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PC817X Series: DIP 4pin General Purpose Photocoupler
PC817X Series: DIP 4pin General Purpose Photocoupler
PC817X Series: DIP 4pin General Purpose Photocoupler
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03101EN
1 Date Sep. 30. 2003
© SHARP Corporation
PC817X Series
1.2±0.3
1.2±0.3
0.6±0.2
0.6±0.2
4.58±0.5
1 4
4.58±0.5
PC817 2 PC817 3
2 3
2.54±0.25
2.54±0.25
6.5±0.5 6.5±0.5
7.62±0.3 4.58±0.5
7.62±0.3 4.58±0.5
0.35±0.25
±0.1
3.5±0.5
0.5TYP.
3.5±0.5
0.26
3.0±0.5
Epoxy resin
2.7±0.5
0.26±0.1 10.0+0
−0.5
±0.1
0.5
θ θ
θ : 0 to 13˚
3. Wide Through-Hole Lead-Form [ex. PC817XF] 4. Wide SMT Gullwing Lead-Form [ex. PC817XFP]
Rank mark Factory identification mark Rank mark
Anode mark Anode mark Factory identification mark
1.2±0.3
Date code
0.6±0.2
1.2±0.3
0.6±0.2
Date code
1 4 1 4
4.58±0.5
±0.5
4.58
2 PC817 3 2 PC817 3
1.0±0.1
±0.25
2.54±0.25
1.0±0.1
6.5±0.5
6.5±0.5
2.54
7.62±0.3 4.58±0.5
7.62±0.3 4.58±0.5
0.25±0.25
±0.1
3.5±0.5
0.26
3.5±0.5
12.0MAX
0.26±0.1 0.5±0.1
10.16±0.5
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
■ Model Line-up
Lead Form Through-Hole Wide Through-Hole SMT Gullwing Wide SMT Gullwing IC [mA]
Sleeve Taping Rank mark (IF=5mA, VCE=5V, Ta=25˚C)
Package
100pcs/sleeve 2 000pcs/reel
PC817X PC817XF PC817XI PC817XP PC817XFP with or without 2.5 to 30.0
PC817X1 PC817XF1 PC817XI1 PC817XP1 − A 4.0 to 8.0
PC817X2 PC817XF2 PC817XI2 PC817XP2 − B 6.5 to 13.0
PC817X3 PC817XF3 PC817XI3 PC817XP3 − C 10.0 to 20.0
PC817X4 PC817XF4 PC817XI4 PC817XP4 − D 15.0 to 30.0
Model No. PC817X5 PC817XF5 PC817XI5 PC817XP5 − A or B 4.0 to 13.0
PC817X6 PC817XF6 PC817XI6 PC817XP6 − B or C 6.5 to 20.0
PC817X7 PC817XF7 PC817XI7 PC817XP7 − C or D 10.0 to 30.0
PC817X8 PC817XF8 PC817XI8 PC817XP8 − A, B or C 4.0 to 20.0
PC817X9 PC817XF9 PC817XI9 PC817XP9 − B, C or D 6.5 to 30.0
PC817X0 PC817XF0 PC817XI0 PC817XP0 − A, B, C or D 4.0 to 30.0
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
Fig.1 Forward Current vs. Ambient Fig.2 Diode Power Dissipation vs.
Temperature Ambient Temperature
50 100
40 80
70
30 60
20 40
10 20
0 0
−30 0 25 50 55 75 100 125 −30 0 25 50 55 75 100 125
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs. Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature Temperature
250 250
Collector power dissipation PC (mW)
150 150
100 100
50 50
0 0
−30 0 25 50 75 100 125 −30 0 25 50 75 100 125
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Current Transfer Ratio vs. Forward
Current
10 000
800
Pulse width≤100µs VCE=5V
5 000 Ta=25˚C Ta=25˚C
700
2 000
Peak forward current IFM (mA)
1 000 600
500 500
200 400
100
300
50
200
20
10 100
5
5 10−3 2 5 10−2 2 5 10−1 2 5 1 0
0.1 1 10
Duty ratio Forward current IF (mA)
Fig.7 Forward Current vs. Forward Voltage Fig.8 Collector Current vs. Collector-emitter
Voltage
30
500
Ta=75˚C IF=30mA Ta=25˚C
200 25
50˚C 25˚C 20mA PC (MAX.)
100 0˚C
50 −25˚C 20
20 15
10mA
10
10
5
5mA
2 5
1
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 1 2 3 4 5 6 7 8 9
Fig.9 Relative Current Transfer Ratio vs. Fig.10 Collector - emitter Saturation Voltage
Ambient Temperature vs. Ambient Temperature
150% 0.14
IF=20mA
IF=1mA,VCE=5V IC=1mA
Collector-emitter saturation voltage VCE (sat) (V) 0.12
Relative current transfer ratio (%)
IF=5mA,VCE=5V
0.10
100%
0.08
0.06
50%
0.04
0.02
0% 0
−40 −20 0 20 40 60 80 100 −40 −20 0 20 40 60 80 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient Fig.12 Collector-emitter Saturation Voltage
Temperature vs. Forward Current
10−5 6
Collector-emitter saturation voltage VCE (sat) (V)
5 VCE=50V Ta=25˚C
10−6 5 IC=0.5mA
Collector dark current ICEO (A)
5
1mA
10−7 4 3mA
5
5mA
10−8 3 7mA
5
10−9 2
5
10−10 1
5
10−11 0
−30 0 20 40 60 80 100 0 5 10 15
Ambient temperature Ta (˚C) Forward current IF (mA)
Fig.13 Response Time vs. Load Resistance Fig.14 Test Circuit for Response Time
500
VCE=2V
200 IC=2mA
Ta=25˚C Input
100 VCC
Output
50 tr
Input RD RL Output 10%
Response time (µs)
tf
20
VCE 90%
10
td ts
5 tr tf
2 td
ts Please refer to the conditions in Fig.13.
1
0.5
0.2
0.1
0.01 0.1 1 10 50
Load resistance RL (kΩ)
VCE=5V VCC
IC=2mA
Ta=25˚C RD RL Output
0
VCE
Voltage gain Av (dB)
100Ω
1kΩ
−10 Please refer to the conditions in Fig.15.
RL=10kΩ
−20
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
2.54
2.54
1.7
1.7
2.2 2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0 1 2 3 4 (min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing Lead-Form
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
±2
520
10.8
5.8
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
±2
520
10.8
5.9
6.35
(Unit : mm)
Sheet No.: D2-A03101EN
12
PC817X Series
C
B
A
H
H X.
MA
K
5˚
Dimensions List (Unit : mm)
A B C D E F G
16.0±0.3 7.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 φ1.5−0
+0.1
H I J K
10.4 ±0.1 0.4±0.05 4.2±0.1 5.1±0.1
e d
g
c
Pull-out direction
[Packing : 2 000pcs/reel]
A
H
H
X.
MA
5˚
K
H I J K
12.4 ±0.1 0.4±0.05 4.1±0.1 5.1±0.1
e d
g
c
Pull-out direction
[Packing : 2 000pcs/reel]
■ Important Notices
· The circuit application examples in this publication are with equipment that requires higher reliability such as:
provided to explain representative applications of --- Transportation control and safety equipment (i.e.,
SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.)
circuit design or license any intellectual property rights. --- Traffic signals
SHARP takes no responsibility for any problems rela- --- Gas leakage sensor breakers
ted to any intellectual property right of a third party re- --- Alarm equipment
sulting from the use of SHARP's devices. --- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
· Contact SHARP in order to obtain the latest device tion with equipment that requires an extremely high lev-
specification sheets before using any SHARP device. el of reliability and safety such as:
SHARP reserves the right to make changes in the spec- --- Space applications
ifications, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines]
and other contents described herein at any time without --- Nuclear power control equipment
notice in order to improve design or reliability. Manufac- --- Medical and other life support equipment (e.g.,
turing locations are also subject to change without no- scuba).
tice.
· If the SHARP devices listed in this publication fall with-
· Observe the following points when using any devices in the scope of strategic products described in the For-
in this publication. SHARP takes no responsibility for eign Exchange and Foreign Trade Law of Japan, it is
damage caused by improper use of the devices which necessary to obtain approval to export such SHARP de-
does not meet the conditions and absolute maximum vices.
ratings to be used specified in the relevant specification
sheet nor meet the following conditions: · This publication is the proprietary product of SHARP
(i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under the
in general electronic equipment designs such as: copyright laws, no part of this publication may be repro-
--- Personal computers duced or transmitted in any form or by any means, elec-
--- Office automation equipment tronic or mechanical, for any purpose, in whole or in
--- Telecommunication equipment [terminal] part, without the express written permission of SHARP.
--- Test and measurement equipment Express written permission is also required before any
--- Industrial control use of this publication may be made by a third party.
--- Audio visual equipment
--- Consumer electronics · Contact and consult with a SHARP representative if
(ii) Measures such as fail-safe function and redundant there are any questions about the contents of this pub-
design should be taken to ensure reliability and safety lication.
when SHARP devices are used for or in connection