BAB 1 - Apendix Siap Gabung

CHAPTER 1
INTRODUCTION
1.1 Introduction to industrial training
Internship session for students is to inform reader the main point of the
report and the introduction of the jobs that have been given. This industrial
training is important in syllabus of bachelor students of Politeknik Tuanku
Sultanah Bahiyah (PTSB). This program provided opportunity to all
students to expose the real working environment in order to improve their
knowledge and technical skill. It helps students able to adapt fastest into
the working environment in industry. For the Mechatonic Engineering
course, the total period of industrial training for this year is 20 weeks which
is within first Decembet 2014 until 17th April 2015.
This internship session, the place been chosen is at Knowles Electronic
(M) Sdn. Bhd located at Bayan Lepas, Pulau Pinang. The position given is
under Process Engineering Department. The person who guided
internship student and reported to is Cheng Kok Min (KM Cheng). KM
Cheng is a Senior Engineer for Process Engineering. The major task given
is more to analysis problems and how to overcome it.
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1.2 Objective of industrial training
The main purpose of industrial training was to provide guidance and new
experiences to students who will go through the challenges of the working
world later. Students should always comply the regulations set by the
polytechnic or the company to educate the students to become better
discipline and quality in the future.
1.2.1 Objectives of industrial training:
i. To exposure students to real industrial practice in Malaysia.
ii. To give students opportunity for students to obtain, expand
and practice knowledge and skills learned while studying.
iii. To increase self-awareness and student interest in the field
or field that are taken during in polytechnic.
iv. To build self-confidence and a good personality.
v. To create a network of relationship between polytechnic and
the company.
vi. Producing quality students and outstanding leadership
qualities.
vii. Planting work and practice rules and a good work ethic.
viii. Practice safety rules during industrial training.
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1.3 Objective of industrial training report
Industrial training report is for documenting the activities and the student
experience in training industry as well as evidence that a student has to
undergo practical training. A good report can be used in job interviews.
Hence, it can also be used as a reference for other students who will
undergo industrial training. Industrial training report is also to meet
requirements for the graduation in the semester that occupied the entire
duration during the training.
Besides, getting exposure in advance of the actual situation of the
working environment, the students are also able to understand more about
their areas of expertise. Through their industrial training report writing,
superiors can see and evaluate student abilities and focus fully on all the
knowledge that they had poured over the industrial training in their
companies.
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1.4 Importance of industrial training
Industrial training is an exercise in shaping the identity of the students to
be more exposed to the attributes of responsibility in executing a job and
adhere to all instructions given. Students can make the industrial training
experience as the valuable asset and can be used as an evidence when
looking or getting a job in future.
This exposure not only provide more time for students to gain knowledge
and experience in the workplace, or even hang out and get to know the
outside world closer as they supplied to related fields. The industrial
training should be implemented to ensure graduates ready to enter the job
market.
With the advent of industrial training, the students are able to broaden
the mind and be more open and mature in finding their own initiative to
solve a problem that may exist without seeking help from others.
Other responsibilities assigned by the students’ employer accountable to
the good name of their respective polytechnics present themselves as a
student dedicated student and quality in executing a job properly, quickly
and accurately.
Thus, industrial training indirectly build and transform the personality and
image of being a student with high confidence and efficient in meeting the
needs of the industry while improving the living standards of the local
community.
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CHAPTER 2
ORGANIZATION BACKGROUND
2.1 Introduction to KNOWLES ELECTRONICS
The purpose for this chapter is to show that reader will understand the
organizational structure of the company.
Figure 2.0 Knowles Electronic’s Logo
Knowles Electronic were founded by Hugh Knowles in 1946, Knowles
corporate headquarters is based in Itasca, USA with major manufacturing
and engineering operations in Suzhou China; Weifeng China; and Penang,
Malaysia and sales offices in Korea, Taiwan and UK.
Knowles has manufactured in Asia since 1974, with world class facilities
in china and Malaysia. Knowles build by former paremt through a series of
acquisition (included Knowles electronics, Vectron international, Novacap,
Syfer, Dielectric, Voltronics and Sound Solution). Knowles corporate is a
$350 million manufacturer of miniature acoustic products and it is supplies
of advanced micro acoustic, Micro Electrical Mechanical System (MEMS)
technology and human interface solution serving a variety application and
market. For example, Knowles has supplies wide range of products in the
markets for professional audio, consumer electronics, mobile
communications, and hearing health.
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Manufacturing facilities of Knowles corporate are used ISO -9001
certified, with some additionally facilities ISO -14001 or OSHAS -18001 in
order to ensure the cost effective on time delivery and meet the customer
needs.
In the addition, Knowles has over 60 years of acoustic expertise and it
has strengthened the competitive advantage in the market through
continuous technical support and enhancement of the management
performance with world class facilities.
The Dover Corporation, a multibillion dollar diversified global
manufacturer of innovative equipment and components, specialty system
and support services had acquire Knowles in 2005. Finally, Knowles
electronic has spinning off from Dover and establish as an individual part
in year 2014. Now, Knowles have successfully developing at various
countries, such as Denmark, Switzerland, United Kingdom, Austria, China,
Korea, Japan, Singapore and Malaysia. The branches varies from
customer support services, manufacturing services, consulting services,
quality analysis labs, research and development labs and more. Below are
the overall maps of the Knowles electronic company.
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Figure 2.1 Knowles Electronic’s location
2.2 KNOWLES ELECTRONICS Milestone
Figure 2.2 Knowles Electronic (M) Sdn. Bhd. Penang
2014 – Knowles Corporation established as an independent, publicly-
traded company.
2014 – Ships two millionth MEMS (Micro-Electro-Mechanical Systems)
microphone for the hearing health industry.
2014 – Developed the world’s first digital microphone supporting ultrasonic
bandwidth.
2014 – Developed digital multi-mode, low power MEMS microphone
enabling ‘Always On’ technology.
2013 – Ships five billionth SiSonic TM MEMS (Micro-electrical-mechanical
system) microphone.
2013 – Launches the most powerful high power micro speaker, Cobra TM ,
in its size category.
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2012 – Ships three billionth SiSonic TM MEMS microphone.
2012 – Enables the smallest possible acoustic design in portable devices
with N’BassTM.
2012 – Knowles KJ-33000 MEMs Joystick Named Product of the Year by
Electronic Products Magazine.
2011 – Ships two billionth Sisonic TM MEMs microphone.
2011 – Knowles acquires Sound Solutions.
2011 – Introduces virtual technology N’Bass™ for sound enhancement.
2007 – Develops world’s smallest rectangular dynamic speaker.
2007 – Introduces balanced armature technology for premium earphones.
2006 – Offers third-generation digital SiSonic™ microphones.
2005 – Dover Corporation acquires Knowles.
2005 – Introduces world’s first rectangular dynamic speaker.
2003 – Launches second-generation SiSonic™ for breakthrough cell
phone designs.
2002 – Develops world’s smallest dynamic speaker design.
2002 – Introduces first silicon surface mount microphone, the SiSonic™
series.
2001 – Launches complementary metal oxide semiconductor/MEMs
technology platform.
2000 – Expands high-volume global production facilities.
1999 – Knowles family sells Knowles to investors.
1998 – Develops condenser technology platform that yields world's
smallest electrolet condenser microphone.
1996 – Establishes micro electro-mechanical controls.
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1994 – Introduces acoustic devices for global electronic business.
1994 – Presents world's flattest dynamic speaker design for cell phones.
1991 – Introduces first improved electrolet magnetic microphone.
1990 – Makes strategic decision with Sound Solutions to focus entirely on
telecom market.
1989 – Opens Hugh Knowles Center for Hearing Research at
Northwestern University.
1987 – Introduces Class-D amplified receivers.
1982 – Launches first ultra-high power miniature receiver.
1980 – Focuses Sound Solutions on small speakers for cassette
recorders, Dictaphones and telecom applications.
1974 – Opens first Knowles Asian manufacturing center.
1971 – Introduces first subminiature electret condenser microphone.
1956 – Sound Solutions starts manufacturing dynamic speakers for TV
sets.
1954 – Develops first miniature microphone and receiver for hearing aids.
1947 – Introduces first transistor-based miniature microphone.
1946 – Knowles founded by Hugh Knowles.
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2.3 KNOWLES ELECTRONICS Activities
2.3.1 Main Products
Knowles provides component and system solutions for all types of
BTE hearing instruments from Super BTE to Miniature BTE. With
their range of products, they can advise on the configuration of
microphones for improved directionality to allow for the most
enhanced end user experience possible.
Figure 2.3 Behind the ear (BTE) hearing instrument
Super Power BTE Hearing Instruments:
i. Assist people with profound hearing loss
ii. Sound pressure level (SPL) output typically over 135dB,
requiring a powerful receiver
iii. Directional microphones or multiple microphone pairs or triplets
recommended for improved directionality for the user
Power BTE Hearing Instruments:
i. Assist people with moderate to severe hearing losses, needing
up to 70dB of acoustic gain
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ii. Sound pressure level (SPL) output typically between 125dB and
130dB
Mini BTE Hearing Instruments:
i. Assist people with mild to moderate hearing losses
ii. Sound pressure level (SPL) output typically between 120dB and
125dB
iii. Cosmetically appearing to the patient
Knowles extensive experience in the development of many of the
Open Canal hearing instruments make them uniquely qualified to
work together with customer to design and develop state-of-the-art
products.
Figure 2.4 In the ear (ITE) hearing instrument
Full-shell ITE Hearing Instruments:
i. Assist people with moderate to severe hearing losses
ii. Visible to the eye, but less conspicuous than BTE instruments
iii. Largest and loudest of custom product range
iv. Delivers 120dB SPL to 125dB SPL output or more
v. Design options available for both power and small size
Half-shell ITE Hearing Instruments:
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i. Assist people with mild to moderate hearing losses
ii. Smaller than full-shell ITE instruments and less conspicuous
iii. Delivers 110dB SPL to 15dB SPL output, occasionally exceeds
120dB
iv. Enhanced directionality improves end user experience
v. Design options for smaller size, high output receivers
Radio hand phone and Portable Data Terminals typically have a
wide range of requirements which are very demanding. Knowles
Electronics’ products are optimized to address and withstand water,
extreme temperatures, shock and vibration. Knowles’ component
solution is ideally designed for these rugged applications and
environments.
Figure 2.5 Handphone
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Knowles offers reliable and advanced audio metric instrumentation
for medical and industrial applications, including miniature
implantable devices. These are known as micro-acoustic
components.
Figure 2.6 Instrumentation
Knowles’s sensors offer a wide range of applications including flow
measurements, vibration testing, failure detection such as bearings
and motors, motion detection and positioning location. Knowles has
a variety of solutions, including ultrasonic sensor components, to fit
these applications. Knowles also offer sensors for security
applications, specifically, glass break detection, movement
detection, vibration and noise.
Figure 2.7 Sensors
Knowles is dedicated to the preservation and improvement of our
global environment. To help achieve this, Knowles has established
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a Green Materials Policy. The products Knowles offers are in
compliance with the EV RoHS/WEEE regulations. Additionally,
many products will be compliant to the Knowles Green Materials
Standard. This standard is based on the list of substances
identified in the JIG-101 Standard which is endorsed by the EIA, the
JEDEC and the JGPSSI associations as well as the Sony Standard
SS-00259.
Figure 2.8 Green Initiative
To meet this requirement, Knowles reviews supplier data for all
purchased materials to ensure compliance to applicable standards
and performs analytical testing when deemed necessary.
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2.3.2 Types of product
The products manufactured are acoustics transducer (hearing aid).
Moreover, Knowles products serve a variety of end market, notably,
consumer mobile devices, medical technology, aerospace and
defense and telecom, and can generally be divided into two
categories: acoustic component and specialty component. The
acoustic component included analog and digital microphones,
MEMS microphones, surface mounted device microphones,
receivers, speakers, speaker modules, multi-functional devices,
ultrasonic sensors and integrated audio sub –system.
On the other hand, the specialty components included
transducers, oscillators, capacitors and filters. Figure 2.9 Indicated
example some of the types of products.
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Figure 2.9 Types of product
2.3.3 Types of service
Knowles corporate provide service to customer in order enable
customer save they time and reduce manufacturing costs to
efficient delivery to the marketplace. They engage in the design and
manufacture of innovative products and component. Knowles tested
all the products if customers have special qualification test and they
are control the product from the preliminary design concept
manufacturing and final inspection.
The service offering by Knowles are including subassembly
development, testing and component integration, Zero defect value-
added manufacturing, Connector and interface design and
development, Ultrasonic welding, Epoxy selection and optimization
for materials and compatibility with transducers, Discrete
electromechanical component design and manufacturing and
Miniature switches, potentiometers, toggles and telecoils.
2.3.4 Local market/export
The customers of Knowles electronic company includes some of the
world's top importers, exporters, freight forwarders, logistics
companies, manufacturers, investment banks, financial analysts,
intellectual property attorneys, and other more. The current markets
for Knowles corporate are China, Japan, Singapore, Taiwan, United
Kingdom, and United States.
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2.3.5 Process flow
Figure 2.10 Process flow of product
Figure 2.10 indicated the process of product. The general
production process for manufacture products are including the
microphone assembly process and final test process. The
microphone assembly including the series of station of process,
such as die bond IC, die bond MEMS, wire bond, dispense solder,
encapsulation and other processes.
After the final product produce from the assembly, Knowles will
carry out the final test process to test the entire product to ensure
the product beyond quality. If the products fail the final test process,
the products will be rejected by inspector. Then, the quality products
only enter the process of packing and place in the store. Finally, the
product is shipping out the products to the buyers.
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2.4 KNOWLES ELECTRONICS Vision and Mission
The vision is The Premier Acoustics Manufacturing Centre. To achieve
vision of company, Knowles have the mission which to take pride in
providing best-in-class manufacturing services that creates increasing
value for our customers and shareholders.
The mission of company is aim to achieve the most cost-efficient,
market-leading technologies. Thus, the dynamic research require to fast
product development cycles, and high-volume, scalable manufacturing
help us to meet customer needs.
Knowles Electronics Malaysia using the excellent employees and
innovative technologies by holding the value of customer always comes
first, people are our greatest asset, integrity is never compromised,
teamwork is the key to success and excellence is never ending pursuit.
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2.5 Organization Chart
2.5.1 KNOWLES ELECTRONICS Organization Chart
Figure 2.11 Knowles Electronic Organisation Chart
Figure 2.11 indicated Knowles Electronic organization chart. Knowles
Electronic Sdn. Bhd. is leading by Managing Director, General Manager,
Director and Manager. Knowles Electronic consist into three groups, it is
KEM 1, KEM 2, and KEM 3. Regional quality director, Sr. SCM manager,
Operator director and engineering director are reporting to KEM 1‘s
manager. Other than that, other department such as IT Manager, Business
Development, Senior Manager, Supply Chain Director, Global Order
Fulfillment Director, HR Director, Finance Director and Senior Regional
Area Manager are directing report to VP.
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2.5.2 KEM3 Process Engineering Organization Chart
Figure 2.12 KEM3 Process Engineering Operation Organisation
Figure 2.12 Indicated the KEM 3 Process Enginreering organization chart.
KEM 3 is leading by Senior Process Engineering Manager and the
department of Die Bond, Wire Bond, Assembly, Solder, Encap, 3 in 1
process, SMT and Reflow are under Senior Process Engineering
Manager.
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CHAPTER 3
SUMMARY OF THE ACTIVITIES OF INDUSTRIAL TRAINING
5.1 Introduction
This chapter is a summary of the overall activities carried out weekly
during industrial training. Based on the activities performed as written in
the book of reflection journal will briefly described in chapter covers the
tasks assigned by the supervisor. Each activity or task progress will be
recorded in the book of daily reports. Therefore, this section will explain
briefly the activities and tasks performed during my industrial training in
one semester of twenty weeks. All activities will be explained from week to
week so can conclude the work that has been done in a week set aside to
facilitate the review process. Day work week is not necessarily the same
every week because there are public holidays and public holidays
announced by the company.
In industrial training, I have been exposed to many new things. They
practice what they have learned at the university, I have also been
exposed to the rules and ethics of the company and it should be practiced
whenever I was in the company where my industrial training. When
undergoing industrial training in this company, I was placed in a more
mechanical maintenance division to work repairing and maintenance of
machinery in the factory. Each assigned task has been scheduled by
maintenance engineers to facilitate subsequent maintenance tasks on
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every Friday factories doing work (prevention maintenance) it means
making inspection and maintenance of machinery equipment regularly set.
In industrial training, I have given time for 8 hours and 30 minutes a day,
starting from 08:00 am - 5:30 pm daily from Monday - Friday. Here is a
weekly summary when I undergo industrial training for 20 weeks.
5.2 Summary of activities industrial training
WEEKS ACTIVITY PICTURES

1&2
 Introduction to company – Company profile -
Knowles Electronic (M) Sdn. Bhd.
Thermome
 Get introduce to Supervisor – KM Cheng, ter
Process Engineer
 Going to production line – get explained
about the process flow syringe
 Learned how to get the pressure and speed
of the machine. Machine’s pressure and
speed will give results in solder weight. The
results will shows the percentage solder Solder
used. The differences between speed and
pressure will affect the solder weight which
become heavy or light.

Jig
 Measure the syringe temperature - The
temperature related with the soldering

Tweezer
process whereas the thickness or weight of
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solder may help in used of the product. For
example, the more high temperature, the
more fast the soldering process (liquid flow). High

power
scope
 Tear down process – monitoring the surface
inside the product. The splash could may the
function wouldn’t give a good performance
while used. The solder splash located around the

Solder
PCB that may touch the center surface. splash
 Inspection of solder splash on units using
high power scope.
 Update report and slide for every week

3&4
process whereas the thickness or weight of Thermome

ter
more fast the soldering process (liquid flow).
syringe
PCB that may touch the center surface. Solder
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high power scope.
 Update report and slide for every week Jig
Tweezer
High
power
scope
 Take parameter measurement using high
power scope
Solder
splash
 Help supervisor collected data (solder
weight monitoring for several board) using
sensitive weighting tool
Weighting
tool
24
5&6

ter
syringe
high power scope.

Jig
Tweezer
High
power
scope
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 Bubble rate inspection – inspect whether the was
bubble inside solder or not.
Solder
 Explore minitab tool splash
 Key in collected data of syringe temperature into
excel
Bubble
rate
inspection
7&8

ter
syringe
high power scope.

Jig
26
Tweezer
High
power
scope

Solder
excel
splash
 Help supervisor with solder evaluation( solder
weight monitoring)
Weighting
tool
9 & 10

ter
syringe
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PCB that may touch the center surface.

Solder
high power scope.
Jig
Tweezer
High
power
scope
 Run solder dispense machine
 Measure weight of board before and after
dispense using weighting tool Solder

splash
 Measurement-Measure solder height and
diameter using high power scope.
 Do multimeter plotting to check electrical
resistance on unit.
Weighting
tool
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Solder
dispense
machine
Multimeter
11 & 12

ter
syringe
high power scope.

Jig
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excel
Tweezer
High
power
scope
 Run solder dispense machine
 Solder weight monitoring--Measure weight of Solder

splash
board before and after dispense using weighting
tool.
 Do multimeter plotting to check electrical Weighting

tool
resistance on unit.
Solder
dispense
machine
Multimeter
30
13 & 14

ter
syringe
 Run solder dispense evaluation on shining solder
that occur in unit.

Jig
 Do multimeter plotting to identify electrical
resistance of good unit, fail unit and dummy unit.
Tweezer
Solder
dispense
machine
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Multimeter
15 & 16

ter
syringe

Solder
PCB that may touch the center surface. Multimeter
 Pad arrangement identification
 Data entry Jig
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Tweezer
17 & 18

ter
syringe
 Run solder dispense evaluation.
 Solder weight monitoring--Measure weight of Solder
board before and after dispense using weighting
tool.
Multimeter
Weighting
tool
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 Perform KGM test for several job to find certain
failures units.
Solder
dispense
machine
KGM
tester
19 & 20
 Perform KGM test for several job to find certain
failures units.
KGM
tester
 Do multimeter plotting after KGM test to
identify electrical resistance of good unit, fail
unit and dummy unit. Multimeter
 Run 12 board in dispense solder machine and
AOI maccine.
 Measure the syringe temperature - The Solder

dispense
temperature related with the soldering machine
process whereas the thickness or weight of

AOI
example, the more high temperature, the machine

Thermome
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ter
syringe
Solder
CHAPTER 4
REFLOW PROCESS
9.1 Introduction
Reflow process is a process to melt the solder and heat the adjoining
surfaces, without overheating and damaging the electrical components. In
the conventional reflow soldering process, there are usually four stages,
called “zones”, which are preheat, thermal soak, reflow and cooling.
9.2 Specifications / type of equipment used
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The equipment used is :
i. Reflow machine
4.2.1 PYRAMAX 100N reflow oven
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4.2.2 Reflow oven
4.3 Procedure for the use of equipment
i. Put the PCB board on the reflow jig in the correct position.
ii. Make sure the board is inserted in the right direction.
iii. Make sure the correct profiled is used for each different model.
iv. Enter the board and wait for 15-17 minutes.
v. Cool down the board and do the inspection.
9.4 Working process
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4.4.1 Type of working process
9.4.1 Preheat zone
Maximum slope is a temperature or time relationship that measures
how fast the temperature on the printed circuit board changes. The
preheat zone is often the lengthiest of the zones and often
establishes the ramp-rate. The ramp-rate is usually somewhere
between 1.0 oC and 3.0 oCper second, often falling between 2.0 oC
and 3.0 oC per second. If the rate exceeds the maximum slope,
damage to components from cracking can occur. Solder paste can
also have spattering effect. The preheat section is where the
solvent in the paste begins to evaporate and if the rise rate or
temperature level is too low, evaporation of flux volatiles is
incomplete.
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9.4.2 Thermal soak zone
The second section is typically a 60 to 120 second exposure for
removal of solder paste volatiles and activation of the fluxes where
the flux components begin oxidereduction on component leads and
pads. Similarly, fluxes may not fully activate if the temperature is
too low. A soak profile is also recommended to diminish voiding in
area array type packages.
9.4.3 Reflow zone
The third section is also referred as the “time above reflow “ and is
the part of the process where the maximum temperature is reached.
“Time above reflow”, measures how long the solder is a liquid. An
important consideration is peak temperature, which is the maximum
allowable temperature of the entire process. Common peak
temperature is 20-40 oC and this limit is determined by the
component on the assembly with the lowest tolerance for high
temperature. It is important to monitor the process temperature to
keep it from exceeding this limit (a standard guideline is to subtract
5 oC from the maximum temperature). Additionally, high
temperature may cause damage to the internal dies of SMT
components. Conversely, a temperature that is not hot enough may
prevent the paste from reflow adequately.
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9.4.4 Cooling zone
The last zone is a cooling zone to gradually cool the processed
board and solidify the solder joints. Typical temperatures in the
cooling zone range from 30 – 100oC. A fast cooling rate is chosen
to create a fine grain structure that is most mechanically sound.
Unlike the maximum ramp-up rate, the ramp-down rate is often
ignored. It may be that the ramp rate is less critical above certain
temperatures, however, the maximum allowable slope for any
component should apply whether the component is heating up or
cooling down. A cooling rate of 4 oC/s is commonly suggested. It is
a parameter to consider when analysing process result.
4.4.4.1 Pin transport system with mesh conveyor underneath

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The board transport system may use either a conveyor belt or, more
usually with larger ovens, some of edge conveyor system, often with a
mesh belt underneath to catch dropped boards and components. A chain
conveyor, for example, has pins protruding from the sides of the chain to
provides an edge support that carries the board through the reflow system
without touching the belt. This allows double-sided PCBs to be processed
without disturbing the bottom-side components.
Proper design of the edge conveyor system is critical, as typically only
4 mm is in contact with the bottom-side edges of the product. If the
conveyor has lateral warpage of greater than this amount, the product will
fall into the oven.
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CHAPTER 5
SYRINGE MEASUREMENT
5.1 Introduction
To monitor syringe temperature of different level and different pressure.
Frequency of this monitoring is two times every day for three weeks at all 3
in 1 machines (10 machines).
The equipment used is :
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5.2.1 Infrared thermometer
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5.2.2 Empty syringe
i. Point the laser thermometer at three points which is above piston, ½
inch below piston and 1 inch above syringe tip.
ii. Use the empty syringe to measure the solder level (put the empty
syringe besides syringe).
iii. Do not point the laser at metal to avoid error measurement.
iv. Explanation are given from trainer how to measure the solder.
v. Take the speed and pressure reading at machine’s monitor.
5.4 Working process
i. Measurement taken must be the 2nd board and above after the machine
is idle for more than five minutes.
ii. Measure when machine is running to avoid error in measurement.
iii. Keep track of the solder when it reaches level 1 to level 8.
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iv. Measure the solder then followed by speed and pressure.
v. Measure at three points, above piston, ½ inch below piston and 1 inch
above syringe tip.
vi. Measure for the right and left side.
5.4.1 Above piston
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5.4.2 ½ inch below piston
5.4.3 1 inch above syringe tip
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Is the laser pointer of the infrared thermometer.
CHAPTER 6
3 IN 1 MACHINE FOR METAL CAN PRODUCT
11.1 Introduction
Differences in solder weight is due to below few factors :
i. High writing speed
ii. Low squeeze pressure
iii. Difference solder viscosity
iv. CDA controller pressure calibration
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4 5
1
6
6.2.1 AD838L 3 IN 1 Machine
Machine Parts
1. Input elevator loading table
2. Left epoxy controller
3. Right epoxy controller
4. Monitor
5. Output elevator loading table
6. Mouse controller
7. Keyboard
8. EMO
6.3.1 Machine loading
All metal can board direction. Board two holes and undercut
towards left side.
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Figure 6.3.1.1
6.3.2 Machine operation
Dispenser operation :
i. Select AVI depend model name on travel
ii. Loading a program depend AVI
Click “setup” button
Click “Package file”
Choose program as AVI indicates and click “Load package”
iii. Put magazine on the Input elevator, ensure PCB in bottom area
of magazine.
iv. Choose solder based on traveller information.
Install solder, needle and dispense tool on machine.
v. Dispense location optic alignment
First performed left epoxy optic alignment. Access to set
up – Process set up – Left epoxy dispenser – Optic
alignment.
Performed right epoxy optic alignment. Method same as
Left epoxy optic alignment.
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vi. Learn Z for dispense solder. Access to set up – Process set up
– Left epoxy dispenser – Pos.
vii. Back to main table and confirm that Output elevator buttons
highlight behind should be “Off” model.
viii. Minimum run three column per dispenser head on dummy
board, 100 % inspection under minimum 10x microscope,
complete dispenser set-up when 100 % accept according
QAP720 (Quality Assurance Procedures).
6.4 Working process
6.4.1 Bonding operation
i. Choose can base on traveller information and install them in machine.
ii. PR image confirm
Wafer PR, confirm that hole location on top if can have hole.
Up-look PR, confirm that hole location on top if can have hole.
Post bond PR, confirm that image created without solder and position
in centre of guard ring.
iii. Can position confirm
Stick double-face pastern on dummy board, do not cover the centre
of the PCB.
Select “SET BONDING MAP” bottom, access to “Bonding Map Setup
Page”, setting to “ON” condition for “Customer Bonding” and “Bonding
Map” bottom.
Select left three column and right three column to enable, then run
the machine.
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100% inspection under minimum 10x microscope, no rotation, ring is
clearly at round of can.
Confirm below bottom is “ON” condition, then can normal running.
6.4.1.1
6.4.2 Inspection procedure
i. 100% inspection dispense solder status as QAP720 required.
ii. Inspect P&P can status as QAP720 (Quality Assurance
Procedures) required.
iii. Detect mark method status as WI1308 required.
6.4.3 Needle and dispense adaptor change status
i. Needle and dispensing adaptor must be changed after machine
idle 6 hours.
ii. Needle and dispensing adaptor must be changed
at the beginning of a shift.
iii. Needle and dispensing adaptor must be changed after solder
change.
iv. Needle and dispensing adaptor must be changed
after needle clog.
51
v. Dispensing adaptor must be changed after needle
removal by operator.
vi. Operator need use dummy board, run all boards
after needle change / dispensing adaptor change /
program change. Run normal product after inspect
no any defective units.
6.4.4 Solder
i. The solder shall be vertical placed at refrigerator
and solder thawed state. Storage temperature are
different depends on supplier products.
ii. Operator shall take no any air bubble solder.
6.4.5 Change line
i. Based on AVI and traveller decide whether need change solder.
ii. Collect rest can in bowl and pack them in the bag
marked with P/N. Scrap the can on the guide.
iii. Collect can in bowl.
Open valve in the bowl.
Click “Bowl” to vibrate the can into collect box.
Pack the can in.
52
6.4.5.1 Metal can track
6.4.6 Non-Conforming Material Report (NCMR) job disposition
i. Based on NCMR rules defined, issue NCMR hold relevant job
and ask technician to check the machine.
ii. Once needle clog / needle broken / needle scratch PCB or find
air bubble in solder, stop machine immediately. Check
dispense solder status and do action as OCAP-Sisonic-14,
needle clog disposition.
53
CHAPTER 7
SISONIC PROCESS FLOW
7.1 INTRODUCTION
Sisonic process flow is a method of microphone unit according to a
predetermined sequence. This is to align the quality of products produced.
Sisonic microphone is in batch process, a batch of ten PCB board and one
board contains 600+ microphone before dicing.
There are 16 steps to complete this process :
Top side Bottom side
54
i. FR4 Strip Attach
Assemble FR4 wall to base to make supporting for board clamping in
downstream Assembly Process.
Before After
ii. Plasma Clean
Plasma clean the wire bond PCB pad to remove any possible
contamination that could affect wire bond.
Before After
55
iii. Die Bond
Die mount IC, MEMS. Place and attach the IC and MEMS onto the PCB.
Before After
iv. Curing
Curing, speed up DB IC / MEMS epoxy solidifying.
56
Oven
v. Wire Bond
Attach and bond the wires from MEMS to IC and to PCB pad per the wire
bond layout in the spec.
Wire bond process Before After
vi. Encapsulate
Dispensing the black epoxy to cover the IC
57
Encapsulation process Before After
vii. Curing
Curing, speed up encapsulation epoxy solidifying
Oven
viii. Dispense solder
Dispensing the solder to cover metal ground ring
58
Solder dispense process Before After
ix. Pick-n-place can
Pick and place metal can on the solder ring
Pick & place machine Before After
x. Reflow solder
Reflow the metal can and solder
59
Reflow machine Before After
xi. Laser mark
Laser Mark the job number on metal can for identification
Laser mark machine Before After
xii. Mount on tape
Mount the tape on the PCB to secure the units during the dicing process
60
Tape mount process Before After
xiii. Dice
Dice the board to single unit
Dicing machine Before After
xiv. UV Cure
To apply UV on the UV tape to reduce the stickinessso to release the
unit from the UV tape.
61
UV cure process Before After
xv. Final test
Every microphone is 100% electrical and acoustic tested.
Final test process Before After
xvi. Tape-n-reel
Standard reel packing
62
Tape-n-reel machine Before After
xvii. Warehouse
63
CHAPTER 8
CONCLUSION
8.1 Conclusion
Working with Knowles Electronic (M) Sdn. Bhd. is one of opportunity to learned
new knowledge in electronic. Knowles also mostly absorb training student
(internship) to grab opportunity to become permanent worker there. With a high
performance and good attitude, Knowles can give opportunity.
For a four and half months training period, a new knowledge were exposed. For
example, even from mechatronic course, student also can learn the system in the
production where the function of each machines and how it is work. To gain the
knowledge, an initiative attitude is applied. With an initiative to asked operator,
technician and engineer, new things were gain. With helping from other engineer
also can help in working. Getting information, collecting data and analysis the
data is one of routine task since internship period started. With own effort,
supervisor give a task and need to be handled. To do the task, communication
skills need to have. A good communication between workers (engineer, operator
and technician) needs to be applied. In this company, mostly they used English as
communication language. It is good in used because it will make other workers
understand and ease to working in group.
As mention above, new knowledge’s was gain. Therefore, new environments
were adapted. This is shows that from manufacturing course transferred to
electronic company make it differences changes in environment. But, the system
applied still the same. The Knowles Company also applied Lean manufacturing
system.
64
CHAPTER 9
COMMENT AND SUGGESTION
9.1 Suggestion
After lecturer visited, a recommendation was made which is internship students
need to extend internship period at least six months. It is because for that period,
more tasks can be given and can study more about machines. For the tasks
given, it is success made student understood about the works. Even not fully
enough the whole process was understood, but at least tasks given is success
finished.
65
REFERENCE
Resources Website
1. www.knowles.com
2. Knowles Intranet
3. Kem3 filesharing
Resources Human
1. Chneg Kok Min , Senior Engineer
66
APPENDIX
10.1 AD838L
10.2 Asymtek With Dual-Lane Dispenser
67
10.3 Encap Machine
10.4 Laser Engraving Machine
68
10.5 Pick & Place Machine
10.6 Reflow Machine
69
10.7 Cartridge
10.8 DJ9500
70
10.9 Microphone
10.10 Gas Recirculation Within A Heated Zone
71
10.11 Gold Wire
10.12 Tweeezers
72
10.13 Syringe
10.14 Wafer-level Package for MEMS ICs
73
10.15 Infrared Thermometer
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90
91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120
121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150
151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180
181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210
211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240
241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 257 258 259 260 261 262 263 264 265 266 267 268 269 270
271 272 273 274 275 276 277 278 279 280 281 282 283 284 285 286 287 288 289 290 291 292 293 294 295 296 297 298 299 300
301 302 303 304 305 306 307 308 309 310 311 312 313 314 315 316 317 318 319 320 321 322 323 324 325 326 327 328 329 330
331 332 333 334 335 336 337 338 339 340 341 342 343 344 345 346 347 348 349 350 351 352 353 354 355 356 357 358 359 360
361 362 363 364 365 366 367 368 369 370 371 372 373 374 375 376 377 378 379 380 381 382 383 384 385 386 387 388 389 390
391 392 393 394 395 396 397 398 399 400 401 402 403 404 405 406 407 408 409 410 411 412 413 414 415 416 417 418 419 420
421 422 423 424 425 426 427 428 429 430 431 432 433 434 435 436 437 438 439 440 441 442 443 444 445 446 447 448 449 450
451 452 453 454 455 456 457 458 459 460 461 462 463 464 465 466 467 468 469 470 471 472 473 474 475 476 477 478 479 480
481 482 483 484 485 486 487 488 489 490 491 492 493 494 495 496 497 498 499 500 501 502 503 504 505 506 507 508 509 510
511 512 513 514 515 516 517 518 519 520 521 522 523 524 525 526 527 528 529 530 531 532 533 534 535 536 537 538 539 540
541 542 543 544 545 546 547 548 549 550 551 552 553 554 555 556 557 558 559 560 561 562 563 564 565 566 567 568 569 570
571 572 573 574 575 576 577 578 579 580 581 582 583 584 585 586 587 588 589 590 591 592 593 594 595 596 597 598 599 600
10.16 Board orientation
74
10.17 Metal Can Track
75

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CHAPTER 1

1.1 Introduction to industrial training

training is important in syllabus of bachelor students of Politeknik Tuanku

Sultanah Bahiyah (PTSB). This program provided opportunity to all

students to expose the real working environment in order to improve their

the working environment in industry. For the Mechatonic Engineering

is within first Decembet 2014 until 17th April 2015.

This internship session, the place been chosen is at Knowles Electronic

under Process Engineering Department. The person who guided

internship student and reported to is Cheng Kok Min (KM Cheng). KM

is more to analysis problems and how to overcome it.

experiences to students who will go through the challenges of the working

polytechnic or the company to educate the students to become better

discipline and quality in the future.

1.2.1 Objectives of industrial training:

i. To exposure students to real industrial practice in Malaysia.

ii. To give students opportunity for students to obtain, expand

and practice knowledge and skills learned while studying.

iii. To increase self-awareness and student interest in the field

or field that are taken during in polytechnic.

iv. To build self-confidence and a good personality.

v. To create a network of relationship between polytechnic and

vi. Producing quality students and outstanding leadership

viii. Practice safety rules during industrial training.

experience in training industry as well as evidence that a student has to

undergo practical training. A good report can be used in job interviews.

undergo industrial training. Industrial training report is also to meet

duration during the training.

Besides, getting exposure in advance of the actual situation of the

their areas of expertise. Through their industrial training report writing,

Industrial training is an exercise in shaping the identity of the students to

be more exposed to the attributes of responsibility in executing a job and

experience as the valuable asset and can be used as an evidence when

looking or getting a job in future.

outside world closer as they supplied to related fields. The industrial

training should be implemented to ensure graduates ready to enter the job

Other responsibilities assigned by the students’ employer accountable to

the good name of their respective polytechnics present themselves as a

student dedicated student and quality in executing a job properly, quickly

2.1 Introduction to KNOWLES ELECTRONICS

organizational structure of the company.

Figure 2.0 Knowles Electronic’s Logo

Knowles Electronic were founded by Hugh Knowles in 1946, Knowles

corporate headquarters is based in Itasca, USA with major manufacturing

and engineering operations in Suzhou China; Weifeng China; and Penang,

Malaysia and sales offices in Korea, Taiwan and UK.

in china and Malaysia. Knowles build by former paremt through a series of

acquisition (included Knowles electronics, Vectron international, Novacap,

Syfer, Dielectric, Voltronics and Sound Solution). Knowles corporate is a

$350 million manufacturer of miniature acoustic products and it is supplies

of advanced micro acoustic, Micro Electrical Mechanical System (MEMS)

technology and human interface solution serving a variety application and

markets for professional audio, consumer electronics, mobile

communications, and hearing health.

certified, with some additionally facilities ISO -14001 or OSHAS -18001 in

In the addition, Knowles has over 60 years of acoustic expertise and it

has strengthened the competitive advantage in the market through

continuous technical support and enhancement of the management

performance with world class facilities.

The Dover Corporation, a multibillion dollar diversified global

manufacturer of innovative equipment and components, specialty system

and support services had acquire Knowles in 2005. Finally, Knowles

in year 2014. Now, Knowles have successfully developing at various