
100 100
VGS VGS
TOP - 15V TOP - 15V
- 10V - 10V
- 8.0V - 8.0V
- 7.0V - 7.0V
- 6.0V - 6.0V
- 5.5V - 5.5V
- 5.0V - 5.0V
BOTTOM - 4.5V BOTTOM - 4.5V
10 10
-4.5V
100 2.5
I D = -11A
R DS(on) , Drain-to-Source On Resistance
-ID , Drain-to-Source Current (A)
2.0
TJ = 25°C
1.5
(Normalized)
TJ = 175°C
10
1.0
0.5
VDS = -50V
20µs PULSE WIDTH VGS = -10V
1 0.0 A
A
4 5 6 7 8 9 10 -60 -40 -20 0 20 40 60 80 100 120 140 160 180
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IRFR/U6215PbF
2000 20
V GS = 0V, f = 1MHz I D = -6.6A
C iss = Cgs + C gd , Cds SHORTED VDS = -120V
C rss = C gd VDS = -75V
Ciss
1200 12
Coss
800 8
Crss
400 4
100 100
OPERATION IN THIS AREA LIMITED
BY R DS(on)
-ISD , Reverse Drain Current (A)
10µs
-I D , Drain Current (A)
TJ = 175°C
10
TJ = 25°C
10 100µs
1ms
TC = 25°C
TJ = 175°C
VGS = 0V Single Pulse 10ms
0.1 A 1 A
0.2 0.6 1.0 1.4 1.8 1 10 100 1000
-VSD , Source-to-Drain Voltage (V) -VDS , Drain-to-Source Voltage (V)
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IRFR/U6215PbF
14
12
-ID , Drain Current (A)
10
8
Fig 10a. Switching Time Test Circuit
6
0
25 50 75 100 125 150 175
TC , Case Temperature ( °C)
Fig 9. Maximum Drain Current vs. Case Temperature Fig 10b. Switching Time Waveforms
10
Thermal Response (ZthJC )
1 D = 0.50
0.20
0.10
PDM
0.05
0.1
0.02 t
1
0.01 t2
SINGLE PULSE Notes:
(THERMAL RESPONSE) 1. Duty factor D = t /t
1 2
2. Peak TJ = PDM x Z thJC + T
C
0.01 A
0.00001 0.0001 0.001 0.01 0.1 1
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IRFR/U6215PbF
800
ID
400
200
Fig 12a. Unclamped Inductive Test Circuit
0 A
25 50 75 100 125 150 175
Starting TJ , Junction Temperature (°C)
Fig 13a. Gate Charge Waveform Fig 13b. Gate Charge Test Circuit
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IRFR/U6215PbF
Fig 14. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
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IRFR/U6215PbF
D-Pak (TO-252AA) Package Outline (Dimensions are shown in millimeters (inches))
PART NUMBER
INTERNATIONAL
OR RECTIFIER IRFR120
DATE CODE
P = DESIGNATES LEAD-FREE
LOGO PRODUCT (OPTIONAL)
12 34
P = DESIGNATES LEAD-FREE
ASSEMBLY PRODUCT QUALIFIED TO THE
CONSUMER LEVEL (OPTIONAL)
LOT CODE
YEAR 1 = 2001
WEEK 16
A = ASSEMBLY SITE CODE
Note: For the most current drawing please refer to Infineon’s web site www.infineon.com
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IRFR/U6215PbF
I-Pak (TO-251AA) Package Outline Dimensions are shown in millimeters (inches)
OR
PART NUMBER
INTERNATIONAL
RECTIFIER IRFU120 DATE CODE
LOGO P = DESIGNATES LEAD-FREE
56 78 PRODUCT (OPTIONAL)
YEAR 1 = 2001
ASSEMBLY
LOT CODE WEEK 19
A = ASSEMBLY SITE CODE
Note: For the most current drawing please refer to Infineon’s web site www.infineon.com
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IRFR/U6215PbF
D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches)
TR TRR TRL
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
13 INCH
16 mm
NOTES :
1. OUTLINE CONFORMS TO EIA-481.
Note: For the most current drawing please refer to Infineon’s web site www.infineon.com
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IRFR/U6215PbF
Qualification Information†
Industrial
Qualification Level
(per JEDEC JESD47F) ††
D-Pak MSL1
Moisture Sensitivity Level
I-Pak (per JEDEC J-STD-020D) ††
RoHS Compliant Yes
Revision History
Date Comments
Updated datasheet with corporate template.
5/31/2016
Added disclaimer on last page.
Trademarks of Infineon Technologies AG
µHVIC™, µIPM™, µPFC™, AU‐ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™,
DAVE™, DI‐POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™,
HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my‐d™, NovalithIC™, OPTIGA™,
Op MOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO‐SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™,
SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™
Trademarks updated November 2015
Other Trademarks
All referenced product or service names and trademarks are the property of their respec ve owners.
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