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  • VR Conditioner v3.1 - PNP

    Uploaded by

    Freddy Campos
    116 views2 pages
    This document contains a list of 65 items with their coordinates, values, packages, orientations and names for components in a VR Conditioner v3 project. The components include capacitors, resistors, integrated circuits, connectors and copper fills placed on the top and bottom sides of a PCB. The origin is at the lower left corner of the PCB and coordinates are in millimeters.

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    Original Title

    VR Conditioner v3.1_pnp

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    This document contains a list of 65 items with their coordinates, values, packages, orientations and names for components in a VR Conditioner v3 project. The components include capacitors, resistors, integrated circuits, connectors and copper fills placed on the top and bottom sides of a PCB. The origin is at the lower left corner of the PCB and coordinates are in millimeters.

    Copyright:

    © All Rights Reserved
    Download as TXT, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as txt, pdf, or txt
    116 views2 pages

    VR Conditioner v3.1 - PNP

    Uploaded by

    Freddy Campos
    This document contains a list of 65 items with their coordinates, values, packages, orientations and names for components in a VR Conditioner v3 project. The components include capacitors, resistors, integrated circuits, connectors and copper fills placed on the top and bottom sides of a PCB. The origin is at the lower left corner of the PCB and coordinates are in millimeters.

    Copyright:

    © All Rights Reserved
    Download as TXT, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as txt, pdf, or txt
    of 2

    *Pick And Place List

    *Company=
    *Author=
    *eMail=
    *
    *Project=VR Conditioner v3
    *Date=13:46:42
    *CreatedBy=Fritzing 0.9.3b.04.19.5c895d327c44a3114e5fcc9d8260daf0cbb52806
    *
    *
    *Coordinates in mm, always center of component
    *Origin 0/0=Lower left corner of PCB
    *Rotation in degree (0-360, math. pos.)
    *
    *No;Value;Package;X;Y;Rotation;Side;Name
    1;;;7.2644;-19.3733;0;Bottom;Copper Fill16
    2;;;18.5928;-4.28574;0;Bottom;Copper Fill28
    3;0.01µF;0805 [SMD, multilayer];22.0984;-15.5844;0;Top;C2
    4;;;15.9623;-12.8549;0;Bottom;TXT6
    5;;;19.7866;-18.2811;0;Bottom;Copper Fill18
    6;;;20.2946;-7.13054;0;Bottom;Copper Fill27
    7;;;19.4858;-7.96443;0;Bottom;Via14
    8;;;12.9286;-17.3413;0;Bottom;Copper Fill4
    9;;;16.9926;-11.4485;0;Bottom;Copper Fill8
    10;;;4.572;-23.9707;0;Bottom;Copper Fill14
    11;1µF;0805 [SMD, multilayer];22.0984;-18.1244;0;Top;C3
    12;4.7k;THT;20.1209;-20.6644;0;Bottom;R12
    13;;;8.5344;-8.33704;0;Bottom;Copper Fill10
    14;;;23.0391;-15.6173;-90;Bottom;TXT3
    15;;;14.7234;-7.64693;0;Bottom;Via16
    16;;;24.4094;-6.57174;0;Bottom;Copper Fill26
    17;10k;0805 [SMD];20.5109;-25.4269;0;Top;R7
    18;0.1µF;0805 [SMD, multilayer];22.0984;-13.0444;0;Top;C1
    19;;;7.47785;-6.63903;0;Bottom;TXT4
    20;;;10.287;-19.0685;0;Bottom;Copper Fill17
    21;;;8.9789;-7.89254;0;Bottom;Copper Fill9
    22;;;12.7;-19.3733;0;Bottom;Copper Fill2
    23;;;11.6586;-14.4711;0;Bottom;Copper Fill23
    24;;;17.5514;-4.83184;0;Bottom;Copper Fill36
    25;;;21.082;-12.2613;0;Bottom;Copper Fill5
    26;10k;0805 [SMD];9.08086;-23.2044;0;Top;R9
    27;;;14.6685;-7.28294;0;Bottom;Copper Fill12
    28;;;11.4554;-6.76224;0;Bottom;Copper Fill32
    29;;;17.1704;-14.2933;0;Bottom;Copper Fill7
    30;;;17.9832;-16.4015;0;Bottom;Copper Fill3
    31;1nF;0805 [SMD, multilayer];7.03084;-14.3144;180;Top;C5
    32;;;8.5344;-8.33704;0;Bottom;Copper Fill30
    33;;;9.9568;-13.6837;0;Bottom;Copper Fill24
    34;;;9.00835;-8.28193;0;Bottom;Via19
    35;;;13.7709;-4.78943;0;Bottom;Via15
    36;;;16.1823;-10.5259;0;Bottom;TXT6
    37;;QSOP16;14.5583;-5.41172;180;Top;MAX9926
    38;;;9.398;-8.33704;0;Bottom;Copper Fill11
    39;1k;0805 [SMD];23.6133;-9.79693;90;Top;R4
    40;;;11.4554;-5.49224;0;Bottom;Copper Fill35
    41;;;9.6012;-13.7091;0;Bottom;Copper Fill15
    42;;;19.4858;-16.8544;0;Bottom;Via17
    43;;;22.1742;-8.04494;0;Bottom;Copper Fill25
    44;;;21.336;-16.8587;0;Bottom;Copper Fill20
    45;4.7k;THT;20.1209;-23.2044;180;Bottom;R10
    46;;;17.1704;-16.8333;0;Bottom;Copper Fill6
    47;;;17.2085;-3.37134;0;Bottom;Copper Fill34
    48;;;17.5514;-6.76224;0;Bottom;Copper Fill33
    49;;;6.00746;-7.5823;0;Bottom;TXT5
    50;;;15.9512;-14.2933;0;Bottom;Copper Fill29
    51;;;24.2316;-15.3601;0;Bottom;Copper Fill19
    52;;;14.574;-25.1077;0;Bottom;TXT1
    53;1nF;0805 [SMD, multilayer];6.15085;-24.2294;-90;Top;C4
    54;;;8.2804;-14.3187;0;Bottom;Copper Fill22
    55;;DIP (Dual Inline) [THT];14.4059;-14.3144;0;Bottom;IC1
    56;1k;0805 [SMD];21.0733;-9.79693;90;Top;R6
    57;;;15.5948;-17.8602;0;Bottom;TXT6
    58;10k;0805 [SMD];7.17586;-16.8544;0;Top;R13
    59;;;13.9954;-14.4965;0;Bottom;Copper Fill1
    60;;THT;21.3909;-3.83692;90;Bottom;J1
    61;;;15.4313;-15.285;0;Bottom;TXT6
    62;;;19.8374;-16.9222;0;Bottom;Copper Fill13
    63;;;9.398;-8.33704;0;Bottom;Copper Fill31
    64;10k;0805 [SMD];7.17586;-11.7744;0;Top;R11
    65;;;20.701;-13.7599;0;Bottom;Copper Fill21

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