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FLY SERVICE SUPPORT

Service Manual

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FLY SERVICE SUPPORT

Contents

directory
1 E4002F Module Features................................................................................................................. 3

1.1 E4002F ............................................................................................................................................ 3

1.2 Basic Feature.................................................................................................................................. 3

1.3 Typical Application ......................................................................................................................... 4

2 Main board explored overview ........................................................................................................ 5

3.Detailed Function Circuit ............................................................................................................... 7

3.1 Download Module .......................................................................................................................... 7

3.2 Audio Module .................................................................................................................................. 7

3.2.1 Micphone Circuit ......................................................................................................................... 7

3.2.2 Receiver Circuit ........................................................................................................................... 8

3.2.3 Speaker Circuit............................................................................................................................ 8

3.3 FM Module ...................................................................................................................................... 8

3.4 BT Module ....................................................................................................................................... 9

3.5 WIFI/GPS…………………………………………………………………………………………………………. 9
3.6 RF Module ....................................................................................................................................... 9

3.7 LCM Module.................................................................................................................................. 11

3.8 CAMERA MODULE ..................................................................................................................... 11

3.9 KEYPAD interface........................................................................................................................ 12

4.1 RF Part .......................................................................................................................................... 13

4.2 BB Part .......................................................................................................................................... 13


5.0 Chapter 5TroubleshootingGuideline.................................................................................16

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FLY SERVICE SUPPORT

1 E4002F Module Features

1.1 E4002F

Figure 1.1: E4002F Module

1.2 Basic Feature


Table 1-1: Feature
Platform MTK6570
Band GSM 900, DCS 1800
UMTS 2100 MHz
LCM 5.0 inch HD IPS
CAMERA Front 2.0MP Rear 5.0MP
MCP Module Internal Nor Flash
BT Module Internal BT Module
FM RX Module Internal FM Module
Audio PA Extraposition AudiO PA(Class K)
SIM Dual SIM
I/O Micro USB 5PIN
Torch NO support
Keypad Power on/off Key and Volume key

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1.3 Typical Application

Figure 1.2: Typical Application with MTK6570 Based platform

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2 Main board explored overview

Figure 2.1: top

Figure 2.2: bottom

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J6401USB CON6001 PHONE JACK

J6202 Front cam

J6201 REAR CAM


U3101 2GPA

U2001 POWER
U1001 CPU

U4201 MEMORY

U3201 3G PA

U2101 Charging chip

CON2102 BATTERY CONN

U2302 FLASH LED

LED2301
GSM antenna WIFI/BT/FM

J6102 TP

J6101 LCD connector


CN6501 Key connector

J6502 sim-2 card


J4101 T card J6501sim-1 card

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3.Detailed Function Circuit

3.1 Download Module


Download through USB port, program select download mode, when connect BOOT(pin Y4
U0TXD) to GND. Through the USB port to download, choose to download program mode, when
the connection start (P F25 U0TXD) ground.

Figure 3.1: U1001 D/L Interface

3.2 Audio Module

3.2.1 Micphone Circuit

Figure 3.2: Micphone

If MICPHONE useless ,first you should check B6105/B6106 ok or not,use multimeter measure
connect or not ,if not connect that indicate not good.

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3.2.2 Receiver Circuit

Figure 3.3: Receiver


The receiver is part with audio output,if receiver defet,it caused by
B6006/B6007/C6024/C6031/C6032. should measure these two parts ok or not

3.2.3 Speaker Circuit


Extraposition AudiO PA(Class K) , PMU - 2 electric signal decoding audio PA directly from inside the CPU
output, after the signal amplification, then Drive to the speaker, the speaker to convert electrical signal
into sound.

Figure 3.4: Speaker

3.3 FM Module
Internal FM module ,this module built-in MT6570-baseband chipset..
Internal frequency modulation module, the module is built-in MT6570 - baseband
chipset.

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Figure 3.5

3.4 BT Module
Internal BT module ,this module built-in MT6570-baseband chipset.
BT module, the module is built-in MT6570 - baseband chipset.

Figure 3.6
Bluetooth poor performance of the function, not active ,not find Bluetooth, next to match the circuit in
normal circumstances, poor bluetooth antenna can lead to poor.

3.5 WIFI
Internal WIFI module ,this module built-in MT6570-baseband chipset..
Internal frequency modulation module, the module is built-in MT6570 - baseband chipset.

Figure 3.7

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3.6 RF Module
RF Front-end Module, type HS8692(2G), HS8358 (3G)item U601. U601 F The front-end
module, typeSKY77590、SKY77758 project

Figure 3.8: RF Front-end Module

RF PA is the probability of the most original failure, common faults are: no network, no signal, the signal
is weak, can dial emergency calls, etc., first replace the PA amplifier, verify failure existence or not , PA
front-end RF signal head can lead to bad signal

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3.7 LCM Module

Figure 3.9 LCM

LCM interface is a channel connecting the motherboard and the screen, generally will not be bad, only
when improper welding operation. Pay attention to the insert。

3.8 CAMERA MODULE

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Figure 4.0 CAMERA


Before and after the Camera interface is connected to the main board and camera position with a plug-in to be
inserted, and then will not cause the failure of the camera and note the insert method.

3.9 KEYPAD interface

Figure 4.10 KEYAPD

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4 Fault Maintenance

4.1 RF Part
Refer to function circuit Part 3.5 3.5 Reference function circuit parts
4.2 BB Part
Refer to function circuit. Reference function circuit

5.Chapter 5 Troubleshooting Guideline


5.1 Can not download

Can not
download

no
Can power on? Check power on
porblem
yes

Check download
tool, download no Change new tool, new
cable, software ok cable or new software
?
yes

USB port no
appearance check Clean or change new USB
ok? port
yes

ChangCPU U1001

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5.2 Can not power on

Can not power on

yes

Change battery ok? yes Change battery

no

no no The power on current


The current 0? The power on current
high?>200mA low?<100mA

no yes no

Heat or Change U1001 or


Remove U1001
change U1001 X3101
current ok?

yes no

Change U1001 Change U2001

5.3 Can not recognize SIM

Can not recognize


SIM
yes

The SIM connector The SIM connector


no damaged? SIM pins
appearance ok?
dirty or distortion?
yes
yes
The resistance to
Heat or change no Change SIM
ground of SIM pins
U1001 connector
ok?
yes
Change U1001

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5.4 Display problem

Display problem

yes
Display black no Display white screen?
no Diplay white line
screen? or others

yes yes yes

Upgrade software ok? Upgrade software ok? Change LCD

yes yes no

Resolder or change Software problem Resolder or change


LCD ok? LCD ok?

no yes

Change U1001 Soldering or


material problem

5.5 Receiver no sound

Receiver no
sound
yes
no
Upgrade software Change speaker
ok? ok?
yes no yes
Software problem Speaker
problem

Change U1001

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5.6 MIC pboblem

MIC problem

yes

no MIC rubber cover


The MIC
appearance ok? broken or missing?

yes yes

Change U1001 no Change MIC OK? Change or get


another new rubber
no cover
yes

MIC material MIC soldering ok?


problem
no

Resolder MIC get


solve

5.7 No charging

No charging

yes

USB port no Clean or change


appearance ok? USB port

yes

Change U2101 no
Change U1001
OK?
yes

U2001 material
problem

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