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MPXV7002 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7002
MPXV7002 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7002
MPXV7002 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7002
Features
• 2.5% Typical Error over +10°C to +60°C with Auto Zero
• 6.25% Maximum Error over +10°C to +60°C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package MPXV7002GP MPXV7002DP
• Temperature Compensated over +10° to +60°C CASE 1369 CASE 1351
N/C 5 4 VOUT
N/C 6 3 GND
N/C 7 2 VS
N/C 8 1 N/C
Pinout
(Style 2, case number 98ASA99255D)
ORDERING INFORMATION
Package Case # of Ports Pressure Type Device
Device Name
Options No. None Single Dual Gauge Differential Absolute Marking
Small Outline Package (MPXV7002 Series)
MPXV7002GC6U Rails 482A • • MPXV7002G
MPXV7002GC6T1 Tape & Reel 482A • • MPXV7002G
MPXV7002GP Trays 1369 • • MPXV7002G
MPXV7002DP Trays 1351 • • MPXV7002DP
MPXV7002DPT1 Tape & Reel 1351 • • MPXV7002DP
Related Documentation
The MPXV7002 device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current versions of these documents:
1. Go to the MPXV7002 web page at http://www.nxp.com/products/:MPXV7002.
2. Click the Documentation tab.
MPXV7002
Sensors
2 NXP B.V.
1 Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet specification.)
Full Scale Output(4) (10 to 60°C) VFSO 4.25 4.5 4.75 Vdc
@ VS = 5.0 Volts
Full Scale Span(5) (10 to 60°C) VFSS 3.5 4.0 4.5 V Vdc
@ VS = 5.0 Volts
Warm-Up Time(9) — — 20 —- ms
MPXV7002
Sensors
NXP B.V. 3
2 Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Symbol Value Unit
Operating Temperature TA 10 to 60 °C
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 2
MPXV7002
Sensors
4 NXP B.V.
3 On-Chip Temperature Compensation, Calibration and Signal
Conditioning
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation,
calibration and signal conditioning circuitry onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die
surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.
The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or
microcontroller. Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for
operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside
of the specified pressure range.
P1
Thermoplastic
Wire Bond Case
Lead
Frame
P2
Differential Sensing Die Bond
Element
+5 V
Vout OUTPUT
Vs
IPS
MPXV7002
Sensors
NXP B.V. 5
5.0
Transfer Function:
Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS
4.0 VS = 5.0 Vdc
TA = 10 to 60°C
MIN
1.0
0
-2 -1 0 1 2
Differential Pressure (kPa)
Pressure (P1)
Part Number Case Type
Side Identifier
0.100 TYP 8X
0.660 2.54
16.76
0.060 TYP 8X
1.52 0.300
7.62
MPXV7002
Sensors
6 NXP B.V.
6 Package Dimensions
–A– D 8 PL NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
4 0.25 (0.010) M T B S A S Y14.5M, 1982.
5 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
N –B– 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
G
8 INCHES MILLIMETERS
1 DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
S C 0.500 0.520 12.70 13.21
W D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
V K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
C S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
H W 0.115 0.125 2.92 3.17
J
–T–
PIN 1 IDENTIFIER SEATING
M PLANE
K
CASE 482A–01
ISSUE A
DATE 05/13/98
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
NXP B.V. 7
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
8 NXP B.V.
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
NXP B.V. 9
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
10 NXP B.V.
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV7002
Sensors
NXP B.V. 11
7 Revision History
MPXV7002 Rev. 3.0 2015 January Technical data — MPXV7002 Rev. 2.0
MPXV7002 Rev. 2.0 2009 January Technical data — MPXV7002 Rev. 1.0
MPXV7002
Sensors
12 NXP B.V.
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MPXV7002
Rev 4
03/2017