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6/10/2020 DIN EN 50155 (VDE 0115-200): 2008-03

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GERMAN STANDARD March 2008

DIN EN 50155
(VDE 0115-200)

This standard is also a VDE regulation in the sense of VDE 0022. It is according to
Implementation of the approval process decided by the VDE Presidium at
of the number given above in the VDE regulations and in the
"Etz Elektrotechnik + Automation" has been announced.

Reproduction - also for internal purposes - is not permitted.

ICS 45.060.01 Replacement for


DIN EN 50155
(VDE 0115-200): 2004-01
However, see beginning of validity

Railway applications -
Electronic devices on railway vehicles;
German version EN 50155: 2007

Railway applications -
Electronic equipment used on rolling stock;
German version EN 50155: 2007

Applications ferroviaires -
Equipments electronic utilisés sur le matériel roulant;
Version allemande EN 50155: 2007

Total length 51 pages

DKE German Commission for Electrical Engineering Electronics Information Technology in DIN and VDE

Database printout from "VDE regulations - electronic version". Use only in accordance with the usage contract. All rights reserved.
© DIN German Institute for Standardization e. V. and VDE Association of Electrical Engineering Electronics Information Technology e. V. Price gr. 30 K.
Any type of reproduction, even in part, only with the approval of DIN, Berlin, and VDE sales no. 0115117
des VDE, Frankfurt am Main.
Individual sales and subscriptions through VDE VERLAG GMBH, 10625 Berlin
Individual sales also through Beuth Verlag GmbH, 10772 Berlin

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DIN EN 50155 (VDE 0115-200): 2008-03

Start of validity

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6/10/2020 DIN EN 50155 (VDE 0115-200): 2008-03
The EN 50155 adopted by CENELEC on 2007-03-01 is considered a DIN standard from 2008-03-01.

In addition, DIN EN 50155 (VDE 0115-200): 2004-01 may still be applied until 2010-03-01.

National Foreword

Previous draft: E DIN EN 50155 (VDE 0115-200): 2006-10.

The national working group UK 351.1 "Vehicles" of the DKE German Commission is for this standard
Electrical engineering electronics information technology in DIN and VDE (http://www.dke.de) responsible.

Changes

The following changes have been made to DIN EN 50155 (VDE 0115-200): 2004-01 :
a) Requirements to ensure functional safety with regard to EN 50126 and EN 50128
were specified;
b) the standard has been adapted to the series of standards EN 50121;
c) addition of an explanation of the different information in Table 1 and EN 50125-1: 1999, Table 2,
to the internal cabinet temperature.

Previous issues

DIN EN 50155 (VDE 0115-200): 1996-05, 2002-11, 2004-01

National Annex NA
(informative)

Connection with European and international standards

In the case of an undated reference in the normative text (reference to a standard without specifying the
Issue date and without reference to a section number, a table, a picture, etc.) refers to the
Reference to the latest valid edition of the referenced standard.

In the case of a dated reference in the normative text, the reference always refers to the in
Referenced edition of the standard.

Information about the relationship between the cited standards and the corresponding German standards
is shown in Table NA.1.

Table NA.1

Classification in
European standard International standard German standard
VDE regulations

EN 50121-3-1: 2000 - DIN EN 50121-3-1 VDE 0115-121-3-1


withdrawn, (VDE 0115-121-3-1): 2001-05
replaced by: withdrawn, replaced by:

EN 50121-3-1: 2006 - DIN EN 50121-3-1 VDE 0115-121-3-1


(VDE 0115-121-3-1): 2007-07

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DIN EN 50155 (VDE 0115-200): 2008-03

Classification in
European standard International standard German standard
VDE regulations

EN 50121-3-2: 2000 - DIN EN 50121-3-2 VDE 0115-121-3-2


withdrawn, (VDE 0115-121-3-2): 2001-05
replaced by: withdrawn, replaced by:

EN 50121-3-2: 2006 DIN EN 50121-3-2


(VDE 0115-121-3-2): 2007-07 VDE 0115-121-3-2

EN 50125-1: 1999 - DIN EN 50125-1 VDE 0115-108-1


(VDE 0115-108-1): 2000-05

Series standards - Series standards VDE 0115-103


EN 50126 DIN EN 50126 (VDE 0115-103)

EN 50128: 2001 - DIN EN 50128 VDE 0831-128


(VDE 0831-128): 2001-11

EN 50129: 2003 - DIN EN 50129 VDE 0831-129


(VDE 0831-129): 2003-12

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EN 50163: 1995 - DIN EN 50163 VDE 0115-102
withdrawn, (VDE 0115-102): 1996-05
replaced by: withdrawn, replaced by:

EN 50163: 2004 - DIN EN 50163 VDE 0115-102


(VDE 0115-102): 2005-07

EN 50207: 2000 - DIN EN 50207 VDE 0115-410


withdrawn, (VDE 0115-410): 2001-03
replaced by: withdrawn, replaced by:

EN 61287-1: 2006 IEC 61287-1: 2005 DIN EN 61287-1 VDE 0115-410


(VDE 0115-410): 2007-08

Series standards - Series standards VDE 0876-16


EN 55016 DIN EN 55016 (VDE 0876-16)

Series standards Series standards Series standards -


EN 60068 IEC 60068 DIN EN 60068

EN 60068-2-1: 1993 IEC 60068-2-1: 1990 DIN EN 60068-2-1: 1995-03 -


withdrawn, withdrawn,
replaced by: replaced by:

EN 60068-2-1: 2007 IEC 60068-2-1: 2007 - -

EN 60068-2-2: 1993 IEC 60068-2-2: 1974 DIN EN 60068-2-2: 1994-08 -


+ A1: 1993 + A1: 1993
+ A2: 1994 + A2: 1994

EN 60068-2-30: 2005 IEC 60068-2- 30: 2005 DIN EN 60068-2-30: 2006-06 -

Series standards Series standards Series standards VDE 0115-460


EN 60077 IEC 60077 DIN EN 60077 (VDE 0115-460)

EN 60249-2-15: 1994 IEC 60249-2-15: 1987 DIN EN 60249-2-15: 1994-09 -


+ A1: 1994 + A1: 1993

Series standards Series standards Series standards -


EN 60297 IEC 60297 DIN EN 60297

Series standards Series standards Series standards -


EN 60352 IEC 60352 DIN EN 60352

EN 60352-1: 1997 IEC 60352-1: 1997 DIN EN 60352-1: 1998-04 -

EN 60352-2: 2006 IEC 60352-2: 2006 DIN EN 60352-2: 2006-11 -

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DIN EN 50155 (VDE 0115-200): 2008-03

Classification in
European standard International standard German standard
VDE regulations

EN 60529: 1991 IEC 60529: 1989 DIN EN 60529 VDE 0470-1


+ A1: 2000 + A1: 1999 (VDE 0470-1): 2000-09

EN 61000-4-4: 2004 IEC 61000-4-4: 2004 DIN EN 61000-4-4 VDE 0847-4-4


(VDE 0847-4-4): 2005-07

Series standards Series standards Series standards VDE 0040


EN 61082 IEC 61082 DIN EN 61082 (VDE 0040)

Series standards Series standards Series standards -


EN 61249 IEC 61249 DIN EN 61249

EN 61249-2-7: 2002 IEC 61249-2-7: 2002 DIN EN 61249-2-7: 2002-12 -

EN 61249-2-10 IEC 61249-2-10 DIN EN 61249-2-10: 2004-01 -

EN 61373: 1999 IEC 61373: 1999 DIN EN 61373 VDE 0115-106


(VDE 0115-106): 1999-11

Series standards Series standards Series standards -


EN 62326 IEC 62326 DIN EN 62326

EN 123000: 1991 - DIN EN 123000: 1992-02 -


+ A1: 1995 + A1: 1996
+ A2: 1996 + A2: 1997

EN 123200: 1992 - DIN EN 123200: 1992-11 -

EN 123300: 1992 - DIN EN 123300: 1992-11 -

EN 123400: 1992 - DIN EN 123400: 1992-11 -

EN 123500: 1992 DIN EN 123500: 1992-11

EN ISO 9000-3: 1997 - - -


withdrawn

EN ISO 9001: 2000 ISO 9001: 2000 DIN EN ISO 9001: 2000-12 -

EN ISO 9002: 1994 ISO 9002: 1994 DIN EN ISO 9002: 1994-08 -

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withdrawn,
replaced by: withdrawn,
replaced by: withdrawn,
replaced by:

EN ISO 9001: 2000 ISO 9001: 2000 DIN EN ISO 9001: 2000-12 -

- Series standards Series standards -


IEC 60605 DIN IEC 60605

- IEC 60617 (DB) - -

National Annex NB
(informative)

References

DIN EN 50121-3-1 (VDE 0115-121-3-1): 2007-07, Railway Applications - Electromagnetic Compatibility -


Part 3-1: Railway vehicles - train and entire vehicle; German version EN 50121-3-1: 2006

DIN EN 50121-3-2 (VDE 0115-121-3-2): 2007-07, Railway Applications - Electromagnetic Compatibility -


Part 3-2: Railway vehicles - equipment; German version EN 50121-3-2: 2006

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DIN EN 50155 (VDE 0115-200): 2008-03

DIN EN 50125-1 (VDE 0115-108-1): 2000-05, Railway applications - environmental conditions for equipment -
Part 1: Equipment on rail vehicles; German version EN 50125-1: 1999

DIN EN 50126 (VDE 0115-103) (series), railway applications - specification and proof of reliability
availability, maintainability, security (RAMS)

DIN EN 50128 (VDE 0831-128): 2001-11, Railway Applications - Telecommunications, Signaling


and data processing systems - software for railway control and monitoring systems;
German version EN 50128: 2001

DIN EN 50129 (VDE 0831-129): 2003-12, Railway Applications - Telecommunications, Signaling


and data processing systems - Safety-relevant electronic systems for signaling; German
Version EN 50129: 2003

DIN EN 50163 (VDE 0115-102): 2005-07, Railway applications - supply voltages for railway networks;
German version EN 50163: 2004

DIN EN 55016 (VDE 0876-16) (series), requirements for devices and equipment as well as definition of
Method for measuring high-frequency interference (radio interference) and immunity

DIN EN 61287-1 (VDE 0115-410): 2007-08, Railway applications - Power converters on railway vehicles - Part 1:
Properties and test methods (IEC 61287-1: 2005); German version EN 61287-1: 2006

DIN EN 60068 (series), environmental tests

DIN EN 60068-2-1: 1995-03, Environmental tests - Part 2-1: Tests - Test group A: Cold
(IEC 60068-2-1: 1990 + A1: 1993 + A2: 1994); German version EN 60068-2-1: 1993 + A1: 1993 + A2: 1994.

DIN EN 60068-2-2: 1994-08, Environmental tests - Part 2-2: Tests - Test group B: Dry heat
(IEC 60068-2-2: 1974 + A1: 1993 + A2: 1994); German version EN 60068-2-2: 1993 + A1: 1993

DIN EN 60068-2-30: 2006-06, environmental influences - Part 2-30: Test methods - Test Db: moist heat,
cyclical (12 + 12 hours) (IEC 60068-2-30: 2005); German version EN 60068-2-30: 2005

DIN EN 60077 (VDE 0115-460) (series), railway applications - electrical equipment on railway vehicles

DIN EN 60249-2-15: 1994-09, base materials for printed circuits - Part 2: Individual provisions -
Individual determination No. 15: Flexible copper-clad polyimide film with defined flammability
(IEC 60249-2-15: 1987 + A1: 1993); German version EN 60249-2-15: 1994 + A1: 1994

DIN EN 60297 (series), construction methods for electronic equipment - dimensions of the 482.6 mm (19 in) construction method

DIN EN 60352 (series), solderless connections

DIN EN 60352-1: 1998-04, Solderless connections - Part 1: Wound connections - General requirements,
Test methods and application notes (IEC 60352-1: 1997); German version EN 60352-1: 1997

DIN EN 60352-2: 2006-11, Solderless connections - Part 2: Crimp connections - General requirements,
Test methods and application notes (IEC 60352-2: 2006); German version EN 60352-2: 2006

DIN EN 60529 (VDE 0470-1): 2000-09, Degrees of protection provided by housing (IP code) (IEC 60529: 1989 + A1: 1999);
German version EN 60529: 1991 + A1: 2000

DIN EN 61000-4-4 (VDE 0847-4-4): 2005-07, Electromagnetic Compatibility (EMC) - Part 4-4: Test and

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Measuring method - testing immunity to fast transient electrical disturbances / burst
(IEC 61000-4-4: 2004); German version EN 61000-4-4: 2004

DIN EN 61082 (VDE 0040) (series), electrical engineering documents

DIN EN 61249 (series), materials for printed circuit boards and other connection structures

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DIN EN 50155 (VDE 0115-200): 2008-03

DIN EN 61249-2-7: 2002-12, materials for printed circuit boards and other connection structures - Part 2-7: Ka
bare and unclad reinforced base materials - copper-clad glass fiber reinforced epoxy
resin laminate sheets with defined flammability (firing test with vertical test specimen position)
(IEC 61249-2-7: 2002); German version EN 61249-2-7: 2002

DIN EN 61249-2-10: 2004-01, Materials for printed circuit boards and other connection structures - Part 2-10: Ka
bare and non-laminated reinforced base materials - copper-clad lami- reinforced with E-glass fabric
natural tablets based on cyanate ester with modified or unmodified epoxy resin containing bromine
defined flammability (flammability test with vertical test object position) (IEC 61249-2-10: 2003); German
Version EN 61249-2-10: 2003

DIN EN 61373 (VDE 0115-106): 1999-11, Railway applications - equipment of railway vehicles - testing
vibration and shock conditions (IEC 61373: 1999); German version EN 61373: 1999

DIN EN 62326 (series), printed circuit boards

DIN EN 123000: 1992-02, generic specification - printed circuit boards; German version EN 123000: 1991

DIN EN 123200: 1992-11, frame specification - printed circuit boards with printed circuit diagrams on one or both
Sides with metallized holes; German version EN 123200: 1992

DIN EN 123300: 1992-11, frame specification - multilayer printed circuit boards; German version
EN 123300: 1992

DIN EN 123400: 1992-11, frame specification - flexible printed circuit boards without through-connections; German
Version EN 123400: 1992

DIN EN 123500: 1992-11, frame specification - flexible printed circuit boards with through connections; German
Version EN 123500: 1992

DIN EN ISO 9001: 2000-12, quality management systems - requirements

DIN IEC 60605 (series), device reliability tests

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6/10/2020 DIN EN 50155 (VDE 0115-200): 2008-03

EUROPEAN STANDARD EN 50155


EUROPEAN STANDARD
NORME EUROPÉENNE July 2007

ICS 45.060.10 Replacement for EN 50155: 2001 + A1: 2002

German version

Railway applications -
Electronic devices on rail vehicles

Railway applications - Applications ferroviaires -


Electronic equipment used on rolling stock Equipments électroniques utilisés sur le
matériel roulant

This European standard was adopted by CENELEC on 2007-03-01. The CENELEC members
are required to comply with the CEN / CENELEC rules of procedure, which set out the conditions,
under which this European standard gives the status of a national standard without any change
is.

Up-to-date lists of these national standards with their bibliographical information


are available from the central secretariat or from any CENELEC member on request.

This European Standard consists of three official versions (German, English, French). A
Version in another language made by a CENELEC member at their own risk
Translation into his national language and notified to the Central Secretariat has the
same status as the official versions.

CENELEC members are the national electrotechnical committees of Belgium, Bulgaria,


Denmark, Germany, Estonia, Finland, France, Greece, Ireland, Iceland, Italy, Latvia
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Austria, Poland, Portugal, Romania,
Sweden, Switzerland, Slovakia, Slovenia, Spain, the Czech Republic, Hungary, the
United Kingdom and Cyprus.

CENELEC
European Committee for Electrotechnical Standardization
European Committee for Electrotechnical Standardization
Comité Européen de Normalization Electrotechnique

Central Secretariat: rue de Stassart 35, B-1050 Brussels

© 2007 CENELEC - All rights of exploitation, regardless of the form and the procedure,
are reserved for members of CENELEC worldwide.

Ref.No. EN 50155: 2007 D

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DIN EN 50155 (VDE 0115-200): 2008-03
EN 50155: 2007

foreword

This European standard has been approved by the CENELEC / TC 9X Technical Committee “Electrical and electronic
applications for railways ”.

The text of the draft was submitted to the single stage acceptance procedure and was published by CENELEC on
2007-03-01 adopted as EN 50155.

This European standard replaces the standard EN 50155: 2001 + A1: 2002.

This EN 50155: 2007 was adapted to the new series of standards EN 50121 and takes some into account
Portuguese comments.

The following dates have been set:

- latest date on which the EN at national level


by publishing an identical national

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6/10/2020 DIN EN 50155 (VDE 0115-200): 2008-03
Norm or by acceptance
got to (dop): 2008-03-01

- latest date at which national standards were adopted


oppose the EN, be withdrawn
have to (dow): 2010-03-01

This European Standard was drawn up under a mandate issued by the European Commission and the
European Free Trade Association was given to CENELEC. This European standard covers basic ones
Requirements that are contained in the EC Directives 96/48 / EG and 2001/16 / EG. See Appendix ZZ.

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DIN EN 50155 (VDE 0115-200): 2008-03
EN 50155: 2007

content

page
Foreword................................................. .................................................. .................................................. .......... 2

1 Scope of application ................................................. .................................................. ........................... 5


2nd Normative references ................................................ .................................................. .................... 5

3rd Terms ................................................. .................................................. ............................................... 7


4th Environmental conditions for operation .............................................. .................................................. ..... 9

4.1 Nominal operating conditions ................................................. .................................................. ................. 9

4.2 Special operating conditions ................................................ .................................................. ...... 10


5 Electrical operating conditions ................................................ .................................................. ...... 11

5.1 Power supply ................................................. .................................................. ..................... 11

5.2 Overvoltages in the power supply ............................................... ...................................... 12


5.3 Installation................................................. .................................................. ......................................... 13

5.4 Tests of voltage surges, electrostatic discharge and sensitivity


regarding transient disturbances ............................................... .................................................. ....... 13

5.5 Electromagnetic compatibility ................................................ .................................................. ... 13


6 Reliability, maintainability and expected service life ........................................... .......... 13
6.1 Reliability of the facility ............................................... .................................................. .......... 13

6.2 Useful life ................................................. .................................................. ............................ 14

6.3 Serviceability ................................................. .................................................. ....................................... 14

6.4 Maintenance levels ................................................. .................................................. ................................ 14


6.5 Built-in diagnostic facilities ................................................ .................................................. .. 15
6.6 Automatic test facility ................................................ .................................................. ............ 15

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6.7 Alternative methods for fault diagnosis .............................................. ............................................. 15
6.8 Product-specific test equipment and special tools .............................................. .............. 15
7 Development................................................. .................................................. ....................................... 16

7.1 General ................................................. .................................................. ...................................... 16

7.2 Execution Practices - Hardware ............................................... .................................................. ..... 16

7.3 Execution Practices - Software ............................................... .................................................. ...... 18


7.4 Features of the facility ............................................... .................................................. ................... 20
8th Components ................................................. .................................................. ..................................... 21

8.1 Procurement................................................. .................................................. ...................................... 21


8.2 Application................................................. .................................................. ....................................... 22
9 Construction ................................................. .................................................. .............................................. 22

9.1 Structure of the facility ............................................... .................................................. ....................... 22

9.2 Assembly of the components ............................................... .................................................. ................. 23

9.3 Electrical connections ................................................ .................................................. .................. 24


9.4 Internal flexible wiring (electrical and optical) .......................................... ................................. 24
9.5 Flexible printed wiring ............................................... .................................................. .......... 25

9.6 Printed circuit boards - flexible and rigid ............................................. .................................................. ........... 25

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EN 50155: 2007

page
9.7 Protective covers for printed circuit boards .............................................. .......................................... 26

9.8 Labelling ................................................. .................................................. ................................. 26

9.9 Installation ................................................. .................................................. ............................................... 27


9.10 Cooling and ventilation ............................................... .................................................. ....................... 27

9.11 Materials and paintwork ............................................... .................................................. ............. 27


10th Safety ................................................. .................................................. .......................................... 28

10.1 General ................................................. .................................................. ...................................... 28

10.2 Functional safety ................................................. .................................................. ........................... 28


10.3 Personal safety ............................................... .................................................. ..................... 28

11 Documentation................................................. .................................................. .................................. 28

11.1 Provision and storage of documentation ............................................. ........................... 28


11.2 Hardware and software documentation .............................................. ................................................ 28

11.3 Documentation requirements .............................................. .................................................. .30


12 Exam ................................................. .................................................. ............................................. 31

12.1 Test categories ................................................. .................................................. ................................... 31

12.2 List of exams ............................................... .................................................. ................. 32


Appendix A (informative) List of sections in which agreements between the
Participants (e.g. users and manufacturers) must be met ..................................... ............................ 43

References ................................................. .................................................. ........................................... 44


Annex ZZ (informative) connection with essential requirements of EC directives ................. 45

Figure 1 - System interface design with the typical areas of electromagnetic


Compatibility A, B and C ............................................ .................................................. ...................... 17
Figure 2 - Overvoltages in the power supply ............................................ ......................................... 37

Figure 3 - Alternative test for overvoltages in the power supply ......................................... ....... 38

Table 1 - Ambient temperature .............................................. .................................................. ................... 9


Table 2 - List of exams ............................................ .................................................. .............. 32

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EN 50155: 2007

1 Scope

This standard applies to all electronic devices for control, regulation, protection,
supply etc. installed on rail vehicles and connected to:

- either the battery of the vehicle or


- a low-voltage power supply with or without a direct connection to the mains voltage (trans-
formator, voltage divider, auxiliary power supply)

with the exception of the electronic high-voltage circuits, which Comply with EN 50207 .

This standard contains the operating conditions, design, construction and testing of the electronic
facilities as well as the basic hardware and software requirements required for a
powerful, reliable facility is considered necessary.

Additional requirements in other standards or individual provisions may supplement this standard,
if they are justified.

Special requirements regarding measures to ensure functional safety are


increase according to 4.6.3.1 and 4.6.3.2 of EN 50126 and their informative Appendix A. Software-Safety Integrity-
Level 1 or higher may only be considered if it becomes clear that there is a residual security risk
remains and this is covered by the software-controlled programmable electronic system
shall be. In this case (ie software safety integrity level 1 or higher)EN 50128 applicable.

Electronic equipment in the sense of this standard is defined as a device consisting mainly of
Semiconductor components and usually associated components is constructed. These components are
mainly mounted on printed circuit boards.

NOTE Sensors (current, voltage, speed, etc.) and assembled printed circuit boards in ignition units for
Power electronics components are included in this standard. Complete ignition units are inEN 50207 corresponds
hold.

2 Normative references

The following cited documents are required for your use of this document. At dated
References apply only to the referenced edition. In the case of undated references, the last
of the referenced document (including any changes).

EN 50121-3-2: 2000, Railway applications - Electromagnetic compatibility - Part 3-2: Railway vehicles -
equipment

EN 50125-1: 1999, Railway applications - Environmental conditions for equipment - Part 1: Equipment
Rail vehicles; German version EN 50125-1: 1999

EN 50126 (series), railway applications - specification and proof of reliability, availability,


Maintainability, security (RAMS)

EN 50128: 2001, railway applications - telecommunications technology, signaling technology and data processing
systems - software for railway control and monitoring systems

EN 50163: 1995, Railway applications - supply voltages for railway networks

EN 50207: 2000, Railway Applications - Electronic converters on railway vehicles (comparable with
IEC 61287-1.1995)

EN 60068 (series), environmental tests (series of standards IEC 60068)

EN 60068-2-1: 1993, Environmental tests - Part 2-1: Tests - Test group A: Cold (IEC 60068-2-1: 1990)

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DIN EN 50155 (VDE 0115-200): 2008-03
EN 50155: 2007

EN 60068-2-2: 1993, Environmental tests - Part 2-2: Tests - Test group B: Dry heat
(IEC 60068-2-2: 1974)

EN 60068-2-30: 2005, Environmental influences - Part 2-30: Test methods - Test Db: Damp heat,
cyclical (12 + 12 hours) (IEC 60068-2-30: 2005)

EN 60077 (series), railway applications - electrical equipment on railway vehicles (IEC 60077 (series),
modified)

EN 60249-2-15: 1994, base materials for printed circuits - Part 2: Individual provisions -
Individual determination No. 15: Flexible copper-clad polyimide film with defined flammability (publication
withdrawn)

EN 60297 (series), construction methods for electronic equipment - dimensions of the 482.6 mm (19 in) construction method
(IEC 60297 series of standards)

EN 60352 (series), solderless electrical connections (series of standards IEC 60352)

EN 60352-1: 1997, Solderless connections - Part 1: Wound connections - General requirements,


Test methods and application notes (IEC 60352-1: 1997)

EN 60352-2: 2006, Solderless electrical connections - Part 2: Crimp connections - General


Requirements, test methods and application notes (IEC 60352-2: 2006)

EN 60529: 1991, degrees of protection provided by enclosures (IP code) (IEC 60529: 1989)

EN 61000-4-4: 2004, Electromagnetic compatibility (EMC) - Part 4-4: Test and measurement methods - Test
immunity to fast transient electrical disturbances / burst (IEC 61000-4-4: 2004)

EN 61082 (series), preparation of documents used in electrical engineering (series of standards IEC 61249)

EN 61249 (series), materials for printed circuit boards and other connection structures (series of standards IEC 61082)

EN 61249-2-7: 2002, materials for printed circuit boards and other connection structures - Part 2-7: Laminated
and non-laminated reinforced base materials - copper-clad glass fiber reinforced epoxy resin
Laminate board with defined flammability (flame test with vertical test sample position) (IEC 61247-2-7: 2002)

EN 61249-2-10: 2003, Materials for printed circuit boards and other connection structures - Part 2-10: Laminated
and non-laminated reinforced base materials - copper-laminated panels reinforced with E-glass fabric
on the basis of cyanate ester with bromine-containing modified or unmodified epoxy resin
Flammability (flame test with vertical test sample position) (IEC 61247-2-10: 2003)

EN 61373: 1999, Railway applications - Railway vehicle equipment - Tests for swingarms and
Shock (IEC 61373: 1999)

EN 62326 (series), printed circuit boards

EN 123000: 1991, generic specification - printed circuit boards

EN 123200: 1992, frame specification - printed circuit boards with printed circuit boards on one or on both sides with
metallized holes

EN 123300: 1992, frame specification - multilayer printed circuit boards

EN 123400: 1992, frame specification - flexible printed circuit boards without through-connections

EN 123500: 1992, frame specification - flexible printed circuit boards with through connections

EN ISO 9000-3: 1997, Quality management and quality assurance standards - Part 3: Guide for the
Application of ISO 9001 to the development, delivery and maintenance of software (ISO 9000-3: 1991)

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EN ISO 9001, Quality Management Systems - Requirements (ISO 9001)

EN ISO 9002, Quality Management Systems - Model for the presentation of the quality management system in
Production, assembly and maintenance (ISO 9002)

IEC 60605 (series), Equipment reliability testing

IEC 60617 Database, Graphical Symbols for diagrams

3 terms

The following terms apply to the application of this document.

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3.1
Circuit board
Base material cut to size, containing all holes and at least one conductor pattern. Circuit board
are typically divided into

- their structure (e.g. single or double-sided, multi-layer PCB)


- the type of their base material (e.g. rigid, flexible)

3.2
populated circuit board
Printed circuit board on which electrical and mechanical components and / or other printed circuit boards are attached,
all manufacturing processes, the soldering process, the coating, etc. are completed

3.3
Plug-in unit
Unit that is plugged into a rack and held by guide rails. This building
Unit can be of different types, e.g. B. a printed circuit board, which is in a frame or cassette
is assembled and equipped with a connector

3.4
Subrack
Unit for receiving printed circuit boards and / or plug-in units

3.5
frame
free-standing or fixed scaffold to hold electrical or electronic equipment (e.g.
Subrack)

3.6
closet
Housing for accommodating electrical and / or electronic devices

3.7
interchangeable unit
Unit that can be replaced in the event of a failure diagnosed on the vehicle, e.g. B.
a rack or a plug-in unit

3.8
Checking the operating behavior
brief operational behavior review that is carried out during or after environmental assessments
to demonstrate that the facility operates within its operating limits and that an environmental assessment is
has stood

3.9
Control system power supply
Power supply used to power the control device of the vehicle

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This supply can come from a vehicle battery. The battery can be used with battery chargers,
Auxiliary inverters as well as DC-AC converters or motor generators with electronic
Scheme can be loaded.

For the voltage supply of the control system from a battery, the nominal and rated voltage
of the tax system defined in 5.1 . If no battery is used, one is assigned to the
regulated voltage.

3.10
Vehicle wiring
entire wiring, regardless of their routing with the power supply to the control system
connected, as well as all external wiring, which is also connected to the relevant electronic input
direction is connected

3.11
Power supply overvoltage
electrical failure of the voltage supply to the control system caused by the control device of this
Power supply is caused. An overvoltage in the power supply occurs as an increase in the
Control system power supply levels appear

3.12
Surge
non-periodic and relatively short positive and / or negative voltage or current change between
two steady states

A surge in voltage can result from the intended operation of the device inside the vehicle.
are generated and is generally caused by an energy discharge when inductive
Circuits are switched.

It can either be connected to the supply voltage of the control system or directly to the
ducting connected wiring may be present or electrostatic or electromagnetic
of such wiring can be coupled into another wiring.

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The effective value of the source impedance of a transient depends on the way it is generated and launched.
lung from.

3.13
Burst (fast transient disturbance variable)
repetitive impulses within a specified time
It can occur during the intended operation of the vehicle and is typical
caused by unstable arcing.

3.14
failure
Termination of a unit's ability to perform a required function
A temporary malfunction is not considered a failure, provided that both:

a) the device automatically returns to normal operation after the malfunction.


returns;
b) the malfunction is not visible to the driver, for example
light up.

NOTE Reference is made to the possibility that as a result of a temporary malfunction of a unit
a consequential failure can occur in another connected unit.

3.15
damage
any change in appearance or mechanical integrity

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3.16
Usability time interval
Usability time
under given conditions, the time interval that begins at a given point in time and then ends,
if the failure density becomes unacceptably high, or if the unit is the result of a malfunction or other
relevant factors is no longer considered repairable

NOTE For a repairable unit, its useful life can be ended by a failure
the one that is considered irreparable for any reason.

4 Operating environmental conditions

4.1 Nominal operating conditions

4.1.1 Height above sea level

The height up to which a facility usually has to function is not greater than the values in 4.2
of EN 50125-1. If this amount is exceeded, an agreement between the manufacturer and
User compliance with the requirements can be determined.

4.1.2 Ambient temperature

Electronic devices must be dimensioned and manufactured in such a way that they meet all specified requirements.
the operating behavior for the selected temperature class according to Table 1.

The dimensioning must take into account the heating in the cabinet to ensure that the structural
elements do not exceed their specified temperature design values.

In addition, the facilities must comply with the special short-term temperature
endure conditions when switching on. During this period, the design values of the operating
behavior can not be fully met, however, the highest air temperature in the area of the assembled
PCB according to column 4 must not be exceeded.

Table 1 - Ambient temperature

Column 1 Column 2 Column 3 Column 4

Ambient temperature Inner Inner cupboard cover Air temperature in the


outside the vehicle Cabinet temperature temperature during a Environment of

(EN 50125-1, Duration of 10 min populated circuit board


Table 2, column 1)
°C °C °C °C

T1 −25 +40 −25 +55 +15 −25 +70

T2 −40 +35 −40 +55 +15 −40 +70

T3 −25 +45 −25 +70 +15 −25 +85

TX −40 +50 −40 +70 +15 −40 +85

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NOTE The differences between EN 50155, Table 1 (Column 2), and EN 50125-1, table 2 (column 3)
The main reasons are as follows:

EN 50125-1 relates to general applications in which no special heat design is required for cabinets
follows.

In electronic devices, to ensure a suitable minimum and maximum temperature in the area
Exercise of the electronic components usually requires a heat design. The reliability of the
elements strongly depends on the ambient temperature. The specified for the maximum temperatures inside the cabinet
These values have been limited to two values so that manufacturers only have to provide two classes of printed circuit boards.

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For peripheral units (instrument transformers, etc.) or if the device is arranged decentrally, must
if the ambient temperature ranges specified above are exceeded which actually occur at the installation site
temperatures are used for the design.

Rapid changes in the external ambient temperature that arise when driving through tunnels
must be taken into account. For this purpose, the rate of change of the external temperature
temperature of 3 ° C / s with a maximum change of 40 ° C.

4.1.3 Swinging and bumping

The device must vibrate and without functional degradation and without malfunctions
Can withstand impacts that can occur during operation.

To provide an adequate level of confidence for the specified useful life under operating conditions
ensure that the device must pass the vibration, shock and shock test 12.2.11 meet.

For this purpose, the device is defined as a complete electronic unit with its design
fixings and, where provided, anti-vibration mounts.

For typical values of vibration and shock loads in actual operation, EN 61373
referred.

4.1.4 Relative humidity

The device must be suitable for the following stresses caused by air humidity (limit values)
Range of the external ambient temperature according to 4.1.2 :

- annual mean: ≤ 75% relative humidity;

- on 30 consecutive days a year: 95% relative humidity.

In addition, condensation caused during operation, especially when passing through tunnels,
disturbances or failures.

For peripheral units (instrument transformers, etc.) or if the device is arranged decentrally, must
If the above-mentioned moisture values are exceeded, the humidity actually occurring at the installation site
property values can be used for the design.

4.2 Special operating conditions

Special agreements must be established between the relevant contracting parties


if the operating conditions differ from those specified in 4.1 N1) (e.g. mounted on the chassis
or electronic devices integrated in a power converter, etc.). The review of the
The effectiveness of such agreements can, if necessary, be followed by optional type tests between
Users and manufacturers are to be agreed, if necessary carried out directly on the vehicle.

4.2.1 Atmospheric pollutants

The device can be exposed to a wide variety of pollutants during its service life (e.g.
Oil mist, salt spray, conductive dust, sulfur dioxide). All types of pollutants and their concentrations
should be specified in the tender documents.

N1) National footnote: The English original incorrectly states 2.1.

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5 Electrical operating conditions

5.1 Power supply

5.1.1 Supply from an accumulator battery

The nominal voltage ( U n ) of the device supplied in this way must be selected from the following values:

24 V, 48 V, 72 V, 96 V, 110 V

NOTE 1 These nominal voltage values are only given as standard values for the design of the device.
They should not be viewed as the battery open-circuit voltages, which depend on the battery type, the cell
number and the operating conditions.

NOTE 2 According to EN 60077, other voltage variants can be used. In this case, the over-
agreement with the requirements between manufacturer and user.

5.1.1.1 Fluctuations in the power supply

Electronic devices powered by accumulator batteries without voltage stabilization must


satisfactory for all supply voltage values within the range given below
work (measured at the device's input terminals).

The supplier of the electronic device must determine its power consumption in order to perform the calculations.
to allow for the wiring of the battery.
Minimum voltage: 0.7 U n

Nominal voltage: Un

Rated voltage: 1.15 U n

Maximum voltage: 1.25 U n

Voltage fluctuations (e.g. during the start-up of auxiliary devices or in the event of voltage
vibrations of the battery charger), which lie between 0.6 U n and 1.4 U n and do not last longer than 0.1 s
last, must not cause any deviations in the function.

Voltage fluctuations that lie between 1.25 U n and 1.4 U n and do not last longer than 1 s may
cause no damage. The device does not have to function fully during these voltage fluctuations.
be able to act.

5.1.1.3 also applies to diesel drives.

5.1.1.2 Power supply interruptions

Interruptions in the input voltage of up to 10 ms are classified as follows:

- Class S1: no interruptions;


- Class S2: interruptions up to 10 ms.

These interruptions must not cause the equipment to fail.

The specified time values apply to the nominal voltage. The selection of the class must be made by the system
developers.

5.1.1.3 Changes in the voltage supply for traction vehicles with diesel drive

The vehicle electrical system must be designed so that when the diesel drives start up, the supply to the
essential electronic equipment is ensured over the entire start-up phase.
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5.1.1.4 DC ripple factor

All batteries have a pulsating voltage during charging, their DC ripple factor,
unless otherwise specified, it must not be greater than 15% if it follows the following equation
is calculated:

- U min
DC ripple factor = U Max × 100
U +U
Max min

where U max and U min are the largest and the smallest value of the pulsating voltage.

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In the 5.1.1.1 minimum and maximum voltages may not be exceeded.

5.1.2 Supply with a converter or rotating converter

If the device comes from a stabilized energy source (e.g. a converter system or a rotating
the converter group with controller), the electronic device must be satisfactory
Supply voltage values that are between 0.9 U n and 1.1 U n , where U n is the nominal voltage
voltage and can be either a DC or an AC voltage.

In addition, there are voltage fluctuations with a duration of up to 1 s in devices in operation


permissible between 0.7 U n and 1.25 U n and a duration of up to 0.1 s between 0.6 U n and 1.4 U n .

5.1.3 Switching between two supply voltages

If a device comes from either an accumulator battery or a stabilized source (direct current)
is supplied with energy, it must be satisfactory under the conditions of 5.1.1, 5.1.1.1, 5.1.1.4 and
5.1.2 work.
- Class C1: at 0.6 U n for 100 ms (without interruptions);

- Class C2: during an interruption in the supply voltage of 30 ms.

5.1.4 Supply with contact line voltage or via a power rail

If the electronic device comes directly from the overhead line or busbar (e.g. control electronics
self-starting converter system) is supplied with energy, it must be
tension after EN 50163 work satisfactorily.

5.2 Overvoltages in the power supply

All connections to electronic devices related to the supply voltage of the control system
connected:
a) Overvoltages after the supply voltage 5.1.1.1 and / or 5.1.2 (as applicable);
b) Overvoltages after the supply voltage Withstand 12.2.6 .

Overvoltages must be assumed to be related to the return conductor of the supply


generated by the control system voltage and only as an increase in the level of the control system voltage
occur. The control system voltage can be assumed to be before and after the occurrence
the overvoltage is present. Overvoltages with opposite polarity to the supply voltage
The tax system need not be taken into account.

Surges over 1.25 U n and a duration of more than 0.1 s must be assumed that they
only occur in the event of a fault in the control system power supply.

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5.3 Installation

The power supply of the electronic device should, if possible, be so direct with its own conductor
connected to the source as possible. This conductor should only be used to supply the electronic
circuits.

The installation of the electronic device must be arranged so that the effects are external
electrical interference is kept as low as possible.

The suppression should be done at the source of the electrical disturbance.

If a pole of the battery is connected to the vehicle body, this must be indicated.

When different suppliers supply electronic devices, the common direct connections
, a single reference point must be agreed as equipotential.

5.4 Tests of voltage surges, electrostatic discharge and


Sensitivity to transient disturbances

All electronic devices must be tested for voltage surges, electrostatic discharge
and the sensitivity to transient disturbances EN 50121-3-2 exist.

The tests are defined in 12.2.7 .

5.5 Electromagnetic compatibility

The device must be protected in such a way that it is not damaged by the device according to the stipulations in EN 50121-3-2 .
bound or radiated interference, and it must not cause radio frequency interference

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above the in Send out the level specified in EN 50121-3-2 .
The tests are defined in 12.2.8 .

6 Reliability, maintainability and expected service life

6.1 Reliability of the facility

6.1.1 Predicted reliability

The user can require the manufacturer to predict reliability values or to determine the reliability
meet the user's goals. The calculation procedure must be carried out at the time of the tender
agreed between the manufacturer and the user and in accordance with a recognized standard.

6.1.2 Proof of reliability

When the user has set a required level of reliability, the following are measures
necessary.

The operating behavior of the facility must be carefully monitored.

The manufacturer of the facility and the user must agree to all that is carried out on the facility
Record measures.

In order to demonstrate the level of reliability of the facility, a mutually agreed upon is provided at the end
Period of time (km or hours of operation) submitted a failure report of the replaced components
(Circuit reference number, type, manufacturer, lot number, mileage and / or
operating hours, etc.) as well as the description and cause of the errors (lack of design, software, components
ment problems, etc.).

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In order to show whether the facility meets its defined reliability, it should be
be subjected to evaluation.

IEC 60605 can be used as a guide.

The exact procedure of the reliability assessment must be specified in the contract.

6.2 Service life

The usability time of the electronic device must be between


nothing else has been agreed between the manufacturer of the facility and the user,
gene.

If the manufacturer intends to make components with a known lifespan smaller than the usable
time to use the electronic device must be between the parties involved in its application
and the regular exchange procedure is agreed.

6.3 maintainability

Unless otherwise agreed, the facility must be designed so that a regular periodic
maintenance is not required.

Special maintenance requirements, if necessary, must be carried out by the user at the time of the
exercise.

Printed circuit boards and / or subracks must be individually testable.

In addition, the manufacturer of the facility must determine which maintenance measures are necessary or necessary.
are messengers.

NOTE Maintenance measures such as ultrasonic cleaning, connection of diagnostic devices, electrical insulation
Lation tests and packaging arrangements for transportation can determine the level of reliability of the facility
reduce by additional stress on assemblies and components.

6.4 Maintenance levels

6.4.1 Diagnostics and repairs on the vehicle

Users and manufacturers must replace the structural units to be replaced on the vehicle in the event of a fault (e.g.
Determine subracks or printed circuit boards).

These units, which are defined as interchangeable units, must be easily interchangeable.

Users and manufacturers must also be informed about the approval of special
witness some.

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Facilities must be designed so that a failed interchangeable unit with either a


suitable portable test device or with a built-in diagnostic device, both with associated
Test instructions that can be identified.

Maintenance or diagnostics at this level must be done without removing or replacing any
a component of the interchangeable unit may be possible.

6.4.2 Diagnostics and repairs outside the vehicle

The facility must be designed in such a way that test facilities with associated test instructions are fully
constant diagnosis and functional testing of every type of on-board equipment by qualified personnel in re-
Enable paratur workshops.

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The facility must be designed so that the required access for diagnosis and repair without
Damage or unreasonable impairment of the components or wiring is achieved.

In addition, assembled printed circuit boards must have test points (e.g. test plugs, test connection surfaces, etc.)
zen that support the diagnosis and repair process.

6.5 Built-in diagnostic facilities

Indicators that support the maintenance diagnosis must be used in suitable places to the
State of input values, output values, important control functions, power supplies etc.
put.

Self-test routines must be able to clearly display the operating status of the facility
to deliver.

All built-in diagnostic options, which can trigger test states in addition to displays, must
be locked in a suitable manner in order to interrupt the intended operation of the
Prevent direction outside the test mode.

The use of additional components for built-in diagnostic devices may


not significantly affect the facility, and it must be included in the reliability calculations
be taken into account.

6.6 Automatic test facility

The user can use a specific automatic test facility for fault location
request either on or outside the vehicle.

If this is required, details of such test facilities and their interfaces to the on-board
facility such as B. test needle adapter or probes (for repairs outside the vehicle) or
Test plug (for diagnosis on the vehicle) by the user at the time of the tender.
be called.

Removing plug-in units that are not involved in the function of the device is to simplify
Connection of automatic test equipment permitted.

6.7 Alternative methods of fault diagnosis

Where electronic on-board equipment is developed or tested using our own test equipment
the manufacturer may offer this as an alternative for fault diagnosis in repair shops,
provided that the use of such devices is expedient and that the user
supporting details are made available.

6.8 Product-specific test facilities and special tools

For the use of equipment that requires tools other than those commonly available in industry.
prior consent from the user must be obtained.

Where product-specific test facilities and / or special tools are required to carry out formal maintenance
The user must carry out these facilities or alternatively the
Manufacturing and process details are available for purchase.

Test facilities do not necessarily have to comply with this standard.

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7 development

7.1 General

7.1.1 Quality management

The development must be in accordance with EN ISO 9001.

The development process must be visible and auditable.

If the user requests details of this process for the tender evaluation, he must
in the tender documents.

Particular attention is drawn to the need for all system, hardware and software developments
to comply with EN ISO 9001 with clearly defined functional and interface specifications.

7.1.2 Life cycle

All developments must be carried out according to a defined life cycle model that is
plan of action must be laid down.

7.2 Execution Practices - Hardware

7.2.1 Interface design

All interfaces must be designed so that the facility meets its requirements in terms of
on:

- Electromagnetic compatibility,
- potential differences,
- personal safety,

and that consequential damage caused by external errors is limited.

For this purpose, the user may request galvanic isolation. In this case, requirement and
special scope of application to be determined at the time of the tender.

An example of system interfaces with different EMC areas is given in Figure 1 .

7.2.2 Error protection

Outgoing cables must have at least the current limit of the protective device for this circuit
be measured.

The device must be protected against external faults (e.g. short-circuit or open conditions)
be.

Regulated power supply units for electronic devices must include a current limit.
hold to reduce the need for fuses.

If the user does not allow the use of fuses in the facility, he must do so
Explain the time of the tender.

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Picture 1 - Sy

stem interface design

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A, B and C

little be

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Where protective devices with tripping are contained in the output circuits, the available one must be used
Current under short-circuit conditions be sufficiently high to operate them. In addition,
counters that are reset manually are easily accessible.

All protective devices used must be arranged so that the risk of fire in the
Facility is minimized.

7.2.3 Reference potential of power supplies

The output of electrically isolated power supply units should not be potential-free.

If the outputs are not related to a voltage source (e.g. battery or power supply
gung), one of the power supply lines should be connected to the vehicle frame or a specified earth
point to be connected.

This point of reference and the type of connection should be established and agreed.

7.2.4 Interchangeability

All individually assembled printed circuit boards that are part of a system must be functionally closed and
be fully interchangeable with any other unit of the same functional type without emergency
Agility of recalibrating the hardware after inserting a circuit board into the system.

7.2.5 Reduction of the supply voltage

The device must not be damaged if the supply voltage is below the low
th limit of its specified source voltage is below or falls below this, regardless of the
The speed at which the tension changes.

In addition, the device must not generate a false output signal under these conditions
Failure of any other facility could result.

7.2.6 Reverse polarity

To prevent damage to the device, electrical or mechanical devices


be present that protect against polarity reversal of the supplied power supply.

7.2.7 Inrush currents

The design of the device must include inrush currents that can occur at the time of switching on.
take into account that the protective devices do not trip and that no damage occurs.

7.2.8 Capacity reserve

If the user has a spare capacity (e.g. reserve inputs, reserve outputs, CPU utilization
etc.) for system expansion or changes during the life cycle of the facility,

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he must
of the specify thisprocess.
development in the tendering phase. The consideration of these requirements must be part

7.3 Execution Practices - Software

7.3.1 General

The EN 29000-3 standard must be used to interpret the EN ISO 9001 standard regarding software.

The requirements and recommendations in EN 29000-3 are binding.

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The configuration management procedures must run parallel to the phases of the life cycle
and include all software and tools for development and maintenance.

Information on the life cycle and documentation of software development must be provided.

The development of the software must be divided into defined phases and activities.

All information related to the design of the software must be recorded.

The minimum necessary phases and documents are:


a) Software request phase
In this phase, all software requirements must be in a software requirements specification
determined and documented, including the interfaces to the system environment and other
rer software.
b) Software design phase
In this phase, the structure of the software must be defined, the modules defined and the programs
are written and ensured so that all elements meet the requirements of the software
requirement specifications are defined, are sufficient. 7.3.2 N2) should also be taken into account.
c) Software testing phase
This phase includes testing the software at each of its design stages to ensure its accuracy and
To ensure consistency with regard to their specification. Test results must be recorded
the.
d) Software / hardware integration phase
In this phase, hardware and software must be integrated and checked to ensure that they match
with the requirements of the system (e.g. as defined in the software requirements specification)
to secure. Test results must be recorded.
e) Software maintenance phase
It is important that the reliability of the software is not jeopardized if corrections, extensions
conditions or adjustments to the software. The measures taken must be defined
be documented and documented.

7.3.2 Software design measures

The following measures must be applied unless the justification for an alternative
documented and coordinated with the user.

NOTE Explanations of this and other useful measures can be taken Taken from EN 50128 (Appendix B)
will.

7.3.2.1 Modular solution

The software system must be made up of small, understandable parts in order to reduce the complexity of the system.
to be able to handle tems. This includes measures such as module size limitation and completely defi-
interfaces.

7.3.2.2 Proven and proven translator program

A proven and proven translator program must be applied to overcome difficulties


Translation errors that occur during the development, suitability check and maintenance of the software package
can avoid.

N2) National footnote: 5.3.2 is incorrectly stated in the English original.

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7.3.2.3 Data recording

All data, decisions and explanations in the software project must be recorded in order to achieve a
Facilitate easier aptitude test, validity check, evaluation and maintenance.

7.3.2.4 Structured methodology

Structured methods must be applied to ensure the quality of the software development through strict
Promote attention in the early stages of the life cycle. With these methods, this can be done through accurate
intuitive procedures and designations (supported by computers) can be achieved to meet the requirements
presentation and the basics of the implementation in a logical order and structured manner.

7.3.2.5 Design and coding methods

Design and coding methods must be defined in order to ensure that the development
secure documentation documents and the generated code as well as for person-neutral programming and a
enforce uniform design method.

7.3.2.6 Structured programming and analysis

The program must be designed and implemented in such a way that it makes it easier to analyze it.

The program behavior must be fully testable on the basis of the analysis.

7.3.2.7 Programming language

The chosen programming language must enable code checking with a minimum of effort and
support program development, testing and maintenance.

7.3.2.8 Best practices

Proven techniques must be used. Examples of such techniques are:


a) semi-formal methods such as
- logic / function block representations,
- flow charts,
- data flow diagrams,
- decision / truth tables;
b) test methods such as
- limit value analysis,
- Equivalence classes and entrance area check,
- process simulation.

7.4 Features of the facility

The facility must meet the following criteria to enable operation under all conditions.
chen.

7.4.1 Memory check

After turning on, the system must run a test during the initialization of the facility,
which shows that:

a) all the required memory is available and functional,


b) the entire program memory that is between individual integrated circuits or populated lines
terplatten can be divided, is functionally compatible.
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Measures to assign the memory to the correct printed circuit board and the printed circuit board
to the rack either by visual display on the device or by internal coding
be made. The user must be informed of the method.

7.4.2 Self-examination

The facility must contain a self-checking function which, if feasible, must demonstrate that the
System is operational at every initialization. As far as it is possible in the event of failure of the self-examination
diagnostic information is available to indicate the failed area. Wherever possible
the system must enter the state of troubleshooting.

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7.4.3 Monitoring function (watchdog)

The software must include a monitoring function that can be set up if the operating software fails.
ware (e.g. if the software loops in an unintended manner due to abnormal transient interference
occurs) causes it to enter the state of the troubleshooting.

7.4.4 Error display

When detecting errors, the processor must record or display this event. He must
then take the state of troubleshooting.

7.4.5 Troubleshooting

The facility must, as far as possible, be forced out of a failure or fault condition
may have returned to their function with the smallest possible disability. This trouble shooting
Lifting may require that the processor be reinitialized. If this condition is not corrected
is safe or not executable, the manufacturer must state the effects on the facility.

8 components

8.1 procurement

8.1.1 All components must meet component specifications that specify the functional and physical
Set the physical parameters of the component.

8.1.2 All components used must be in accordance with a quality system in accordance with the requirements
changes to EN ISO 9001 or EN ISO 9002 or an equivalent quality system
be.

8.1.3 The component specifications above must meet one of the following standards or specifications
cations correspond to:

a) EN or IEC specifications;
b) other national or international standards or specifications;
c) specification of the component manufacturer;
d) Specification of the manufacturer of the facility.

Where it is possible in cases c) and d), the specifications must be based on EN or IEC technical specifications.
obtain qualifications.

8.1.4 With the exception of those mentioned in 8.1.5, components must be used for which there are several
Suppliers there. For the purpose of this standard, "multiple suppliers" must be fully interchangeable
in relation to the dimensions and the function according to the specification in 8.1.1.

8.1.5 Where components with just one supplier cannot be avoided, this must be justified
and the user must be made aware of this at the time of the advertisement.

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8.1.6 The components and component families used must be selected so that
future deliveries after commissioning of the facility at least above the usable defined in 6.2
time are possible. If despite this precaution certain components during the
The period that is included in the delivery contract of the facility should no longer be available, the
Provide electronic device manufacturers with an alternative solution.

8.1.7 Special components such as customer-specific hybrid circuits and application-specific integrated
Rated circuits (ASIC) must be described in a detail specification in order to
To enable post-development or as a source for fully compatible components
to serve alternative suppliers.

8.2 Application

8.2.1 The quality of all components used must be such that they meet the requirements of the
meet the requirements described in this standard (e.g. environment, quality, life expectancy)
tion, etc.).

8.2.2 The user is permitted to use components and techniques that have not been tested in railway applications
Evidence requires that these components or techniques meet the requirements of this standard.

8.2.3 All components must be used:

a) according to the manufacturer's component specification,


b) in such a way that the lifespan or the operational behavior of the device is not endangered.

8.2.4 The choice of the temperature range, the reduction in stress, the housing and the
Reading, etc. of components is entirely the responsibility of the manufacturer.

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If required by the user, the manufacturer must check at the time of the tender.
demonstrate (e.g. by calculation or other application) that the facility meets all requirements,
in this standard with particular reference to its reliability and life of the components by ex
cut 6NF3) are described. The lifespan of the components must not be shorter than the useful
Lifetime of the device except for components with a 6.2N3) established known
Lifespan.

9 Structure

9.1 Structure of the facility

The facilities must comply with the following construction principles.

9.1.1 Mechanical protection

It must be possible to replace all interchangeable components without mechanical damage to any component.
place the element in any position on a flat surface. Where necessary, components must
be mechanically protected.

9.1.2 Unmistakability or coding

Where required by the user, exchangeable units must have mechanical aids for the
interchangeability or coding to prevent incorrect assembly.

N3) National footnote: Section 4 or 4.2 is incorrectly stated in the English original.

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9.1.3 Dimensional requirements

Racks, subracks and plug-in units must meet the dimensional requirements of EN 60297 / HD 493
speak.

NOTE The most commonly used dimensions of EN 60297 / HD 493 are 3U and 6U with PCB depths
of 160 mm or 220 mm.

9.1.4 Sockets and connectors

At the time of the tender, the user may use sockets for integrated switching
Prohibit circles and / or edge connectors.

9.2 Assembly of the components

The device must comply with IEC 60321 and the following design requirements.

9.2.1 Design

Components must be arranged, secured and distributed to each other and to constructive components,
that it checks without damage and undue interference to other parts or the wiring
or can be replaced.

Wherever possible, the component label must be visible on the assembled component.

Devices must not be designed so that they contain components that are connected to wiring
locking pins are attached unless there is an appropriate clamp connection or an auxiliary circuit board
used and the component identification is retained.

Heat-generating components must be installed in such a way that they can be attached to printed circuit boards and other components.
elements do not cause damage.

9.2.2 Fastening

Components that have no special mechanical fastenings and whose mass is caused by
stress or damage to the solder joints during the life of the device
can bring about, must be securely attached to the circuit board.

The fastening procedure must be such that the components are replaced without damaging the circuit board
can be.

All components must follow the recommendations of the component manufacturer or in the absence of such
Recommendations can be assembled in such a way that the fastening method's operating behavior
of the component or the structural unit, including the soldered connections, not adversely affected.

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9.2.3 Component connections

Connections to components must be carried out in such a way that no mechanical or thermal
stresses occur that go beyond the limits specified for the component.

The bending of component leads must not damage or permanently stress the
Cause component body or the supply line connection.

9.2.4 Preferences

If presets are considered necessary for operation (ie no internal calibration),


the setting elements must be used when operating the complete facility and adjacent facilities.
be accessible.

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These setting elements must maintain their settings in the intended operation and against
an unintentional adjustment must be protected.

9.2.5 Select on test (SOT) components

Where SOT components are used, they must be soldered to component mounting pins,
to allow removal for recalibration purposes.

9.3 Electrical connections

Connections must be one of the following types.

9.3.1 Solder connections

Solder connections may only be made on components specially designed for this purpose.
Flexible conductors / strands and metal-wound conductors that are designed for permanent bending must not be soldered
must be provided with crimp sleeves and strain relieved before the electrical connection
will.

Silver-plated or gold-plated wires or components must not be soldered, except for the galvanization
is thin enough to prevent adverse effects on the connections.

As far as possible, soldered wires and components must be removed without disturbing other connections.
can be soldered.

Solder flux must be non-corrosive.

9.3.2 Crimp connections

Crimp connections must comply with EN 60352-2.

9.3.3 Winding connections

All winding connections must at least comply with EN 60352-1 and be of the "modified type".
Soldered and wound connections with wires on the same connection pin are not permitted. The one used
Wire must be suitable for the winding process chosen, and there must be at least three turns
are in close contact with the pen.

9.3.4 Other connections

Other connection methods such as B. insulation piercing, press fitting etc. may only be carried out after prior
agreement with the user.

9.4 Inner flexible wiring (electrical and optical)

Wiring that could be subject to movement must be equipped with suitable terminals, jacketing
or requirements in the vicinity of the connection points and at suitable points along the cable routing
to be seen.

The wiring must be arranged so that its operating behavior is not affected by extreme values of the temperature
is influenced.

The wiring must not be bent with smaller radii than the smallest permissible value, which is given by
the manufacturer is determined. Where no smallest radius is specified for electrical cables, the inner radius is allowed
the bend must not be less than the outside diameter of the wire including its insulation.

Bushings, bushings or edge protectors must be available if the wiring is through


a material is used that is likely to be damaged by wear.

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The internal wiring must be clamped, pulled into the insulating tube, routed in cable ducts or similar.
funds are adequately supported.

The wiring must be clamped in plugs and sockets in such a way that the connections
conditions within the plug connector when used as intended or as intended
exercise can not be subjected to any disadvantageous tensile or torsional stress.

Where it is practically possible, sufficient wire length must be used to ensure that
Binding can be made at each end of the wire.

Shielded cables must have an insulating outer jacket.

All wiring must be through a point-to-point wiring diagram or a point-to-point


Wiring list to be easily traceable.

9.5 Flexible printed wiring

Flexible printed wiring must not carry any components other than connectors.

The base material must have suitable temperature ranges and mechanical properties for the application
have. It must be flame-retardant and protected against dripping water.

Wherever possible, sharp bends must be avoided. The smallest bending radius is not allowed
be so slight that it cracks or deteriorates the base material or the top layer
results.

Adequate mounting of all transition connections must be used to ensure


that there is no separation of the base material or the lower layer.

All connections using this technology must be reconnected without damaging the wiring system
can be.

9.6 Printed circuit boards - flexible and rigid

9.6.1 PCB types

The following types of circuit boards can be used:


- rigid single or double sided;
- flexible and semi-flexible single or double-sided;
- rigid multilayer printed circuit boards.

Signal lines on the inner levels must not be used for direct connection to the vehicle wiring
be used, unless special protection against external fault conditions is taken.

All holes used for solder connections must be plated through and with solder eyes on both
Pages.

Other types may be used after prior approval by the user.

9.6.2 Procurement

Printed circuit boards must be in accordance with the regulations of the relevant specification from the following
drawing can be obtained and manufactured:

- EN 123000 (generic specification - printed circuit boards);


- EN 123200 (frame specification - printed circuit boards with circuit diagrams on one or on both sides with
metallized holes);

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- EN 123300 (frame specification - multilayer printed circuit boards);


- EN 123400 (frame specification - flexible printed circuit boards without through-connections);
- EN 123500 (frame specification - flexible printed circuit boards with through connections).

Alternative standards with an equivalent scope of application may be approved by the


Users can be used.

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9.6.3 Design
The circuit board design must be in accordance with EN 60326 with reference to the operating conditions of this standard.
be performed.

9.6.4 Materials

The base material must have an epoxy resin glass fabric panel with a defined flammability (test with vertical
sample layer) for rigid printed circuit boards and for use in the manufacture of multilevel printed circuit boards
according to EN 60249-2-7, EN 60249-2-10 and IEC 62326, as applicable.

For flexible printed circuit boards, the base material must define a flexible copper-clad polyimide film
Flammability (test with vertical sample position) according to EN 60249-2-15.

Other materials may be used if they affect the operating behavior of the basic
meet or exceed material.

9.7 Protective covers for printed circuit boards

All printed circuit boards must have a transparent protective coating on both sides
to be an impairment or damage from moisture and atmospheric pollutants
prevent. The coating must not have an adverse effect on all other materials and construction materials used.
have elements.

The protective coating must not be used for sockets for integrated circuits, test points or contact surfaces from
Connectors, etc. are used.

It must be possible to assemble a printed circuit board with a protective coating without the need for
repair the complete removal of the coating.

After the repair, the printed circuit board must be provided with a protective coating locally again
the.

9.8 Marking

9.8.1 Marking the bare PCB

The circuit board image must contain sufficient information to ensure correct identification as well as
enable work.

9.8.2 Identification of subracks and printed circuit boards

The labeling of subracks and printed circuit boards must be sufficient so that their
correct identification including serial number and change is possible. All labels must
be clear, concise, brief and permanent.

The labeling of exchangeable units must also include their name, the manufacturer's name or the
Trademark and serial number included.

Means for recording changes in the. Must be on racks and assembled printed circuit boards
Installation, form or function.

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Wherever possible, the labeling must be placed on the front panel of plug-in units
be.

For maintenance purposes, it is also desirable that the version marking on this front panel
brought.

9.8.3 Mounting position of subracks and printed circuit boards

Each mounting position must be labeled to indicate the type of rack, the printed circuit board
or the cable connector located at that position.

9.8.4 Identification of fuses and batteries

All fuse ratings must be specified near the fuse.

If batteries are used inside the device, the front panel of the module in which they are installed
are labeled to indicate their presence and the recommended replacement date
specify.

9.9 Installation

Devices must be installed in such a way that their operation under the specified operating conditions
can be made. Such an installation location can exist:
- for larger facilities: from a cabinet with a number of frames, subracks and

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populated circuit boards;
- in the case of smaller, locally arranged devices: from individual sealed housings.

In any case, the housing must ensure the necessary protection for the operating conditions (IP
Code after EN 60529 ) and allow removal and repair of the equipment it contains.

The encapsulation (the sheathing, for example, of a printed circuit board with silicone rubber, synthetic resin
or other material) for additional protection is not preferable and may only be used
if special environmental conditions are required (e.g. with a remotely mounted transducer)
other.

If the manufacturer wants to use encapsulation, he must inform the user at the earliest possible time-
notify point.

NOTE The requirements of this section do not include individual components such as hybrid circuits,
ASICs, etc.

9.10 Cooling and ventilation

The cooling must not be done by blowing air into the housing of the device, except when
Protective measures agreed between the parties were taken to ensure that the
Life of the facility is not adversely affected by the introduction of pollutants.

Where fan assisted cooling is used, the facility must be protected so that
no damage occurs if the cooling system fails. The complete intended use must
drive behavior are maintained until a protective device responds.

(For this purpose, the term "damage" includes effects on the life of the facility that
caused by taking a state outside the limit values for any components.)

9.11 Materials and paintwork

Materials and paints must take into account the environmental, wear and aging factors
and the risk of toxic influences on people for the application conditions.

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All materials must be true to size, non-hygroscopic, resistant to fungal growth and either not
be flammable or flame-resistant.

The user must have a list of the materials prohibited or monitored by national laws
provide.

In addition, for all components that contain toxic materials, the manufacturer must
specify procedure.

10 security

These regulations apply to both electronic equipment and all maintenance equipment,
Tools and procedures.

10.1 General

Facilities must be designed, constructed and installed (in accordance with the contract) so that they can
applicable national safety law regulations of the country of use or countries of use
by the user - meet.

10.2 Functional reliability

Requirements for safety-related functions of the facility or the system and their specific
Safety integrity requirements must be defined in accordance with EN 50126 (4.3, 4.6 and 4.7).

NOTE The security integrity level of any software involved in a security-related function
depends on the scope of measures to reduce external risks or the effectiveness of protection systems for
this function, e.g. B. a wire "fail-safe" circuit (failure to the safe side) or such a mechanical
Facility. If all security risks are covered by such measures, the appropriate software has
no security reference and is assigned to security integrity level 0.

10.3 Personal safety

At the time of the tender, the user must define all special requirements that relate to
the safety of people with regard to the installation, construction and use of materials
Respectively.

11 Documentation

As referred to in Section 7 , the development of the facility must comply with the provisions of

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Be documented in EN ISO 9001.

11.1 Provision and storage of the documentation

Supplier and user must agree in writing:


a) Quantity, scope, content, presentation, storage medium and type of update of the
the required documentation;
b) Scope, conditions and duration required for the documentation to be retained by the supplier
be valid.

Such a written agreement only applies if it is included in the contract.

11.2 Hardware and software documentation

The following points form a selection list for the documentation. The listed documents could
be requested by the user.

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11.2.1 Hardware documentation

The following items form a selection list for hardware documentation:


a) name and type of institution;
b) functional purpose of the facility;
c) building the full facility;
d) principle of action;
e) start-up instructions and default values;
f) Description of the operation of the circuit, where appropriate, including the waveforms of the span
voltage and current, rise times, etc .;
g) description of the function interface;
h) change status;
i) certain manufacturing documents (circuit diagrams, wiring diagrams, etc.);
j) diagnostic procedures on and outside the vehicle (es) as well as necessary test facilities;
k) precautionary measures for storage;
l) annotated functional block diagram;
m) site plans and drawings for mechanical arrangement;
n) component list;
o) component specifications and delivery information (ie manufacturer);
p) checkpoints;
q) list of components with limited lifespan;
r) Information on hazardous materials that may be present in the facility and that are provided by the
Users have been approved;
s) information on any implosion or explosion hazards that exist in the facility or
may occur during use or handling;
t) maintenance documentation.

11.2.2 Software documentation

The following items form a selection list for software documentation:

a) a specification of the software requirements, which describes how the manufacturer


system implementation;
b) a software description that describes the structure and execution of the software in order to
fulfill the software requirements;
c) for each module:
- the description of the operating behavior (e.g. input, output values, function),
- the written source code (assembler or higher level, as appropriate),
- test requirements and test results;
d) data dictionary that defines all global variables and constants;
e) the system's memory map;
f) the hardware dependency (ie hardware requirements for the software);
g) details of the development system used;
h) details of all tools used in software development;
i) test requirements and results of the software / hardware integration test;
j) maintenance documentation.

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11.3 Documentation requirements

11.3.1 Documents

All documents handed over to the user must have a suitable drawing number, date,
sion / edition and a title with the part shown and the type of drawing are specified.

All documents and component lists must have an edition or revision label and a change
change index.

All graphic symbols must comply with EN 60617.

11.3.2 Circuit diagrams

Circuit diagrams must be drawn up for each printed circuit board and plug-in unit of the entire facility
will.

If possible, the circuit diagrams must be drawn so that the signal flow from left to right (and
where necessary for reasons of arrangement, from top to bottom).

If possible, the circuit diagram must be self-contained and self-explanatory for each individual unit
as well as easily refer to other circuit diagrams and show the following:

- supply voltage levels and connections;


- Connections between the low voltage circuits;
- Connections between these circuits, the electronic equipment, the transducers
and the controlled or monitored devices;
- earth connections of the metal parts;
- Connections between the electronic zero voltage lines;
- housing and its connections;
- shielded or twisted cables and wires.

Individual components that are outside of a printed circuit board or plug-in unit, but
essential for their operation must be shown in a dotted outline in the circuit diagram and
be labeled accordingly.

All component symbols must have a reference to their circuit and where the component list
is not included in the same circuit diagram, the nominal value of the component must be in the circuit diagram
can be specified.

In the case of components with three or more connections, the connection points must be marked or
be drawn.

The functions of all controls, switches and indicators are according to those on the device
to mark attached labels. The symbols of rotating control elements must be
nem arrow indicating the clockwise rotation when on the actuation side
is looked at.

Relays must always be shown in the rest position.

11.3.3 List of components

Component lists must clearly indicate their reference number and specification for each component
give.

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11.3.4 Component arrangement

Drawings with component arrangements must show the position of each one on an assembled conductor
plate or plug-in unit used component and, where necessary, with its circuit
Reference number, the outline and the polarity features.

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11.3.5 Block diagrams

Block diagrams with symbols according to EN 60617 and EN 61082 must ensure the flow of information between
represent marked parts of a system.

11.3.6 Wiring plans

Wiring plans and tables must ensure that the components are wired together within the
house of the facility and also the intended auxiliary companies (ie power supplies, distribution,
Display alarm functions etc.).

11.3.7 Connection diagrams

Connection diagrams and tables must provide the necessary connections between housings and all
Represent external cables and lines of equipment connected to the device.

You must also specify the type of cable and wire to be used for these connections, as well as
all special information for the connection or special execution of the wiring to reduce
interference.

11.3.8 Drawings of the facility

Drawings of the facility must show the arrangement of those mounted in racks and subracks
Establishment, the arrangement of the structural units and subassemblies within a housing as well as the
significant mechanical characteristics of all cabinets, racks, subracks, plug-in units and specific
represent pieced circuit boards.

12 examination

12.1 Test categories

There are three test categories:

- type tests;
- routine tests;
- investigative tests.

At the time of the tender, the user must all be agreed tests (see 12.2) Working
call.

A test plan that lists all tests to be carried out and their specifications must be
be erected.

During the type and routine tests, the device must not malfunction or
show drive behavior that is outside of their specification.

NOTE Since some of the tests to be scheduled can be costly, it is advisable to only use the tests
perform that are required. The user may request to be a witness to all possible tests in order to
check results. Provisions for this must be included in the contract.

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12.1.1 Type tests

Type tests must be carried out to demonstrate that a product meets the specified requirements.
changes.

Type tests must be performed on a single device of a given design and given
Manufacturing process are carried out.

If a complete facility or part of it is largely with a previously checked one


is identical, the manufacturer may supply a certificate of the previous tests, at least the one in this
Must contain the specified tests. In such cases, if the user has agreed,
it is not necessary to repeat these tests on the unit under consideration.

Some or all of these exams can be repeated from time to time on patterns that match
an agreement between the user and the manufacturer from ongoing production or delivery
gen be removed; this can be used to confirm that the quality of the product
laid down requirements.

In addition, the user can request the manufacturer to either type test completely or partially
to be repeated after:
- changes to the facility that are likely to affect its functioning or operation;
- Failures or deviations that were proven during the type or routine tests;

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- resumption of production after a break of more than five years;
- Change of production site.

12.1.2 Routine tests

Routine tests must be carried out to demonstrate that the properties of a product
correspond to those measured during the type test. Routine tests must be carried out by the
Manufacturers can be carried out at any facility.

12.1.3 Investigations

Investigation tests are provided to provide additional information on the operational behavior of the electronic
Receive facility outside of their specified requirements. You must explicitly either
be requested by the user or the manufacturer and are subject to contractual agreements.

The results of the investigative examinations must not be used as grounds for accepting the
to refuse direction or to demand penalties.

NOTE These tests are not described in this standard.

12.2 List of exams

Table 2 lists the type and routine tests for electronic equipment.

Table 2 - List of exams

exam Type test Routine check section

1 Visual inspection * * 12.2.1

2nd Checking the operating behavior * * 12.2.2

3rd Cold test * - 12.2.3

4th Dry heat test * - 12.2.4

5 Test with moist heat, cyclically - - 12.2.5

6 Tests of the overvoltages of the supply voltage * - 12.2.6

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exam Type test Routine check section

7 Testing of voltage surges, electrostatic discharge and * - 12.2.7


the sensitivity to transient disturbances

8th Radio frequency interference test - - 12.2.8

9 Insulation test * * 12.2.9

10 Salt spray test - - 12.2.10

11 Vibration, shock and shock test * - 12.2.11

12 Water tightness test - - 12.2.12

13 Selection test by stressing the facility - - 12.2.13

14 Check storage at low temperature - - 12.2.14

NOTE 1 Tests marked with "*" are binding.

NOTE 2 Tests marked with "-" are subject to an agreement between the user and the manufacturer.
actuator.

NOTE 3 The ambient temperature for these tests is set at 25 ° C ± 10 ° C.

12.2.1 Visual inspection

The visual inspection must be carried out to ensure that the device works properly
Has structure and, as far as it can be determined, corresponds to your specified requirements.

A visual inspection must also be carried out after each type test to verify
whether damage or deterioration has occurred as a result of the tests.

12.2.2 Checking the operating behavior

Measurements must be taken at the ambient temperature.

The operating behavior test must be a type test from a comprehensive series of measurements of the
Characteristic values of the facility exist in order to check whether its operating behavior meets the functional requirements.
of the specific facility concerned, including all special requirements of its individual
specification and the general requirements of this standard.

The test of the operating behavior for the routine test must be the same as that of the type test, but without
the test described below for interruptions and changes in the power supply.

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Unless otherwise agreed, this type test must include the following:
a) Changes in the power supply
Facilities powered by DC:
The tests must be carried out to ensure the correct function at nominal supply voltage
and to be demonstrated at the defined upper and lower limit values.
AC powered facilities:
The tests must be carried out to demonstrate the correct function of:
1) nominal voltage and frequency;
2) the upper and lower limits of voltage and frequency in all combinations.
b) Test with interruption of the power supply
ANNOTATION This test is after class S1 interruptions 5.1.1.2 not applicable .

The tests must be carried out at nominal voltage.


The power supply input of the device under test must be for a period after the in
5.1.1.2 and5.1.3 according to the specified classification.

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The facility must function without intervention or need to be reset by the operator.
Continue and display the server correctly.
This test must be repeated ten times at random and include all operating modes
ten.
The exit of the facility must be monitored during the test to ensure that none
wrong operating mode occurs.
In the case of a group of electrically identical output signals, 4 output signals or 20% (each
after which number is larger) are monitored.
If the device is connected to the traction power supply and not from an interim
switched battery is powered, a test must be performed to determine the effects of
To simulate power supply interruptions.

12.2.3 Cold test

This test is carried out in accordance with EN 60068-2-1, test Ad.

The printed circuit board, the plug-in unit, the subrack or the frame are
sen state arranged in a test chamber.

The temperature values corresponding to the set by the user class of Table 1 to corresponds
to take.

The device must first be pretreated by being in the test chamber for a sufficient period of time
is left after it has stabilized at the selected temperature. In any case, this
Duration be at least 2 hours.

At the end of this period, the device must be switched on and a check of the loading
drive behavior are carried out, the device is to be kept at the low temperature.

After a recovery period, this check of the operating behavior is repeated at normal room temperature.

Requirements to pass the exam:


- no damage may occur;
- The functional check must not malfunction or cause damage and results outside the
limit deviations.

The test specification must specify the criteria for passing the test individually.

12.2.4 Dry heat test

This test is carried out according to EN 60068-2-2, test Bd, using natural ventilation,
except for forced ventilation is usually provided for the facility.

The temperature value in this test depends on the temperature range that is set by the user and
the type of facility to be tested is determined (see Table 1 for details ). In the case of one in the closet
built-in device, a frame, a subrack, a plug-in unit or an assembled one
PCB is used as the temperature that is specified in 4.1.2 as a suitable temperature.

The dry heat test should preferably be carried out on smaller functional units (e.g. equipped cables
boards, plug-in units or subracks) are carried out, but it must be ensured
that every heat-emitting device is either switched on or if it is not
is reproduced.

With the voltage applied, the device is brought into a test chamber in which the temperature increases.
mend to the specified temperature (see above). When the temperature has stabilized,

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the
the device remains
operating in the test
temperature. chamber
When for a is
this exam period of 6 you
finished, hours and then the
can

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the device cool down to the ambient temperature and another check of the loading
drive behavior made.

In the case of a cabinet, a special check of the operating behavior is carried out during the 10-minute
temperature value carried out (see table 1 for details ).

During the above test, the temperature of all previously determined components must be checked
to ensure that they meet their operating limits or the values specified by this standard
do not exceed.

Requirements to pass the exam:

a) no errors or damage may occur;


b) no results outside the limit deviations may occur.

The test specification must specify the criteria for passing the test individually.

12.2.5 Test with moist heat, cyclically

The temperature and humidity in the test chamber must be controllable and continuous recording of
These values must be possible.

The water from the condensation of moisture must be withdrawn from the test chamber and must not
be reused.

If the air is humidified by spraying water, the spray water must have a specific resistance
have at least 500 Ω ⋅ m.

The climatic conditions in the test chamber must be kept as uniform as possible (if necessary
due to recirculation) and the facility under test must not limit these conditions to values
change within the specified limit deviations (through heat emission, absorption of moisture or
in a different way).

Condensed water must not drip onto the device under test.

This test is carried out according to EN 60068-2-30, test Db.

The facility under test must be switched off, except during the operational behavior check.
tens.

Temperatures: +55 ° C and +25 ° C

Number of cycles: 2 (breathing effect)

Time: 2 × 24 h

Intermediate measurements: The operating behavior must be checked at the beginning of the second cycle.
(during the condensation).

If the moisture does not condense at the beginning of the second cycle (low thermal inertia of the
Specimen), the rate of change of the temperature can be increased (but not 1 ° C / min
exceed and the relative humidity must be maintained).

The return to ambient temperature must be carried out under controlled conditions.

Review and final measurements:


- Insulation test (dielectric strength test and insulation measurement);
- verification of operational behavior;
- visual inspection.

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Requirements to pass the exam:

The results of all insulation tests and the test of the operating behavior (results after the

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first and second cycle) must be within the guaranteed limit deviations.

12.2.6 Overvoltages in the power supply

Overvoltages in the power supply must be generated:

a) either as a trapezoidal test voltage according to Figure 2


b) or as an alternative test according to Figure 3.

The curve of the test voltage must have the same polarity as the supply voltage of the control
have systems, which must be applied before and after the feed of the test curve.

The voltage must be based on the return potential of the supply voltage of the control system.
will measure.

As an alternative to the above, the manufacturer may demonstrate by calculation that the
can withstand the curves (to be approved by the user).

In addition to the previous sections, the following test requirements apply.

The voltage level and the duration of the test voltages must in all cases be
nerator can be measured.

The electronic device under test must have five applications with each specified voltage level
and subjected to any specified polarity.

The time interval between successive applications of the test voltage curve shape may be 1 min
do not exceed.

During the test, the facility must be monitored to determine failures and malfunctions.

Requirements to pass the exam:


- no error may occur;
- where non-linear absorbers are used to suppress voltage surges, must end
the test series are checked that there has been no reduction in function.

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Figure 2a - Test circuit

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Figure 2b - Curve of the test voltage

Voltage level Duration d Duration D Series resistance

(Minimum value) (Maximum value) (Maximum value) (Limit deviation ± 10%)

1.4 U n 0.1 s 1.0 s 1Ω

Figure 2 - Overvoltages in the power supply

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Figure 3a - Typical test circuit

Figure 3b - Curve of the test voltage

Voltage level Duration D Series resistance a

(Minimum value) (Minimum value) (Limit deviation ± 10%)

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1.4 U n 1.0 s 1Ω

a
Including the impedance of the power supply

Figure 3 - Alternative test for overvoltages in the power supply

12.2.7 Testing voltage surges, electrostatic discharge and sensitivity


regarding transient disturbances

12.2.7.1 Surges

The curve of voltage surges (see 5.4) must be used using a generator and the
Curve shape after EN 50121-3-2 (Table 7) can be generated and checked.

12.2.7.2 Testing sensitivity to electrostatic discharge

This test is only carried out on equipment that is usually used by operating personnel and drivers.
guests are accessible.

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The device must be provided with all coverings and access covers and be in the ground
housing.

The test has to follow EN 50121-3-2 (Table 9) .

12.2.7.3 Testing the sensitivity to transient disturbances

The purpose of this test is to determine the effects of coupling an electrical and / or magnetic
Field in the input and output circuits and / or the power supply lines of the test
To replicate the facility.

The test has to follow EN 50121-3-2 (Table 7 andTable 8) .

12.2.8 Radio Frequency Interference Test

12.2.8.1 Radio interference (RFI) - test of radio frequency interference immunity

For all tests, the arrangement of the device to be tested, including the associated
wiring and the agreed connections correspond as far as possible to the installation conditions.

Unless otherwise agreed with the user, the device must be in its housing
to which all panels and access covers are attached.

See conducted interference caused by radio frequency fields EN 50121-3-2 (Table 7 and Ta-
belle 8).

Radiated interference caused by radio frequency fields see EN 50121-3-2 (table 9).

12.2.8.2 Radio interference (RFI) - testing of radio frequency interference

For all tests, the arrangement of the device to be tested, including the associated
wiring and the agreed connections correspond as far as possible to the installation conditions.

Unless otherwise agreed with the user, the device must be in its housing
to which all panels and access covers are attached.

The facility must comply with the in EN 50121-3-2 (Tables 4, 5 and6) specified requirements checked
will.

12.2.9 Insulation test

The aim of this test is to ensure that the assembly of components, their metal connections
the housing and the routing of the wiring as well as the conductor tracks of circuit boards are not too tight
surrounding metal parts or fastenings.

In addition, the test should check the conformity of the dimensioned clearances of the circuits with the
demonstrate requirements for electrical isolation.

The test must be carried out in accordance with the delivery conditions on fully assembled parts of the facility
and / or complete facilities.

The test consists of two parts, an insulation measurement (is carried out before and after the dielectric strength
test carried out) and the dielectric strength test.

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Insulation measurement and dielectric strength tests must be carried out in one of the two ways
be led:
a) on individual subracks and / or assembled printed circuit boards and frames and cabinets
without subracks or circuit board assemblies;

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b) on complete racks and cabinets with all subracks and printed circuit boards.

Where galvanic isolation is required, the results of the insulation measurement and the
Test voltages are applied between the two sides of the insulation.

The insulation measurement must then be repeated.

The dielectric strength test must be carried out in such a way that individual circuits one as possible
small number of applications are exposed to the insulation test voltage.

For subracks and printed circuit boards with exposed metal parts, frames, front
plate or metal fastenings that can either be touched or a galvanic
test must be carried out between all short-circuited connections and these
metal parts.

If the insulation test was carried out as part of the routine test, it does not have to be carried out during the type test
be repeated.

12.2.9.1 Insulation measurement

The insulation resistance test must be carried out with a direct voltage of 500 V and the
results are logged.

The test must be repeated after the dielectric strength test.

Requirements to pass the exam:

There must be no fundamental deterioration compared to the initial measurement.

12.2.9.2 Dielectric strength test

Wherever possible, AC voltage of 50 Hz or 60 Hz must be used. Is this not possible,


a DC voltage equal to the peak value of the AC voltage must be used.

The test voltage must rise gradually up to the height of the test voltage.
voltage and be kept constant at the set level for 1 min.

The nominal value of the input DC or AC voltage determines the test voltage.

The effective value of the sinusoidal test voltage must be:


- 500 V for battery voltages below 72 V (or 50 V AC);
- 1,000 V for battery voltages from 72 V to 125 V (or AC voltages from 50 V to 90 V);
- 1 500 V for battery voltages above 125 V and up to 315 V (or alternating voltages of 90 V
up to 225 V).

The exception is that the secondary circuit of the power supplies, which are galvanically isolated, with
a voltage of the corresponding lower voltage range may be checked.

If part of the electronic device is galvanically connected to a power circuit, the


This part of the device must be subjected to the same voltage tests as the circuit.

Requirements to pass the exam:

There should be no breakdown or rollover.

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12.2.10 Salt spray test

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12.2.10.1 Saline solution

The solution for generating the salt spray is made by dissolving (50 ± 1) g sodium chloride (NaCl) in
Quality of analysis prepared in a quantity of distilled or deionized water, so that at 20 ° C
(1 ± 0.02) l final solution; if the pH is not between 6.5 and 7.2, the solution must be discarded
will.

12.2.10.2 Test procedure

The temperature in the test chamber must be kept at (35 ± 2) ° C during the test.

The solution and air used to generate the salt spray must be at the same temperature as that
Own test chamber.

The device should be checked under the anticipated operating conditions, ie protective cover
Covers should be in place and the facility as close as possible to the position they are in
in their practical use.

The test chamber is kept closed and the spraying of the salt solution must be carried out during the entire
test duration without interruption.

The test duration must be:

- Class ST1: 4 hours;


- class ST2: 16 h;
- Class ST3: 48 hours;
- Class ST4: 96 h.

At the end of the test, the device must be washed under running tap water for 5 minutes
rinse distilled or deionized water, dry to remove water drops, and at
standardized environmental conditions of the test area for at least 1 h and at most 2 h.

The facility is then subjected to a visual inspection.

Requirements to pass the exam:

No major visible damage may occur.

A functional check (see 3.8) must not show any failure, damage or results that
are outside the specified limit deviations.

12.2.11 Vibration, shock and shock test

The complete cabinet or frame must be together with their auxiliary and assembly equipment
(including their vibration absorbing components when mounting the device on such
Components is provided) in EN 61373 tests.

12.2.12 Water tightness test

Because an electronic device is generally inside a vehicle or in boxes outside


it is not necessary to carry out a water tightness test, except in
Exceptional cases that are determined between the user and the manufacturer.

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12.2.13 Selection test by loading the facility

The user may request a selection test procedure based on the full facility or parts
of which is used to eliminate hidden manufacturing or component defects.

The process may include:


- operation at elevated temperature;
- alternating thermal stress;
- vibration stress.

During the tendering phase, the procedure and the procedures for the
applicable tests must be agreed.

No condition set out in this procedure may set the condition for the facility or sub-assembly.
operating conditions.

12.2.14 Checking storage at low temperature

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If the device is exposed to temperatures below the lowest operating temperature, a


Storage testing can be carried out at low temperature. This test must comply with EN 60068-2-1
correspond.

The temperature value for the test must be −40 ° C and the duration at least 16 hours.

After the recovery time, the operating behavior must be checked at ambient temperature
the.

Requirements to pass the exam:


- no damage may occur;
- The functional check must not malfunction and results outside the specified limit
show deviations.

The test specification must specify the criteria for passing the test individually.

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Appendix A.
(informative)

List of sections in which agreements between the


Participants (e.g. users and manufacturers) must be met

4.1.1 Height above sea level

4.2 Special operating conditions

5.1.1 Supply from an accumulator battery

5.3 installation

6.1.1 Predicted reliability

6.1.2 Proof of reliability

6.2 Usability time

6.3 Maintainability

6.4.1 Diagnostics on the vehicle

7.2.3 Reference potential of power supplies

7.3.2 Software design measures

9.3.4 Other connections

11.1 Provision and storage of the documentation

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12.1.1 Type tests
12.1.3 Investigation tests

12.2.2 Checking the operating behavior

12.2.8.1 Radio frequency immunity test

12.2.8.2 Testing of radio frequency interference

12.2.13 Selection test by stressing the facility

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References

EN 50121-3-1: 2000, Railway applications - Electromagnetic compatibility - Part 3-1: Railway vehicles -
Train and entire vehicle

EN 50125-1: 1999, Railway applications - Environmental conditions for equipment - Part 1: Equipment
Train vehicles

EN 50129: 2003, railway applications - telecommunication technology, signal technology and data processing
systems - safety-relevant electronic systems for signaling

EN 55016 (series), requirements for devices and equipment as well as determination of the procedures for measuring
high-frequency interference (radio interference) and immunity (CISPR 16 series)

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Appendix ZZ
(informative)

Relation to basic requirements of EC directives

This European Standard was drawn up under a mandate issued by the European Commission and the
European Free Trade Association was given to CENELEC. This European standard covers within
of the scope of application all relevant basic requirements, which are listed in Annex III of the EC
Lines 96/48 / EG and 2001/16 / EG contain:
- ER 1.1.1, 1.1.3, 1.1.5, 1.2, 1.3.1 and 1.4.3 related to the system;
- ER 2.3.1 and 2.3.2 related to the operating and signaling subsystem;
- ER 2.4.1, 2.4.2 and 2.4.3 related to the locomotive subsystem.

Compliance with this standard is one way of ensuring conformity with the basic
to explain the requirements of the relevant EC directive (s).

WARNING: For products that fall within the scope of this standard, additional requirements
changes and other EC directives are applicable.

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Bibliographic data
Not part of the standard!

< VDE classification > VDE 0115-200

< DIN -...- number > DIN EN 50155

< Date of issue > March 2008

< German standard title > Railway applications - electronic


Facilities on rail vehicles;
German version EN 50155: 2007

< English standard title > Railway applications - electronic


equipment used on rolling stock; German
version EN 50155: 2007

< Document type > N

< ICS > 45.060.01

< Replacement for > DIN EN 50155; VDE 0115-200 (2004-01) * E


DIN EN 50155; VDE 0115-200 (2006-10)

< Transition period > In addition, DIN EN 50155 (2004-01) applies


until 2010-03-01.

< Standards Committee > DKE

< VDE sales number > 0115117

< Price group > 30K

28 125 3GKTÜ vsü d

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