A Design Methodology Using Power-Grid Prototyping To Optimize Area Performance of SoCs

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A design methodology using Power-

Grid Prototyping to optimize Area
Performance of SoCs
8-10 minutes
Abhishek Nigam, Bhanu Prakash (STMicroelectronics)

Anant Narain, Apache Design Solutions
Abstract:
Set-Top-Box(STB) SoC designs are extremely complex with multi-
million standard cells, higher core utilization of around 70-80 %,
and multiple clock domains including high and low frequencies. An
assessment of any overdesign in the power grid of such SoCs
becomes one of the key competitive business needs.
This paper first describes a methodology for power grid
optimization leveraging early static IR flow and correlating with
existing sign-off results. It also presents a methodology for doing
early dynamic IR drop analysis, which can identify potential
overdesigns in the grid to save valuable signal routing area. It
outlines the impact of Metal6 power grid width variations on Static
and dynamic IR drop using STB SoC in 40 nm Wire bond chip.
Finally, results and conclusion of changing metal density on static
and dynamic IR drop analysis at early stage using ANSYS-
Apache’s RedHawk tool are presented. The correlation of early
results with final results observed are encouraging for decision-
making in shrinking metal6 width to gain advantage in routing
tracks and consequently floorplan change which can reduce the
die-size - a value-add to SoC designs.
Introduction
Set-Top-Box SoC designs are complex, typically with over 5 million
standard-cell instances, having multiple frequencies and low
voltage supply of 1.1V in 40 nm technology node. In this paper we
describe a methodology using a fast PG mesh prototyping based
flow for such SoCs, that can be used to identify PG grid
overdesign by early static and Dynamic Voltage Drop analysis of
1 of 10 14-08-2020, 18:05
the power grid and hence identify opportunities for freeing up

valuable signal and clock routing resources on higher metal layers.
Using this methodology, we could conclude that the PG mesh of
one such SoC was indeed over-designed. Another advantage of
leveraging this methodology is, all our experiments are
independent of any dependency due to Place and Route tool for
the grid design and hence provide fast turn-around-time to meet
aggressive time-to-market needs.
Experiments to simulate the design with shrinked width of Metal6
using early static & dynamic IR drop on SoCs was a driver for
formulation and execution of the idea as explained in this paper. A
key aspect of this work is to measure the penalty of shrinking
power mesh and potential in gaining the core area.
Methodology
The methodology involves the design of a PG mesh-only prototype
model of the SoC, validating the Static-IR and Dynamic Voltage
Drop results from this prototype model against the first version of
the PnR database results. In the next step, the widths of the
Metal6 layer PG mesh is reduced in quick iterative runs to optimize
the PG mesh and create useful signal and clock routing resources
for potential area savings.
Figure 1.
The Figure 1. shows the technology inputs, automation scripts for
translation of design inputs to the flow and the what-if analysis with
metal change variations in power grid. The Figure 2 below shows
the layout of the PG mesh prototype of the SoC
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Figure 2.
To estimate the effects of PG mesh optimizations on Dynamic
Voltage Drop (DvD) analysis, the entire power grid area is
modelled as 10x10 regions as in Figure 3. The currents and
decaps for each region were estimated from the first PnR
database results and provided as APL (Apache Power Library)
currents and cdevs models in Figure 4 for DvD analysis with
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Ansys-Apache’s RedHawk tool
Figure 3.
Figure 4.
The PG Mesh in the SoC consists of M1, M6, M7 and AP layers.
We have used this methodology to investigate for possible
overdesign in the M6 PG mesh. Since most of memories, macros
and IPs use the M6 layer, any optimization in the PG mesh of this
layer could free useful signal and clock routing resources for
hence potential reduction in the area.
For the prototype model validation we used standard 3.4u width of
the M6 layer which is the same as used for the first version of PnR
database of this SoC. We then investigate using this fast iterative
PG prototyping flow, the effect on static and DvD drops versus
routing area savings achieved with M6 widths of 2.5u and 1.7u
respectively as in figure 5.
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Figure 5.
Results, Analysis and Conclusions
Static IR analysis histogram comparing the effect on IR drop for
vdd and gnd for different widths of M6 layer is shown below in
Figure 6a and 6b resp.
Figure 6a.
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Figure 6b.
The static-IR color maps between the PnR database (1st version)
and PG prototype base static IR correlate well with pessimism of
4mV as.
The Figure 7 shows the color maps for M6 widths reduced to 2.5u
and 1.7u respectively
Figure 7.
A first PG prototype Early Analysis run was done to have the same
PG mesh specs as the sign-off database (M6 width 3.4u) to
validate the QoR of this methodology. The Static IR drop color
maps for vdd/gnd match reasonably well (Figure 7) with the PnR
database results with a pessimism of 4-5mV on vdd and gnd IR
drops. Total Veff drop for PnR database signoff run is 3.4% while
for Early Analysis run is 4.2%. The Early Analysis results are
within +1% of signoff results. The M6 metal width was reduced by
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~25% and ~50% of original M6 signoff width keeping the pitch

same. The Veff static IR drop is increased by 0.6% and 1.4% resp.
The effect of decreasing M6 width from 3.4u to 2.5u is not much.
Even the extreme case of reducing the M6 width to half (1.7u)
results in 1.4% increase in static IR. So from the experiments,
reducing the M6 density looks feasible as in Figure 8.
Figure 8.
Dynamic Voltage Drop analysis histogram comparing the effect on
IR drop for vdd for different widths of M6 layer in shown in Figure
9.
Figure 9.
The first version PnR database based demand current (sum of all
instantaneous currents over time) is shown in green in Figure 10
and battery current (sum of current supplied by the pads over time)
is shown in red. The total demand current and battery currents for
the grid prototype based early dynamic run are shown in blue and
pink resp. and match well with the PnR database runs
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Figure 10.
The DvD hotspots in Figure 11 match well between the 1st PnR
database based results and the grid prototype based early DvD
results using our methodology. The increase in DvD drops due to
shrinking M6 widths is marginal and hence the potential routing
area savings by shrinking M6 width looks feasible.
Figure 11.
The potential savings in routing area for Metal6 are shown in
Figure 12.
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Figure 12.
Recent Silicon results shown in Figure 13 below correlates with
pre-silicon simulation results which increases our confidence in the
methodology for a new area efficient product.
Figure 13.
Known Limitations of the Methodology
The initial floorplan GIF based flow creates the design from
scratch starting from chip boundary, PG mesh specification,
partition and blockage placements, hence this flow can result in
some differences in the actual placements of partitions/macros
/blockages/pads and PG mesh if compared with a sign-off
database.
This is also seen in the results of prototype based Early Analysis
that has same PG mesh as sign-off but the GIF based Static IR
results are 4/5 mV pessimistic for each vdd/gnd rails.
Conclusions
SoC Power-trends of Static and Dynamic Voltage drop with
reduced M6 power mesh density was demonstrated on
representative SOC which shows a gain in area savings of 6.2sq-
mm and 11.7 sq-mm for reduced widths of 2.5u and 1.7u widths
respectively from the signoff width of 3.4u with marginal increase
in static IR and DvD drops.
This approach led to the development of a specific CAD method,
which has potential for re-use.
Acknowledgements
Rajeev Srivastava , STMicroelectronics , India
9 of 10 14-08-2020, 18:05
Naveen Sharma , STMicroelectronics , India

Sachin Mathur , ST Microelectronics , India
Manish Kumaria , STMicroelectronics , India
Ajay Miyan , STMicroelectronics , India
Steve Docker , STMicroelectronics , UK
Guido Angelo Repetto, STMicroelectronics, France
Posted on: Jan. 27, 2014
10 of 10 14-08-2020, 18:05

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A design methodology using Power-Grid Prototyping to optimize Area P... about:reader?url=https://www.design-reuse.com/articles/33760/power-gr...

A design methodology using Power-

Abhishek Nigam, Bhanu Prakash (STMicroelectronics)

the power grid and hence identify opportunities for freeing up

Ansys-Apache’s RedHawk tool

~25% and ~50% of original M6 signoff width keeping the pitch

Naveen Sharma , STMicroelectronics , India

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