Telephone Number:

MADHUCHANDRA ANJANAYYA
#18 RUGBY STREET [+447468586036]
LEICESTER LE35FF Email: Madhu1168@gmail.com

EMPLOYMENT
Associate Manager Best Dial India Management Services Pvt Ltd Aug 10 2015 – Aug 2017
• Documented all customer quires and comments thoroughly and quickly.
• Responded to all customer need assessment thoroughly and professionally.
EDUCATION
LEICESTER, UK De MontFort University Jan 2018 – oct 2019
 Masters in Mechatronics Engineering
Graduate Coursework : Engineering Systems: Dynamics and Control, Machine Vision, Robotics and
Flexible Automation , Microprocessor Applications and Digital Signal Processing, Study Skills and
Research Methods ,Mechatronic Systems Engineering and Design ,Electro mechanics, Engineering
Business Environment and Energy Studies , Programming and Software Engineering ,Includes
dissertation and project presentation

Bangalore, India Sambhram Institue Of Technology Sep 2011 – june 2015

 Bachelor of Engineering in Mechanical Engineering
 Undergraduate Coursework : Engineering Mathematics, Electric and Electronics, Computer
Engineering, Mechanics of Materials, Design of Machine Elements 1&2, Turbo Machines,
Thermodynamics, Heat Mass Transfer, Hydraulics & Pneumatics, Vibrations , CAMD Design,
CIM Programming.
SOFTWARE SKILLS
Programming languages and Libraries
 Fusion360, C, MATLAB, C++, AUTO CAAD, PRO-E , CAM SHAFT, CNC SOFTWARE [(GTTC) Govt Tool Room & Training
Centre Ltd] .
Platforms
 Windows
Documentation Tools
 Microsoft Word Office (Word, PowerPoint, Excel, Outlook)
Software IDEs
 Arduino

ACADEMIC AND RESEARCH PROJECTS

Design and Manufacture of Drill Jig for Aerospace Component with tolerance Stack up analysis
 To identify the locating, supporting and clamping methods and details to suit
Specific jig and fixture for drilling machine.
 To calculate and analyze the clamp to hold the work piece for this jig.
 To design jigs for making straight holes by maintaining dimensional tolerance.
 To generate a new component result by using the machining process in drilling Machine.
Effect of Reflow Profile on Bonding Strength of Lead-Free Solder Joints in Electronics Applications

Purpose – The purpose of this work is to study the effect of the reflow peak temperature and time above
liquids on both SnPb and SnAgCu solder joint shear strength.
in reflow profiles for Sn37Pb have been developed with three levels of peak temperature (2308C, 2408C,
and 2508C for Sn3.0Ag0.5Cu; and 1958C, 2058C, and 2158C for Sn37Pb) and three levels of time above
solder liquids temperature (30, 60, and 90 s).
The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared
across the different profiles.

The shear forces for the resistors were measured after assembly. The fracture interfaces were inspected
using scanning electron microscopy with energy dispersive spectroscopy in order to determine the failure
mode and failure surface morphology.

Findings – The results show that the effects of the peak temperature and the time above solder liquids
temperature are not consistent between different component sizes and between Sn37Pb and Sn3.0Ag0.5Cu
solder. The shear force of SnPb solder joints is higher than that of Sn3.0Ag0.5Cu solder joints because the
wetting of SnPb is better than that of SnAgCu.

Research limitations/implications – This study finds that fracture occurred partially in the termination
metallization and partially in the bulk solder joint. To eliminate the effect of the termination metallization,
future research is recommended to conduct the same study on solder joints without component
attachment.

Practical implications – The shear strength of both SnPb and SnAgCu solder joints is equal to or higher than
that of the termination metallization for the components tested.

Originality/value – Fracture was observed to occur partially in the termination metallization (Ag layer) and
partially in the bulk solder joint. Therefore, it is essential to inspect the fracture interfaces when comparing
solder joint shear strength.