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HW 5
HW 5
EE457
Assume that you are a design engineer and at a leading semiconductor company. You are requested to
analyze high-speed signals on a newly developed chip on a silicon substrate. Assume that all fabrication is
done through a conventional CMOS batch process. You are to analyze a signal interconnect length of 750
um with width of 75 um and thickness of 10um. The interconnect is made of aluminum. Calculate the
following: