CHAPTER 3

SUMMARY OF THE ACTIVITIES OF INDUSTRIAL TRAINING

3.1 Introduction

This chapter is a summary of the overall activities carried out weekly

during industrial training. Based on the activities performed as written in

the book of reflection journal will briefly described in chapter covers the

tasks assigned by the supervisor. Each activity or task progress will be

recorded in the book of daily reports. Therefore, this section will explain

briefly the activities and tasks performed during my industrial training in

one semester of twenty weeks. All activities will be explained from week to

week so can conclude the work that has been done in a week set aside to

facilitate the review process. Day work week is not necessarily the same

every week because there are public holidays and public holidays

announced by the company.

In industrial training, I have been exposed to many new things. They

practice what they have learned at the university, I have also been

exposed to the rules and ethics of the company and it should be practiced

whenever I was in the company where my industrial training. When

undergoing industrial training in this company, I was placed in a more

mechanical maintenance division to work repairing and maintenance of

machinery in the factory. Each assigned task has been scheduled by

maintenance engineers to facilitate subsequent maintenance tasks on

every Friday factories doing work (prevention maintenance) it means

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 making inspection and maintenance of machinery equipment regularly set.

In industrial training, I have given time for 8 hours and 30 minutes a day,

starting from 08:00 am - 5:30 pm daily from Monday - Friday. Here is a

weekly summary when I undergo industrial training for 20 weeks.

3.2 Summary of activities industrial training

WEEKS ACTIVITY PICTURES

1&2
 Introduction to company – Company profile -

Knowles Electronic (M) Sdn. Bhd.

Thermome
 Get introduce to Supervisor – KM Cheng, ter

Process Engineer

 Going to production line – get explained

about the process flow syringe

 Learned how to get the pressure and speed

of the machine. Machine’s pressure and

speed will give results in solder weight. The

results will shows the percentage solder Solder

used. The differences between speed and

pressure will affect the solder weight which

become heavy or light.

Jig

 Measure the syringe temperature - The

temperature related with the soldering

Tweezer
process whereas the thickness or weight of

solder may help in used of the product. For

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 example, the more high temperature, the

more fast the soldering process (liquid flow).

High
 Tear down process – monitoring the surface power
scope
inside the product. The splash could may the

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface.

Solder
splash
 Inspection of solder splash on units using

high power scope.

 Update report and slide for every week

3&4
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

syringe
 Tear down process – monitoring the surface

inside the product. The splash could may the

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface. Solder

 Inspection of solder splash on units using

high power scope.

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  Update report and slide for every week

Jig

Tweezer

High
power
scope

 Take parameter measurement using high

power scope

 Help supervisor collected data (solder

Solder
weight monitoring for several board) using splash

sensitive weighting tool

Weighting
tool
5&6
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

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 more fast the soldering process (liquid flow).

 Tear down process – monitoring the surface

inside the product. The splash could may the syringe

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface.

 Inspection of solder splash on units using Solder

high power scope.

 Update report and slide for every week

Jig

Tweezer

High
power
scope

 Bubble rate inspection – inspect whether the was

bubble inside solder or not.

Solder
 Explore minitab tool splash

 Key in collected data of syringe temperature into

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 excel

Bubble
rate
inspection
7&8
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

syringe
 Tear down process – monitoring the surface

inside the product. The splash could may the

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface. Solder

 Inspection of solder splash on units using

high power scope.

Jig
 Update report and slide for every week

Tweezer

High

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 power
scope

 Key in collected data of syringe temperature into

excel Solder
splash

 Help supervisor with solder evaluation( solder

weight monitoring)

Weighting
tool
9 & 10
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

syringe
 Tear down process – monitoring the surface

inside the product. The splash could may the

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface. Solder

 Inspection of solder splash on units using

high power scope.

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 Jig
 Update report and slide for every week

Tweezer

High
power
scope

 Run solder dispense machine

Solder
splash
 Measure weight of board before and after

dispense using weighting tool

 Measurement-Measure solder height and

diameter using high power scope.

 Do multimeter plotting to check electrical Weighting

tool
resistance on unit.

Solder
dispense
machine

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 Multimeter

11 & 12
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

syringe
 Tear down process – monitoring the surface

inside the product. The splash could may the

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface. Solder

 Inspection of solder splash on units using

high power scope.

Jig
 Update report and slide for every week

 Key in collected data of syringe temperature into

Tweezer
excel

High
power
scope

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  Run solder dispense machine

Solder
 Solder weight monitoring--Measure weight of splash
board before and after dispense using weighting

tool.

 Measurement-Measure solder height and

diameter using high power scope.

Weighting
 Do multimeter plotting to check electrical tool
resistance on unit.

Solder
dispense
machine

Multimeter

13 & 14
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

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 syringe
 Tear down process – monitoring the surface

inside the product. The splash could may the

function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface. Solder

 Run solder dispense evaluation on shining solder

that occur in unit.

Jig
 Do multimeter plotting to identify electrical

resistance of good unit, fail unit and dummy unit.

Tweezer

Solder
dispense
machine

 Measurement-Measure solder height and

diameter using high power scope.

Multimeter

 Update report and slide for every week

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15 & 16
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

syringe
 Do multimeter plotting to identify electrical

resistance of good unit, fail unit and dummy unit.

 Tear down process – monitoring the surface

inside the product. The splash could may the

Solder
function wouldn’t give a good performance

while used. The solder splash located around the

PCB that may touch the center surface. Multimeter

 Pad arrangement identification

 Data entry Jig

 Update report and slide for every week

Tweezer

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17 & 18
 Measure the syringe temperature - The

temperature related with the soldering

process whereas the thickness or weight of Thermome

ter
solder may help in used of the product. For

example, the more high temperature, the

more fast the soldering process (liquid flow).

syringe
 Do multimeter plotting to identify electrical

resistance of good unit, fail unit and dummy unit.

 Run solder dispense evaluation.

 Solder weight monitoring--Measure weight of Solder

board before and after dispense using weighting

tool.
Multimeter

Weighting
tool

 Perform KGM test for several job to find certain

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 failures units.

 Update report and slide for every week

Solder
dispense
machine

KGM
tester

19 & 20
 Perform KGM test for several job to find certain

failures units.
KGM
tester
 Do multimeter plotting after KGM test to

identify electrical resistance of good unit, fail

unit and dummy unit. Multimeter

 Run 12 board in dispense solder machine and

AOI maccine.

 Measure the syringe temperature - The Solder

dispense
temperature related with the soldering machine
process whereas the thickness or weight of

solder may help in used of the product. For

AOI
example, the more high temperature, the machine
more fast the soldering process (liquid flow).

 Update report and slide for every week

Thermome
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 ter

syringe

Solder

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