CHAPTER 4

REFLOW PROCESS

4.1 Introduction

Reflow process is a process to melt the solder and heat the adjoining

surfaces, without overheating and damaging the electrical components. In

the conventional reflow soldering process, there are usually four stages,

called “zones”, which are preheat, thermal soak, reflow and cooling.

4.2 Specifications / type of equipment used

The equipment used is :

i. Reflow machine

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4.2.1 PYRAMAX 100N reflow oven

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 4.2.2 Reflow oven

4.3 Procedure for the use of equipment

i. Put the PCB board on the reflow jig in the correct position.

ii. Make sure the board is inserted in the right direction.

iii. Make sure the correct profiled is used for each different model.

iv. Enter the board and wait for 15-17 minutes.

v. Cool down the board and do the inspection.

4.4 Working process

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 4.4.1 Type of working process

4.4.1 Preheat zone

Maximum slope is a temperature or time relationship that measures

how fast the temperature on the printed circuit board changes. The

preheat zone is often the lengthiest of the zones and often

establishes the ramp-rate. The ramp-rate is usually somewhere

between 1.0 oC and 3.0 oCper second, often falling between 2.0 oC

and 3.0 oC per second. If the rate exceeds the maximum slope,

damage to components from cracking can occur. Solder paste can

also have spattering effect. The preheat section is where the

solvent in the paste begins to evaporate and if the rise rate or

temperature level is too low, evaporation of flux volatiles is

incomplete.

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4.4.2 Thermal soak zone

The second section is typically a 60 to 120 second exposure for

removal of solder paste volatiles and activation of the fluxes where

the flux components begin oxidereduction on component leads and

pads. Similarly, fluxes may not fully activate if the temperature is

too low. A soak profile is also recommended to diminish voiding in

area array type packages.

4.4.3 Reflow zone

The third section is also referred as the “time above reflow “ and is

the part of the process where the maximum temperature is reached.

“Time above reflow”, measures how long the solder is a liquid. An

important consideration is peak temperature, which is the maximum

allowable temperature of the entire process. Common peak

temperature is 20-40 oC and this limit is determined by the

component on the assembly with the lowest tolerance for high

temperature. It is important to monitor the process temperature to

keep it from exceeding this limit (a standard guideline is to subtract

5 oC from the maximum temperature). Additionally, high

temperature may cause damage to the internal dies of SMT

components. Conversely, a temperature that is not hot enough may

prevent the paste from reflow adequately.

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4.4.4 Cooling zone

The last zone is a cooling zone to gradually cool the processed

board and solidify the solder joints. Typical temperatures in the

cooling zone range from 30 – 100oC. A fast cooling rate is chosen

to create a fine grain structure that is most mechanically sound.

Unlike the maximum ramp-up rate, the ramp-down rate is often

ignored. It may be that the ramp rate is less critical above certain

temperatures, however, the maximum allowable slope for any

component should apply whether the component is heating up or

cooling down. A cooling rate of 4 oC/s is commonly suggested. It is

a parameter to consider when analysing process result.

4.4.4.1 Pin transport system with mesh conveyor underneath

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The board transport system may use either a conveyor belt or, more

usually with larger ovens, some of edge conveyor system, often with a

mesh belt underneath to catch dropped boards and components. A chain

conveyor, for example, has pins protruding from the sides of the chain to

provides an edge support that carries the board through the reflow system

without touching the belt. This allows double-sided PCBs to be processed

without disturbing the bottom-side components.

Proper design of the edge conveyor system is critical, as typically only

4 mm is in contact with the bottom-side edges of the product. If the

conveyor has lateral warpage of greater than this amount, the product will

fall into the oven.

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 CHAPTER 5

SYRINGE MEASUREMENT

5.1 Introduction

To monitor syringe temperature of different level and different pressure.

Frequency of this monitoring is two times every day for three weeks at all 3

in 1 machines (10 machines).

5.2 Specifications / type of equipment used

The equipment used is :

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5.2.1 Infrared thermometer

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 5.2.2 Empty syringe

5.3 Procedure for the use of equipment

i. Point the laser thermometer at three points which is above piston, ½

inch below piston and 1 inch above syringe tip.

ii. Use the empty syringe to measure the solder level (put the empty

syringe besides syringe).

iii. Do not point the laser at metal to avoid error measurement.

iv. Explanation are given from trainer how to measure the solder.

v. Take the speed and pressure reading at machine’s monitor.

5.4 Working process

i. Measurement taken must be the 2nd board and above after the machine

is idle for more than five minutes.

ii. Measure when machine is running to avoid error in measurement.

iii. Keep track of the solder when it reaches level 1 to level 8.

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iv. Measure the solder then followed by speed and pressure.

v. Measure at three points, above piston, ½ inch below piston and 1 inch

above syringe tip.

vi. Measure for the right and left side.

5.4.1 Above piston

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 5.4.2 ½ inch below piston

5.4.3 1 inch above syringe tip

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 Is the laser pointer of the infrared thermometer.

CHAPTER 6

3 IN 1 MACHINE FOR METAL CAN PRODUCT

6.1 Introduction

Differences in solder weight is due to below few factors :

i. High writing speed

ii. Low squeeze pressure

iii. Difference solder viscosity

iv. CDA controller pressure calibration

6.2 Specifications / type of equipment used

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 4 5

1
6

6.2.1 AD838L 3 IN 1 Machine

Machine Parts
1. Input elevator loading table
2. Left epoxy controller
3. Right epoxy controller
4. Monitor
5. Output elevator loading table
6. Mouse controller
7. Keyboard
8. EMO

6.3 Procedure for the use of equipment

6.3.1 Machine loading

All metal can board direction. Board two holes and undercut

towards left side.

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 Figure 6.3.1.1

6.3.2 Machine operation

Dispenser operation :

i. Select AVI depend model name on travel

ii. Loading a program depend AVI

Click “setup” button

Click “Package file”

Choose program as AVI indicates and click “Load package”

iii. Put magazine on the Input elevator, ensure PCB in bottom area

of magazine.

iv. Choose solder based on traveller information.

Install solder, needle and dispense tool on machine.

v. Dispense location optic alignment

First performed left epoxy optic alignment. Access to set

up – Process set up – Left epoxy dispenser – Optic

alignment.

Performed right epoxy optic alignment. Method same as

Left epoxy optic alignment.

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 vi. Learn Z for dispense solder. Access to set up – Process set up

– Left epoxy dispenser – Pos.

vii. Back to main table and confirm that Output elevator buttons

highlight behind should be “Off” model.

viii. Minimum run three column per dispenser head on dummy

board, 100 % inspection under minimum 10x microscope,

complete dispenser set-up when 100 % accept according

QAP720 (Quality Assurance Procedures).

6.4 Working process

6.4.1 Bonding operation

i. Choose can base on traveller information and install them in machine.

ii. PR image confirm

Wafer PR, confirm that hole location on top if can have hole.

Up-look PR, confirm that hole location on top if can have hole.

Post bond PR, confirm that image created without solder and position

in centre of guard ring.

iii. Can position confirm

Stick double-face pastern on dummy board, do not cover the centre

of the PCB.

Select “SET BONDING MAP” bottom, access to “Bonding Map Setup

Page”, setting to “ON” condition for “Customer Bonding” and “Bonding

Map” bottom.

Select left three column and right three column to enable, then run

the machine.

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 100% inspection under minimum 10x microscope, no rotation, ring is

clearly at round of can.

Confirm below bottom is “ON” condition, then can normal running.

6.4.1.1

6.4.2 Inspection procedure

i. 100% inspection dispense solder status as QAP720 required.

ii. Inspect P&P can status as QAP720 (Quality Assurance

Procedures) required.

iii. Detect mark method status as WI1308 required.

6.4.3 Needle and dispense adaptor change status

i. Needle and dispensing adaptor must be changed after machine

idle 6 hours.

ii. Needle and dispensing adaptor must be changed

at the beginning of a shift.

iii. Needle and dispensing adaptor must be changed after solder

change.

iv. Needle and dispensing adaptor must be changed

after needle clog.

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 v. Dispensing adaptor must be changed after needle

removal by operator.

vi. Operator need use dummy board, run all boards

after needle change / dispensing adaptor change /

program change. Run normal product after inspect

no any defective units.

6.4.4 Solder

i. The solder shall be vertical placed at refrigerator

and solder thawed state. Storage temperature are

different depends on supplier products.

ii. Operator shall take no any air bubble solder.

6.4.5 Change line

i. Based on AVI and traveller decide whether need change solder.

ii. Collect rest can in bowl and pack them in the bag

marked with P/N. Scrap the can on the guide.

iii. Collect can in bowl.

Open valve in the bowl.

Click “Bowl” to vibrate the can into collect box.

Pack the can in.

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 6.4.5.1 Metal can track

6.4.6 Non-Conforming Material Report (NCMR) job disposition

i. Based on NCMR rules defined, issue NCMR hold relevant job

and ask technician to check the machine.

ii. Once needle clog / needle broken / needle scratch PCB or find

air bubble in solder, stop machine immediately. Check

dispense solder status and do action as OCAP-Sisonic-14,

needle clog disposition.

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 CHAPTER 7

SISONIC PROCESS FLOW

7.1 INTRODUCTION

Sisonic process flow is a method of microphone unit according to a

predetermined sequence. This is to align the quality of products produced.

Sisonic microphone is in batch process, a batch of ten PCB board and one

board contains 600+ microphone before dicing.

There are 16 steps to complete this process :

Top side Bottom side

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i. FR4 Strip Attach

Assemble FR4 wall to base to make supporting for board clamping in

downstream Assembly Process.

Before After

ii. Plasma Clean

Plasma clean the wire bond PCB pad to remove any possible

contamination that could affect wire bond.

Before After

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iii. Die Bond

Die mount IC, MEMS. Place and attach the IC and MEMS onto the PCB.

Before After

iv. Curing

Curing, speed up DB IC / MEMS epoxy solidifying.

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 Oven

v. Wire Bond

Attach and bond the wires from MEMS to IC and to PCB pad per the wire

bond layout in the spec.

Wire bond process Before After

vi. Encapsulate

Dispensing the black epoxy to cover the IC

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 Encapsulation process Before After

vii. Curing

Curing, speed up encapsulation epoxy solidifying

Oven

viii. Dispense solder

Dispensing the solder to cover metal ground ring

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 Solder dispense process Before After

ix. Pick-n-place can

Pick and place metal can on the solder ring

Pick & place machine Before After

x. Reflow solder

Reflow the metal can and solder

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 Reflow machine Before After

xi. Laser mark

Laser Mark the job number on metal can for identification

Laser mark machine Before After

xii. Mount on tape

Mount the tape on the PCB to secure the units during the dicing process

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 Tape mount process Before After

xiii. Dice

Dice the board to single unit

Dicing machine Before After

xiv. UV Cure

To apply UV on the UV tape to reduce the stickinessso to release the

unit from the UV tape.

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 UV cure process Before After

xv. Final test

Every microphone is 100% electrical and acoustic tested.

Final test process Before After

xvi. Tape-n-reel

Standard reel packing

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 Tape-n-reel machine Before After

xvii. Warehouse

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 CHAPTER 8

CONCLUSION

8.1 Conclusion

Working with Knowles Electronic (M) Sdn. Bhd. is one of opportunity to learned

new knowledge in electronic. Knowles also mostly absorb training student

(internship) to grab opportunity to become permanent worker there. With a high

performance and good attitude, Knowles can give opportunity.

For a four and half months training period, a new knowledge were exposed. For

example, even from mechatronic course, student also can learn the system in the

production where the function of each machines and how it is work. To gain the

knowledge, an initiative attitude is applied. With an initiative to asked operator,

technician and engineer, new things were gain. With helping from other engineer

also can help in working. Getting information, collecting data and analysis the

data is one of routine task since internship period started. With own effort,

supervisor give a task and need to be handled. To do the task, communication

skills need to have. A good communication between workers (engineer, operator

and technician) needs to be applied. In this company, mostly they used English as

communication language. It is good in used because it will make other workers

understand and ease to working in group.

As mention above, new knowledge’s was gain. Therefore, new environments

were adapted. This is shows that from manufacturing course transferred to

electronic company make it differences changes in environment. But, the system

applied still the same. The Knowles Company also applied Lean manufacturing

system.

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 CHAPTER 9

COMMENT AND SUGGESTION

9.1 Suggestion

After lecturer visited, a recommendation was made which is internship students

need to extend internship period at least six months. It is because for that period,

more tasks can be given and can study more about machines. For the tasks

given, it is success made student understood about the works. Even not fully

enough the whole process was understood, but at least tasks given is success

finished.

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