Electromagnetics: Electromagnetic Field Is A Natural Phenomenon

Electromagnetics
©2009 BestESD Technical Services

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Vladimir Kraz
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vkraz@bestesd.com
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EMI
• ElectroMagnetic Interference is electromagnetic emission that
causes equipment malfunction
• No matter how strong emission is, if it doesn’t cause problems,
it is not an interference, i.e. not EMI.
• Therefore, the impact of EMI is judged not only by how much
emission is generated, but also by how it gets from “here” to
“there” and by how immune the equipment is to EMI.
• EMI is NOT an ESD Event! An ESD Event, though, can be one
of the sources of EMI
• For simplicity of this discussion we will call all electromagnetic
emission “EMI,” though it is technically incorrect

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Electromagnetic Field is a
Natural Phenomenon
• Electricity and magnetism were not invented – they were
discovered
• Our bodies rely on electric currents to function
• Earth has strong magnetic field
• Lightning and other atmospheric phenomena create electric
and magnetic fields
• Sun experiences electromagnetic storms
• There is no place in the Universe without electromagnetic

fields
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Is Electromagnetic Field
Dangerous for People?
• Perhaps
• Everything is good in moderation
• It is hot inside microwave oven
• Outside in normal environment there was no
repeatable conclusive studies proving connection between
emission from mobile phones with any specific illness
• Every positive published study is refuted by a negative

study and vs. versa
• Just don’t get your head inside microwave oven
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Why EMI is Important?

• High-frequency signals (EMI) manifest
themselves in a number of harmful ways:
– Outright equipment lock-up
– Tools do things they weren’t supposed to do
– Software errors
– Erratic response
– Parametric errors
– Sensor misreading
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– Component damage
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Types of Fields
• Voltage creates electric field
• Anywhere where voltage is present, there is an electric field
• In return, an electric field creates voltage in conductors
• Current creates magnetic field
• Anywhere current is present, there is a magnetic field
• In return, magnetic field creates current in conductive loops
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Electric and Magnetic Fields
• Electric field is
accompanied by
magnetic field
• Electric and magnetic
fields are orthogonal
to each other

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Field Strength
• Electric field strength is a
quantitative expression of the
intensity of an electric field at a
particular location.
• The standard unit is the volt
per meter (V/m)
• A field strength of 1 V/m 1V
represents a potential
difference of one volt between
points separated by one meter
1 V/m
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1 meter
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Large Dynamic Range is the

Reason for Log Scale
Dynamic range of electromagnetic fields can be very large. Thus, logarithmic
scale is often used
Linear Scale Log Scale
1200 8.00E+01
6.00E+01
1000
4.00E+01
2.00E+01
800
0.00E+00
1 2 3 4 5 6 7 8 9 10
600 -2.00E+01
-4.00E+01
400
-6.00E+01
-8.00E+01
200
-1.00E+02
0 -1.20E+02
1 2 3 4 5 6 7 8 9 10
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Units of Measurement of
Voltage
Voltage Vdb = 20 × log(V / Vo )
• Vo (v): 0dBV = 1V
• Vo (µv): 0dBµV = 1µV
Ratio - Linear Formula Ratio - dB

x2 20*log(2) 6
x4 20*log(4) 12
X10 20*log(10) 20

x100 20*log(100) 40
x1000 20*log(1000) 60
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Units of Measurement of
Field
Electric Field Edb = 20 × log( EV / m / E 0)
• Eo (V/m): 0dBV/m = 1V/m
• Eo (µV/m): 0dBµV = 1µV/m

x2 20*log(2) 6
x4 20*log(4) 12
X10 20*log(10) 20
x100 20*log(100) 40
x1000 20*log(1000) 60
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V V
vs .
inch m
• V/inch is an artificial unit for static electric field derived from the
convenience of using a fieldmeter at a distance of 1” from the
measured surface
• V/m is a more standardized unit. It is now frequently used by
Europeans for static control
• V/m does not mean that the field is measured at 1m away from the
surface – it is just calculations
V V V V
1 = 40 100 = 4000
inch m inch m
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Another Unit You May See
dbm P
Pdbm = 10 × log(
)
• This is a unit of power, not voltage P0
dbµV = dbm + 107
• It is also a logarithmic unit
dbm = dµV − 107
• P0 = 1mW into 50N load

x2 10*log(2) 3
x4 10*log(4) 6

X10 10*log(10) 10
x100 10*log(100) 20
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x1000 10*log(1000) 30
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Dynamic Range Examples

80 dBm 100 kW Typical transmission power of FM radio station with 50 km range
60 dBm 1 kW Typical combined radiated RF power of microwave oven elements

50 dBm 100 W Typical thermal radiation emitted by a human body
Typical maximum output power for a Citizens' band radio station (27 MHz) in many
36 dBm 4W
countries
33 dBm 2W Maximum output from a GSM850/900 mobile phone
Typical RF leakage from a microwave oven
30 dBm 1W Maximum output power for DCS 1800 MHz mobile phone
Maximum output from a GSM1800/1900 mobile phone
Typical cellular phone transmission power maximum output from a UMTS/3G mobile
27 dBm 500 mW
phone (class 2)
26 dBm 400 mW Access point for Wireless networking
20 dBm 100 mW Typical wireless router transmission power.
15 dBm 32 mW Typical WiFi transmission power in laptops.
4 dBm 2.5 mW Bluetooth Class 2 radio, 10 m range
−10 dBm 100 µW Typical maximum received signal power (−10 to −30 dBm) of wireless network
−60 dBm 1.0 nW = 1000 pW The Earth receives one nanowatt per square meter from a magnitude +3.5 star
Typical range (−60 to −80 dBm) of wireless (802.11x) received signal power over a
−70 dBm 100 pW
network
HBM −127.5 dBm 0.178 fW = 178 aW Typical received signal power from a GPS satellite
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Near and Far Fields

• Voltage creates electric field
• Current creates magnetic
field
• As distance from the source
increases, they create their
complementary fields
• The boundary between near
and far fields is at
λ
r=
2π
• where λ = wavelength
• Static field is always in near
field – its frequency is zero

• High-frequency fields have
transitional region within few
centimeters from the source
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Fundamental Difference
Between Near and Far Fields
• In the near field the affected objects are capacitively
coupled with the source
• The objects caught in the near field affect the source
• In the far field there is no coupling between the source and
the objects
• Why all of this would matter to us?
• See Static Charge Section!

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Time for Experiments

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RADIATED AND CONDUCTIVE

EMISSION
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Propagation of
Electromagnetic Emission
• Radiated
– Electromagnetic field composed of electric and magnetic fields propagates via air path
just as emission from a mobile phone would reach the base station
– This field would create voltages and currents in any metal object, i.e. wire, PCB trace,
etc.
• Conducted
– The most neglected type of propagation
– High-frequency currents move via power, ground and data cables and inject
undesirable signals into equipment
• Mixed
– Radiated emission generates signals in wires and cables. These signals are then

injected into equipment via conductive path
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Radiated Emission
• Everything electric generates electromagnetic fields
• Electromagnetic fields, in return, generate signals in
conductive objects
• This is how your mobile phone, your radio and your TV can
work
• In most practical sense, every piece of equipment that has
anything electric inside is a radio station
• Also, every piece of equipment is also a radio receiver

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Antennae
• Without antennae there would be no radio communication (and no
radiated EMI)
• Antenna converts electromagnetic field into electric signal
• Any piece of wire is an electric field antenna
• Any wire loop, ground loop or coil is a magnetic field antenna
• Antenna can be receiving, transmitting or both
• Antennae have certain key properties that define their performance
• Details of antenna performance is outside of the scope of this class
• Sufficient to say that any piece of equipment can be either radiator or
receiver or both
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Radiated Emission
Propagation
• The farther from the source,
the smaller the field
• Electric field is inversely
proportional to the distance
• This means that even a
strong source of emission
won’t be able to interfere

with tools located far away
• Electromagnetic fields are also affected by metal objects
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which further attenuate the field
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Conducted Emission
• Any “glitch” and any electrical
artifact of operation of
equipment propagates via
power line, ground and other
cables
• Current spikes, voltage spikes,
other high-frequency signals
create corresponding
high-frequency signals that
emanate from that piece of

equipment to the rest of the
factory
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Properties of Signals on
Cables and Wires
• Most dominant signals on power lines and ground are
transient signals, i.e. spikes
• Spikes are caused typically by sudden draw of current
by actuators, stepper motors. This produces
corresponding voltage drops
• Even though the spectrum of these spikes may originally
be fairly broad, long cables exhibit reactive properties
such as distributed inductance and capacitance
• As a result, the spectrum of conducted noise is limited to
typically 20…50 MHz

• EMC regulations go up only to 30MHz
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Examples of Signals on
Cables and Wires

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Conducted Emission:
Propagation via Wires and Cables
• Electric noise can be generated by any equipment
• This signal propagates throughout the entire factory
• Unlike radiated emission, noise on lines is not as quickly
attenuated and can be critical far away from the source
• Common conduits:
– Ground wires
– Power cables
– Network cables
– Any cables and wires
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Common-Mode vs.
Differential Noise
Differential Signal (between two wires in a pair)

Common-Mode Signal (between each of two wires and the ground)
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Common-Mode vs.
Differential Noise
• Differential Noise
– Caused by operation of electric equipment connected to that power line
– AC differential noise is between live and neutral
– DC differential noise is between positive and negative lines
• Common Mode
– Caused by induced signals from other lines or via transformer using capacitive and
inductive coupling
– Noise on ground wires is a derivative of common mode noise
• Differential noise is generated, common-mode noise is induced
• Reduction of differential noise in the facility leads to reduction of common

mode noise
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EMI and Ground

• High-frequency signals are often present on both
ground and power lines
• Most typically, if there is noise on power lines,
ground will have noise as well
• Most of signals on ground and power lines are
pulsed (transient) and most of spectrum is in the
lower range (up to 50MHz)
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Noisy Tools
• Any electric circuit generates noise and unwanted currents
and voltages
• Poorly designed tool generates excessive noise
• When selecting your tools, always select the ones that
have passed emission test limits. Your starting criteria:
FCC or CE certification (not just a label)
• If you do not require your suppliers to provide you with
good-quality tools, then the noise becomes your problem to
deal with
• Even the best tool poorly installed and maintained is a

source of noise
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Example of a Noisy Tool
• Most tools use stepper motors
• Questionable-quality stepper
motors generate significant
noise
• Improperly-connected motors
use tool ground as return for
current +5V I Z
• This creates high-noise Signal In V
situation that may affect

sensitive parts
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Inductive and Capacitive

Coupling of Parasitic Signals
• At higher frequencies crosstalk
between wires is more pronounced
since capacitive coupling between
them has lower impedance
• Bundled wires create inductive
coupling between wires with strong
currents and ground
• The result is unwanted signals on
ground and on supposedly-grounded
tool parts
• These unwanted signals are different
at different parts of the tool
• A device can be exposed to a

difference between these signals
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Electrical Circuits Behavior

at Low and at High Frequencies
Examples: Capacitor Long Wire
Low frequencies Open circuit Short circuit

and DC: (infinite resistance) (low resistance)
High frequencies Short circuit Open circuit

(MHz and GHz): (low impedance) (high impedance)
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Is Copper Buss a Good
Grounding Element?
• What can possibly be bad in
using solid copper buss bar for
grounding?
• Large cross-section, good
conductive material
• Problem is skin effect
• Surface area is too small
• Oxidation further increases

impedance at high frequencies
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Skin Effect
δ = the skin depth in meters
• Due to internal magnetic fields in a µr = the relative permeability of the
conductor, the higher the frequency δ ≈ 503 ρ medium ~1 for copper
the more the current flows on the µr f ρ = the resistivity of the medium in
Ωm (for copper = 1.68 10-8 Ωm)
outside of that conductor f = the frequency of the wave in Hz
• A bus bar for AC current at 60 Hz

with a thickness more than 2/3”
(17 mm) is a waste of copper
except for mechanical reasons
• How to deal with it? 60Hz 10kHz 10MHz
0.33" or 8.4mm 0.026" or 0.66mm 0.001" or 0.021mm
– Use multi-stranded wires
– Cover ground wires with insulation to Frequency Skin depth (mm)

prevent oxidation 60 Hz 8.47
10 kHz 0.66
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1 MHz 0.066
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10 MHz 0.021
Grounding at Low and High

Frequencies
• If ground is done improperly, a
ground wire acts as an inductor
with high impedance at high
frequencies
• High-frequency “junk” doesn’t
dissipate into the ground and
resides on a workbench or on a
tool
• Conventional methodology and
tools provide false assurance
of “good ground”
Low impedance for DC
High impedance for EMI
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Grounding Wires and
High-Frequency Signals
• For safety purposes and for dissipation
of static charges, a coiled or long
ground wire is sufficient
• However, such wires have significant
impedance at high frequencies
• With currents flowing to/from the tool
during normal operation, the tool may
have voltage on its “grounded” parts
Z I V
• 5-turn coiled wire with a 10cm radius
and a 1cm thick coil will have
impedance of 6.28kOhms at 100MHz.
A 1mA current would cause 6.28V Impedance of Coiled Wire
r2N 2
voltage across such coil. L = 0.394

9r + 10d
• 3m 14 AGW wire has self-inductance of
Impedance of Long Straight Wire
5.17µH. At 1mA of 100MHz this would  4 ⋅l 
cause voltage of 5.17V L = 2l  ln − 1
 d 
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Ground Bounce
• EMI (internal and external)
induces voltages in equipment’s
ground
• Current flows from equipment’s
ground to facility’s ground
• If ground path is imperfect, +5V I Z
V
voltage drop develops Signal In
• Equipment ground “bounces”

• Circuit signal levels are no
longer valid
• Equipment malfunctions
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Injection of EMI into Ground Wires
• Both radiated and +5V
conducted emission induces Signal In
voltages in long and

poorly-done ground wires
• Equipment ground
“bounces”
• Circuit signal levels are no
longer valid
• Equipment malfunctions
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Inductive Coupling in Wires
• Closely-placed wires act as
transformer
• Current in one wire generates
current in nearby wires
• All it takes is one “bad
neighbor” to spoil the entire
neighborhood
• Identify noisy wires and
separate them from other

wires (at least 30cm is
recommended)
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Capacitive Coupling in Wires

• The longer the wires run
together, the higher is the
capacitance
• The higher the frequency, the
better the coupling
• The higher the impedance to
ground (RL), the higher the
voltage
• Identify noisy wires and separate
them from other wires (at least

30cm is recommended)
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Dealing
with EMI
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EMI Management:
Comprehensive Approach
• All components must be considered for
successful EMI managements
Propagation
EMI Origin EMI Target
Path

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Sources of EMI in
Manufacturing Environment
• Poorly-designed equipment
• Poorly installed equipment
• Poorly maintained equipment
• ESD Events
• Mobile phones and walkie-talkies
Propagation
Path
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EMI Caused by EMI Origin

Equipment
• Every electric or electronics device generates
electromagnetic field and electrical noise on wires
• If these signals are too strong and have certain
properties, they are good candidate for EMI
• Poorly-maintained equipment is good source of EMI
(DC brush motors, bad grounding)
• EMI-generating equipment often causes problems
for itself
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EMI in Improperly EMI Origin
Installed Equipment
• Even the best tool improperly
installed can be a source of
strong EMI
– Long and coiled ground wires
– Power cables running next to
data cables
– Known noisy tools installed
next to sensitive equipment

– Known noisy tools connected
to the same power lines as
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sensitive tools
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ESD-Caused EMI EMI Origin
• ESD Event is rapid current surge:

causes magnetic field
• ESD Event is rapid drop of voltage:
causes electric field
• Combination: electromagnetic field
• ESD Events cause strong ground and power line currents --
EMI via conductive path
• ESD-induced EM fields have broad spectrum, high energy

and rapid rise time -- good candidates for EMI
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ESD-Caused EMI in EMI Origin

Cleanrooms – Example
• Wafers are charged to the limit

• SMIF pods with wafers are placed on steel cart
• Cart is charged by the wafers via capacitive coupling
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• EMI propagates throughout the fab causing lockup of wafer handlers
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EMI from EMI Origin
Mobile Phones
• Frequency range: 800, 900 and
1800MHz
• GSM phones produce emission in
bursts
• High emission levels (~10V/m)
• Easily creates disruption in sensitive
equipment in immediate proximity

577µS Carrier: 900/1800MHz
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GSM Phone Transmission Pattern
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Propagation of EMI
• If noise cannot get to sensitive equipment, the
problem is solved, at least partially
Propagation
Path
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Radiated Emission Propagation

Path
Equipment Shielding
• Used for both reduction of emission and improvement of
immunity
• Tool panels (shielding) are often left open after
maintenance
• Sometimes panels are not connected to ground (painted
mounting, etc.)
• Anodized aluminum is not a conductor!
• Dissipative surfaces are not EMI-conductive!

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Propagation
Conducted Emission Path
• Common conduits:
– Ground wires
– Power cables
– Network cables
• A signal originated in one spot can propagate through the
entire factory via these conduits
• Consider using separate power and ground lines for

sensitive and for noisy equipment (see Facility Ground
section)
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• Use EMI filters
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Some Specifics of High-

Frequency Propagation
• Reflections
– If the impedance of source, cable
and the load are mismatched, the
resulting artifact is reflections
– In the RF world 50N impedance
is common
– Impedance of power and ground
wires, sources and loads is
anything but
– End result is that any spike on
the wire can produce ringing
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Some Specifics of High-

Frequency Propagation
• Standing Waves
– If the length of the cable is
just right for a particular
wavelength this may result
in a standing wave
– Standing waves aggravate
EMI problems since the
signals do not “die”
peacefully
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Equipment Susceptibility to EMI
• Every piece of equipment is a target for EMI
Propagation
Path

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EMI-Caused EMI Target

Equipment Failures
Three Basic Types of Failures
• Fatal failure due to overstress
– direct ESD discharge
– high EMI-induced signals (EOS)
• Latch-Up
– induced voltages are outside of supply rails
– often recoverable after power-cycling
– sometimes causes overheating and failure
• Injection of false signals
– Induced signal is comparable to legitimate signals

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EMI-Induced EOS EMI Target

Damage
• Unlike electrostatic discharge with limited charge
available, EMI-caused signals may not have such
limitations
• They often act as voltage sources with virtually
unlimited current (within reason)
• Exposure of components to EOS caused by EMI
must be examined in an entirely different way from
exposure to ESD
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Equipment Lock-Up: EMI Target
False Signals
• Electromagnetic fields induce Induced EM
Disturbance
seemingly legitimate signals into
electronics circuits which leads to
circuit malfunction
• Often, the electronics circuit does not
suspect that it was affected by EMI
• Today’s high-speed circuits are much
more susceptible to ESD-induced
high-speed transients An "Extra" Pulse
• Virtually impossible to reproduce –

difficult to diagnose
• IC testers and other equipment,
including process-sensitive tools are
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most affected
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Sensor Malfunction EMI Target
• Strong electromagnetic fields • TDMA mobile phone caused false readings in sensor
of magnetic head tester and finally caused error
induce voltages and currents in message after failing several good GMR heads
circuits
• In sensors such signals can
affect legitimate signals and
cause false readings
• Consequences:
– disrupted process
– good components failed
– bad components passed
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EMI FILTERS
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Purpose of EMI Filters
• In general, EMI filters suppress
high-frequency signals and pass
only desired signals
• More specifically, absolute
majority of EMI filters are designed
to help manufacturers comply with
EMC regulations

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EMI Filters
• Regular EMI filters don’t work well in a factory environment:
• They perform better at high frequencies while most of strong EMI cases in
production is at lower end of the spectrum
• They are designed for 50N termination during compliance test
• Real-life production environment is anything but that
• Most of signals in production environment are transients, while the EMC tests
use continuous signals
• Long lines in installation create reflections, mostly at low frequencies rendering
standard filters even more ineffective
• The performance of even a good-quality filter would be dramatically worse in
real-life conditions at a factory than in then laboratory using standardized setups

• There is nothing wrong with standard EMI filters, except they are designed for
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completely different purpose than the needs of the factory
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Caveat Emptor, or Importance

of Reading Specification
• EMC regulations use 50N
termination
• Power lines are not quite
50N
• Some manufacturers do
specify more realistic
performance of their filters as
it is relevant to actual
applications
• Read the specification! A=50N/50 Nsym; B=50N/50N asym;
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C=0.1N/100N sym; D=100N/0.1N sym
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Signals on Power Lines
and Filter Performance
An example of a waveform on power Performance of different filters at low
lines. Timebase is 2µS. The main frequencies
frequency is 200kHz
0
0 500 1000 1500 2000
-10
-20
2-Stag
-30 e Filter
Attenuation, dB
Single
-40 Stage
Filter
-50 Specia
l Filter
-60

-70
-80
-90
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Frequency, kHz
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Impulse Response of
Different Filters
Raw signal on ground
After Single-Stage Filter

After Time-Domain Filter
After Dual-Stage Filter
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Where to Place a Filter

• A factory is often a maze of cables and wires often routed
together in unpredictable ways without consideration for noise
• This means that noise can be injected on cable that goes to a
sensitive tool anywhere
• Therefore, it is the most effective to place filter at the power
input of sensitive tools
• It is also a good practice to place filter at noise generators – this
lowers overall noise in the factory, but cannot guarantee low
noise at sensitive tools due to many other noise sources in the

facility
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GOOD EMI PRACTICES

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Good EMI Practices
• Denial is no longer an option

• EMI Management
• EMI Education
• EMI and Equipment
• EMI Audit
• EMI Monitoring
• EMI Troubleshooting and Diagnostics

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EMI Management Basics

• Assign personnel responsible and accountable
for EMI environment worldwide and in each
facility
• Educate personnel and keep them current
• Set EMI policy and standards for equipment and
installation. Enforce it.
• Allocate budget for EMI mitigation

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EMI Management of
Equipment
• Require all purchased equipment to have proper EMC
certification (FCC, CE). Make it a part of purchase specification
• Certify all internally-created equipment for compliance with EMC
standards
• Do not use non-compliant equipment
• Test entire installation for emission and compare it with internal
standards
• Enforce EMI check before and after maintenance of all

equipment
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EMI-Proof Your Equipment
• Properly install it
• Keep all covers on with all the screws properly
fastened
• Tighten all connectors
• Use EMI filters
• Monitor EMI environment near equipment
• Include EMI performance in maintenance record

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An ounce of prevention is worth hours of downtime and finger-pointing
EMI AUDIT
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EMI Audit
• Just as you conduct ESD Audit, perform EMI Audit on a regular basis.
Among items to check:
• Every connection to ground
• Quality of EMI ground
• EMI levels at each tool/workstation.
Set EMI limits for each type of tool!
• ESD activity
• Proper shielding
• Runs of data cables

Collect data and keep records. Investigate changes!
Train personnel in EMI basics – will pay off
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EMI Audit: Basics

1st floor • Conduct baseline EMI survey.
Measure both average and peak
Data from EMI 180
values of EMI
Audit at a FAB.
160
• Create EMI map of your facilities
Field Strength, mV/m
140
Measurements of 120
EMI on ground
100 – Determine your EMI “hot spots”
80
plates 60
40
S7 – Similar equipment should have
S6
20
0
S5
S4
similar EMI signature. Deviations
1
2 3 4 S2
S3
may mean trouble
5
Sub Fab Ground EMI 6 S1
7
8
• Do not let problems just “sit there” --
devise plan of action and follow-up
200
180
• Do EMI audit on scheduled basis.
Monitor progress. Find where the
160
Field Strength,mV/m
140
120
100
problems appear
80
60
40
20
0
HBM
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EMI Facility Map

High EMI Area
Create EMI map of

your facilities. It will
help you to identify
problematic spots
BEFORE problems
arise and will help
you to troubleshoot
the problems that
have occurred.
HBM
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25
EMI Audit: Non-Contact Ground
Measurements
• Measure field strength near
– each ground plate
– grounded tool cover
– grounding wires
• Recommended distance from the
grounded surface: 0.5” or 10mm
• Measure both average and peak
values
• Data log the readings and make

them part of EMI Audit Report
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EMI Audit: Contact Ground

Measurements
• Measure ground
impedance and EMI
between reference ground
and the parts of the tool
that come in contact or
close to your devices
• Measure ground
impedance and EMI
between different metal
parts that may expose your
devices to EOS
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EMI Audit: Power Lines

• Power lines serve as propagation path for EMI
• Use the same methodology as with ground wires
• Keep in mind that power lines are expected to have
more EMI than ground
• Use factor of 3..5x (vs. background) to determine
whether power line is clean
• Trace EMI problems to their sources
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26
EMI TROUBLESHOOTING AND

DIAGNOSTICS
HBM
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79
EMI Troubleshooting
Methodology
• Your tool has locked. What now?
Ignore it and pretend it never Disregard it as unimportant

happened
Hope it was just an accident Report the incident and

and forget it investigate it
HBM
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Difficulties in EMI
Troubleshooting
• In order for EMI to cause problems EMI occurrence should
coincide with the most vulnerable step in equipment
operation
• One equation with two variables
• EMI simulation often doesn’t help since it may not
represent actual EMI condition to which equipment is most
vulnerable
• Continuous EMI monitoring is essential in correlating EMI

occurrences and equipment malfunction
HBM
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27
Why EMI Matters Now
More than Ever?
• Smaller geometries of today’s devices make them much more
susceptible to EMI
• The new circuits work at higher speeds and now “notice” the ultra-
short spikes that older slower circuits ignored
• Higher frequencies used in today’s electronics create more emission
due to better antenna factor
• Today’s circuits work at lower voltages: as low as 1.8V. Much lower
levels of EMI are needed for their disturbance

• The trend doesn’t look promising
HBM
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Q&A
HBM
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83
Contact Information
Vladimir Kraz
BestESD Technical Services
P.O. Box 5146, Soquel, CA 95073 USA
Tel. 831-824-4052 FAX 206-350-7458
E-mail vkraz@bestesd.com
Web site http://www.bestesd.com
HBM
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Electromagnetics: Electromagnetic Field Is A Natural Phenomenon

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Electromagnetics

©2009 BestESD Technical Services

emission “EMI,” though it is technically incorrect

• There is no place in the Universe without electromagnetic

©2009 BestESD Technical Services

Why EMI is Important?

©2009 BestESD Technical Services

Large Dynamic Range is the

Ratio - Linear Formula Ratio - dB

©2009 BestESD Technical Services

Ratio - Linear Formula Ratio - dB

Ratio - Linear Formula Ratio - dB

©2009 BestESD Technical Services

Dynamic Range Examples

60 dBm 1 kW Typical combined radiated RF power of microwave oven elements

Near and Far Fields

field – its frequency is zero

©2009 BestESD Technical Services

Time for Experiments

RADIATED AND CONDUCTIVE

©2009 BestESD Technical Services

• Also, every piece of equipment is also a radio receiver

©2009 BestESD Technical Services

emanate from that piece of

typically 20…50 MHz

©2009 BestESD Technical Services

Differential Signal (between two wires in a pair)

Common-Mode Signal (between each of two wires and the ground)

©2009 BestESD Technical Services

EMI and Ground

• Even the best tool poorly installed and maintained is a

©2009 BestESD Technical Services

Inductive and Capacitive

• A device can be exposed to a

Electrical Circuits Behavior

Low frequencies Open circuit Short circuit

High frequencies Short circuit Open circuit

(MHz and GHz): (low impedance) (high impedance)

©2009 BestESD Technical Services

• A bus bar for AC current at 60 Hz

– Cover ground wires with insulation to Frequency Skin depth (mm)

Grounding at Low and High

©2009 BestESD Technical Services

• Equipment ground “bounces”

Injection of EMI into Ground Wires

• Both radiated and +5V

conducted emission induces Signal In

voltages in long and

©2009 BestESD Technical Services

Capacitive Coupling in Wires

them from other wires (at least

©2009 BestESD Technical Services

EMI Caused by EMI Origin

©2009 BestESD Technical Services

ESD-Caused EMI EMI Origin

• ESD Event is rapid current surge:

• ESD-induced EM fields have broad spectrum, high energy

ESD-Caused EMI in EMI Origin