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323-1851-102.3 (6500 R11.2 OCn STMN CPS) Issue1
323-1851-102.3 (6500 R11.2 OCn STMN CPS) Issue1
What’s inside...
New in this release and documentation roadmap
OC-n/STM-n circuit packs
Contents 0
List of procedures
1-1 Provisioning a circuit pack automatically 1-123
1-2 Provisioning a pluggable automatically 1-125
1-3 Routing fiber-optic cables and STM-1e coaxial cables onto the 6500
shelf 1-126
1-4 Connecting or disconnecting fiber-optic cables to or from circuit packs 1-127
1-5 Adding a facility to an equipment 1-128
1-6 Editing facility parameters 1-132
1-7 Changing the protection scheme for a pair of facilities 1-133
1-8 Creating ring configurations 1-138
1-9 Adding a new entry in the communications settings 1-143
1-10 Adding a path connection 1-145
1-11 Changing the primary state of a facility 1-150
1-12 Changing the primary state of a circuit pack or pluggable 1-152
1-13 Deleting a facility from an equipment 1-154
1-14 Deleting a circuit pack or pluggable 1-156
Equipment and facility provisioning parameters 1-157
Facility parameters 1-160
OCn/STMn/STM0J/STM1J/STM4J facility parameters 1-160
OTM2 facility parameters 1-163
AD facility parameters 1-169
ADJ facility parameters 1-170
DCC/GCC support and parameters 1-172
IISIS parameters 1-175
OSPF parameters 1-178
Ring APS configuration editor parameters 1-183
Path connections parameters 1-186
Issue 1
There are no new features covered in this document for this release.
Supporting WaveLogic Photonics 6500 Data 6500 Control Plane Submarine Networking
Documentation Coherent Select Application Guide Application Guide Application Guide
(323-1851-980) (NTRN15BA) (NTRN71AA) (NTRN72AA)
6500 Photonic Common 6500 - 5400 / 8700 Network Interworking Universal AC Rectifier
Layer Guide Photonic Layer Interworking Solution Guide Application Note
(NTRN15DA) Technical Publications (323-1851-160) (NTCA68CA) (009-2012-900)
Table 1-1
OC-n/STM-n circuit packs in this chapter
Topic Page
When interworking with OMX product and to avoid link budget problem, you
must set the Tx FEC Format of the 1xOC-192/STM-64 STS-1/HO DWDM
C-Band AM1/AM2, 1xOC-192/STM-64 VT1.5/LO DWDM C-Band AM1/AM2,
and 1xOC-192/STM-64 DWDM L-band tunable optical interfaces to Super
concatenated FEC. The Rx Equalization firmware must be also running on the
OMX side. The AM1/AM2 dithering support is required when interworking with
Long Haul 1600 systems and MOR+ systems.
To use the VT1.5/VC11 and VT2/VC12 granularity, both the optical interface
circuit packs and the cross-connect circuit packs must support VT.15/VC11
and VT2/VC12 switching granularity.
Figure 1-1
1xOC-192/STM-64 circuit pack faceplate
Ready
In Use
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Tx
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Hazard
level:
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type A
Figure 1-2
1xOC-192/STM-64 circuit pack block diagram (NTK523xxE5)
XC
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-3
1xOC-192/STM-64 circuit pack block diagram (NTK524xxE5)
XC
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-4
1xOC-192/STM-64 circuit pack block diagram (NTK526xxE5 except NTK526JAE5 and
NTK526JBE5)
XC
Fixed
10G SONET/SDH OHP G.709/FEC wavelength 1
DWDM optics
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-5
1xOC-192/STM-64 circuit pack block diagram (NTK527xxE5 except NTK527JAE5 and NTK527JB)
XC
Fixed
VT/TU 10G SONET/SDH OHP G.709/FEC wavelength 1
processor DWDM optics
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-6
1xOC-192/STM-64 circuit pack block diagram (NTK526JAE5)
XC
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-7
1xOC-192/STM-64 circuit pack block diagram (NTK527JAE5)
XC
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-8
1xOC-192/STM-64 circuit pack block diagram (NTK527JB)
XC
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-9
1xOC-192/STM-64 circuit pack block diagram (NTK526JBE5)
XC
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Supported functionality
The 1xOC-192/STM-64 circuit pack provides the following functionality.
• one integrated 10G line interface (port 1)
• supports OC-192 (SONET) and STM-64 (SDH) services
• terminates/generates both section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable (default is Off) (no support for
GCC)
• line/MS DCC for SONET/SDH Control Plane
Table 1-2
Supported configuration and equipment details
Topic Requirement
Configuration
Minimum receiver sensitivity -25 dBm on 10G SONET/SDH DWDM circuit pack
FEC RS8
Equipment
10G OTR circuit packs 2x10G OTR 4x XFP (NTK530PGE5 and NTK530PME5)
Cross-connection types
The 1xOC-192/STM-64 circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled
Cross-connection rates
The 1xOC-192/STM-64 circuit packs support the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11, VT2/VC12, STS1/LO VC3
(VT1.5/LO circuit packs only)
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rates of STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
STS48c/VC4-16c, and STS192c/VC4-64c
• auto concatenated rates of STS1/VC3, STS3c/VC4, STS12c/VC4-4c,
STS48c/VC4-16c, and STS192c/VC4-64c
Performance monitoring
The 1xOC-192/STM-64 circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-192/STM-64 facilities
• PM collection for OTU layer (1xOC-192/STM-64 AM1/AM2 DWDM tunable
HO/LO circuit pack only)
• PM collection for ODU layer (1xOC-192/STM-64 AM1/AM2 DWDM
tunable HO/LO circuit pack only)
• PM collection for STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
STS48c/VC4-16c, and STS192c/VC4-64c concatenated payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
Photonic alarms
• Duplicate Adjacency Discovered
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)
Equipping rules
The following equipping rules apply to 1xOC-192/STM-64 circuit packs:
• is a single-slot one-port interface
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note 1: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Note 2: The 1xOC-192/STM-64 circuit pack is supported in slots 1 to 4
and 11 to 14 (e.g. excluding slots 5, 6, 9, and 10) only if the 14-slot shelf
is equipped with STS-1/VC-3 (160/0), 240G+ STS-1/VC-3 (240/0), or
240G+/80G VT1.5/VC-12 (240/80) cross-connect circuit packs. The
1xOC-192/STM-64 circuit packs are supported in slots 5, 6, 9, and 10 of
a 14-slot shelf for all cross-connect circuit packs (except PKT/OTN,
20G/20G VT1.5/VC-12, and MXC cross-connect circuit packs). The
1xOC-192/STM-64 circuit pack is not supported when using the 20G/20G
VT1.5/VC-12 or MXC cross-connect circuit packs.
• you cannot deploy 1xOC-192/STM-64 DWDM (VT1.5/LO, STS-1/HO, or
1xOC-192/STM-64 AM1/AM2 DWDM tunable HO/LO) circuit packs in the
lower shelf of the stacked configuration in 14-slot shelf type.
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot
packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.
Technical specifications
Table 1-3 lists the weights for 1xOC-192/STM-64 circuit packs.
Table 1-3
1xOC-192/STM-64 circuit packs weights
Description PEC Weight
(estimated)
1xOC-192/STM-64 circuit pack NTK523BAE5/NTK524BAE5 1.3 kg (2.9 lb)
NTK523DAE5/NTK524DAE5
NTK523FAE5/NTK524FAE5
NTK523FBE5/NTK524FBE5
1xOC-192/STM-64 DWDM circuit pack NTK526xxE5/NTK527xxE5/ 1.4 kg (3.1 lb)
NTK527JB
Table 1-4 lists the power consumptions for 1xOC-192/STM-64 circuit packs.
Table 1-4
1xOC-192/STM-64 circuit packs power consumptions
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Table 1-5 lists the optical specifications for the OC-192/STM-64 circuit packs.
Table 1-5
Optical specifications for 1xOC-192/STM-64 circuit packs
Classification SR1/I64.1 IR2/S64.2 LR2/L64.2 LR2/L64.2
PEC NTK523BAE5 NTK523DAE5 NTK523FAE5 NTK523FBE5
NTK524BAE5 NTK524DAE5 NTK524FAE5 NTK524FBE5
Transmitter
Transmitter type DFB EML EML EML
Nominal wavelength 1310 nm 1550 nm 1533 nm 1557 nm
Wavelength range 1290 nm to 1530 nm to 1530.5 nm to 1554.5 nm to
1330 nm 1565 nm 1535.5 nm 1559.5 nm
Transmit output power (max) -1 dBm +2 dBm +5 dBm +5 dBm
Transmit output power (min) -6 dBm -1 dBm +1 dBm +1 dBm
Spectral width 1 nm 0.3 nm 0.3 nm 0.3 nm
Minimum side mode suppression ratio 30 dB 30 dB 30 dB 30 dB
Minimum extinction ratio 6 dB 8.2 dB 10 dB 10 dB
Tx power monitor accuracy +/- 2.5 dB +/- 2.5 dB +/- 2.5 dB +/- 2.5 dB
(see Note 2)
Table 1-6 lists the optical specifications for the 1xOC-192/STM-64 DWDM
circuit packs.
Table 1-6
Optical specifications for 1xOC-192/STM-64 DWDM circuit packs
Parameter Value
PEC NTK526xx and NTK527xx except
NTK526JA/JB, NTK527JB, and
NTK527JA (see Planning - Ordering
Information, 323-1851-151)
Transmitter
Transmitter type DFP laser with InP MZ modulator
Laser modulation IMDD NRZ
Wavelength range 1528.77 nm to 1564.68 nm (C-band)
1569.59 nm to 1605.74 nm (L-band)
(see Note 1)
Central wavelength accuracy +/- 0.04 nm
Transmit output power (max) +4.2 dBm
Transmit output power (min) +2.6 dBm
Spectral width 20 MHz Full Width Half Maximum
Minimum side mode suppression ratio 40 dB
Tx power monitor accuracy +/- 0.5 dB
Chirp polarity negative
Receiver
Receiver type APD (uncooled)
Wavelength range 1528.77 nm to 1605.74 nm
Receiver sensitivity at OSNR >= 21 dB (C-band) or -23 dBm (see Note 2)
22 dB (L-band) (see Note 3)
Receiver overload -8
Path penalty Included in receiver sensitivity figures
Rx power monitor accuracy +/- 1 dB
Table 1-8 lists the optical specifications for the 1xOC-192/STM-64 AM1/AM2
DWDM tunable HO and 1xOC-192/STM-64 AM1/AM2 DWDM tunable LO
circuit pack circuit packs.
Table 1-8
Optical specifications for 1xOC-192/STM-64 DWDM tunable circuit packs
Parameter Value
PEC NTK526JAE5 (1xOC-192/STM-64
STS-1/HO DWDM C-Band AM1/AM2)
PEC NTK527JAE5 (1xOC-192/STM-64
VT1.5/LO DWDM C-Band AM1/AM2)
PEC NTK526JBE5 (1xOC-192/STM-64
STS-1/HO DWDM L-Band)
PEC NTK527JB (1xOC-192/STM-64 VT1.5/LO
DWDM L-Band)
Transmitter
Connector type LC
Laser modulation IMDD NRZ
Laser spectral width < 20 MHz
Line rate 10.709 Gbit/s
Tunable wavelength range • NTK526JAE5 and NTK527JAE5:
1528.77 nm to 1565.09 nm
• NTK526JBE5 and NTK527JB: 1569.59
nm to 1605.74 nm
(see “DWDM wavelengths” on page 1-29
for a list of supported wavelengths)
Tunable wavelength spacing • NTK526JAE5 and NTK527JAE5: 50 GHz
• NTK526JBE5 and NTK527JB: 50 GHz
Central Wavelength Accuracy 0.02 nm
Transmit output power • NTK526JAE5 and NTK527JAE5:
-10 to 1.5 dBm (if the Tx AM Format is set
to "AM1")
-10 to 3.1 dBm (if the Tx AM Format is set
to anything other than "AM1")
• NTK526JBE5 and NTK527JB:
3.1 dBm (typical)
Tx power monitor accuracy +/- 0.5 dB
Electronic dispersion compensation range N/A
Chirp polarity Positive or negative for NTK526JAE5 and
NTK527JAE5
Negative for NTK526JBE5 and NTK527JB
DWDM wavelengths
Table 1-9 lists the DWDM frequencies and wavelengths for the 10G HO/LO
DWDM tunable C-band AM1/AM2 (NTK526JAE5 and NTK527JAE5) circuit
packs supporting tunable transmitters in 50 GHz spacing.
Table 1-9
DWDM C-band wavelengths (50 GHz spacing)
Frequency Wavelength Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm) (THz) (nm)
196.10 1528.77 195.10 1536.61 194.10 1544.53
196.05 1529.16 195.05 1537.00 194.05 1544.92
196.00 1529.55 195.00 1537.40 194.00 1545.32
195.95 1529.94 194.95 1537.79 193.95 1545.72
195.90 1530.33 194.90 1538.19 193.90 1546.12
195.85 1530.72 194.85 1538.58 193.85 1546.52
195.80 1531.12 194.80 1538.98 193.80 1546.92
195.75 1531.51 194.75 1539.37 193.75 1547.32
195.70 1531.90 194.70 1539.77 193.70 1547.72
Table 1-10 on page 1-31 lists the DWDM L-band frequencies and wavelengths
for the following circuit packs supporting tunable transmitters in 50 GHz
spacing:
• 10G HO DWDM L-band tunable (NTK526JBE5)
• 10G VT1.5/LO DWDM L-band tunable (NTK527JB)
Table 1-10
DWDM L-band wavelengths (50 GHz spacing)
Frequency Wavelength Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm) (THz) (nm)
191.00 1569.59 189.40 1582.85 187.80 1596.34
190.95 1570.01 189.35 1583.27 187.75 1596.76
190.90 1570.42 189.30 1583.69 187.70 1597.19
190.85 1570.83 189.25 1584.11 187.65 1597.62
190.80 1571.24 189.20 1584.53 187.60 1598.04
190.75 1571.65 189.15 1584.95 187.55 1598.47
190.70 1572.06 189.10 1585.36 187.50 1598.89
190.65 1572.48 189.05 1585.78 187.45 1599.32
190.60 1572.89 189.00 1586.20 187.40 1599.75
190.55 1573.30 188.95 1586.62 187.35 1600.17
190.50 1573.71 188.90 1587.04 187.30 1600.60
190.45 1574.13 188.85 1587.46 187.25 1601.03
190.40 1574.54 188.80 1587.88 187.20 1601.46
190.35 1574.95 188.75 1588.30 187.15 1601.88
190.30 1575.37 188.70 1588.73 187.10 1602.31
190.25 1575.78 188.65 1589.15 187.05 1602.74
190.20 1576.20 188.60 1589.57 187.00 1603.17
190.15 1576.61 188.55 1589.99 186.95 1603.60
190.10 1577.03 188.50 1590.41 186.90 1604.03
190.05 1577.44 188.45 1590.83 186.85 1604.46
190.00 1577.86 188.40 1591.26 186.80 1604.88
189.95 1578.27 188.35 1591.68 186.75 1605.31
189.90 1578.69 188.30 1592.10 186.70 1605.74
189.85 1579.10 188.25 1592.52
189.80 1579.52 188.20 1592.95
189.75 1579.93 188.15 1593.37
189.70 1580.35 188.10 1593.79
189.65 1580.77 188.05 1594.22
189.60 1581.18 188.00 1594.64
189.55 1581.60 187.95 1595.06
189.50 1582.02 187.90 1595.49
189.45 1582.44 187.85 1595.91
Latency
Table 1-11 shows the latency specifications for 1xOC-192/STM-64 circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).
Table 1-11
Latency for 1xOC-192/STM-64 circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn/ XC→
OTM2→ XC OCn/STMn/
OTM2
1xOC-192/STM-64 STS-1/HO IR2/S64.2 NTK523DA 5 5
1xOC-192/STM-64 STS-1/HO LR2/L64.2 1557 nm NTK523FB 5 5
1xOC-192/STM-64 VT1.5/LO LR2/L64.2 1557 nm NTK524FB 5 (see Note 2) 5
1xOC-192/STM-64 VT1.5/LO SR1/I64.1 NTK524BA 5 (see Note 2) 5
1xOC-192/STM-64 STS-1/HO SR1/I64.1 NTK523BA 5 5
1xOC-192/STM-64 STS-1/HO LR2/L64.2 1533 nm NTK523FA 5 5
1xOC-192/STM-64 STS-1/HO DWDM (different NTK526xx 6 (see Note 3) 6
wavelengths)
1xOC-192/STM-64 VT1.5/LO DWDM (different NTK527xx 6 (see 6
wavelengths) Note 3 and
Note 4)
1xOC-192/STM-64 VT1.5/LO IR2/S64.2 NTK524DA 5 (see Note 2) 5
1xOC-192/STM-64 VT1.5/LO LR2/L64.2 1533 nm NTK524FA 5 (see Note 2) 5
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
Note 3: For an OTM2 facility, the typical OTM2 to XC latency for STS-1, STS-Nc, LO_VC3 and HO
paths is as follows: OTM2 with FEC Off is 6 µs, OTM2 with RS8 FEC is 13 µs and OTM2 with SCFEC
is 50 µs.
Note 4: For an OTM2 facility, the typical OTU2 to XC latency for LO VT1.5, VT2, VC11 and VC12 paths
is as follows: OTM2 with FEC Off is 18 µs, OTM2 with RS8 FEC is 24 µs and OTM2 with SCFEC is 61 µs.
The DWDM SFPs and DPOs support ITU-T DWDM compliant wavelengths as
follows:
• 40 wavelengths for interworking with the Common Photonic Layer
equipment and 6500 Photonic layers.
• 16 wavelengths on the 200GHz grid and 32 wavelengths on the 100 GHz
grid for interworking with the 565, 5100 and 5200 Advanced Services
Platform DWDM optical multiplexer (OMX).
To use the VT1.5/VC11 and VT2/VC12 granularity, both the optical interface
circuit packs and the cross-connect circuit packs must support VT.15/VC11
and VT2/VC12 switching granularity.
Figure 1-11
2xOC-48/STM-16 circuit pack faceplate
Fail Fail
Rx
Hazard Hazard
level: level:
R99
R99
EEEEE99999
EEEEE99999
S/N NT030MEE9999E
S/N NT030MEE9999E
NTUD99EE
Type A Type A
SFP DPO
Figure 1-12
2xOC-48/STM-16 circuit pack block diagram (NTK516BAE5)
XC
SFP 1
5G SONET/SDH OHP
SFP 2
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-13
2xOC-48/STM-16 circuit pack block diagram (NTK517BAE5)
XC
SFP 1
SFP 2
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-14
2xOC-48/STM-16 circuit pack block diagram (NTK519BAE5)
XC
DPO 1
5G SONET/SDH OHP
DPO 2
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-15
2xOC-48/STM-16 circuit pack block diagram (NTK520BAE5)
XC
DPO 1
DPO 2
XC
Backplane
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Supported functionality
The 2xOC-48/STM-16 circuit pack provides the following functionality.
• up to two pluggable (SFP or DPO) 2.5G interfaces (ports 1 and 2)
• OC-48 (SONET) and STM-16 (SDH) services
• terminates section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable (default is Off)
• line/MS DCC for SONET/SDH Control Plane
• monitors optical power input and output on all circuit pack types
• selectable automatic laser shut off controlled by software
• automatic detection/provisioning of SFP and DPO modules, which are hot
pluggable.
• unprotected, 2-Fiber BLSR/MS-SPRing, 1+1/MSP linear, and
UPSR/SNCP traffic protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports Control Plane (OC48/STM16 facility is supported as both
add/drop Control Plane facility and Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.
Cross-connection types
The 2xOC-48/STM-16 circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled
Cross-connection rates
The 2xOC-48/STM-16 circuit packs support the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11, VT2/VC12, STS1/LO VC3
(VT1.5/LO circuit packs only)
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rated of STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
and STS48c/VC4-16c
• auto concatenated rates of STS1/VC3, STS3c/VC4, STS12c/VC4-4c, and
STS48c/VC4-16c
Supported SFPs/DPOs
Table 1-12 provides a list of the SFPs that are supported on the
2xOC-48/STM-16 circuit pack. Table 1-13 provides a list of the DPOs that are
supported on the 2xOC-48/STM-16 circuit pack.
Table 1-12
Supported SFP modules for the 2xOC-48/STM-16 circuit packs (NTK516BAE5 and NTK517BAE5)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “OC-48/STM-16
DWDM small form-factor (SFP) pluggable modules”, for the complete list of ordering codes.
Table 1-13
Supported DPO modules for the 2xOC-48/STM-16 circuit packs (NTK519BAE5 and NTK520BAE5)
Pluggable Equipment and Supported DPO modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: Refer to Planning - Ordering Information, 323-1851-151, Chapter 7: Table “DWDM pluggable
optic modules (DPO) (manufacture discontinued)”, for the complete list of ordering codes.
Performance monitoring
The 2xOC-48/STM-16 circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-48/STM-16 facilities
• PM collection for STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and
STS48c/VC4-16c concatenated payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)
Equipping rules
The following equipping rules apply to 2xOC-48/STM-16 circuit packs:
• is a single-slot two-port interface
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Technical specifications
Table 1-14 lists the weight, power consumption, and SFP/DPO specifications
for 2xOC-48/STM-16 circuit packs.
Table 1-14
Technical specifications for 2xOC-48/STM-16 circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
2xOC-48/STM-16 STS-1/HO SFP NTK516BAE5 1.3 kg (2.9 lb) 31 31
circuit pack
2xOC-48/STM-16 VT1.5/LO SFP NTK517BAE5 1.3 kg (2.9 lb) 40 40
circuit pack
2xOC-48/STM-16 STS-1/HO DPO NTK519BAE5 1.3 kg (2.9 lb) 32 32
circuit pack
2xOC-48/STM-16 VT1.5/LO DPO NTK520BAE5 1.3 kg (2.9 lb) 32 32
circuit pack
SFP/DPO specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For the circuit packs that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-48/STM-16 SFP and DPO optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
Latency
Table 1-15 shows the latency specifications for 2xOC-48/STM-16 circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).
Table 1-15
Latency for 2xOC-48/STM-16 circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn→ XC→
XC OCn/STMn
2xOC-48/STM-16 STS-1/HO SFP NTK516BA 5 5
2xOC-48/STM-16 STS-1/HO DPO NTK519BA 5 5
2xOC-48/STM-16 VT1.5/LO SFP NTK517BA 5 (see Note 2) 5
2xOC-48/STM-16 VT1.5/LO DPO NTK520BA 5 (see Note 2) 5
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
The 8xOC-3/12/STM-1/4 circuit pack uses SFP optics for short reach,
intermediate reach, long reach, and CWDM applications or an STM-1e SFP
for intra-office applications. VT1.5/Low Order (LO) and STS-1/High Order
(HO) versions are available for 8xOC-3/12/STM-1/4 circuit packs
(NTK513DAE5 and NTK513MAE5).
Note: If the external synchronization mode is SDH-J and the use of the
64 kHz ESI or 6 MHz ESO ports is required, the following releases of the
cross-connect circuit packs are required:
- NTK557AA/BA: Release 08 or higher
- NTK557EAE5/GAE5: Release 01 or higher
- NTK557ES/GS: Release 01 or higher
- NTK557NA/PA/QA: Release 04 or higher
- NTK557TB: Release 01 or higher
- NTK557AA/BA: Release 05A, 06B
- NTK557NA/PA/QA: Release 02A
The 02A, 05A, and 06B releases are cross-connect circuit packs that have
been upgraded as a result of a return/repair operation.
Since the introduction of the SDH-J mode in 6500, only circuit packs
meeting the above criteria are being manufactured and shipped.
Figure 1-16
8xOC-3/12/STM-1/4 circuit pack faceplate
Fail
Ready
- Card not failed = LED off, Card failed = LED on
In Use
2 Tx
Rx
Blue diamond (In Use)
3 Tx
- Used to communicate whether circuit pack can be extracted
Rx (on->no pull, off->can be pulled)
4 Tx - Equipment in-service = LED on; Equipment out-of-service = LED off
Rx
5 Tx
Rx
8 Tx
Rx
Hazard
level: Transmit/receive SFP dual LC connector
or dual 1.0/2.3 mm coaxial connector
R99
EEEEE99999
S/N NT030MEE9999E
NTUD99EE
Type A
Figure 1-17
8xOC-3/12/STM-1/4 circuit pack block diagram (NTK513MAE5)
XC
SFP 1
SFP 2
SFP 3
SFP 4
5G SONET/SDH OHP
SFP 5
Backplane
SFP 6
SFP 7
XC
SFP 8
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-18
8xOC-3/12/STM-1/4 circuit pack block diagram (NTK513DAE5)
XC
SFP 1
SFP 2
SFP 3
SFP 4
5G SONET/SDH OHP
VT/TU processor
SFP 5
Backplane
SFP 6
SFP 7
XC SFP 8
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Supported functionality
The 8xOC-3/12/STM-1/4 circuit pack provides the following functionality.
• up to eight pluggable (SFP) 155M/622M interfaces (ports 1 to 8)
• OC-3/12 (SONET), STM-1/STM-4 (SDH), or STM-1J/4J (SDH-J) services
• per port selectable to OC-3/STM-1/STM-1J or OC-12/STM-4/STM-4J
• auto-detection of SFP modules, which are hot pluggable
• auto provisioning of facilities at OC-3/STM-1 or OC-12/STM-4 specific
SFPs
• manual provisioning of facilities at SFPs that support both OC-3/STM-1
and OC12/STM4 facility types. For example, since the IR-1/S1.1_S4.1
OC-3/12/STM-1/4 SFP supports both OC-3/STM-1 and OC12/STM4
facility types, the user must manually provision an OC-3/STM-1 or
OC-12/STM-4.
• terminates section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable (default is Off). Section/RS
DCC can be enabled on all ports, line/MS DCC can be enabled on any two
ports
• optical power input and output monitoring on all circuit pack types (optical
power is not applicable to STM-1e SFPs)
• selectable automatic laser shut off controlled by software. For STM-1e
SFPs, you must ensure that automatic laser shut off is disabled (see
Part 1 of Configuration - Provisioning and Operating, 323-1851-310).
• unprotected, 1+1/MSP linear, and UPSR/SNCP traffic protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports Control Plane (OC3/OC12/STM1/STM4 facility is only supported
as add/drop Control Plane facility and not Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.
Cross-connection types
The 8xOC-3/12/STM-1/4 circuit pack supports the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled
Cross-connection rates
The 8xOC-3/12/STM-1/4 circuit pack supports the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11, VT2/VC12, STS1/LO VC3
(VT1.5/LO circuit packs only)
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rates of STS3c and STS12c/VC4-4c for OC-12/STM-4
• auto concatenated rates of STS1/VC3 and STS3c/VC4
Supported SFPs
Table 1-16 provides a list of the SFPs that are supported on the
8xOC-3/12/STM-1/4 circuit pack.
Table 1-16
Supported SFP modules for the 8xOC-3/12/STM-1/4 circuit packs (NTK513DAE5 and
NTK513MAE5)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
P155M OC-3/STM-1 SR-0 (multimode) 1310 nm SFP NTTP02AD
— OC3/STM1/STM1J (auto), — OC-3/STM-1 (155.52Mb/s)
AD
OC-3/STM-1 SR1/I1 1310 nm SFP NTTP02BF
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 IR1/S1.1 1310 nm SFP NTTP02CD
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 LR1/L1.1 1310 nm SFP NTTP02ED
— OC-3/STM-1 (155.52Mb/s)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Performance monitoring
The 8xOC-3/12/STM-1/4 circuit pack supports the following monitored
entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-3/STM-1/STM-1J,
STM-1e, and OC-12/STM-4/STM-4J facilities
• PM collection for SONET path (P)/SDH path (P) for OC-3/STM-1/STM-1J
and OC-12/STM-4/STM-4J facilities
• PM collection for STS3c/VC4, and STS12c/VC4-4c concatenated
payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration, except for STM-1e
facilities
• Physical layer PM collection, except for STM-1e facilities
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Packet Rate Limit Exceeded
• Provisioning Incompatible
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable
• Loss Of Frame
• Lockout Active
• Loopback Active
• Protection Scheme Mismatch
• Protection Mode Mismatch
• Protection Switch Byte Fail
• Protection Channel Match Fail
• Protection Exerciser Failed
• Protection Switch Complete
• Protection Locked
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC Link Failure
• SECTION DCC OSPF Adjacency Loss
• Trace Identifier Mismatch
Path alarms (STS & VT)
• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer
• Loopback Active - Facility
• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)
Equipping rules
The following equipping rules apply to 8xOC-3/12/STM-1/4 circuit packs:
• is a single-slot eight-port interface.
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Technical specifications
Table 1-17 lists the weight, power consumption, and SFP specifications for
8xOC-3/12/STM-1/4 circuit packs.
Table 1-17
Technical specifications for 8xOC-3/12/STM-1/4 circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
8xOC-3/12/STM-1/4 STS-1/HO SFP NTK513MAE5 1.2 kg (2.6 lb) 27 27
8xOC-3/12/STM-1/4 VT1.5/LO SFP NTK513DAE5 1.2 kg (2.6 lb) 29 29
SFP specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
— “Electrical specifications”
Latency
Table 1-18 shows the latency specifications for 8xOC-3/12/STM-1/4 circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).
Table 1-18
Latency for 8xOC-3/12/STM-1/4 circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn→ XC→
XC OCn/STMn
8xOC-3/12/STM-1/4 STS-1/HO NTK513MAE5 5 5
8xOC-3/12/STM-1/4 VT1.5/LO SFP NTK513DAE5 5 (see Note 2) 5
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
Figure 1-19
16xOC-n/STM-n circuit pack faceplate
OC-n/STM-n
5G VT1.5/LO
16 Ports SFP
Red triangle (Fail)
1
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
2
Green rectangle (Ready)
- Used to communicate hardware or software functional state
3 T
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
R
4 T
7 T
R
Red/yellow bi-color circle (Fail/LOS)
8 T
R
- Used to communicate Rx Loss of Signal/optical module fail
- Red = module fail; Yellow = Rx Loss of Signal
9 T
10 T
11 T
R
Transmit/receive SFP dual LC connector
12 T
or dual 1.0/2.3 mm coaxial connector
R
13 T
14 T
Rz
15
16
NTK513FAE5
Type A
Figure 1-20
16xOC-n/STM-n circuit pack block diagram (NTK512FAE5)
XC
SFP 1
SFP 2
SFP 3
SFP 4
SFP 5
SFP 6
Backplane
SFP 7
5G SONET/SDH OHP
SFP 8
SFP 9
SFP 10
SFP 11
SFP 12
SFP 13
SFP 14
SFP 15
XC
SFP 16
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-21
16xOC-n/STM-n circuit pack block diagram (NTK513FAE5)
XC
SFP 1
SFP 2
SFP 3
SFP 4
SFP 5
SFP 6
Backplane
SFP 7
5G SONET/SDH OHP
with VT/TU processor SFP 8
SFP 9
SFP 10
SFP 11
SFP 12
SFP 13
SFP 14
SFP 15
XC
SFP 16
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-22
16xOC-n/STM-n circuit pack block diagram (NTK512GAE5)
XC
SFP 1
SFP 2
SFP 3
SFP 4
SFP 5
SFP 6
Backplane
SFP 7
10G SONET/SDH OHP
SFP 8
SFP 9
SFP 10
SFP 11
SFP 12
SFP 13
SFP 14
SFP 15
XC
SFP 16
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-23
16xOC-n/STM-n circuit pack block diagram (NTK513GAE5)
XC
SFP 1
SFP 2
SFP 3
SFP 4
SFP 5
SFP 6
Backplane
SFP 7
10G SONET/SDH OHP
with VT/TU processor SFP 8
SFP 9
SFP 10
SFP 11
SFP 12
SFP 13
SFP 14
SFP 15
XC
SFP 16
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Supported functionality
The 16xOC-n/STM-n circuit packs (NTK512FAE5 and NTK513FAE5,
NTK512GAE5 and NTK513GAE5) provide the following functionality.
• up to 16 pluggable (SFP) 155M/622M/2.5G interfaces (ports 1 to 16)
• support OC-3/OC-12 (SONET) and STM-1/STM-4 (SDH) services on
16xOC-n/STM-n 5G variant (NTK512FAE5 and NTK513FAE5).
STM1/STM4 facilities on 16xOC-n/STM-n 5G circuit packs also support
SDH-J port mode.
• support OC-3/OC-12/OC-48 (SONET) and STM-1/STM-4/STM-16 (SDH)
services on 16xOC-n/STM-n 10G variant (NTK512GAE5 and
NTK513GAE5). STM1/STM4 facilities on 16xOC-n/STM-n 10G circuit
packs do not support SDH-J port mode.
• There are some restrictions on how to fill up a 16xOC-n/STM-n 5G or
16xOC-n/STM-n 10G circuit pack (that is, blocking rules). You must see
“Provisioning rules summary for the 16xOC-n/STM-n circuit packs” on
page 1-119 for full details on port blocking rules for 16xOC-n/STM-n 5G
and 16xOC-n/STM-n 10G circuit packs.
• auto provisioning of facilities at OC-3/STM-1, OC-12/STM-4, or
OC-48/STM-16 specific SFPs
• manual provisioning of facilities at SFPs that support both OC-3/STM-1
and OC12/STM4 facility types. For example, since the IR-1/S1.1_S4.1
OC-3/12/STM-1/4 SFP supports both OC-3/STM-1 and OC12/STM4
facility types, the user must manually provision an OC-3/STM-1 or
OC-12/STM-4.
• terminate section/RS and line/MS overhead
— terminate section/RS and line/MS overhead bytes in Rx direction
— insert section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC is selectable (default is Off). In
16xOC-n/STM-n 5G variants (NTK512FAE5 and NTK513FAE5), line/MS
DCC can be enabled on any two ports. In 16xOC-n/STM-n 10G variants
(NTK512GAE5 and NTK513GAE5), line/MS DCC can be enabled on all
16 ports. Section/RS DCC can be enabled on all 16 ports.
• line/MS DCC for SONET/SDH Control Plane (only for OC48/STM16
facility)
• monitor optical power input and output on all circuit pack types (optical
power is not applicable to STM-1e SFPs)
• selectable automatic laser shut off controlled by software. For STM-1e
SFPs, you must ensure that automatic laser shut off is disabled (see
Procedure 1-6, “Editing facility parameters” on page 1-132).
Cross-connection types
The 16xOC-n/STM-n circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled
Cross-connection rates
The 16xOC-n/STM-n circuit packs support the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11 and VT2/VC12 (VT1.5/LO circuit
packs only)
• non-concatenated rates of LO_VC3, STS1/HO VC3, and VC4
• concatenated rates of
— STS3c/VC4 for OC-3/STM-1, OC-12/STM-4, and OC-48/STM-16
ports
— STS12c/VC4-4c for OC-12/STM-4 and OC-48/STM-16 ports
— STS24c/VC4-8c and STS48c/VC4-16c for OC-48/STM-16 ports
• auto concatenated rates as follows
— the 16xOC-n/STM-n 10G circuit packs (NTK512GAE5,
NTK513GAE5) support auto concatenated rates of STS1/VC3,
STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and
STS48c/VC4-16c for OC-48/STM-16 ports
Note: The 16xOC-n/STM-n (NTK512FAE5, NTK513FAE5,
NTK512GAE5, NTK513GAE5) circuit packs do not support auto
concatenated rates for connections on OC-3/STM-1 and OC-12/STM-4
ports.
Supported SFPs
Table 1-19 provides a list of the SFPs that are supported on the
16xOC-n/STM-n circuit pack.
Table 1-19
Supported SFP modules for the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5,
NTK512GAE5, and NTK513GAE5)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: On the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5, NTK512GAE5,
NTK513GAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is
set to On in the Node Information application.
Note 3: SDH-J is supported on the 5G version of 16xOC-n/STM-n circuit packs only (NTK512FAE5
and NTK513FAE5 variants).
Note 4: OC48/STM16 is supported on the 10G version of 16xOC-n/STM-n circuit packs only
(NTK512GAE5 and NTK513GAE5 variants).
Note 5: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “OC-48/STM-16
DWDM small form-factor (SFP) pluggable modules”, for the complete list of ordering codes.
Performance monitoring
The 16xOC-n/STM-n circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-3/STM-1 and
OC-12/STM-4 facilities
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-48/STM-16 facilities
(10G variants only)
• PM collection for STS1, STS3c/VC4 and STS12c/VC4-4c concatenated
payloads
• PM collection for STS24c/VC4-8c and STS48c/VC4-16c concatenated
payloads (10G variants only)
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable
• Lockout Active
• Loss Of Signal
• Loss Of Frame
• LINE DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• Loopback Active
• Manual Ring Switch Active
• Node Id Mismatch
• Protection Channel Match Fail
• Protection Default K-bytes
• Protection Exerciser Failed
• Protection Invalid K-bytes
• Protection Mode Mismatch
• Protection Scheme Mismatch
• Protection Switch Byte Fail
• Protection Switch Complete
• Protection Locked
• Ring Protection Switch Complete
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC Link Failure
• SECTION DCC OSPF Adjacency Loss
• Trace Identifier Mismatch
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Traffic Squelched
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F
• Test Access in Progress - Split EF
• Unequipped
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)
Equipping rules
The following equipping rules apply to 16xOC-n/STM-n circuit packs:
• is a single-slot 16-port interface.
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Technical specifications
Table 1-20 lists the weight, power consumption, and SFP specifications for
16xOC-n/STM-n circuit packs.
Table 1-20
Technical specifications for 16xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
16xOC-n/STM-n 5G STS-1/HO SFP NTK512FAE5 0.9 kg (1.9 lb) 27 29
16xOC-n/STM-n 5G VT1.5/LO SFP NTK513FAE5 0.9 kg (1.9 lb) 27 29
16xOC-n/STM-n 10G STS-1/HO SFP NTK512GAE5 0.9 kg (1.9 lb) 27 29
16xOC-n/STM-n 10G VT1.5/LO SFP NTK513GAE5 0.9 kg (1.9 lb) 27 29
SFP specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
— “Electrical specifications”
— “OC-48/STM-16 SFP and DPO optical specifications”
— “Multirate SFP optical specifications”
Latency
Table 1-21 shows the latency specifications for 16xOC-n/STM-n circuit packs.
For latency information about OC-n/STM-n, GbE (ETH) and FC-100/200/400
facilities using a SuperMux with XFP (NTK535FAE5) circuit pack, refer to
Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs, 323-1851-102.5
(Chapter 3).
Table 1-21
Latency for 16xOC-n/STM-n circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn→ XC→
XC OCn/STMn
16xOC-n/STM-n 5G STS-1/HO SFP NTK512FAE5 2 1
16xOC-n/STM-n 5G VT1.5/LO SFP NTK513FAE5 2 (see Note 2) 1
16xOC-n/STM-n 10G STS-1/HO SFP NTK512GAE5 2 1
16xOC-n/STM-n 10G VT1.5/LO SFP NTK513GAE5 2 (see Note 2) 1
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
Figure 1-24
(2+8)xOC-n/STM-n circuit pack faceplate
In Use
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
1 T Blue diamond (In Use)
R
- Used to communicate whether circuit pack can be extracted
1M
2 T
(on->no pull, off->can be pulled)
R - Equipment in-service = LED on; Equipment out-of-service = LED off
3 T
R Transmit/receive XFP dual LC connector
4 T
R
Red/yellow bi-color circle (Fail/LOS)
5 T
R
- Used to communicate Rx Loss of Signal/optical module fail
6 T - Red = module fail;
R
7 T
- Yellow = Rx Loss of Signal
R
8 T
R Transmit/receive SFP dual LC connector
9 T
R
10 T
R
Type A
Figure 1-25
(2+8)xOC-n/STM-n STS-1/VC-3 20G circuit pack block diagram (NTK521CAE5)
XC
XFP 1
XFP 2
SFP 3
SFP 4
Backplane
SFP 6
SFP 7
SFP 8
SFP 9
XC
SFP 10
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-26
(2+8)xOC-n/STM-n STS-1/VC-3 OTN 20G circuit pack block diagram (NTK521DAE5)
XC
SFP 3
SFP 4
Backplane
SFP 6
SFP 7
SFP 8
SFP 9
XC
SFP 10
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-27
(2+8)xOC-n/STM-n LO 20G circuit pack block diagram (NTK522CAE5)
XC
XFP 1
XFP 2
SFP 3
SFP 4
Backplane
SFP 6
SFP 7
SFP 8
SFP 9
XC
SFP 10
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Figure 1-28
(2+8)xOC-n/STM-n LO OTN 20G circuit pack block diagram (NTK522DAE5)
XC
SFP 3
SFP 4
Backplane
SFP 6
SFP 7
SFP 8
SFP 9
XC
SFP 10
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Supported functionality
The (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5,
NTK522CAE5, and NTK522DAE5) provide the following functionality.
• up to two pluggable (XFP) 10G interfaces (ports 1 and 2) and up to eight
pluggable (SFP) 2.5G interfaces (ports 3 to 10)
• support OC-48/OC-192 (SONET) and STM-16/STM-64 (SDH) services.
• There are some restrictions on how to fill up a (2+8)xOC-n/STM-n circuit
pack (that is, blocking rules). You must see “Provisioning rules summary
for the (2+8)xOC-n/STM-n 20G and OTN 20G circuit packs” on page
1-120 for full details on port blocking rules for (2+8)xOC-n/STM-n circuit
packs.
• automatic detection/provisioning of SFP and XFP modules, which are hot
pluggable.
• Line ports (10G OC-192/STM-64 line facility, ports 1 and 2, available on
non-OTN variant; NTK521CAE5 and NTK522CAE5) supports:
— section/RS DCC and line/MS DCC on OC-192/STM-64 line facility
Maximum eight section/RS DCC or line/MS DCC. Port 1 & port 3 and
port 2 & port 7 share the same section/RS DCC and line/MS DCC as
both port pairs cannot be provisioned at the same time. DCC channels
can be configured to support LAPD, PPP, or Transparency. Route
diversity can be provisioned on DCC ports
— line/MS DCC for SONET/SDH Control Plane (for OC192/STM64
facility)
• Line ports (OTM2 line facility, ports 1 and 2, only available on OTN variant;
NTK521DAE5 and NTK522DAE5) supports:
— Up to 175 km reach (when the OTM2 line port is equipped with the
DWDM XFPs such as NTK588xxE5 or NTK589xxE6 or less reach
when equipped with NTK583AAE6, NTK583AB, or NTK587xxE5
XFPs)
— FEC provisionable to Off, SCFEC and RS8 (Link budget support only
with SCFEC)
Note: RS8 FEC algorithm is also known as ITU-T G.709 RS-8.
SCFEC FEC algorithm is also known as ITU-T G.975 I.4.
— OTU TTI and ODU TTI (without SAPI/DAPI support), ODU-LCK signal
conditioning when port 1 is OOS
— GCC0 and GCC1 support
Maximum two GCCs (GCC 0/GCC1). GCC channels can be
configured to support LAPD or PPP.
• Client support via up to eight OC48/STM16 SFP optics in ports 3 to 10:
— SDCC and LDCC on OC-48/STM-16 client facilities
Maximum eight line/MS DCC and eight section/RS DCC
— DCC channels can be configured to support LAPD, PPP, or
Transparency
— line/MS DCC for SONET/SDH Control Plane (for OC48/STM16 facility)
— Route diversity can be provisioned on DCC ports
— OC48/STM16 Tx and Rx power monitoring
• Protection types supported:
— Unprotected
— 10G line-side protection using UPSR/SNCP or 1+1/MSP linear
line-side protection.
— 1+1/MSP linear and UPSR/SNCP client-side protection for
OC-48/STM-16 clients.
— 2-Fiber BLSR/MS-SPRing protection for OC-48/STM-16 and
OC192/STM64 facilities
— 4-Fiber BLSR/MS-SPRing/HERS protection for OC192/STM64
facilities
• Line timing synchronization support (provides the handover between the
line timing and the shelf)
• support SSM monitoring/generation
• monitor optical power input and output
• support Control Plane (OC48/STM16 facility or OC192/STM64 facility is
supported as both add/drop Control Plane facility and Network Control
Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.
Cross-connection types
The (2+8)xOC-n/STM-n circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled
Cross-connection rates
The (2+8)xOC-n/STM-n circuit packs support the following cross-connection
rates:
• non-concatenated rates of
— VT1.5/VC11, VT2/VC12, and STS1/LO VC3 ((LO variants
NTK522CAE5 and NTK522DAE5 only) for OC-48/STM-16 and
OC-192/STM-64 ports
— LO VC3, STS1/HO VC3 and VC4 for OC-48/STM-16 and
OC-192/STM-64 ports
• concatenated rates of
— STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and
STS48c/VC4-16c for OC-48//STM-16 and OC-192/STM-64 ports
— concatenated rate of STS-192c/VC-4-64c for OC-192/STM-64 ports
• auto concatenated rates of
— STS1/VC3, STS3c/VC4, STS12c/VC4-4c, and STS48c/VC4-16c for
OC-48/STM-16 and OC-192/STM-64 ports
— STS-192c/VC-4-64c for OC-192/STM-64 ports
Supported SFPs/XFPs
Table 1-22 provides a list of the SFPs that are supported on the
(2+8)xOC-n/STM-n circuit pack. Table 1-23 and Table 1-24 provide lists of the
XFPs that are supported on the (2+8)xOC-n/STM-n circuit pack.
Table 1-22
Supported SFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5,
NTK522CAE5, and NTK522DAE5)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: On the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is set
to On in the Node Information application.
Note 3: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “OC-48/STM-16
DWDM small form-factor (SFP) pluggable modules”, for the complete list of ordering codes.
Table 1-23
Supported XFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5 and NTK522CAE5
variants)
Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)
Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: On the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is set
to On in the Node Information application.
Note 3: OTM2 TX and OTM2 RX facilities represent the TX and RX portions of the OTM2 facility.
Note 4: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “Multirate
DWDM/CWDM pluggable optics modules (XFP)”, for the complete list of ordering codes.
Table 1-24
Supported XFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521DAE5 and NTK522DAE5
variants)
Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)
Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: OTM2 TX and OTM2 RX facilities represent the TX and RX portions of the OTM2 facility.
Note 3: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “Multirate
DWDM/CWDM pluggable optics modules (XFP)”, for the complete list of ordering codes.
Note 4: Refer to Planning - Ordering Information, 323-1851-151, Chapter 7: Table “Multirate DWDM
pluggable optics modules (XFP) (manufacture discontinued)”, for the complete list of ordering codes.
Performance monitoring
The (2+8)xOC-n/STM-n circuit packs support the following monitored entities:
• OC-192/STM-64 line interfaces (non-OTN variants only):
— PM collection of SONET section (S)/SDH regenerator section (RS),
SONET line (L)/SDH multiplex section (MS), and SONET path
(P)/SDH path (P) for OC-192/STM-64 facilities
— PM collection of protection switch count/duration
— Physical layer PM collection
• OTM2 line interfaces (OTN variants only):
— PM collection for OTN line
— PM collection for OTU layer for OTM2 NGM interfaces
— PM collection for ODU layer
— Protection switch count/duration for ODU layer
— Physical layer PM collection
• Client interfaces:
— PM collection of SONET section (S)/SDH regenerator section (RS),
SONET line (L)/SDH multiplex section (MS), and SONET path
(P)/SDH path (P) for OC-48/STM-16 facilities
— PM collection for STS1, STS3c/VC4 and STS12c/VC4-4,
STS24c/VC4-8c, STS48c/VC4-16c, and STS-192c/VC4-64c
concatenated payloads
— PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
STS1/HO VC3 and VC4 non-concatenated payloads
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)
Equipping rules
The following equipping rules apply to (2+8)xOC-n/STM-n circuit packs:
• is a single-slot 10-port interface
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Technical specifications
Table 1-25 lists the weight, power consumption, and SFP specifications for
(2+8)xOC-n/STM-n circuit packs.
Table 1-25
Technical specifications for (2+8)xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
OC-n/STM-n 20G STS-1/VC-3 2x NTK521CAE5 1.0 kg (2.2 lb) 42 45
XFP/8x SFP circuit pack
OC-n/STM-n OTN 20G STS-1/VC-3 NTK521DAE5 1.0 kg (2.2 lb) 52 60
2x XFP/8x SFP circuit pack
OC-n/STM-n 20G VT-1.5/LO 2x NTK522CAE5 1.0 kg (2.2 lb) 42 45
XFP/8x SFP circuit pack
Latency
Table 1-26 shows the latency specifications for (2+8)xOC-n/STM-n circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).
Table 1-26
Latency for (2+8)xOC-n/STM-n circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn/ XC→
OTM2→ XC OCn/STMn/
OTM2
OC-n/STM-n 20G STS-1/VC-3 2x XFP/8x SFP NTK521CAE5 2 1
OC-n/STM-n OTN 20G STS-1/VC-3 2x XFP/8x SFP NTK521DAE5 2 (see Note 2, 1 (see Note 3)
Note 4, Note 5)
OC-n/STM-n 20G VT-1.5/LO 2x XFP/8x SFP NTK522CAE5 2 (see Note 2) 1
OC-n/STM-n OTN 20G VT-1.5/LO 2x XFP/8x SFP NTK522DAE5 2 (see Note 4) 1 (see Note 3)
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path from
cross-connect. To calculate the end-to-end latency through the system, add the stated ingress latency,
the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the egress
latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
Note 3: This value applies to all facilities including the 10G interfaces when the facility is OC-192 or
STM-64. When a 10G interface is provisioned for OTM2, the XC to facility latency is 2 µs.
Note 4: For an OTM2 facility, the typical OTM2 to XC latency for STS-1, STS-Nc, LO_VC3 and HO paths
is as follows: OTM2 with FEC Off is 3 µs, OTM2 with RS8 FEC is 9 µs and OTM2 with SCFEC is 47 µs.
Note 5: For an OTM2 facility, the typical OTM2 to XC latency for STS-1, STS-Nc, LO_VC3 and HO paths
is as follows: OTM2 with FEC Off is 6 µs, OTM2 with RS8 FEC is 13 µs and OTM2 with SCFEC is 50 µs.
Note 1: If the external synchronization mode is SDH-J and the use of the
64 kHz ESI or 6 MHz ESO ports is required, the following releases of the
cross-connect circuit packs are required:
- NTK557AA/BA: Release 08 or higher
- NTK557EAE5/GAE5: Release 01 or higher
- NTK557ES/GS: Release 01 or higher
- NTK557NA/PA/QA: Release 04 or higher
- NTK557TB: Release 01 or higher
- NTK557AA/BA: Release 05A, 06B
- NTK557NA/PA/QA: Release 02A
The 02A, 05A, and 06B releases are cross-connect circuit packs that have
been upgraded as a result of a return/repair operation.
Since the introduction of the SDH-J mode in 6500, only circuit packs
meeting the above criteria are being manufactured and shipped.
Note 2: This LO circuit pack can achieve LO switching granularity
provided that the shelf in which they are equipped is equipped with
compatible cross-connect circuit packs. The LO circuit packs can achieve
LO_VC3 switching granularity on HO cross-connect circuit pack when
using the 240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+
STS-1/VC-3 (640/0G) (NTK610BBE5) cross-connect circuit packs.
Figure 1-29
8xOC-n/STM-n circuit pack faceplate
Figure 1-30
8xOC-n/STM-n circuit pack block diagram (NTK511AA)
XC
SFP 1
SFP 2
Backplane
SFP 3
5G SONET/SDH OHP
with VT/TU processor SFP 4
SFP 5
SFP 6
SFP 7
SFP 8
XC
Processor Power
Sync Supply
Module
Legends
OHP Overhead processor
Supported functionality
The 8xOC-n/STM-n circuit pack (NTK511AA) provides the following
functionality.
• up to eight pluggable (SFP) 155M/622M interfaces (ports 1 to 8)
• up to six pluggable (SFP) 51M interfaces (ports 2 to 4 and ports 6 to 8)
• OC-3/12 (SONET), STM-1/4 (SDH), or STM-0J/1J/4J (SDH-J) services
• auto-provisioning of facilities at STM-0J, OC-3/STM-1/STM-1J, or
OC-12/STM-4/STM-4J specific SFPs
• manual provisioning of facilities at SFPs that support both
OC-3/STM-1/STM-1J and OC12/STM4/STM4J facility types. For
example, since the IR-1/S1.1_S4.1 OC-3/12/STM-1/4 SFP supports both
OC-3/STM-1/STM-1J and OC12/STM4/STM4J facility types, the user
must manually provision an OC-3/STM-1/STM-1J or
OC-12/STM-4/STM4J.
• terminates section/RS and line/MS overhead
— terminate section/RS and line/MS overhead bytes in Rx direction
— insert section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC is selectable (default is Off). Section/RS
DCC can be enabled on all eight ports. Line/MS DCC can be enabled on
all eight ports.
• monitor optical power input and output on all circuit pack types (optical
power is not applicable to STM-1e SFPs)
• selectable automatic laser shut off controlled by software. For STM-1e
SFPs, you must ensure that automatic laser shut off is disabled (see
Procedure 1-6, “Editing facility parameters” on page 1-132).
• automatic detection/provisioning of SFP modules, which are hot
pluggable.
• unprotected, 1+1/MSP linear, and UPSR/SNCP traffic protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports SSM monitoring/generation
• 8xOC-n/STM-n circuit packs support DSM when equipped with
OC-3/STM-1 SFPs.
• Control Plane (OCn/STMn facility is only supported as add/drop Control
Plane facility and not Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.
Cross-connection types
The 8xOC-n/STM-n circuit pack supports the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
Cross-connection rates
The 8xOC-n/STM-n circuit pack supports the following cross-connection
rates:
• non-concatenated rates of STS1/AU3-mapped VC3, AU4-mapped VC3,
VT1.5/VC11, or VT2/VC12
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rates of STS3c/VC4 for OC-3/STM-1 and OC-12/STM-4
ports
• concatenated rates of STS12c/VC4-4c for OC-12/STM-4 ports
Supported SFPs
Table 1-27 provides a list of the SFPs that are supported on the
8xOC-n/STM-n circuit pack.
Table 1-27
Supported SFP modules for the 8xOC-n/STM-n circuit pack NTK511AA)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: STM0J is supported on PSFP pluggables that support the STM0J facility on ports 2 to 4 and
ports 6 to 8 of the 8xOC-n/STM-n circuit packs only.
Performance monitoring
The 8xOC-n/STM-n circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-1/STM-0/STM-0J,
OC-3/STM-1/STM-1J, and OC-12/STM-4/STM-4J facilities
• PM collection for SONET path (P)/SDH path (P) for OC-1/STM-0/STM-0J,
OC-3/STM-1/STM-1J, and OC-12/STM-4/STM-4J facilities
• PM collection for STS1, STS3c/VC4, and STS12c/VC4-4c concatenated
payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3, STS1/HO VC3, and VC4
non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection facilities
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Packet Rate Limit Exceeded
• Provisioning Incompatible
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable
Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)
Equipping rules
The following equipping rules apply to 8xOC-n/STM-n circuit pack:
• is a single-slot 8-port interface.
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Technical specifications
Table 1-28 lists the weight, power consumption, and SFP specifications for
8xOC-n/STM-n circuit packs.
Table 1-28
Technical specifications for 8xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
8xOC-n/STM-n 5G VT1.5/LO SFP NTK511AA 0.9 kg (1.9 lb) 25 27
SFP specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
— “Multirate SFP optical specifications”
Latency
Table 1-29 shows the latency specifications for 8xOC-n/STM-n circuit packs.
For latency information about OC-n/STM-n, GbE (ETH) and FC-100/200/400
facilities using a SuperMux with XFP (NTK535FAE5) circuit pack, refer to
Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs, 323-1851-102.5
(Chapter 3).
Table 1-29
Latency for 8xOC-n/STM-n circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn/ XC→
STMnJ→ OCn/STMn/
XC STMnJ
8xOC-n/STM-n 5G VT1.5/LO SFP NTK511AA 2 1
(see Note 2)
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, and LO_VC3 paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
1xOC-192/STM-64
Install 1xOC192/STM64
circuit pack(s) Note 1: To use the photonic layer, make sure the photonic
layer is provisioned. Refer to "Photonic circuit packs
Procedure 1-1 provisioning procedures" in Photonics Equipment,
323-1851-102.6.
Fiber line side ports
Note 2: The 1xOC192/STM64 circuit pack requires the
Procedures 1-3 & 1-4 cross-connect circuit packs be equipped to auto-provision.
Note 3: For control plane provisioning procedures, refer to
Edit the 10G facility
to out-of-service Configuration - Control Plane, 323-1851-330.
Procedure 1-11
Procedure 1-6
Procedure 1-11
Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No
End
Procedure
2xOC-48/STM-16
Install the 2xOC-48/STM-16 Note 1: The 2xOC-48/STM-16 circuit pack requires the
circuit pack(s) and SFP(s)
cross-connect circuit packs be equipped to auto-provision.
Procedures 1-1 & 1-2
Note 2: For control plane provisioning procedures, refer to
Configuration - Control Plane, 323-1851-330.
Fiber line side SFP(s)
Procedures 1-3 & 1-4
Procedure 1-11
Procedure 1-6
Procedure 1-11
Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No
End
Procedure
Install 8xOC-n/STM-n
circuit pack(s) and SFP(s) Note 1: The 8xOC-3/12/STM-1/4 circuit pack requires the
cross-connect circuit packs be equipped to auto-provision.
Procedures 1-1 & 1-2
Note 2: For control plane provisioning procedures, refer to
Fiber line side SFP(s) Configuration - Control Plane, 323-1851-330.
Procedures 1-3 & 1-4
Add the desired optical
Is the SFP Yes facility to the SFP(s)
multirate?
Procedure 1-5
No
Procedure 1-11
Procedure 1-6
Change protection
1+1 scheme to 1+1
Line side protection?
Procedure 1-7
Unprotected/UPSR
Procedure 1-11
Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No
End
Procedure
16xOC-n/STM-n
Install 16xOC-n/STM-n
circuit pack(s) and SFP(s) Note 1: The 16xOC-n/STM-n circuit pack requires the
cross-connect circuit packs be equipped to auto-provision.
Procedures 1-1 & 1-2
Note 2: For control plane provisioning procedures, refer to
Fiber line side SFP(s) Configuration - Control Plane, 323-1851-330.
Procedure 1-11
Procedure 1-6
Procedure 1-11
Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No
End
Procedure
(2+8)xOC-n/STM-n
No Procedure 1-5
Edit the optical
facility to out-of-service
Procedure 1-11
Procedure 1-6
Procedure 1-11
Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No
No
End
Procedure
Provisioning rules summary for the (2+8)xOC-n/STM-n 20G and OTN 20G
circuit packs
• This circuit pack is supported in 10G and 20G slots only.
• Only 10G XFP (ports 1 and 2) and 2.5G SFP (ports 3 to 10) are supported.
• In a 10G slot:
— Facility provisioning on port 2 and ports 7 to 10 are blocked.
— You can provision either one 10G XFP on port 1 or four 2.5G SFP on
ports 3 to 6.
— If port 1 is provisioned, then ports 3 to 6 are blocked. If one of ports 3
to 6 is provisioned, then port 1 is blocked.
— You can have up to 1xOC192/STM64 or 4xOC48/STM16 facilities in
one 10G slot.
• In a 20G slot:
— You can provision either one 10G XFP on port 1 or four 2.5G SFP on
ports 3 to 6.
— If port 1 is provisioned, then ports 3 to 6 are blocked. If one of ports 3
to 6 is provisioned, then port 1 is blocked.
— You can provision either one 10G XFP on port 2 or four 2.5G SFP on
ports 7 to 10.
— If port 2 is provisioned, then ports 7 to 10 are blocked. If one of ports
7 to 10 is provisioned, then port 2 is blocked.
— Ports 1 and 2 can be provisioned at the same time.
— Ports 1 and 7 to 10 can be provisioned at the same time.
— Ports 2 and 3 to 6 can be provisioned at the same time.
— Ports 3 to 6 and 7 to 10 can be provisioned at the same time.
— You can have up to 2xOC192/STM64, 2xOTM2,
1xOC192+4xOC48/STM16, 1xOTM2+4xOC48/STM16, or
8xOC48/STM16 facilities in one 20G slot.
Table 1-30
Procedures in this chapter
Topic Page
Procedure 1-3, Routing fiber-optic cables and STM-1e coaxial cables onto the 6500 shelf 1-126
Procedure 1-4, Connecting or disconnecting fiber-optic cables to or from circuit packs 1-127
Procedure 1-7, Changing the protection scheme for a pair of facilities 1-133
Procedure 1-12, Changing the primary state of a circuit pack or pluggable 1-152
Procedure 1-1
Provisioning a circuit pack automatically
If automatic equipping is enabled, an OC-n/STM-n circuit pack and any
pluggables present are automatically provisioned when the circuit pack is
inserted in the shelf. Facilities may or may not auto-provision, depending on
the circuit pack and pluggable type. See Table 1-31 on page 1-129 for facilities
that auto-provision and facilities that must be manually provisioned.
See the “Equipping rules” section for supported slots for 1xOC-192/STM-64,
2xOC-48/STM-16, 8xOC-3/12/STM-1/4, 16xOC-n/STM-n, 8xOC-n/STM-n,
and (2+8)xOC-n/STM-n circuit packs.
CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.
CAUTION
Risk of autoprovisioning failure
Make sure that you install the shelf processor first, then the
cross-connect circuit packs. Insert circuit packs in the correct
order to ensure autoprovisioning of circuit packs.
CAUTION
Risk of circuit pack damage
Do not force a circuit pack all the way to the back of its slot if it
resists insertion. Before installing a circuit pack, make sure
you know the detailed procedure for inserting the circuit packs.
CAUTION
Risk of incorrect installation
Make sure that the circuit pack lock/eject latches are locked in
position. If the lock covers are not locked, the latch sensors on
the circuit pack do not allow the shelf to identify the circuit
pack, and do not allow the circuit pack to autoprovision.
Prerequisites
• To provision equipment for an empty equipment slot, ensure the last
equipment that occupied the slot and its related facilities and
cross-connects have been deleted.
• Ensure the plastic pin protector on the circuit pack has been removed.
• Ensure automatic equipping is enabled.
Step Action
Procedure 1-2
Provisioning a pluggable automatically
When automatic equipping is enabled, a pluggable is automatically
provisioned when the pluggable is inserted into the circuit pack port. Facilities
may or may not auto-provision, depending on the circuit pack and pluggable
type. See Table 1-31 on page 1-129 for facilities that auto-provision and
facilities that must be manually provisioned.
CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.
Prerequisites
• Ensure the last pluggable that occupied the circuit pack port and its related
facilities and cross-connects have been deleted.
• Ensure the plastic pluggable port protector has been removed.
• Ensure automatic equipping is enabled.
Step Action
Procedure 1-3
Routing fiber-optic cables and STM-1e coaxial cables
onto the 6500 shelf
Refer to the procedure on routing fiber-optical cables, and electrical cables, as
applicable, onto the 6500 shelf, in the Installation technical publication specific
to the respective 6500 shelf type.
—end—
Procedure 1-4
Connecting or disconnecting fiber-optic cables to or
from circuit packs
Refer to the procedure on connecting or disconnecting fiber-optic cables to or
from circuit packs, in the Installation technical publication specific to the
respective 6500 shelf type.
—end—
Procedure 1-5
Adding a facility to an equipment
Use this procedure to:
• add a facility that was manually deleted
• add a facility for a pluggable on which the facility is not auto-created
See Table 1-31 on page 1-129 for facilities that auto-provision and facilities
that must be manually provisioned.
Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.
Step Action
Table 1-31
Facilities supported on OC-n/STM-n circuit packs (Note 1)
Circuit pack Facilities on the circuit Pluggable Facilities on the pluggable (Note 2)
(Equipment) pack equipment
• P155622M • OC3/OC12/STM1/STM4/STM1J
/STM4J, AD
• PCWDMS • OC3/OC12/STM1/STM4/STM1J
/STM4J, AD
Circuit pack Facilities on the circuit Pluggable Facilities on the pluggable (Note 2)
(Equipment) pack equipment
• PXFP • OC192/STM64, AD
• OTM2 (OC192/STM64) (Note 3),
AD
Circuit pack Facilities on the circuit Pluggable Facilities on the pluggable (Note 2)
(Equipment) pack equipment
Note 1: Refer to Table 1-12 on page 1-40, Table 1-13 on page 1-41, Table 1-16 on page 1-53, Table
1-19 on page 1-69, Table 1-22 on page 1-88, Table 1-23 on page 1-88, Table 1-24 on page 1-90 and
Table 1-27 on page 1-105 for supported pluggable modules for 2xOC-48/STM-16, 8xOC-3/12/STM-1/4,
16xOC-n/STM-n, and (2+8)xOC-n/STM-n circuit packs.
Note 2: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 3: OTM2 TX and OTM2 RX facilities represent the TX and RX portions of the OTM2 facility.
Note 4: 160-9016-900 supports STM0J only. 160-9014-900 and 160-9015-900 do not support
OC12/STM4.
Note 5: STM0J is supported on PSFP pluggables that support the STM0J facility on ports 2 to 4 and
ports 6 to 8 of the 8xOC-n/STM-n circuit packs only.
Note 6: OC48/STM16 is supported on the 10G version of 16xOC-n/STM-n circuit packs only.
Note 7: SDH-J is supported on the 5G version of 16xOC-n/STM-n circuit packs and on the
8xOC-n/STM-n circuit packs only.
Note 8: 10G XFPs (P10GSEL, P10GSOEL, and PXFP) are supported on ports 1 and 2. 2.5G SFPs
(PCWDMS and P2G5) are supported on ports 3 to 10. The OTM2 facility is supported on the OTN
capable variant only.
Note 9: P10GSEL pluggables are supported in NTK521CAE5 and NTK522CAE5 variants only.
Note 10: On the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5, NTK512GAE5,
NTK513GAE5) and (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is set
to On in the Node Information application.
Procedure 1-6
Editing facility parameters
Use this procedure to edit the facility parameters for a facility.
CAUTION
Risk of traffic loss
Editing some OTM2 parameters can affect traffic if the facility
is in-service.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
Procedure 1-7
Changing the protection scheme for a pair of facilities
Use this procedure to change the protection scheme for a pair of OCn/STMn
facilities from:
• 1+1/MSP linear to unprotected
• unprotected to 1+1/MSP linear
• unprotected to 2-Fiber BLSR/MS-SPRing
• 2-Fiber BLSR/MS-SPRing to unprotected
• unprotected to 4-Fiber BLSR/MS-SPRing/HERS
• 4-Fiber BLSR/MS-SPRing/HERS to unprotected
CAUTION
Risk of traffic loss
Changing the protection scheme is a service impacting
procedure.
Prerequisites
To perform this procedure, you must:
• ensure you have all the documentation relating to editing and deleting
cross-connects, editing a BLSR/MS-SPRing configuration, and changing
a facility state. Refer to the “Editing a path connection”, “Deleting path
connection”, and “Editing a BLSR/MS-SPRing/HERS ring map”
procedures in Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320 and Procedure 1-11, “Changing the primary state of a
facility” on page 1-150.
• use an account with a level 3 or higher UPC
Step Action
3
CAUTION
Risk of traffic loss
Ensure cross-connects are not carrying traffic before
you delete them. Deleting a cross-connect that is
carrying traffic causes traffic loss.
Step Action
4
CAUTION
Risk of traffic loss
If you place a facility out-of-service, you can cause a
loss of traffic.
Change the even slot facility in 1+1 protection to the out-of-service state. See
Procedure 1-11, “Changing the primary state of a facility” on page 1-150.
Go to step 9.
5
CAUTION
Risk of traffic loss
Ensure cross-connects are not carrying traffic before
you delete them. Deleting a cross-connect that is
carrying traffic causes traffic loss.
Step Action
8
CAUTION
Risk of traffic loss
If you place a facility out-of-service, you can cause a
loss of traffic.
Step Action
Procedure 1-8
Creating ring configurations
Use this procedure to create configurations for BLSR/MS-SPRing/HERS rings
for the following circuit packs:
• 1xOC-192/STM-64
• 2xOC-48/STM-16
• 16xOC-n/STM-n (OC48/STM16 facilities)
• (2+8)xOC-n/STM-n
You can save the configurations as ring configuration files to provide a starting
point or template for creating additional ring configurations. Refer to “Ring
APS configuration editor parameters” on page 1-183 for details on ring
parameters.
Step Action
1 Select Ring APS Configuration Editor from the Tools menu to open the
Ring APS Configuration Editor application.
The Ring APS Configuration Editor application opens with no data if a
configuration file has not been previously opened with this session of Site
Manager. Otherwise, the latest configuration file will be displayed.
2 Type the name of the new ring in the Ring name field.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
3 Select the ring type of the new ring from the Ring type drop-down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
4 Click on the Add Node tool icon. (Once at least one node has been created,
you can also double click on the Add diamond, the diamond shaped icon on
the facility connecting line directly under the center of the node graphic.)
The Add Node dialog box appears.
5 Select the node type of the new ring from the Node type drop-down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Step Action
6 Type a node identifier in the Node field or select a node from the drop-down
list. The drop-down list displays all nodes Site Manager is currently logged in
to that have at least one pair of facilities that are BLSR/MS-SPRing/HERS
protected. You can type in any other node identifier, whether or not the node
is known to Site Manager.
When a node is selected from the Node drop down list, the entries in the
facility drop-down list(s) are updated. You should first define the node, then
the facilities, otherwise the user provided facility data is replaced whenever a
new node is selected. However, the facility entries are not affected if you type
the node name instead of selecting it from the drop down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
7 Type an APS identifier in the APS ID field or select an APS identifier from the
drop-down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
8 If in step 3 you selected the Ring type as Then go to
2 Fiber step 9
4 Fiber step 11
9 Type a facility identifier in the East facility linked to: Next node field or select
a facility from the drop-down list. The drop-down list displays all facilities Site
Manager knows to be an East facility (that is, a BLSR/MS-SPRing working
member of a 2-fiber group) and are associated with the node selected in the
Node field. You can type in any other facility identifier, whether or not it is
known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: “Next node” in the East facility linked to: Next node field changes to
the node name (for example, 6500-1, 6500-2, etc.) after the first node has
been entered. For example; East facility <facility-shelf-slot-port> linked to:
West of 6500-1. If the node is not the first node and the neighbor has no node
name or TID assigned to it but has an APS ID, the label appears as: East
facility <facility-shelf-slot-port> linked to: West of node with APSID<#>.
When you select a value in one of the facility drop-down lists, the other list
automatically adjusts to show the protection group mate facility. If you modify
both facilities, the automatic selection of the mate is disabled, but becomes
re-enabled if you select another node.
When you add the node information to the Nodes area, this facility appears
on right side of node and connects the node to the node below it in the Nodes
area. The last node in the Nodes area is connected to the first node.
Step Action
10 Type a facility identifier in the West facility linked to: Previous node field or
select a facility from the drop-down list. The drop-down list displays all
facilities Site Manager knows to be a West facility (that is, a
BLSR/MS-SPRing protection member of the 2-fiber group) and are
associated with the node selected in the Node field. You can type in any other
facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Previous node” in the West facility linked to: Previous node
field changes to the node name (for example, 6500-1, 6500-2, etc.) after the
first node has been entered. For example, West facility
<facility-shelf-slot-port> linked to: East of 6500-2. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label appears as: West facility <facility-shelf-slot-port> linked to: East
of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on left side of node and connects the node to the node above it in the Nodes
area. The first node in the Nodes area is connected to the last node.
Go to step 15.
11 Type a facility identifier in the Working east facility linked to: Next node
field or select a facility from the drop-down list. The drop-down list displays all
facilities Site Manager knows to be a Working east facility (that is, a
BLSR/MS-SPRing/HERS working member on the east side of a 4-fiber
group) and are associated with the node selected in the Node field. You can
type in any other facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Next node” in the Working east facility linked to: Next node
field changes to node name (for example, 6500-1, 6500-2, etc.) after the first
node has been entered. For example; Working east facility
<facility-shelf-slot-port> linked to: West of 6500-1. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label appears as: Working east facility <facility-shelf-slot-port> linked
to: West of node with APSID<#>.
When you select a value in one of the facility drop-down lists, the other lists
automatically adjust to show the available facilities.
When you add the node information to the Nodes area, this facility appears
on right side of node and connects the node to the node below it in the Nodes
area. The last node in the Nodes area is connected to the first node.
Step Action
12 Type a facility identifier in the Protection east facility linked to: Next node
field or select a facility from the drop-down list. The drop-down list displays all
facilities Site Manager knows to be a Protection east facility (that is, a
BLSR/MS-SPRing/HERS protection member on the east side of a 4-fiber
group) and are associated with the node selected in the Node field. You can
type in any other facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Next node” in the Protection east facility linked to: Next node
field changes to node name (for example, 6500-1, 6500-2, etc.) after the first
node has been entered. For example; Protection east facility
<facility-shelf-slot-port> linked to: West of 6500-2. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label appears as: Protection east facility <facility-shelf-slot-port> linked
to: West of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on right side of node and connects the node to the node below it in the Nodes
area. The last node in the Nodes area is connected to the first node.
13 Type a facility identifier in the Working west facility linked to: Previous
node field or select a facility from the drop-down list. The drop-down list
displays all facilities Site Manager knows to be a Working west facility (that is,
a BLSR/MS-SPRing/HERS working member on the west side of a 4-fiber
group) and are associated with the node selected in the Node field. You can
type in any other facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Previous node” in the Working west facility linked to: Previous
node field changes to node name (for example, 6500-1, 6500-2, etc.) after
the first node has been entered. For example, Working west facility
<facility-shelf-slot-port> linked to: East of 6500-1. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label will appear as: Working west facility <facility-shelf-slot-port>
linked to: East of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on left side of node and connects the node to the node above it in the Nodes
area. The first node in the Nodes area is connected to the last node.
Step Action
14 Type a facility identifier in the Protection west facility linked to: Previous
node field or select a facility from the drop-down list. The drop-down list
displays all facilities Site Manager knows to be a Protection west facility (that
is, a BLSR/MS-SPRing/HERS protection member on the west side of a
4-fiber group) and are associated with the node selected in the Node field.
You can type in any other facility identifier, whether or not it is known to Site
Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Previous node” in the Protection west facility linked to:
Previous node field changes to node name (for example, 6500-1, 6500-2,
etc.) after the first node has been entered. For example; Protection west
facility <facility-shelf-slot-port> linked to: East of 6500-2. If the node is not
the first node and the neighbor has no name or TID assigned to it but has an
APS ID, the label appears as: Protection west facility
<facility-shelf-slot-port> linked to: East of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on left side of node and connects the node to the node above it in the Nodes
area. The first node in the Nodes area is connected to the last node.
15 If you want to use the Add Node dialog box information Then go to
to add a new node to the configuration, and want to
add more nodes step 16
close the dialog step 18
16 Click on Apply.
The node appears in the Nodes area of the Ring APS Configuration Editor
application and the Add Node dialog box remains open.
17 If you want to add another node, return to step 6. Otherwise, go to step 18.
18 Click OK.
The Add Node dialog box closes, and the node appears in the Nodes area
of the Ring APS Configuration Editor application.
19 Save the configuration as described in the "Saving a ring configuration file"
procedure in Chapter 1 in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320.
20 Apply the configuration information to a node or nodes. Refer to the “Applying
ring configuration files to nodes” procedure in Chapter 1 in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
—end—
Procedure 1-9
Adding a new entry in the communications settings
Use this procedure to add a new entry (interface, circuit, router) in the
communications settings. For more information on these parameters and how
they apply to the DCN, refer to Part 4 of Planning, NTRN10DP.
Prerequisites
To perform this procedure, you must use an account with a level 3 UPC or
higher.
Step Action
Step Action
8 If Then
the dialog allows more than one entry to be click Apply, go
added and you want to add another entry to step 7
otherwise go to step 9
9 Click OK.
—end—
Procedure 1-10
Adding a path connection
Use this procedure to add a 1WAY, 1WAYPR, 2WAY, 2WAYPR, or 2WAYDPR
path connection to a network element for the following circuit packs:
• 1xOC-192/STM-64
• 2xOC-48/STM-16
• 8xOC-3/12/STM-1/4
• 16xOC-n/STM-n
• (2+8)xOC-n/STM-n protection channels of a 4-Fiber
BLSR/MS-SPRing/HERS
Note: This is a generic procedure to enter a path connection for the circuit
packs listed above. For detailed information on each connection type,
recommendations for use of connection types to support a particular
network configuration, and example networks, refer to "Path connections
management" in Chapter 3 in Part 1 of Configuration - Bandwidth and
Data Services, 323-1851-320.
Note: Immediately following SLAT and during the initial launch of the Path
Connections application in Site Manager, the Path Connections
application does not allow the creation of STS192c/STM64c path
connections. If you attempt to do so, a "No facilities found on the NE" error
message appears. You must acknowledge the error message and in order
to create STS192c/STM64c path connections, you must manually refresh
the Equipment & Facility Provisioning application in Site Manager.
Subsequent launches of the Path Connections application in Site
Manager allow you to create STS-192c/STM-64c path connections
without the need to manually refresh the Equipment & Facility
Provisioning application in Site Manager. Alternative to manually refresh
the Equipment & Facility Provisioning application in Site Manager and
after performing SLAT, you can logout and then log back into the same Site
Manager session to resolve the issue.
Prerequisites
To perform this procedure, you must:
• use an account with a level 3 or higher UPC
• have met all specific requirements for bandwidth management for path
connections in a BLSR/MS-SPRing/HERS configuration. Refer to the
"BLSR/MS-SPRing/HERS configuration requirements” section in
Chapter 3 in Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320.
• have met all specific requirements for bandwidth management for path
connections in a UPSR/SNCP ring configuration. Refer to the
“UPSR/SNCP ring requirements” section in Chapter 3 in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
Step Action
Step Action
Step Action
13 If Then go to
you want to create the connection on BLSR/MS-SPRing step 14
endpoints
the connection you are adding is to be carried as extra traffic on step 15
the protection channels of a 2-Fiber BLSR/MS-SPRing
the connection you are adding is to be carried as extra traffic on step 18
the protection channels of a 4-Fiber BLSR/MS-SPRing/HERS
otherwise step 18
14 If you Then
want to create a VT/VC access 2-Fiber check the VT
BLSR/MS-SPRing connection at the pass-through Access checkbox
node but you have not selected a VT/VC rate in step and go to step 18
7 (for example, you selected a STS/VC4 rate in step
7)
otherwise go to step 17
Note: For more information about the VT/VC accessed BLSR/MS-SPRing
feature, refer to the “VT/VC-accessed BLSR/MS-SPRing” section in
Chapter 3 of Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320.
15 Select the Extra Traffic check box in the From and To panels, as required.
16 Select the required protection channel(s) from the payload parameters
drop-down lists.
Go to step 18.
17 Select the End NE A and End NE Z node from the APSIDs in the drop-down
lists in the BLSR/MS-SPRing Endpoints panel.
Note: These fields are available only if ENUT or Extra Traffic is not selected.
18 If you Then click
provision additional connections Apply
enter this connection and return to the main OK (Apply & Close)
connection screen
If you are adding a single path connection, the path connection is added. If
the path connection cannot be added, an error message appears.
If you are adding multiple path connections, the Multiple Cross Connect
Add Confirmation dialog box appears. Check that the multiple path
connections are correct, then click Yes. If the path connections cannot be
added, an error message appears.
Step Action
Procedure 1-11
Changing the primary state of a facility
Use this procedure to change the primary state of a facility.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a loss of
traffic.
Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.
Step Action
Step Action
9 Click OK.
10 If changing the primary state to OOS, click Yes in the warning dialog box.
—end—
Procedure 1-12
Changing the primary state of a circuit pack or
pluggable
Use this procedure to change the primary state of a circuit pack or pluggable
to in-service or out-of-service.
You must change the primary state of any related facilities to out-of-service
before changing the primary state of a circuit pack or pluggable to
out-of-service, see Procedure 1-11, “Changing the primary state of a facility”
on page 1-150.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step Action
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.
Step Action
Procedure 1-13
Deleting a facility from an equipment
Use this procedure to delete a facility.
CAUTION
Risk of service interruption
If you delete a facility, you can cause a loss of traffic.
Prerequisites
To perform this procedure, you must
• ensure the end-to-end service to be deleted is not carrying traffic
• ensure the facility to be deleted is out-of-service and is not in maintenance
state
• delete the sub-network connection if provisioned on this facility. Refer to
the “Deleting a sub-network connection” procedure in Configuration -
Control Plane, 323-1851-330.
• delete the connections of the entire path. Refer to the “Deleting path
connections” procedure in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320.
• delete the IISIS circuit or OSPF circuit and then the GCC or DCC if
provisioned on the facility to be deleted. Refer to the “Deleting an entry in
the communications settings” procedure in Part 1 of Configuration -
Provisioning and Operating, 323-1851-310.
• delete the timing reference if it is provisioned on the facility to be deleted.
Refer to the “Provisioning the network element timing mode and
references” procedure in Part 2 of Configuration - Provisioning and
Operating, 323-1851-310.
• ensure that the protection switching scheme on the facility to be deleted is
provisioned as unprotected. See Procedure 1-7, “Changing the protection
scheme for a pair of facilities” on page 1-133.
• ensure that no loopback exists on the facility. Refer to the
“Operating/releasing a loopback” procedure in Part 1 of Configuration -
Provisioning and Operating, 323-1851-310, to release a loopback if it
exists.
Step Action
Procedure 1-14
Deleting a circuit pack or pluggable
Use this procedure to delete a circuit pack or pluggable equipment from the
list of provisioned equipment in the Equipment and Facility Provisioning
application. Deleting a circuit pack automatically deletes any provisioned
pluggables on that circuit pack.
Prerequisites
To perform this procedure, you must
• use an account with a level 3 or higher UPC
• delete all connections provisioned through the equipment,
Refer to the “Deleting path connections” procedure in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320 on how to
delete a nodal connection.
• delete all facilities on the circuit pack or pluggable. See Procedure 1-13,
“Deleting a facility from an equipment” on page 1-154.
• put the circuit pack or pluggable to be deleted out-of-service. See
Procedure 1-12, “Changing the primary state of a circuit pack or
pluggable” on page 1-152.
Step Action
Table 1-32
Equipment and facility primary states
Primary State Description
IS In-service; no failure detected
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is partial failure)
OOS-AU Out-of-service - autonomous; failure detected
OOS-MA Out-of-service - maintenance; no failure detected (OOS for maintenance
for provisioning memory administration)
OOS-AUMA Out-of-service - autonomous - maintenance; failure detected
OOS-MAANR Out-of-service - maintenance - abnormal; partial failure detected
Table 1-33
Equipment secondary states
Table 1-34
Facility secondary states
Secondary State Description
<null> Active, working state for UPSR/SNCP facility.
Working receiver Active OCn/STMn facility in the specified direction
Working transmitter
Protected Optical line in a BLSR/MS-SPRing protection scheme is protected
Hot standby Inactive facility in both directions (Hot standby)
Protection switch Protection switch inhibited. Lockout command issued on a line OCn/STMn.
inhibited
Disconnected Facility has no connections established.
Fault detected Facility failure detected
Supporting entity Supporting equipment (circuit pack):
outage • has a failure, or
• is missing, or
• is mismatched, or
• has an associated connection which is failed.
Loopback active Loopback (facility, terminal, or EFM remote) active on facility
Test The facility acts as a test access port if “Test” is selected. For more information
about test access, refer to the “Test access and connection loopback provisioning”
chapter in Part 2 of Configuration - Provisioning and Operating, 323-1851-310.
Applicable to STM0J, OC3/STM1/STM1J and OC12/STM4/STM4J facilities only.
Maintenance State Maintenance State is enabled. When in Maintenance State, a facility continues to
carry traffic if it can, but does not raise alarms, SNMP traps or Performance
Monitoring Threshold Crossing Alerts (PM TCAs).
Applies to facilities that support maintenance state. See Table 1-36 on page 1-159.
Maintenance state is applicable to these facilities only if they are in out-of-service
state.
Auto in-service AINS is enabled. Applies to facilities that support AINS. See Table 1-35 on page
1-159.
Table 1-35
Facilities that support Automatic In-Service (AINS)
Table 1-36
Facilities that support maintenance state
Facility parameters
OCn/STMn/STM0J/STM1J/STM4J facility parameters
Table 1-37
OCn/STMn/STM0J/STM1J/STM4J facility parameters
Unit facility-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility. Read-only.
Primary state See “Equipment and Sets the primary state of the facility. Default reflects primary
facility primary state of associated equipment.
states” on page Note: IS and OOS are selectable.
1-157
Secondary See “Facility Displays the facility operational state.
State secondary states” on For STM0J, OC3/STM1/STM1J and OC12/STM4/STM4J
page 1-158 facilities, the Test state is editable.
The AINS state is editable.
The Maintenance state is editable.
Port mode • SONET Sets the port mode. By default, the port mode is set to the NE
• SDH mode. Automatically updated to reflect facility type selected.
• SDH-J Note 1: Each OCn/STMn port can also individually set to either
the SONET, or SDH, or SDH-J port mode by selecting the
appropriate facility type.
Note 2: Only the STM0J, OC3/STM1 and OC12/STM4 ports
can be set to SDH-J port mode.
Note 3: The OC192/STM64 port mode in a 1xOC-192/STM-64
L-Band tunable, 1xOC-192/STM-64 DWDM, or
1xOC-192/STM-64 AM1/AM2 DWDM tunable HO/LO circuit
pack follows the OTM2 port mode.
Note 4: The port mode is not editable, you must set the mode
during adding of the optical facility. Once set, to change the port
mode you must delete the facility and then add the facility again
with the correct port mode.
Signal mode • SONET (default for Sets the signal mode (SS bits).
SONET port mode)
• SDH (default for
SDH port mode)
• SDH-J (default for
SDH-J port mode)
Used as timing • Yes Displays whether the facility is being used as a timing
reference • No reference. Read-only.
Enable OSRP • Yes Enables or disables OSRP control plane on the network links.
• No Applicable to the OC48/STM16 and OC192/STM64 facilities
only.
OSRP can be enabled on the network ports only. On the
add/drop access ports, OSRP must be disabled.
Table 1-38
OTM2 facility parameters
OTU Signal Degrade 1x10^-9 Displays the signal degrade threshold (applicable only
Threshold when Rx FEC Format is Off). Read-only.
Table 1-39
OTM2 facility parameter applicability
Unit X X X
Primary State X X X
Secondary State X X X
Rate X
Tx Path Identifier X X
Tx Power (dBm) X
Tx SBS Dither X X
Tx AM Format X (Note)
Tx Wavelength (nm) X X
Tx Chirp X
Tx FEC Format X X X
Rx FEC Format X X X
Payload Type X
Transmitted (In HEX)
Port Mode X X X
Customer Defined X X X
Facility Identifier
AD facility parameters
Table 1-40
AD facility parameters
Parameter Options Description
Rx Actual string Sets the received autodiscovery tag. The AD tag format is the
same as the Tx Tag.
Rx Reliability Reliable Sets the state of the received autodiscovery tag: autodiscov-
ery tag is being correctly received.
Unit ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.
Primary State See “Equipment and Displays the primary state of the facility. Read-only.
facility primary states” on
page 1-157
Adjacency Type TXRX Displays the type of the adjacency. Read-only.
Actual Far End string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber.
Read-only.
Actual Far End See Note 2. Displays the option that each field of the far end address
Address Format represents. Read-only.
Expected Far End TID-shelf-slot-port Sets the provisioned far end address of the fiber
Address (Note 1) connection.
Expected Far End See Note 2. Sets the expected far end line receive and client receive
Address Format addresses format reported by the adjacency.
Customer Defined string of up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2 is equipped.
Note 1: The Expected Far End Address is controlled by the Expected Far End Address Format
selection. If the Expected Far End Address Format is set to ‘NULL’, then the Expected Far End
Address is disabled; Otherwise, it is enabled.
Note 2: The Far End Address Format options are:
• NULL
• TID-SH-SL-PRT
• TID-SH-SL-SBSL-PRT
Use the Add button to provision new DCC/GCC circuits and the Delete button
to delete existing DCC/GCC circuits. The Edit button is only enabled for editing
the LAPD parameters. When adding a DCC/GCC circuit, consider the
following:
• A maximum of two line/MS DCC circuits are supported on each
8xOC-3/12/STM-1/4 circuit pack.
• On the (2+8)xOC-n/STM-n circuit pack, 8 x SDCC/RS DCC and 8 x
LDCC/MS DCC are available on the OCn/STMn facilities. Port 1 & Port 3
and Port 2 & Port 7 share the same SDCC/RS DCC and LDCC/MS DCC
as both ports cannot be provisioned at the same time.
• 2 x GCC0 and 2 x GCC1 are available on the OTM2 facilities of the
(2+8)xOC-n/STM-n OTN 20G circuit pack.
• Each end of the DCC/GCC circuit must be provisioned with the same
options.
• When adding a DCC circuit, the L2 Frame Size and L2 Side Role fields
only become available when the LAPD option is selected.
• When adding a DCC circuit, the Mate field only become available when
the Transparent option is selected.
• Once a new DCC/GCC circuit has been added, an IISIS or OSPF circuit
must be added for this port (except for a transparent DCC). See “IISIS
Circuit parameters” on page 1-177 and “OSPF Circuit parameters” on
page 1-180.
• You must delete the IISIS or OSPF circuit for the DCC/GCC circuit before
deleting the DCC/GCC circuit.
• Adding or deleting a lower layer DCC/GCC entry with its Protocol
parameter set to PPP, automatically adds or deletes an associated PPP
circuit with IP address of 0.0.0.0.
For more information about the control plane communications, refer to 6500
Packet-Optical Platform Control Plane Application Guide, NTRN71AA.
Table 1-42
Lower Layer DCC/GCC parameters
Carrier Section/RS, line/MS, Selects the carrier for the Section/ DCC, line DCC Yes
GCC0, GCC1 and GCC circuit, or GCC0 or GCC1.
Only applicable to OCn/STMn/OTMn ports.
Protocol LAPD, NDP, PPP Select the LAPD, PPP, or Transparent radio button Yes or No
(default), to set the protocol of the DCC circuit (PPP, LAPD, or depends
Transparent Transparent). Only PPP or NDP is supported for on facility
OTMn GCC ports and LAPD and Transparent and carrier
options are disabled.
L2 Frame Size 512 to 1492 (default
Sets the LAPD frame size (only applicable to LAPD). Yes for
1304) for MCN CAUTION MCN
9000 for No for
Each end of the DCC circuit must be provisioned SONET/
SONET/SDH Control with the same LAPD frame size. Defaults on
Plane SDH
different equipment types may be different. Control
Plane
L2 Side Role Automatic Displays the LAPD link mode (only applicable to No
LAPD).
Operation L2 Network, User, Displays the availability of L2 side role when adding No
Side Role Disconnected a DCC/GCC circuit (only applicable to LAPD).
FCS Mode 16 bit (default), 32 bit Sets the frame check sequence (FCS) mode. Only Yes
applicable to the Transparent protocol or the PPP
protocol when the carrier is Section/RS or line/MS.
IISIS parameters
Table 1-43 provides a list of the IISIS Router parameters and Table 1-44 on
page 1-177 provides a list of the IISIS Circuit parameters.
Router table
Router Level Level 1 Sets the IISIS router level. Level 2 not supported in this No
release, option is always disabled.
L1 Priority 1 to 127 Sets the level 1 router priority. The L1 router assigned Yes
(default 64) the highest priority becomes the L1 designated router
for that LAN segment.
L2 Priority 1 to 127 Sets the level 2 router priority. The L2 router assigned No
(default 64) the highest priority becomes the L2 designated router
for that LAN segment.
Not supported in this release, option is disabled.
Route On (default), Off Sets whether routes (Off) or route summaries (On) are Yes
Summarization redistributed.
Redistribution table
Route OSPF Sets the IISIS router distribution list entries for the Yes
Redistribution/ Distribution, selected IISIS router.
List Static Distribution
(default)
IP Subnet Standard dot Sets the IP subnet address of the distribution list entry Yes
notation for the selected IISIS router.
Subnet Mask Standard dot Sets the subnet mask of the distribution list entry for the Yes
notation selected IISIS router.
Metric 1 to 63 Sets the metric (cost) of the distribution list entry for the Yes
selected IISIS router.
Metric Type External (default), Sets the metric type of the distribution list entry for the Yes
Internal selected IISIS router.
Table 1-44
IISIS Circuit parameters
Unit OCn/STMn/STM0J/S Displays the available ports for an IISIS circuit. Yes
TM1J/STM4J/OTMn OCn/STMn/STM0J/STM1J/STM4J/OTMn ports are
ports displayed in the following format:
OCn/STMn/STM0J/STM1J/STM4J/OTMn-shelf
-slot-port
Only OCn/STMn/STM0J/STM1J/STM4J/OTMn ports
with lower layer DCC/GCC0/GCC1 provisioned are
available for selection.
Carrier Section/RS, line/MS, Displays the DCC channel used, section/RS, line/MS, Yes
GCC0, GCC1 GCC used, GCC0 or GCC1 (options available depend
on circuit pack type and function).
Circuit 1 to 63 Sets the circuit default metric used to calculate the Yes
Default best route. Default depends on type of interface as
Metric follows:
• OCn/STMn/STM0J/STM1J/STM4J/OTMn ports with
line/MS DCC/GCC0/GCC1 provisioned: 5
• OCn/EC1/STMn/STM0J/STM1J/STM4J ports with
section/RS DCC provisioned: 6
Select a higher value for a slower circuit.
Level 2 Only On, Off (default) Sets the status of level 2 only routing on the IISIS No
circuit.
Not supported in this release, On option is always
disabled.
3 Way On, Off (default) Sets the status of 3-way handshaking on the IISIS No
Handshake circuit.
Not supported in this release, On option is always
disabled.
Neighbour Off (default), IP, OSI, Sets the protocols supported on neighbour routers Yes
Protocols IP and OSI (overrides what the router advertises).
Supported Must be set to OSI if the lower layer DCC Protocol
Override parameter is set to LAPD.
When provisioning an IISIS circuit:
• on an optical DCC port connected to OSI managed
network elements (for example, Optical Metro 3000
and Optical Metro 4000), you must ensure that
neighbour protocol supported override parameter is
set to OSI.
• on an optical port connected to another 6500
network element, it is strongly recommended that the
lower layer DCC Protocol parameter be set to PPP
and the neighbour protocol supported override
parameter be set to Off.
The “IP” and “IP and OSI” options are not supported.
OSPF parameters
Table 1-45 on page 1-179 provides a list of the OSPF Router parameters and
Table 1-46 on page 1-180 provides a list of the OSPF Circuit parameters.
Table 1-45
OSPF Router parameters
Parameter Options Description Addable
/Editable
Router
OSPF Router Standard dot notation Sets the router ID for the OSPF. Yes
Id It is recommended that the SHELF address (if
provisioned) is used as the OSPF Router Id.
Link State External (default), Sets the type of link state announcement used. Yes
Router, Summary This parameter is not used and can be left at the
default value (External).
Route ON (default), OFF Sets whether routes (off) or route summaries (On) are Yes
Summarization redistributed.
Autonomous ON, OFF (default) Sets the autonomous system border router (ASBR). Yes
System Border ASBR identifies whether an OSPF router can accept
Router input (route redistribution) from another autonomous
system such as IISIS, or static routes.
Opaque Filter ON, OFF (default) Enables or disables the OSPF Opaque LSA Flooding Yes
Control (OOLFC). OOLFC reduces the number of
Type 11 opaque LSAs containing AR and TR records
in the OSPF database for 6500 shelf that is part of an
OSPF network. Cannot be set to ON if ODBR or
DBRS is ON, and vice versa.
Shelf IP ON, OFF (default) Enables or disables shelf IP redistribution. Shelf IP Yes
Redistribution redistribution provides the ability to redistribute a
route to the local shelf IP into all OSPF areas that the
local shelf participates in. All NEs in these
participating OSPF areas will install the received
route into their local IP routing table. Only supported
in OSPF networks without a backbone.
Redistribution
Route IISIS Distribution, Sets the origin of the route(s) to be redistributed. Yes
Redistribution/ Static Distribution
List (default)
IP Subnet Standard dot notation Sets the IP subnet address for redistribution. Yes
Subnet Mask Standard dot notation Sets the subnet mask for redistribution. Yes
Metric 1 to 65535 Sets the metric for redistribution. Yes
Metric Type External (default), Sets the metric type for redistribution. Yes
Internal
Table 1-46
OSPF Circuit parameters
Carrier Section/RS, line/MS, Sets the DCC/GCC on the OCn/STMn/OTMn port Yes
GCC0, GCC1 for the OSPF circuit.
Only applicable to OCn/STMn/OTMn ports.
Network Area Standard dot notation Sets the area (defaults to backbone area of 0.0.0.0). Yes
Cost 1 to 65534 Sets the cost of the route (reflects speed of Yes
(default 10) interface). Defaults are as follows:
• GCC0/1: 75
• section/RS DCC: 520
• line/MS DCC: 174
Area Default 1 to 16777215 Sets the cost of the route to the next area. No
Cost (default 1) Note: It is not supported in this release.
Dead Interval 1 to 65535 Sets the interval (in seconds) at which hello packets Yes
(default 40) must not be seen before neighbors declare the
router down.
Hello Interval 1 to 65535 Sets the interval (in seconds) between the hello Yes
(default 10) packets that the router sends on the interface.
Transmit 1 to 3600 (default 1) Sets the estimated time (in seconds) it takes to No
Delay transmit a link state update packet over this
interface.
Note: It is not supported in this release.
Priority 0 to 255 (default 1) Sets the router priority value used in multi-access Yes
networks for the election of the designated router (0
indicates that router is not eligible to become
designated router).
Area Off (default), NSSA, Sets whether the router is in a not so stubby area Yes
Stub (NSSA) or stub area. NSSA and Stub not supported
in this release.
Opaque Link On (default), Off Sets whether opaque link state advertisement Yes
State performs on the OSPF circuit.
Advertisement
Passive OSPF On, Off (default) Determines whether OSPF adjacency loss should Yes
Circuit be detected. If set to On, OSPF adjacency loss will
be ignored.
Authentication Null (default), Simple Sets the authentication type. Null means no Yes
Type Password, MD5 authentication.
Simple string of up to 8 Sets the password if authentication type is simple Yes
Password characters password.
MD5 Identifier 0 to 255 Sets the identifier for the first MD5 key. Must be Yes
1 unique on an OSPF interface.
MD5 Key 1 string of up to 16 Sets the password for the first MD5 key. Yes
characters
Status 1 Accepting, Rejecting Displays the status of the authentication using MD5 No
Key 1.
MD5 Identifier 0 to 255 Sets the identifier for the second MD5 key. Must be Yes
2 unique on an OSPF interface.
MD5 Key 2 string of up to 16 Sets the password for the second MD5 key. Yes
characters
Status 2 Accepting, Rejecting Displays the status of the authentication using MD5 No
Key 2.
Area List
IP Subnet Standard dot notation Sets the IP subnet address of the OSPF area. No
Not supported in this release, field is disabled.
Subnet Mask Standard dot notation Sets the subnet mask of the OSPF area. No
Not supported in this release, field is disabled.
Table 1-47
Ring APS configuration editor parameters for OC-n/STM-n circuit packs
Configuration file A character string Displays the name of the configuration file associated with the
name currently displayed ring.
Ring name Up to 40 characters Sets the ring name. The name cannot include the backslash (\)
and double quote (“) characters.
View ordered as All the nodes in the Sets the order in which the nodes of the selected ring appear in
provisioned data ring the Nodes area. The connections are shown from the point of
on view of the node selected from the drop-down list, with the
selected node at the top of the Nodes area. If a node does not
have a node identifier, only the APS ID appears in the
drop-down list.
The second node is the node connected to the east facility. If
the facility AIDs is not specified for the first node, then the
second node can be any of the two nodes connected to the first
node (a warning message appears at the bottom of the window
indicating that the list of nodes may not correspond to the order
that will be used at provisioning time). Both AIDs must be
specified before the node can be considered for provisioning.
East facility Alphanumeric Sets the East facility (BLSR/MS-SPRing working member of a
linked to: string 2-fiber group) linked to the next node (appears on right side of
node in Node area).
When there is no node in the configuration, the linked to: field
shows “Next node”.
Note: Applicable when the Ring type selected is 2 Fiber.
West facility Alphanumeric Sets the West facility (BLSR/MS-SPRing protection member of
linked to: string a 2-fiber group) linked to the “previous node” (appears on left
side of node in Node area).
When there is no node in the configuration, the linked to: field
shows “Previous node”.
Note: Applicable when the Ring type selected is 2 Fiber.
Table 1-48
Path Connections application parameters for OC-n/STM-n circuit packs
Parameter Description
Connection ID The connection identifier string is used to identify a provisioned path connection.
The path connection ID can contain a maximum of 64 characters, with the
exception of the \, “, and % characters.
For connections created by the SONET/SDH Control Plane, the connection
identifier string is assigned a network wide unique identifier, called a Network
Call Correlation Identification (NCCI).
For connections created by the OTN Control Plane, the connection identifier
string includes the Sub-Network Connection (SNC) name, in the format
Node ID_SNC Name_SNC reincarnation number.
Note: Support for 64 characters connection IDs is only supported from ONM
Release 6.0 onwards.
Table 1-49
Path connection types for OC-n/STM-n circuit packs—supported From, To, Switch Mate, and
Destination Mate instances
Table 1-50
Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
OC-192/STM-64 circuit packs (Note 1)
VT1.5/VC11 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts#-v shelf# = 1 to 254
and tg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 STM64-shelf#-slot#-port#-J#-K# 14-slot shelf
-L#-M# slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1 to 192
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 64
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
STS1/VC3 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
STM64-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1 to 192
J# (AU4) = 1 to 64
K# (TUG-3) = 1 to 3
STS3c/VC4 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1, 4, 7, 10, ..., 190
J# (AU4) = 1 to 64
Release 11.2
Publication: 323-1851-102.3
Document status: Standard
Issue 1
Document release date: July 2016
CONTACT CIENA
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