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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi


Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Datasheet.Live
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.

Notes regarding these materials


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Technology Corporation product best suited to the customer's application; they do not convey any
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Corporation or a third party.
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circuit application examples contained in these materials.
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or system that is used under circumstances in which human life is potentially at stake. Please contact
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contained therein.
2SC1213A(K)
Silicon NPN Epitaxial

ADE-208-1049 (Z)
1st. Edition
Mar. 2001

Application

• Low frequency amplifier


• Medium speed switching

Outline

TO-92 (1)

1. Emitter
2. Collector
3. Base

3
2
1
2SC1213A (K)

Absolute Maximum Ratings (Ta = 25°C)


Item Symbol Ratings Unit
Collector to base voltage VCBO 50 V
Collector to emitter voltage VCEO 50 V
Emitter to base voltage VEBO 4 V
Collector current IC 500 mA
Collector power dissipation PC 400 mW
Junction temperature Tj 150 °C
Storage temperature Tstg –55 to +150 °C

Electrical Characteristics (Ta = 25°C)


Item Symbol Min Typ Max Unit Test conditions
Collector to base breakdown V(BR)CBO 50 — — V I C = 10 µA, IE = 0
voltage
Collector to emitter breakdown V(BR)CEO 50 — — V I C = 1.0 mA, RBE =
voltage
Emitter to base breakdown V(BR)EBO 4 — — V I E = 10 µA, IC = 0
voltage
Collector cutoff current I CBO — — 0.5 µA VCB = 20 V, IE = 0
1
DC current transfer ratio hFE* 60 — 320 VCE = 3 V, IC = 10 mA
hFE 10 — — VCE = 3 V, IC = 500 mA*2
Base to emitter voltage VBE 0.64 — V VCE = 3 V, IC = 10 mA
Collector to emitter saturation VCE(sat) — 0.12 0.6 V I C = 150 mA, IB = 15 mA*2
voltage
Base to emitter satruation VBE(sat) — 0.83 1.2 V I C = 150 mA, IB = 15 mA*2
voltage
Collector output capacitance Cob — 7.0 — pF VCB = 10 V, IE = 0, f = 1 MHz
Gain bandwidth product fT — 120 — MHz VCE = 3 V, IC = 10 mA
Turn on time t on — 0.25 — µS VCC = 10.3 V
I C = 10 IB1 = –10 IB2 = 10 mA
Turn off time t off — 0.85 — µS
Storage time t stg — 0.4 — µS VCC = 5 V
I C = IB1 = –IB2 = 20 mA
Notes: 1. The 2SC1213A(K) is grouped by h FE as follows.
2. Pulse test
B C D
60 to 120 100 to 200 160 to 320

2
2SC1213A (K)

Switching Time Test Circuit Switching Time Test Circuit

ton, toff Test Circuit tstg Test Circuit


D.U.T. CRT D.U.T. CRT
6k 1.0 215
1k 240
6k
50 0.002 0.002 200 100
P.G. 0.002 0.002
P.G. – + – + tr ≤ 5 ns + – – +
tr, tf ≤ 15 ns –6 V 50 50 10.3 V
PW ≥ 5 µs 50 50
7V 5V
PW ≥ 5 µs duty ratio ≤ 2%
Unit R : Ω Unit R : Ω
duty ratio ≤ 10% C : µF C:F

Response Waveform Response Waveform

13 V 90% 0 10%
Input Input
0 10% 9V

td 90% 90%
Output Output
10%
0 0 10%
ton toff tstg

Typical Output Characteristics (1)


500 40 30
20
Maximum Collector Dissipation Curve 10
Collector Power Dissipation PC (mW)

8
Collector Current IC (mA)

500 400 6
5
400 4
300 3
300
200 2
200 PC =
1 mA 400
mW
100
100
IB = 0
0 50 100 150 0 1 2 3 4 5
Ambient Temperature Ta (°C) Collector to Emitter Voltage VCE (V)

3
2SC1213A (K)
Typical Output Characteristics (2) Typical Transfer Characteristics
100 30
0.9 VCE = 3 V
0.8
Collector Current IC (mA)

Collector Current IC (mA)


80
0.7 10

60 0.6

Ta = 75°C
0.5 3

25
–25
40 0.4
0.3 1.0
20 0.2
PC = 400
0.1 mA mW
IB = 0
0.3
0 10 20 30 40 50 0 0.2 0.4 0.6 0.8 1.0 1.2
Collector to Emitter Voltage VCE (V) Base to Emitter Voltage VBE (V)

DC Current Transfer Ratio vs.


Collector Current
Collector Cutoff Current vs. 140
Collector to Base Voltage VCE = 3 V
DC Current Transfer Ratio hFE

100 120
100 75
Collector Current ICBO (nA)

30 100 50
75
10 25
80 0
25°
C
3 50 –
60 Ta=
1.0
Ta = 25°C
40
0.3

0.1 20

0.03 0
0 10 20 30 40 50 2 5 10 20 50 100 200 500
Collector to Base Voltage VCB (V) Collector Current IC (mA)

4
2SC1213A (K)

Collector to Emitter Saturation Base to Emitter Saturation Voltage vs.


Collector to Emitter Saturation Voltage VCE(sat) (V)

Base to Emitter Saturation Voltage VBE(sat) (V)


Voltage vs. Collector Current Collector Current
0.32 1.1
IC = 10 IB IC = 10 IB
0.28 1.0 Pulse
0.24
0.9
0.20
0.8
0.16
0.7 –25
0.12 0
0.6 25
0.08 50 °C
5
0.5 a =7
0.04 T

0 0.4
0.1 0.3 1.0 3 10 30 100 300 1,000 0.1 0.2 0.5 1.0 2 5 10 20 50 100 200 500
Collector Current IC (mA) Collector Current IC (mA)

Input And Output Capacitance vs. Voltage Gain Bandwidth Product vs.
70 Collector Current
Collector Output Capacitance Cob (pF)

280
Emitter input Capacitance Cib (pF)

f = 1 MHz
60 VCE = 3 V
Gain Bandwidth Product fT (MHz)

240
50
Cib(IC = 0) 200
40
160
30
120
20
Cob(IE = 0) 80
10
40
0
0.1 0.3 1.0 3 10 30 0
Collector to Base Voltage VCB (V) 2 5 10 20 50 100 200 500
Emitter to Base Voltage VEB (V) Collector Current IC (mA)

5
2SC1213A (K)
Switching Time vs. Collector Current
1,000

500 toff

Switching Time t (ns)


tstg
200

100

50
ton

20 VCC = 10.3 V td
IC = 10 IB1 = –10 IB2
10
5 10 20 50 100 200 500
Collector Current IC (mA)

6
2SC1213A (K)

Package Dimensions

As of January, 2001
Unit: mm

4.8 ± 0.4 3.8 ± 0.4

5.0 ± 0.2
2.3 Max
12.7 Min

0.60 Max
0.7

0.55Max 0.5Max

1.27
2.54

Hitachi Code TO-92 (1)


JEDEC Conforms
EIAJ Conforms
Mass (reference value) 0.25 g

7
2SC1213A (K)

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.

Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http://semiconductor.hitachi.com/
Europe : http://www.hitachi-eu.com/hel/ecg
Asia : http://sicapac.hitachi-asia.com
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor Hitachi Europe GmbH Hitachi Asia Ltd. Hitachi Asia (Hong Kong) Ltd.
(America) Inc. Electronic Components Group Hitachi Tower Group III (Electronic Components)
179 East Tasman Drive, Dornacher Straβe 3 16 Collyer Quay #20-00, 7/F., North Tower,
San Jose,CA 95134 D-85622 Feldkirchen, Munich Singapore 049318 World Finance Centre,
Tel: <1> (408) 433-1990 Germany Tel : <65>-538-6533/538-8577 Harbour City, Canton Road
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0 Fax : <65>-538-6933/538-3877 Tsim Sha Tsui, Kowloon,
Fax: <49> (89) 9 29 30 00 URL : http://www.hitachi.com.sg Hong Kong
Tel : <852>-(2)-735-9218
Hitachi Europe Ltd. Hitachi Asia Ltd.
Electronic Components Group. Fax : <852>-(2)-730-0281
(Taipei Branch Office) URL : http://www.hitachi.com.hk
Whitebrook Park 4/F, No. 167, Tun Hwa North Road,
Lower Cookham Road Hung-Kuo Building,
Maidenhead Taipei (105), Taiwan
Berkshire SL6 8YA, United Kingdom Tel : <886>-(2)-2718-3666
Tel: <44> (1628) 585000 Fax : <886>-(2)-2718-8180
Fax: <44> (1628) 585160 Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright  Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0

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