GENERIC

PRODUCTION PROCESS CONTROL

REQUIREMENTS
GPRO_039
Prepared by: Øystein Larsen / Bo Damberg
Rev 11, Date 16.02.2018

www.eltek.com
 1 TABLE OF CONTENTS
1 TABLE OF CONTENTS..............................................................................................................2
2 SCOPE..........................................................................................................................................4
3 GENERAL....................................................................................................................................4
4 IPC STANDARDS.......................................................................................................................4
5 ROHS / WEEE / REACH COMPLIANCE...................................................................................5
5.1 Practical handling..................................................................................................................5
5.2 REACH compliance..............................................................................................................5
6 COMPONENTS AND ASSEMBLIES.........................................................................................6
6.1 Component Handling.............................................................................................................6
6.2 General handling of electronic components and assemblies..................................................6
6.2.1 EOS/ESD.......................................................................................................................................6
6.3 Storage...................................................................................................................................7
6.3.1 General requirements.....................................................................................................................7
6.3.2 Moisture sensitive components......................................................................................................7
6.3.3 Sealing/re-sealing...........................................................................................................................7
6.3.4 Temperature and humidity.............................................................................................................7
6.3.5 Baking of components and PCBA’s..............................................................................................8
6.3.6 Assembled Circuit Boards.............................................................................................................8
6.3.7 Electrolytic Capacitors...................................................................................................................8
6.3.8 Finished Modules...........................................................................................................................8
6.4 Incoming Inspection..............................................................................................................9
6.4.1 General requirements.....................................................................................................................9
6.4.2 Sampling from boxes...................................................................................................................10
6.4.3 Inspection records........................................................................................................................10
6.4.4 Findings/rejections in consecutive lots/batches...........................................................................10
6.4.5 Mechanical parts..........................................................................................................................10
6.4.6 PCB test coupons.........................................................................................................................11
6.4.7 Bare PCB, Additional Quality Control during IQC.....................................................................11
6.5 Tracking...............................................................................................................................12
6.5.1 Date Codes...................................................................................................................................12
6.5.2 Component in transit from storage to production........................................................................12
7 PRODUCTION...........................................................................................................................12
7.1 Housekeeping and environment...........................................................................................12
7.2 Reflow.................................................................................................................................12
7.2.1 Solder Paste Handling..................................................................................................................12
7.2.2 SMT Printing...............................................................................................................................13
7.2.3 Automatic component insertion (Pick and Place)........................................................................13
7.2.4 Reflow / Curing oven...................................................................................................................14
7.2.5 QA and touch up..........................................................................................................................14
7.2.6 BGA inspection and repair..........................................................................................................15
7.3 Manual component insertion................................................................................................15
7.4 Solder Wave........................................................................................................................16
7.4.1 Flux Application..........................................................................................................................16
7.4.2 Solder Profile...............................................................................................................................16
7.4.3 QA and touch up..........................................................................................................................17
7.5 Selective Solder...................................................................................................................18
7.6 Hand Solder.........................................................................................................................18
7.7 Cleanliness...........................................................................................................................18
7.8 Assembly.............................................................................................................................19
7.9 Testing and reporting...........................................................................................................19
7.9.1 Test equipment maintenance.......................................................................................................19
7.10 Rework.............................................................................................................................21
7.10.1 The Printed Board Assembly.......................................................................................................21
7.10.2 Basic Considerations....................................................................................................................21
7.10.3 Reporting and Fault finding.........................................................................................................21

GPRO_039 Generic production process control requirements Page 2 of 40

 7.10.4 Skill levels required.....................................................................................................................21
7.10.5 Max number of repairs.................................................................................................................22
7.10.6 Reuse of electrical components...................................................................................................22
7.10.7 Reuse of mechanical parts...........................................................................................................22
7.10.8 Re-use of screws..........................................................................................................................22
7.10.9 Retesting of disassembled and repaired PCBA’s and modules...................................................22
7.11 Process Capability and Yield Requirements....................................................................23
7.11.1 Use of Cpk Index.........................................................................................................................23
7.11.2 Use of SPC...................................................................................................................................23
7.11.3 First Time Pass Yield (FTPY).....................................................................................................23
7.12 Conformal Coating...........................................................................................................24
7.13 Serial number Labels.......................................................................................................24
8 PACKING AND SHIPMENT....................................................................................................24
9 DOCUMENT CONTROL..........................................................................................................25
10 COMMUNICATION ROUTINES.............................................................................................25
10.1 Contact Matrix.................................................................................................................25
11 CONTINUOUS IMPROVEMENTS...........................................................................................25

APPENDIX A, PCB MATERIAL SPECIFICATIONS.......................................................................26

APPENDIX B, PCB REQUIREMENTS.............................................................................................29
APPENDIX C, TEST COUPON REQUIREMENTS..........................................................................30
APPENDIX D, ADDITIONAL PCB TEST SPEC..............................................................................33
APPENDIX E, GENERIC REWORK RULES...................................................................................34

Version history................................................................................................................................41

GPRO_039 Generic production process control requirements Page 3 of 40

2 SCOPE
The scope of this document is to have a generic reference for the production process of our
products.
This document complements the IPC standards set as a minimum requirement from Eltek,
and shall serve an explanation to our requirements.

This document is necessary for all our sub-contractors to understand our specific
requirement in different parts of the process, and will also specify rules that may be stricter
than the general rules in the IPC standards with a specific reference to our type of products.

3 GENERAL
As an overall requirement for soldered electrical and electronic assemblies, Eltek specifies
IPC/EIA standard J-STD-001 to be used, complemented by the standard for acceptability of
electronic assemblies IPC-A-610, acceptance level according to Class 2. Eltek also fully
recommends IPC-HDBK-001 and IPC-HDBK-610 as handbook and guides to supplement J-
STD-001 and IPC-A-610D for better and deeper understanding of the standards.

4 IPC STANDARDS
Various IPC standards are referred to in this document.
The requirements in these standards are set as the minimum requirement from Eltek in all
areas, where no stricter rules have been specified by us, by our subcontractors or by the
component manufacturers. Eltek requires that the latest editions of the following IPC
standards are available at our subcontractors at all times. Our subcontractors shall check for
updates and new revisions once a year as a minimum.
The following standards are referred to in this document, and shall be available at our
subcontractors:
-IPC-1750, “Family of Supplier Declaration Standards” (incl. IPC-1751/1752)
-IPC-1601, “Printed Board Handling and Storage Guidelines”
-IPC-4101, “Specification for Base Materials for Rigid & Multilayer Printed Boards”
-IPC-TM-650, “Test Methods Manual”
-IPC-A-600H-2010, “Acceptability of Printed Boards”
-IPC-1066/J-STD-609, “Marking, Symbols & Labels for Identification…”
-IPC-1710, “OEM Standard for Printed Board Manufacturers Qualification Profile”
-IPC-7351, “Generic Requirements for Surface Mount Design & Land Pattern Standards”
-IPC-J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”
-IPC-A-610DC, “Telecom Addendum”

-IPC-A-610, “Acceptability of Electronic Assemblies” (Class 2 as minimum requirement.

Class 3 is required for automotive products unless otherwise is agreed with Eltek)
-IPC-9502, “PWB Assembly Soldering Process Guidelines for Electronic Components”
-IPC-6011/6012, “Qualification and Performance Specification for Rigid Printed Boards”
-IPC/JEDEC J-STD-020 & IPC-9503, “Moisture/Reflow Classification of Components”
-IPC/JEDEC J-STD-033, “Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices”
-IPC-M-109, “Moisture Sensitive Components IPC Standard Guidelines”
-IPC-CC-830, “Qualification and Performance of Electrical Insulating Compound for Printed
Wiring Assemblies”
-IPC-HDBK-830, “Guidelines for Design, Selection and Application of Conformal Coatings”
-IPC-7711 / 7721, “Rework / Repair and modification of Electronic Assemblies”
-ANSI/ESD S541-2003 (incl. ANSI/ESD-20-20-2007), “ESD standards”
5 ROHS / WEEE / REACH COMPLIANCE
All Eltek products shall comply with EU-RoHS/WEEE requirements, and also comply with
China RoHS, California RoHS, Korea RoHS and similar requirements in other
countries/areas world-wide. In practice this means that documentation have to state the
compliance e.g. by COC’s (Certificate of Compliance) and by continuous sample testing (e.g.
by XRF testing) of all materials used in our modules and systems.
All Eltek sub-contractors (CMS) and suppliers, also have to comply with these requirements.

5.1 Practical handling

All RoHS parts and components shall be handled carefully and be 100% separated from
Non-RoHS parts and components, to avoid risks and chances for cross contamination. IQC
areas, storage/warehouse areas and delivery areas shall be marked with labels, signs and/or
relevant markings, to avoid any confusion between RoHS / Non-RoHS separated areas.
Worktables in these areas also have to be separated and marked correctly. In production,
test and packing areas, the same rules are valid. Worktables, storage boxes, tools,
soldering / inspection / assembly and test equipment shall be marked, to avoid any cross
contamination. Eltek will not accept the use of equipment that has been run in Non-RoHS
production at earlier stage, unless if supplier can prove that it’s been tested / measured
/checked and found acceptable for the use during RoHS production.

5.2 REACH compliance

Manufacturers must now register and identify the dangers from their substances, assess
potential risks and stipulate measures to rule out any damage to health and the environment.

All topics related to procedures to achieve “Full REACH Compliance”, can be found at
http://ec.europa.eu/growth/sectors/chemicals/reach/
6 COMPONENTS AND ASSEMBLIES

6.1 Component Handling

6.2 General handling of electronic components and assemblies

Component handling shall be kept to a minimum.

All handling of electronic components and assemblies shall be performed in a way that
protects them from electrical, mechanical and environmental damage.

Active components or assemblies used for demonstration or exhibition purposes, where the
handling procedures in this document are not followed, must be clearly marked as not fit for
use or be obviously disabled.

The minimum requirement set by Eltek is as specified in IPC-A-610 chapter 3.

6.2.1 EOS/ESD
The Contract manufacturer shall establish and implement a documented ESD control
program in accordance with ANSI/ESD S541-2003 and ANSI-ESD S20 20 -2007.

For specification of the EOS/ESD protection, IPC-A-610 chapter 3 shall be followed.

General rules:

 All personnel (including managers and visitors) must be properly protected before
entering any production area. Test stations must be available at every entrance for
self-checking.

 Active components shall only be handled by personnel who are grounded via wrist-
straps or through dissipative footwear and a dissipative floor.

 Any equipment used to process the components shall be earthed at appropriate

contact points to prevent high voltages appearing on the components.

 Where anti-static precautions are being taken to protect components or assemblies

the anti-static equipment shall be regularly checked. This includes checking the
resistively and ground connection of anti-static surfaces, floors, wrist-straps and
footwear.

 All handling of electrical components, boards and assemblies shall only be done by
operators protected with special ESD gloves or finger cots, also for the protection
against ionic and non-ionic contamination

6.3 Storage
6.3.1 General requirements
Products or items for incorporation into products shall be stored in a way that protects them
from electrical, mechanical and environmental damage.
Items not for use or items for scrap shall be individually marked or segregated into marked
areas or containers

Active components shall be stored in antistatic packages or kept on antistatic surfaces before
installation on boards. The manufacturer’s original packaging may be used for storage where
this is deemed adequate to protect the components.

6.3.2 Moisture sensitive components

Eltek refer to the guideline manual IPC-M-109 for moisture sensitive component standards
and guidelines as classifications and use of moisture sensitive components.

This manual lists a lot of IPC standards that we will be referring to for minimum requirements
regarding classification (IPC/JEDEC J-STD-020 and IPC-9503), handling, packing, shipping
(IPC/JEDEC J-STD-033B.1) and assembly soldering process guidelines (IPC-9502).

The methods and requirements as described in these standards are set as the minimum
requirement for handling of moisture sensitive components, if no stricter specifications have
been set by the component manufacturer or by Eltek. Especially note components with MSL
from level 3 (168 hours) and above.

6.3.3 Sealing/re-sealing
Components in sealed bags shall be kept sealed until use on assembled boards. When only
part of the components in a sealed bag is to be used in production, the bag shall be resealed
immediately to protect the remaining components in the bag.

The floor life specified for each moisture sensitive component is specified by the
manufacturer. After opening a sealed package, the floor life begins immediately.

6.3.4 Temperature and humidity

All active and passive components used in Eltek’s products shall be stored in rooms with
temperature and humidity control to not compromise the component performance and
lifetime. Storage conditions required are specified by the moisture classification level
specified by the manufacturer. The minimum requirement is set by the standard
EIA/JEDEC/IPC J-STD-020 / 033B.1.

As an overall rule, unless stricter rules apply from the part manufacturer, Eltek has specified
the following storage conditions for components used on our assemblies as follows:

 All PCB’s and IC’s shall be stored in sealed bags, with a temperature range
on 18°C – 24°C and humidity within 20% - 75%.

 All other active and passive components can be stored with a temperature range
on 18°C – 28°C and humidity within 20% - 75%.

6.3.5 Baking of components and PCBA’s

When component have exceeded the maximum allowed floor life, it is possible to bake the
components to dry out the moisture and reset the floor life. See J-STD-033, chapter 4 –
Drying.

Please note the maximum drying time for baking temperatures between 90°C – 125°C to
avoid oxidation and solder problems.

For baking of populated boards after rework, see J-STD-033, chapter 6.2. Note that PCB
material FR-4 and electrolytic capacitors have limitations to baking temperature and duration.
6.3.6 Assembled Circuit Boards
Minimum requirements for handling and storage of assembled circuit boards, as specified in
IPC-610 latest rev.

Assembled circuit boards shall be stored in one of several ways:

1 In anti-static bags or on anti-static surfaces, but not stacked on top of other boards
2 In anti-static bags inside rigid boxes
3 In appropriate rigid anti-static containers
4 In anti-static racks

Preliminary storage of partly assembled boards in production shall be kept to an absolute

minimum due to solder ability of components, where oxidisation of the component legs is a
known problem. If storage of partly assembled boards is necessary, a protective cover
against dust or other contaminants is demanded.

All boards and modules shall be dispatched according to Eltek specification.

Eltek specifies the maximum storage time for assembled circuit boards to be 6 months from
production date. If longer storage is required, the modules shall be stored in an air
conditioned storage facility with max 28°C temperature and max 75% humidity.

6.3.7 Electrolytic Capacitors

Electrolytic capacitors shall not exceed their recommended storage time. Eltek specified
maximum storage time as two (2) years, if not stricter requirements are specified from
manufacturer. When capacitors exceed the recommended storage time, Eltek shall be
notified before the components are put in production. Special precautions and re-charge
procedures may be requested.

6.3.8 Finished Modules

Minimum requirements for handling and storage of assembled circuit boards, as specified in
IPC-610 latest rev.
Eltek specifies the maximum storage time for finished modules to be 6 months from
production date. If longer storage is required, the modules shall be stored in an air
conditioned storage facility with max 28°C temperature and max 75% humidity.
If storage time exceeds two (2) years, Eltek shall be notified before the modules are shipped
to customer. Special precautions and re-charge procedures may be requested.

6.4 Incoming Inspection

6.4.1 General requirements
Eltek require use of AQL tables for specification of sample size and acceptance rate based
on minor, major or critical items, for all incoming parts. This can be fulfilled by onsite IQC or
as a SI (Site Inspection) at the Sub-supplier. If SI is used to replace the IQC, then the SI
must be done by an operator from the supplier (stationed at the sub-supplier), or by an
independent third party. An approved SI cannot be fulfilled by operators from the sub-
supplier themselves.

Sample size and acceptance rates for parts shall be specified according to ANSI/ASQC Z1.4,
the ISO 2859 standard or other equal standards that meet the same criteria’s.

For all made to drawing, or made to specification parts, like PCB, Magnetics,
mechanical parts, use the following AQL level for cosmetics, colour and general
quality:
 AQL General Inspection Level 2
For Critical items: Eltek require to use AQL 0 (None accepted)
For Major items: Eltek require to use minimum AQL 0,65
For Minor items: Eltek require to use minimum AQL 2,5

Specifically for dimensional measurements according to drawing, a fixed sample size

must be agreed with Eltek per different part group/category instead of the AQL
sampling plan.

Note: To deviate from this requirement, and perform less inspection, one of the
following criteria’s needs to be met:

 We need a firm agreement of outgoing quality inspection from the supplier that meets
our required specification and inspection criteria’s. This agreement must be specified
in the PQP (Product Quality Plan) for the part, and the evidence of such inspection
records audited minimum yearly
 A written agreement with Eltek allowing you to deviate from this requirement

For all commodity electronic components, like resistors, transistors, capacitors,

commodity magnetics, etc, use the following criteria’s for general quality inspection:

AQL General Inspection Level 1

For Critical items: Eltek require to use AQL 0 (None accepted)
For Major items (incl. function): Eltek require minimum AQL 0,4
For Minor items(not affecting performance): Eltek accept AQL 2,5

Specifically for functional measurements according to datasheet, a fixed sample

size / lot must be agreed with Eltek per different part group/category instead of the AQL
sampling plan.

For all other commodity components, like wire, screws, washers, tape, carton inserts,
etc, use the following criteria’s:

AQL General Inspection Level 1

For Critical items: Eltek require to use AQL 0 (None accepted)
For Major items (incl. function): Eltek require minimum AQL 1
For Minor items: Eltek accept AQL 2,5
6.4.2 Sampling from boxes
Samples shall be taken from as many random boxes/inner boxes in incoming shipment as
possible, not all from one box. I.e. if sample size is 20 and you received 2 boxes, take 10 pcs
randomly from each box.

6.4.3 Inspection records

All inspections shall be recorded. Preferably electronically, but we can also accept manual
(paper) if the system can be efficiently back-traceable and you fulfil our storage requirement.
Eltek require storage of records for 5 years.

6.4.4 Findings/rejections in consecutive lots/batches

If a problem is found in two consecutive shipments or lot’s, resulting on lot rejection, the
issue must be escalated to Eltek and proper corrective actions determined towards the
supplier.
6.4.5 Mechanical parts
Eltek use Inspection Dimensions in the newest mechanical drawings, specifying some
dimensions that must be controlled and recorded in the incoming inspection as a minimum.
The dimensions measured/controlled in the IQC shall always include, but not be limited to,
these dimensions. If nothing is pre-specified in the drawing, a set of critical dimensions must
be chosen by the CM, and agreed with Eltek.

If terms as Special Characteristics and/or Critical Characteristics are used in the

drawing, this means that incoming inspection needs to measure these dimensions with
special attention and make a dimensional report with Cpk study for these dimensions on
minimum 20 parts. See Table 1 for specifications.

SC and CC dimensions shall be reported specially in a PQP, with a dimensional report from
IQC. If the SC/CC dimensions are related to assembly, a dimensional report must be
submitted from production.

This dimensional report can be obtained from the supplier of the part directly, before
shipping, instead of doing this as a part of IQC.

Table 1, Special and Critical Characteristics requirements

6.4.6 PCB test coupons
Eltek has designed a test coupon type and method which we strongly recommend be used
by the PCB manufacturers to keep good quality control, early detection of process problems
and for traceability of quality.

Eltek always recommend the PCB supplier to do 100% testing of the PCB test coupons
themselves, but this is something that should be agreed together with Eltek for each PCB
manufacturer, based on experience, volume and quality performance records.

Minimum 50% of the test coupons should always be sent to the Eltek manufacturing site IQC
for storage, for traceability and investigation possibilities at a later stage. If the coupons are
not tested, all coupons should be sent. This test coupon gives Eltek the possibility to trace
back to search for quality issues and root causes in a specific batch. The detailed
requirements of the test coupon are specified in Appendix C.
6.4.7 Bare PCB, Additional Quality Control during IQC
Refer to Appendix D for detailed description of this test;
When receiving new PCB shipments, an extended quality control of the bare PCB shall be
done for chosen/strategic products. Take 1 pc bare PCB (Or use the test coupons if
available) from actual production batch and run this 4 times (6 times when specially agreed)
through the reflow oven. After this, the PCB shall be inspected visually for discoloration,
blisters, delamination and warpage (measured to meet IPC-spec.).

- If any related errors are found, the whole batch shall be quarantined in MRB for a
possible reject, and Eltek alerted.
- Also, the PCB supplier shall immediately be contacted and informed about the
findings and request for 8D report
- If this issue is found during production, a production “STOP ORDER” have to be
initiated to get full overview of the material situation

6.5 Tracking
6.5.1 Date Codes
All components with date codes shall be tracked, and used according to the FIFO (first in,
first out) principal. In the traceability system, it is required that there are correlation between
component Manufacturer/date code/Lot code and finished goods serial numbers, both ways.
6.5.2 Component in transit from storage to production
The maximum floor life for components with a moisture classification level is specified in J-
STD-033B.1, table 5-1 (page 10).

When removing components from a sealed bag, or the appropriate storage facility, the
components shall be tracked and the maximum time in open air before soldering (floor life)
not exceeded, so that the component quality is not compromised. For component handling
during the transit stage prior to soldering, see component handling chapter.

7 PRODUCTION
7.1 Housekeeping and environment
The production floor and facilities shall be kept tidy and clean at all times.

Paper card boxes, styrofoam materials, plastic non-esd filling materials and other packing /
shipment materials with loose particles, shall not enter the production environment areas.
Unpacking of materials shall take place at warehouse/storage areas or in separate rooms.
Loose particles picked up by the production equipment and PCB is a source to process
failures, causing halting and the need for rework. It will also cause hidden failures that will
affect the products life.

In general, investigations have shown that 80% of contaminants are introduced to a “clean
area” by people and products (dust, fibres and hair), 15% are generated by equipment and
5% are generated by the room’s filtration system! Contaminants are attracted to the
substrate because of static charge.

The contract Manufacturer is responsible for implementing a production process where the
above described contamination is avoided in the best way possible by means of proper
equipment and procedures. Common routines and rules must be established and followed in
the production area. The procedures shall focus on the areas of production which are most
critical when it comes to contamination from loose particles.
Temperature in the production shall be between minimum 18°C and maximum 30°C. The
relative humidity must be between 30% (due to ESD) and 75% (due to corrosion and
component moisture entrapment hazard).

7.2 Reflow
7.2.1 Solder Paste Handling
Many of the problems encountered while using solder paste may be attributed to the
methods by which the paste is transported, received, stored and applied. By controlling these
handling methods, many past-related problems can be reduced or eliminated.
The contract manufacturer shall have procedures and routines covering the following key
topics regarding solder paste handling:
 Heat
 Moisture
 Freezing
 Transport
 Receiving
 Storage
 Printer area conditions
 Paste Preparation
 Thawing
 Mixing
 Shear-thinning
 Re-using of “old” paste.

7.2.2 SMT Printing

Regardless of the method being used to print glue and solder paste, automatic in-line printer
or manual printer, accuracy is vital for an optimal reflow process.

The contract manufacturer shall have a procedure for tuning in the printing operation to avoid
all known problems related to this process, such as:
 Scooping
 Bleed-out
 Bridging
 Torn Prints
 Over-Driving the Board
 Clogged Stencils
 Dog Ears/Peaking
 Excessive solder paste
 Solder balls
 Solder beading
 Tomb stoning, etc.

The need for board support in the screen printer must be determined for each different board
type. But as a general rule, it is recommended to have on all boards. Board support width
shall match board and squeegee width as minimum. Proper maintenance procedures must
be established for both stencil and printer cleaning;

Stencils must be cleaned frequently to ensure total removal of any bottom side residues, but
not so infrequently as to allow the same residues to dry or cake on, making their removal
much more difficult. When cleaning the stencil by hand, use a lint-free cloth.

Printer must be cleaned on a regular basis to avoid any of the above problems. Contract
Manufacturer must detect the need for cleaning and frequency based on testing.

A separate maintenance procedure for the SMT printing equipment must be in place.

7.2.3 Automatic component insertion (Pick and Place)

Adequate board support combined with correct placement pressure is vital in this process to
avoid parts moving or being thrown off and board bounce. The need for board support must
be determined for each different board type.
Contract manufacturer must determine all variables in this process to tune the pick and place
to gain an optimal level of quality.

If experiencing problems such as billboarding of the components, or general component

misalignment, the need for adjustment of the pick and place process must be investigated for
optimization.

Pick & Place machines shall be checked and calibrated once a year as a regular routine, and
every time a machine has been moved out of position and when misaligned component no’s
on PCB exceeds limitations. Therefore, these limitations must be defined for each machine
type.
Keep touch-up work down to an absolutely minimum.
7.2.4 Reflow / Curing oven
Profiles for both glue hardening, solder reflow and conformal coating curing/drying, must be
developed and stored.

If the temperature profile is developed incorrectly, or is out of control, any range of defects,
including premature field failures, can occur.
Therefore, an optimized temperature profile shall be tuned in and agreed with Eltek for each
different product.

A partly assembled board shall be used to measure the solder profile. The need for
assembled components on the board, and sensor placement, shall be agreed with Eltek.

The agreed temperature profile and test board setup (the need for assembled components
and sensor placement) shall be stored for reference. Changes to this profile shall be agreed
with Eltek according to process change management rules.
7.2.5 QA and touch up
QA inspection of the PCBA after reflow solder process shall contain the following:

 Visual inspection of the soldered boards shall be in accordance with IPC J-STD-001 /
IPC-A-610 acceptance level class 2 as a minimum requirement. For automotive
products, class 3 shall be used unless otherwise is agreed with Eltek.

 Off-line sample inspection after soldering shall be defined. Use a high magnification
microscope (minimum 40x magnification) for inspection. Results shall be logged and
controlled by SPC. Feedback routines for upstream process shall be defined.

For pre-run and testing on new products, or if problems occur due to solder quality, use a
microscope (minimum 40x magnification) to inspect the quality of the soldering joints.

For qualification of SMT solder alloy and solder process during NPI, Eltek require micro-
section and microscopics lab test to be done in specified areas of the board, where solder
quality and IMC is qualified according to IPC-A-610, and also shear testing for testing IMC
strength according to AEC-Q200 and/or JIS-Z3198-4. Approval according to relative
measurements using golden samples, with minimum break force of 1,8kg / 60 sec force
application for ceramic SMT components size 0201 and upwards.

Inspection with micro section shall be performed on new products to determine the solder
joint quality after the solder profile has been tuned in. This shall be done in agreement with
Eltek and be a part of the approval process for the solder profile.
Keep touch-up work down to an absolutely minimum, by optimizing the temperature profile in a
best possible way. Touch-up joints are normally the ones that fail first because of additional
thermal stress and intermetallic formation that occurs during touch-up.

If touch-up is performed, it shall be done in accordance with IPC J-STD-001 for rework and
repair (chapter 12). For a thorough explanation of the IPC standards for rework and repair
requirements, Eltek refers to IPC-7711 / 21.

For touch-up of SMD defects that involves removing a chip component from the pads and re-
solder, such as tombstoning, billboarding, etc., it is not allowed to reuse the chip
components. This is to be classified as a repair, and the chip components must be scrapped
and replaced with new components.

Note: Chapter 8.3.2.9.1 in IPC-610 specifies that it is acceptable with Billboarding

(mounting on side), if the SMD component with (W) to height (H) ration does not
exceed 2:1 ratio. All Eltek products are designed to survive periodically high
vibrations, and we do NOT accept Billboarding of any SMD components independent
of W to H ratio.

For mounting SMD components upside down, chapter 8.3.2.9.2, this is specified as
acceptable for Class 1, but process indicators for Class 2, 3 in IPC-610. Eltek does
NOT accept any SMD component mounted upside down.

7.2.6 BGA inspection and repair

For all products where BGA’s are used, it is very important that the QA inspection is
equipped to find solder failures. Eltek require 100% inspection of BGA’s, i.e. all BGA’s must
be checked with an approved technique.

When inspecting BGA’s in-line, special optical methods can be used to find solder shorts and
insufficient solder quality of the hidden solder joints of the BGA, such as Ersascope or similar
optical techniques.

For process set-up and regular off-line inspection, X-ray shall be used to verify the soldered
BGA.

A BGA can only be repaired if specialized de-solder equipment for BGA is used, and the
rework application and operator approved by Eltek. After repair/change, inspection must be
done by the optical equipment and/or X-ray on 100% of the repaired BGA’s.

7.3 Manual component insertion

All PCBA are fragile, and bending the cards may cause cracking of ceramic components
(SMD capacitors are very exposed to failures caused by rough handling).

During manual insertion of through-hole components, care shall be taken when handling the
boards. All operators involved in this type of operation must be informed that the cards shall
not be bent, and shall be handled as such.

Eltek require strain gage analyses to be performed on the board during NPI for all fixtures
and machines (Example; panel separation machine, ICT/PCBA fixtures) and the result must
be approved by Eltek during product process approval. Eltek also recommends
requalification of fixtures and machines after main (yearly) maintenance by strain gage. Eltek
is following the “Bosch procedural rule AE/ETS2” of not exceed the limit of +/- 800µm/m.
Manual bending of component legs to keep the component in place shall be kept down to an
absolutely minimum, and must be in accordance with IPC J-STD-001 / IPC-A-610
acceptance level class 2. In all cases of manual bending of component legs, Eltek must be
consulted and must approve such solution during product process approval.

Generally, solder fixtures shall be used to keep components in place during the wave solder
process if this is a problem. Arms/springs to hold the component in place can be attached to
the fixture.
For preliminary storage of assembled circuit boards, strict rules apply. See under chapter
Storage of Assembled Circuit Boards.

7.4 Solder Wave

7.4.1 Flux Application
Spray fluxing is the preferred method for no-clean and VOC-free flux application. It is much
more controllable over the old method of foaming. Spraying will give you a more reproducible
process window.

It is very important to achieve an even population of the flux on the board. This shall be
tested using a recognised method. A good method is to use a bare PCB, or a glass LEV
Check, confirming that thin and even layer of flux over the complete board. Remove the PCB
just after passing through the fluxer unit and the air knife. Also check for evidence that the
flux has entered plated through-holes. This can be tested by covering the top side of the bare
board with thermal paper (fax paper) and let it pass through the flux spray. Inspect the paper
to find that it has been wetted by flux through all the through-holes.

Testing of the application of flux shall be done before each production batch, and on a
regular basis based on necessary interval. The Contract manufacturer shall make a
procedure for this, and apply a routine to test this on a regular basis.

7.4.2 Solder Profile

A solder profile for each different product shall be developed and stored.

Make sure that the pre-heat section temperature is according to the flux manufacturer
specification, but in any case above 100°C, to activate the flux.

If the solder wave contacts settings (length, time and wave level) and temperature profile is
developed and set incorrectly or is out of control, any range of defects, including premature
field failures can occur. Defects often caused by incorrect wave solder settings are: De-
wetting or non-wetting, Bridging, Webbing, Micro/Solder balls or Splatter, excessive solder,
insufficient solder flow-through, solder voids or out-gassing causing blow-holes, icicles, skips,
etc.

Therefore, an optimized wave solder profile shall be tuned in and agreed with Eltek for each
different product.

A partly assembled board shall be used to measure the solder profile. The need for
assembled components on the board, and sensor placement, shall be agreed with Eltek.

The agreed wave profile and test board setup (the need for assembled components and
sensor placement) shall be stored in a database system for each product. Changes to this
profile shall be agreed with Eltek.

7.4.3 QA and touch up

Touch-up is a negative process indicator, and a target for a maximum touch-up % must be
agreed with Eltek.

QA inspection of the PCBA after the solder wave process shall contain the following:

 Visual inspection of the soldered PCBA’s shall be in accordance with IPC J-STD-
001 / IPC-A-610 acceptance level class 2 as a minimum requirement. For automotive
products, class 3 shall be used unless otherwise is agreed with Eltek. The minimum
requirement is a 4x Magnifier for this inspection.

 In-line sample inspection after soldering shall be defined. Use the Video Inspection
System that Eltek has provided during this work. Results shall be logged and
controlled by SPC. Feedback routines for upstream process shall be defined.

 X-ray inspection: During every work shift, min. 2 samples of each module type shall
be inspected for solder joint fillings on thru-hole components and overall solder joint
quality. First sample shall be taken from the beginning of work shift; 2nd sample after
lunch break or 4 hrs later. If two work shifts pr. day, repeat sample schedule once
more.
For customer modules with special requirements, the sample interval may deviate
from this schedule. Finally a report shall be made and saved for each inspection
sample.

For pre-run and testing on new products, or if problems occur due to solder quality, use a
high magnification microscope (minimum 40x magnification) and/or the Video Inspection
system plus the X-ray machine to inspect and verify the quality of the soldering process.

Inspection with micro section may be required on new products to determine the solder
quality after the solder profile has been tuned in. This shall be done in agreement with Eltek
and be a part of the approval process for the solder profile.

Keep touch-up down to an absolutely minimum, by optimizing the solder profile in a best
possible way. Touched-up joints are normally the ones that fail first because of additional
thermal stress and inter-metallic formation that occurs during touch-up.

If touch-up is performed, it shall be done in accordance with IPC J-STD-001 for rework and
repair, chapter 12. For a thorough explanation of the IPC standards for rework and repair
requirements, Eltek refers to IPC-7711A / 21A.

Note: SIL pads and clips can never be reused. When removing cooling clips and SIL
pads / isolation pads during disassembly of a semiconductor, always scrap the clip
and pad and replace before assembly.

7.5 Selective Solder

Selective solder machines can be used in certain areas where a solder wave is insufficient or
cannot be used. There are many different selective solder techniques and different
machines. Choose the machine and technique suitable for your application or challenge. As
standard, this decision should ideally be made in the DFM processes to make sure you
layout for good process reliability. Each process demands a special PCB layout
To realize optimum soldering results, there are some specific process conditions that have to
be met.

To a high degree, process reliability with selective solder depends on:

• The design of the pads (type, distance between each other).

• The distance between pad and neighboring component pad
(e.g. SMD which is not supposed to be touched)
• The pin length underneath the board
• The pitch between pins (e.g. pitch of connectors)

These influence coefficients affect directly the peel-off of the flowing solder. To ensure no-
bridging results, a defined and reproducible peel-off is required. Bridges are the main
soldering failure (more than 80 %).

For QA and touch-up, refer to the same chapter under solder wave/ QA and touch up.

7.6 Hand Solder

Hand solder shall be done in accordance with IPC J-STD-001 and IPC-A-610 as a minimum
requirement.

Extra flux used during hand soldering shall be approved by Eltek. Keep the usage of extra
flux down to an absolutely minimum to avoid electro migration in field.

Use No-Clean cored wire, and make especially sure that operators use ESD gloves or Finger
cots during this process. One fingerprint in the wrong place can cause electro migration. The
operator shall heat the component lead and flow the solder onto the pad – not heating the
cored wire directly.

Proper training of operators shall be performed acc. to IPC-A-610 latest rev. An approved
hand solder certificate shall be issued and afterwards maintained / re-issued every 2nd – 3rd
year.

Hand solder training shall be held on a yearly basis for all operators used for touch-up and
rework/repair.

7.7 Cleanliness
In general, “No-clean” fluxes are used on Eltek assemblies and shall not be cleaned. This
means that no further cleaning shall take place unless absolutely necessary or required.

If cleaning is necessary or required to obtain acceptable FPY on PCBA testing, it must take
place according to Eltek specifications and instructions. Special and dedicated cleaning
materials for removal of “No-clean” flux have to be used. Pure IPA (isopropyl alcohol) shall
not be used.

Inspection of post-solder cleanliness shall be done for each new production batch, and on a
regular basis for each product. The Contract manufacturer shall make a procedure for this,
and establish routines for testing of post-solder cleanliness on a regular basis. The frequency
of the sample testing during production shall be agreed with Eltek.

In general, the IPC J-STD-001 shall be followed as minimum criteria for testing cleanliness.
This standard specifies IPC-TM-650 for specification of the test method.
Eltek requires that all our products are tested by means of ionic residues tester and rosin flux
residues tester on a sample basis as described above.
When discrepancies are found, efforts shall be taken to determine at what stage in the
production process the residues origins and actions shall be taken for improvements.

7.8 Assembly
Assembly shall be performed according to Eltek specifications and assembly drawings, in
accordance with IPC J-STD-001 chapter 1.11 and 1.12.

If cleaning and coating is required during the assembly process, follow the instructions given
by Eltek. This shall be done in accordance with IPC-CC-830B.

Take precautions when handling the electronic assemblies. See Component Handling
chapter.

7.9 Testing and reporting

Testing and reporting shall be performed as specified by Eltek in the test manuals for each
product.

Test results shall be stored for statistical reasons, according to specification by Eltek QA
department.
Failure reports and repair reports shall be filled in correctly, so that statistics on production
failure rate stay accurate.

Failure reports shall specify basic data (Eltek part number, serial number, batch number,
date, etc.). It is also very important to specify failed test point referred to the test manual,
specify symptom and Operator ID. Repair reports shall specify basic data (as above), failure
classification (component failure, workmanship, etc.), free text failure description, all
components changed

The Contract Manufacturer shall not divert on any point from the released test manual or
procedure given by Eltek, unless a formal permission (Change Order or Temporary
Permission) is given.
The test equipment shall not be changed in any way, unless approved by Eltek.

7.9.1 Test equipment maintenance

The test equipment shall work correctly at all times, and the Contract manufacturer is
responsible for making sure that all Eltek products are tested as intended and specified by
Eltek. The Contract manufacturer shall develop control and maintenance routines for all test
equipment, with specified service intervals for all parts that must be changed out on a regular
basis such as contacts, plugs, test needles, switches, circuit breakers, etc. (Parts exposed to
mechanical wear and tear) acc. to Eltek document no. 2026491 “GPRO_039 Generic
Production process control requirements – ”. Ask Eltek to get this document from our ERP
system, if not received.
7.10 Rework
7.10.1 The Printed Board Assembly
The IPC standard that covers procedures for repairing and reworking printed board
assemblies, IPC-7711/21, shall be followed as a minimum requirement and guide for which
methods, tools and materials to be used in a modification, rework and repair.

For acceptance of the reworked PCBA, the IPC standard IPC-J-STD-001E, “Requirements
for Soldered Electrical & Electronic Assemblies” shall be followed together with IPC-A-610E,
“Acceptability of Electronic Assemblies” (Class 2 or 3, according to agreement with Eltek for
the specific product).

For more specific instructions, see Appendix D, Generic Rework rules.

7.10.2 Basic Considerations

Tools and equipment must be appropriate to variety of tasks to be performed. The work area
and tools used must be ESD/EOS safe, the lightning must be good.

All work on lead free and non-Lead free electronics must be properly segregated (workbench
and tools) and the operators must be given clear instructions on how to avoid mix and cross
contamination.

For the safety of the operators, appropriate fume/smoke extraction during soldering must be
in place.

With regards to storage of component and PCBA’s in repair areas, the general rules for
storage of electronic components and assemblies apply.

For further info and details on basic considerations, see chapter 1.7 – 1.9 in IPC-7711/21.
7.10.3 Reporting and Fault finding
All rework and repair on all electronics, controlled by a serial number, PCBA and modules,
must be properly reported in WATS. All serial numbers in for repair must be given a repair
report as soon as possible.

Furthermore, all failures require investigation and root cause analyse, to prevent re-
occurrence.

For repeated failures that is not eliminated by the repair team and initial preventive actions,
Lean Six Sigma techniques for root cause analysis such as “5-Why”, Fishbone technique, or
a proper DMIAC project shall be initiated, and the failure cause and how to prevent it
properly documented in an 8D report.
7.10.4 Skill levels required
Operators performing modification rework and repair on any PCBA must be trained and
certified according to the above mentioned IPC standards, internally by IPC certified
instructor, or by an external training company. See chapter 1.4.5 and 1.6 in IPC-7711/21.

7.10.5 Max number of repairs

As a general rule, the maximal number of repairs on one PCBA during production is 2. After
two attempts of fault finding, repair/change of components and test on the same PCBA
without success, the PCBA shall be placed in an MRB area and Eltek shall be notified. Await
decision from the QA department and Eltek for further action.

Change of a single component more than one time is not allowed, due to the heat application
and danger of destroying the PCB surface and solder pad. PCBA must be placed in the MRB
area and Eltek shall be notified. Await decision from the QA department and Eltek for further
action.
7.10.6 Reuse of electrical components
Reuse of de-soldered components is not allowed. De-soldered components must always be
scrapped and changed out with a new.

7.10.7 Reuse of mechanical parts

Reuse of mechanical parts is allowed, but the repaired item shall always pass through a
visual inspection with regards to dents, scratches, cracks or any other mechanical damage
and be careful to inspect that any metal particles from disassembly are completely removed.

Exception:
This is not applicable for any GAP pads / SIL pads / isolation pads and cooling clips for
semiconductors. Used pads and clips must always be scrapped and replaced after
disassembly.
7.10.8 Re-use of screws
Reuse of screws is allowed, but the screw shall always go through a visual inspection for
damage to the groves and screw head. No burr, damaged grooves or damaged threads will
be allowed.

Make special note of screws used on aluminium parts. After disassembling the screw, a full
inspection of loose burr or metal particles may be necessary before re-assembly.

7.10.9 Retesting of disassembled and repaired PCBA’s and modules

All PCBA being modified or repaired shall always go through new PCBA tests before passed
on to next process step.

If a module is disassembled, it shall always go through and pass a new isolation test (HiPot
test), burn-in test, followed by a final function test before shipment.

7.11 Process Capability and Yield Requirements

7.11.1 Use of Cpk Index
The Cpk Index quantifies both the process spread and the centering of the process to the
upper and lower specification requirements. It is a measure of the actual performance and
capability of a process relative to the requirements. The Contract Manufacturer shall
implement SPC methods to control critical processes. Eltek might define some processes to
be covered by this requirement.

Where applicable the following process capability targets shall be met:

Eltek has defined the minimum acceptable Cpk level for individual processes to be 1.33 in
mass production. The target is always 2.
See below a table with a definition of Cpk levels.

Quality Condition Cpk Value

Inadequate
Capable, but below Eltek’s
acceptable level.
Satisfactory
Excellent
Super

Note: Other quality conditions and Cpk values are valid for automotive products (see also page 18).

7.11.2 Use of SPC

Statistical Process Control shall be performed in production processes where specified or
agreed with Eltek during NPI, or specified in drawings.

If our mechanical drawings or assembly and/or Customer interface drawings specify

dimensions/requirements as SC/CC (Special Characteristic/Critical Characteristic), the
following shall be done during NPI pre-production;

-Dimensional report, measuring minimum 20 parts and perform Cpk study for the PQP
-Evaluate the need for SPC and use of control charts in production for all SC/CC marked
dimensions/requirements
7.11.3 First Time Pass Yield (FTPY)
A process is defined as sequence of events or inputs resulting in an output. The process may
consist of one or several checkpoints. The term “single process” is used to denote any given
single checkpoint, including visual inspection where yield measurement takes place. The
term “cumulative process” is used to denote the aggregate value of yield measurements
taken at designated intervals along the entire process chain.

For Eltek products the First Time Passed Yield (FTPY) data shall be used to measure the
TEST process performance. FTPY shall mean that test has passed in first attempt. For test
the measurement shall be implemented as a “single process” measurement. If the WATS
system has been implemented the FTPY measured by WATS shall be used as reference.

Yield Condition Requirements

Below 90% Automatic Line Stop for any product released for mass
production. To continue production, Eltek must formally
approve either through Eltek QA representative verifying and
buy off the CM process or FAI resubmission from CM suppliers.
90 to 93% Yield far below accepted level. Corrective actions must be
implemented immediately and followed up. Mass production is
only accepted if field performance is judged not to be affected.
Equal to or above 93% Yield below accepted level. Corrective actions must be
implemented and followed up. Mass production can start but
yield must be continuous monitored and improved.
Equal to or above 97% Good – First Test Yield Acceptance Level. Improvement
process must continue to bring yield up to next level. Corrective
actions must be defined and followed up against due date.
Above 99,74% Very Good - Eltek Test Yield Goal.
(measured from last 1000 units)
7.12 Conformal Coating
Coating of assemblies shall be performed according to Eltek specifications and assembly
drawings, in accordance with IPC J-STD-001 and IPC-CC-830B.

General rules and guidelines for Conformal Coatings are also found in IPC-HDBK-830.
Coating materials used shall be according to Eltek specifications.
The same standard also applies for cleaning of PCB assemblies.

7.13 Serial number Labels

All products with serial numbering shall be labelled as specified in ETS, Eltek Tracking
System, unless other is specified by Eltek.

If a mismatch is discovered between the product revision in progress (released by Eltek), and
the product revision in ETS, Eltek shall be notified immediately.

The Contract manufacturer is responsible for making sure that correct label is mounted on all
products, and that the revision on the label and product revision always are the same.

8 PACKING AND SHIPMENT

The Contract manufacturer shall ensure that packing and shipment is as specified and
agreed with Eltek for each separate product.

9 DOCUMENT CONTROL
All production documents such as procedures, routine descriptions, manuals, etc. developed
by the Contract manufacturer for Eltek products and production process shall be given
document numbers and revisions and incorporated in a document control system approved
by Eltek QA department.

Mandatory production documents such as PFMEA, Control Plan and Process Flow Charts
must be synchronized and be kept up to date of any changes in production process and/or
new failures/risks based on internal production analysis and customer complaints leading to
FAR/8D reports.

10 COMMUNICATION ROUTINES
10.1 Contact Matrix
A Contact Matrix for the Contract Manufacturer shall be issued to Eltek outsourcing
department.
Eltek outsourcing department will issue a contact matrix for Eltek to the Contract
manufacturer.

11 CONTINUOUS IMPROVEMENTS
The Contract Manufacturer shall employ a philosophy of constant process improvements.
Regardless of whether the requirements in this document have been met, the Contract
Manufacturer shall continue the constant process improvement process to reach even higher
goals. In cases where design errors or weaknesses are preventing improvement progress,
the Contract Manufacturer shall report this to Eltek.
APPENDIX A, PCB MATERIAL SPECIFICATIONS

PCB laminate specification

Eltek rigid boards shall meet and fulfil the IPC-1751/1752, IPC-4101D/ (99+101+121), IPC-A-
600H-2010 std.
and other valid specifications listed in the “IPC Specification Tree” and requirements
specified in “Eltek – GPRO_039 : Generic Production Process Control Requirements”.
Boards shall be marked “Pb-Free” or acc. to IPC-1066/J-STD-609 (draft) std. All Eltek boards
and materials shall comply and be made acc. to RoHS6/WEEE requirements.

Marking/Symbol examples acc. to IPC-std.: e1 – SnAgCu

e2 – Other Sn alloys (i.e. SnCu, SnAg,
SnAgCuX, etc.) (No Bi or Zn)
e3 – Sn
e4 – Precious metals (i.e. Ag, Au, NiPd,
NiPdAu, but no Sn)
e5 – SnZn, SnZnX (no Bi)
ESD Pb/Lead-free e2 = other Sn alloys e6 – Contains Bi
(i.e. SnCu) like SN100CL alloy e7 – Low temperature solder (<150°C)
containing indium but no bismuth

PCB laminate type

Laminate material depends of requirements, design layout, no’s of Cu-layers.

General Rule for standard boards with < 8 Cu-layers:

FR4 (EPOXY GLASS) material - IPC 4101D/121 MIN TG 150°C – Low CTE/ ULV0, will meet
Eltek requirements, see text EXAMPLE OF PCB SPECIFICATIONS.

FR4 boards:
TG (Tg)= Glass transition temperature TG = Min. 150º C or higher
TD (Td) = “Break-down” temperature TD = average ca. 300-350º C
T260 = Time to delamination at 260ºC T260 = 5≈30 min.
CTE = Thermal expansion coefficient CTE = for boards and components should be equal.

CTE average values for FR4: X= 12-18 ppm; Y= 12-18 ppm; Z= 50-60 ppm (preTg); Z=200-300 ppm (post Tg)
Good quality boards are usually called: CTE LOW (value)

Results from our own experience, shows that FR-4 laminate types with Normal (low) Tg
value, which are not specified by manufacturer to meet “Lead-free” soldering process, shall
not be used in Eltek products. These low-cost materials very often have problem with
delamination and moist absorption related issues. Recommended laminate types are
therefore specified in the Gerber data text file, see text EXAMPLE OF PCB SPECIFICATIONS. All
Eltek boards shall meet requirements according to IPC-std. 6011/6012 and Eltek PCB
requirements.

PCB surface treatment

PCB’s shall have the following surface treatment:
Lead-Free HASL (Hot Air Solder Levelling) process with preferred alloy SN100C (CL) or
equivalent alloy (depending of solder supplier); LF HASL + Hard Gold; ENIG or other
specified surface treatment.

Exemptions from this rule might occur due to requirements or other process demands, see
also IPC -std. 6011/6012B
PCB Solder Mask / Resist
PCB’s shall be coated with solder mask/resist acc. to specifications in IPC-SM-840 and IPC-
6011/6012 standards. Solder mask/resist shall be compatible with “No-clean” solder paste
and fluxes, and all materials shall comply with RoHS6/WEEE requirements.

PCB layout & soldering requirements

Eltek boards shall have pattern layout, pad size, hole size and necessary distance clearing
between components acc. to IPC-7351 / J-STD-001D and IPC-A-610E std’s plus latest rules
for “Lead-Free” soldering.
During soldering, the following alloys should be used:
RoHS5:
Wave Solder, Rework/Repair and Reflow Solder: Sn63/Pb37 or Sn62/Pb36/Ag2
RoHS6:
Wave Solder, Rework/Repair: SN100C (or equivalent alloy); SAC 305; SAC 405
Reflow Solder: SAC 305; SAC 405; SN100C (or equivalent alloy)

PCB cleaning
PCB supplier shall guarantee that delivered boards are clean acc. to IPC-std. and Eltek
requirements, and shall be tested for ionic & non-ionic contamination based on J-STD-001
and IPC-TM-650 std’s.

Eltek boards are soldered with halide-free “No-clean” fluxes, and shall generally not be
cleaned after soldering. Only when special requirements occur, cleaning can be performed.
Ref: Cleanliness requirements in this document.

PCB testing
PCB’s shall be tested acc. to “SOLDER FLOAT TEST” per IPC TM-650A, 2.4.13, method B,
minimum 2 samples per lot. Test to be performed for a minimum of 10 sec at 315°C,
repeated 3 times per sample with no observable evidence of blisters or delamination. Cross-
section samples and COC (Certificate of Compliance) to be provided with each lot affirming
materials and construction conform to all noted printed wiring board requirements.

PCB handling and storage

All boards shall be handled as MSD’s (Moisture Sensitive Devices) and be shipped in ESD
safe air-sealed packaging materials with a Humidity Indicator Card (HIC) in each package
and stored properly acc. to instructions in IPC-JEDEC J-STD 020C and under general
requirement for storing

Storage of boards must take place in humidity and temperature controlled environment. If
open packages are found, pre-baking of boards should be performed before re-sealing with
vacuum or before usage in production.

During handling of bare boards in the production area, boards shall be kept free for moist,
dust, fingerprints and any other type of contamination. Operators handling the boards must
use finger condoms or protective gloves acc. to ESD-requirements.
EXAMPLE OF PCB SPECIFICATIONS IN GERBER TEXT FILE:
MANUFACTURING STANDARD: IPC-6011/-6012; IPC-A-600H-2010, Class2
PCB TYPE: 4 LAYER PLATED THROUGH
LAMINATE: FR4 (EPOXY GLASS) – Lead-free process compatible, IPC 4101D/121
LAMINATE TYPE - by manufacturer: ITEQ IT-158 ; Shengyi S1000 (Mid Tg / Low CTE materials)
(specify one of these in order)
MIN. TG: 150°C or higher / UL94 V-0
CTE – Z-axis: < 60 ppm / °C (Alpha 1) ; < 300 ppm / °C (Alpha 2)
OVERALL BOARD THICKNESS 1.6 mm +/- 10%
UL Recognition (approval): UR marking is required for all PCBs supplied to Eltek products
unless excluded by written agreement with the purchasing dept.
Flame retardant, UL94-V0
COPPER THICKNESS,TOP AND BOTTOM SIDE: 2 x 70 um. Cu. (to be specified - see example on next page)
COPPER THICKNESS, INTERNAL LAYERS: 2 x 70 um. Cu. (to be specified – see example on next page)
SURFACE TREATMENT: Pb-free HASL SN100C;HASL+Hard Gold; ENIG or other Eltek approved plating
process
SOLDER MASK: WET FILM TYPE
SOLDER MASK THICKNESS: < 2 OZ (outer layer Cu-th.ss) = min. 5 um SM th.ss of copper corner area
≥ 2 OZ (outer layer Cu-th.ss) = min. 8 um SM th.ss of copper corner area
(2 applications)
MANUFACTURER'S LOGO: LOGO AND PRODUCTION DATE TO BE READABLE IN SOLDER MASK
ONLY.
COMPONENT MARKING: YES, TOP SIDE
ESD MARKING: YES, TOP SIDE (symbol acc. to IPC-std)

ELECTRICALLY TESTED: YES

PACKAGEING: VACUUM PACKED / AIR-SEALED with solid quality bag incl. HIC-card in each
package
PCB SIZE: xxx.xmm X xxx.xmm
PANEL SIZE: xxx.xmm X xxx.xmm
TOTAL NUMBER OF HOLES: xxx EACH PCB
NUMBER OF HOLE SIZES: xx EACH PCB
MIN. TRACK THICKNESS: (to be specified) i.e. 8 mil TOP AND BOTTOM SIDE, 8 mil INTERNAL
LAYERS
MIN. COPPER INSULATION: (to be specified) i.e. 8 mil TOP AND BOTTOM SIDE, 8 mil INTERNAL
LAYERS
MIN. HOLE SIZE: 20 mil FINISHED PCB

NOTE: Silk-screen must be removed from pads.

Board-contur must be removed from artwork layers.
Hole sizes (plated through holes) is considered after plating.
All unplated slots must be routed with tolerance +0.15 -0.0

Example of PCB: CONSTRUCTION DETAILS 4 LAYERS:

---------------------------------------------70um Cu TOP SIDE

/////////////////////////////////////////////
MIN 0.4mm PREPREG
/////////////////////////////////////////////
---------------------------------------------70um Cu INTERNAL LAYER #1
/////////////////////////////////////////////
MIN 0.4mm CORE
/////////////////////////////////////////////
---------------------------------------------70um Cu INTERNAL LAYER #2
/////////////////////////////////////////////
MIN 0.4mm PREPREG
/////////////////////////////////////////////
---------------------------------------------70um Cu BOTTOM SIDE
APPENDIX B, PCB REQUIREMENTS
Category
Performance Class
Material
Final Finish
Min. Copper thickness and
tolerance
Copper foil type
Hole Diameter Tolerance
Plated, components
Plated, via only
Unplated
Conductor Width tolerance
Conductor spacing tolerance
Dielectric separation
Lateral conductor spacing
Marking Ink
Solder Resist (Solder Mask)
Impedance control
Micro sectioning
Cleanliness
Repair/Rework on Cu-layers
Additional information
Default Selection Requirements
Class 1,2,3 Class 2
FR-4 Epoxy-Glass Laminate - IPC-4101C/ -121; (design dependant)
Tg min. Min. 140°C – Mid Tg Recommended
CTE Post Tg Z - Low CTE within ± 2 ppm / °C
- Average values for FR4: X= 12-18 ppm; Y= 12-18
ppm;
Mechanical requirements Z= max. 60 ppm / °C (preTg);
Bow and twist after soldering processes Z= max. 300 ppm / °C (post Tg)
Electrical requirements -After SMT: 0,75% max.
UL requirements (Logo etc.) After WS: 1,50% max.
Week Year code placement etc.
- UL V0
- To be specified by EV or manufacturer
Type - Pb-free HASL SN100C; ENIG or other EV
approved finishes (to be specified). IPC/J-STD-
003; IPC-4552;
Solderability - IPC-J-STD-003:, Category 2
Pb-free: Test C1 / Test D1/ Test E1/ Test F1
Plating Adhesion - IPC-TM-650, method 2.4.1
Total external copper thickness (base foil + IPC-4562; IPC-6012 –table 3-8 + IPC-A-600 std:
plating). Class 2 3.2.3 “Min. Surface Conductor Thickness after
Processing
Absolute copper foil min. (IPC-4562 nominal less 1/2 oz – min.. 33,4 µm
10% reduction) for ½ oz = 15,4 µm 1 oz - min. 47,9 µm
2 oz - min. 78,7 µm
Min. Cu Plating thickness Class2 = 20 µm 3 oz - min. 108,6 µm
4 oz - min. 139,5 µm
Inner layers – Class1+2+3
See IPC-6012 – table 3-7
Have to be specified especially for flex PCB. IPC-6012 ; IPC-6013; IPC-A-600 std: 3.2.4
“Foil Thickness – Internal layers”
± 100µm ± 100µm
+ 80µm, - N/A + 80µm, - N/A
± 80µm ± 80µm
Specify IPC-6012: 3.5.1
Specify IPC-6012: 3.5.2
Min. 90 µm Min. 90 µm or other separation if specified
Specified or min.100 µm Min.100 µm or other spacing if specified
Specify colour, max. thickness and placement IPC-6012: 3.2.10 to be specified +
IPC-A-600: 2.8 Marking
White colour (or other colour when specified)
Specify thickness (tolerances) - Class T for IPC-6012: 3.7 - 3.7.3
standard
- Acc. to IPC-J-STD-003 Table 4-4 Lead-free
Temperature profile and chemicals used ex Reflow Parameter requirements
fluxes Solder resist shall comply to “No-Clean fluxes”
- IPC-SM-840
Conformal coating
Electrical requirements IPC-6012, chapter 3.8 - 3.12
Specify IPC-6012, chapter 3.6.2, Table 3-6 & paragraph
3.6.2.1 to 3.6.2.17
Specify IPC-J-STD-001 & IPC-TM-650 – 2.3.25 -Max.
1,56μg/cm² of NaCl ; IPC-5704 & IPC-TM-650-
2.3.28.2
(inner & outer layers)
< ½ oz. thickness (Cu-layer) No rework allowed
≥ ½ oz. thickness (Cu-layer) One rework process allowed
Qualification Test Coupons & Test Information IPC-6012 – Table 4-1> 4.4
APPENDIX C, TEST COUPON REQUIREMENTS
Test Coupon Requirements (A 4-layer PCB is used as an example):
1. For the PCB with PTH holes, the test coupon design should be like photo1 (3D) and
photo2 (2D) below. Using this design, one test coupon for one PCB manufacture panel
should be ok.

2. Hole size requirement: Drill all PTH holes used in the PCB from the smallest to the biggest
on the test coupon.
Note: For the PCB with a limited number of hole sizes (such as two or three different kinds of
hole sizes), we can drill the same hole size two or 3 times on the test coupon to ensure there
are more than 10 holes on test coupon.

3. Wire requirement: The wire connection as below photos shown. The wire width design
should be same as the min. wire width used in the Eltek PCB design. When the Eltek PCB
wire min width is more than 0.45mm, the PCB manufacturer should design the wire
connection width as 0.45mm.Tear drops are not allowed to add between the hole and the
wire connection point area.

4. Design more than 4 solder pads with size 5X20mm for both top and bottom size. (For
testing purposes, see below for additional PCB test spec. This way, only the test coupon is
necessary to test regularly)

5.Other information that should be on the test coupon; PCB manufacturer logo, PCB
manufacturer date code, Eltek P/N should be marked on the test coupon (use the etch
process to mark this information). Date code should be considered as silkscreen, so there
will be no extra cost when PCB manufacturer change date code.

6. The PCB manufacturer should design the test coupon on edge of PCB manufacture panel
and not on the shipping panel.

7. Each hole on the test coupon shall be the last hole drilled of the same hole size.

8. PCB manufacturer should perform 100% testing of the micro-resistance of the test coupon
(one resistance data per test coupon) and record it. This record should be stored at least 5
years by the PCB manufacturer.

9. The PCB supplier should send the record of item 8 to Eltek before each shipment.

10. 50% of the test coupons should be shipped to the Eltek manufacturer together with the
product. Eltek manufacturing will keep these test coupons for min. 5 years. The other 50% of
the test coupons shall be stored by the PCB manufacturer for 5 years.

11. For the PCBs with 3OZ copper, the test coupon also should design some circuit (with
thinner wires and narrow space between wires) on test coupon to check for solder mask
blister issue.

12. For the PCBs with Elliptical holes, the different size of elliptical holes should be
connected in different directions. (see explanation below)
Photo 1

Photo 2

Photo 3

Photo 4

Photo 5
Photo 6

Below are some examples of the test coupon locations for reference. One PCB
manufacturing panel just needs one test coupon.

Main Board.pdf primary Board.pdf secondary Board.pdf

Explanation for point 12>

I.e.: If we have two different Elliptical holes, the holes can be connected like this:

If we have four different Elliptical holes, the holes can be connected like this:
APPENDIX D, ADDITIONAL PCB TEST SPEC

Purpose:
To detect out PCB solder pad dis-coloration, in addition to warpage, blisters and
delamination issues with the PCB material, during IQC.

Equipment Used:
SMT IR reflow oven

Sample Size:
1 panel / batch.

If the Eltek test coupon design is used for the PCB, se specification above, the test coupons
can be used for this test instead of the whole PCB. The 4 solder pads of 5x20mm on the test
coupon can be used for the visual discoloration check.

Test Method:
1>. Take the sample and run through the SMT IR reflow process 4 times / standard profile.
2>. Inspect the solder pads for any solder surface discoloration.
3>. Also inspect the PCB material for warpage, blisters and delamination
3>. All solder surfaces shall be without dis-coloration, and additionally no
warpage/blisters/delamination shall be found on the PCB. If any defects are found on the
PCB after this test, then the related batch PCB must be quarantined (Put into MRB) and
investigations to be initiated with the supplier.

Note: Below are two rejected samples with discoloration failure, for reference.

NG Sample

NG Sample

NG Sample
APPENDIX E, GENERIC REWORK RULES
Scope
This appendix is giving more specific guide and instructions for repair and rework of Elteks
power modules and PCBA’s, in addition to the generic rework rules set in this document.

Limitations
These rules cover all electronic modules, power modules and control modules; PCBA’s and
power shelves in our manufacturing.

Definitions
Repair – a generic process to correct random failures that originates from a production
process or from a component failure, detected at an inspection point or after a test station

Rework – an agreed amount of work to be refinished on one or several units, limited to a

specified components or parts

WIP – work in progress

PCBA – Assembled Printed Circuit Board. We divide this into two groups;
 PCBA after SMD (semi-finished PCBA only with SMD components)
 PCBA after THT (finished PCBA ready for function test and boxing)

SMT – Surface Mount Technology

THT – Through Hole Technology

AOI – Automatic Optical Inspection

PQC – Production Quality Control

Rules for repair
Workstation: SMD visual inspection after reflow and AOI

Process: Production quality control station to find defects according to agreed work
instruction and customer specification.

Defects from this process (i.e. not acceptable component assemblies or soldering defects
according to IPC-610 and GPRO_39) shall be registered and can immediately be repaired at
the touch-up station following the requirements set in GPRO_039 for touch-up and
repair/rework.

Workstation: Visual inspection after selective and/or hand solders

Process: Production quality control station to find defects according to agreed work
instruction and customer specification.

Defects from this process (i.e. not acceptable component assemblies or soldering defects
according to IPC-610 and GPRO_039) shall be registered and can immediately be repaired
at the touch-up station following the requirements set for touch-up and repair/rework

Workstation: Test stations ICT and PCBA test

Process: ICT test and Function test of PCBA daughter boards

Defects from this process (i.e. failing PCBA after second attempt) shall be put in the defect-
box and registered after each shift.

Repair of defect assemblies is allowed following the rules in this document for touch-up and
repair/rework

Workstation: Pre-assembly of transistors to heat-sink profiles

Process: Preassembly of transistors to heat-sink profiles with SIL pads and clips

Defects from this process (i.e. SIL pads out of position, component skewed/out of position,
SIL pad damaged, legs not cut properly, clips not in position, etc.) shall be put in the defect-
box and registered after each shift.

Repair of defect assemblies is allowed following these rules:

 Heat-sink can be re-used after inspection (no damage, burr). Note that it must be
cleaned before re-use.
 Clip and SIL pad cannot be re-used. A used clip or SIL pad must always be scrapped.
 Transistors can be re-used if they have no damage to the component body or legs

Workstation: THT mounting

Process: Assembly of THT components and pre-mounted heat-sinks on PCBA after SMD.

Defect parts detected or made during this process (i.e. failures described during Pre-
assembly, THT component legs missing or bent so much that they cannot be adjusted in a
safe way, Other physical damage on components, PCBA defects, etc.) shall be put in the
defect-box and registered after each shift.

Repair of defect heat-sink assemblies from pre-assembly can be done as described above
for these stations.
Defect PCBA from SMD: as described after process SMD visual inspection after reflow and
AOI.
Other defect THT components: components shall be put in the defect-box and scrapped

Workstation: Visual inspection after solder wave and AOI

Process: Production quality control station to find defects according to agreed work
instruction and customer specification.

Defects from this process (i.e. not acceptable component assemblies or soldering defects
according to IPC-610 and GPRO_039) shall be registered and can immediately be repaired
at the touch-up station following the requirements set in this document for touch-up and
repair/rework.

If the rejects are not suitable for in-line touch-up, i.e. components/parts need changing; they
must be put in the defect-box and registered after each shift.

Repair of defect PCBA after THT is allowed following these rules:

 IPC 7711/21 and GPRO_39 Repair/Rework rules
 IPC610 is always for acceptance criteria’s after repair

Special remarks:

 Semiconductors on heat-sink assemblies 1,2,3 or 4 are only allowed to be changed,

following these special rules:
o Clips and heat-sinks must be carefully removed
o Cut the legs of the component on PCBA top side. Take care not to damage other
components or the PCB surface / solder rings/pads.
o Note that all semiconductors on the heat sink must be changed at the same time.
(I.e. you are not allowed to change only one component internally on a heat sink)
o De-solder the remaining pins from the PCBA.
o De-soldered components cannot be re-used.
o Clips and SIL pads cannot be re-used after removal.
o Mounting new components, SIL-pads and clips must be done using the clip-
mounting machine in the production line.
o Plastic rail and heat sink can be re-used if inspected to be OK without damage.

 Primary and Secondary board are allowed to be changed (de-soldered), following

these special rules:
o Cut the legs of the daughter boards on top side of PCBA where possible, for
easily removal. This is especially important on the long secondary boards.
o De-solder the pins after removal of the boards.
o Take care not to damage other components or the PCB surface / solder
rings/pads.
o If board is repaired or found to be OK after testing, it may be re-used. Any
removed pin header contact cannot be re-used, and must be replaced with new
pin headers.
If difficult failures are detected, the PCBA can be placed in the MRB area awaiting failure
analysis and decision from Eltek on how to go on. In cases of repeated/high failure rate with
the same failure symptom, take aside some un-touched boards in the MRB area and take
contact with Eltek for further instructions.

Workstation: Coating station

Touch-up of coating during visual control is a manual process difficult to control, and
therefore Eltek do not want rework/touch-up to be done on our PCBA’s. There are
exceptions, i.e. situations where Eltek allow touch-up, and this will be specified below.

We specify coating on our modules according to the following ;

LED’s not to be
Must NOT be coated. Red square or circle. coated
If an area is marked with red square of ring, we can also specify with a text which component
in this red area is not allowed to be coated. See example above.

Desired coverage. Marked with blue diamond grid. (coverage spec taken directly from
Asymtek machines).

No marking: It means this area is neutral. We have not specified coating in this area, but it is
not strictly forbidden with coating material in this area.

1. Must not be coated. This means that in the area specified as red in our specification,
Eltek do not accept coating material at all. This means if there is traces of coating
inside these areas, the PCBA must be considered defect and be put in the red box for
evaluation of rework.
2. Desired coverage. This means that we want to coat this area as good as possible.
The important here is that the SMD components inside the area are properly coated.
If SMD component are missing coating, they are allowed to get touch up. It touch-up
is done, this should be noted and reported upstream for possible machine adjustment
by machine operator in agreement with line leader.
If areas are missing coating in this area without any SMD components, not touch-up
shall be done. But it shall be noted and reported upstream for possible machine
adjustment by machine operator in agreement with line leader. The reason could be
fingerprints or other contamination, and the root cause must be found and removed.
3. No marking: This area is neutral. It means that we should not coat in this area, but if
coating is spilled, it is still not considered a defect. But it should be noted and
reported upstream for possible machine adjustment by machine operator in
agreement with line leader.
Rework of coating, i.e. removal of coating and to apply coating again, can only be done as
specified under Removal of coating on PCBA below.
Workstation: Test station PCBA test

Process: Function test of PCBA main board

Defects from this process (i.e. failing PCBA after second attempt) shall be put in the defect-
box and registered after each shift

Repair of defect PCBA after THT is allowed following the rules as specified under
Workstation: Visual inspection after solder wave and AOI

Workstation: Final Assembly of modules / assembly of shelves

Defects made during this processes (i.e. incomplete screwing process, defect screws, etc.)
shall be put in the defect-box and registered after each shift.

Repair of defect assemblies is allowed following these rules:

 Screws can be re-used according to terms in this document under Repair/Rework
 Spacers/washers can be re-used if inspected and found ok
 Gap-pads cannot be re-used. A used Gap-pad must always be scrapped and
replaced with a new
 Bottom/Top chassis can be re-used according to terms in this document under
Repair/Rework, but must be vacuum cleaned in case of metal dust from un-screw
process
 Isolation sheet can be re-used if inspected and found ok
 O-rings cannot be re-used and must be scrapped
 Cooling profiles must be inspected and vacuum cleaned before re-assembly.
 Cables without damage can be re-used
 If cables are mounted onto fast-on terminals, and have to be removed, they may be
re-used if damage free. But this process (remove/assemble) can only be repeated
maximum 6 times before the cable need scrapping.
 If cables are dis-assembled from an IP classified cover (i.e. disassembly of cable
glands), the cables shall be scrapped and new cables (with new cable glands) must
be used for re-assembly.
 Gore-vents cannot be re-used. This must be scrapped if unscrewed.
Workstation: Test station Isolation Test

Process: Test the isolation of input and output to ground, and between input and output

Failures from this test stations shall go directly in the defect-box without a second test.

Repair of defect modules is allowed following the rules specified earlier in this document for:
 Disassembly/Assembly(see rules from Final Assembly of modules / Assembly of
shelves)
 Repair of defect PCBA after THT is allowed following the rules as specified under
Workstation: Visual inspection after solder wave and AOI

Note: For the Nimbus project, all products failing this test stations shall be scrapped. Fault
finding is allowed, but repaired modules are not allowed to be delivered. To be put in MRB to
await final scrapping decision.

Workstation: Test stations Pre Burn-in test, Burn-in test, final function test

Process: Function test of the final assembly (module)

Defects from this process (i.e. failing module after second attempt in any test, except for
isolation test where only one attempt is allowed) shall be put in the defect-box and registered
as a repair report in WATS after each shift

Repair of defect modules is allowed following the rules specified earlier in this document for:
 Disassembly/Assembly(see rules from Final Assembly of modules / Assembly of
shelves)
 Repair of defect PCBA after THT is allowed following the rules as specified under
Workstation: Visual inspection after solder wave and AOI

For PCBA repair after conformal coating and gluing process (during assembly AOI
process), special rules apply for removal of coating (for soldering and post repair
testing) and removal of glued component;

Removal of coating on PCBA

Eltek only approve mechanical removal of coating, using micro-abrasive blasting technique,
for a safe operation with minimal mechanical effect on the board.

Alternatively, using thinner V-1307 from Elpeguard to remove the coating by brushing is also
an allowed. This thinner is designated for the coating Elpeguard SL-1307 series, which Eltek
use on our products.

The process chosen must be approved by Eltek and the customer.

After repair, the area where coating was removed must be cleaned and touch-up by hand
using the same conformal coating as specified for the product.
Removal of glued components

Some components have been glued together for mechanical support during vibration. (Using
hot melt glue)

For these components, apply a few drops of alcohol, Alpha 425 thinner or equivalent, wait 1
minute for the glue to loosen from the surface, and then carefully remove the glue using
plastic tweezers or pliers.

If this method does not loosen the glue from the surface properly, then all capacitors glued
together needs to be changed at the same time.

Sharp tools are not allowed to cut off the glue, due to risk of damaging the components.

Rules for rework

General rules for rework and repair are the same if nothing else is specified, but for rework
special rules may apply from case to case based on quantity and risk. This will be specified
in agreement with Eltek.
Version history

Version Date Changes

11 2016-11-02 Added requirements for video and X-ray inspection of solder fillings in chapter 7.4.3.
10 2016-06-07 Added Appendix A, B, C, D and E; PCB material spec, PCB requirements, PCB test
coupon requirements, Additional PCB test spec, and Rework requirements. In
addition, changed allowed storage time for electrolytic capacitors to 2 years.
9 2015-06-24 Updated the incoming Inspection criteria’s page 8-10
Added a SPC chapter page 20.
8 2015-04-28 Added Incoming Inspection requirement page 8, including special inspection
criteria’s for PCB.
Under Reporting and Fault finding page 20, specified the need for root cause
analyses and preventive actions.
Also emphasized on page 22 that Eltek’s minimum Cpk acceptance level is 1.33 for
released mass production.
Implemented automatic Line Stop criteria page 23.
7 2012-10-31 Added requirements regarding PFMEA, Control Plan and Process Flow chart
synchronisation and update.
6 2012-09-25 Added a chapter with selective solder, BGA inspection and repair, increased
requirement for hand solder, cleanliness, production area temp/humidity and a
general re-emphasizing of when to seek approval from Eltek.
5 2012-03-05 Changes to rules in chapter ‘Rework’ on page 16-17, and some additions on ‘touch-
up’ on page 11 and 13. New logo has been added.
4 2011-04-28 Revision change to J-STD 001 and IPC-610E. Added page 18 (new).
3 2010-10-14 Revised and added some IPC standards. Added text regarding REACH compliance
on page 4.
2 2008-05-23 Version history not kept