Sensors: Thermal Model and Countermeasures For Future Smart Glasses

sensors
Article
Thermal Model and Countermeasures for Future
Smart Glasses †
Kodai Matsuhashi, Toshiki Kanamoto and Atsushi Kurokawa *
Graduate School of Science and Technology, Hirosaki University, Aomori 036-8560, Japan;
ms19518@eit.hirosaki-u.ac.jp (K.M.); kana@hirosaki-u.ac.jp (T.K.)
* Correspondence: kurokawa@eit.hirosaki-u.ac.jp
† This paper is an extended version of Matsuhashi, K.; Kurokawa, A. Thermal Countermeasures of Glass
Wearable Devices published in the Proceedings of ICCE-TW 2019, Yilan, Taiwan, 20–22 May 2019 and
Matsuhashi, K.; Kanamoto, T.; Kurokawa, A. Thermal Resistance Model and Analysis for Future Smart
Glasses, published in Proceedings of IMPACT 2019, Taipei, Taiwan, 23–25 October 2019.

Received: 17 January 2020; Accepted: 5 March 2020; Published: 6 March 2020
Abstract: The market for wearable devices such as smart watches and smart glasses continues to
grow rapidly. Smart glasses are attracting particular attention because they offer convenient features
such as hands-free augmented reality (AR). Since smart glasses directly touch the face and head,
the device with high temperature has a detrimental effect on human physical health. This paper
presents a thermal network model in a steady state condition and thermal countermeasure methods
for thermal management of future smart glasses. It is accomplished by disassembling the state by
wearing smart glasses into some parts, creating the equivalent thermal resistance circuit for each
part, approximating heat-generating components such as integrated circuits (ICs) to simple physical
structures, setting power consumption to the heat sources, and providing heat transfer coefficients of
natural convection in air. The average temperature difference between the thermal network model
and a commercial thermal solver is 0.9 ◦ C when the maximum temperature is 62 ◦ C. Results of
an experiment using the model show that the temperature of the part near the ear that directly touches
the skin can be reduced by 51.4% by distributing heat sources into both sides, 11.1% by placing higher
heat-generating components farther from the ear, and 65.3% in comparison with all high conductivity
materials by using a combination of low thermal conductivity materials for temples and temple tips
and high conductivity materials for rims.
Keywords: thermal management; wearable device; thermal modeling; smart glasses; thermal analysis
1. Introduction
Wearable devices have become popular as state-of-the-art electronic devices, such as smart
watches, smart glasses, smart clothing, and fitness trackers, have been made commercially available
for consumer and industrial uses. Currently, smart watches are the wearable device with the largest
market size. However, smart glasses have also been released by many companies [1–7] and can be used
for various purposes such as medical care, health, learning/education, and entertainment. Differences
in the uses between the smart glasses and the wrist-worn wearables such as smart watches and fitness
trackers come from the differences between wrists and eyes. Smart glasses have advantages that
users can look at various things such as maps (e.g., current location) and movies with augmented
reality (AR) through a display, and their eye and facial movements can be recognized for medical
care, health monitoring, and dozing prevention. In the future, heat issues will become more serious
because smart glasses will require faster central processing unit (CPU) and larger memory to deal with
enormous amounts of data. Therefore, thermal design is becoming one of the key technologies for
future wearable devices.
Sensors 2020, 20, 1446; doi:10.3390/s20051446 www.mdpi.com/journal/sensors

Sensors 2020, 20, 1446 2 of 20
Various techniques for utilizing smart glasses have been developed by many researchers.
For medical uses, techniques have been presented for clinical and surgical applications [8], medical
emergency situations [9], and disaster medicine [10]. For recognition and interface, techniques have
been presented for head gestures [11], face detection [12], eye movements [13], user authentication [14],
estimation of respiration rate [15], speech interaction with eye blinking detection [16], context-aware
lightning control [17], distance learning [18], and indoor localization [19], drowsiness and fatigue
detection to increase road safety [20], countermeasures to phishing attacks [21], gait aid for Parkinson’s
disease patients [22], contextually-aware learning in physics experiments [23], and guiding for visually
impaired users [24]. Some techniques regarding thermals have been presented such as 3D thermal
model reconstruction based on image-based modeling using smartphone sensors [25], design of an oven
utilizing radiative heat transfer for smart phone panels [26], thermal management systems for civil
aircraft engines [27], and thermal properties of glasses [28]. A system for low-power smart glasses has
been presented [29]. However, there have been only a few technical reports about the heat of smart
glasses [30,31]. Smart glasses directly touch human skin. The heat of the smart glasses is capable
of causing burns of the skin. Thermal management of smart glasses is essential for physical health
safety and comfortable use. Current smart glasses consume 1 to 3 W under various workloads [30].
We presented thermal countermeasures of smart glasses [31] and discussed only the maximum
temperature in the integrated circuits that generate heat. Only a heat generating component was used
and was placed on a limited space. Moreover, the temperature of the device surface touching skin that
may cause a low-temperature burn even at 43 ◦ C [32] was not analyzed. In Reference [33], we presented
a thermal network model for thermal designs of future smart glasses. In this paper, we provide more
detailed resistance models for all parts of devices, thermal properties that were used in the analysis,
a difference in temperatures due to the position on the temple, more detailed explanations for each
figure, motivations for this work, and discussions.
Smart glasses mainly comprise the electronic device body, and display a liquid crystal on the
silicon (LCOS) device [34] and battery. The device body consists of many heat generating electronic
components, including processors, memory, wireless modules, and power management integrated
circuits (ICs). In accordance with a design concept, the device body is mounted to various places [35].
We simplify the device body as follows: IC packages are reconstructed by using three layers (heat
generating, upper, and lower) in the vertical direction, and several packages are arranged horizontally
on a printed circuit board (PCB). Thereby, the simplified device body can be re-sized and consume
power in a non-uniform manner. By making a thermal resistance model of the state wearing smart
glasses, temperatures at each part can be calculated. The thermal model can be used for various types
of smart glasses such as glasses’ structures, materials, heat sources, and layouts of the components.
Smart glasses include various functions such as a camera, video, map, translation, weather
information, and search in real-world environments, augmented reality, and virtual reality (VR). As the
demand for higher precision and higher speed increases, power consumption also increases. Moreover,
power density increases with higher integration (including 3D ICs). Therefore, thermal management is
very important for future smart glasses. Systems and design methodologies of smart glasses have
been proposed [29,36–39]. Among them, thermal management has become one of the crucial issues
in AR and VR processing [30,31] where image screens as well as image sensors have been equipped.
Even the current high definition (HD) smart glasses consume 1 to 3 W [30]. Upcoming advanced
features including 4K/8K resolution processing are expected to need additional power to render the
images [40–45]. This will require more organized thermal management with overviewing packages,
boards, and systems as well as heating processor chips [46]. Motion detection is another power
consuming factor. Even the current artificial intelligence (AI)-based moving object identification from
the sensor images also requires up to 3W of power. Additionally, the expected features in the near
future such as human detection will impose an extra power expense. Furthermore, promising smart
glasses need to communicate with external networks and transfer large amounts of the processed data.
The leading 5G communications technologies reduce transmission power in exchange for consuming
Sensors 2020, 20, 1446 3 of 20
additional circuit power due to the required hardware expansions including signal processing to
establish low-power mmWave communications at extremely high frequencies [47].
In the viewpoint of the safety and comfort of smart glasses, there are several issues such as
weight [48,49], battery [50,51], AR/VR [52–54], and heat [31,33]. In Reference [48], regarding weight
issues, the effect of weight balance for shutter glasses in terms of subjective discomfort and physical
load on the nose has been investigated [48] and a user discomfort on the different wearing mode glasses
with different support points has been presented [49]. With respect to battery safety, an extremely
safe and wearable solid-state zinc ion battery has been fabricated [50] and a quasi-solid-state aqueous
rechargeable lithium-ion battery with outstanding stability, flexibility, safety, and breathability toward
various wearable electronics has been reported [51]. AR/VR include many problems such as display
size, resolution, computing capability, negative effects in some people with autism spectrum disorder,
and architecture/server/network issues [52–54]. Moreover, it is necessary to ensure the safety and
comfort due to heat generation [31,33] since smart glasses are worn on the face/head of the human
body for use.
The main sources of heat generation of smart glasses come from power consumptions of ICs.
Thermal countermeasures within IC chips must be mainly low power designs and have a limit.
For smart glasses, the temperature not only in chips for circuit operation but also on the device
surface touching the skin is important for preventing low temperature burns. Thermal management of
smart glasses is required to determine various conditions such as arrangements of heat generating
components and materials of parts. Although a commercial thermal solver can obtain high accuracy
results, it has the disadvantages of a complex structure input, long processing time, and unsuitability
for parameter optimization. Therefore, we have developed a thermal network model to improve
design efficiency. The model has been devised for not only current products but also future products.
To deal with as wide a variety of smart glasses as possible, the entire thermal network is divided into
several parts and is expressed by a block diagram (as described in Section 3.1). In addition, each block
is removable and replaceable. We use virtual smart glasses composed of some parts but not real smart
glasses so that the entire thermal network can be applied to various types of smart glasses.
Additionally, using the proposed model, we present thermal countermeasures of smart glasses
for ensuring the health safety and comfortable use. We clarify the following facts: (1) If high thermal
conductivity materials like Al are used for a grasses frame, the whole temperature can be reduced,
but a low temperature burn may be caused near an ear. (2) If low conductivity materials like cellulose
acetate (CA) plastic are used, temperature near an ear can be reduced, but the surface temperature
of the device body rises. (3) When Al is used, by locating higher power density, ICs near the lens,
temperature at the ear decreases but not sufficiently. (4) When the device body is divided and placed
on both sides, temperatures decrease as a whole. From these results, we found that the best solution
is to use plastic for the temples and temple tips for hanging on the ears and Al for the other parts of
the frame in order to locate the device body to the lens side and divide it into both sides as much
as possible.
The rest of the paper is organized as follows. Section 2 describes the details of smart glasses
assumed in this work. Section 3 presents thermal network models for the smart glasses. Section 4
shows experimental results for thermal countermeasures. Section 5 presents discussions of this work.
Section 6 concludes this paper.
2. Physical Structural Model of Smart Glasses

In this section, the smart glasses assumed in this work are described. First, an overview of the
smart glasses is shown. Next, a physical structural model with dimensions is presented. Lastly, the heat
generating components are discussed.
Sensors 2020, 20, 1446 4 of 20
2.1. Overview of Smart Glasses

Figure 1 shows an overview of a basic structure of the smart glasses used in this study. In the basic
structure of smart glasses, batteries are connected to device bodies. Device body cases are mounted on
the temples of both sides. Electronic components are installed in the right device body, and displays
Sensors 2019, 19, x FOR PEER REVIEW 4 of 20
are Sensors
set in 2019,
front19,ofxlenses.
FOR PEER REVIEW 4 of 20
Figure 1. Overview of smart glasses used in this paper.

Figure
Figure 1. Overview
1. Overview of smart
of smart glasses
glasses usedused in this
in this paper.
paper.
2.2.Structure
2.2. StructureofofSmart
SmartGlasses
Glasses
2.2. Structure of Smart Glasses
Table11 lists
Table lists thermal
thermal properties
properties of the smart glasses used in our basic analysis. FigureFigure
2 shows
Table 1 lists thermal propertiesofofthe
thesmart
smart glasses used
glasses used in our
in our basic
basic analysis.
analysis. 2
Figure 2 shows
dimensions
shows of a
dimensions face/head
of a model.
face/headFor a face
model. model,
For a we referred
face model, to a
we model of
referred human
to a thermoregulation
model of human
dimensions of a face/head model. For a face model, we referred to a model of human thermoregulation
[55] and used a simpler
thermoregulation andmodel. a The skinmodel.
thickness
The was 2thickness
mm. Thewas core and ambient
core temperatures
[55] and used [55]a simpler used simpler
model. The skin thickness skin
was 2 mm. The core 2 mm.andThe
ambientand ambient
temperatures
were set
temperaturesto 36.6 and 25 °C, respectively.
◦ Figure 3 shows dimensions of the smart glasses.
were set towere
36.6 set
andto2536.6
°C,and 25 C, respectively.
respectively. Figuredimensions
Figure 3 shows 3 shows dimensions of the
of the smart smart glasses.
glasses.
Table1.1.Thermal
Table Thermalproperties
propertiesofofsmart
smartglasses.
glasses.
Table 1. Thermal properties of smart glasses.
Parts Material Abbreviation Thermal Conductivity (W/mK)
Parts Parts Material
Material Abbreviation
Abbreviation Thermal Thermal Conductivity
Conductivity (W/mK)
(W/mK)
Aluminum Al 236
Frame Aluminum
Aluminum Al 236
Frame Frame Cellulose acetate CAAl 0.2 236
Cellulose
Cellulose acetate
acetate CA
CA 0.2 0.2
Display Polycarbonate PC 0.19
Display Display Polycarbonate
Polycarbonate PC
PC 0.190.19
Lens Polycarbonate PC 0.19
Lens Lens Polycarbonate
Polycarbonate PC
PC 0.190.19
Nose pad Cellulose
Nose padNose padCellulose propionate
propionate CP CP 6
Cellulose propionate CP 6 6
BatteryBattery
Battery —---
---
---—
---
15
15 15
(a) (b)
(a) (b)
Figure2.2.Overview
Figure Overviewofofsmart
smartglasses
glassesused
usedin
inthis
thispaper:
paper:(a)
(a)front
frontview
viewand
and(b)
(b)top
topview.
view.
Figure 2. Overview of smart glasses used in this paper: (a) front view and (b) top view.
(a) (b) (c)

(a) (b) (c)
(a) (b)
Sensors 2020, 20, 1446 5 of 20
Figure 2. Overview of smart glasses used in this paper: (a) front view and (b) top view.

(a) (b) (c)
2.3. Heat Generating
Figure
Figure 3. Components
3. Dimensions (in
(in mm)
mm) of
of smart
smart glasses:
glasses:(a)
(a)front
frontview,
view,(b)
(b)side
sideview,
view,and
and(c)
(c)top
topview.
view.
2.3. Heat Generating
In Generating
general, heatComponents
generating components of smart glasses include processors, memories (e.g.,
2.3. Heat Components
DDR4 SDRAM, and NAND
In general, heat generating flash), audio ICs,of
components wireless
smart modules, power processors,
glasses include management ICs, and (e.g.,
memories LCOS
In
devices. general, heat
Figureand generating
4 illustrates components
an example of smart glasses include processors, memories (e.g.,
DDR4 SDRAM, NAND flash), audio of a cross-sectional
ICs, wireless modules,structure
powerofmanagement
an IC package ICs,with
andthe
LCOS flip-
DDR4
chip SDRAM, and
technology. NAND
Table 2 flash),
lists an audio ICs,
example of wireless
the thermalmodules,
propertypower
and management
thickness of ICs,layer.
each and LCOS
Figure
devices. Figure 4 illustrates an example of a cross-sectional structure of an IC package with the flip-
devices. Figure
5 illustrates an4 example
illustratesofana example of a cross-sectional
cross-sectional structure structure of an IC package withantheexample
flip-chipof
chip technology. Table 2 lists an example of the thermalofproperty
an LCOSand device. Tableof3 each
thickness lists layer. Figure
technology.
the thermal Table 2
property lists
andan example
size. The of
heatthe thermal
generating property and
components thickness
are composedof each
of layer.
various Figure
structures5
5 illustrates an example of a cross-sectional structure of an LCOS device. Table 3 lists an example of
illustrates
and an
thermal example of
properties. a cross-sectional structure of an LCOS device. Table 3 lists an example of the
the thermal property and size. The heat generating components are composed of various structures
thermal property and size. The heat generating components are composed of various structures and
and thermal properties.
thermal properties.
Chip substrate Package

Bumps
Device layer
Package substrate
Metal layer Balls
Copper plane
PCB
Figure 4. IC package (flip-chip package).
Figure 4.
Figure 4. IC
IC package
package (flip-chip
(flip-chip package).
package).
Table 2. Thermal properties and size of IC package.
Table 2. Thermal properties and size of IC package.
Table 2. Thermal
Component Thermalproperties and size(W/mK)
Conductivity of IC package.
Thickness (mm)
Component
Component
Mold Thermal Conductivity
Thermal (W/mK)
Conductivity
0.88 (W/mK) Thickness--- (mm) (mm)
Thickness
Metal
MoldMoldlayer 98
0.880.88 0.003
--- —
Metal layer
Device layer 14998 0.0010.003
Metal layer 98 0.003
DeviceSi layer
substrate 149
149 0.1 0.001
Device layer
Si substrate 149149 0.001 0.1
Bumps 60 0.08
Si substrate
Bumps 149 60 0.1 0.08
Package substrate 149 0.2
Bumps
Package substrate 60 149 0.08 0.2
Balls 33 0.35
Package
Balls substrate 149 33 0.2 0.35
PCB 13 0.8
PCB Balls 33 13 0.35 0.8
Copper plane 401 0.03
Copper PCBplane 13 401 0.8 0.03
Copper plane 401 0.03
Glass substrate
Liquid crystal layer
Chip
PCB
5. 5.Liquid
Figure
Figure Liquidcrystal
crystalononthe
thesilicon
silicon(LCOS) device.
(LCOS) device.
Figure 5. Liquid crystal on the silicon (LCOS) device.

Table 3. Thermal properties and size of liquid crystal on the silicon (LCOS) device.
Table 3.Component
Thermal propertiesThermal
and size Conductivity
of liquid crystal on the siliconx,(LCOS)
(W/mK) device.
y, z (mm)
Glass substrate 0.8 8, 8, 0.5
Component Thermal Conductivity (W/mK) x, y, z (mm)
Liquid crystal layer 0.15 8, 8, 0.005
Copper plane 401 14, 13, 0.03
PCB 13 14, 13, 0.8
Copper plane 401 14, 13, 0.03
Sensors 2020, 20, 1446 6 of 20
Table 3. Thermal properties and size of liquid crystal on the silicon (LCOS) device.
Component Thermal Conductivity (W/mK) x, y, z (mm)

Copper plane 401 14, 13, 0.03
PCB 13 14, 13, 0.8
In this scenario, we model the heat generating components by applying them to various types of
smart glasses. The simple physical model for an equivalent circuit of one heat generating component
is approximated with
Sensors 2019, 19, x FORupper and lower layers, as
PEER REVIEW Airshown in Figure 6. 6 of 20
Heat Upper layer
generating Air Heat generation
component
Heat Upper layer
generating Lower layer
Heat generation
component PCB Copper plane
Lower layer
PCB Copper plane
Figure 6. Simple model of the heat generating component.
Figure 6. Simple model ofofthe heat generatingcomponent.

component.
In this work, in theFigure
device6. body
Simple atmodel
one side, thewe
heat generating
assumed the use of four IC packages shown in
InFigure 4 with conditions in Table 2 and one LCOS device shown in Figure 5 with conditions in Table
thisInwork,
this in the
work, in device body at one side, we
we assumed theuse
use
ofAof four IC packages shown in
3. Figure 7 shows thethe device
arrangementbody of at one
five side,
heat assumed
generating the
components. four IC packages
thermal resistanceshown in
network
FigureFigure
4 with4conditions in Table
with conditions 2 and
in their
Table one
2 and LCOS
one LCOS device
deviceshown
shown inFigure
in Figure5 5with
with conditions in Table 3.
for the device body with components is constructed by using the simpleconditions in Table
physical model in
Figure 3.7Figure
shows
Figure6.7the arrangement
shows the of
arrangement five
of heat
five generating
heat generatingcomponents.
components. AA thermal
thermal resistance
resistance network
network for
the device
for thebody with
device theirwith
body components is constructed
their components by using
is constructed the simple
by using physical
the simple model
physical in Figure
model in 6.
Figure 6.
Figure
Figure 7. Layout
7. Layout ofofheat
heatgenerating
generating components.
components.
2.4. Structures and Materials

2.4. Structures of Components
and Materials Figure 7. Layout of heat generating components.
of Components
In2.4.
theStructures
future,
In the smart
future, glasses
smart ofwith
and Materials glasses various
Components shapes, size,
with various materials,
shapes, and arrangements
size, materials, of components
and arrangements of
must becomponents
produced. must be produced.
Size and materialsSize and materials
are basically are basically
modifiable because modifiable
they canbecause theyby
be applied can be
changing
In the future, smart glasses with various shapes, size, materials, and arrangements of
thermalapplied by changing
resistance values.thermal resistance values.
components must be produced.
Although this paper uses rectangular Size and lithium
materials are basically
polymer modifiable
(LiPo) batteries, thebecause
shapes andtheymaterials
can be
Although
applied this
by paper uses
changing thermalrectangular
resistance lithium
values. polymer (LiPo) batteries, the shapes and materials of
of batteries are not greatly restricted because a battery is modeled simply. In this case, thermal
batteries are not greatly
Although restricted
this paper because a battery is modeled simply. In this case, thermal resistance
resistance circuits for a uses rectangular
cylindrical lithium
battery polymer
are discussed. (LiPo) batteries,
Figure 8a showsthe shapes
a crossand materials
section of a
circuitsof for a cylindrical
batteries
cylindrical are not battery
battery. greatly
A are isdiscussed.
restricted
cylinder because
expressed Figure
with 8a thermal
a battery
three shows aresistances
is modeledcross section
simply. In of
[56,57]. aThe
this cylindrical
case, thermal
inner battery.
liquid
resistance
A cylinder is circuits
expressed for a
with cylindrical
three battery
thermal are discussed.
resistances Figure
[56,57]. The 8a shows
inner a
liquid cross
fluid in a battery is covered by a frame. The heat conduction resistance value for the internal cylinder section
fluid in a of a
battery is
covered cylindrical
by a battery.
frame. The A cylinder
heat is
conductionexpressed with
resistance
(inner liquid fluid) can be calculated from the equation below.three
valuethermal
for resistances
the internal [56,57].
cylinder The inner
(inner liquid
liquid fluid)
can be fluid in a battery is covered by a frame. The heat conduction resistance value for the internal cylinder
calculated from the equation below. 𝑙𝑛 𝑟
(inner liquid fluid) can be calculated from the equation 𝑅 = below. (1)
2𝜋𝑘𝑙
ln𝑙𝑛(r1𝑟)
where r1 is the internal radius, k is the thermal R1 𝑅=conductivity
= of the material, and l is the length of (1)a (1)
2𝜋𝑘𝑙
2πkl
cylinder. The heat conduction resistance value for an outer frame can be calculated from the equation
where r1 is the internal radius, k is the thermal conductivity of the material, and l is the length of a
where rbelow.
1 is the internal radius, k is the thermal conductivity of the material, and l is the length of a cylinder.
cylinder. The heat conduction resistance value for an outer frame can be calculated from the equation
The heat conduction resistance value for an outer frame 𝑙𝑛 𝑟 ⁄can𝑟 be calculated from the equation below.
below. 𝑅 = (2)
2𝜋𝑘𝑙
𝑙𝑛 𝑟
ln(r2 /r ⁄ 𝑟
where r2 is the outer radius. The heat R 𝑅 =
convection 1)
resistance value from a frame surface can (2) be (2)
2 = 2𝜋𝑘𝑙
calculated from Equation (3) below. 2πkl
where r2 is the outer radius. The heat convection resistance value from a frame surface can be
r2 is the outer
where calculated 1 value from a frame surface can be calculated
fromradius.
Equation The
(3) heat
below.convection𝑅resistance
= (3)
from Equation (3) below. ℎ 2𝜋𝑟 𝑙
1
where hc is the heat transfer coefficient. In this = all the necessary resistances can be obtained.(3)
𝑅 way, By
ℎ 2𝜋𝑟 𝑙
assigning them the model of rectangular batteries (i.e., by converting a circle into a rectangle as shown
where hc is8b),
in Figure thea heat transferbattery
cylindrical coefficient.
is alsoInapplicable.
this way, all the necessary resistances can be obtained. By
assigning them the model of rectangular
For modeling heat generating components, we batteries (i.e., by converting
used a circle
the PCB with a flipinto a rectangle
chip-ball as shown
grid array (FC-
in Figure 8b), a cylindrical battery is also applicable.
BGA) package shown in Figure 4 as an example. However, types of packages (e.g., wafer level
For modeling
package (WLP)) and heat boards
generatingare components, we used the
not greatly restricted PCB with
because a flipgenerating
a heat chip-ball grid array (FC-is
component
Sensors 2020, 20, 1446 7 of 20
1
Rc = (3)
hc 2πr2 l
where hc is the heat transfer coefficient. In this way, all the necessary resistances can be obtained.
By assigning them the model of rectangular batteries (i.e., by converting a circle into a rectangle as
shown in Figure 8b), a cylindrical battery is also applicable.
For modeling heat generating components, we used the PCB with a flip chip-ball grid array
Sensors 2019, 19,package
(FC-BGA) x FOR PEER shown
REVIEWin Figure 4 as an example. However, types of packages (e.g., wafer 7 oflevel
20
package (WLP)) and boards
Sensors 2019, 19, x FOR PEER REVIEWare not greatly restricted because a heat generating component is modelled
7 of 20
very simply
modelled veryassimply
a structure shown in shown
as a structure Figure 6.in The idea6.ofThe
Figure theidea
thermal modeling
of the thermalpresented
modelingin this paper
presented
modelled
incan
thisuse not very
paper onlyuse
can simply
rigid as a structure
notboards
only but also
rigid shown
boards butinalso
flexible Figure 6. The
substrates
flexible idea of
[58–60] the[58–60]
such
substrates thermal
as modeling
polyimide
such asand presented
polyethylene
polyimide and
in this paper can
terephthalateterephthalate
polyethylene use not
(PET). However, only rigid boards
if such
(PET). but also flexible
flexibleifcircuits
However, substrates
are used,
such flexible [58–60]
the model
circuits such as
of device
are used, polyimide
body parts
the model and
should
of device
bepolyethylene
body replaced with
parts should
terephthalate
abemore (PET). However,
appropriate
replaced thermal
with a more
if such flexible circuits are used, the model of device
model.
appropriate thermal model.
body parts should be replaced with a more appropriate thermal model.
(a)(a) (b)
(b)
Figure
Figure
Figure8. 8.
Thermal
8.Thermalmodeling
Thermal modeling
modeling inin
cross sections
cross for
sections
sections forcylindrical
for cylindrical
cylindrical battery:
battery:
battery: (a)(a)
thermal resistance
thermal
thermal circuit
resistance
resistance and
circuit
circuit andand
(b) conversion
(b)(b)conversion of the circle
conversionofofthe to
thecircle
circletorectangle.
to rectangle.
rectangle.
3.3.Thermal
3.Thermal
ThermalNetwork
Network
Network Model
Model
Model
InInthis
Inthis
thissection,
section,
section, wewe
wepresent
present
present a thermal
thermal
a thermal network
network
network model
model
model for
for
for smart
smart
smart glasses
glasses
glasses inin
in a steady
aasteady
steady state
state
state condition.
condition.
condition.
Based
Based on ona block
a blockdiagram
diagram for
for an entire
entire thermal
thermal network,
network, thermal
thermal models
models forfor each
each block
block are
Based on a block diagram for an entire thermal network, thermal models for each block are presented.are presented.
presented.
3.1. Block Diagram for Entire Thermal Network

3.1.3.1. Block
Block Diagram
Diagram forfor Entire
Entire ThermalNetwork
Thermal Network
AAblock
block diagram
diagram for the
theentire
entirethermal
thermal network of smart glasses is shown in Figure 9.
A block diagram forforthe entire thermal network
network of smart
of smart glasses
glasses is
is shown
shown ininFigure
Figure9.9.ByBy
Byrepresenting
representing each
each block
block byby thethe equivalent
equivalent thermal
thermal resistance
resistance circuit,
circuit, ourour model
model cancan
be be applied
applied to to
representing each block by the equivalent thermal resistance circuit, our model can be applied to
varioustypes
various typesofofsmart
smartglasses.
glasses. Designers
Designerscan canremove
removeororreplace blocks
replace blockswhen
when necessary. In this
necessary. paper,
In this paper,
various types of smart glasses. Designers can remove or replace blocks when necessary. In this paper,
a thermalmodel
a thermal modelofofeach
eachblock
block is is constructed
constructed by
by aa representative
representativeexample.
example. ByBychanging
changingthethe
thermal
thermal
a thermal model of each block is constructed by a representative example. By changing the thermal
modelofofeach
model eachblock,
block,smart
smartglasses
glasses under various
variousconditions
conditionscancanbebeexpressed.
expressed.
model of each block, smart glasses under various conditions can be expressed.
Battery Battery
Battery Temple Temple Battery
Temple
Tip Temple
Tip
Tip Tip
Face
Face
Temple Temple
Device Device
Temple Temple
Body
Device Body
Device
Body Body
Lens Lens
and and
Lens
Rim Lens
Rim
and and
Rim Rim
Figure 9. Block diagram for entire thermal network of smart glasses.


3.2. Basic Thermal Resistance Model
3.2. BasicFor a thermal

Thermal resistance
Resistance model for heat conduction of one cell (called a thermal cell), we basically
Model
use the three-dimensional (3D) equivalent resistance model shown in Figure 10a. The heat conduction
For a thermal
resistance value resistance modelcan
in each segment forbeheat conduction
calculated from of
theone cell (called
equation below.a thermal cell), we basically
Sensors 2020, 20, 1446 8 of 20
3.2. Basic Thermal Resistance Model

For a thermal resistance model for heat conduction of one cell (called a thermal cell), we basically
use the three-dimensional (3D) equivalent resistance model shown in Figure 10a. The heat conduction
resistance value in each segment can be calculated from the equation below.
l
R= (4)
where l is the length of a heat transfer path, k is thekS thermal conductivity of the material, and S is the
cross-sectional
where area. The
l is the length of a natural convection
heat transfer path,heat transfer
k is the thermal coefficient value for
conductivity air can
of the be calculated
material, and S isfrom
the
the equation below.
cross-sectional area. The natural convection heat transfer coefficient value for air can be calculated
from the equation below. .
𝑘 × 𝑔 × 𝛽 × !𝑃𝑟 0.25 𝛥𝑇 .
ℎ = k × g × β × Pr
4 × 𝐾 ∆T
× 0.25 (5)
hc = 𝜂 × K × 𝐿 (5)
η2 L
where g is the acceleration of gravity, β is the air thermal expansion coefficient, Pr is the Prandtl number,
where g is the acceleration of gravity, β is the air thermal expansion coefficient, Pr is the Prandtl number,
η is the air kinematic viscosity, K is the coefficient in the vertical or horizontal direction, ΔT is the
η is the air kinematic viscosity, K is the coefficient in the vertical or horizontal direction, ∆T is the
temperature difference, and L is the characteristic length [61]. The heat convection resistance value can
temperature difference, and L is the characteristic length [61]. The heat convection resistance value can
be calculated from the equation below.
be calculated from the equation below.
11
Rc 𝑅= = (6)
(6)
hcℎS𝑆
where SS is
where is the heat dissipation
dissipationarea.
area.The
Theconvection
convection heat
heat transfer
transfer coefficients
coefficients for for
the the
top,top, bottom,
bottom, and
and
sideside are distinguished,
are distinguished, as shown
as shown in Figure
in Figure 10b. The10b. The thermal
thermal resistance
resistance model formodel for each
each part part by
is created is
created by setting thermal cells in heat transfer paths. The number of thermal cells depends
setting thermal cells in heat transfer paths. The number of thermal cells depends on heat flow rates on on heat
flow ratestransfer
the heat on the path.
heat transfer
The heatpath. The heat
convection convection
resistances areresistances
connected are connected
to the thermal to theinthermal
cells contact cells
with
in contactair.
ambient withTheambient
ambientair. The ambient
temperature temperature
is connected to aiscircuit
connected to a circuit ground.
ground.
hc,T
hc,S
hc,B
(a) (b)
Figure10.
Figure 10. Thermal
Thermal resistance
resistance circuits:
circuits: (a)
(a) 3D
3D heat
heat conduction
conduction resistance
resistance model
model for
for one
one thermal
thermal cell,
cell,
and(b)
and (b)heat
heatconvection
convectionresistance
resistancemodel
modelwith withconvection
convectionheat
heattransfer
transfercoefficients.
coefficients.
3.3.
3.3. Thermal
Thermal Model
Model of
of the
the Temple
Temple
AAtemple
templeofof thethe
glasses is divided
glasses is dividedinto four
intocells
fourtocells
enabletothe connections
enable with four heat
the connections withgenerating
four heat
components of a device body (see Figure 11). In this case, the method to derive
generating components of a device body (see Figure 11). In this case, the method to derive resistance resistance values of the
thermal model is described in detail. Figure 12 shows thermal resistance
values of the thermal model is described in detail. Figure 12 shows thermal resistance circuits withcircuits with the structure
of
thea structure
glasses’ temple. Thetemple.
of a glasses’ temple The is divided
temple is into four thermal
divided into fourcells.
thermalA thermal cell consists
cells. A thermal of the
cell consists
3D heat conduction resistance model in Figure 10a, which has six
of the 3D heat conduction resistance model in Figure 10a, which has six resistances in threeresistances in three dimensions
from the center
dimensions of the
from the thermal
center ofcell.
theFor simplification,
thermal series resistance
cell. For simplification, is expressed
series resistance byisone resistance.
expressed by
Heat conduction resistance values are calculated by substituting the length,
one resistance. Heat conduction resistance values are calculated by substituting the length, thermal thermal conductivity of
the material, and
conductivity areamaterial,
of the into Equation
and area(4). into EquationR(4).
For example, 3 in For
the vertical
example, direction
R3 in the of vertical
one cell direction
is 0.25 K/W of
from l = is
one cell 2.50.25
mm, K/Wk =from
236 W/mK,
l = 2.5 mm,and kS ==236 × 2 mm
85/4W/mK, 2
and. STable 4 summarizes
= 85/4 × 2 mm2. Table the4heat conduction
summarizes the
resistance values resistance
heat conduction for a temple. values for a temple.
The
The heat dissipations are
heat dissipations aresetset to
to three
three points
points at at the
the back,
back, top,
top, and
and bottom
bottom of of each
each cell
cell of
of aa temple.
temple.
Heat convection resistance values are calculated by using Equations (5) and
Heat convection resistance values are calculated by using Equations (5) and (6). The thermal profile(6). The thermal profile for
air shown in Table 5 is used for Equation (5). The characteristic lengths for heat
for air shown in Table 5 is used for Equation (5). The characteristic lengths for heat dissipation areas dissipation areas use
use the short side for the horizontal surface and height for the vertical surface. The temperature
difference is obtained by iterating the temperature calculation. The number of iterations used in this
paper is three. As a concrete example to calculate the resistance in the vertical direction in one cell of
a temple, the characteristic length is 2 mm, the heat dissipation area is 21.25 mm × 2 mm, and K is
0.52. When the temperature difference is 10 °C, the heat convection resistance becomes Rc = 2.14 × 103
Sensors 2020, 20, 1446 9 of 20
the short side for the horizontal surface and height for the vertical surface. The temperature difference
is obtained by iterating the temperature calculation. The number of iterations used in this paper is
three. As a concrete example to calculate the resistance in the vertical direction in one cell of a temple,
the characteristic length is 2 mm, the heat dissipation area is 21.25 mm × 2 mm, and K is 0.52. When the
temperature difference is 10 ◦ C, the heat convection resistance becomes Rc = 2.14 × 103 K/W. Table 6
summarizes the heat convection resistance values of a temple. The top and bottom of a temple are
connected
Sensors
Sensors2019, with
2019,19,
19, thePEER
xxFOR
FOR bottom
PEER of a temple tip and with the rim, respectively.
REVIEW
REVIEW 99 ofof 20
20
Figure
Figure11. Thermal model of temple (at right side).
Figure 11.
11. Thermal
Thermal model
model of
of temple
temple (at
(at right
right side).
side).
Figure
Figure12.
12.Thermal
Thermalresistance
resistancecircuits
circuitswith
withaaphysical
physicalstructure
structureof
ofthe
thetemple.
temple.
Figure 12. Thermal resistance circuits with a physical structure of the temple.
Table
Table4.4.Heat
Heatconduction
conductionresistance
resistancevalues
valuesof
ofthe
thetemple.
temple.
Variable
Variable
Variable lll(mm)
(mm)
(mm) SS(mm
S(mm
(mm
2)2
)2 ) Thermal
ThermalConductivity
ThermalConductivity(W/mK)
Conductivity (W/mK) Thermal
(W/mK) ThermalResistance
Resistance
Thermal (K/W)
(K/W)
Resistance (K/W)
RR1,1,RR7 7 10.625
10.625 10
10 236
236 4.50
4.50
R1 , R7 10.625 10 236 4.50
RR2 2 11 106.25
106.25 236
236 0.04
0.04
R2 1 106.25 236 0.04
R3 2.5 42.5 236 0.25
R3R3 2.5
2.5 42.5
42.5 236
236 0.25
0.25
RR4,4,RR5,5,RR6 6 21.25
21.25 10
1010 236
236 9.00
9.00
R ,R ,R
4 5 6 21.25 236 9.00
Table
Table5.5.Thermal
Thermalprofile
profilefor
forair.
air.
Table 5. Thermal profile for air.
Parameter
Parameterof ofAir
Air Value
Value
Thermal Parameter of Air Value −2−2
Thermalconductivity
conductivity(W/mK)
(W/mK) 2.625
2.625××1010
Acceleration of
ofgravity
gravity(m/s
Thermal conductivity
Acceleration (m/s 2
(W/mK) )2) 2.625 × 10−2
9.80665
9.80665
Acceleration 2) 9.80665
Thermal
Thermal expansionof
expansion gravity (m/s
coefficient
coefficient (1/K)
(1/K) 3.247
3.247 ××10
10−3−3
Thermal expansion coefficient (1/K) −3
Prandtl
Prandtl number
number 7.268×××10
3.247
7.268 10
10−1−1
Prandtl number 7.268 × 10 −1
Kinematic
Kinematicviscosity
viscosity(m(m/s)
2 2/s) 1.655
1.655××10 −5
10−5
Kinematic viscosity (m 2 /s) 1.655 × 10 −5
KKin
inthe
thevertical
verticaldirection
direction 0.56
0.56
KKin K in the vertical direction 0.56
inthe
thelower
lowerhorizontal
horizontaldirection
direction 0.26
0.26
KKinK in the lower horizontal direction 0.26
inthe
theupper
upperhorizontal
horizontaldirection
direction 0.52
0.52
K in the upper horizontal direction 0.52
Table
Table6.6.Heat
Heatconvection
convectionresistance
resistancevalues
valuesof
ofthe
thetemple.
temple.
Variable
Variable ll(mm)
(mm) SS(mm
(mm2)2) KK Thermal
ThermalResistance
Resistance(K/W)(K/W)
RR8,8,RR1111, ,RR1414, ,RR1717 55 106
106 0.56
0.56 1.0
1.0××10
103 3
RR9,9,RR1212, ,RR1515, ,RR1818 22 42.5
42.5 0.26
0.26 4.29
4.29××10
103 3
RR1010, ,RR1313, ,RR1616, ,RR1919 22 42.5
42.5 0.52
0.52 2.14 × 10
2.14 × 103 3
3.4.
3.4.Thermal
ThermalModel
ModelofofElectronic
ElectronicDevice
DeviceBody
Body
Figure
Figure13
13shows
showsaathermal
thermalmodel
modelaround
aroundaaheating
heatingcomponent,
component,which
whichisiscomposed
composedof
ofthermal
thermal
Sensors 2020, 20, 1446 10 of 20
Table 6. Heat convection resistance values of the temple.
Variable l (mm) S (mm2 ) K Thermal Resistance (K/W)

R8 , R11 , R14 , R17 5 106 0.56 1.0 × 103
R9 , R12 , R15 , R18 2 42.5 0.26 4.29 × 103
R10 , R13 , R16 , R19 2 42.5 0.52 2.14 × 103
3.4. Thermal Model of Electronic Device Body

Figure 13 shows a thermal model around a heating component, which is composed of thermal
resistances for each layer in the vertical direction and a heat source connected in the center of a heat
generation layer. The heat source is given by power dissipated by a heat generating component.
A power consumption value (in Watt) is given to the heat source. A thermal model of an electronic
device body that incorporates five heat generating components is shown in Figure 11. It is a model
Sensors
Sensors 2019,
19, 19, x FOR PEER REVIEW 10 10 of 20
for the2019,
device x FOR
body PEER
of REVIEW
the right side. The device body is composed of heat generating components, of 20
PCBs, copper planes, device body cases, and a projector. Their parts are replaced by thermal cells.
PCBs,
PCBs, copper
copper planes,
planes, device
device body
body cases,
cases, andand a projector.
a projector. Their
Their parts
parts areare replaced
replaced byby thermal
thermal cells.
cells.
ForForexample,
example,
a PCB
a PCB
is is
replaced
replaced
with
with
four
four
thermal
thermal
cells.
cells.
The
The
thermalresistance
thermal
resistancevalues
valuesinineach
eachthermal
thermal
For example, a PCB is replaced with four thermal cells. The thermal resistance values in each thermal
cell are
cellcell
calculated
areare calculated
calculated
from
from fromthe length,
length,
thethe length,thermal
thermal
thermal
conductivity,
conductivity,
conductivity,
and
andandcross-sectional
cross-sectional
cross-sectional
area
area
area
of aacell,
of aofcell,
cell,as
as as
shown
shownin
shown
Equation
in Equation
in Equation (4). The
(4).(4).
The heat
Theheat dissipations
heat dissipations
dissipations are set
areare to
setset four
to four
to four points
points
points at the
at the
at the front,
front,
front, back,
back,
back, top,
top,
top, and and
and bottom
bottom
bottom ofofeach
of each each
heat
heat generating
heat generating
generating component.
component.
component. AAheat
Aheat
heat generating
generating
generating component
component
component represented
represented
represented inFigure
in Figure
in Figure 6 is66modelled
isismodelled
modelled toto
to the thethe
equivalent
equivalent
equivalent thermal
thermal
thermal resistance
resistance circuit
resistancecircuit in
circuit Figure
in in 14.
Figure
Figure The
14.14.
Theheat
The source
heat
heat is
source
source located in
is located
is located the
in in center
thethe with
center
center a current
with
with a a
source
current symbol.
current source
source Five
symbol. heat
symbol. Fivegenerating
Five heat
heat components
generating
generating componentsare arranged
components areare in theinbody
arranged
arranged in the
the case.
body
body case.case.
Figure
Figure
Figure 13.13.
13. Thermal
Thermal
Thermal model
model
model around
around the
thethe
around heating
heating component.
component.
heating component.
Figure
Figure 14. Thermal
14.14.
Figure Thermal model
Thermal
model of of
model ofthe
the the device
device
device body
body (on
(on(on the
thethe right
right
right side).
side).
side).
3.5.3.5. Thermal
Thermal Model
Model of Temple
of Temple TipTip
A temple
A temple tiptip of the
of the glasses
glasses is modelled
is modelled as as
oneone thermal
thermal cell.
cell. Figure
Figure 15 15 shows
shows a thermal
a thermal model
model forfor
a a
temple
temple tiptip of the
of the right
right side.
side. TheThe temple
temple tiptip is expressed
is expressed by by
thethe3D3D equivalent
equivalent resistance
resistance model
model shown
shown
in in Figure
Figure 10a.
10a. TheThe heat
heat dissipations
dissipations to to
an an
airair
areare
setset
to to three
three points
points at the
at the top,
top, bottom,
bottom, andand back
back of of
a a
Sensors 2020, 20, 1446 11 of 20
Figure 14. Thermal model of the device body (on the right side).
3.5.
3.5. Thermal
Thermal Model
Model of
of Temple
Temple Tip
Tip
A
A temple tip of the glasses is modelled
modelled as as one
one thermal
thermalcell.
cell.Figure
Figure1515shows
showsaathermal
thermalmodel
modelfor
fora
atemple
templetip
tipofofthe
theright
rightside.
side.The
Thetemple
templetip
tipisisexpressed
expressed byby the
the 3D
3D equivalent resistance model shown
shown
in
in Figure
Figure 10a. The
The heat
heat dissipations
dissipationsto
toan
anair
airare
areset
settotothree
threepoints
pointsatatthe
thetop,
top,bottom,
bottom,and
andback
backofofa
atemple
templetip.
tip.
Sensors2019,
Sensors 2019,19,
19,x xFOR
FORPEER
PEERREVIEW
REVIEW
Figure 15. Thermal
Figure 15. Thermal model
model of
of temple
temple tip
tip (on
(on the
the right
right side).
side). 1111ofof2020
3.6. Thermal
3.6.Thermal
3.6. Model
Modelofof
ThermalModel Battery
ofBattery
Battery
For
Foraaabattery
For battery model,
batterymodel,
model,the the inner
theinner liquid
innerliquid fluid
liquidfluid and
fluidand outer
andouter frame
outerframe
frameare arerepresented
are representedby
represented by thermal
bythermal resistances.
thermalresistances.
resistances.
Figure
Figure 16
16 shows
shows thermal
thermal resistance
resistance circuits
circuits of
of aa battery
battery structure.
structure. R
R 1 is
is the
the resistance
resistance
Figure 16 shows thermal resistance circuits of a battery structure. R1 is the resistance to connect with
1 to
to connect
connect with
with
a device
aadevice
devicebody,body, R to R are
body,RR222totoRR888are the
arethe resistances
theresistances of a frame,
resistancesofofaaframe, R to R
frame,RR999totoRR1111 are the
arethe
11are resistances
theresistances of
resistancesofofthethe inner
theinner parts,
innerparts,
parts,
and
and RR12 to
to R
R 15 are
are the
the heat
heat convection
convection resistances.
resistances. Figure
Figure 17
17 shows
shows the
the
and R12 to R15 are the heat convection resistances. Figure 17 shows the thermal model of the battery
12 15 thermal
thermal model
model of
of the
the battery
battery
on the
onthe
on right
theright side.
rightside.
side.TheThe number
numberofof
Thenumber thermal
ofthermal
thermalcellscells used
cellsused for
usedforforaaabattery
battery
batteryin in this
inthis paper
thispaper isisseven.
paperis seven.
seven.The The heat
Theheat
heat
dissipations
dissipationsare
dissipations are set
areset to five
settotofive points
fivepoints at the
pointsatatthe front,
thefront, back,
front,back, top,
back,top, bottom,
top,bottom,
bottom,and and
andtiptip of each
tipofofeach cell
eachcell of a battery.
cellofofaabattery.
battery.
(a)
(a) (b)
(b) (c)
(c)
Figure 16.Thermal
Figure Thermal resistancecircuits
circuits withaaphysical
physical structureofofthe
the battery:(a)
(a) zydirection,
direction, (b)zx
zx
Figure16.
16. Thermalresistance
resistance circuitswith
with a physicalstructure
structure of thebattery:
battery: (a)zyzy direction,(b)
(b) zx
direction, and(c)
direction, (c) xydirection.
direction.
direction,and
and (c)xy
xy direction.
Figure 17.
Figure17.
Figure Thermal
17.Thermal model
modelofof
Thermalmodel the
ofthe battery
thebattery (on
battery(on the
(onthe right
theright side).
rightside).
side).
3.7.Thermal
3.7. ThermalModel
ModelofofLens
Lensand
andRim
Rim
AAlens
lensisisrepresented
representedbybyaatwo-dimensional
two-dimensionalthermal
thermalresistance
resistancemodel,
model,andandthe
therim
rimofofthe
thelens
lens
frame is represented by a one-dimensional thermal resistance model. The lens and rim
frame is represented by a one-dimensional thermal resistance model. The lens and rim are divided are divided
intothree
into threeparts:
parts:lens,
lens,upper
upperrim,
rim,and
andlower
lowerrim.
rim.Three
Threethermal
thermalcells
cellsare
areused.
used.Figure
Figure1818shows
showsthethe
model of the lens and rim of the right side. The heat dissipations are set to eight points at
model of the lens and rim of the right side. The heat dissipations are set to eight points at the frontthe front
Sensors 2020, 20, 1446 12 of 20
3.7. Thermal Model of Lens and Rim

A lens is represented by a two-dimensional thermal resistance model, and the rim of the lens
frame is represented by a one-dimensional thermal resistance model. The lens and rim are divided
into three parts: lens, upper rim, and lower rim. Three thermal cells are used. Figure 18 shows the
model of the lens and rim of the right side. The heat dissipations are set to eight points at the front
and back of a lens and the upper front, back, and top and the lower front, back, and bottom of a rim.
The temperature
Sensors 2019, 19, x FORofPEER
a nose pad on the nose is represented by T109 . The node (T109 ) is connected
REVIEW 12 with
of 20
a Sensors
face part.
2019, 19, x FOR PEER REVIEW 12 of 20
Figure 18. Thermal model of the lens and rim (on the right side).
Figure Thermal
18. Thermal model of thelens
lens and rim
rim (on the right side).
Figure 18. Thermalmodel
Figure18. modelofofthe
the lensand
and rim(on
(onthe
theright
rightside).
side).
3.8. Thermal
3.8. Thermal Model of the
ModelModel
3.8. Thermal of theofFace
Face PartPart
Part
the Face
3.8. Thermal Model of the Face Part
FigureFigure
Figure 19 shows
19 shows aa thermal
19 shows thermal
a thermalmodel
modelmodel ofof
of aa face
aface for
facefor smart
forsmart glasses.
smart glasses. Theface
glasses. The
The facepart
face part is expressed
is is
part expressed
expressed by one
by one
by one
thermal
thermal cell. The
Figure
thermal
cell. The
19cell. center
shows node
anode
The center
center is set
thermal
node
is set to 36.6
ismodel
set
to 36.6
to of◦°C.
36.6aC.°C.RR
face
R 1 1and
for RR22 represent
andsmart glasses.
represent the
the thermal
The resistances
face resistances
thermal part of the
is expressed
of the byface
face one
1 and R2 represent the thermal resistances of the face
skin. The
thermal
skin.side
cell.
The and
The
side bottom
center
and of
node
bottom the
ofis face
set
the topart
face 36.6
partare
°C.
are connected
R 1 and R2with
connected the
represent
with the temple
the
temple tip
thermal
tip
skin. The side and bottom of the face part are connected with the temple tip nose pads, respectively. nose
nose pads, respectively.
resistances
pads, of the
respectively. face
skin. The side and bottom of the face part are connected with the temple tip nose pads, respectively.
Figure 19. Thermal model of the face part.

Figure 19. Thermal
Figure 19. Thermal model
model of
of the
the face
face part.
part.
4. Experimental Results Figure 19. Thermal model of the face part.
4. Experimental Results
4. Experimental Results
We first verify the validity of our thermal model. Figure 20 shows a histogram in temperature
We first verify
4. Experimental
differences the validity
Results
between of our thermal
results obtained by our model.
model and Figure 20 shows
a thermal solvera [62].
histogram in temperature
The absolute errors
We first
differences verify
between the validity
results of ourby
obtained thermal
our model.
model and Figure
a 20 shows
thermal solvera histogram
[62]. The in temperature
absolute errors
were almost within a few degrees. This is the result under the conditions that five heat generating
differences
We
were almost between
first verify
within results
the obtained
validity of by
our our
thermal model and
model. a thermal
Figure 20 solver
shows a [62]. The
histogram absolute
in errors
temperature
components areaplaced
few degrees. This
at one side is the
only and result under
the power the conditions
consumptions that five
are uniform heat
and 5W generating
in the
were almost
differences
components within
between
total. are
a results
placed few degrees.
at one obtained
side Thisand
only byis our
the result under
the model
power and a the conditions
thermal
consumptions solver
are that
[62].five
uniform Theheat
and generating
5 absolute
W in the errors
total.
components
were almostare placed
within at one
a few side only
degrees. This and theresult
is the power consumptions
under are uniform
the conditions that fiveandheat5generating
W in the
total.
components are placed at one side only and the power consumptions are uniform and 5 W in the
total.
Figure
Figure 20. Error
20. Error distribution
distribution forforallallnodes
nodesof
of the
the thermal
thermalnetwork
networkmodel.
model.
Next, we perform thermal analysis using the proposed model. Some countermeasures to reduce
temperaturesFigure
are shown in this
20. Error section. Itfor
distribution is all
important
nodes ofto reduce
the thenetwork
thermal surface model.
temperature of smart
glasses for more physical health safety and comfortable use.
Figure 20. Error distribution for all nodes of the thermal network model.
Next,Figure 21 illustrates
we perform thermalthatanalysis
heat sources
using (a)the
were placed onmodel.
proposed one side only countermeasures
Some and (b) were divided
tointo
reduce
both sides. Those are examples of conditions in which the total power consumption is 5 W and the
Sensors 2020, 20, 1446 13 of 20
Next, we perform thermal analysis using the proposed model. Some countermeasures to reduce
temperatures are shown in this section. It is important to reduce the surface temperature of smart
glasses for more physical health safety and comfortable use.
Figure 21 illustrates that heat sources (a) were placed on one side only and (b) were divided into
Sensors 2019, 19, x FOR PEER areREVIEW 13 of 20the
Sensors sides.
both 2019, 19,Those
x FOR PEER examples
REVIEW of conditions in which the total power consumption is 5 W and 13 of 20
power consumption is uniform. Figure 22 shows differences in temperatures when the device body
waswas
was setsettoto
set (a)(a)
to one
one side only
side only
onlyand
and
and toto(b)
to (b)both
(b) both
both sides.
sides.InIn
sides. Inthe
the
thefigure,
figure,
figure, “HG”
“HG”
“HG” means
means
means the
the
thehighest
highest
highest temperature
temperature
temperature in
ininheat
heat
heat generating
generating
generating components,
components,
components, “DB”
“DB” means
“DB” means the temperature
the temperature
means the temperature on
on theon the
surface surface of
of the device
the surface the device
of thebody, device body,
“Temple”
body,
“Temple”
means the
“Temple” means
means the
temperature
thetemperature
temperature inin
in the center the ofcenter
the the ofof
the
temple
center the temple
frame,
temple frame,
“Ear” “Ear”
means
frame, “Ear” means
the the
temperature
means thetemperature ofof
of the frame
temperature
the
theframe
surface
frame surface
where
surface where
the where the
glassesthe glasses
frame frame
is onframe
glasses is
the ear, on the
andthe
is on ear,
“Nose” and
ear, and “Nose”
means means the
the temperature
“Nose” temperature
of a nose pad.
means the temperature of a nose
of In their
a nose
pad.
pad. In their
parts,Inthe theirparts,
temperaturethe temperature
parts, the of the “Ear” and
temperature of the
of the “Ear”
“Nose” and
“Ear”areand “Nose”
very
“Nose” are
important very
are very important
since since
they directly
important they
sincetouch directly
the skin.
they directly
touch
For the
touch the skin.
example, skin.For
under
For example,
example, under
the condition
under the
ofthe condition
the ofof
total power
condition the total
consumption
the totalpower
power consumption
of 5 W, when the
consumption ofof 5device
W,
5 W, when
bodythe
when was
the
device
set to body
one was
side set
only,to one
the side only,
temperatures the temperatures
on the back side on of the
theback side
temple
device body was set to one side only, the temperatures on the back side of the temple and the ear are of
and the
the temple
ear are and
60.6 the
and ear are
51.0 ◦ C,
60.6 and 51.0
respectively.
60.6 °C,
and 51.0 °C, respectively.
On respectively.
the other hand,On the
On when other
the other hand,
the hand, when
devicewhen the
bodythe device
wasdevice body
set tobody was
both was set
sides, to
setthe both
to temple sides,
both sides, the
and theear
temple and
temperatures ear temperatures
were 48.6 and were
43.6 ◦48.6
C, and 43.6
respectively. °C, Byrespectively.
distributing
temple and ear temperatures were 48.6 and 43.6 °C, respectively. By distributing the device body Bythedistributing
device body the device
(heat body
generating
(heat
(heat generating
components),
generating components),
the temperaturethe
components), thetemperature
rising to the ambient
temperature rising totothe
temperature
rising theambient
of 25 ◦temperature
ambient Ctemperature
can be reduced ofof2525by°C°C can
canbe
33.6% and
be
reduced
29.4%. The
reduced by 33.6% and
by difference 29.4%.
33.6% andof29.4%. The
the earThe difference
temperature
differencefromof the
of the ear
the ear temperature
coretemperature from
temperaturefrom the
of 36.6 core
◦
theCcore temperature
is reduced
temperature ofof
by 51.4%.
36.6
As°C
36.6 seen
°Cis is
reduced
from
reduced byby
Figure 51.4%.
22, the As
51.4%. seen
temperature
As seen from
from Figure
growths
Figure 22,
can22,the
be
the temperature
significantly
temperature growths
suppressed
growths can bybedistributing
can significantly
be significantlyheat
suppressed by
sources regardless
suppressed distributing heat
of total power
by distributing sources regardless
consumption.
heat sources of total power consumption.
regardless of total power consumption.
(a)(a) (b)(b)
Figure 21. Illustration of heat sources: (a) one side and (b) both sides (example of total power of 5 W).
Figure
Figure 21.21.Illustration
Illustrationofof heat
heat sources:
sources: (a)(a) one
one side
side and
and (b)(b) both
both sides
sides (example
(example of of total
total power
power of of 5 W).
5 W).
(a)(a) (b)(b)
Figure 22.22.
Figure Temperature differences
Temperature of of
differences heat sources:
heat (a)(a)
sources: oneone
side and
side (b)(b)
and both sides.
both sides.
Figure 22. Temperature differences of heat sources: (a) one side and (b) both sides.
Figure 23 illustrates
Figure the conditions in which power consumptions are not uniform and heat
Figure2323illustrates
illustratesthetheconditions
conditionsininwhich
whichpower
powerconsumptions
consumptionsare arenot
notuniform
uniformandandheat
heat
sources
sources were
were placed
placed at
atat
oneone side
side only.
only. Figure
Figure 24
2424 shows
shows temperature
temperature results
results at
atat each
each part
part when
when power
power
sources were placed one side only. Figure shows temperature results each part when power
consumptions
consumptions are are uniform,
uniform, in in descending
descending order,
order, andandin in ascending
ascending order.
order. The
The temperatures
temperatures of of “Ear”
“Ear”
consumptions are uniform, in descending order, and in ascending order. The temperatures of “Ear”
◦ C (temperature differences from the core temperature of 36.6 ◦ C were 14.4,
were
were 51.0,
51.0, 49.4,
49.4, and and 52.7
52.7 °C°C(temperature differences from the core temperature ofof
36.6 °C°C
were 14.4,
were 51.0, 49.4, and 52.7 (temperature differences from the core temperature
◦ C) for uniform, descending order, and ascending order. The descending order can reduce
36.6 were 14.4,
12.8,
12.8, and16.1
16.1°C)
12.8, and 16.1 °C) for uniform, descending order, and ascending order. The descending ordercan
and for uniform, descending order, and ascending order. The descending order can
a temperature
reduce a rise byrise
temperature 11.1%by compared
11.1% with uniform
compared with power consumptions.
uniform power Therefore,Therefore,
consumptions. the temperature
the
reduce a temperature rise by 11.1% compared with uniform power consumptions. Therefore, the
of the part near the
temperature ear that directly touches the skin can be reduced when power consumptions of
temperatureofofthe thepart
partnear
nearthe theear
earthat
thatdirectly
directlytouches
touchesthe theskin
skincan
canbebereduced
reducedwhenwhenpower
power
heat generating
consumptions of components
heat generating arecomponents
placed in descending
are placed order.
in descending order.
consumptions of heat generating components are placed in descending order.
consumptions are uniform, in descending order, and in ascending order. The temperatures of “Ear”
were 51.0, 49.4, and 52.7 °C (temperature differences from the core temperature of 36.6 °C were 14.4,
12.8, and 16.1 °C) for uniform, descending order, and ascending order. The descending order can
reduce a temperature rise by 11.1% compared with uniform power consumptions. Therefore, the
temperature of the part near the ear that directly touches the skin can be reduced when power
Sensors 2020, 20, 1446 14 of 20
consumptions of heat generating components are placed in descending order.

Figure Device
23. 23.
Figure body
Device with
body power
with consumptions
power in descending
consumptions order
in descending at one
order side.
at one side.
Figure 24. Effect of frame materials on temperature.
Figure 24. Effect of frame materials on temperature.

Figure 25 illustrates the position
Figure onof the
24. Effect frame temple in on
materials thetemperature.
x direction. Figure 26 shows the
temperatures at each position when power consumptions are uniform in descending order and in
Figure 25 illustrates the position on the temple in the x direction. Figure 26 shows the
Figure
Figure
ascending 25
25illustrates
order. thethe
illustrates
For example, position onmm,
position
at 55.8 theontemple in the x in
the temple
temperatures direction.
forthe Figuredescending
26 shows
x direction.
a uniform, Figurethe 26temperatures
shows
order, the
and an
temperatures at each position when power consumptions are uniform in descending order and in
at each position
temperatures
ascending order when
atare
each power
58.6, 56.1, consumptions
position when
and 61.4power
°C. The are uniform in order
consumptions
descending descending
are uniform order
inand
thatinitascending
in descending
is superior canorder order.
and
reduce thein
ascending order. For example, at 55.8 mm, temperatures for a uniform, descending order, and an
For example,
ascending
temperature at 55.8
order.
near Formm,
the temperatures
example,
ear. for a temperatures
at 55.8 mm, uniform, descending order, and
for a uniform, an ascending
descending order
order, and are
an
ascending order are◦ 58.6, 56.1, and 61.4 °C. The descending order is superior in that it can reduce the
58.6, 56.1, and 61.4 C. The descending order is superior in that it can reduce the temperature
ascending order are 58.6, 56.1, and 61.4 °C. The descending order is superior in that it can reduce the near
temperature near the ear.
the ear.
temperature near the ear.
Figure 25. Illustration of the position on the temple.

Figure
Figure26.
26.Difference
Differenceinintemperatures
temperaturesdue
duetotoaaposition
positionon
onthe
thetemple.
temple.
Figure 26. Difference in temperatures due to a position on the temple.

Figure27
Figure 27illustrates
illustrates differences
Figuredifferences
26. Differenceinininthe
the frame
frame materials,
materials,
temperatures due towhere where (a) (a)
a position is is the
onthe
the all-Al
all-Al
temple. frame,frame,
(b) is(b)
theisall-
the
all-CA
CA frame,
frame, andand (c)the
(c) is is the
CACA temples
temples and and temple
temple tips
tips and andAlAl rims.Figure
rims. Figure2828depicts
depictsthat thatAlAlgreatly
greatly
Figure 27 illustrates differences in the frame materials, where (a) is the all-Al frame, (b) is the all-
reduces
reduces temperatures
Figure 27 illustrates
temperatures of“HG,”
of “HG,” “DB,”
differences
“DB,” inand
and “Temple,”
the“Temple,”
frame whereas
materials,
whereas where
CACAextremely
extremely
(a) raises
is the all-Al
raises thetemperatures.
frame,
the temperatures.
(b) is the all-
CA frame, and (c) is the CA temples and temple tips and Al rims. Figure 28 depicts that Al greatly
The
The reasonis
CA reason
frame, isthermal
andthermal conductivity
(c) is the CA temples
conductivity ofAl
of Alisistemple
and muchhigher
much higher
tips and than thatof
Althat
than rims. ofFigure
CA.However,
CA. However,
28 depicts the
thethattemperature
Al greatly
temperature
reduces temperatures of “HG,” ◦ C) when “DB,” and “Temple,” whereas CA extremely ◦ C) when raises the temperatures.
of “Ear” is highest (51.0 °C) when Al was used but lowest (41.6 °C) when Al and CA were used.used.
of “Ear”
reduces is highest
temperatures (51.0
of “HG,” “DB,” Al was
and used but
“Temple,” lowest
whereas (41.6
CA extremely Al
raisesand the CA were
temperatures.The
The reason is thermal conductivity of Al is much higher than ◦ Cthat of CA. However, the temperature
◦ C. The
The temperature
temperature differences
reason isdifferences
thermal fromfromthe the
conductivity corecore
of Al temperature
is much higher
temperature of 36.6
of 36.6 than were
that
°C were of14.4
14.4CA.andand 5.0°C.
However,
5.0 combination
thecombination
The temperature
of “Ear” is highest (51.0 °C) when Al was used but lowest (41.6 °C) when Al and CA were used. The
can
can suppress
of “Ear”
suppress aatemperature
is highesttemperature
(51.0 °C) riseriseby
when by
Al 65.3%
was used
65.3% compared withAl
but lowest
compared with Alonly.
(41.6only. Forparts
°C)For
when parts directly
Al and
directly contacting
CA were used. the
contacting the
The
temperature differences from the core temperature of 36.6 °C were 14.4 and 5.0 °C. The combination
temperature
body, we found differences from the core
that a combination of CA temperature
temples and of 36.6
temple°C tips
wereand 14.4Aland
rims5.0is°C.
theThebest.combination
The result
can suppress a temperature rise by 65.3% compared with Al only. For parts directly contacting the
can suppress
obtained a temperatureofrise
by a combination by 65.3%
Al and CA can compared with
satisfy the Al only.
limit For parts
temperature (43directly
°C), which contacting
does not the
body, we found that a combination of CA temples and temple tips and Al rims is the best. The result
body,awe
cause low found that a combination
temperature burn [32]. of CA temples
Therefore, the and
methodtemplewilltipsbe and Al rims
effective foristhethephysical
best. Thehealth
result
obtained by a combination of Al and CA can satisfy the limit temperature (43 °C), which does not
obtained
safety and by a combination
comfortable use ofoffuture
Al and CA glasses.
smart can satisfy the limit temperature (43 °C), which does not
cause a low temperature burn [32]. Therefore, the method will be effective for the physical health
Sensors 2020, 20, 1446 15 of 20
body, we found that a combination of CA temples and temple tips and Al rims is the best. The result
obtained by a combination of Al and CA can satisfy the limit temperature (43 ◦ C), which does not
Sensors2019,
safety
Sensors 2019,19,
and 19,xxFOR
FORPEER
PEERuse
comfortable REVIEW
of future smart glasses.
REVIEW 15ofof20
15 20
(a)
(a) (b)
(b) (c)
(c)
Figure27.
Figure
Figure 27.Illustration
27. Illustrationof
Illustration offrame
of framematerials:
frame materials:(a)
materials: (a)Al,
(a) Al,(b)
Al, (b)CA,
(b) CA,and
CA, and(c)
and (c)CA
(c) CAfor
CA forthe
for thetemple
the templeand
temple andtemple
and templetip
temple tipand
tip and
and
Alfor
Al forothers.
others.
Figure 28.Effect
Figure Effect offrame
frame materialson
on temperature.
Figure 28.
28. Effect of
of frame materials
materials on temperature.
temperature.
5.5.Discussions
5. Discussions
Discussions
5.1. Validity
5.1.Validity
5.1. of
Validityof Thermal
ofThermal Network
ThermalNetwork Model
NetworkModel
Model
The accuracy
Theaccuracy
The accuracyof of the
ofthe proposed
theproposed thermal
proposedthermal network
thermalnetwork model
networkmodel
modelwas was verified
wasverified
verifiedby by
byaaafinite
finite element
finiteelement method
elementmethodmethod
(FEM)-based
(FEM)-based 3D
3D thermal
thermal solver.
solver. Figure
Figure 20
20 in
in Section
Section 44 shows
shows the
the result
result
(FEM)-based 3D thermal solver. Figure 20 in Section 4 shows the result of errors at all nodes when of
of errors
errors at
at all
all nodes
nodes when
when
power consumption
powerconsumption
power consumptionwas was
was555W.W. Figure
W.Figure
Figure29 29 shows
29shows temperature
showstemperature distributions
temperaturedistributions obtained
distributionsobtained
obtainedby by
byaaasolver
solver when
solverwhen
when
power
power consumption
consumption varied. Figure
varied. 30
Figure compares
30 the
compares model
the and a
model
power consumption varied. Figure 30 compares the model and a commercial solver in the commercial
and a solver
commercial in the temperature
solver in the
at the main nodes
temperatureatatthe
temperature when
themain power
mainnodes consumptions
nodeswhenwhenpower were
powerconsumptions 1, 5,
consumptionswereand 10 W. We
were1,1,5,5,and can
and10 see
10W. that
W.We differences
Wecan canseeseethatin
that
temperature
differencesin
differences between
in temperature
temperature the model
betweenandthe
between solver
the model
model hardly
andoccur.
and solverhardly
solver hardlyoccur.
occur.
Simulation-based
Simulation-based design
design and
and optimization
optimization of
ofan
an accelerometer
Simulation-based design and optimization of an accelerometer subjectaccelerometer subject
subjecttoto thermal
tothermal
thermalloadsloads
loadshashas been
hasbeen
been
presented [63].
presented[63].
presented As
[63].As verification
Asverification
verificationof of thermal
ofthermal simulations,
thermalsimulations, comparisons
simulations,comparisons
comparisonsof of simulations
ofsimulations
simulationsand and measurements
andmeasurements
measurements
in
in smartphones,
smartphones, aa power
power semiconductor
semiconductor device,
device, and
and aa tablet
tablet device
device
in smartphones, a power semiconductor device, and a tablet device have been reported [60,64–67].have
have been
been reported
reported [60,64–67].
The
The simulation
simulation results
results agree
agree with
withthe measurement
the measurement results. This
results. means
This that
means
The simulation results agree with the measurement results. This means that if data to be inputted if
thatdataif to
databe toinputted
be into
inputted
ainto
solver
into are near
aa solver
solver are real
are neardata,
near thedata,
real
real model
data, corresponding
the
the to simulation
model corresponding
model corresponding to results
to simulationcan reproduce
simulation results can
results can temperature
reproduce
reproduce
characteristics
temperature of real products.
characteristics of Thus,
real the verification
products. Thus, of the
the proposed
verification
temperature characteristics of real products. Thus, the verification of the proposed model model
of by
the measurements
proposed modelis our
by
by
future plan.
measurementsisisour
measurements ourfuture
futureplan.
plan.
(a)
(a) (b)
(b) (c)
(c)
Figure29.
Figure 29.Temperature
Temperaturedistributions
distributionswhen
whenpower
powerconsumptions
consumptionsare
are(a)
(a)11W,
W,(b)
(b)55W,
W,and
and(c)
(c)10
10W.
W.
presented [63]. As verification of thermal simulations, comparisons of simulations and measurements
in smartphones, a power semiconductor device, and a tablet device have been reported [60,64–67].
The simulation results agree with the measurement results. This means that if data to be inputted
into a solver are near real data, the model corresponding to simulation results can reproduce
temperature characteristics of real products. Thus, the verification of the proposed model
Sensors 2020, 20, 1446 16 ofby
20
measurements is our future plan.
(a) (b) (c)

Sensors 2019, 19, x29.
Figure
Figure FOR
29. PEER REVIEW
Temperature
Temperaturedistributions
distributionswhen
whenpower
powerconsumptions
consumptionsare
are (a) W, (b) 5 W, and (c) 1016
(a) 11 W, W.of 20
W.
Figure 30.
Figure 30. Comparison of results by the model with results
results given
given by
by the
the solver.
solver.
This
This paper
paper presents
presents a thermal
a thermal network
network model
model inin a steady-state
a steady-state condition
condition forfor
thethe entire
entire thermal
thermal
networkofofsmart
network smart glasses. There
Therearearetwo
twotypes of thermal
types of thermalanalysis: steady-state
analysis: (or static)
steady-state and transient
(or static) and
(or dynamic).
transient In this work,
(or dynamic). In thiswe are interested
work, in the temperatures
we are interested in the steady
in the temperatures in thestate
steadyrather
statethan ones
rather
in transient
than time since
ones in transient timesmart
sinceglasses
smart are designed
glasses to be worn
are designed to befor a long
worn for time.
a longSteady-state thermal
time. Steady-state
simulation
thermal resultsresults
simulation have been
havepresented [60,64–67].
been presented [60,64–67].
InIngeneral,
general, advanced
advanced systems
systems operate
operate in in
thethe range
range of of
thethe
nsnsto to because
µs-orderbecause
μs-order ofofcircuit
circuit
frequencies
frequencies of of
MHzMHz toto GHz-order.
GHz-order. Power
Power consumptions
consumptions also
also change
change within
within the
the same
same range.
range. OnOn thethe
other
other hand,
hand, timeuntil
time untilthe
thetemperature
temperatureofofeach
eachnode
nodeof ofsmart
smart glasses
glasses used
used in this work is is stabilized
stabilized in
in in
in the range of thethe ms
msto tomin-order.
min-order.In Insteady-state
steady-statethermal
thermalanalysis,
analysis,a aconstant
constant power
power (e.g.,
(e.g., average
average
power)
power) cancan
bebe used
used [60,66,67].
[60,66,67].
5.2.
5.2. Advantages
Advantages of Thermal
of Thermal Network
Network Model
Model
TheThe previous
previous works
works related
related to to this
this paper
paper andandthethe advantages
advantages of of
thethe proposed
proposed thermal
thermal network
network
model are discussed in this sub-section. There have been several technical
model are discussed in this sub-section. There have been several technical reports of thermal reports of thermal modeling
for electrical
modeling and electric
for electrical andequipment [62,65,67].[62,65,67].
electric equipment These methods
These can be used
methods canforbethermal
used forsimulations.
thermal
The thermal
simulations. Theresistance
thermal network
resistanceisnetwork
commonly composed composed
is commonly of thermalofcells with cells
thermal thermalwithconduction
thermal
resistances, convection heat transfer coefficients, and heat sources. However,
conduction resistances, convection heat transfer coefficients, and heat sources. However, the thermal the thermal resistance
networknetwork
resistance is specialized for smartfor
is specialized glasses
smartand is very
glasses andsimple
is verybecause
simple the number
because the of elements
number is reduced.
of elements
is To the best
reduced. Toofthe
our knowledge,
best no technical
of our knowledge, report ofreport
no technical thermal models and
of thermal modelscountermeasures
and countermeasuresfor smart
glasses exists. Moreover, thermal simulations of smart glasses have hardly
for smart glasses exists. Moreover, thermal simulations of smart glasses have hardly been reported. been reported.
TheThethermal
thermalnetwork
networkmodel model was
was implemented
implementedininMicrosoft
MicrosoftVisual
Visual Basic.
Basic.TheThe
advantages
advantages of using
of
using the thermal network model are speed and convenience. The former speed is, for an example,the
the thermal network model are speed and convenience. The former speed is, for an example, that
runtime
that taken taken
the runtime by using the thermal
by using network
the thermal model
network was about
model 11 sec,
was about 11 whereas
sec, whereasthat that
taken by using
taken by
a thermal
using solversolver
a thermal was about 337 sec.337
was about The model
sec. The is, thus, is,
model more than
thus, 30 times
more than faster.
30 times All experiments
faster. All
were run on
experiments an Intel
were run onXeon CPUXeon
an Intel X5687CPU withX5687
3.6 GHz.
with The latterThe
3.6 GHz. (convenience) is that theismodel
latter (convenience) that thecan
easily estimate effects of structures and materials of parts on temperature.
model can easily estimate effects of structures and materials of parts on temperature. Moreover, by Moreover, by using the
model,
using the designers can optimize
model, designers various various
can optimize parameters of futureofsmart
parameters futureglasses.
smart glasses.
6. Conclusions
6. Conclusions
In this paper, we have presented a thermal network model for thermal designs of future smart
In this paper, we have presented a thermal network model for thermal designs of future smart
glasses. Thermal countermeasures for ensuring more safety and comfort have also been presented.
glasses. Thermal countermeasures for ensuring more safety and comfort have also been presented.
Thermal analysis using the model demonstrates that plastic should be used for a part of the temples
and temple tips for hanging on the ear. Al should be used for the other parts of the frame, and the
device body should be located on the lens side and divided into both sides as much as possible.
Author Contributions: Investigation and data curation, K.M., A.K., and T.K. Validation and methodology, K.M.
Sensors 2020, 20, 1446 17 of 20
Thermal analysis using the model demonstrates that plastic should be used for a part of the temples
and temple tips for hanging on the ear. Al should be used for the other parts of the frame, and the
device body should be located on the lens side and divided into both sides as much as possible.
Author Contributions: Investigation and data curation, K.M., A.K., and T.K. Validation and methodology,
K.M. and A.K. Writing—review and editing, A.K., K.M., and T.K. Supervision, A.K. and T.K. Project administration,
A.K. All authors have read and agreed to the published version of the manuscript.
Acknowledgments: The JSPS KAKENHI Grant Number JP17K00070 supported this work.
Conflicts of Interest: The authors declare no conflict of interest.
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2. Physical Structural Model of Smart Glasses

2.1. Overview of Smart Glasses

Figure 1. Overview of smart glasses used in this paper.

(a) (b) (c)

Sensors 2019, 19, x FOR PEER REVIEW 5 of 20

Chip substrate Package

Figure 5. Liquid crystal on the silicon (LCOS) device.

Component Thermal Conductivity (W/mK) x, y, z (mm)

Figure 6. Simple model ofofthe heat generatingcomponent.

2.4. Structures and Materials

3.1. Block Diagram for Entire Thermal Network

Figure 9. Block diagram for entire thermal network of smart glasses.

Figure 9. Block diagram for entire thermal network of smart glasses.

3.2. BasicFor a thermal

3.2. Basic Thermal Resistance Model

Table 6. Heat convection resistance values of the temple.

Variable l (mm) S (mm2 ) K Thermal Resistance (K/W)

3.4. Thermal Model of Electronic Device Body

3.7. Thermal Model of Lens and Rim

Figure 19. Thermal model of the face part.

Sensors 2019, 19, x FOR PEER REVIEW 14 of 20

Sensors 2019, 19, x FOR PEER REVIEW 14 of 20

Figure 24. Effect of frame materials on temperature.

Figure 24. Effect of frame materials on temperature.

Figure 25. Illustration of the position on the temple.

Figure 26. Difference in temperatures due to a position on the temple.

(a) (b) (c)

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