Internal Use Only

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LCD TV
SERVICE MANUAL
CHASSIS : LP91T

MODEL : 32SL80YR 32SL80YR-MA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL60021574 (0909-REV00) Printed in Korea

 CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 9

BLOCK DIAGRAM ................................................................................. 14

EXPLODED VIEW .................................................................................. 15

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
AC Volt-meter

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
such as WATER PIPE,
shock. CONDUIT etc.
To Instrument’s
0.15uF
exposed
Leakage Current Cold Check(Antenna Cold Check) METALLIC PARTS
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1MΩ and 5.2MΩ. *Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright LG Electronics. Inc. All right reserved. -4-
Only for training and service purposes
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright LG Electronics. Inc. All right reserved. -5-
Only for training and service purposes
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use Only
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method

This spec sheet is applied to LCD TV used LP91T chassis. 1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
2. Specification - EMC : CE, IEC
Each part is tested as below without special appointment.

1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC

2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Electrical specification
- General Specification
No Item Specification Measurement Remark
1 Screen Size 32” wide Color Display Module Resolution : 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 32” TFT WUXGA LCD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 85 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤116.7W FHD, 200/240Hz(SBL)
7 LDC Module FHD 731.8(H) x 426.4(V) x 39.0(D) [with inverter]
(Maker : LGD) 0.36375 x 0.36375 Unit : mm

Coating 3H, Anti-Glare

Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness (Optical)
(1) LCD Module
The Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid

No. Item Min. Typ. Max. Unit Maker Remark

1. Luminance 480 540 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree LGD
3. Color Coordinates White X Typ 0.279 Typ LGD 32”(FHD)
Y -0.03 0.292 +0.03
RED X 0.638
Y 0.334
Green X 0.288
Y 0.607
Blue X 0.145
0.062
4. Contrast ratio 8000:1 1200:1
5. Luminance Variation 1.3

6. Component Video Input (Y, PB, PR)

Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
7. RGB
- Analog PC, RGB- DTV –NOT SUPPORT
Specification Proposed
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

8. HDMI Input
(1) PC - Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA

(2) DTV Mode

Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application Range (2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
This specification sheet is applied to all of the LCD TV, LP91T utility Vx.x.x) will be opened
chassis. 2) Click the “Connect” button and confirm “Dialog Box”

2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100-220V,
50/60Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software (IC800, Mstar ISP
Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration – RGB / Component
(4) Check SW Version. 3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input

4. PCB assembly adjustment method

4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps 4) Read and write bin file.
1) Connect the download jig to D-sub(RGB) jack Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.

Filexxx.bin
1

Fil

Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
 1
Filexxx.bin
5) Click “(2)Auto” tab and set as below
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
4.3. EDID D/L method
4.1.2. Using the Memory Stick
* USB download : Service Mode 4.3.1. 1st Method
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
4.3.2. 2nd Method
5) Check The update SW Version.
4.2. Input tool option.
Adjust tool option refer to the BOM. 4.3.3. RS-232C command Method
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on
module maker, inch and market
(2) Equipment : adjustment remote control.
Copyright LG Electronics. Inc. All right reserved. - 10 -
Only for training and service purposes
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
* Caution : Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then compele.
(1) Command : AE 00 10
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
LGE Internal Use Only
4.3.4. EDID data 4.4. ADC Calibration
(1) Analog(RGB): 128bytes> 4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
(2) HDMI 1 : 256Bytes

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
(3) HDMI 2 : 256Bytes OK

4.4.2. ADC Calibration - RGB (Using External pattern)

(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )

(4) HDMI 3 : 256Bytes

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear

OK

Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx”
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
* White Balance Adjustment
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV( ch : 9 ),
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for auto adjustment)
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.2. Adjustment of White Balance
: (For automatic adjustment)
* LP91S/T Chassis Support Only I2C Interface.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance
(for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
- 12 - LGE Internal Use Only
Copyright
EEPROM
DDC_SCL1/ SDA1 IR TX
HDMI1 TMDS 24C02
HDMI_DATA_1 Serial Flash
HDMI2 TMDS DDC_SCL2/ SDA2
HDMI3 EEPROM HDMI_DATA_2 ( 8MByt e)
24C02
TMDS EEP_SCL/ SDA EEPROM
EEPROM
HDMI_DATA_3 for HDCP
24C02 DDC_SCL3/ SDA3
( 8K)
USB USB_DP/ DN EEP_SCL/ SDA
EEPROM

Only for training and service purposes

( 256K)
Blueto o t h BLT_DP/ DN
Circ uit
DDR2 SDRAM
( 512MB)
OPC_EN
E-DIM
PC_Aud io _L/ R :7 00m Vrm s

LG Electronics. Inc. All right reserved.

PC_Aud io PC_Aud io _L/ R
MAIN SCALER DDR2 SDRAM
EEPROM DSUB_SCL/ SDA ( 2* 256MB) URSA_[ A: B]
RGB_PC 24C02 LGE376xA
PC_R/ G/ B/ HS/ VS MEMC_RXE0–
PC_R/ G/ B/ HS/ VS MEMC_RXE1–
MEMC_RXE2–
COMP1_Y/ Pb / Pr
: 1/ 0. 7Vp p MEMC_RXC–
COMP1_Y/ Pb / Pr
: 1/ 0. 7Vp p MEMC_RXC3–
COMP1 COMP2_Y/ Pb / Pr
: 1/ 0. 7Vp p MEMC_RXE4– FRC IC
FULL HD LVDS connector

- 13 -
COMP2_Y/ Pb / Pr
: 1/ 0. 7Vp p
COMP2 MNT_OUT MEMC_RXO0– LGE7329A
MEMC_RXO1–
Co m p 1_L/ R :500m Vrm s MEMC_RXO2–
COMP1_LIN/ RIN
Co m p 2_L/ R :500m Vrm s MEMC_RXOC–
COMP2_LIN/ RIN MEMC_RXO3–
AV1_LIN/ RIN :500m Vrm s AV1_LIN/ RIN MEMC_RXO4–
AV1_VIN: 1Vp p
AV1_VIN
MNT _OUT AV2_LIN/ RIN :500m Vrm s Serial Flash
BLOCK DIAGRAM

AV2_LIN/ RIN URSA_[ C~D]

AV1 AV2_VIN :1Vp p
AV2_VIN
AV 2 MNT_VOUT: 1Vp p
MNT_VOUT M_SCL/ SDA
FRC LVDS connector

MNT_LOUT/ ROUT :500m Vrm s AUDIO PWM R_SPK_OUT

MNT_L/ R OUT NTP3100L
AMP IIS_OUT R_CH
L_CH
TV TU_MAIN TU_MAIN
TUNER M_SCL/ SDA L_SPK_OUT
( RF)
SIF SIF
PANEL_STATUS
PSU

RL_ON/I-DIMMING/ DISP_EN

* OPC_OUT is directly connected

between T-con and Module Inverter
by using FFC.

LGE Internal Use Only

 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

400

810
521

A7
520
540

910
530
805

900
806

550
804
801

807
802
LV2

610

803
LV1

600

A10
580

121
200

A2
120
200T

200N
300

310

500
510

Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
 EAX61181901
Mstar LCD SL80
COMPONENT1/2, AV1, MNT_OUT PC +5V_MULTI
JK105
SPG09-DB-010
JK101 C117 C118 C119
0.1uF 0.1uF 0.1uF
PPJ231-01 **MULTI ITEM
1.24C02-SUB:0IMMRAL014D

ENKMC2837-T112

ENKMC2837-T112

ENKMC2837-T112
4 R217 10K 2.ENKMC2837-SUB:0DS226009AA

C
A

C
A

C
A
CVBS_RIN

D126

D127

D128
D203 RED_GND [KDS226]
30V
R211 R219 6

AC

AC

AC
220K 12K
5 GND_2
1 11 RED
PC_R

AV1
7 R215 10K
CVBS_LIN GREEN_GND R101
75
D204 R214 R218 7 JP105
30V 220K 12K DDC_DATA
2 12 DSUB_SDA
8 GREEN D107
PC_G CDS3C30GTH
30V
BLUE_GND R102
8 75
R110
6 CVBS_VIN H_SYNC 68

ZD200 R210 3 13 ZD104 R111 C100

PC_HS
SD05 75 BLUE 4.7K 68pF

ZD201
PC_B SD05

SD05 NC R103
9 75
R116
V_SYNC 68
4 14 ZD105 R112 C102
PC_VS
GND_1 SD05 4.7K
68pF

10 SYNC_GND
JP106

C103 100uF 16V R212 75

DDC_CLOCK
MNT_VOUT 5 15 DSUB_SCL
DDC_GND CDS3C30GTH D110
30V
[YL]E-LUG 5A
MNT_OUT

[YL]O-SPRING 4A 16 JP104
SHILED
[YL]CONTACT 3A
R134
1K
MNT_LOUT C105 10uF 16V
[WH]C-LUG 4B
0 C104 D104
Q201 R142 6800pF 30V
RT1C3904-T112 C
MUTE_LINE B E C
B E [RD]CONTACT 3C
POP NOISE 10uF Q100
READY
C10000 RT1C3904-T112
16V
[RD]O-SPRING 4C

MNT_ROUT C106 10uF 16V

R135
1K R124 0 [RD]E-LUG 5C PC SOUND
C 0 C10001 D201
30V PPJ233-01 3 E_SPRING
B 6800pF
C
R143
JK102 PC_AUD_R
POP NOISE Q200 B
E RT1C3904-T112 E Q101
T_TERMINAL1
RT1C3904-T112 6A R138
10K
D119 R130 R140
7A B_TERMINAL1 30V 220K 12K
CDS3C30GTH

4 R_SPRING
PC_AUD_L
5 T_SPRING R139
R113 10K COMP1_R 10K
D100 R117 JK104 COMP2_R
JK103 30V
R100
220K 12K
13 [RD]MONO D114 R121
10K R132
R136 7B B_TERMINAL2
D120
30V
R131
220K
R141
12K
13 [RD]MONO CDS3C30GTH PPJ-230-01 30V 220K 12K CDS3C30GTH
PPJ-230-01 [RD]R_IN
4
[RD]R_IN
COMPONENT2

4 R114 10K COMP1_L 5 [WH]L_IN

6B T_TERMINAL2

COMPONENT1
D101 R104 R118
5 [WH]L_IN
30V 220K 12K 6 [RD]R 10K R133 COMP2_L
[RD]R
D115 R122 R137
6 30V 220K 12K
7 [BL]B
8 SHIELD_PLATE
7 [BL]B
8 [GN]C_DET
8 [GN]C_DET
COMP1_PR ZD106 R125
COMP2_PR
JK106
[GN]G 75
ZD100 R107 9 SD05
[GN]G
9 SD05 75
10 [GN]GND
10 [GN]GND 11
11
PEJ027-01
FIX-TER COMP2_PB
FIX-TER COMP1_PB ZD107
SD05
R126
+5VST_MST
ZD101 R108 75
SD05 75 CATALYST STM_replace

COMP2_Y IC100 IC100-*1

ZD108 R127 CAT24C02WI-GT3 M24C02-RMN6T
COMP1_Y SD05 75

READY
ZD102 R109 ZD109 R154 R128 R129 C113
SD05 75 SD05 A0
1 8
VCC 4.7K 4.7K 4.7K 0.01uF E0
1 8
VCC
ZD103
SD05 R123
A1 WP 100 E1 WC
2 7

R119
DDC_WP 2 7

A2 SCL 100 E2 SCL

3 6

R120
DSUB_SCL 3 6

VSS SDA 100 VSS SDA

4 5
DSUB_SDA 4 5

PC EDID
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. INPUT-ANALOG/PC 9 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80

P201
12507WS-08L
SIDE AV USB

1 +5V_USB

JP201 R202 0
Non_OCP
2 SIDE_V
5.6B Close to SIDE_USB
ZD202 R227 OCP
75 L200
5.6B C
500
ZD203 AC A
3 100uF
C202 16V KDS226
JK200 D200
Pin to Pin with
KJA-UB-4-0004 C200
220uF
16V EAN43439401

4 R208
C201 10uF 6.3V IC201 OCP 510
**1A Design MIC2009YM6-TR OCP

1
JP202

USB DOWN STREAM

6 VOUT VIN 1 L202 120OHM
R224 10K OCP
5 SIDE_LIN R205
D206 R223 R226 R200 0 5 ILIMIT GND 2 4.7K C203
USB_DN

2
30V OCP C204
220K 12K 0.1uF 10uF
R203 OCP OCP
160 OCP 4 FAULT/ ENABLE 3
6 R204
R201 0 1KOCP
USB_DP

3
JP203

D207 D208
7 R225 10K 30V 30V
SIDE_RIN READY READY
D205 R222 R228

4
30V 220K 12K

5
8

M1 M2 M3 M4 M5 M6 M7 M8
MDS61887702 MDS61887702 MDS61887702 MDS61887702 MDS61887702 MDS61887702 MDS61887702 MDS61887702
GASKET GASKET GASKET GASKET GASKET GASKET GASKET GASKET
6T_GASKET(32/42/55) 6T_GASKET(55) 6T_GASKET(55) 6T_GASKET(55) READY 6T_GASKET(32/42/55) 6T_GASKET(55) 6T_GASKET(55)

M1-*1 M3-*1 M4-*1 M6-*1

MDS61887703 MDS61887703 MDS61887703 MDS61887703
GASKET GASKET GASKET GASKET
7T_GASKET(47) 7T_GASKET(47) 7T_GASKET(47) 7T_GASKET(47)

==6T==
32" : MDS61887702, M1, M6
42" : MDS61887702, M1, M6
55" : MDS61887702, M1, M2, M3 M3, M4, M6, M7, M8
==7T==
47" : MDS61887703, M1, M3, M4, M6

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SIDE AV/USB 2 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80 OPTION
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
+5V_MULTI +5V_MULTI
+5V_HDMI_3
+5V_HDMI_2
2SC3875S +5V_HDMI_2 +5V_HDMI_3
SIDE_HDMI

A2

A1

A2

A1
Q301 D301 D302
HPD_MST_2 RT1C3904-T112
R303
1K KDS184S
SIDE_HDMI
R314
1K KDS184S
Q302C

C
C IC301 2SC3875S IC302
R301 CAT24C02WI-GT3
R312 CAT24C02WI-GT3
10K 10K
B
HPD_MST_3 B
RT1C3904-T112

E A0 VCC E A0 VCC
1 8 1 8 C300
JP307 SIDE_HDMI JP308
R309 R311 R319 R320 0.01uF
C301
10K 10K 0.01uF 10K 10K
A1 WP R327 100 A1 WP R329 100
2 7
DDC_WP 2 7
DDC_WP
A2 SCL R304 100 A2 SCL R317 100
20 3 6 JACK_GND 3 6

20 20
VSS SDA R305 100 VSS SDA R318 100
4 5 19 HPD 4 5
19

JP304
18 +5V_POWER
18

JP305
17DDC/CEC_GND
17
JP301
16 DDC_SDA2 16 SDA
DDC_SDA3
15
JP300
DDC_SCL2 15 SCL

14 NC
DDC_SCL3
14

13 CEC 13 CEC
CEC
12 TMDS2_RXC- 12 CLK-

11 CLK_SHIELD
TMDS3_RXC-
11
10 CLK+
TMDS2_RXC+ 10 CLK+
TMDS3_RXC+
9 DATA0-

8 DATA0_SHIELD
TMDS2_RX0- 9 DATA0-

8 DATA0_SHIELD
TMDS3_RX0-
7 DATA0+

6 DATA1-
TMDS2_RX0+ 7 DATA0+
TMDS3_RX0+
5 DATA1_SHIELD
TMDS2_RX1- 6 DATA1-

5 DATA1_SHIELD
TMDS3_RX1-
4 DATA1+
TMDS2_RX1+ 4 DATA1+
TMDS3_RX1+
3 DATA2-

2 DATA2_SHIELD
TMDS2_RX2- 3 DATA2-

2 DATA2_SHIELD
TMDS3_RX2-
1 DATA2+
TMDS2_RX2+ 1 DATA2+
TMDS3_RX2+
JK302 DC1R019NBH
JK303
YKF45-7054V
SIDE_HDMI

+5V_MULTI
+5V_HDMI_1

+5V_HDMI_1
A2

A1

R302 D300
1K KDS184S
HPD_MST_1 Q300C
C

IC300
R300 CAT24C02WI-GT3
10K B
RT1C3904-T112

E 2SC3875S A0 VCC
1 8
JP306 R308 R310 C302
10K 10K 0.01uF
A1 WP R331 100
2 7
DDC_WP +3.3V_MST

A2 SCL R306 100

20 3 6

20 R332
VSS SDA R307 100
4 5 R315 56000
19
68K READY
CEC_READY
18
Q303
17 JP302 BSS83
16 DDC_SDA1 CEC_READY D303
MMBD301LT1G
15 DDC_SCL1 D
30V CEC_READY
JP303 CEC_C
14
B R313
13 CEC G S 0
CEC
12 TMDS1_RXC-
D304
11 CDS3C30GTH
10 CLK+
TMDS1_RXC+ 30V CEC_READY
9 DATA0-

8 DATA0_SHIELD
TMDS1_RX0-
7 DATA0+

6 DATA1-
TMDS1_RX0+
5 DATA1_SHIELD
TMDS1_RX1-
4 DATA1+
TMDS1_RX1+
3 DATA2-

2 DATA2_SHIELD
TMDS1_RX2-
1 DATA2+
TMDS1_RX2+
JK301
YKF45-7058V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. INPUT-HDMI 3 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80

P400
CONTROL KEY/IR
12507WS-12L

BLUETOOTH
1 L411 500-ohm
SUB_SCL
ZD401

2 L410 500-ohm SUB_SDA

ZD402
P401
12507WS-06L
3 +3.3V_MULTI_MST R401
+3.3V_MST 0 1
READY R420 C400
4.7K close to R401 0.1uF
2
4 L403 120ohm
KEY1
C404 C408 +3.3V_MST R402
470pF 0.1uF 0
BLT_DP 3

READY R421
4.7K 4
5 L406 120ohm KEY2
C412 R403
470pF C411 0
+5VST_MST 0.1uF BLT_DN 5

L404 6
6
C406 MLB-201209-0120P-N2 7
47uF
IR
7 +5VST_MST

+5VST_MST
R429
10K
8 IR-OUT R430 22
R427 IR-OUT
10K
IR-OUT R428 10K C Q404
B
IR-OUT E 2SC3052
IR-OUT
9 L402 120ohm R426 47K C
B
ZD400 C403 C407 IR-OUT E Q405
47pF 0.1uF 2SC3052
READY IR-OUT

10 +3.3V_MST +3.3V_MULTI_MST

R400 R417
L407 0 0
11 READY
C414 MLB-201209-0120P-N2
0.1uF

12

13

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. KEY/IR/BLUETOOTH 4 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80

+5V_TUNER
IC501
AZ1117H-3.3
R511 0 INPUT 3 $0.0511 ADJ/GND
2
C541 C540 C538 OUTPUT 120-ohm
22uF 0.1uF 0.1uF
L508 +3.3V_TUNER

C545 C543
22uF 0.1uF

IC502 +5V_TUNER
AZ1117H-1.8TRE1(EH13A)
INPUT 3 1 ADJ/GND +3.3V_TUNER +3.3V_TUNER

1000pF

0.1uF
$0.051
C539 2 C529
0.1uF OUTPUT 0.1uF C530

C517 0.1uF
C521 0.1uF
GND 0.1uF

C510

C513
+1.8V_TUNER_A R504 10

4.99K
TU_RESET

0.1uF

0.1uF

C518 0.1uF

0.1uF
C546 C542 C544
22uF 0.1uF 0.1uF
+1.8V_TUNER_A

C512

R500

C515

C520
L507 +1.8V_TUNER_D
2.2uH

C526
0.1uF
JK501

48
47
46
45
44
43
42
41
40
39
38
37
NTSC

VI2C
REXT

RESET
GND_9

VREF_P
VDDA_8
VDDC_9

VDDA_7

VDDC_8
VDDC_7

VREF_N
VDDC_6
1 KCN-BT-2-0082 C505 0.1uF
2
C503 1000pF 1 VDDA_1 GND_8 36
C500 56pF C502 39pF L502 6.8nH 2 IN1 SDA 35 R509 100 M_SDA
L500 L501 L503
D500 1uH 270nH 390nH 3 GND_1 SCL 34 R510 100 M_SCL
JK500 OPT C501 C535 C536
PAL 120pF 4 IN2 VDDD_2 33 C524 0.1uF 18pF 18pF
1 KCN-ET-0-0094 5 GND_2
IC500
2 $0.088 +3.3V_TUNER EXTREF 32
C504 0.1uFL504 820nH 6 EXTCHOKE XC5000 X1 31
$0.085
7 GND_3 GND_7 30 X-TAL_23 2GND_1

C506 0.1uF 8 VDDA_2 X2 29 GND_24

X501
1X-TAL_1

31.875MHz
9 VDDA_3 $2.25 ADDRSEL 28 R502 0 C533
15pF
C532
15pF
C507 0.1uF 10 VDDC_1 DDI2 27
11 GND_4 VDDC_5 26 C525 0.1uF

24 TESTMODE
C508 0.1uF 12 VDDC_2 DDI1 25

14 VDDA_4

17 VDDA_5

21 VDDA_6

23 VDDD_1
13 VDDC_3

20 VDDC_4
19 GND_5

22 GND_6
15 VAGC
16 VIF

18 SIF
+1.8V_TUNER_D

0.1uF

0.1uF

0.1uF

0.1uF
+1.8V_TUNER_A

C509

C516

C522

C523
+5V_TUNER

0.1uF

0.1uF

0.1uF
C511

C514

C519
R507 C534
390 0.1uF

MAIN_SIF
E
L505 2.7uH R501 680 B Q501
C527 ISA1530AC1
10pF C

+5V_TUNER

R505 C531
390 0.1uF
R508 0 TV_MAIN
C537
R506 270pF
0 READY
E
L506 2.7uH R503 680 Q500
C528 B ISA1530AC1
10pF C

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. TUNER 5 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80
+16V_NTP

READY

C620 C615 C617 R604 C674 C675 C676 C677

10uF35V 0.1uF 0.1uF 3.3 68uF 68uF 68uF 68uF
35V 35V 35V 35V
+1.8V
C613
L606 0.01uF
+1.8V_AVDD
MLB-201209-0120P-N2 L600
L605 MLB-201209-0120P-N2

MLB-201209-0120P-N2
+1.8V_DVDD
R608 R605 C672 SPK_L+
12 12 0.01uF
L603 C637 R663
C619 2S AD-8770 2F 0.1uF 4.7K
R626
+3.3V_MULTI_MST +3.3V_MST 390pF 3.3
C632
C621 1S 1F 0.47uF R625
390pF R623 3.3
EAP60684501 C669
MLB-201209-0120P-N2

READY
MLB-201209-0120P-N2

0.1uF 4.7K
L601

L609

R610 R606 C671 L602

12 12 0.01uF MLB-201209-0120P-N2

+3.3V_MULTI_AUD SPK_L-
C616
22000pF

C611 22000pF
C618
1uF
+3.3V_MST

R611
10K

C
R607 10KB
PGND1A_2 56
PGND1A_1 55
OUT1A_2 54

OUT1A_1 53
PVDD1A_2 52
PVDD1A_1 51

PVDD1B_2 50

PVDD1B_1 49
OUT1B_2 48
OUT1B_1 47
PGND1B_2 46
PGND1B_1 45

BST1B 44
VDR1B 43
Q601
RT1C3904-T112 E

R609 0
SW_RESET READY 1 BST1A NC 42
READY
R612
22K 2 VDR1A VDR2A 41
C608 C624
R682 0 R601 100 1uF 1uF
MULTI_PW_SW 3 RESET BST2A 40
READY C606
1000pF 4 AD
5 DVSS_1 AUDIO MAIN AMP PGND2A_2 39
PGND2A_1 38
C625
22000pF L604

6 VSS_IO IC600 OUT2A_2 37

C648
MLB-201209-0120P-N2

SPK_R+
I2S_MCLK +3.3V_MULTI_AUD
7 CLK_I NTP-3100L OUT2A_1 36
+16V_NTP
R658 R622
12
C630
12
L607
C644
0.1uF
R628
4.7K
0.01uF

8 VDD_IO PVDD2A_2 35 R671

+1.8V_AVDD C605
390pF 2S AD-8770 2F 3.3
C603 0.1uF 9 DGND_PLL PVDD2A_1 34 C634 C673
1000pF 0.47uF
C601 C626 C629 390pF 1S 1F
100pF 10 AGND_PLL PVDD2B_2 33 0.1uF 0.1uF R635
R600 EAP60684501 3.3
3.3K R667
11 LFM PVDD2B_1 32 C643
R621 R624 0.1uF 4.7K C647 L608
+1.8V_AVDD 12 12 0.01uF MLB-201209-0120P-N2
12 AVDD_PLL OUT2B_2 31
C600 C602 SPK_R-
10uF16V 0.1uF 13 DVDD_PLL OUT2B_1 30

14 TEST0 PGND2B_2 29
+1.8V_DVDD
22 MONITOR_0
23 MONITOR_1
24 MONITOR_2

28 PGND2B_1
15 DVSS_2

C604 C607
17 SDATA

26 VDR2B
25 FAULT

27 BST2B
16 DVDD

10uF16V 0.1uF
18 WCK
19 BCK
20 SDA

21 SCL

+1.8V_DVDD C623 22000pF

C651 1000pF C614 1uF

C609 C610
10uF 16V 0.1uF
100
100

P600
0
0

R656 0

SMAW250-04Q
READY
R676
R677

R678

R602
R603

R673

SPK_R- 1

SPK_R+ 2
MULTI_PW_SW
M_SCL
M_SDA
I2S_SCK
I2S_SDO
I2S_WS

SPK_L- 3

SPK_L+ 4

C639
5 C638
33pF 33pF
50V 50V
READY READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. AUDIO 6 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80 AMP :GAIN X 4
+12V_AUDIO
IC701
C707
0.1uF
C B R702 1K 1 OUT1 LM324DOUT4 14
Q700 E
RT1C3904-T112 C700 R704 10K
MNT_LOUT 6800pF
R700
4.7K C702 33pF 2 INPUT1- INPUT4- 13
R708
6.8K

MNT_L_AMP R705 5.6K 3 INPUT1+ INPUT4+ 12

+12V_AUDIO

4 VCC GND 11
C704
0.01uF

MNT_R_AMP R706 5.6K 5 INPUT2+ INPUT3+ 10

+12V_AUDIO C703 33pF

R707 10K 6 INPUT2- INPUT3- 9

R709
C709 6.8K
0.1uF
C B R703 1K 7 OUT2 OUT3 8
Q701 E
RT1C3904-T112 C701
MNT_ROUT 6800pF
R701
4.7K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. AUDIO OUT 7 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901 **H/W OPTION
R896 R898 R8010 R8011 DDR2_A[0-12]

Mstar LCD SL80 Small HD(19/22) 4.7K X 4.7K X

DDR2_A[12]

DDR2_A[10]

DDR2_A[11]
DDR2_A[3]
DDR2_A[7]

DDR2_A[9]
DDR2_A[5]

DDR2_A[1]

DDR2_A[8]

DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
Small FHD (27) 4.7K X 4.7K 4.7K

R893:AUDIO_SW
Non Small HD 4.7K X X 4.7K +1.8V_DDR

DDR2_CASZ
DDR2_RASZ
TU_RESET

DDR2_WEZ

DDR2_ODT
DDR2_CKE

DDR2_BA0
DDR2_BA1
Non Small FHD X 4.7K 4.7K X

R867 1K
I2S_OUT
IC802 Apollo X 4.7K 4.7K 4.7K

+5VST_MST
+3.3V_MST
SERIAL FLASH 8M MX25L6405DMI-12G 100HZ X 4.7K X 4.7K

PANEL_STATUS
+3.3V_MULTI_MST

POWER_SW

MODEL_OPT1
MODEL_OPT2
SYS_RESET

DSUB_SDA

AR812

AR813

AR814

AR815

AR800
I2S_MCLK
EEP_SDA
1 HOLD SCLK 16 +3.3V_MULTI_MST +3.3V_MULTI_MST

EEP_SCL

0.01uF
I2S_SDO
I2S_SCK
SPI_CLK

0.1uF
BLT_DN
BLT_DP

I2S_WS

56

56

56

56

56
RL_ON
CEC_C
PC_VS
PC_HS

1K
KEY2
KEY1
C807

RXD

RXD
TXD

TXD
0.01uF

IR

10K
2 VCC SI.SIO015
SPI_DI R8011 R898

C817 20pF
C816 20pF
+3.3V_LPLL_VDDP

C844
C863
R868
4.7K 4.7K

100
100
R8003
3 NC_1 NC_8 14 C811
+3.3V_MULTI_MST MODEL_OPT1 MODEL_OPT2
+3.3V_MST R8020 10K +1.8V

I2S_IN_BCK/GPIO68 R8016
R8010 R896 0.1uF

I2S_IN_WS/GPIO67R8017
+1.2V_VDDC_MST

12MHz
X801
4 NC_2 NC_7 13 4.7K 4.7K

0.1uF
READY READY

UART2_RX/I2CM_SDA
UART2_TX/I2CM_SCK
100
100

100
100

100
100

100
100

100
100

100
100
100
R878

56
0
0

UART1_RX/GPIO86
UART1_TX/GPIO87
4.7K
5 NC_3 NC_6 12

R839
+3.3V_MULTI_MST

AVDD_MEMPLL
R8035
R8034

R8022
R8021

R8012

A_MCLKE R852
I2S_OUT_MCK
I2S_OUT_BCK
GPIO140 R895
GPIO139 R849

GPIO135 R850
GPIO134 R893

R824
R825

R894

R826
R827

C883
R828
R829
1M

AVDD_DDR_6
I2S_OUT_WS

A_MADR[12]

A_MADR[10]

A_MADR[11]
I2S_OUT_SD
C B R8031

AVDD_MPLL

A_MADR[3]
A_MADR[7]

A_MADR[9]
A_MADR[5]

A_MADR[1]

A_MADR[8]
A_MADR[6]

A_MADR[4]
A_MADR[2]
A_MADR[0]
A_BADR[0]
A_BADR[1]
I2S_IN_SD
DDC_WP

HWRESET

USB0_DM
6 NC_4 NC_5 11

USB0_DP
GPIO138
E 10K

VSYNC1
HSYNC1
VSYNC0
HSYNC0

VDDC_7

VDDC_6

A_CASZ
A_RASZ
VDDP_5
GND_18
GND_17

GND_16

GND_15

GND_14
SPDIFO
R877

MVREF
A_WEZ

A_ODT
Q805

XOUT

SAR3
SAR2
SAR1
SAR0
IRIN
4.7K

CEC

XIN
RT1C3904-T112
SPI_CZ 7 CS GND 10
+3.3V_AVDD_33_DM

256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
8 SO/SIO1 WP/ACC 9 10RXBCKN B_MCLKZ
SPI_DO TMDS2_RXC- R851
R854 10RXBCKP
1
2
192
191 B_MCLK
R843
R844
33
33
DDR2_MCLKZ DDR2_D[0-15]
IC802_MSTAR TMDS2_RXC+ B_MDATA[5]
DDR2_MCLK
TMDS2_RX0- R856 10 RXB0N 3 190 AR805 DDR2_D[5]
R858 10 RXB0P 4 189 B_MDATA[2] 56 DDR2_D[2]
TMDS2_RX0+

HDMI_2
HOTPLUGB 5 188 B_MDATA[0] DDR2_D[0]
HPD_MST_2
TMDS2_RX1- R859 10 RXB1N 6 187 B_MDATA[7] DDR2_D[7]
TMDS2_RX1+ R862 10 RXB1P 7 186 AVDD_DDR_5 C853 0.1uF
EEPROM Close to IC Pin C833 0.1uF TMDS2_RX2- R869
AVDD_33_1
10 RXB2N
8
9
185
184
B_MDATA[13]
B_MDATA[10]
AR806 DDR2_D[13]
56 DDR2_D[10]
IC801 L803 TMDS2_RX2+ R871 10 RXB2P 10 183 GND_13 DDR2_D[8]
24LC256-I/SM MLB-201209-0120P-N2 TMDS1_RXC- R872 RXACKN
10 11 182 B_MDATA[8] DDR2_D[15]
+3.3V_MULTI_MST +3.3V_MULTI_MST 10RXACKP B_MDATA[15]
+3.3V_AVDD_33_DM TMDS1_RXC+ R873 12 181
A0 VCC R874 10 RXA0N 13 180 AVDD_DDR_4
1 24C64_Normal 8 TMDS1_RX0-
C866 C867
16V 10uF 0.1uF L801READY 10 RXA0P B_DDR2_DQSB[1]

HDMI_1
TMDS1_RX0+ R879 14 179 DDR2_DQS1M
C803 +3.3V_AVDD_AU AVDD_33_2 15 178 B_DDR2_DQS[1]
A1 WP 0.01uF MLB-201209-0120P-N2
GND_12
DDR2_DQS1P
2 7 R8027 R8028 L802 C815 0.1uF TMDS1_RX1- R880 10 RXA1N 16 177
4.7K 4.7K +3.3V_LPLL_VDDP TMDS1_RX1+ R890 10 RXA1P 17 176 VDDP_4 C849 0.1uF
A2 SCL MLB-201209-0120P-N2 GND_1 18 175 AVDD_DDR_3
3 6 R812 0 EEP_SCL L800 10 RXA2N B_DDR2_DQSB[0]
+3.3V_MST TMDS1_RX2- R891 19 174 DDR2_DQS0M
+3.3V_AVDD_AU R892 10 RXA2P 20 173 B_DDR2_DQS[0]
TMDS1_RX2+ DDR2_DQS0P
VSS
4 5
SDA
R813 0
EEP_SDA C878
1uF
C877
0.1uF
MLB-201209-0120P-N2
HPD_MST_1
R840
HOTPLUGA
390 REXT
VCLAMP
21
22
IC800 172
171
GND_11
B_DDR2_DQM[0]
B_DDR2_DQM[1]
DDR2_DQM0
C819 0.1uF C804 0.1uF 23 170 DDR2_DQM1
C804/C805/C806:Close to IC C805 0.1uF REFP 24 169 AVDD_DDR_2

PC_B
as close as possible
R814
C806
47 C843
0.1uFREFM
BIN1P
0.047uF
25
26
LGE3767A 168
167
B_MDATA[14]
B_MDATA[9]
AR809 DDR2_D[14]
56 DDR2_D[9]
SOGIN1 GND_10

HDCP EEPROM READY

PC_G R803
R816
470 C846
47 C845
1000pF
GIN1P
0.047uF
27
28 MST99A88ML 166
165 B_MDATA[12]
DDR2_D[12]
DDR2_D[11]
+3.3V_MULTI_MST RIN1P B_MDATA[11]
PC_R R818
R838
47 C847
47 C825
0.047uF
BINM
0.047uF
29
30 (MATRIX ONLY SD DIVX_ NON RM) 164
163 AVDD_DDR_1
R815 47 C851 BIN0P
0.047uF 31 162 B_MDATA[6] AR810 DDR2_D[6]
COMP1_PB GINM B_MDATA[1]
IC803 R833 47 C827 0.047uF 32 161 56 DDR2_D[1]
HDCP_READY GIN0P GND_9
CAT24WC08W-T COMP1_Y R817 47 C852 0.047uF 33 160 DDR2_D[3]
R8004
4.7K R819 470 C854 SOGIN0
1000pF 34 159 B_MDATA[3] DDR2_D[4]
R836 47 C829 RINM
0.047uF 35 158 B_MDATA[4]
A0 VCC RIN0P VDDC_5 READY
1 8 COMP1_PR R804 47 C855 0.047uF 36 157 R899 4.7K
AVDD_33_3 VDDP_3
+3.3V_MST
37 156 C848 0.1uF
GND_2 GPIO58 R8018 1K +3.3V_MULTI_MST
A1 WP C838 0.1uF 38 155 MUTE_LINE R865
2 7
DDC_WP COMP2_PB R832 47 C826 BIN2P
0.047uF 39 154 GPIO57 R8038 1K
SUB_SCL R866
4.7K
4.7K
HDCP_READY COMP2_Y R834 47 C828 GIN2P
0.047uF 40 153 GPIO56
SUB_SDA R8009
A2 SCL 22 4.7K
R8005 SOGIN2 GPIO55
3 6
EEP_SCL R835
R837
470
47
C835
C830
1000pF
RIN2P
0.047uF
41
42
152
151 GPIO54
COMP2_PR CVBS6 GPIO53
PANEL_ON R8029 3.3K
VSS SDA R8042 47 C8001 0.047uF 43 150 DISP_EN/VAVS_ON
R8006 22
4 5
HDCP_READY EEP_SDA R8019 47 C8002 CVBS5
0.047uF
CVBS4
44 149 GPIO52
GPIO51
SW_RESET
CVBS_VIN R897 47 C831 0.047uF 45 148 DDC_WP
R802 47 C832 CVBS3
0.047uF 46 147 GND_8 R8032 4.7K
SIDE_V CVBS2 GPIO152/I2C_OUT_SD3
47 146 R8014 100 READY
READY R8014:M_SCL_REAR
CVBS1 GPIO151/I2C_OUT_SD2
48 145 R8015 100 R8015:M_SDA_REAR
R831 47 C834 VCOM1
0.047uF 49 144 GPIO150/I2C_OUT_MUTE
OPC_EN MEMC_RESET
R857 47 C836 CVBS0
0.047uF 50 143 VDDC_4
TV_MAIN GND_7
C810 1uF R830 47 C837 VCOM0
0.047uF 51 142
+12V_AUDIO
GAIN X 4 AVDD_33_4
CVBSOUT
52
53
141
140
AVDD_LPLL
LVB0M
C850 0.01uF
MNT_VOUT_T GND_3 LVB0P
MEMC_RXO4-
54 139 MEMC_RXO4+
R809 R875 47 C868 0.1uF SIF0P 55 138 LVB1M
470 MAIN_SIF MEMC_RXO3-
E B R876 47 C869 0.1uFSIF0M 56 137 LVB1P
MEMC_RXO3+
C VDDC_1 57 136 LVB2M
MEMC_RXOC-
Q801 C B SIDE_LIN C856 2.2uF AUL5 58 135 LVB2P
MEMC_RXOC+
R8041 47
ISA1530AC1
E MNT_VOUT_T SIDE_RIN C861 2.2uF AUR5
AUVRM
59 134 LVBCKM
LVBCKP
MEMC_RXO2-
60 133 MEMC_RXO2+
Q802 AUOUTL2 LVB3M
R808 220
MNT_VOUT RT1C3904-T112 MNT_L_AMP
MNT_R_AMP
R882
R881
100
AUOUTR2
100
61
62
132
131 LVB3P
MEMC_RXO1-
MEMC_RXO1+
R846 AUOUTL1
100 63 130 LVB4M
R807 402 R810 AUOUTR1 LVB4P
MEMC_RXO0-
READY R847 100 64 129 MEMC_RXO0+
68

100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
R842 22K

65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
C839 0.01uF
+3.3V_AVDD_33_DM

SDI
GPIO20

SCZ
SCK

SDO
AUL0

AUL1

AUL2

AUL3

AUL4

RXC0P

RXC1P

RXC2P

LVA4P

LVA3P

LVA2P

LVA1P

LVA0P
USB1_DP
AUR0

AUR1

AUR2

AUR3

AUR4
GND_4

GND_5

GND_6
VDDP_1

VDDP_2
R845 22K

PWM0
PWM1
PWM2
PWM3
RXC0N

RXC1N

RXC2N
VDDC_2

VDDC_3
AUCOM

AUVRP
AUVAG

LVA4M

LVA3M

LVA2M

LVA1M

LVA0M
UART2_TX

RXCCKP

LVACKP
USB1_DM
UART2_RX

RXCCKN

LVACKM
AVDD_AU

DDCA_CK
DDCA_DA

AVDD_DM

HOTPLUGC
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA

DDCDC_CK

DDCDC_DA
+3.3V_AVDD_AU

C841 0.01uF
RESET
C842 0.1uF
P_12V P_16V Q804
RT1C3904-T112
R8037
C B R8007 33K
RL_ON

0 READY

0.01uF
0.1uF
R800 R8001 E

0.01uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
2.2uF
0.1uF
2.2uF
2.2uF
0
0 0

100
100
100
100

100

100
C871

10
10

10
10
10
10

10
10
4.7uF READY
READY

0
0
10V
C823
C824
C801
C872
C802
C873
C874
C875
C808
C821
C822

C840
POWER_DET

R8023
R8024
R8025
R8026
R8033

R8039

R8040
C882

R822
R823
C876
R841
R848
R806
R870

R801
R805

R820
R821

AR818
D801 +5VST_MST
KDS181

33
R885 150 D802
R860 1K KDS181

SPI_DI
POWER_DET

I-DIM
SPI_CZ
SPI_CLK

SPI_DO

E-DIM
R855
CVBS_LIN

USB PART USB_DP

CVBS_RIN

TMDS3_RX0-

TMDS3_RX1-

TMDS3_RX2-
DDC_SCL1
DDC_SCL2

DDC_SCL3

USB_DN
COMP1_L

COMP2_L

PC_AUD_L

DSUB_SCL

HPD_MST_3
COMP1_R

COMP2_R

PC_AUD_R

TMDS3_RXC-
DDC_SDA1

DDC_SDA2

DDC_SDA3
TMDS3_RX0+

TMDS3_RX1+

TMDS3_RX2+
DSUB_SDA

MEMC_RXE0-
MEMC_RXE1-
MEMC_RXE2-

MEMC_RXE3-
MEMC_RXE4-
TMDS3_RXC+

MEMC_RXEC-
MEMC_RXE0+

MEMC_RXE1+
MEMC_RXE2+

MEMC_RXE3+
MEMC_RXE4+
MEMC_RXEC+
R8036 10K
20K C870
47uF 25V C
MULTI_PW_SW
R853 B Q803
Q800 RT1C3904-T112 +1.2V_VDDC_MST
R861 ISA1530AC1
+5VST_MST 1K C8000 HDMI_3
E
1K 2.2uF
B E READY +3.3V_MULTI_MST
with width trace

C Close to IC as close as possible

SYS_RESET R863 4.7K
10uF 16V

SW800
R886
1000pF

JTP-1127WEM +5VST_MST
0.1uF

4.7uF

R864 4.7K +3.3V_MULTI_MST R811 R883 +1.2V_VDDC_MST

Close to IC
2

1K 1K
2K READY
3 1

R8000 R8002
C809
C813
C818
C820

10K
4

MEMC_RESET R8008 0 0
C812

M_SCL
C857 C859 C879 C880 C881
M_SDA
4.7uF R889 R884
R888 100 1K 1K
READY
0.01uF 0.01uF 0.01uF 0.01uF 0.01uF

R887 D803
C814 KDS181 +1.8V
0.1uF 33K [MODE SELECTION]
C864 C858 C860 C862 C865
0.01uF 0.01uF 0.01uF 0.01uF 0.01uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN Mstar 8 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80 H5PS5162FFR-S6C
IC900-*1

IC900
HYB18TC512160CF-2.5
#9.DDR2
VREF
DDR2_HYNIX DQ0
+1.8V_DDR DDR2_D[0-15] J2 G8
G2 DQ1
DQ2
Close to DDR2 IC A0 M8
H7

1K
H3 DQ3

R907
A1 M3
H1 DQ4
A2
J2 VREF
DDR2_400Mhz_QIMONDA DQ0 G8 DDR2_D[0] A3
M7
N2
H9 DQ5

1K
C904 C905 C918 F1 DQ6

R908
A4
0.01uF 1000pF 0.1uF
50V DQ1 G2 DDR2_D[1] A5
N8
N3
F9 DQ7
DQ8
A6 C8

DDR2_A[0] DQ2 H7 DDR2_D[2] A7

N7
C2 DQ9
M8 A0 A8
P2
D7 DQ10

DDR2_A[1] DQ3 H3 DDR2_D[3] A9

P8
D3 DQ11
M3 A1 A10/AP
P3
D1 DQ12

DDR2_A[2] DQ4 H1 DDR2_D[4] A11

M2
D9 DQ13
M7 A2 A12
P7
B1 DQ14

DDR2_A[3] DQ5 H9 DDR2_D[5] R2

B9 DQ15
N2 A3
DDR2_A[4] DQ6 F1 DDR2_D[6] BA0 L2
N8 A4 BA1 L3 VDD5
DDR2_A[5] DQ7 F9 DDR2_D[7]
A1
VDD4
N3 A5 CK
E1
VDD3
DDR2_A[6] DQ8 C8 DDR2_D[8] CK
J8 J9
VDD2
N7 A6 CKE
K8 M9
VDD1
DDR2_A[7] DQ9 C2 DDR2_D[9]
K2 R1

P2 A7
DDR2_A[8] DQ10 D7 DDR2_D[10] ODT K9
P8 A8 CS L8 A9 VDDQ10

DDR2_A[9] DQ11 D3 DDR2_D[11] RAS K7 C1 VDDQ9

P3 A9 CAS L7 C3 VDDQ8

DDR2_A[10] DQ12 D1 DDR2_D[12] WE K3 C7 VDDQ7

M2 A10/AP C9 VDDQ6

DDR2_A[11] DQ13 D9 DDR2_D[13] LDQS E9 VDDQ5

P7 A11 UDQS
F7
G1 VDDQ4

DDR2_A[12] DQ14 B1 DDR2_D[14]

B7
G3 VDDQ3
R2 A12 G7 VDDQ2
DQ15 B9 DDR2_D[15] LDM
UDM
F3 G9 VDDQ1
B3

DDR2_A[0-12] +1.8V_DDR LDQS VSS5

DDR2_BA0 L2 BA0 UDQS
E8
A8
A3
E3 VSS4
VSS3
DDR2_BA1 L3 BA1 J3
VSS2
VDD5 A1 C901 0.01uF NC4 L1
N1
VSS1

Close to DDR2 IC
NC5 P9
R3
VDD4 E1 C902 0.01uF NC6 R7

DDR2_MCLK J8 CK VDD3 J9 C903 0.01uF NC1 A2

B2 VSSQ10
VSSQ9
R906 150 NC2 B8

DDR2_MCLKZ READY K8 CK VDD2 M9 C906 0.01uF NC3

E2
R8
A7 VSSQ8
VSSQ7
D2

DDR2_CKE K2 CKE VDD1 R1 C907 0.01uF D8 VSSQ6

VSSQ5
VSSDL J7 E7
F2 VSSQ4
F8 VSSQ3
H2 VSSQ2

DDR2_ODT K9 ODT VDDL J1 H8 VSSQ1

L8 CS VDDQ10 A9 C908 0.01uF

DDR2_RASZ K7 RAS VDDQ9 C1 C909 0.01uF

DDR2_CASZ L7 CAS VDDQ8 C3 C910 0.01uF IC900-*2

DDR2_WEZ K3 WE VDDQ7 C7 C911 0.01uF EDE5116AJBG-8E-E

VDDQ6 C9 C912 0.01uF

VREF DQ0
DDR2_ELPIDA J2 G8
VDDQ5 E9 C913 0.01uF G2 DQ1

DDR2_DQS0P R900 56 F7 LDQS A0 H7 DQ2

VDDQ4 G1 C914 0.01uF A1
M8
H3 DQ3

DDR2_DQS1P R901 56 B7 UDQS A2

M3
H1 DQ4
VDDQ3 G3 C915 0.01uF A3
M7
N2
H9 DQ5
DQ6
A4 F1
VDDQ2 G7 C916 0.01uF A5
N8
N3
F9 DQ7
DQ8
A6 C8

DDR2_DQM0 R902 56 F3 LDM VDDQ1 G9 C917 0.01uF A7

N7
P2
C2 DQ9
DQ10
A8 D7

DDR2_DQM1 R903 56 B3 UDM A9

P8
P3
D3 DQ11
DQ12
A10 D1
M2 DQ13
A11 D9
P7 DQ14
A12 B1
R2 DQ15
B9

DDR2_DQS0M R904 56 E8 LDQS VSS5 A3 BA0 L2

DDR2_DQS1M R905 56 A8 UDQS VSS4 E3 BA1 L3

A1 VDD_5
VDD_4
VSS3 J3 CK J8
E1
J9 VDD_3
CK VDD_2
VSS2 N1 CKE
K8 M9
VDD_1
L1 NC4 K2 R1

VSS1 P9
R3 NC5 ODT
CS
K9
VDDQ_10
L8 A9
R7 NC6 RAS
CAS
K7 C1 VDDQ_9
VDDQ_8
L7 C3
WE K3 C7 VDDQ_7
C9 VDDQ_6
VSSQ10 B2 LDQS E9 VDDQ_5
A2 NC1 UDQS
F7
G1 VDDQ_4
VSSQ9 B8 B7
G3 VDDQ_3
E2 NC2 G7 VDDQ_2
VSSQ8 A7 LDM F3 G9 VDDQ_1
R8 NC3 UDM B3
VSSQ7 D2
LDQS VSS_5
VSSQ6 D8 UDQS
E8
A8
A3
E3 VSS_4
VSS_3
J7 VSSDL VSSQ5 E7 NC_4 N1
J3
VSS_2
L1 VSS_1
VSSQ4 F2 NC_5
NC_6
R3
P9

R7
VSSQ3 F8 VSSQ_10
NC_1 B2
+1.8V_DDR VSSQ2 H2 A2
B8 VSSQ_9
NC_2 E2
A7 VSSQ_8
NC_3
J1 VDDL VSSQ1 H8 R8
D2 VSSQ_7
VSSQ_6
C900 C919 D8
0.01uF 10uF 10V VSSDL E7 VSSQ_5
J7
F2 VSSQ_4
F8 VSSQ_3
H2 VSSQ_2
VDDL J1 H8 VSSQ_1

DDR2 MEMORY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN_DDR 9 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901 P1000
Mstar LCD SL80 FM20020-24
P_5V

R1000
2.2K
1 NC Power_On 2
3 GND
5 GND
GND 4
GND 6
3
12
R1003 10K
RL_ON P_5V
L1001

MLB-201209-0120P-N2 C1003 C1008 C1011

+5VST_MST *ST 5V->3.3V
Q1000 10uF16V 0.01uF 0.01uF
7 5.2V 5.2V 8 2SC3875S
P_5V L1012 IC1007
MLB-201209-0120P-N2
9 5.2V 5.2V 10 P_12V +12V_AUDIO AP2121N-3.3TRE1
P_5V C1034
C1002 C1007 0.1uF
11 GND GND 12 47uF 25V 0.01uF 3 VIN VOUT 2
+5VST_MST +3.3V_MST
GND C1052 C1053 C1037
P_12V 13 12V 12V 14 P_12V L1000 500 1
10uF 16V 0.01uF 1uF 25V
P_16V +16V_NTP READY
15 GND GND 16 +5V_MULTI
C1006
68uF35V
C1046
0.01uF
C1001
0.1uF
P_16V 17 24V 24V 18 P_16V R1046
3K
R1066 0 19 NC INV_ON 20
READY
R1001 10K
L1005
21 A.DIM Err_Out22 3 R1047 10K
I-DIM MLB-201209-0120P-N2
PANEL_STATUS 1 2 Q1002 DISP_EN/VAVS_ON
1K R1012 C1044 C1024 23 NC PWM_DIM 24 2SC3875S
2.2uF 0.1uF R1053

OPC_OUT2 R1067 0
READY

C1020
READY 25
0 NON_LGD
READY
L1004
OPC_OUT1
**5V_MULTI-->1.2V
MLB-201209-0120P-N2 C1045 R1011
2.2uF 16V 6.2K
READY

LED Block IC1001

BD9130EFJ-E2

+5VST_MST +5V_MULTI ADJ 1 8 EN R1006 10K

R1002 R1005 VCC
10K 1.2K +5V_MULTI 2 7 PVCC
L1002 OUT:1.27V
ITH 3
C1004 C1018 R1008 12K 6 SW +1.2V_VDDC_MST
LD1002 10uF 16V 10uF 16V C1012 2.2uH R1009
R2
SAM2333 560pF GND
4 5 PGND C1013
10uF 16V
C1025
10uF 16V
2K C1014
0.1uF
C1041
1uF 25V
R1010 READY
MAX 2A 3.3K R1
V0 = 0.8*(1+(R2/R1))

**5V_MULTI->3.3V->1.8V
IC1003
AZ1085S-3.3TR/E1
**DC-DC CONVERTER_READY +5V_MULTI R1073 0 INPUT 3
C1054
MAX 3A
1
2 OUTPUT
OUT:3.3V

C1028
0
R1074 C1036
0.1uF IC1002
+3.3V_MULTI_MST

12V->5V_TUNER/USB 0.1uF ADJ/GND 100uF 16V

AP1117EG-13
IN 3 MAX 1A 2 OUT
MLB-201209-0120P-N2
+1.8V_DDR
1 C1022 C1039 C1023 L1013 C1032 DDR2, Vref

10uF 1uF 25V 0.1uF 0.1uF

C1016 C1015 ADJ/GND
10uF 0.1uF R1 R1004 READY +1.8V
NTP,AUDIO DSP
300

R1007
R2
150 V0 = 1.25*(1+(R2/R1))
+5V_MULTI

R1019
10
0
R1059 10K

R1 R1057
READY
IC1006
MP2212DN
R1056
C1026 **Switch 12V:P12V
C1033R1018

0.1uF
READY
0.47uF2K

43K

R2 R1058
5.6K
1 FB

2 GND
MAX 3A
EN/SYNC 8

SW_2 7
IC1000
AP1117EG-13
**Switch 5V:5V_MULTI -> 1.8V
P_12V L1008 500 3 IN SW_1 6 L1009
OUT:6.8V IN 3 MAX 1A 2OUT L1010 500
+5V_TUNER
P_12V

C1030 C1031 3.6uH C1017 C1000 C1029 C1038 C1040 1 C1043

R1013

10uF 25V 10uF 25V 100uF16V 10uF 16V 10uF 16V 1uF 25V 0.1uF 100uF 16V L1006
4 BS VCC 5 READY ADJ/GND MLB-201209-0120P-N2
110

C1035
1uF 25V R1014
330 C1027
68uF
35V R1049 C1047 Q1003
R1055 0 READY 33K 1uF 25V SI4925BDY
Close to Q1003 EBK32753101
R1=R2*((Vo/0.8)-1) IC1004 R1065 L1007
AP1117EG-13 33K S1 1 MLB-201209-0120P-N2
8 D1_2 +12V_LCD
IN 3 MAX 1A 2 OUT +5V_USB C C1005 R1050 R1051 R1052 C1009 C1010
G1
7 D1_1
C1042 B Q1001 0.1uF 2.2K 2.2K 2.2K 100uF16V 0.01uF
1 C1049
PANEL_ON R1048 10K RT1C3904-T112 2
0.1uF 100uF 16V
ADJ/GND 10K E
R1015

S2 3
6 D2_2
110

R1017
G2
R1016 P_5V 4 5 D2_1 +5V_MULTI
330 C1019 C1021
10uF 16V 0.01uF
R1070 C1048 1UF
22K 1uF

R1069 C1048-*1
1.6K 2 . 2 u F 2.2UF
C 16V

R1068 10K B Q1004

POWER_SW RT1C3904-T112
E

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER 10 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901 P1103
+12V_LCD
P1101

MEMC_RXOC+
TF05-51S

MEMC_RXEC+

MEMC_RXO0+
MEMC_RXO1+

MEMC_RXO2+

MEMC_RXO3+
MEMC_RXO4+
MEMC_RXOC-
MEMC_RXE0+
MEMC_RXE1+
MEMC_RXE2+

MEMC_RXE3+
MEMC_RXE4+
MEMC_RXEC-

MEMC_RXO0-
MEMC_RXO1-

MEMC_RXO2-

MEMC_RXO3-
MEMC_RXO4-
MEMC_RXE0-
MEMC_RXE1-

MEMC_RXE2-

MEMC_RXE3-
MEMC_RXE4-
SMAW250-04Q L1107

Mstar LCD SL80 DEBUG CIC21J501NE

C1150 10uF 16V

XTAL R1124 1M 1

C1151 1000pF
1

C1152 0.1uF
2
X1101 12MHz
M_XTALO M_XTALI 2 JP1101 3

R1146
100
R1152
100
Closed to IC1100 C1147
15pF
C1148
15pF
3 ISP_RXD_TR
4

5
R1147 R1153 4
100 100 ISP_TXD_TR 6

7
R1148 R1154 5
JP1102 8
100 100
R1149 R1155 9

100 100 +3.3V_MEMC JP1100

10
R1150 R1156 11
URSA_B4M
100 100 L1105
120-ohm URSA_B4P 12
R1151 R1157
+3.3V_MEMC 13
100 100 URSA_B3M

URSA_ACKM
URSA_ACKP
URSA_A0M

URSA_A1M
URSA_A2M

URSA_A3M

URSA_A4M

URSA_B0M
URSA_A0P

URSA_A1P
URSA_A2P

URSA_A3P
URSA_A4P

URSA_B0P

URSA_B1M
URSA_B1P
10uF 10V
URSA_B3P 14

M_XTALO
M_XTALI
+3.3V_MEMC L1104 120-ohm

0.01uF
0.1uF
0.1uF

0.1uF

0.1uF
15

10uF

1uF
L1106
BLM18PG121SN1D URSA_BCKM 16
R1110 820 C1139 22uF
C1126
C1127
C1101
C1129

C1131

C1133

C1134

C1135
URSA_BCKP 17
+1.26V_MEMC L1102 120-ohm C1115 22uF 16V C1140 10uF
18
C1117 10uF C1146 0.1uF
URSA_B2M 19
C1118 0.1uF C1141 0.1uF

G11

K15
K16

A14

D13
D11

A10

A11

A12

A13

REXT D12
B14

C10

B10
B11

C11
C12

B12

B13

C13
C14
E11
F11

F10
A1 C1142 0.1uF URSA_B2P 20

A2

A3

A4

H8

A5

A6

A7

A8

H7

D4
D3

D5
D6
N7

G8

A9

D9
D7
B1

C1
C2

B2
B3

C3
C4

B4

B5

C5
C6

B6
B7

C7
C8

B8

B9

C9
ISP_RXD_TR R1105 0

GPIO[25]
GPIO_13
GPIO_14

GPIO_12
GPIO_2
GPIO_1

GPIO_9
GPIO_8

GPIO_6
GPIO_4
XIN
URSA_B1M 21
RE4P

RE3P

RE2P

RE1P

RE0P

RO4P

RO3P

RO2P

RO1P

RO0P
RE4N

RE3N

RE2N

RE1N

RE0N

LVB0P

LVB1P
LVA0P

LVA1P

LVA2P

LVA3P

LVA4P
RO4N

RO3N

RO2N

RO1N

RO0N
GND_6

GND_5

GND_2
R1106 0
RECKP

SCLM
XOUT

SDAM
ROCKP
ISP_TXD_TR

RECKN

LVB0M

LVB1M
ROCKN

LVA0M

LVA1M

LVA2M

LVA3M

LVA4M
LVACKP
AVDD_PLL

LVACKM
AVDD_LVDS_1

AVDD_LVDS_2
R1107 100 E1 SDAS GPIO_5 D8
M_SDA D10 URSA_B1P 22
M_SCL R1108 100 D1 SCLS GPIO_7
R1101 1K F1 GPIO[8] GPIO_11 E10 URSA_B0M 23
+3.3V_MEMC E3
G1 GPIO[9] GPIO_10
+3.3V_MEMC

R1102 URSA_B0P 24
1K C1119 0.1uF K8 GND_14 [E1] GPIO_3 D2
READY E5 VDDC_1 LVB2P C15 +3.3V_MEMC R1129 4.7K 25
[D1]
B15
URSA_B2P READY
LED_DEMO E2 GPIO[10] LVB2M URSA_B2M R1132 0 R1130 0 26
F2 GPIO[11] LVBCKP A15 LED_DEMO READY READY
LVDS_SEL A16
URSA_BCKP
F3 GPIO[12] LVBCKM URSA_A4M 27
B16
URSA_BCKM
AFLC_EN G2 GPIO[13] LVB3P URSA_B3P 28
M4 GPIO[22] LVB3M C16 URSA_A4P
D15
URSA_B3M
M5 GPIO[23] LVB4P URSA_A3M 29
R1100 R1159 D16
URSA_B4P
G3 GPIO[14] LVB4M URSA_B4M 30
1K 1K
E4 GPIO[15] AVDD_33_2 F9 URSA_A3P
READY READY
F4 GPIO[16] GND_4 G10 C1143 0.1uF 31
R1158 R1160 G4 GPIO[17] LVC0P E15
1K 1K E16
URSA_C0P URSA_ACKM 32
H4 GPIO[18] LVC0M URSA_C0M
J4 GPIO[19] LVC1P E14 URSA_ACKP 33
L1103 120-ohm C1120 10uF 10V URSA_C1P
+3.3V_MEMC K4 GPIO[20] LVC1M F14
URSA_C1M 34
C1121 10uF L4 GPIO[21] LVC2P F16
F15
URSA_C2P
J6 VDDP_2 LVC2M URSA_A2M 35
G15
URSA_C2M
C1122 0.1uF H9 GND_7 LVCCKP URSA_CCKP 36
MEMC_DQ[16-31] LVCCKM G16 URSA_A2P
C1123 0.1uF K9 GND_15 URSA_CCKM +3.3V_MULTI_MST
LVC3P G14 URSA_A1M 37
H14
URSA_C3P
F6 VDDC_2 LVC3M URSA_C3M 38
MEMC_DQ[20] H1 MDATA[20] LVC4P H16 URSA_A1P
H15
URSA_C4P
MEMC_DQ[19] H2 MDATA[19] LVC4M R1127 URSA_A0M 39
URSA_C4M
MEMC_DQ[17]
MEMC_DQ[22]
H3 MDATA[17]
J1 MDATA[22]
IC1100 LVD0P
LVD0M
LVD1P
LVD1M
J15
J16
J14
K14
URSA_D0P
URSA_D0M
URSA_D1P
URSA_D1M
470

OPC_OUT2 R1123
READY
22
URSA_A0P
R1136 0 READY
40

41

42
P1102
TF05-41S
MEMC_DQ[27] J2 MDATA[27]
MEMC_DQ[28]
MEMC_DQ[25]
MEMC_DQ[30]
C1105 0.1uF
K1
K2
J3 MDATA[28]

MDATA[25]
MDATA[30]
LGE7329A GND_3
LVD2P
LVD2M
G9
L14
L15
C1144 0.1uF
URSA_D2P
OPC_EN R1128
OPC_EN
22 B
C

Q1101
E RT1C3904-T112
R1137
0 READY
OPC_OUT1
E-DIM
LVDS_SEL
R1138
R1139
R1161
22
22
0 READY
R1144
READY
0
R1145
READY
0 43

44

45
1

L16
URSA_D2M +3.3V_MEMC R1112 4.7K R1113 0 VESA 2
K6 AVDD_DDR_2 LVDCKP URSA_DCKP JEIDA 46
K3 DQM[3] LVDCKM M16 READYR11314.7K R1140 0 READY URSA_D4M 3
MEMC_DQM3 F8
URSA_DCKM READY R1162 0
L1 DQM[2] AVDD_33_1 AFLC_EN 47
MEMC_DQM2 M15 R1118 4.7K R1119 0 READY URSA_D4P 4
C1106 0.1uF J8 GND_10 LVD3P URSA_D3P READY 48
L2 DQS[2] LVD3M M14 R1133 4.7K R1141 0 READY URSA_D3M 5
MEMC_DQS2 N16
URSA_D3M READY
L3 DQSB[2] LVD4P 49
MEMC_DQSB2 N15
URSA_D4P R1134 4.7K R1142 0 READY URSA_D3P 6
L6 AVDD_DDR_4 LVD4M URSA_D4M READY 50
L8 VDDP_3 C1145 0.1uF R1135 4.7K R1143 0 READY 7
H6 READY 51
C1124 0.1uF H10 GND_8 VDDC_5 8
M1 DQS[3] GPIO[24] N6 URSA_DCKM
MEMC_DQS3 E12
M2 DQSB[3] GPIO[7] 52 URSA_DCKP 9
MEMC_DQSB3 D14
L7 AVDD_DDR_5 GPIO[6] 10
MEMC_DQ[31] F12
M3 MDATA[31] GPIO[5] +3.3V_MEMC
MEMC_DQ[24] N1 MDATA[24] GPIO[4] E13 URSA_D2M 11
C1107 0.1uF J9 GND_11 GPIO[3] F13
URSA_D2P 12
MEMC_DQ[26] N2 MDATA[26] GPIO[2] G13
MEMC_DQ[29] N3 MDATA[29] GPIO[1] H13 URSA_D1M 13
L10 AVDD_DDR_6 GPIO[0] J13 R1114 R1116
1K 1K URSA_D1P 14
MEMC_DQ[23] P1 MDATA[23] PWM0 K12
MEMC_DQ[16] R1 MDATA[16] [N13] PWM1 L12 URSA_D0M 15
MEMC_DQ[18] T1 MDATA[18] CSZ K13
[L9] [N12]
M12
M_SPI_CZ R1115 R1117 URSA_D0P 16
MEMC_DQ[21] T2 MDATA[21] [N5] SDO M_SPI_DO 1K 1K
R2 MCLK[0] SDI M13 17
MEMC_MCLK [N4]
L13
M_SPI_DI READY READY
MEMC_MCLKZ P2 MCLKZ[0] SCK M_SPI_CK 18
C1125 0.1uF G7 GND_1 GPIO[30] N14
R1103 L9 AVDD_MEMPLL GPIO[29] N13 URSA_C4M 19
10K MVREF
AVDD_DDR_7

AVDD_DDR_3

AVDD_DDR_1

N5 MVREF GPIO[28] N12 GPIO8 PWM1 PWM0

MDATA[11]
MDATA[12]

MDATA[14]

P13 MDATA[15]

R14 MDATA[10]
P14 MDATA[13]

URSA_C4P 20
MDATA[4]
MDATA[3]

MDATA[1]
MDATA[6]

MDATA[9]

T14 MDATA[8]

MDATA[7]
MDATA[0]
MDATA[2]
MDATA[5]
MADR[11]

MADR[10]

MADR[12]

MCLKZ[1]
GPIO[26]
GPIO[27]
MADR[0]
MADR[2]
MADR[4]

MADR[6]
MADR[8]

MADR[1]

MADR[5]
MADR[9]

MADR[7]
MADR[3]

MCLK[1]
BADR[1]
BADR[0]

P12 DQSB[0]

R13 DQSB[1]

MEMC_ODT N4 ODT
VDDC_3

G6 VDDC_4
H11 VDDP_1
GND_12

GND_16

GND_13

GND_17
DQM[1]
DQM[0]

R12 DQS[0]

T13 DQS[1]

I2C HIGH LOW HIGH

MCLKE

RESET

R1104 C1102 C1103 URSA_C3M 21

RASZ
CASZ

+3.3V_MEMC
WEZ

10K 0.1uF 1uF EEPROM HIGH HIGH LOW

GND_9

C1108 0.1uF 22
URSA_C3P
J10

J11

J7
P10

P11

P15

P16
P3

P4

P5

P6

P7

P8

F7

P9
L11

T10

T11

T12

T15

T16
T3

T4

T5

T6

T7

T8

T9

R10

R11

R15

R16
R3

R4

R5

R6

R7

R8

R9
K10

K11

N10
N11
N8

K7

N9

SPI HIGH HIGH HIGH

M11

C1109 0.1uF
R1111 23
C1110 0.1uF 10K
URSA_CCKM 24
C1111 0.1uF MEMC_RESET
0

C1112 0.1uF URSA_CCKP 25

R1109

C1116 10uF 26
0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

+1.8V_MEMC L1101 120-ohm C1104 22uF 16V 27

URSA_C2M
URSA_C2P 28
C1113

C1114

C1132

C1128

C1130

C1136

C1137

C1138

URSA_C1M 29

URSA_C1P 30

SPI FLASH +3.3V_MEMC URSA_C0M 31

URSA_C0P 32
IC1101_URSA_Replace_macronix
33
C1149 IC1101-*1
MEMC_WEZ
MEMC_BA1
MEMC_BA0
MEMC_RASZ
MEMC_CASZ

MEMC_DQM1
MEMC_DQM0
MEMC_DQS0

MEMC_DQS1
MEMC_DQSB0

MEMC_DQSB1
MEMC_MCLKE

MEMC_MCLK1
MEMC_MCLKZ1

IC1101 0.1uF MX25L2005MC-12G 34

W25X20AVSNIG
MEMC_DQ[11]
MEMC_DQ[12]

MEMC_DQ[14]

MEMC_DQ[15]

MEMC_DQ[10]
MEMC_DQ[13]
MEMC_DQ[4]
MEMC_DQ[3]
MEMC_DQ[1]
MEMC_DQ[6]

MEMC_DQ[9]

MEMC_DQ[8]

MEMC_DQ[7]
MEMC_DQ[0]
MEMC_DQ[2]
MEMC_DQ[5]
MEMC_A[11]

MEMC_A[10]

MEMC_A[12]

35
MEMC_A[0]
MEMC_A[2]
MEMC_A[4]

MEMC_A[6]
MEMC_A[8]

MEMC_A[1]

MEMC_A[5]
MEMC_A[9]
MEMC_A[7]
MEMC_A[3]

CS VCC
M_SPI_CZ R1120 56 CS 1 8 VCC 1 8 36

37
SO HOLD
M_SPI_DO R1121 56 DO 2 7 HOLD 2 7
38
MEMC_A[0-12] MEMC_DQ[0-15] WP SCLK 39
R1122 10K WP 3 6 CLK R1125 56 M_SPI_CK
3 6
40
GND SI
GND 4 5 DIO R1126 56 4 5 41
M_SPI_DI
IC1101_URSA_winbond
42

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MEMC & LVDS Out 11 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only
 EAX61181901
Mstar LCD SL80
+3.3V_MEMC +1.8V_MEMC for DDR +1.26V Core for MEMC
1300 mA @85% efficiency 1000 mA @85% efficiency

+5V_MULTI +5V_MULTI
READY
IC1205
MP2212DN +3.3V_MEMC IC1203 IC1204
APE8953MP
C1200
BD9130EFJ-E2
100pF R1236
39K R1 R1234
10
C1246
0.1uF ADJ
P_12V 1 FB EN/SYNC 8 R1235 10K 233 mA+400mA+600mA 1 8 EN R1227 10K 8 EN GND 1
L1206
R1237 R2 2 GNDMAX 3ASW_2 +3.3V_MEMC
500 C1264 R2
L1205 12K 7 L1204 3.6uH
VCC
2 7 PVCC R1233 0 400mA + 600mA 1uF 7 POK 2A FB 2 R1232 17.4K 1%
500
C1257 C1258 L1203 +1.8V_MEMC
3 IN SW_1 6 10uF 16V 10uF 16V C1243
100uF
C1244
22uF
C1267
0.1uF
R1225 18K ITH 3 6 SW +1.8V_MEMC 6 VCNTL VOUT_1 3 R1 R1231
10K 1%
C1259
18nF 16V 600 mA
C1253 C1254 2.2uH R1228
10uF 25V 10uF 25V
4 BS VCC 5 C1245 GND
4 5 PGND C1247
R1 39K 1% C1248 5 VIN VOUT_2 4
+1.26V_MEMC
C1255 C1256 330pF 22uF R1229 0.1uF
1uF 25V 0.47uF MAX 2A R2 30K 1%
C1250
0.1uF
C1249
10uF 10V C1251 C1252 C1260
Close to IC1204 100uF16V 0.1uF 10uF 16V
R1226 0 V0 = 0.8(1+R1/R2) R1230 1K

Vo=0.8(1+R1/R2) V0 = 0.8(1+R1/R2)

+1.8V_MEMC_DDR +1.8V_MEMC_DDR

R1221 R1223
1K 1% 1K 1%

C1239 C1240 R1222 R1224 C1241 C1242

1000pF 0.1uF 1K 1% 1K 1% 0.1uF 1000pF

QIMONDA
QIMONDA
MEMC_DQ[16-31] DDR_DQ[16-31] DDR_DQ[16-31] IC1201 DDRB_A[0-12]
DDRB_A[0-12] MEMC_A[0-12] DDRA_A[0-12]
DDRA_A[0-12] IC1202 DDR_DQ[0-15]
DDR_DQ[0-15] MEMC_DQ[0-15]
HYB18TC512160CF-2.5 HYB18TC512160CF-2.5

AR1201 56 AR1205 22 AR1209 22 AR1213 56

MEMC_DQ[27] DDR_DQ[27] DDR_DQ[16] DQ0 G8 J2 VREF VREF J2 G8 DQ0 DDR_DQ[0] DDR_DQ[15] MEMC_DQ[15]
MEMC_DQ[28] DDR_DQ[28] DDR_DQ[17] DQ1 G2 DDRB_A[10] MEMC_A[10] MEMC_A[10] DDRA_A[10] G2 DQ1 DDR_DQ[1] DDR_DQ[8] MEMC_DQ[8]
MEMC_DQ[25] DDR_DQ[25] DDR_DQ[18] DQ2 H7 M8 A0 DDRB_A[1] MEMC_A[1] MEMC_A[1] DDRA_A[1]
A0 M8 H7 DQ2 DDR_DQ[2] DDR_DQ[10] MEMC_DQ[10]
DDRB_A[0] DDRA_A[0]
MEMC_DQ[30] DDR_DQ[30] DDR_DQ[19] DQ3 H3 DDRB_A[3] MEMC_A[3] MEMC_A[3] DDRA_A[3] H3 DQ3 DDR_DQ[3] DDR_DQ[13] MEMC_DQ[13]
M3 A1 DDRB_A[1] DDRA_A[1] A1 M3
AR1202 56 DDR_DQ[20] DQ4 H1 M7 A2 AR1206 22 AR1210 22 A2 M7 H1 DQ4 DDR_DQ[4]
AR1214 56
DDRB_A[2] DDRA_A[2]
MEMC_DQ[22] DDR_DQ[22] DDR_DQ[21] DQ5 H9 N2 A3 DDRB_A[9] MEMC_A[9] MEMC_A[9] DDRA_A[9]
A3 N2 H9 DQ5 DDR_DQ[5] DDR_DQ[7] MEMC_DQ[7]
DDRB_A[3] DDRA_A[3]
MEMC_DQ[17] DDR_DQ[17] DDR_DQ[22] DQ6 F1 DDRB_A[12] MEMC_A[12] MEMC_A[12] DDRA_A[12] F1 DQ6 DDR_DQ[6] DDR_DQ[0] MEMC_DQ[0]
MEMC_DQ[19] DDR_DQ[19] DDR_DQ[23] DQ7 F9 N8 A4 DDRB_A[4]
DDRB_A[7] MEMC_A[7] MEMC_A[7] DDRA_A[7]
DDRA_A[4] A4 N8 F9 DQ7 DDR_DQ[7] DDR_DQ[2] MEMC_DQ[2]
N3 A5 DDRB_A[5] DDRA_A[5] A5 N3
MEMC_DQ[20] DDR_DQ[20] DDR_DQ[24] DQ8 C8 N7 A6 DDRB_A[5] MEMC_A[5] MEMC_A[5] DDRA_A[5]
A6 N7 C8 DQ8 DDR_DQ[8] DDR_DQ[5] MEMC_DQ[5]
DDRB_A[6] DDRA_A[6]
AR1203 56 DDR_DQ[25] DQ9 C2 P2 A7 AR1207 22 AR1211 22 A7 P2 C2 DQ9 DDR_DQ[9]
AR1215 56
DDRB_A[7] DDRA_A[7]
MEMC_DQ[31] DDR_DQ[31] DDR_DQ[26] DQ10 D7 DDRB_A[0] MEMC_A[0] MEMC_A[2] DDRA_A[2] D7 DQ10 DDR_DQ[10] DDR_DQ[11] MEMC_DQ[11]
MEMC_DQ[24] DDR_DQ[24] DDR_DQ[27] DQ11 D3 P8 A8 DDRB_A[8]
DDRB_A[2] MEMC_A[2] MEMC_A[0] DDRA_A[0]
DDRA_A[8] A8 P8 D3 DQ11 DDR_DQ[11] DDR_DQ[12] MEMC_DQ[12]
P3 A9 DDRB_A[9] DDRA_A[9] A9 P3
MEMC_DQ[26] DDR_DQ[26] DDR_DQ[28] DQ12 D1 M2 A10/AP DDRB_A[4] MEMC_A[4] MEMC_A[6] DDRA_A[6]
A10/AP M2 D1 DQ12 DDR_DQ[12] DDR_DQ[9] MEMC_DQ[9]
DDRB_A[10] DDRA_A[10]
MEMC_DQ[29] DDR_DQ[29] DDR_DQ[29] DQ13 D9 P7 A11 DDRB_A[6] MEMC_A[6] MEMC_A[4] DDRA_A[4]
A11 P7 D9 DQ13 DDR_DQ[13] DDR_DQ[14] MEMC_DQ[14]
DDRB_A[11] DDRA_A[11]
AR1204 56 DDR_DQ[30] DQ14 B1 R2 A12 AR1208 22 AR1212 22 A12 R2 B1 DQ14 DDR_DQ[14] AR1216 56

DDR2 1.8V By CAP - Place these Caps near Memory

DDRB_A[12] DDRA_A[12]
MEMC_DQ[23] DDR_DQ[23] DDR_DQ[31] DQ15 B9 B_URSA_RASZ MEMC_RASZ MEMC_RASZ A_URSA_RASZ B9 DQ15 DDR_DQ[15] DDR_DQ[6] MEMC_DQ[6]
MEMC_DQ[16] DDR_DQ[16] +1.8V_MEMC_DDR B_URSA_CASZ MEMC_CASZ MEMC_CASZ A_URSA_CASZ DDR_DQ[1] MEMC_DQ[1]
MEMC_DQ[18] DDR_DQ[18] L2 BA0 B_URSA_BA0 DDRB_A[11] MEMC_A[11] MEMC_A[8] DDRA_A[8] A_URSA_BA0 BA0 L2 +1.8V_MEMC_DDR DDR_DQ[3] MEMC_DQ[3]
DDR2 1.8V By CAP - Place these Caps near Memory

MEMC_DQ[21] DDR_DQ[21] C1203 10uF VDD5 A1 L3 BA1 B_URSA_BA1 DDRB_A[8] MEMC_A[8] MEMC_A[11] DDRA_A[11] A_URSA_BA1 BA1 L3 A1 VDD5 C1222 10uF DDR_DQ[4] MEMC_DQ[4]
C1204 0.1uF R1202 22 R1211 22 C1223 0.1uF
VDD4 E1 MEMC_MCLK MEMC_MCLK1 E1 VDD4
C1205 0.1uF R1201 R1220 C1224 0.1uF
VDD3 J9 J8 CK 150 CK J8 J9 VDD3
C1206 0.1uF VDD2 M9 K8 CK READY R1203 22 MEMC_MCLKZ MEMC_MCLKZ1
R1212 22 150READY CK K8 M9 VDD2 C1225 0.1uF
+1.8V_MEMC +1.8V_MEMC_DDR
C1207 0.1uF C1226 0.1uF
VDD1 R1 K2 CKE B_URSA_MCLKE A_URSA_MCLKE CKE K2 R1 VDD1
C1208 0.1uF C1228 0.1uF
BLM18PG121SN1D
+1.8V_MEMC +1.8V_MEMC_DDR L1202
K9 ODT R1204 22 MEMC_ODT MEMC_ODT
R1213 22 ODT K9
C1212 10uF C1227 10uF

16V
BLM18PG121SN1D C1209 0.1uF VDDQ10 A9 L8 CS CS L8 A9 VDDQ10 C1229 0.1uF

C1220
L1201 VDDQ9 C1 K7 RAS RAS K7 C1 VDDQ9

0.1uF

C1221
C1210 0.1uF B_URSA_RASZ A_URSA_RASZ C1230 0.1uF
VDDQ8 C3 L7 CAS CAS L7 C3 VDDQ8
10V

0.1uF
C1211 0.1uF B_URSA_CASZ A_URSA_CASZ C1231 0.1uF
VDDQ7 C7 K3 WE WE K3 C7 VDDQ7
0.1uF
C1201

C1213 0.1uF B_URSA_WEZ A_URSA_WEZ C1232 0.1uF

C1202

C1214 0.1uF VDDQ6 C9 IC1201-*1 C9 VDDQ6 C1233 0.1uF

VDDQ5 E9 R1205 56 IC1201-*2
R1214 56 E9 VDDQ5
10uF

C1215 0.1uF F7 LDQS MEMC_DQS2 H5PS5162FFR-S6C EDE5116AJBG-8E-E MEMC_DQS0 LDQS F7 C1234 0.1uF
C1216 0.1uF VDDQ4 G1 R1206 56 R1215 56 G1 VDDQ4
VDDQ3 G3 B7 UDQS MEMC_DQS3 MEMC_DQS1 UDQS B7 G3 VDDQ3
C1235 0.1uF
VREF J2 Hynix G8 DQ0 VREF DQ0
C1217 0.1uF G2 DQ1
J2 ELPIDA
G8
DQ1 C1236 0.1uF
C1218 0.1uF VDDQ2 G7 A0 M8
H7 DQ2
A0
G2
H7 DQ2 G7 VDDQ2 C1237 0.1uF
IC1202-*1
VDDQ1 G9 F3 LDM R1207 56 A1 M3
H3 DQ3
DQ4 A1
M8
M3
H3 DQ3
R1216 56 LDM F3 G9 VDDQ1 IC1202-*2
C1219 0.1uF MEMC_DQM2 A2 M7
H1
A2 H1 DQ4
MEMC_DQM0 C1238 0.1uF H5PS5162FFR-S6C
B3 UDM R1208 56 A3 N2
H9 DQ5
DQ6 A3
M7
N2
H9 DQ5
R1217 56 UDM B3
EDE5116AJBG-8E-E
MEMC_DQM3 A4
A5
N8
F1
F9 DQ7 A4 N8
F1
F9
DQ6
DQ7
MEMC_DQM1
A6
N3
N7
C8 DQ8
DQ9
A5
A6
N3
N7
C8 DQ8
VREF J2 Hynix G8
G2
DQ0
DQ1
VREF J2
ELPIDA
G8 DQ0
DQ1
A7 C2 C2 DQ9 G2
P2 A7 DQ2

VSS5 A3 E8 LDQS R1209 56 A8 P8

D7 DQ10
DQ11 A8
P2
P8
D7 DQ10
R1218 56 LDQS E8 A3 VSS5
A0 M8
H7
H3 DQ3 A0 M8
H7 DQ2
DQ3
MEMC_DQSB2 A9 P3
D3
A9 D3 DQ11
MEMC_DQSB0 A1 M3 DQ4 A1 M3
H3

VSS4 E3 A8 UDQS R1210 56 A10/AP M2

D1 DQ12
DQ13 A10
P3
M2
D1 DQ12
R1219 56 UDQS A8 E3 VSS4
A2 M7
H1
H9 DQ5 A2 M7
H1 DQ4
DQ5
MEMC_DQSB3 A11 P7
D9
B1 DQ14 A11 P7
D9 DQ13
DQ14
MEMC_DQSB1 A3
A4
N2
F1 DQ6 A3 N2
H9
F1 DQ6
VSS3 J3 A12 R2
B9 DQ15 A12 R2
B1
B9 DQ15 J3 VSS3 A5
A6
N8
N3
F9
C8
DQ7
DQ8
A4
A5
N8
N3
F9
C8
DQ7
DQ8
VSS2 N1 AR1217 22
BA0 L2 BA0 N1 VSS2 A7
N7
C2 DQ9 A6 N7
C2 DQ9

VSS1 P9 L1 NC4 BA1 L3

A1 VDD5 BA1
L2
L3 VDD_5
NC4 L1 P9 VSS1
A8
P2
P8
D7 DQ10
DQ11
A7
A8
P2
P8
D7 DQ10

B_URSA_BA0 MEMC_BA0
A1 A9 D3 D3 DQ11
R3 NC5 CK J8
E1
J9
VDD4
VDD3 CK
E1 VDD_4
VDD_3
NC5 R3 A10/AP
P3
M2
D1 DQ12
DQ13
A9
A10
P3
M2
D1 DQ12

B_URSA_BA1 MEMC_BA1
J8 J9 A11 D9 D9 DQ13
R7 NC6 CK
CKE
K8
K2
M9
R1
VDD2
VDD1 CKE
CK K8
K2
M9
R1
VDD_2
VDD_1
NC6 R7 A12
P7
R2
B1
B9
DQ14
DQ15
A11
A12
P7
R2
B1 DQ14
DQ15
B_URSA_MCLKE MEMC_MCLKE B9

BA0
B_URSA_WEZ MEMC_WEZ
ODT K9 ODT L2 BA0 L2
VSSQ10 B2 A2 NC1
CS
RAS
L8
K7
A9
C1
VDDQ10
VDDQ9 RAS
CS
K9
L8 A9 VDDQ_10
VDDQ_9 NC1 A2 B2 VSSQ10 BA1 L3
A1 VDD5
VDD4
BA1 L3
A1 VDD_5

VSSQ9 B8 AR1218 22 CAS L7 C3 VDDQ8 CAS

K7 C1
VDDQ_8 B8 VSSQ9 CK
E1
VDD3
E1 VDD_4

E2 NC2 WE K3 C7 VDDQ7 WE
L7 C3
VDDQ_7 NC2 E2 CK
J8 J9
VDD2
CK J8 J9 VDD_3

VSSQ8 A7 MEMC_BA0 A_URSA_BA0 C9 VDDQ6

K3 C7
VDDQ_6 A7 VSSQ8 CKE
K8 M9
VDD1
CK K8 M9 VDD_2

VSSQ7 D2 R8 NC3 LDQS E9 VDDQ5

C9
E9 VDDQ_5
+1.8V_MEMC_DDR NC3 R8 D2 VSSQ7
K2 R1 CKE K2 R1 VDD_1

+1.8V_MEMC_DDR MEMC_BA1 A_URSA_BA1 UDQS

F7
B7
G1
G3
VDDQ4
VDDQ3
LDQS
UDQS
F7
B7
G1 VDDQ_4
VDDQ_3
ODT K9 ODT K9
VSSQ6 D8 MEMC_MCLKE A_URSA_MCLKE LDM F3
G7
G9
VDDQ2
VDDQ1 LDM
G3
G7 VDDQ_2
VDDQ_1
D8 VSSQ6 CS
RAS
L8
K7
A9
C1
VDDQ10
VDDQ9
CS
RAS
L8
K7
A9
C1
VDDQ_10
VDDQ_9
VSSQ5 E7 J7 VSSDL MEMC_WEZ A_URSA_WEZ
UDM B3 UDM
F3
B3
G9
VSSDL J7 E7 VSSQ5 CAS
WE
L7
K3
C3
C7
VDDQ8
VDDQ7
CAS
WE
L7
K3
C3
C7
VDDQ_8
VDDQ_7
VSSQ4 F2 LDQS E8 A3 VSS5 LDQS E8 A3 VSS_5
F2 VSSQ4 LDQS
C9
E9
VDDQ6
VDDQ5
C9
E9
VDDQ_6
VDDQ_5
VSSQ3 F8 UDQS A8 E3
J3
VSS4
VSS3
UDQS A8 E3
J3
VSS_4
VSS_3
F8 VSSQ3 UDQS
F7
B7
G1
G3
VDDQ4
VDDQ3
LDQS
UDQS
F7
B7
G1
G3
VDDQ_4
VDDQ_3
VSSQ2 H2 NC4
NC5
L1
R3
N1
P9
VSS2
VSS1 NC_4
NC_5
L1
N1
P9
VSS_2
VSS_1
H2 VSSQ2 LDM F3
G7
G9
VDDQ2
VDDQ1 LDM F3
G7
G9
VDDQ_2
VDDQ_1
VSSQ1 H8 J1 VDDL NC6 R7 NC_6
R3
R7 VDDL J1 H8 VSSQ1 UDM B3 UDM B3

C1261 NC1 A2
B2
B8
VSSQ10
VSSQ9 NC_1 A2
B2 VSSQ_10
VSSQ_9
C1262 LDQS
UDQS
E8 A3 VSS5
VSS4
LDQS E8 A3 VSS_5

0.1uF NC2
NC3
E2
R8
A7
D2
VSSQ8
VSSQ7
NC_2
NC_3
E2
R8
B8
A7 VSSQ_8
VSSQ_7
0.1uF A8 E3
J3 VSS3
VSS2
UDQS A8 E3
J3
VSS_4
VSS_3
D2 NC4 N1 N1 VSS_2
D8 VSSQ6 VSSQ_6 L1 VSS1 NC_4 L1
D8 NC5 P9 P9 VSS_1
VSSDL E7 VSSQ5 VSSQ_5 R3 NC_5 R3
J7 VSSDL J7 E7 NC6
F2 VSSQ4 VSSQ_4 R7 NC_6 R7
F2
F8 VSSQ3 VSSQ_3
F8 VSSQ10
H2 VSSQ2 VSSQ_2 NC1 B2 B2 VSSQ_10
H2 A2 VSSQ9 NC_1 A2
VDDL J1 H8 VSSQ1 VDDL VSSQ_1 NC2 B8 B8 VSSQ_9
J1 H8 E2 VSSQ8 NC_2 E2
NC3 A7 A7 VSSQ_8
R8 VSSQ7 NC_3 R8
D2 D2 VSSQ_7
D8 VSSQ6 VSSQ_6
D8
VSSDL E7 VSSQ5 VSSQ_5
J7 VSSDL J7 E7
F2 VSSQ4 VSSQ_4
F2
F8 VSSQ3 VSSQ_3
F8
H2 VSSQ2 VSSQ_2
H2
VDDL J1 H8 VSSQ1 VDDL VSSQ_1
J1 H8

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS H6 SL80 2009/04/02
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MEMC_DDR & POWER 12 12

Copyright © 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only