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6500 Packet-Optical Platform

OC-n/STM-n Circuit Packs


Release 11.2

What’s inside...
New in this release and documentation roadmap
OC-n/STM-n circuit packs

323-1851-102.3 - Standard Issue 1


July 2016
Copyright© 2010-2016 Ciena® Corporation. All rights reserved.
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Contacting Ciena

Corporate Headquarters 410-694-5700 or 800-921-1144 www.ciena.com


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or 410-865-8996
For additional office locations and phone numbers, please visit the Ciena web site at www.ciena.com.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
IMPORTANT: PLEASE READ THIS LICENSE AGREEMENT (“AGREEMENT”) CAREFULLY BEFORE
INSTALLING OR USING CIENA CORPORATION (“Ciena”) SOFTWARE, HARDWARE OR DOCUMENTATION
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6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
7. Limitation of Liability. ANY LIABILITY OF Ciena SHALL BE LIMITED IN THE AGGREGATE TO THE
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provisions shall remain in full force and effect.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
v

Contents 0

New in this release and documentation roadmap ix

OC-n/STM-n circuit packs 1-1


1xOC-192/STM-64 circuit packs (NTK523xxE5, NTK524xxE5, NTK526xxE5,
NTK527xxE5, NTK527JB) 1-2
Overview 1-2
Supported functionality 1-12
Cross-connection types 1-16
Cross-connection rates 1-17
Performance monitoring 1-17
Alarms 1-17
Equipping rules 1-21
Technical specifications 1-22
Latency 1-32
2xOC-48/STM-16 circuit packs (NTK516BAE5 and NTK517BAE5, NTK519BAE5 and
NTK520BAE5) 1-33
Overview 1-33
Supported functionality 1-39
Cross-connection types 1-39
Cross-connection rates 1-40
Supported SFPs/DPOs 1-40
Performance monitoring 1-41
Alarms 1-41
Equipping rules 1-44
Technical specifications 1-45
Latency 1-46
8xOC-3/12/STM-1/4 circuit packs (NTK513MAE5 and NTK513DAE5) 1-47
Overview 1-47
Supported functionality 1-51
Cross-connection types 1-52
Cross-connection rates 1-52
Supported SFPs 1-53
Performance monitoring 1-54
Alarms 1-55
Equipping rules 1-57
Technical specifications 1-58
Latency 1-59

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
vi Contents

16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5, NTK512GAE5,


NTK513GAE5) 1-60
Overview 1-60
Supported functionality 1-66
Cross-connection types 1-67
Cross-connection rates 1-68
Supported SFPs 1-69
Performance monitoring 1-71
Alarms 1-72
Equipping rules 1-75
Technical specifications 1-76
Latency 1-77
(2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5) 1-78
Overview 1-78
Supported functionality 1-85
Cross-connection types 1-87
Cross-connection rates 1-87
Supported SFPs/XFPs 1-88
Performance monitoring 1-91
Alarms 1-92
Equipping rules 1-96
Technical specifications 1-97
Latency 1-99
8xOC-n/STM-n 5G VT1.5/LO SFP circuit packs (NTK511AA) 1-100
Overview 1-100
Supported functionality 1-103
Cross-connection types 1-104
Cross-connection rates 1-104
Supported SFPs 1-105
Performance monitoring 1-107
Alarms 1-107
Equipping rules 1-110
Technical specifications 1-111
Latency 1-112
OC-n/STM-n circuit packs provisioning procedures 1-113
1xOC-192/STM-64 1-114
2xOC-48/STM-16 1-115
8xOC-3/12/STM-1/4 (including 8xOC-n/STM-n) 1-116
16xOC-n/STM-n 1-117
(2+8)xOC-n/STM-n 1-118
Provisioning rules summary for the OC-192/STM-64 DWDM circuit packs 1-119
Provisioning rules summary for the 16xOC-n/STM-n circuit packs 1-119
Provisioning rules summary for the (2+8)xOC-n/STM-n 20G and OTN 20G circuit
packs 1-120
Provisioning rules summary for the 8xOC-n/STM-n circuit packs 1-121

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
Contents vii

List of procedures
1-1 Provisioning a circuit pack automatically 1-123
1-2 Provisioning a pluggable automatically 1-125
1-3 Routing fiber-optic cables and STM-1e coaxial cables onto the 6500
shelf 1-126
1-4 Connecting or disconnecting fiber-optic cables to or from circuit packs 1-127
1-5 Adding a facility to an equipment 1-128
1-6 Editing facility parameters 1-132
1-7 Changing the protection scheme for a pair of facilities 1-133
1-8 Creating ring configurations 1-138
1-9 Adding a new entry in the communications settings 1-143
1-10 Adding a path connection 1-145
1-11 Changing the primary state of a facility 1-150
1-12 Changing the primary state of a circuit pack or pluggable 1-152
1-13 Deleting a facility from an equipment 1-154
1-14 Deleting a circuit pack or pluggable 1-156
Equipment and facility provisioning parameters 1-157
Facility parameters 1-160
OCn/STMn/STM0J/STM1J/STM4J facility parameters 1-160
OTM2 facility parameters 1-163
AD facility parameters 1-169
ADJ facility parameters 1-170
DCC/GCC support and parameters 1-172
IISIS parameters 1-175
OSPF parameters 1-178
Ring APS configuration editor parameters 1-183
Path connections parameters 1-186

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
viii Contents

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
ix

New in this release and documentation


roadmap 0

This Technical Publication supports 6500 Packet-Optical Platform (6500)


Release 11.2 software and subsequent maintenance releases for
Release 11.2.

Issue 1
There are no new features covered in this document for this release.

6500 Packet-Optical Platform technical publications


The following roadmap identifies the technical publications that support the
6500 for Release 11.2.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
x New in this release and documentation roadmap

Planning a Network Installing, Managing and Maintaining and Circuit Pack-Based


Commissioning and Provisioning Troubleshooting Documentation
Testing a Network a Network a Network

Planning - Installation - Administration Fault Management - Common Equipment


Parts 1, 2, 3, and 4 General Information and Security Performance (323-1851-102.1)
(NTRN10DP) (323-1851-201.0) (323-1851-301) Monitoring
(323-1851-520) Electrical
Documentation Installation - Configuration - (323-1851-102.2)
Roadmap 2-slot Shelves Provisioning
(323-1851-201.1) Fault Management -
(323-1851-090) and Operating OC-n/STM-n
Alarm Clearing
Ordering Information Parts 1 and 2 (323-1851-102.3)
Installation - 7-slot & Parts 1 and 2
(323-1851-151) (323-1851-310)
6500-7 packet-optical (323-1851-543) 40G/100G/OSIC/
Shelves Configuration - ISS/SLIC10 and
CLI, REST, gRPC &
(323-1851-201.2) Bandwidth & Data Fault Management - 200G Services
Waveserver-6500
Services Parts 1,2,3 Module (323-1851-102.4)
Interworking Installation -
(323-1851-320) Replacement
(323-1851-165) 14-slot Shelves (323-1851-545)
Latency (323-1851-201.3) Broadband/SMUX
Configuration -
Specifications OTN FLEX MOTR
Installation - Control Plane Fault Management -
(323-1851-170) (323-1851-102.5)
32-slot Shelves (323-1851-330) SNMP
Pluggable (323-1851-201.4) (323-1851-740)
Datasheets Encryption and FIPS Photonics Equipment
Installation - Passive Security Policy (323-1851-102.6)
and Reference Fault Management -
Chassis (2150 Optical Overview and
(323-1851-180) Customer Visible
Multiplexer & Procedures Data and Layer 2
TL-1 Description Photonics) (323-1851-340) Logs
(323-1851-102.7)
(323-1851-190) (323-1851-201.5) (323-1851-840)
MyCryptoTool
Commissioning Certificate OTN I/F, PKT I/F, &
CLI Reference
and Testing Management and PKT/OTN I/F
(323-1851-193)
(323-1851-221) Quick Start (323-1851-102.8)
Site Manager (323-1851-341)
Fundamentals
(323-1851-195)

SAOS-based Command Fault and MIB


Configuration
Packet Services Reference Performance Reference
(323-1851-630)
Documentation (323-1851-610) (323-1851-650) (323-1851-690)

Supporting WaveLogic Photonics 6500 Data 6500 Control Plane Submarine Networking
Documentation Coherent Select Application Guide Application Guide Application Guide
(323-1851-980) (NTRN15BA) (NTRN71AA) (NTRN72AA)
6500 Photonic Common 6500 - 5400 / 8700 Network Interworking Universal AC Rectifier
Layer Guide Photonic Layer Interworking Solution Guide Application Note
(NTRN15DA) Technical Publications (323-1851-160) (NTCA68CA) (009-2012-900)

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
1-1

OC-n/STM-n circuit packs 1-

This chapter provides an overview of the 6500 Packet-Optical Platform (6500)


OC-n/STM-n circuit packs and their associated procedures. See Table 1-1 for
different circuit packs covered in this chapter.

Table 1-1
OC-n/STM-n circuit packs in this chapter

Topic Page

1xOC-192/STM-64 circuit packs (NTK523xxE5, NTK524xxE5, NTK526xxE5, NTK527xxE5, 1-2


NTK527JB)

2xOC-48/STM-16 circuit packs (NTK516BAE5 and NTK517BAE5, NTK519BAE5 and 1-33


NTK520BAE5)

8xOC-3/12/STM-1/4 circuit packs (NTK513MAE5 and NTK513DAE5) 1-47

16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5, NTK512GAE5, NTK513GAE5) 1-60


(2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5, 1-78
NTK522DAE5)

8xOC-n/STM-n 5G VT1.5/LO SFP circuit packs (NTK511AA) 1-100

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
1-2 OC-n/STM-n circuit packs

1xOC-192/STM-64 circuit packs (NTK523xxE5, NTK524xxE5,


NTK526xxE5, NTK527xxE5, NTK527JB)
Overview
The 1xOC-192/STM-64 circuit pack supports both OC-192 (SONET) and
STM-64 (SDH) services and 6500 supports four basic variants of the
1xOC-192/STM-64 circuit pack:
• non-DWDM variants available with short reach, intermediate reach, and
long reach optics (NTK523xxE5 and NTK524xxE5)
VC11/VT1.5 (Low Order; LO) and STS-1/VC3 (High Order; HO) versions
are available for these variants.
• DWDM variants with fixed wavelengths which support ITU-T DWDM
compliant wavelengths (NTK526xxE5 and NTK527xxE5 except for
NTK526JAE5, NTK526JBE5, NTK527JAE5, and NTK527JB) as follows:
— 36 wavelengths for interworking with Common Photonic Layer
systems equipment or 6500 Photonic layer
— 16 C-band and 16 L-band wavelengths for interworking with the 565,
5100 and 5200 Advanced Services Platform DWDM optical
multiplexer (OMX). When interworking with OMX while the 6500 on
one end uses OC-192/STM-64 DWDM optical interfaces and the 6500
on other end uses OC-192/STM-64 DWDM AM1/AM2 tunable optical
interfaces, you must contact your Ciena representative for link budget
validation.
VC11/VT1.5 (Low Order; LO) and STS-1/VC3 (High Order; HO) versions
are available for these variants.
• DWDM variants with C-band tunable laser and AM1/AM2 dithering
support (NTK526JAE5 and NTK527JAE5). The DWDM laser is tunable
across the entire ITU-T DWDM C-band with 50 GHz spacing (1528.77 nm
to 1565.09 nm) (see Table 1-9 on page 1-29) allowing wavelength
interworking as follows:
— 88 wavelengths compliant with Common Photonic Layer or 6500
Photonic layers
— 80 wavelengths compliant with Optical Long Haul 1600
— 32 wavelengths compliant with MOR/MOR Plus
— 16 wavelengths compliant with 200GHz 565, 5100 and 5200
Advanced Services Platform DWDM optical multiplexer (OMX)
— 32 wavelengths compliant with 100 GHz 565, 5100 and 5200
Advanced Services Platform DWDM optical multiplexer (OMX)
VC11/VT1.5 (Low Order; LO) and STS-1/VC3 (High Order; HO) versions
are available for these variants.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
OC-n/STM-n circuit packs 1-3

• DWDM variant with L-band tunable laser (NTK526JBE5 and NTK527JB).


The DWDM laser is tunable across the entire ITU-T DWDM L-band with
50 GHz spacing (1569.59 nm to 1605.74 nm)
Both STS-1/VC3 (High Order; HO) (NTK526JBE5) and VT1.5/LO (Low
Order; LO) (NTK527JB) versions are available for this variant.

When interworking with OMX product and to avoid link budget problem, you
must set the Tx FEC Format of the 1xOC-192/STM-64 STS-1/HO DWDM
C-Band AM1/AM2, 1xOC-192/STM-64 VT1.5/LO DWDM C-Band AM1/AM2,
and 1xOC-192/STM-64 DWDM L-band tunable optical interfaces to Super
concatenated FEC. The Rx Equalization firmware must be also running on the
OMX side. The AM1/AM2 dithering support is required when interworking with
Long Haul 1600 systems and MOR+ systems.

VT1.5/LO and STS-1/HO circuit packs


There are two versions of the 1xOC-192/STM-64 circuit packs:
• VT1.5/Low Order (LO)
This circuit pack supports VT1.5/VC11, VT2/VC12, and above switching
granularity (including LO_VC3).
• STS-1/High Order (HO)
This circuit pack supports STS1/HO_VC3/VC4 and above switching
granularity.

To use the VT1.5/VC11 and VT2/VC12 granularity, both the optical interface
circuit packs and the cross-connect circuit packs must support VT.15/VC11
and VT2/VC12 switching granularity.

Note: The LO circuit packs can achieve LO switching granularity provided


that the shelf in which they are equipped is equipped with LO
cross-connect circuit packs. The LO circuit packs can achieve LO_VC3
switching granularity on HO cross-connect circuit pack when using the
240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+ STS-1/VC-3
(640/0G) (NTK610BBE5) cross-connect circuit packs.

Figure 1-1 on page 1-4 shows the faceplate of a 1xOC-192/STM-64 circuit


pack and Figure 1-2 on page 1-5 to Figure 1-9 on page 1-12 show the
functional block diagrams of a 1xOC-192/STM-64 circuit packs.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
1-4 OC-n/STM-n circuit packs

Figure 1-1
1xOC-192/STM-64 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
OC-192/STM-64
STS-1/HO
1 Port G.709 DWDM
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
Fail

Ready

In Use
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off

Blue diamond (In Use)


Rx

Tx
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off

Transmit/receive fixed dual LC connector


(on older circuit packs, the orientation of the
LC connectors is horizontal)
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal

Hazard
level:
R99
EEEEE99999
S/N NT030MEE9999E

NTUD99EE

Type A

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
OC-n/STM-n circuit packs 1-5

Figure 1-2
1xOC-192/STM-64 circuit pack block diagram (NTK523xxE5)

XC

10G SONET/SDH OHP Optics 1

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
1-6 OC-n/STM-n circuit packs

Figure 1-3
1xOC-192/STM-64 circuit pack block diagram (NTK524xxE5)

XC

VT/TU processor 10G SONET/SDH OHP Optics 1

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
OC-n/STM-n circuit packs 1-7

Figure 1-4
1xOC-192/STM-64 circuit pack block diagram (NTK526xxE5 except NTK526JAE5 and
NTK526JBE5)

XC

Fixed
10G SONET/SDH OHP G.709/FEC wavelength 1
DWDM optics

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
1-8 OC-n/STM-n circuit packs

Figure 1-5
1xOC-192/STM-64 circuit pack block diagram (NTK527xxE5 except NTK527JAE5 and NTK527JB)

XC

Fixed
VT/TU 10G SONET/SDH OHP G.709/FEC wavelength 1
processor DWDM optics

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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OC-n/STM-n circuit packs 1-9

Figure 1-6
1xOC-192/STM-64 circuit pack block diagram (NTK526JAE5)

XC

10G SONET/SDH OHP G.709/FEC/ DWDM


optics 1
AM1/AM2

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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1-10 OC-n/STM-n circuit packs

Figure 1-7
1xOC-192/STM-64 circuit pack block diagram (NTK527JAE5)

XC

VT/TU 10G SONET/SDH OHP G.709/FEC/ DWDM


optics 1
processor AM1/AM2

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
OC-n/STM-n circuit packs 1-11

Figure 1-8
1xOC-192/STM-64 circuit pack block diagram (NTK527JB)

XC

VT/TU 10G SONET/SDH OHP G.709/FEC DWDM


optics 1
processor

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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1-12 OC-n/STM-n circuit packs

Figure 1-9
1xOC-192/STM-64 circuit pack block diagram (NTK526JBE5)

XC

10G SONET/SDH OHP G.709/FEC DWDM


Optics 1

XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

Supported functionality
The 1xOC-192/STM-64 circuit pack provides the following functionality.
• one integrated 10G line interface (port 1)
• supports OC-192 (SONET) and STM-64 (SDH) services
• terminates/generates both section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable (default is Off) (no support for
GCC)
• line/MS DCC for SONET/SDH Control Plane

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• terminates/generates OTM2 overhead (1xOC-192/STM-64 DWDM,


1xOC-192/STM-64 STS-1/HO DWDM L-Band, 1xOC-192/STM-64
VT1.5/LO DWDM L-Band, 1xOC-192/STM-64 STS-1/HO DWDM C-Band
AM1/AM2, and 1xOC-192/STM-64 VT1.5/LO DWDM C-Band AM1/AM2
interfaces only)
• monitors optical power input and output on all 10G circuit pack types
• G.709 wrapper (non provisionable) on 1xOC-192/STM-64 DWDM,
1xOC-192/STM-64 STS-1/HO DWDM L-Band, 1xOC-192/STM-64
VT1.5/LO DWDM L-Band, 1xOC-192/STM-64 STS-1/HO DWDM C-Band
AM1/AM2, and 1xOC-192/STM-64 VT1.5/LO DWDM C-Band AM1/AM2
interfaces only
— with RS8 FEC selectable (default is On) on the 1xOC-192/STM-64
DWDM interfaces only
— with RS8 or SCFEC selectable (default is SCFEC) on the,
1xOC-192/STM-64 STS-1/HO DWDM L-Band, 1xOC-192/STM-64
VT1.5/LO DWDM L-Band, 1xOC-192/STM-64 STS-1/HO DWDM
C-Band AM1/AM2 and 1xOC-192/STM-64 VT1.5/LO DWDM C-Band
AM1/AM2 interfaces only
Note: RS8 FEC algorithm is also known as ITU-T G.709 RS-8.
SCFEC FEC algorithm is also known as ITU-T G.975 I.4.

• AM1/AM2 dithering support (default is AM1) on 1xOC-192/STM-64


STS-1/HO DWDM C-Band AM1/AM2 and 1xOC-192/STM-64 VT1.5/LO
DWDM C-Band AM1/AM2 interfaces only. Push Button Equalization
(PBE) is supported.
• provisionable Tx chirp, and Tx power on 1xOC-192/STM-64 STS-1/HO
DWDM C-Band AM1/AM2 and 1xOC-192/STM-64 VT1.5/LO DWDM
C-Band AM1/AM2 interfaces only and Tx SBS dither on
1xOC-192/STM-64 DWDM, 1xOC-192/STM-64 STS-1/HO DWDM
C-Band AM1/AM2, and 1xOC-192/STM-64 VT1.5/LO DWDM C-Band
AM1/AM2 interfaces
• provisionable wavelength (1528.77 nm to 1565.09 nm) and optical output
power (-10 dBm to +1.5 dBm for AM1 format and -10 dBm to +3.1 dBm for
AM2 format) on 1xOC-192/STM-64 STS-1/HO DWDM C-Band AM1/AM2
and 1xOC-192/STM-64 VT1.5/LO DWDM C-Band AM1/AM2 interfaces
• provisionable wavelength (1570.42 nm to 1605.74 nm) and fixed optical
output power of +3.1 dBm (typical) on 1xOC-192/STM-64 STS-1/HO
DWDM L-Band and 1xOC-192/STM-64 VT1.5/LO DWDM L-Band
interface
• offers built-in VOAs (only supported on DWDM circuit packs)
• selectable automatic laser shut off controlled by software

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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• supports unprotected, 2-Fiber BLSR/MS-SPRing, 4-Fiber


BLSR/MS-SPRing/HERS, 1+1/MSP linear, and UPSR/SNCP traffic
protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports Control Plane (OC192/STM64 facility is supported as both
add/drop Control Plane facility and Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.

• supports 2x10G OTR circuit packs as regenerator for the 10G


SONET/SDH tunable DWDM circuit packs
Figure 1-10 shows the configuration supporting the use of the 2x10G OTR
circuit packs as regenerator for the 10G SONET/SDH tunable DWDM
circuit packs.
Figure 1-10
Configuration details

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OC-n/STM-n circuit packs 1-15

Table 1-2 shows details for supported configuration and equipment.

Table 1-2
Supported configuration and equipment details
Topic Requirement

Configuration

Specific configurations • With OMX


— 4ch or 16ch OMX (16ch insertion loss of 6dB)
• Without OMX

Number of Regens Up to two Regen sites in a given span

Fiber type DSF and NDSF

Specific fiber conditions • With OMX: 70km / 14dB per span


• Without OMX: 100km / 20dB per span

Minimum receiver sensitivity -25 dBm on 10G SONET/SDH DWDM circuit pack
FEC RS8

Minimum software release Release 9.21

Equipment

10G OTR circuit packs 2x10G OTR 4x XFP (NTK530PGE5 and NTK530PME5)

10G SONET/SDH Tunable DWDM • 1xOC-192/STM-64 STS-1/HO DWDM L-Band (NTK526JBE5)


circuit packs • 1xOC-192/STM-64 VT1.5/LO DWDM L-Band (NTK527JB)
• 1xOC-192/STM-64 STS-1/HO DWDM C-Band AM1/AM2
(NTK526JAE5)
• 1xOC-192/STM-64 VT1.5/LO DWDM C-Band AM1/AM2
(NTK527JAE5)

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Release 11.2 323-1851-102.3 Standard Issue 1
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1-16 OC-n/STM-n circuit packs

Table 1-2 (continued)


Supported configuration and equipment details

XFP optical modules • Multirate 1570.42 nm to 1572.06 nm Tunable Dispersion


Tolerant DWDM 3200 ps/nm XFP (NTK589PAE6)
• Multirate 1573.71 nm to 1575.37 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PCE6)
• Multirate 1577.03 nm to 1576.69 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PDE6)
• Multirate 1580.35 nm to 1582.02 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PEE6)
• Multirate 1582.85 nm to 1584.53 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PFE6)
• Multirate 1583.69 nm to 1585.36 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PGE6)
• Multirate 1586.20 nm to 1587.88 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PHE6)
• Multirate 1590.41 nm to 1592.10 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PJE6)
• Multirate 1593.79 nm to 1595.49 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PLE6)
• Multirate 1594.64 nm to 1596.34 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PME6)
• Multirate 1600.60 nm to 1602.31 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PNE6)
• Multirate 1601.46 nm to 1603.17 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PPE6)
• Multirate 1604.03 nm to 1605.74 nm Tunable Dispersion
Tolerant DWDM 3200 ps/nm XFP (NTK589PQE6)
• Multirate 1528.38 nm to 1568.77 nm (1-88) 50GHz Tunable
DWDM XFP (NTK583AAE6)

Cross-connection types
The 1xOC-192/STM-64 circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled

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Release 11.2 323-1851-102.3 Standard Issue 1
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Cross-connection rates
The 1xOC-192/STM-64 circuit packs support the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11, VT2/VC12, STS1/LO VC3
(VT1.5/LO circuit packs only)
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rates of STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
STS48c/VC4-16c, and STS192c/VC4-64c
• auto concatenated rates of STS1/VC3, STS3c/VC4, STS12c/VC4-4c,
STS48c/VC4-16c, and STS192c/VC4-64c

Performance monitoring
The 1xOC-192/STM-64 circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-192/STM-64 facilities
• PM collection for OTU layer (1xOC-192/STM-64 AM1/AM2 DWDM tunable
HO/LO circuit pack only)
• PM collection for ODU layer (1xOC-192/STM-64 AM1/AM2 DWDM
tunable HO/LO circuit pack only)
• PM collection for STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
STS48c/VC4-16c, and STS192c/VC4-64c concatenated payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed

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Release 11.2 323-1851-102.3 Standard Issue 1
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• Circuit Pack Latch Open


• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Packet Rate Limit Exceeded
• Provisioning Incompatible

OTM facility alarms


• Loss Of Signal
• Loss Of Frame
• Loss Of Multiframe
• OTU Trace Identifier Mismatch
• OTU Signal Degrade
• OTU BDI
• ODU AIS
• ODU LCK
• ODU OCI
• ODU Trace Identifier Mismatch
• ODU BDI
• OPU AIS
• OPU Payload Type Mismatch
• Pre-FEC Signal Fail
• Rx Power Out Of Range
• Tx Manual Provisioning required
• Tx Tuning in Progress

OCn/STMn facility alarms


• AIS
• Auto Protection Switch Acknowledge Time Out
• DCC OSPF Adjacency Loss
• Forced Switch Active
• Far End Protection Line Fail
• Forced Ring Switch Active

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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• Forced Span Switch Active


• LINE DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• Lockout Protection Ring Active
• Lockout Working Ring Active
• Lockout Working Span Active
• Lockout Active
• Loss Of Signal
• Loss Of Frame
• Loss of Extra Traffic
• LINE DCC Link Failure
• Loopback Active
• Manual Ring Switch Active
• Manual Span Switch Active
• Node Id Mismatch
• Protection Channel Match Fail
• Protection Default K-bytes
• Protection Exerciser Failed
• Protection Invalid K-bytes
• Protection Mode Mismatch
• Protection Scheme Mismatch
• Protection Switch Byte Fail
• Protection Switch Complete
• Ring Protection Switch Complete
• Ring Protection Switch Fail
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC OSPF Adjacency Loss
• SECTION DCC Link Failure
• Span Protection Switch Complete
• Span Protection Switch Fail

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Release 11.2 323-1851-102.3 Standard Issue 1
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• Span Protection Exerciser Fail


• Trace Identifier Mismatch

Path alarms (STSn/VTn)


• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer
• Loopback Active - Facility
• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Traffic Squelched
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F
• Test Access in Progress - Split EF
• Unequipped

Photonic alarms
• Duplicate Adjacency Discovered

Control Plane alarms


• Remote Node Unreachable (OSRP line level)
• Configuration Mismatch
• Configuration Mismatch - Common ID
• Configuration Mismatch - Primary State

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)

Equipping rules
The following equipping rules apply to 1xOC-192/STM-64 circuit packs:
• is a single-slot one-port interface
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note 1: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.
Note 2: The 1xOC-192/STM-64 circuit pack is supported in slots 1 to 4
and 11 to 14 (e.g. excluding slots 5, 6, 9, and 10) only if the 14-slot shelf
is equipped with STS-1/VC-3 (160/0), 240G+ STS-1/VC-3 (240/0), or
240G+/80G VT1.5/VC-12 (240/80) cross-connect circuit packs. The
1xOC-192/STM-64 circuit packs are supported in slots 5, 6, 9, and 10 of
a 14-slot shelf for all cross-connect circuit packs (except PKT/OTN,
20G/20G VT1.5/VC-12, and MXC cross-connect circuit packs). The
1xOC-192/STM-64 circuit pack is not supported when using the 20G/20G
VT1.5/VC-12 or MXC cross-connect circuit packs.
• you cannot deploy 1xOC-192/STM-64 DWDM (VT1.5/LO, STS-1/HO, or
1xOC-192/STM-64 AM1/AM2 DWDM tunable HO/LO) circuit packs in the
lower shelf of the stacked configuration in 14-slot shelf type.
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot
packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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• is not supported in a 7-slot optical shelf type (NTK503PAE5 or


NTK503KA).
• cannot be equipped in a 6500-7 packet-optical shelf type (NTK503RA) in
this release.
• is not supported in a 2-slot shelf type.

Technical specifications
Table 1-3 lists the weights for 1xOC-192/STM-64 circuit packs.

Table 1-3
1xOC-192/STM-64 circuit packs weights
Description PEC Weight
(estimated)
1xOC-192/STM-64 circuit pack NTK523BAE5/NTK524BAE5 1.3 kg (2.9 lb)
NTK523DAE5/NTK524DAE5
NTK523FAE5/NTK524FAE5
NTK523FBE5/NTK524FBE5
1xOC-192/STM-64 DWDM circuit pack NTK526xxE5/NTK527xxE5/ 1.4 kg (3.1 lb)
NTK527JB

Table 1-4 lists the power consumptions for 1xOC-192/STM-64 circuit packs.

Table 1-4
1xOC-192/STM-64 circuit packs power consumptions

Circuit pack Order code Typical (W) Power Budget (W)


(see Note 1) (see Note 2)

1xOC-192/STM-64 STS-1/HO IR2/S64.2 NTK523DAE5 32 32

1xOC-192/STM-64 STS-1/HO SR1/I64.1 NTK523BAE5 31 31

1xOC-192/STM-64 STS-1/HO LR2/L64.2 NTK523FAE5/ 32 32


NTK523FBE5

1xOC-192/STM-64 VT1.5/LO IR2/S64.2 NTK524DAE5 40 40

1xOC-192/STM-64 VT1.5/LO SR1/I64.1 NTK524BAE5 40 40

1xOC-192/STM-64 VT1.5/LO LR2/L64.2 NTK524FAE5/ 44 44


NTK524FBE5

1xOC-192/STM-64 STS-1/HO DWDM Different 44 44


(NTK526xxE5)

1xOC-192/STM-64 VT1.5/LO DWDM Different 55 55


(NTK527xxE5)

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OC-n/STM-n circuit packs 1-23

Table 1-4 (continued)


1xOC-192/STM-64 circuit packs power consumptions

Circuit pack Order code Typical (W) Power Budget (W)


(see Note 1) (see Note 2)

1xOC-192/STM-64 STS-1/HO DWDM NTK526JAE5 44 44


C-Band AM1/AM2
1xOC-192/STM-64 STS-1/HO DWDM NTK526JBE5 44 44
L-Band

1xOC-192/STM-64 VT1.5/LO DWDM NTK527JAE5 55 55


C-Band AM1/AM2

1xOC-192/STM-64 VT1.5/LO DWDM NTK527JB 55 55


L-Band

Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

Table 1-5 lists the optical specifications for the OC-192/STM-64 circuit packs.

Table 1-5
Optical specifications for 1xOC-192/STM-64 circuit packs
Classification SR1/I64.1 IR2/S64.2 LR2/L64.2 LR2/L64.2
PEC NTK523BAE5 NTK523DAE5 NTK523FAE5 NTK523FBE5
NTK524BAE5 NTK524DAE5 NTK524FAE5 NTK524FBE5
Transmitter
Transmitter type DFB EML EML EML
Nominal wavelength 1310 nm 1550 nm 1533 nm 1557 nm
Wavelength range 1290 nm to 1530 nm to 1530.5 nm to 1554.5 nm to
1330 nm 1565 nm 1535.5 nm 1559.5 nm
Transmit output power (max) -1 dBm +2 dBm +5 dBm +5 dBm
Transmit output power (min) -6 dBm -1 dBm +1 dBm +1 dBm
Spectral width 1 nm 0.3 nm 0.3 nm 0.3 nm
Minimum side mode suppression ratio 30 dB 30 dB 30 dB 30 dB
Minimum extinction ratio 6 dB 8.2 dB 10 dB 10 dB
Tx power monitor accuracy +/- 2.5 dB +/- 2.5 dB +/- 2.5 dB +/- 2.5 dB
(see Note 2)

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1-24 OC-n/STM-n circuit packs

Table 1-5 (continued)


Optical specifications for 1xOC-192/STM-64 circuit packs
Classification SR1/I64.1 IR2/S64.2 LR2/L64.2 LR2/L64.2
Receiver
Receiver type PIN PIN APD APD
Wavelength range 1260 nm to 1260 nm to 1530 nm to 1530 nm to
1600 nm 1600 nm 1565 nm 1565 nm
Nominal wavelength 1310 nm 1550 nm 1550 nm 1550 nm
Receiver sensitivity -11 dBm -14 dBm -23.5 dBm -23.5 dBm
Receiver overload -1 dBm -1 dBm -6 dBm -6 dBm
Path penalty 1 dB 2 dB 2 dB 2 dB
Maximum receive reflectance -27 dB -27 dB -27 dB -27 dB
Rx power monitor accuracy +/- 2.5 dB +/- 2.5 dB +/- 2.5 dB +/- 2.5 dB
(see Note 2)
Optical path
Attenuation range 0 dB to 4 dB 3 dB to 11 dB 11 dB to22 dB 11 dB to22 dB
Nominal reach (see Note 3) 7 km 40 km 80 km 80 km
Maximum dispersion 23 ps/nm 800 ps/nm 1600 ps/nm 1600 ps/nm
Minimum optical return loss 14 dB 24 dB 24 dB 24 dB
Dispersion limited distance 7 km 47 km 94 km 94 km
(see Note 4) (assumes
dispersion
coefficient of
3.3 ps/nm/km)
Attenuation limited distance 11 km 44 km 88 km 88 km
(see Note 4)
Note 1: All parameter values in the table achieve an optical system BER better than 1x10-12 when used
over G.652 specified SMF-28 fiber.
Note 2: Power monitor accuracy figures are for normal operating range (minimum to maximum transmit
power, receiver sensitivity to overload).
Note 3: Nominal reach figures are for classification purposes only as defined in the appropriate
standards.
Note 4: The dispersion and attenuation limited distances are based on the dispersion and attenuation
coefficients detailed in “Dispersion and attenuation coefficients” on page 1-27 (unless otherwise stated)
and are for guidance only and must be verified by a full link budget calculation. The actual limiting
distance is the lower of the dispersion limited or attenuation limited distances.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
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OC-n/STM-n circuit packs 1-25

Table 1-6 lists the optical specifications for the 1xOC-192/STM-64 DWDM
circuit packs.

Table 1-6
Optical specifications for 1xOC-192/STM-64 DWDM circuit packs
Parameter Value
PEC NTK526xx and NTK527xx except
NTK526JA/JB, NTK527JB, and
NTK527JA (see Planning - Ordering
Information, 323-1851-151)
Transmitter
Transmitter type DFP laser with InP MZ modulator
Laser modulation IMDD NRZ
Wavelength range 1528.77 nm to 1564.68 nm (C-band)
1569.59 nm to 1605.74 nm (L-band)
(see Note 1)
Central wavelength accuracy +/- 0.04 nm
Transmit output power (max) +4.2 dBm
Transmit output power (min) +2.6 dBm
Spectral width 20 MHz Full Width Half Maximum
Minimum side mode suppression ratio 40 dB
Tx power monitor accuracy +/- 0.5 dB
Chirp polarity negative
Receiver
Receiver type APD (uncooled)
Wavelength range 1528.77 nm to 1605.74 nm
Receiver sensitivity at OSNR >= 21 dB (C-band) or -23 dBm (see Note 2)
22 dB (L-band) (see Note 3)
Receiver overload -8
Path penalty Included in receiver sensitivity figures
Rx power monitor accuracy +/- 1 dB

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Table 1-6 (continued)


Optical specifications for 1xOC-192/STM-64 DWDM circuit packs
Parameter Value
Optical path
Attenuation range 12 to 25 dB
Nominal reach (see Note 5) 110 km
Maximum dispersion 2000 ps/nm (Note 4)
(565, 5100 and 5200 Advanced Services Platform
System Optimized PECs)
Maximum dispersion -300 to 1850 ps/nm
(Common Photonic Layer System Optimized PECs)
Minimum optical return loss 27 dB
Dispersion limited distance (see Note 6) 110 km (C-band) - 565, 5100 and 5200
Advanced Services Platform systems
100 km (C-band) - Common Photonic
Layer systems
100 km (L-band)
Attenuation limited distance (see Note 6) 100 km (25 dB at 0.25 dB/km)
Note 1: Refer to Planning - Ordering Information, 323-1851-151 for a list of supported
wavelengths and PECs.
Note 2: The sensitivity level is the minimum optical power for which the interface meets an
corrected bit-error-rate of 10-15 with FEC on.
Note 3: Quoted OSNRs are as measured using 0.1 nm resolution bandwidth.
Note 4: Refer to the 565, 5100 and 5200 Advanced Services Platform documentation for link
engineering and e10G modeling using the Network Modeling Tool (NMT).
Note 5: Nominal reach figures are for classification purposes only as defined in the appropriate
standards.
Note 6: The dispersion and attenuation limited distances are based on the dispersion and
attenuation coefficients detailed in “Dispersion and attenuation coefficients” on page 1-27 and are
for guidance only and must be verified by a full link budget calculation. The actual limiting distance
is the lower of the dispersion limited or attenuation limited distances.

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Dispersion and attenuation coefficients


The following assumptions were made when calculating the dispersion and
attenuation limited distances quoted in the optical specifications:
• NSDF fiber plant is being used
• dispersion and attenuation coefficient are as listed in Table 1-7.
Table 1-7
Optical specifications - assumed dispersion and attenuation coefficient
Wavelength

1310 nm 1550 nm + C-band L-band

Dispersion coefficient 6.0 17.0 20.0


(ps/nm/km)

Attenuation coefficient 0.35 0.25 0.25


(dB/km)

Note 1: The dispersion and attenuation limited distances quoted in the


optical specifications are based on the dispersion and attenuation
coefficients detailed in Table 1-7 and are for guidance only and must be
verified by a full link budget calculation. The actual limiting distance is the
lower of the dispersion limited or attenuation limited distances.
Note 2: The DWDM values quoted in the optical specifications are for
information only. To design a DWDM network, refer to OnePlanner for
Common Photonic Layer and 6500 DWDM networks and Network
Modeling Tool (NMT) for 565, 5100 and 5200 Advanced Services Platform
CWDM and DWDM networks.

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Table 1-8 lists the optical specifications for the 1xOC-192/STM-64 AM1/AM2
DWDM tunable HO and 1xOC-192/STM-64 AM1/AM2 DWDM tunable LO
circuit pack circuit packs.

Table 1-8
Optical specifications for 1xOC-192/STM-64 DWDM tunable circuit packs
Parameter Value
PEC NTK526JAE5 (1xOC-192/STM-64
STS-1/HO DWDM C-Band AM1/AM2)
PEC NTK527JAE5 (1xOC-192/STM-64
VT1.5/LO DWDM C-Band AM1/AM2)
PEC NTK526JBE5 (1xOC-192/STM-64
STS-1/HO DWDM L-Band)
PEC NTK527JB (1xOC-192/STM-64 VT1.5/LO
DWDM L-Band)
Transmitter
Connector type LC
Laser modulation IMDD NRZ
Laser spectral width < 20 MHz
Line rate 10.709 Gbit/s
Tunable wavelength range • NTK526JAE5 and NTK527JAE5:
1528.77 nm to 1565.09 nm
• NTK526JBE5 and NTK527JB: 1569.59
nm to 1605.74 nm
(see “DWDM wavelengths” on page 1-29
for a list of supported wavelengths)
Tunable wavelength spacing • NTK526JAE5 and NTK527JAE5: 50 GHz
• NTK526JBE5 and NTK527JB: 50 GHz
Central Wavelength Accuracy 0.02 nm
Transmit output power • NTK526JAE5 and NTK527JAE5:
-10 to 1.5 dBm (if the Tx AM Format is set
to "AM1")
-10 to 3.1 dBm (if the Tx AM Format is set
to anything other than "AM1")
• NTK526JBE5 and NTK527JB:
3.1 dBm (typical)
Tx power monitor accuracy +/- 0.5 dB
Electronic dispersion compensation range N/A
Chirp polarity Positive or negative for NTK526JAE5 and
NTK527JAE5
Negative for NTK526JBE5 and NTK527JB

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Table 1-8 (continued)


Optical specifications for 1xOC-192/STM-64 DWDM tunable circuit packs
Parameter Value
Receiver
Connector type LC
Wavelength range wide band
Receiver sensitivity, BER not worse than 1E-12 -25 dBm (post-SCFEC)
Receiver sensitivity, BER not worse than 1E-15 Not Determined

Receiver overload 7 dBm (see Note 1)


Receiver damage level 10 dBm
Rx Power monitor accuracy +/- 2 dB and +/- 3 dB
(see Note 2)
Chromatic dispersion tolerance over NDSF fiber and 100 km (estimated) for NTK526JBE5 and
with OSNR > 22dB NTK527JB
110 km (estimated) for NTK526JAE5 and
NTK527JAE5
Note 1: Although the receiver overload threshold is set at 8.5 dBm in Site Manager, the physical
power at the input of the receiver that can be guaranteed is 7 dBm and must not be exceeded.
Note 2: The power monitor accuracy on line side receiver is +/- 2 dB within the operating range
(+7 to -25 dBm) and +/- 3 dB outside the operating range (-25 to -28 dBm and +9 to 7 dBm).

DWDM wavelengths
Table 1-9 lists the DWDM frequencies and wavelengths for the 10G HO/LO
DWDM tunable C-band AM1/AM2 (NTK526JAE5 and NTK527JAE5) circuit
packs supporting tunable transmitters in 50 GHz spacing.
Table 1-9
DWDM C-band wavelengths (50 GHz spacing)
Frequency Wavelength Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm) (THz) (nm)
196.10 1528.77 195.10 1536.61 194.10 1544.53
196.05 1529.16 195.05 1537.00 194.05 1544.92
196.00 1529.55 195.00 1537.40 194.00 1545.32
195.95 1529.94 194.95 1537.79 193.95 1545.72
195.90 1530.33 194.90 1538.19 193.90 1546.12
195.85 1530.72 194.85 1538.58 193.85 1546.52
195.80 1531.12 194.80 1538.98 193.80 1546.92
195.75 1531.51 194.75 1539.37 193.75 1547.32
195.70 1531.90 194.70 1539.77 193.70 1547.72

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Table 1-9 (continued)


DWDM C-band wavelengths (50 GHz spacing)
Frequency Wavelength Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm) (THz) (nm)
195.65 1532.29 194.65 1540.16 193.65 1548.11
195.60 1532.68 194.60 1540.56 193.60 1548.51
195.55 1533.07 194.55 1540.95 193.55 1548.91
195.50 1533.47 194.50 1541.35 193.50 1549.32
195.45 1533.86 194.45 1541.75 193.45 1549.72
195.40 1534.25 194.40 1542.14 193.40 1550.12
195.35 1534.64 194.35 1542.54 193.35 1550.52
195.30 1535.04 194.30 1542.94 193.30 1550.92
195.25 1535.43 194.25 1543.33 193.25 1551.32
195.20 1535.82 194.20 1543.73 193.20 1551.72
195.15 1536.22 194.15 1544.13 193.15 1552.12
193.10 1552.52 192.50 1557.36 191.90 1562.23
193.05 1552.93 192.45 1557.77 191.85 1562.64
193.00 1553.33 192.40 1558.17 191.80 1563.05
192.95 1553.73 192.35 1558.58 191.75 1563.45
192.90 1554.13 192.30 1558.98 191.70 1563.86
192.85 1554.54 192.25 1559.39 191.65 1564.27
192.80 1554.94 192.20 1559.79 191.60 1564.68
192.75 1555.34 192.15 1560.20 191.55 1565.09
192.70 1555.75 192.10 1560.61
192.65 1556.15 192.05 1561.01
192.60 1556.55 192.00 1561.42
192.55 1556.96 191.95 1561.83

Table 1-10 on page 1-31 lists the DWDM L-band frequencies and wavelengths
for the following circuit packs supporting tunable transmitters in 50 GHz
spacing:
• 10G HO DWDM L-band tunable (NTK526JBE5)
• 10G VT1.5/LO DWDM L-band tunable (NTK527JB)

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Table 1-10
DWDM L-band wavelengths (50 GHz spacing)
Frequency Wavelength Frequency Wavelength Frequency Wavelength
(THz) (nm) (THz) (nm) (THz) (nm)
191.00 1569.59 189.40 1582.85 187.80 1596.34
190.95 1570.01 189.35 1583.27 187.75 1596.76
190.90 1570.42 189.30 1583.69 187.70 1597.19
190.85 1570.83 189.25 1584.11 187.65 1597.62
190.80 1571.24 189.20 1584.53 187.60 1598.04
190.75 1571.65 189.15 1584.95 187.55 1598.47
190.70 1572.06 189.10 1585.36 187.50 1598.89
190.65 1572.48 189.05 1585.78 187.45 1599.32
190.60 1572.89 189.00 1586.20 187.40 1599.75
190.55 1573.30 188.95 1586.62 187.35 1600.17
190.50 1573.71 188.90 1587.04 187.30 1600.60
190.45 1574.13 188.85 1587.46 187.25 1601.03
190.40 1574.54 188.80 1587.88 187.20 1601.46
190.35 1574.95 188.75 1588.30 187.15 1601.88
190.30 1575.37 188.70 1588.73 187.10 1602.31
190.25 1575.78 188.65 1589.15 187.05 1602.74
190.20 1576.20 188.60 1589.57 187.00 1603.17
190.15 1576.61 188.55 1589.99 186.95 1603.60
190.10 1577.03 188.50 1590.41 186.90 1604.03
190.05 1577.44 188.45 1590.83 186.85 1604.46
190.00 1577.86 188.40 1591.26 186.80 1604.88
189.95 1578.27 188.35 1591.68 186.75 1605.31
189.90 1578.69 188.30 1592.10 186.70 1605.74
189.85 1579.10 188.25 1592.52
189.80 1579.52 188.20 1592.95
189.75 1579.93 188.15 1593.37
189.70 1580.35 188.10 1593.79
189.65 1580.77 188.05 1594.22
189.60 1581.18 188.00 1594.64
189.55 1581.60 187.95 1595.06
189.50 1582.02 187.90 1595.49
189.45 1582.44 187.85 1595.91

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Latency
Table 1-11 shows the latency specifications for 1xOC-192/STM-64 circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).

Table 1-11
Latency for 1xOC-192/STM-64 circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn/ XC→
OTM2→ XC OCn/STMn/
OTM2
1xOC-192/STM-64 STS-1/HO IR2/S64.2 NTK523DA 5 5
1xOC-192/STM-64 STS-1/HO LR2/L64.2 1557 nm NTK523FB 5 5
1xOC-192/STM-64 VT1.5/LO LR2/L64.2 1557 nm NTK524FB 5 (see Note 2) 5
1xOC-192/STM-64 VT1.5/LO SR1/I64.1 NTK524BA 5 (see Note 2) 5
1xOC-192/STM-64 STS-1/HO SR1/I64.1 NTK523BA 5 5
1xOC-192/STM-64 STS-1/HO LR2/L64.2 1533 nm NTK523FA 5 5
1xOC-192/STM-64 STS-1/HO DWDM (different NTK526xx 6 (see Note 3) 6
wavelengths)
1xOC-192/STM-64 VT1.5/LO DWDM (different NTK527xx 6 (see 6
wavelengths) Note 3 and
Note 4)
1xOC-192/STM-64 VT1.5/LO IR2/S64.2 NTK524DA 5 (see Note 2) 5
1xOC-192/STM-64 VT1.5/LO LR2/L64.2 1533 nm NTK524FA 5 (see Note 2) 5
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
Note 3: For an OTM2 facility, the typical OTM2 to XC latency for STS-1, STS-Nc, LO_VC3 and HO
paths is as follows: OTM2 with FEC Off is 6 µs, OTM2 with RS8 FEC is 13 µs and OTM2 with SCFEC
is 50 µs.
Note 4: For an OTM2 facility, the typical OTU2 to XC latency for LO VT1.5, VT2, VC11 and VC12 paths
is as follows: OTM2 with FEC Off is 18 µs, OTM2 with RS8 FEC is 24 µs and OTM2 with SCFEC is 61 µs.

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2xOC-48/STM-16 circuit packs (NTK516BAE5 and NTK517BAE5,


NTK519BAE5 and NTK520BAE5)
Overview
The 2xOC-48/STM-16 circuit pack supports both OC-48 (SONET) and
STM-16 (SDH) services and the 6500 supports the following SFP and DPO
variants of the 2xOC-48/STM-16 circuit packs:
• SFP variant for short reach, intermediate reach, long reach, CWDM, and
DWDM applications. VT1.5/Low Order (LO) and STS-1/High Order (HO)
versions are available for this variant (NTK516BAE5 and NTK517BAE5).
• DPO variant for DWDM applications (NTK519BAE5 and NTK520BAE5)

The DWDM SFPs and DPOs support ITU-T DWDM compliant wavelengths as
follows:
• 40 wavelengths for interworking with the Common Photonic Layer
equipment and 6500 Photonic layers.
• 16 wavelengths on the 200GHz grid and 32 wavelengths on the 100 GHz
grid for interworking with the 565, 5100 and 5200 Advanced Services
Platform DWDM optical multiplexer (OMX).

VT1.5/LO and STS-1/HO circuit packs


There are two versions of the 2xOC-48/STM-16 circuit packs:
• VT1.5/Low Order (LO)
These circuit packs support VT1.5/VC11, VT2/VC12, and above switching
granularity (including LO_VC3).
• STS-1/High Order (HO)
These circuit packs support STS1/HO_VC3/VC4 and above switching
granularity.

To use the VT1.5/VC11 and VT2/VC12 granularity, both the optical interface
circuit packs and the cross-connect circuit packs must support VT.15/VC11
and VT2/VC12 switching granularity.

Note: The LO circuit packs can achieve LO switching granularity provided


that the shelf in which they are equipped is equipped with LO
cross-connect circuit packs. The LO circuit packs can achieve LO_VC3
switching granularity on HO cross-connect circuit pack when using the
240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+ STS-1/VC-3
(640/0G) (NTK610BBE5) cross-connect circuit packs.

Figure 1-11 shows the faceplate of a 2xOC-48/STM-16 circuit pack. Figure


1-12 on page 1-35 to Figure 1-15 on page 1-38 show the functional block
diagrams of 2xOC-48/STM-16 circuit packs.

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Figure 1-11
2xOC-48/STM-16 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
OC-48/STM-16 OC-48/STM-16
STS-1/HO STS-1/HO
2 Ports SFP 2 Ports SFP

Fail Fail

Ready Ready Green rectangle (Ready)


In Use In Use

- Used to communicate hardware or software functional state


- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off

Blue diamond (In Use)


- Used to communicate whether circuit pack can be extracted
1 Tx 1
(on->no pull, off->can be pulled)
Rx - Equipment in-service = LED on; Equipment out-of-service = LED off
2 Tx

Rx

Red/yellow bi-color circle (Fail/LOS)


- Used to communicate Rx Loss of Signal/optical module (SFP/DPO) fail
- Red = module fail; Yellow = Rx Loss of Signal

Transmit/receive SFP dual LC connector


2

Hazard Hazard
level: level:
R99

R99
EEEEE99999

EEEEE99999
S/N NT030MEE9999E

S/N NT030MEE9999E

Transmit/receive DPO dual LC connector


NTUD99EE

NTUD99EE

Type A Type A

SFP DPO

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Figure 1-12
2xOC-48/STM-16 circuit pack block diagram (NTK516BAE5)

XC
SFP 1

5G SONET/SDH OHP

SFP 2
XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-13
2xOC-48/STM-16 circuit pack block diagram (NTK517BAE5)

XC
SFP 1

VT/TU processor 5G SONET/SDH OHP

SFP 2
XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-14
2xOC-48/STM-16 circuit pack block diagram (NTK519BAE5)

XC
DPO 1

5G SONET/SDH OHP

DPO 2
XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-15
2xOC-48/STM-16 circuit pack block diagram (NTK520BAE5)

XC
DPO 1

VT/TU processor 5G SONET/SDH OHP

DPO 2
XC
Backplane

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Supported functionality
The 2xOC-48/STM-16 circuit pack provides the following functionality.
• up to two pluggable (SFP or DPO) 2.5G interfaces (ports 1 and 2)
• OC-48 (SONET) and STM-16 (SDH) services
• terminates section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable (default is Off)
• line/MS DCC for SONET/SDH Control Plane
• monitors optical power input and output on all circuit pack types
• selectable automatic laser shut off controlled by software
• automatic detection/provisioning of SFP and DPO modules, which are hot
pluggable.
• unprotected, 2-Fiber BLSR/MS-SPRing, 1+1/MSP linear, and
UPSR/SNCP traffic protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports Control Plane (OC48/STM16 facility is supported as both
add/drop Control Plane facility and Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.

Cross-connection types
The 2xOC-48/STM-16 circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled

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Cross-connection rates
The 2xOC-48/STM-16 circuit packs support the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11, VT2/VC12, STS1/LO VC3
(VT1.5/LO circuit packs only)
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rated of STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
and STS48c/VC4-16c
• auto concatenated rates of STS1/VC3, STS3c/VC4, STS12c/VC4-4c, and
STS48c/VC4-16c

Supported SFPs/DPOs
Table 1-12 provides a list of the SFPs that are supported on the
2xOC-48/STM-16 circuit pack. Table 1-13 provides a list of the DPOs that are
supported on the 2xOC-48/STM-16 circuit pack.

Table 1-12
Supported SFP modules for the 2xOC-48/STM-16 circuit packs (NTK516BAE5 and NTK517BAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

P2G5 OC48/STM16 SR/IR/LR SFPs NTTP03BF,


— OC48/STM16 (auto), AD — OC-48/STM-16 (2.48832 Gb/s) NTTP03CF,
NTTP03EF,
NTTP03FF

OC-48/STM-16 DWDM SFPs NTK585xx where


— OC-48/STM-16 (2.48832 Gb/s) xx= see Note 2

PCWDMS 155M/622M/2.5G CWDM SFPs NTK590xH where


— OC48/STM16 (auto), AD — OC-3/STM-1 (155.52Mb/s) x= L, M, N, P, Q,
R, S, T
— OC-12/STM-4 (622.08Mb/s)
— OC-48/STM-16 (2.48832 Gb/s)

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “OC-48/STM-16
DWDM small form-factor (SFP) pluggable modules”, for the complete list of ordering codes.

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Table 1-13
Supported DPO modules for the 2xOC-48/STM-16 circuit packs (NTK519BAE5 and NTK520BAE5)
Pluggable Equipment and Supported DPO modules and rates Part Number
Facilities (Note 1)

P2G5 OC-48/STM-16 DWDM DPO NTK580xx where


— OC48/STM16 (auto), AD — OC-48/STM-16 (2.48832 Gb/s) xx= see Note 2

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: Refer to Planning - Ordering Information, 323-1851-151, Chapter 7: Table “DWDM pluggable
optic modules (DPO) (manufacture discontinued)”, for the complete list of ordering codes.

Performance monitoring
The 2xOC-48/STM-16 circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-48/STM-16 facilities
• PM collection for STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and
STS48c/VC4-16c concatenated payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed

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• Cold Restart Required: FPGA Changed


• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Packet Rate Limit Exceeded
• Provisioning Incompatible

Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

OCn/STMn facility alarms


• Loss Of Signal
• Loss Of Frame
• AIS
• Trace Identifier Mismatch
• Signal Fail
• Signal Degrade
• RFI
• SECTION DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• LINE DCC Link Failure
• SECTION DCC OSPF Adjacency Loss
• Loopback Active
• Protection Scheme Mismatch
• Protection Mode Mismatch
• Protection Switch Byte Fail
• Protection Channel Match Fail
• Auto Protection Switch Acknowledge Time Out
• Protection Exerciser Failed

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• Ring Protection Switch Complete


• Forced Ring Switch Active
• Manual Ring Switch Active
• Lockout Protection Active
• Lockout Working Ring Active
• Protection Switch Complete
• Forced Switch Active
• Lockout Active
• Far End Protection Line Fail
• Protection Default K-bytes
• Protection Invalid K-bytes
• Node Id Mismatch
• Ring Protection Switch Fail

Path alarms (STS & VT)


• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer
• Loopback Active - Facility
• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Traffic Squelched
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F

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• Test Access in Progress - Split EF


• Unequipped

Control Plane alarms


• Remote Node Unreachable (OSRP line level)
• Configuration Mismatch
• Configuration Mismatch - Common ID
• Configuration Mismatch - Primary State

Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)

Equipping rules
The following equipping rules apply to 2xOC-48/STM-16 circuit packs:
• is a single-slot two-port interface
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot


packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.

• is not supported in a 7-slot optical shelf type (NTK503PAE5 or


NTK503KA).
• cannot be equipped in a 6500-7 packet-optical shelf type (NTK503RA) in
this release.
• is not supported in a 2-slot shelf type

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Technical specifications
Table 1-14 lists the weight, power consumption, and SFP/DPO specifications
for 2xOC-48/STM-16 circuit packs.

Table 1-14
Technical specifications for 2xOC-48/STM-16 circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
2xOC-48/STM-16 STS-1/HO SFP NTK516BAE5 1.3 kg (2.9 lb) 31 31
circuit pack
2xOC-48/STM-16 VT1.5/LO SFP NTK517BAE5 1.3 kg (2.9 lb) 40 40
circuit pack
2xOC-48/STM-16 STS-1/HO DPO NTK519BAE5 1.3 kg (2.9 lb) 32 32
circuit pack
2xOC-48/STM-16 VT1.5/LO DPO NTK520BAE5 1.3 kg (2.9 lb) 32 32
circuit pack
SFP/DPO specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For the circuit packs that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-48/STM-16 SFP and DPO optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”

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Latency
Table 1-15 shows the latency specifications for 2xOC-48/STM-16 circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).

Table 1-15
Latency for 2xOC-48/STM-16 circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn→ XC→
XC OCn/STMn
2xOC-48/STM-16 STS-1/HO SFP NTK516BA 5 5
2xOC-48/STM-16 STS-1/HO DPO NTK519BA 5 5
2xOC-48/STM-16 VT1.5/LO SFP NTK517BA 5 (see Note 2) 5
2xOC-48/STM-16 VT1.5/LO DPO NTK520BA 5 (see Note 2) 5
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.

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8xOC-3/12/STM-1/4 circuit packs (NTK513MAE5 and NTK513DAE5)


Overview
The 6500 supports OC-3/STM-1 or OC-12/STM-4 per port and is selectable
through software. The same circuit pack supports OC-3/12 (SONET),
STM-1/4 (SDH), and STM-1J/4J (SDH-J) services.

The 8xOC-3/12/STM-1/4 circuit pack uses SFP optics for short reach,
intermediate reach, long reach, and CWDM applications or an STM-1e SFP
for intra-office applications. VT1.5/Low Order (LO) and STS-1/High Order
(HO) versions are available for 8xOC-3/12/STM-1/4 circuit packs
(NTK513DAE5 and NTK513MAE5).

Note: If the external synchronization mode is SDH-J and the use of the
64 kHz ESI or 6 MHz ESO ports is required, the following releases of the
cross-connect circuit packs are required:
- NTK557AA/BA: Release 08 or higher
- NTK557EAE5/GAE5: Release 01 or higher
- NTK557ES/GS: Release 01 or higher
- NTK557NA/PA/QA: Release 04 or higher
- NTK557TB: Release 01 or higher
- NTK557AA/BA: Release 05A, 06B
- NTK557NA/PA/QA: Release 02A
The 02A, 05A, and 06B releases are cross-connect circuit packs that have
been upgraded as a result of a return/repair operation.
Since the introduction of the SDH-J mode in 6500, only circuit packs
meeting the above criteria are being manufactured and shipped.

There are two versions of the 8xOC-3/12/STM-1/4 circuit packs:


• VT1.5/Low Order (LO)
These circuit packs support VT1.5/VC11, VT2/VC12, and above switching
granularity (including LO_VC3).
• STS-1/High Order (HO)
These circuit packs support STS1/HO_VC3/VC4 and above switching
granularity.
To use the VT1.5/VC11 and VT2/VC12 granularity, both the optical interface
circuit packs and the cross-connect circuit packs must support VT.15/VC11
and VT2/VC12 switching granularity.

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Note: The LO circuit packs can achieve LO switching granularity provided


that the shelf in which they are equipped is equipped with LO
cross-connect circuit packs. The LO circuit packs can achieve LO_VC3
switching granularity on HO cross-connect circuit pack when using the
240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+ STS-1/VC-3
(640/0G) (NTK610BBE5) cross-connect circuit packs.

Figure 1-16 shows the faceplate of a 8xOC-3/12/STM-1/4 circuit pack. Figure


1-17 on page 1-49 and Figure 1-18 on page 1-50 show the functional block
diagrams of 8xOC-3/12/STM-1/4 circuit packs.

Figure 1-16
8xOC-3/12/STM-1/4 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
OC-3/12/STM-1/4
STS-1/HO
8 Ports SFP

Fail

Ready
- Card not failed = LED off, Card failed = LED on
In Use

Green rectangle (Ready)


- Used to communicate hardware or software functional state
1 Tx - Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Rx

2 Tx

Rx
Blue diamond (In Use)
3 Tx
- Used to communicate whether circuit pack can be extracted
Rx (on->no pull, off->can be pulled)
4 Tx - Equipment in-service = LED on; Equipment out-of-service = LED off
Rx

5 Tx

Rx Red/yellow bi-color circle (Fail/LOS)


6 Tx - Used to communicate Rx Loss of Signal/optical module fail
Rx
- Red = module fail; Yellow = Rx Loss of Signal
7 Tx

Rx

8 Tx

Rx

Hazard
level: Transmit/receive SFP dual LC connector
or dual 1.0/2.3 mm coaxial connector
R99
EEEEE99999
S/N NT030MEE9999E

NTUD99EE

Type A

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Figure 1-17
8xOC-3/12/STM-1/4 circuit pack block diagram (NTK513MAE5)

XC
SFP 1

SFP 2

SFP 3

SFP 4
5G SONET/SDH OHP

SFP 5
Backplane

SFP 6

SFP 7

XC
SFP 8

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-18
8xOC-3/12/STM-1/4 circuit pack block diagram (NTK513DAE5)

XC
SFP 1

SFP 2

SFP 3

SFP 4
5G SONET/SDH OHP
VT/TU processor
SFP 5
Backplane

SFP 6

SFP 7

XC SFP 8

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Supported functionality
The 8xOC-3/12/STM-1/4 circuit pack provides the following functionality.
• up to eight pluggable (SFP) 155M/622M interfaces (ports 1 to 8)
• OC-3/12 (SONET), STM-1/STM-4 (SDH), or STM-1J/4J (SDH-J) services
• per port selectable to OC-3/STM-1/STM-1J or OC-12/STM-4/STM-4J
• auto-detection of SFP modules, which are hot pluggable
• auto provisioning of facilities at OC-3/STM-1 or OC-12/STM-4 specific
SFPs
• manual provisioning of facilities at SFPs that support both OC-3/STM-1
and OC12/STM4 facility types. For example, since the IR-1/S1.1_S4.1
OC-3/12/STM-1/4 SFP supports both OC-3/STM-1 and OC12/STM4
facility types, the user must manually provision an OC-3/STM-1 or
OC-12/STM-4.
• terminates section/RS and line/MS overhead
— terminates section/RS and line/MS overhead bytes in Rx direction
— inserts section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC selectable (default is Off). Section/RS
DCC can be enabled on all ports, line/MS DCC can be enabled on any two
ports
• optical power input and output monitoring on all circuit pack types (optical
power is not applicable to STM-1e SFPs)
• selectable automatic laser shut off controlled by software. For STM-1e
SFPs, you must ensure that automatic laser shut off is disabled (see
Part 1 of Configuration - Provisioning and Operating, 323-1851-310).
• unprotected, 1+1/MSP linear, and UPSR/SNCP traffic protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports Control Plane (OC3/OC12/STM1/STM4 facility is only supported
as add/drop Control Plane facility and not Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.

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Cross-connection types
The 8xOC-3/12/STM-1/4 circuit pack supports the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled

Cross-connection rates
The 8xOC-3/12/STM-1/4 circuit pack supports the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11, VT2/VC12, STS1/LO VC3
(VT1.5/LO circuit packs only)
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rates of STS3c and STS12c/VC4-4c for OC-12/STM-4
• auto concatenated rates of STS1/VC3 and STS3c/VC4

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Supported SFPs
Table 1-16 provides a list of the SFPs that are supported on the
8xOC-3/12/STM-1/4 circuit pack.

Table 1-16
Supported SFP modules for the 8xOC-3/12/STM-1/4 circuit packs (NTK513DAE5 and
NTK513MAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)
P155M OC-3/STM-1 SR-0 (multimode) 1310 nm SFP NTTP02AD
— OC3/STM1/STM1J (auto), — OC-3/STM-1 (155.52Mb/s)
AD
OC-3/STM-1 SR1/I1 1310 nm SFP NTTP02BF
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 IR1/S1.1 1310 nm SFP NTTP02CD
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 LR1/L1.1 1310 nm SFP NTTP02ED
— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 LR2/L1.2 1550 nm SFP NTTP02FF


— OC-3/STM-1 (155.52Mb/s)
STM-1e SFP NTTP60AE
— STM-1e (155.52Mbps)

P622M OC-12/STM-4 LR1/L4.1 1310 nm SFP NTTP05EF


— OC12/STM4/STM4J (auto), — OC-12/STM-4 (622.08Mb/s)
AD
OC-12/STM-4 LR2/L4.2 1550 nm SFP NTTP05FF
— OC-12/STM-4 (622.08Mb/s)

P155622M OC-3/12/STM-1/4 SR1/I1.1_I4.1 1310 nm SFP NTTP04BF


— OC3/OC12/STM1/STM4/STM — OC-3/STM-1 (155.52Mb/s)
1J/STM4J, AD — OC-12/STM-4 (622.08Mb/s)

OC-3/12/STM-1/4 IR1/S1.1_S4.1 1310 nm XCT NTTP04CDE6


Enhanced SFPs and NTTP04CF
— OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)

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Table 1-16 (continued)


Supported SFP modules for the 8xOC-3/12/STM-1/4 circuit packs (NTK513DAE5 and
NTK513MAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

PCWDMS 155M/622M/2.5G CWDM SFPs NTK590xH where


— OC3/OC12/STM1/STM4/STM — OC-3/STM-1 (155.52Mb/s) x= L, M, N, P, Q,
1J/STM4J, AD R, S, T
— OC-12/STM-4 (622.08Mb/s)
— OC-48/STM-16 (2.48832 Gb/s)
Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.

Performance monitoring
The 8xOC-3/12/STM-1/4 circuit pack supports the following monitored
entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-3/STM-1/STM-1J,
STM-1e, and OC-12/STM-4/STM-4J facilities
• PM collection for SONET path (P)/SDH path (P) for OC-3/STM-1/STM-1J
and OC-12/STM-4/STM-4J facilities
• PM collection for STS3c/VC4, and STS12c/VC4-4c concatenated
payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration, except for STM-1e
facilities
• Physical layer PM collection, except for STM-1e facilities

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Packet Rate Limit Exceeded
• Provisioning Incompatible
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

OCn/STMn facility alarms


• AIS
• Auto Protection Switch Acknowledge Time Out
• DSM-Host Misconnection
• Facility Reconfiguration Required
• Forced Switch Active
• Far End Protection Line Fail
• LINE DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• Loss Of Signal

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• Loss Of Frame
• Lockout Active
• Loopback Active
• Protection Scheme Mismatch
• Protection Mode Mismatch
• Protection Switch Byte Fail
• Protection Channel Match Fail
• Protection Exerciser Failed
• Protection Switch Complete
• Protection Locked
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC Link Failure
• SECTION DCC OSPF Adjacency Loss
• Trace Identifier Mismatch
Path alarms (STS & VT)
• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer
• Loopback Active - Facility
• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E

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• Test Access in Progress - Split F


• Test Access in Progress - Split EF
• Unequipped

Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)

Equipping rules
The following equipping rules apply to 8xOC-3/12/STM-1/4 circuit packs:
• is a single-slot eight-port interface.
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot


packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.

• is not supported in a 7-slot optical shelf type (NTK503PAE5 or


NTK503KA).
• cannot be equipped in a 6500-7 packet-optical shelf type (NTK503RA) in
this release.
• is not supported in a 2-slot shelf type.

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Technical specifications
Table 1-17 lists the weight, power consumption, and SFP specifications for
8xOC-3/12/STM-1/4 circuit packs.

Table 1-17
Technical specifications for 8xOC-3/12/STM-1/4 circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
8xOC-3/12/STM-1/4 STS-1/HO SFP NTK513MAE5 1.2 kg (2.6 lb) 27 27
8xOC-3/12/STM-1/4 VT1.5/LO SFP NTK513DAE5 1.2 kg (2.6 lb) 29 29
SFP specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
— “Electrical specifications”

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Latency
Table 1-18 shows the latency specifications for 8xOC-3/12/STM-1/4 circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).

Table 1-18
Latency for 8xOC-3/12/STM-1/4 circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn→ XC→
XC OCn/STMn
8xOC-3/12/STM-1/4 STS-1/HO NTK513MAE5 5 5
8xOC-3/12/STM-1/4 VT1.5/LO SFP NTK513DAE5 5 (see Note 2) 5
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.

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16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5,


NTK512GAE5, NTK513GAE5)
Overview
The 16xOC-n/STM-n is a multirate optical OC-n/STM-n circuit pack (MRO)
that uses OC-3/STM-1, OC-12/STM-4, or OC-48/STM-16 SFP optics with up
to 5 or 10 Gbit/s of switching capacity for short reach, intermediate reach, long
reach, CWDM, and DWDM variants applications or an STM-1e SFP for
intra-office applications.

This release of 6500 offers the following variants of 16xOC-n/STM-n circuit


pack:
• 5G version (also referred to as 16xOC-n/STM-n 5G) offered in two types:
— 16xOC-n/STM-n 5G STS-1/HO SFP circuit pack (NTK512FAE5)
— 16xOC-n/STM-n 5G VT1.5/LO SFP circuit pack (NTK513FAE5)
The 16xOC-n/STM-n 5G circuit pack supports both OC-3 or OC-12
(SONET) and STM-1 or STM-4 (SDH) services.
• 10G version (also referred to as 16xOC-n/STM-n 10G) offered in two
types:
— 16xOC-n/STM-n 10G STS-1/HO SFP circuit pack (NTK512GAE5)
— 16xOC-n/STM-n 10G VT1.5/LO SFP circuit pack (NTK513GAE5)
The 16xOC-n/STM-n 10G circuit pack supports OC-3, OC-12, or OC-48
(SONET) and STM-1, STM-4, or STM-16 (SDH) services.

The DWDM SFPs in 16xOC-n/STM-n 10G support ITU-T DWDM compliant


wavelengths as follows:
• 40 wavelengths for interworking with the Common Photonic Layer
equipment and 6500 Photonic layers.
• 16 wavelengths on the 200GHz grid and 32 wavelengths on the 100GHz
grid for interworking with the 565, 5100 and 5200 Advanced Services
Platform DWDM optical multiplexer (OMX).

There are two versions of the 16xOC-n/STM-n 5G and 16xOC-n/STM-n 10G


circuit packs:
• VT1.5/Low Order (LO)
This circuit pack supports VT1.5/VC11, VT2/VC12, and above switching
granularity (including LO_VC3).
• STS-1/High Order (HO)
This circuit pack supports LO_VC3, STS1/HO_VC3/VC4, and above
switching granularity.

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To use LO_VC3, VT1.5/VC11, and VT2/VC12 granularity, both the optical


interface circuit packs and the cross-connect circuit packs must support the
required switching granularity.

Note: The MRO LO circuit packs can achieve LO switching granularity


provided that the shelf in which they are equipped is equipped with
compatible cross-connect circuit packs. The MRO LO circuit packs can
achieve LO_VC3 switching granularity on HO cross-connect circuit pack
when using the 240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+
STS-1/VC-3 (640/0G) (NTK610BBE5) cross-connect circuit packs.

Figure 1-19 on page 1-61 shows an example of the faceplate of the


16xOC-n/STM-n circuit pack and Figure 1-20 on page 1-62 to Figure 1-23 on
page 1-65 show the functional block diagrams of 16xOC-n/STM-n circuit
packs.

Figure 1-19
16xOC-n/STM-n circuit pack faceplate

OC-n/STM-n
5G VT1.5/LO
16 Ports SFP
Red triangle (Fail)
1
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
2
Green rectangle (Ready)
- Used to communicate hardware or software functional state
3 T
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
R

4 T

R Blue diamond (In Use)


5 T
- Used to communicate whether circuit pack can be extracted
R (on->no pull, off->can be pulled)
6 T - Equipment in-service = LED on; Equipment out-of-service = LED off
R

7 T

R
Red/yellow bi-color circle (Fail/LOS)
8 T

R
- Used to communicate Rx Loss of Signal/optical module fail
- Red = module fail; Yellow = Rx Loss of Signal
9 T

10 T

11 T

R
Transmit/receive SFP dual LC connector
12 T
or dual 1.0/2.3 mm coaxial connector
R

13 T

14 T

Rz

15

16

NTK513FAE5

Type A

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Figure 1-20
16xOC-n/STM-n circuit pack block diagram (NTK512FAE5)

XC
SFP 1
SFP 2
SFP 3
SFP 4

SFP 5

SFP 6
Backplane

SFP 7
5G SONET/SDH OHP
SFP 8

SFP 9
SFP 10
SFP 11
SFP 12

SFP 13

SFP 14

SFP 15
XC

SFP 16

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-21
16xOC-n/STM-n circuit pack block diagram (NTK513FAE5)

XC
SFP 1
SFP 2
SFP 3
SFP 4

SFP 5

SFP 6
Backplane

SFP 7
5G SONET/SDH OHP
with VT/TU processor SFP 8

SFP 9
SFP 10
SFP 11
SFP 12

SFP 13

SFP 14

SFP 15
XC

SFP 16

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-22
16xOC-n/STM-n circuit pack block diagram (NTK512GAE5)

XC
SFP 1
SFP 2
SFP 3
SFP 4

SFP 5

SFP 6
Backplane

SFP 7
10G SONET/SDH OHP
SFP 8

SFP 9
SFP 10
SFP 11
SFP 12

SFP 13

SFP 14

SFP 15
XC

SFP 16

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-23
16xOC-n/STM-n circuit pack block diagram (NTK513GAE5)

XC
SFP 1
SFP 2
SFP 3
SFP 4

SFP 5

SFP 6
Backplane

SFP 7
10G SONET/SDH OHP
with VT/TU processor SFP 8

SFP 9
SFP 10
SFP 11
SFP 12

SFP 13

SFP 14

SFP 15
XC

SFP 16

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Supported functionality
The 16xOC-n/STM-n circuit packs (NTK512FAE5 and NTK513FAE5,
NTK512GAE5 and NTK513GAE5) provide the following functionality.
• up to 16 pluggable (SFP) 155M/622M/2.5G interfaces (ports 1 to 16)
• support OC-3/OC-12 (SONET) and STM-1/STM-4 (SDH) services on
16xOC-n/STM-n 5G variant (NTK512FAE5 and NTK513FAE5).
STM1/STM4 facilities on 16xOC-n/STM-n 5G circuit packs also support
SDH-J port mode.
• support OC-3/OC-12/OC-48 (SONET) and STM-1/STM-4/STM-16 (SDH)
services on 16xOC-n/STM-n 10G variant (NTK512GAE5 and
NTK513GAE5). STM1/STM4 facilities on 16xOC-n/STM-n 10G circuit
packs do not support SDH-J port mode.
• There are some restrictions on how to fill up a 16xOC-n/STM-n 5G or
16xOC-n/STM-n 10G circuit pack (that is, blocking rules). You must see
“Provisioning rules summary for the 16xOC-n/STM-n circuit packs” on
page 1-119 for full details on port blocking rules for 16xOC-n/STM-n 5G
and 16xOC-n/STM-n 10G circuit packs.
• auto provisioning of facilities at OC-3/STM-1, OC-12/STM-4, or
OC-48/STM-16 specific SFPs
• manual provisioning of facilities at SFPs that support both OC-3/STM-1
and OC12/STM4 facility types. For example, since the IR-1/S1.1_S4.1
OC-3/12/STM-1/4 SFP supports both OC-3/STM-1 and OC12/STM4
facility types, the user must manually provision an OC-3/STM-1 or
OC-12/STM-4.
• terminate section/RS and line/MS overhead
— terminate section/RS and line/MS overhead bytes in Rx direction
— insert section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC is selectable (default is Off). In
16xOC-n/STM-n 5G variants (NTK512FAE5 and NTK513FAE5), line/MS
DCC can be enabled on any two ports. In 16xOC-n/STM-n 10G variants
(NTK512GAE5 and NTK513GAE5), line/MS DCC can be enabled on all
16 ports. Section/RS DCC can be enabled on all 16 ports.
• line/MS DCC for SONET/SDH Control Plane (only for OC48/STM16
facility)
• monitor optical power input and output on all circuit pack types (optical
power is not applicable to STM-1e SFPs)
• selectable automatic laser shut off controlled by software. For STM-1e
SFPs, you must ensure that automatic laser shut off is disabled (see
Procedure 1-6, “Editing facility parameters” on page 1-132).

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• automatic detection/provisioning of SFP modules, which are hot


pluggable.
• support unprotected, 1+1/MSP linear, 2-Fiber BLSR/MS-SPRing (only on
OC48/STM16 facilities in 16xOC-n/STM-n 10G circuit packs;
NTK512GAE5 and NTK513GAE5), and UPSR/SNCP traffic protection
schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• support SSM monitoring/generation
• 16xOC-n/STM-n circuit packs support DSM when equipped with
OC-3/STM-1 SFPs.
• support Control Plane (OC48/STM16 facility is supported as both
add/drop Control Plane facility and Network Control Plane facility, however
OC3/OC12/STM1/STM4 facility is only supported as add/drop Control
Plane facility and not Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.

Cross-connection types
The 16xOC-n/STM-n circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled

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Cross-connection rates
The 16xOC-n/STM-n circuit packs support the following cross-connection
rates:
• non-concatenated rates of VT1.5/VC11 and VT2/VC12 (VT1.5/LO circuit
packs only)
• non-concatenated rates of LO_VC3, STS1/HO VC3, and VC4
• concatenated rates of
— STS3c/VC4 for OC-3/STM-1, OC-12/STM-4, and OC-48/STM-16
ports
— STS12c/VC4-4c for OC-12/STM-4 and OC-48/STM-16 ports
— STS24c/VC4-8c and STS48c/VC4-16c for OC-48/STM-16 ports
• auto concatenated rates as follows
— the 16xOC-n/STM-n 10G circuit packs (NTK512GAE5,
NTK513GAE5) support auto concatenated rates of STS1/VC3,
STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and
STS48c/VC4-16c for OC-48/STM-16 ports
Note: The 16xOC-n/STM-n (NTK512FAE5, NTK513FAE5,
NTK512GAE5, NTK513GAE5) circuit packs do not support auto
concatenated rates for connections on OC-3/STM-1 and OC-12/STM-4
ports.

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Supported SFPs
Table 1-19 provides a list of the SFPs that are supported on the
16xOC-n/STM-n circuit pack.

Table 1-19
Supported SFP modules for the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5,
NTK512GAE5, and NTK513GAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

P155M OC-3/STM-1 SR-0 (multimode) 1310 nm SFP NTTP02AD


— OC3/STM1/STM1J (auto, — OC-3/STM-1 (155.52Mb/s)
Note 2) (Note 3), AD
OC-3/STM-1 SR1/I1 1310 nm SFP NTTP02BF
— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 IR1/S1.1 1310 nm SFP NTTP02CD


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 LR1/L1.1 1310 nm SFP NTTP02ED


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 LR2/L1.2 1550 nm SFP NTTP02FF


— OC-3/STM-1 (155.52Mb/s)

STM-1e SFP NTTP60AE


— STM-1e (155.52Mbps)

OC-3/STM-1 CWDM 1511 nm (0-15 dB span) NTK592NPE6


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (10-30 dB span) NTK592NBE6


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (20-34 dB span) NTK592NHE6


— OC-3/STM-1 (155.52Mb/s)

P622M OC-12/STM-4 LR1/L4.1 1310 nm SFP NTTP05EF


— OC12/STM4/STM4J (auto, — OC-12/STM-4 (622.08Mb/s)
Note 2) (Note 3), AD
OC-12/STM-4 LR2/L4.2 1550 nm SFP NTTP05FF
— OC-12/STM-4 (622.08Mb/s)

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Table 1-19 (continued)


Supported SFP modules for the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5,
NTK512GAE5, and NTK513GAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

P155622M OC-3/12/STM-1/4 SR1/I1.1_I4.1 1310 nm SFP NTTP04BF


— OC3/OC12/STM1/STM1J — OC-3/STM-1 (155.52Mb/s)
/STM4/STM4J (Note 3), AD — OC-12/STM-4 (622.08Mb/s)

OC-3/12/STM-1/4 IR1/S1.1_S4.1 1310 nm XCT NTTP04CDE6


Enhanced SFPs and NTTP04CF
— OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)

PCWDMS 155M/622M/2.5G CWDM SFPs NTK590xH where


— OC48/OC3/OC12/STM1/STM — OC-3/STM-1 (155.52Mb/s) x= L, M, N, P, Q,
1J/STM4/STM4J/STM16 R, S, T
— OC-12/STM-4 (622.08Mb/s)
(Note 4, Note 3), AD
— OC-48/STM-16 (2.48832 Gb/s)
P2G5 (only supported in OC48/STM16 SR/IR/LR SFPs NTTP03BF,
NTK512GAE5 and — OC-48/STM-16 (2.48832 Gb/s) NTTP03CF,
NTK513GAE5 variants) NTTP03EF,
— OC48/STM16 (auto, Note 2) NTTP03FF
(Note 4), AD OC-48/STM-16 DWDM SFPs NTK585xx where
— OC-48/STM-16 (2.48832 Gb/s) xx= see Note 5

PSFP Multi-rate 1310 nm, SMF SFP B-700-1036-001


— STM0J, AD — OC-3/STM-1 (155.52Mb/s)
— OC3/OC12/OC48/STM1/ — OC-12/STM-4 (622.08Mb/s)
STM4/STM16 (Note 4), AD — OC-48/STM-16 (2.48832Gb/s) (only
supported in NTK512GAE5 and
NTK513GAE5 variants)
Note: The SFP B-700-1036-001 with REV “A”
written on the faceplates is not supported in
6500. Only SFP B-700-1036-001 marked REV
“B” can be supported in 6500.

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Table 1-19 (continued)


Supported SFP modules for the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5,
NTK512GAE5, and NTK513GAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: On the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5, NTK512GAE5,
NTK513GAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is
set to On in the Node Information application.
Note 3: SDH-J is supported on the 5G version of 16xOC-n/STM-n circuit packs only (NTK512FAE5
and NTK513FAE5 variants).
Note 4: OC48/STM16 is supported on the 10G version of 16xOC-n/STM-n circuit packs only
(NTK512GAE5 and NTK513GAE5 variants).
Note 5: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “OC-48/STM-16
DWDM small form-factor (SFP) pluggable modules”, for the complete list of ordering codes.

Performance monitoring
The 16xOC-n/STM-n circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-3/STM-1 and
OC-12/STM-4 facilities
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-48/STM-16 facilities
(10G variants only)
• PM collection for STS1, STS3c/VC4 and STS12c/VC4-4c concatenated
payloads
• PM collection for STS24c/VC4-8c and STS48c/VC4-16c concatenated
payloads (10G variants only)
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3 (VT1.5/LO circuit packs only),
STS1/HO VC3, and VC4 non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

OCn/STMn facility alarms


• AIS
• Auto Protection Switch Acknowledge Time Out
• DSM-Host Misconnection
• Facility Reconfiguration Required
• Forced Switch Active
• Far End Protection Line Fail
• Forced Ring Switch Active
• Lockout Protection Ring Active
• Lockout Working Ring Active

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• Lockout Active
• Loss Of Signal
• Loss Of Frame
• LINE DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• Loopback Active
• Manual Ring Switch Active
• Node Id Mismatch
• Protection Channel Match Fail
• Protection Default K-bytes
• Protection Exerciser Failed
• Protection Invalid K-bytes
• Protection Mode Mismatch
• Protection Scheme Mismatch
• Protection Switch Byte Fail
• Protection Switch Complete
• Protection Locked
• Ring Protection Switch Complete
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC Link Failure
• SECTION DCC OSPF Adjacency Loss
• Trace Identifier Mismatch

Path alarms (STSn/VTn)


• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer
• Loopback Active - Facility
• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete

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• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Traffic Squelched
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F
• Test Access in Progress - Split EF
• Unequipped

Control Plane alarms


• Remote Node Unreachable (OSRP line level)
• Configuration Mismatch
• Configuration Mismatch - Common ID
• Configuration Mismatch - Primary State

Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)

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Equipping rules
The following equipping rules apply to 16xOC-n/STM-n circuit packs:
• is a single-slot 16-port interface.
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot


packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.

• is not supported in a 7-slot optical shelf type (NTK503PAE5 or


NTK503KA).
• cannot be equipped in a 6500-7 packet-optical shelf type (NTK503RA) in
this release.
• is not supported in a 2-slot shelf type.
• 16xOC-n/STM-n 5G STS-1/HO SFP and 16xOC-n/STM-n 5G VT1.5/LO
SFP circuit packs work with all type of cross-connect circuit packs except
600G PKT/OTN cross-connect circuit packs. However when using MXC
circuit packs, only the first eight ports are used to equip the OC-3/STM-1
SFPs and only 1, 3, 5, and 7 ports are used to equip the OC-12/STM-4
SFPs. You cannot provision cross-connects on ports other than the ports
specified above. VT1.5/VT2 LO connections are only supported with
cross-connect circuit packs capable of supporting VT1.5/VT2 switching
granularity. For example, cross-connect in 32-slot shelf does not support
VT1.5/VT2 LO connections.
• 16xOC-n/STM-n 10G STS-1/HO SFP and 16xOC-n/STM-n 10G
VT1.5/LO SFP circuit packs work with all type of cross-connect circuit
packs except 600G PKT/OTN cross-connect circuit packs. However when
using MXC circuit packs, only the first four ports are used to equip the
OC-3/STM-1 or OC-12/STM-4 SFPs and only the first port is used to equip
the OC-48/STM-16 SFP. You cannot provision cross-connects on ports
other than the ports specified above.
• see “Provisioning rules summary for the 16xOC-n/STM-n circuit packs” on
page 1-119 for more information.

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Technical specifications
Table 1-20 lists the weight, power consumption, and SFP specifications for
16xOC-n/STM-n circuit packs.

Table 1-20
Technical specifications for 16xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
16xOC-n/STM-n 5G STS-1/HO SFP NTK512FAE5 0.9 kg (1.9 lb) 27 29
16xOC-n/STM-n 5G VT1.5/LO SFP NTK513FAE5 0.9 kg (1.9 lb) 27 29
16xOC-n/STM-n 10G STS-1/HO SFP NTK512GAE5 0.9 kg (1.9 lb) 27 29
16xOC-n/STM-n 10G VT1.5/LO SFP NTK513GAE5 0.9 kg (1.9 lb) 27 29
SFP specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
— “Electrical specifications”
— “OC-48/STM-16 SFP and DPO optical specifications”
— “Multirate SFP optical specifications”

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Latency
Table 1-21 shows the latency specifications for 16xOC-n/STM-n circuit packs.
For latency information about OC-n/STM-n, GbE (ETH) and FC-100/200/400
facilities using a SuperMux with XFP (NTK535FAE5) circuit pack, refer to
Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs, 323-1851-102.5
(Chapter 3).

Table 1-21
Latency for 16xOC-n/STM-n circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn→ XC→
XC OCn/STMn
16xOC-n/STM-n 5G STS-1/HO SFP NTK512FAE5 2 1
16xOC-n/STM-n 5G VT1.5/LO SFP NTK513FAE5 2 (see Note 2) 1
16xOC-n/STM-n 10G STS-1/HO SFP NTK512GAE5 2 1
16xOC-n/STM-n 10G VT1.5/LO SFP NTK513GAE5 2 (see Note 2) 1
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.

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(2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5,


NTK522CAE5, NTK522DAE5)
Overview
The (2+8)xOC-n/STM-n circuit pack is a multirate optical OC-n/STM-n circuit
pack (MRO) that uses OC-192/STM-64 XFP and OC-48/STM-16 SFP optics
up to 20 Gbit/s of switching capacity for short reach, intermediate reach, long
reach, CWDM, and DWDM variants applications. The (2+8)xOC-n/STM-n
circuit packs support both OC-48 or OC-192 (SONET) and STM-16 or
STM-64 (SDH) services.

This release of 6500 offers the following variants of (2+8)xOC-n/STM-n circuit


pack:
• OC-n/STM-n 20G STS-1/VC-3 2x XFP/8x SFP (NTK521CAE5)
This circuit pack is also referred to as (2+8)xOC-n/STM-n STS-1/VC-3
20G.
• OC-n/STM-n OTN 20G STS-1/VC-3 2x XFP/8x SFP (NTK521DAE5)
This circuit pack is also referred to as (2+8)xOC-n/STM-n STS-1/VC-3
OTN 20G.
Note: The (2+8)xOC-n/STM-n STS-1/VC-3 20G and (2+8)xOC-n/STM-n
STS-1/VC-3 OTN 20G circuit packs (NTK521CAE5 and NTK521DAE5)
support high-order (HO) STS-1/VC3 path connections (and higher rates)
as well as LO_VC3 connections. These circuit packs do not support
low-order (LO) VT1.5/VC11 and VT2/VC12 path connections. These
circuit packs can achieve LO_VC3 switching granularity on HO
cross-connect circuit pack when using the 240G+ STS-1/VC-3 (240/0G)
(NTK557EAE5) or 640G+ STS-1/VC-3 (640/0G) (NTK610BBE5)
cross-connect circuit packs.

• OC-n/STM-n 20G VT-1.5/LO 2x XFP/8x SFP (NTK522CAE5)


This circuit pack is also referred to as (2+8)xOC-n/STM-n LO 20G.
• OC-n/STM-n OTN 20G VT-1.5/LO 2x XFP/8x SFP (NTK522DAE5)
This circuit pack is also referred to as (2+8)xOC-n/STM-n LO OTN 20G.
Note: The (2+8)xOC-n/STM-n LO circuit packs (NTK522CAE5 and
NTK522DAE5) support low-order (LO) VT1.5/VC11 and VT2/VC12 path
connections (and higher rates). These circuit packs can achieve LO_VC3
switching granularity on HO cross-connect circuit pack when using the
240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+ STS-1/VC-3
(640/0G) (NTK610BBE5) cross-connect circuit packs.

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The OC-48/STM-16 DWDM SFPs in (2+8)xOC-n/STM-n circuit packs support


ITU-T DWDM compliant wavelengths as follows:
• 40 wavelengths for interworking with the Common Photonic Layer
equipment and 6500 Photonic layers.
• 16 wavelengths on the 200GHz grid and 32 wavelengths on the 100GHz
grid for interworking with the 565, 5100 and 5200 Advanced Services
Platform DWDM optical multiplexer (OMX).

The OC-192/STM-64 DWDM XFPs in (2+8)xOC-n/STM-n circuit packs


support ITU-T DWDM compliant wavelengths as follows:
• 36 wavelengths for interworking with Common Photonic Layer equipment
or 6500 Photonic layer
• 16 C-band and 16 L-band wavelengths for interworking with the 565, 5100
and 5200 Advanced Services Platform DWDM optical multiplexer (OMX).
When interworking with OMX while the 6500 on one end uses
OC-192/STM-64 DWDM optical interfaces and the 6500 on other end
uses OC-192/STM-64 AM1/AM2 DWDM tunable optical interfaces, you
must contact your Ciena representative for link budget validation.

There are two variants of the (2+8)xOC-n/STM-n circuit pack:


• VT1.5/Low Order (LO)
These circuit packs support VT1.5/VC11, VT2/VC12, and above switching
granularity (including LO_VC3).
• STS-1/VC-3
These circuit packs support LO_VC3, STS1/HO_VC3/VC4, and above
switching granularity.

To use LO_VC3, VT1.5/VC11, and VT2/VC12 granularity, both the optical


interface circuit packs and the cross-connect circuit packs must support the
required switching granularity.

Note: The LO circuit packs can achieve LO switching granularity provided


that the shelf in which they are equipped is equipped with compatible
cross-connect circuit packs. These circuit packs can achieve LO_VC3
switching granularity on HO cross-connect circuit pack when using the
240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+ STS-1/VC-3
(640/0G) (NTK610BBE5) cross-connect circuit packs.

Figure 1-24 on page 1-80 shows the faceplate of a (2+8)xOC-n/STM-n circuit


pack. Figure 1-25 on page 1-81 to Figure 1-28 on page 1-84 show the
functional block diagrams of (2+8)xOC-n/STM-n circuit packs.

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Figure 1-24
(2+8)xOC-n/STM-n circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
OC-n/STM-n OTN
20G VT1.5/LO
- Card not failed = LED off, Card failed = LED on
2xXFP / 8xSFP

Fail Green rectangle (Ready)


Ready

In Use
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
1 T Blue diamond (In Use)
R
- Used to communicate whether circuit pack can be extracted
1M

2 T
(on->no pull, off->can be pulled)
R - Equipment in-service = LED on; Equipment out-of-service = LED off

3 T
R Transmit/receive XFP dual LC connector
4 T
R
Red/yellow bi-color circle (Fail/LOS)
5 T
R
- Used to communicate Rx Loss of Signal/optical module fail
6 T - Red = module fail;
R

7 T
- Yellow = Rx Loss of Signal
R

8 T
R Transmit/receive SFP dual LC connector
9 T
R

10 T
R

Type A

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Figure 1-25
(2+8)xOC-n/STM-n STS-1/VC-3 20G circuit pack block diagram (NTK521CAE5)

XC
XFP 1

XFP 2

SFP 3

SFP 4
Backplane

20G SONET/SDH OHP SFP 5

SFP 6

SFP 7

SFP 8

SFP 9
XC
SFP 10

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-26
(2+8)xOC-n/STM-n STS-1/VC-3 OTN 20G circuit pack block diagram (NTK521DAE5)

XC

OTN Mapper XFP 1

OTN Mapper XFP 2

SFP 3

SFP 4
Backplane

20G SONET/SDH OHP SFP 5

SFP 6

SFP 7

SFP 8

SFP 9
XC
SFP 10

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-27
(2+8)xOC-n/STM-n LO 20G circuit pack block diagram (NTK522CAE5)

XC
XFP 1

XFP 2

SFP 3

SFP 4
Backplane

20G SONET/SDH OHP SFP 5


with VT/TU processor

SFP 6

SFP 7

SFP 8

SFP 9
XC
SFP 10

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Figure 1-28
(2+8)xOC-n/STM-n LO OTN 20G circuit pack block diagram (NTK522DAE5)

XC

OTN Mapper XFP 1

OTN Mapper XFP 2

SFP 3

SFP 4
Backplane

20G SONET/SDH OHP SFP 5


with VT/TU processor

SFP 6

SFP 7

SFP 8

SFP 9
XC
SFP 10

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Supported functionality
The (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5,
NTK522CAE5, and NTK522DAE5) provide the following functionality.
• up to two pluggable (XFP) 10G interfaces (ports 1 and 2) and up to eight
pluggable (SFP) 2.5G interfaces (ports 3 to 10)
• support OC-48/OC-192 (SONET) and STM-16/STM-64 (SDH) services.
• There are some restrictions on how to fill up a (2+8)xOC-n/STM-n circuit
pack (that is, blocking rules). You must see “Provisioning rules summary
for the (2+8)xOC-n/STM-n 20G and OTN 20G circuit packs” on page
1-120 for full details on port blocking rules for (2+8)xOC-n/STM-n circuit
packs.
• automatic detection/provisioning of SFP and XFP modules, which are hot
pluggable.
• Line ports (10G OC-192/STM-64 line facility, ports 1 and 2, available on
non-OTN variant; NTK521CAE5 and NTK522CAE5) supports:
— section/RS DCC and line/MS DCC on OC-192/STM-64 line facility
Maximum eight section/RS DCC or line/MS DCC. Port 1 & port 3 and
port 2 & port 7 share the same section/RS DCC and line/MS DCC as
both port pairs cannot be provisioned at the same time. DCC channels
can be configured to support LAPD, PPP, or Transparency. Route
diversity can be provisioned on DCC ports
— line/MS DCC for SONET/SDH Control Plane (for OC192/STM64
facility)
• Line ports (OTM2 line facility, ports 1 and 2, only available on OTN variant;
NTK521DAE5 and NTK522DAE5) supports:
— Up to 175 km reach (when the OTM2 line port is equipped with the
DWDM XFPs such as NTK588xxE5 or NTK589xxE6 or less reach
when equipped with NTK583AAE6, NTK583AB, or NTK587xxE5
XFPs)
— FEC provisionable to Off, SCFEC and RS8 (Link budget support only
with SCFEC)
Note: RS8 FEC algorithm is also known as ITU-T G.709 RS-8.
SCFEC FEC algorithm is also known as ITU-T G.975 I.4.

— Pre-FEC signal fail threshold provisionable (units of dBQ)


— Tx and Rx power monitoring
— OTM2 (10.7G) wrapped OC-192/STM-64 data rate

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— OTU TTI and ODU TTI (without SAPI/DAPI support), ODU-LCK signal
conditioning when port 1 is OOS
— GCC0 and GCC1 support
Maximum two GCCs (GCC 0/GCC1). GCC channels can be
configured to support LAPD or PPP.
• Client support via up to eight OC48/STM16 SFP optics in ports 3 to 10:
— SDCC and LDCC on OC-48/STM-16 client facilities
Maximum eight line/MS DCC and eight section/RS DCC
— DCC channels can be configured to support LAPD, PPP, or
Transparency
— line/MS DCC for SONET/SDH Control Plane (for OC48/STM16 facility)
— Route diversity can be provisioned on DCC ports
— OC48/STM16 Tx and Rx power monitoring
• Protection types supported:
— Unprotected
— 10G line-side protection using UPSR/SNCP or 1+1/MSP linear
line-side protection.
— 1+1/MSP linear and UPSR/SNCP client-side protection for
OC-48/STM-16 clients.
— 2-Fiber BLSR/MS-SPRing protection for OC-48/STM-16 and
OC192/STM64 facilities
— 4-Fiber BLSR/MS-SPRing/HERS protection for OC192/STM64
facilities
• Line timing synchronization support (provides the handover between the
line timing and the shelf)
• support SSM monitoring/generation
• monitor optical power input and output
• support Control Plane (OC48/STM16 facility or OC192/STM64 facility is
supported as both add/drop Control Plane facility and Network Control
Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.

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Cross-connection types
The (2+8)xOC-n/STM-n circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
• sub-network connection (SNC) when OSRP Control Plane enabled
• virtual end point (VEP) when OSRP Control Plane enabled

Cross-connection rates
The (2+8)xOC-n/STM-n circuit packs support the following cross-connection
rates:
• non-concatenated rates of
— VT1.5/VC11, VT2/VC12, and STS1/LO VC3 ((LO variants
NTK522CAE5 and NTK522DAE5 only) for OC-48/STM-16 and
OC-192/STM-64 ports
— LO VC3, STS1/HO VC3 and VC4 for OC-48/STM-16 and
OC-192/STM-64 ports
• concatenated rates of
— STS3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, and
STS48c/VC4-16c for OC-48//STM-16 and OC-192/STM-64 ports
— concatenated rate of STS-192c/VC-4-64c for OC-192/STM-64 ports
• auto concatenated rates of
— STS1/VC3, STS3c/VC4, STS12c/VC4-4c, and STS48c/VC4-16c for
OC-48/STM-16 and OC-192/STM-64 ports
— STS-192c/VC-4-64c for OC-192/STM-64 ports

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Supported SFPs/XFPs
Table 1-22 provides a list of the SFPs that are supported on the
(2+8)xOC-n/STM-n circuit pack. Table 1-23 and Table 1-24 provide lists of the
XFPs that are supported on the (2+8)xOC-n/STM-n circuit pack.

Table 1-22
Supported SFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5,
NTK522CAE5, and NTK522DAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

PCWDMS 155M/622M/2.5G CWDM SFPs NTK590xH where


— OC48/STM16, AD — OC-3/STM-1 (155.52Mb/s) x= L, M, N, P, Q,
R, S, T
— OC-12/STM-4 (622.08Mb/s)
— OC-48/STM-16 (2.48832 Gb/s)

P2G5 OC48/STM16 SR/IR/LR SFPs NTTP03BF,


— OC48/STM16 (auto, Note 2), — OC-48/STM-16 (2.48832 Gb/s) NTTP03CF,
AD NTTP03EF,
NTTP03FF

OC-48/STM-16 DWDM SFPs NTK585xx where


— OC-48/STM-16 (2.48832 Gb/s) xx= see Note 3

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: On the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is set
to On in the Node Information application.
Note 3: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “OC-48/STM-16
DWDM small form-factor (SFP) pluggable modules”, for the complete list of ordering codes.

Table 1-23
Supported XFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5 and NTK522CAE5
variants)
Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)

P10GSEL OC192/STM64 SR-1 / I-64.1 / 10GBase-LR,LW NTTP80BA


— OC192/STM64 (auto, Note XFP
2), AD — 9.953 Gb/s OC192/STM64/10GBaseW

OC192/STM64 IR-2 / S-64.2 / 10GBase-ER,EW NTTP80DA


XFP
— 9.953 Gb/s OC192/STM64/10GBaseW

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Table 1-23 (continued)


Supported XFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5 and NTK522CAE5
variants)

Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)

P10GSOEL 9.95G-11.09G multirate, 1550 nm, SMF, 40 km NTTP84AAE6


— OC192/STM64, AD XFP

— OTM2 (OC192/STM64) — 9.953 Gb/s OC192/STM64/10GBaseW


(Note 3), AD OC192/STM64 SR-1/ I-64.1 / 10GBase-LR,LW / NTTP84BA
OTU2 / 10G FC1200 XFP
— 9.953 Gb/s OC192/STM64/10GBaseW

Multirate 15xx.yy nm EML DWDM 1600 ps/nm NTK587Ax to


XFP NTK587Dx,
— 9.953 Gb/s OC192/STM64/10GBaseW where x= see
Note 4

9.95G-11.09G multirate, 1550 nm, SMF, 80 km NTTP81KAE6


XFP
— 9.953 Gb/s OC192/STM64/10GBaseW

OC192/STM64 SR-1 / I-64.1 / VSR-2000-2R1 / NTTP83BA


10GBase-LR,LW
— 9.953 Gb/s OC192/STM64/10GBaseW

PXFP Multirate 15xx.yy nm EML DWDM 800 ps/nm NTK587Ex to


— OC192/STM64, AD XFP NTK587Hx,
— 9.953 Gb/s OC192/STM64/10GBaseW where x= see
— OTM2 (OC192/STM64) Note 4
(Note 3), AD

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: On the (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is set
to On in the Node Information application.
Note 3: OTM2 TX and OTM2 RX facilities represent the TX and RX portions of the OTM2 facility.
Note 4: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “Multirate
DWDM/CWDM pluggable optics modules (XFP)”, for the complete list of ordering codes.

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Table 1-24
Supported XFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521DAE5 and NTK522DAE5
variants)
Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)

P10GSOEL 9.95G-11.09G multirate, 1550 nm, SMF, 40 km NTTP84AAE6


— OC192/STM64, AD XFP

— OTM2 (OC192/STM64) — 10.709 Gb/s OTU2


(Note 2), AD OC192/STM64 SR-1/ I-64.1 / 10GBase-LR,LW / NTTP84BA
OTU2 / 10G FC1200 XFP
— 10.709 Gb/s OTU2
Multirate 15xx.yy nm EML DWDM 1600 ps/nm NTK587Ax to
XFP NTK587Dx,
— 10.709 Gb/s OTU2 where x= see
Note 3

9.95G-11.09G multirate, 1550 nm, SMF, 80 km NTTP81KAE6


XFP
— 10.709 Gb/s OTU2

OC192/STM64 SR-1 / I-64.1 / VSR-2000-2R1 / NTTP83BA


10GBase-LR,LW
— 10.709 Gb/s OTU2

PXFP Multirate 15xx.yy nm EML DWDM 800 ps/nm NTK587Ex to


— OC192/STM64, AD XFP NTK587Hx,
— 10.709 Gb/s OTU2 where x= see
— OTM2 (OC192/STM64) Note 3
(Note 2), AD
Multirate 15xx.yy nm DWDM 3200 ps/nm XFP NTK588xx,
— 10.709 Gb/s OTU2 where xx= see
Note 4

Multirate 1528.38 nm to 1568.77 nm (1-88) NTK583AAE6


50GHz Tunable DWDM XFP
— 10.709 Gb/s OTU2
Multirate 1528.38 nm to 1568.77 nm (1-88) NTK583AB
50GHz Tunable Type 2 DWDM XFP
— 10.709 Gb/s OTU2
Multirate 15xx.yy – 15xx.yy Tunable Dispersion NTK589xxE6
Tolerant DWDM 3200 ps/nm XFP where xx= see
— 10.709 Gb/s OTU2 Note 3

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Table 1-24 (continued)


Supported XFP modules for the (2+8)xOC-n/STM-n circuit packs (NTK521DAE5 and NTK522DAE5
variants)

Pluggable Equipment and Supported XFP modules and rates Part Number
Facilities (Note 1)

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: OTM2 TX and OTM2 RX facilities represent the TX and RX portions of the OTM2 facility.
Note 3: Refer to Planning - Ordering Information, 323-1851-151, Chapter 3: Table “Multirate
DWDM/CWDM pluggable optics modules (XFP)”, for the complete list of ordering codes.
Note 4: Refer to Planning - Ordering Information, 323-1851-151, Chapter 7: Table “Multirate DWDM
pluggable optics modules (XFP) (manufacture discontinued)”, for the complete list of ordering codes.

Performance monitoring
The (2+8)xOC-n/STM-n circuit packs support the following monitored entities:
• OC-192/STM-64 line interfaces (non-OTN variants only):
— PM collection of SONET section (S)/SDH regenerator section (RS),
SONET line (L)/SDH multiplex section (MS), and SONET path
(P)/SDH path (P) for OC-192/STM-64 facilities
— PM collection of protection switch count/duration
— Physical layer PM collection
• OTM2 line interfaces (OTN variants only):
— PM collection for OTN line
— PM collection for OTU layer for OTM2 NGM interfaces
— PM collection for ODU layer
— Protection switch count/duration for ODU layer
— Physical layer PM collection
• Client interfaces:
— PM collection of SONET section (S)/SDH regenerator section (RS),
SONET line (L)/SDH multiplex section (MS), and SONET path
(P)/SDH path (P) for OC-48/STM-16 facilities
— PM collection for STS1, STS3c/VC4 and STS12c/VC4-4,
STS24c/VC4-8c, STS48c/VC4-16c, and STS-192c/VC4-64c
concatenated payloads
— PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
STS1/HO VC3 and VC4 non-concatenated payloads

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— PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for


VT1.5/VC11 (LO variants only), VT2/VC12 (LO variants only), and
STS1/LO VC3
— PM collection of protection switch count/duration
— Physical layer PM collection

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible

Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

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OTM facility alarms (applies only to NTK521DA and NTK522DA)


• GCC0 Link Fail
• GCC1 Link Fail
• GCC0 OSPF Adjacency Loss
• GCC1 OSPF Adjacency Loss
• Loss Of Signal
• Loss Of Frame
• Loss Of Multiframe
• OTU Trace Identifier Mismatch
• OTU Signal Degrade
• OTU BDI
• ODU AIS
• ODU LCK
• ODU OCI
• ODU Trace Identifier Mismatch
• ODU BDI
• OPU AIS
• OPU Payload Type Mismatch
• Pre-FEC Signal Fail
• Rx Power Out Of Range
• Tx Manual Provisioning required
• Tx Tuning in Progress

OCn/STMn facility alarms


• AIS
• Auto Protection Switch Acknowledge Time Out
• Facility Reconfiguration Required
• Forced Switch Active
• Forced Span Switch Active
• Far End Protection Line Fail
• Forced Ring Switch Active
• Lockout Protection Ring Active
• Lockout Working Ring Active
• Lockout Active
• Lockout Working Span Active

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• Loss of Extra Traffic


• Loss Of Signal
• Loss Of Frame
• LINE DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• Loopback Active
• Manual Ring Switch Active
• Manual Span Switch Active
• Node Id Mismatch
• Protection Channel Match Fail
• Protection Default K-bytes
• Protection Exerciser Failed
• Protection Invalid K-bytes
• Protection Mode Mismatch
• Protection Scheme Mismatch
• Protection Switch Byte Fail
• Protection Switch Complete
• Ring Protection Switch Complete
• Ring Protection Switch Fail
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC Link Failure
• SECTION DCC OSPF Adjacency Loss
• Span Protection Switch Complete (event)
• Span Protection Switch Fail
• Span Protection Exerciser Fail
• Trace Identifier Mismatch

Path alarms (STSn/VTn)


• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer

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• Loopback Active - Facility


• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Traffic Squelched
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F
• Test Access in Progress - Split EF
• Unequipped

Control Plane alarms


• Remote Node Unreachable (OSRP line level)
• Configuration Mismatch
• Configuration Mismatch - Common ID
• Configuration Mismatch - Primary State

Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)

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Equipping rules
The following equipping rules apply to (2+8)xOC-n/STM-n circuit packs:
• is a single-slot 10-port interface
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot


packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.

• is not supported in a 7-slot optical shelf type (NTK503PAE5 or


NTK503KA).
• cannot be equipped in a 6500-7 packet-optical shelf type (NTK503RA) in
this release.
• is not supported in a 2-slot shelf type.

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• (2+8)xOC-n/STM-n circuit packs work with all type of cross-connect circuit


packs except 600G PKT/OTN, 20G/20G VT1.5/VC-12, and MXC
cross-connect circuit packs. VT1.5/LO connections in (2+8)xOC-n/STM-n
LO circuit packs can only be provisioned if the shelf is equipped with
cross-connect (XC) circuit packs capable of supporting VT1.5/VC11 or
VT2/VC12 switching granularity. The total amount of bandwidth that can
be supported in a given slot depends on the capabilities of the
cross-connect circuit pack provisioned in the shelf as well as the shelf type
(see “14-slot backplane traffic capacities per cross-connect circuit pack,
“14-slot backplane traffic capacities per 14-slot shelf type”, “32-slot
backplane traffic capacities per cross-connect circuit pack”, and “32-slot
backplane traffic capacities per 32-slot shelf type” tables for more details).
The maximum of 20G of bandwidth to the backplane can only be used if
the (2+8)xOC-n/STM-n circuit packs are equipped in:
— slots 5, 6, 9, or 10 of any type of 14-slot shelf where 160G+ (160/0)
cross-connect circuit packs are used in the 14-slot shelf, or
— any slots of converged or packet-optical shelf type of 14-slot shelf
(slots 1-6 and 9-14) where 240G+ (240/0) or 240G+/80G (240/80)
cross-connect circuit packs are used in the 14-slot shelf, or
— any slots of 32-slot shelf (slots 1-8, 11-18, 21-28, and 31-38) where
640G+ (640/0) cross-connect circuit packs are used in the 32-slot
shelf.
• see “Provisioning rules summary for the (2+8)xOC-n/STM-n 20G and
OTN 20G circuit packs” on page 1-120 for more information.

Technical specifications
Table 1-25 lists the weight, power consumption, and SFP specifications for
(2+8)xOC-n/STM-n circuit packs.

Table 1-25
Technical specifications for (2+8)xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
OC-n/STM-n 20G STS-1/VC-3 2x NTK521CAE5 1.0 kg (2.2 lb) 42 45
XFP/8x SFP circuit pack
OC-n/STM-n OTN 20G STS-1/VC-3 NTK521DAE5 1.0 kg (2.2 lb) 52 60
2x XFP/8x SFP circuit pack
OC-n/STM-n 20G VT-1.5/LO 2x NTK522CAE5 1.0 kg (2.2 lb) 42 45
XFP/8x SFP circuit pack

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Table 1-25 (continued)


Technical specifications for (2+8)xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated) Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
OC-n/STM-n OTN 20G VT-1.5/LO 2x NTK522DAE5 1.0 kg (2.2 lb) 52 60
XFP/8x SFP circuit pack
SFP specifications (see Note 5)
XFP specifications (see Note 6)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-48/STM-16 SFP and DPO optical specifications”
— “OC-48/STM-16 CWDM optical specifications”
Note 6: For optical XFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “10G XFP optical specifications”
— “Multirate DWDM/CWDM XFP optical specification”
— “Multirate Tunable DWDM XFP optical specification”

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Latency
Table 1-26 shows the latency specifications for (2+8)xOC-n/STM-n circuit
packs. For latency information about OC-n/STM-n, GbE (ETH) and
FC-100/200/400 facilities using a SuperMux with XFP (NTK535FAE5) circuit
pack, refer to Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs,
323-1851-102.5 (Chapter 3).

Table 1-26
Latency for (2+8)xOC-n/STM-n circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn/ XC→
OTM2→ XC OCn/STMn/
OTM2
OC-n/STM-n 20G STS-1/VC-3 2x XFP/8x SFP NTK521CAE5 2 1
OC-n/STM-n OTN 20G STS-1/VC-3 2x XFP/8x SFP NTK521DAE5 2 (see Note 2, 1 (see Note 3)
Note 4, Note 5)
OC-n/STM-n 20G VT-1.5/LO 2x XFP/8x SFP NTK522CAE5 2 (see Note 2) 1
OC-n/STM-n OTN 20G VT-1.5/LO 2x XFP/8x SFP NTK522DAE5 2 (see Note 4) 1 (see Note 3)
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path from
cross-connect. To calculate the end-to-end latency through the system, add the stated ingress latency,
the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the egress
latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, LO_VC3 and HO paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.
Note 3: This value applies to all facilities including the 10G interfaces when the facility is OC-192 or
STM-64. When a 10G interface is provisioned for OTM2, the XC to facility latency is 2 µs.
Note 4: For an OTM2 facility, the typical OTM2 to XC latency for STS-1, STS-Nc, LO_VC3 and HO paths
is as follows: OTM2 with FEC Off is 3 µs, OTM2 with RS8 FEC is 9 µs and OTM2 with SCFEC is 47 µs.
Note 5: For an OTM2 facility, the typical OTM2 to XC latency for STS-1, STS-Nc, LO_VC3 and HO paths
is as follows: OTM2 with FEC Off is 6 µs, OTM2 with RS8 FEC is 13 µs and OTM2 with SCFEC is 50 µs.

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8xOC-n/STM-n 5G VT1.5/LO SFP circuit packs (NTK511AA)


Overview
The 8xOC-n/STM-n 5G VT1.5/LO SFP circuit pack (also referred to as
8xOC-n/STM-n) is a multirate optical OC-n/STM-n circuit pack (MRO) that
supports eight SONET/SDH facilities with up to 5 Gbit/s of total switching
capacity (six ports support STM-0J, eight ports support OC-3/12, STM-1/4
and STM-1J/4J). Each port can be equipped with a compatible SFP optical
plugs for short reach, intermediate reach, long reach, and CWDM optical
applications or with an STM-1e SFP for intra-office electrical applications.

Note 1: If the external synchronization mode is SDH-J and the use of the
64 kHz ESI or 6 MHz ESO ports is required, the following releases of the
cross-connect circuit packs are required:
- NTK557AA/BA: Release 08 or higher
- NTK557EAE5/GAE5: Release 01 or higher
- NTK557ES/GS: Release 01 or higher
- NTK557NA/PA/QA: Release 04 or higher
- NTK557TB: Release 01 or higher
- NTK557AA/BA: Release 05A, 06B
- NTK557NA/PA/QA: Release 02A
The 02A, 05A, and 06B releases are cross-connect circuit packs that have
been upgraded as a result of a return/repair operation.
Since the introduction of the SDH-J mode in 6500, only circuit packs
meeting the above criteria are being manufactured and shipped.
Note 2: This LO circuit pack can achieve LO switching granularity
provided that the shelf in which they are equipped is equipped with
compatible cross-connect circuit packs. The LO circuit packs can achieve
LO_VC3 switching granularity on HO cross-connect circuit pack when
using the 240G+ STS-1/VC-3 (240/0G) (NTK557EAE5) or 640G+
STS-1/VC-3 (640/0G) (NTK610BBE5) cross-connect circuit packs.

Figure 1-29 on page 1-101 shows an example of the faceplate of the


8xOC-n/STM-n circuit pack and Figure 1-30 on page 1-102 shows the
functional block diagrams of 8xOC-n/STM-n circuit packs.

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Figure 1-29
8xOC-n/STM-n circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LE

Blue diamond (In Use)


- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off

Red/yellow bi-color circle (Fail/LOS)


- Used to communicate Rx Loss of Signal/optical module fail
- Red = module fail; Yellow = Rx Loss of Signal

Transmit/receive SFP dual LC connector


or dual 1.0/2.3 mm coaxial connector

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Figure 1-30
8xOC-n/STM-n circuit pack block diagram (NTK511AA)

XC

SFP 1

SFP 2
Backplane

SFP 3
5G SONET/SDH OHP
with VT/TU processor SFP 4

SFP 5
SFP 6
SFP 7
SFP 8

XC

Processor Power
Sync Supply
Module

Legends
OHP Overhead processor

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Supported functionality
The 8xOC-n/STM-n circuit pack (NTK511AA) provides the following
functionality.
• up to eight pluggable (SFP) 155M/622M interfaces (ports 1 to 8)
• up to six pluggable (SFP) 51M interfaces (ports 2 to 4 and ports 6 to 8)
• OC-3/12 (SONET), STM-1/4 (SDH), or STM-0J/1J/4J (SDH-J) services
• auto-provisioning of facilities at STM-0J, OC-3/STM-1/STM-1J, or
OC-12/STM-4/STM-4J specific SFPs
• manual provisioning of facilities at SFPs that support both
OC-3/STM-1/STM-1J and OC12/STM4/STM4J facility types. For
example, since the IR-1/S1.1_S4.1 OC-3/12/STM-1/4 SFP supports both
OC-3/STM-1/STM-1J and OC12/STM4/STM4J facility types, the user
must manually provision an OC-3/STM-1/STM-1J or
OC-12/STM-4/STM4J.
• terminates section/RS and line/MS overhead
— terminate section/RS and line/MS overhead bytes in Rx direction
— insert section/RS and line/MS overhead bytes in Tx direction
• section/RS DCC or line/MS DCC is selectable (default is Off). Section/RS
DCC can be enabled on all eight ports. Line/MS DCC can be enabled on
all eight ports.
• monitor optical power input and output on all circuit pack types (optical
power is not applicable to STM-1e SFPs)
• selectable automatic laser shut off controlled by software. For STM-1e
SFPs, you must ensure that automatic laser shut off is disabled (see
Procedure 1-6, “Editing facility parameters” on page 1-132).
• automatic detection/provisioning of SFP modules, which are hot
pluggable.
• unprotected, 1+1/MSP linear, and UPSR/SNCP traffic protection schemes
• line timing synchronization support (provides the handover between the
line timing and the shelf)
• supports SSM monitoring/generation
• 8xOC-n/STM-n circuit packs support DSM when equipped with
OC-3/STM-1 SFPs.
• Control Plane (OCn/STMn facility is only supported as add/drop Control
Plane facility and not Network Control Plane facility)
Note: Refer to the 6500 Packet-Optical Platform Control Plane
Application Guide, NTRN71AA, for detailed information on Control Plane
concepts, applications, and engineering rules supported in this release of
6500.

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Cross-connection types
The 8xOC-n/STM-n circuit pack supports the following cross-connection
types:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)

Cross-connection rates
The 8xOC-n/STM-n circuit pack supports the following cross-connection
rates:
• non-concatenated rates of STS1/AU3-mapped VC3, AU4-mapped VC3,
VT1.5/VC11, or VT2/VC12
• non-concatenated rates of STS1/HO VC3 and VC4
• concatenated rates of STS3c/VC4 for OC-3/STM-1 and OC-12/STM-4
ports
• concatenated rates of STS12c/VC4-4c for OC-12/STM-4 ports

Note: The 8xOC-n/STM-n (NTK511AA) circuit pack does not support


auto concatenated rates for connections on OC-3/STM-1 and
OC-12/STM-4 ports.

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Supported SFPs
Table 1-27 provides a list of the SFPs that are supported on the
8xOC-n/STM-n circuit pack.

Table 1-27
Supported SFP modules for the 8xOC-n/STM-n circuit pack NTK511AA)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

P155M OC-3/STM-1 SR-0 (multimode) 1310 nm SFP NTTP02AD


— OC3/STM1/STM1J (auto), — OC-3/STM-1 (155.52Mb/s)
AD
OC-3/STM-1 SR1/I1 1310 nm SFP NTTP02BF
— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 IR1/S1.1 1310 nm SFP NTTP02CD


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 LR1/L1.1 1310 nm SFP NTTP02ED


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 LR2/L1.2 1550 nm SFP NTTP02FF


— OC-3/STM-1 (155.52Mb/s)

STM-1e SFP NTTP60AE


— STM-1e (155.52Mbps)

P622M OC-12/STM-4 LR1/L4.1 1310 nm SFP NTTP05EF


— OC12/STM4/STM4J (auto), — OC-12/STM-4 (622.08Mb/s)
AD
OC-12/STM-4 LR2/L4.2 1550 nm SFP NTTP05FF
— OC-12/STM-4 (622.08Mb/s)

P155622M OC-3/12/STM-1/4 SR1/I1.1_I4.1 1310 nm SFP NTTP04BF


— OC3/OC12/STM1/STM1J — OC-3/STM-1 (155.52Mb/s)
/STM4/STM4J, AD — OC-12/STM-4 (622.08Mb/s)

OC-3/12/STM-1/4 IR1/S1.1_S4.1 1310 nm XCT NTTP04CF


Enhanced SFPs
— OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)

PCWDMS 155M/622M/2.5G CWDM SFPs NTK590xH where


— OC48/OC3/OC12/STM1/STM — OC-3/STM-1 (155.52Mb/s) x= L, M, N, P, Q,
1J/STM4/STM4J/STM16, R, S, T
— OC-12/STM-4 (622.08Mb/s)
AD
— OC-48/STM-16 (2.48832 Gb/s)

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Table 1-27 (continued)


Supported SFP modules for the 8xOC-n/STM-n circuit pack NTK511AA)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1)

PSFP OC-1/3/12/STM-0/1/4 SR-1/I-1 I-4, 1310 nm 160-9014-900


— STM0J (Note 2), AD SFP

— OC3/OC12/OC48/STM1/ — STM-0 J (51.84 Mbps)


STM4/STM16, AD — OC-3/STM-1 (155.52Mb/s)

OC-1/3/12/STM-0/1/ IR-1/S-1.1 S-4.1, 1310 nm 160-9015-900


SFP
— STM-0 J (51.84 Mbps)
— OC-3/STM-1 (155.52Mb/s)

OC-1/STM-0 L-0.1, 1310 nm SFP 160-9016-900


— STM-0 J (51.84 Mbps)

Multi-rate 1310 nm, SMF SFP B-700-1036-001


— OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)
Note: The SFP B-700-1036-001 with REV “A”
written on the faceplates is not supported in
6500. Only SFP B-700-1036-001 marked REV
“B” can be supported in 6500.

Note 1: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 2: STM0J is supported on PSFP pluggables that support the STM0J facility on ports 2 to 4 and
ports 6 to 8 of the 8xOC-n/STM-n circuit packs only.

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Performance monitoring
The 8xOC-n/STM-n circuit packs support the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) and
SONET line (L)/SDH multiplex section (MS) for OC-1/STM-0/STM-0J,
OC-3/STM-1/STM-1J, and OC-12/STM-4/STM-4J facilities
• PM collection for SONET path (P)/SDH path (P) for OC-1/STM-0/STM-0J,
OC-3/STM-1/STM-1J, and OC-12/STM-4/STM-4J facilities
• PM collection for STS1, STS3c/VC4, and STS12c/VC4-4c concatenated
payloads
• PM collection for SONET VT Path (VTn)/SDH VC Path (VCm) for
VT1.5/VC11, VT2/VC12, STS1/LO VC3, STS1/HO VC3, and VC4
non-concatenated payloads
• PM collection of protection switch count/duration
• Physical layer PM collection facilities

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Alarm Provisioning Near Limit
• Autoprovisioning Mismatch
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Circuit Pack Latch Open
• Circuit Pack Upgrade Failed
• Cold Restart Required: FPGA Changed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Packet Rate Limit Exceeded
• Provisioning Incompatible

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Pluggable alarms
• Autoprovisioning Mismatch - Pluggable
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Circuit Pack Unknown - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

OCn/STMn facility alarms


• AIS
• Auto Protection Switch Acknowledge Time Out
• DSM-Host Misconnection
• Facility Reconfiguration Required
• Forced Switch Active
• Far End Protection Line Fail
• LINE DCC Link Failure
• LINE DCC OSPF Adjacency Loss
• Loss Of Signal
• Loss Of Frame
• Lockout Active
• Loopback Active
• Protection Scheme Mismatch
• Protection Mode Mismatch
• Protection Switch Byte Fail
• Protection Channel Match Fail
• Protection Exerciser Failed
• Protection Switch Complete
• Protection Locked
• RFI
• Signal Fail
• Signal Degrade
• SECTION DCC Link Failure

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• SECTION DCC OSPF Adjacency Loss


• Trace Identifier Mismatch

Path alarms (STS & VT)


• AIS
• Excessive Error Rate
• Forced Switch Active
• Loss Of Pointer
• Loopback Active - Facility
• Loopback Active - Terminal
• Payload Label Mismatch
• Protection Switch Complete
• RFI
• Signal Degrade
• Trace Identifier Mismatch
• Test Access in Progress - Monitor E
• Test Access in Progress - Monitor F
• Test Access in Progress - Monitor EF
• Test Access in Progress - Split A
• Test Access in Progress - Split B
• Test Access in Progress - Split E
• Test Access in Progress - Split F
• Test Access in Progress - Split EF
• Unequipped

Common alarms
• Software Auto-Upgrade in Progress
• Software Auto-Upgrade Failed
• Timing Distribution Loss Of Reference - n Ref (n=1 to 4)
• Timing Distribution Forced Switch - n Ref (n=1 to 4)
• Timing Distribution Lockout - n Ref (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Major (n=1 to 4)
• Timing Generation Loss Of Reference - n Ref - Minor (n=1 to 4)
• Timing Generation Forced Switch - n Ref (n=1 to 4)
• Timing Generation Lockout - n Ref (n=1 to 4)

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Equipping rules
The following equipping rules apply to 8xOC-n/STM-n circuit pack:
• is a single-slot 8-port interface.
• can be equipped in slots 1 to 6 and 9 to 14 in a 14-slot shelf type.
Note: This circuit pack is not supported in 14-slot shelf types when the
shelf is equipped with PKT/OTN cross-connect circuit packs.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 in a 32-slot


packet-optical shelf type when the shelf is equipped with 640+G
STS-1/VC-3 (640/0) (NTK610BBE5) cross-connect circuit packs.
Note: This circuit pack is not supported in 32-slot packet-optical shelf
types when the shelf is equipped with PKT/OTN cross-connect circuit
packs.

• is not supported in a 7-slot optical shelf type (NTK503PAE5 or


NTK503KA).
• cannot be equipped in a 6500-7 packet-optical shelf type (NTK503RA) in
this release.
• is not supported in a 2-slot shelf type.

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Technical specifications
Table 1-28 lists the weight, power consumption, and SFP specifications for
8xOC-n/STM-n circuit packs.

Table 1-28
Technical specifications for 8xOC-n/STM-n circuit packs
Description PEC Weight Power consumption
(estimated)
Typical (W) Power
(see Note 1, Budget (W)
Note 3, and (see Note 2,
Note 4) Note 3, and
Note 4)
8xOC-n/STM-n 5G VT1.5/LO SFP NTK511AA 0.9 kg (1.9 lb) 25 27
SFP specifications (see Note 5)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggables transceivers must be
considered separately. When estimating the total power for the equipment in a slot or in a system, you
must add the power values for each of the required pluggable devices For pluggable transceiver power
values, refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10DP (Chapter 8):
— “OC-3/12/STM-1/4 SFP optical specifications”
— “OC-3/STM-1, OC-12/STM-4, OC-48/STM-16 CWDM optical specifications”
— “Multirate SFP optical specifications”

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Latency
Table 1-29 shows the latency specifications for 8xOC-n/STM-n circuit packs.
For latency information about OC-n/STM-n, GbE (ETH) and FC-100/200/400
facilities using a SuperMux with XFP (NTK535FAE5) circuit pack, refer to
Broadband, SuperMux, and OTN FLEX MOTR Circuit Packs, 323-1851-102.5
(Chapter 3).

Table 1-29
Latency for 8xOC-n/STM-n circuit packs
OCn/STMn PEC Typical Latency (µs) (Note 1)
OCn/STMn/ XC→
STMnJ→ OCn/STMn/
XC STMnJ
8xOC-n/STM-n 5G VT1.5/LO SFP NTK511AA 2 1
(see Note 2)
Note 1: The latency values in this table are for network planning purposes. Typical latency is specified
separately for the unidirectional ingress path to the cross-connect and the unidirectional egress path
from cross-connect. To calculate the end-to-end latency through the system, add the stated ingress
latency, the cross-connect latency (refer to Common Equipment, 323-1851-102.1 (Chapter 2)) and the
egress latency (for the specific card in use). The measurement does not include the fiber latency.
Note 2: For OCn/STMn facilities, this is the typical latency for STS-1, STS-Nc, and LO_VC3 paths.
LO VT1.5, VT2, VC11 and VC12 paths incur a typical latency of 17 µs.

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OC-n/STM-n circuit packs provisioning procedures


The following flowcharts provide the various steps/procedures that must be
performed in order to have the 1xOC-192/STM-64, 2xOC-48/STM-16,
8xOC-3/12/STM-1/4, 16xOC-n/STM-n, 8xOC-n/STM-n, and
(2+8)xOC-n/STM-n circuit packs ready to carry traffic.

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1xOC-192/STM-64

Install 1xOC192/STM64
circuit pack(s) Note 1: To use the photonic layer, make sure the photonic
layer is provisioned. Refer to "Photonic circuit packs
Procedure 1-1 provisioning procedures" in Photonics Equipment,
323-1851-102.6.
Fiber line side ports
Note 2: The 1xOC192/STM64 circuit pack requires the
Procedures 1-3 & 1-4 cross-connect circuit packs be equipped to auto-provision.
Note 3: For control plane provisioning procedures, refer to
Edit the 10G facility
to out-of-service Configuration - Control Plane, 323-1851-330.

Procedure 1-11

Is this circuit pack Edit OTM2 facility


Yes wavelength & Tx power
equipped with
tunable optics? if applicable
Procedure 1-6
No
Edit other facility
parameters as required

Procedure 1-6

Change protection Change protection Create BLSR ring


1+1 BLSR scheme to BLSR configuration
scheme to 1+1
Line side protection?
Procedure 1-7 Procedure 1-7 Procedure 1-8
Unprotected/UPSR

Provision lower layer DCC/GCC


Is DCC/GCC required? Yes and router circuit
Procedure 1-9
No
Edit the 10G facility
to in-service

Procedure 1-11

Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No

Is this to be carried Yes See "Photonic Network


over a SLAT" in the Photonic
Photonic Layer? Layer Guide, NTRN15DA
No

End
Procedure

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2xOC-48/STM-16

Install the 2xOC-48/STM-16 Note 1: The 2xOC-48/STM-16 circuit pack requires the
circuit pack(s) and SFP(s)
cross-connect circuit packs be equipped to auto-provision.
Procedures 1-1 & 1-2
Note 2: For control plane provisioning procedures, refer to
Configuration - Control Plane, 323-1851-330.
Fiber line side SFP(s)
Procedures 1-3 & 1-4

Edit the optical


facility to out-of-service

Procedure 1-11

Edit the optical facility


parameters as required

Procedure 1-6

Change protection Change protection Create BLSR ring


1+1 BLSR scheme to BLSR configuration
scheme to 1+1
Line side protection?
Procedure 1-7 Procedure 1-7 Procedure 1-8
Unprotected/UPSR

Provision lower layer DCC


Is DCC required? Yes and router circuit
Procedure 1-9
No
Edit the optical facility
to in-service

Procedure 1-11

Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No
End
Procedure

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8xOC-3/12/STM-1/4 (including 8xOC-n/STM-n)

Install 8xOC-n/STM-n
circuit pack(s) and SFP(s) Note 1: The 8xOC-3/12/STM-1/4 circuit pack requires the
cross-connect circuit packs be equipped to auto-provision.
Procedures 1-1 & 1-2
Note 2: For control plane provisioning procedures, refer to
Fiber line side SFP(s) Configuration - Control Plane, 323-1851-330.
Procedures 1-3 & 1-4
Add the desired optical
Is the SFP Yes facility to the SFP(s)
multirate?
Procedure 1-5
No

Edit the optical


facility to out-of-service

Procedure 1-11

Edit the optical facility


parameters as required

Procedure 1-6

Change protection
1+1 scheme to 1+1
Line side protection?
Procedure 1-7
Unprotected/UPSR

Provision lower layer DCC


Is DCC required? Yes
and router circuit
Procedure 1-9
No
Edit the optical facility
to in-service

Procedure 1-11

Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No

End
Procedure

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16xOC-n/STM-n

Install 16xOC-n/STM-n
circuit pack(s) and SFP(s) Note 1: The 16xOC-n/STM-n circuit pack requires the
cross-connect circuit packs be equipped to auto-provision.
Procedures 1-1 & 1-2
Note 2: For control plane provisioning procedures, refer to
Fiber line side SFP(s) Configuration - Control Plane, 323-1851-330.

Procedures 1-3 & 1-4


Add the desired optical
Is the SFP Yes facility to the SFP(s)
multirate?
Procedure 1-5
No

Edit the optical


facility to out-of-service

Procedure 1-11

Edit the optical facility


parameters as required

Procedure 1-6

Change protection Change protection Create BLSR ring


1+1 BLSR scheme to BLSR configuration
scheme to 1+1
Line side protection?
Procedure 1-7 Procedure 1-7 Procedure 1-8
Unprotected/UPSR

Provision lower layer DCC


Is DCC required? Yes
and router circuit
Procedure 1-9
No
Edit the optical facility
to in-service

Procedure 1-11

Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No

End
Procedure

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(2+8)xOC-n/STM-n

Note 1: To use the photonic layer, make sure the photonic


Install the( 2+8)xOC-n/STM-n layer is provisioned. Refer to "Photonic circuit packs
circuit pack(s) and pluggables provisioning procedures" in Photonics Equipment,
Procedures 1-1 & 1-2 323-1851-102.6.
Note 2: The (2+8)xOC-n/STM-n circuit pack requires the
Fiber line side pluggables cross-connect circuit packs be equipped to auto-provision.
Procedures 1-3 & 1-4
Note 3: For control plane provisioning procedures, refer to
Configuration - Control Plane, 323-1851-330.

Is the pluggable Yes Add the desired optical


multirate? facility to the pluggables

No Procedure 1-5
Edit the optical
facility to out-of-service

Procedure 1-11

Edit the optical facility


parameters as required

Procedure 1-6

Change protection Change protection Create BLSR ring


1+1 BLSR scheme to BLSR configuration
scheme to 1+1
Line side protection?
Procedure 1-7 Procedure 1-7 Procedure 1-8
Unprotected/UPSR

Provision lower layer DCC/GCC


Is DCC/GCC required? Yes and router circuit
Procedure 1-9
No
Edit the optical facility
to in-service

Procedure 1-11

Provision path
Traffic connections Yes cross-connection(s)
to be provisioned?
Procedure 1-10
No

Is this to be carried Yes See "Photonic Network


over a SLAT" in the Photonic
Photonic Layer? Layer Guide, NTRN15DA

No
End
Procedure

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Provisioning rules summary for the OC-192/STM-64 DWDM circuit packs


• When an OTM2 facility is automatically or manually created on port 1 of a
OC192/STM64 DWDM circuit packs, an associated OC192/STM64 facility
is auto-created.
• Deleting an OTM2 facility automatically deletes the associated
OC192/STM64 facility.
• Putting the OTM2 facility out-of-service or in-service causes the
OC192/STM64 facility to go out-of-service or in-service.
• Putting the OC192 /STM64 facility out-of-service or in-service has no
effect on the OTM2 facility (however putting the OC192 /STM64 facility
out-of-service may impact the traffic).

Provisioning rules summary for the 16xOC-n/STM-n circuit packs


• 5G version in a 2.5G slot:
— Facility provisioning on ports 9 to 16 is blocked.
— OC12/STM4 facilities can only be provisioned on ports 1, 3, 5, and 7.
— OC12/STM4 facility provisioning is blocked on ports 1, 3, 5, or 7 if an
OC3/STM1 facility is provisioned on ports 2, 4, 6, or 8 respectively.
— OC3/STM1 facilities can be provisioned on ports 1 to 8 as long as
other rates are not provisioned as mentioned above.
• 5G version in a 5G or 10G slot:
— OC12/STM4 facilities can only be provisioned on ports 1, 3, 5, 7, 9, 11,
13, and 15.
— OC12/STM4 facility provisioning is blocked on ports 1, 3, 5, 7, 9, 11,
13, or 15 if an OC3/STM1 facility is provisioned on ports 2, 4, 6, 8, 10,
12, 14, or 16, respectively.
— OC3/STM1 facilities can be provisioned on ports 1 to 16 as long as
other rates are not provisioned as mentioned above.
• 10G version in a 2.5G slot:
— Facility provisioning on ports 5 to 16 is blocked.
— OC48/STM16 facility takes the capacity of 4 ports and can only be
provisioned on port 1 as long as no other rates are provisioned on
ports 2 to 4.
— OC12/OC3/STM4/STM1 facilities can be provisioned on ports 1 to 4
as long as OC48/STM16 facilities are not provisioned as mentioned
above.

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• 10G version in a 5G slot:


— Facility provisioning on ports 9 to 16 is blocked.
— OC48/STM16 facility takes the capacity of 4 ports and can only be
provisioned on ports 1 and 5 as long as no other rates are provisioned
on ports 2 to 4 or 6 to 8 respectively.
— OC12/OC3/STM4/STM1 facilities can be provisioned on ports 1 to 8
as long as OC48/STM16 facilities are not provisioned as mentioned
above.
• 10G version in a 10G slot:
— OC48/STM16 facility takes the capacity of 4 ports and can only be
provisioned on ports 1, 5, 9, and 13 as long as no other rates are
provisioned on ports 2 to 4, 6 to 8, 10 to 12, or 14 to 16 respectively.
— OC12/OC3/STM4/STM1 facilities can be provisioned on ports 1 to 16
as long as OC48/STM16 facilities are not provisioned as mentioned
above.
• The STM1e SFP can only be provisioned on ports 3 to 14. When an
STM1e SFP is inserted, the adjacent ports on the same circuit pack (that
is, the port above and the port below) must be empty. The maximum
number of STM1e SFPs that can be inserted at the same time in a slot is 6.
• When using the MXC circuit packs as cross-connect circuit packs, all
interface slots in a 14-slot shelf (slots 1 to 6 and 9 to 14) can only support
2.5G of traffic. See the rules for a 2.5G slot above.

Provisioning rules summary for the (2+8)xOC-n/STM-n 20G and OTN 20G
circuit packs
• This circuit pack is supported in 10G and 20G slots only.
• Only 10G XFP (ports 1 and 2) and 2.5G SFP (ports 3 to 10) are supported.
• In a 10G slot:
— Facility provisioning on port 2 and ports 7 to 10 are blocked.
— You can provision either one 10G XFP on port 1 or four 2.5G SFP on
ports 3 to 6.
— If port 1 is provisioned, then ports 3 to 6 are blocked. If one of ports 3
to 6 is provisioned, then port 1 is blocked.
— You can have up to 1xOC192/STM64 or 4xOC48/STM16 facilities in
one 10G slot.

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• In a 20G slot:
— You can provision either one 10G XFP on port 1 or four 2.5G SFP on
ports 3 to 6.
— If port 1 is provisioned, then ports 3 to 6 are blocked. If one of ports 3
to 6 is provisioned, then port 1 is blocked.
— You can provision either one 10G XFP on port 2 or four 2.5G SFP on
ports 7 to 10.
— If port 2 is provisioned, then ports 7 to 10 are blocked. If one of ports
7 to 10 is provisioned, then port 2 is blocked.
— Ports 1 and 2 can be provisioned at the same time.
— Ports 1 and 7 to 10 can be provisioned at the same time.
— Ports 2 and 3 to 6 can be provisioned at the same time.
— Ports 3 to 6 and 7 to 10 can be provisioned at the same time.
— You can have up to 2xOC192/STM64, 2xOTM2,
1xOC192+4xOC48/STM16, 1xOTM2+4xOC48/STM16, or
8xOC48/STM16 facilities in one 20G slot.

Provisioning rules summary for the 8xOC-n/STM-n circuit packs


• STM0J facilities are supported on ports 2 to 4 and ports 6 to 8.
• When an STM1e SFP is inserted, the adjacent ports on the same circuit
pack (that is, the port above and the port below) must be empty. The
maximum number of STM1e SFPs that can be inserted at the same time
in a slot is 4.

Table 1-30 provides references to different procedures covered in this chapter.

Table 1-30
Procedures in this chapter

Topic Page

Procedure 1-1, Provisioning a circuit pack automatically 1-123

Procedure 1-2, Provisioning a pluggable automatically 1-125

Procedure 1-3, Routing fiber-optic cables and STM-1e coaxial cables onto the 6500 shelf 1-126

Procedure 1-4, Connecting or disconnecting fiber-optic cables to or from circuit packs 1-127

Procedure 1-5, Adding a facility to an equipment 1-128

Procedure 1-6, Editing facility parameters 1-132

Procedure 1-7, Changing the protection scheme for a pair of facilities 1-133

Procedure 1-8, Creating ring configurations 1-138

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Table 1-30 (continued)


Procedures in this chapter

Procedure 1-9, Adding a new entry in the communications settings 1-143

Procedure 1-10, Adding a path connection 1-145


Procedure 1-11, Changing the primary state of a facility 1-150

Procedure 1-12, Changing the primary state of a circuit pack or pluggable 1-152

Procedure 1-13, Deleting a facility from an equipment 1-154

Procedure 1-14, Deleting a circuit pack or pluggable 1-156

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Procedure 1-1
Provisioning a circuit pack automatically
If automatic equipping is enabled, an OC-n/STM-n circuit pack and any
pluggables present are automatically provisioned when the circuit pack is
inserted in the shelf. Facilities may or may not auto-provision, depending on
the circuit pack and pluggable type. See Table 1-31 on page 1-129 for facilities
that auto-provision and facilities that must be manually provisioned.

To enable automatic equipping, refer to the “Enabling/disabling slot-based


automatic equipping” procedure in Administration and Security,
323-1851-301.

See the “Equipping rules” section for supported slots for 1xOC-192/STM-64,
2xOC-48/STM-16, 8xOC-3/12/STM-1/4, 16xOC-n/STM-n, 8xOC-n/STM-n,
and (2+8)xOC-n/STM-n circuit packs.

If a circuit pack is inserted in an unsupported slot, an Autoprovisioning


Mismatch alarm is raised.

CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.

CAUTION
Risk of autoprovisioning failure
Make sure that you install the shelf processor first, then the
cross-connect circuit packs. Insert circuit packs in the correct
order to ensure autoprovisioning of circuit packs.

CAUTION
Risk of circuit pack damage
Do not force a circuit pack all the way to the back of its slot if it
resists insertion. Before installing a circuit pack, make sure
you know the detailed procedure for inserting the circuit packs.

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Procedure 1-1 (continued)


Provisioning a circuit pack automatically

CAUTION
Risk of incorrect installation
Make sure that the circuit pack lock/eject latches are locked in
position. If the lock covers are not locked, the latch sensors on
the circuit pack do not allow the shelf to identify the circuit
pack, and do not allow the circuit pack to autoprovision.

Prerequisites
• To provision equipment for an empty equipment slot, ensure the last
equipment that occupied the slot and its related facilities and
cross-connects have been deleted.
• Ensure the plastic pin protector on the circuit pack has been removed.
• Ensure automatic equipping is enabled.

Step Action

1 Wear an appropriate ESD personal grounding device to dissipate


electrostatic charges. If you are wearing an antistatic wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2 Insert the circuit pack in the correct slot in the shelf.
If you are logged in to Site Manager when you automatically provision a circuit
pack, click Refresh in the Equipment & Facility Provisioning application to
display the circuit pack in the list of available equipment.
—end—

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Procedure 1-2
Provisioning a pluggable automatically
When automatic equipping is enabled, a pluggable is automatically
provisioned when the pluggable is inserted into the circuit pack port. Facilities
may or may not auto-provision, depending on the circuit pack and pluggable
type. See Table 1-31 on page 1-129 for facilities that auto-provision and
facilities that must be manually provisioned.

To enable automatic equipping, refer to the “Enabling/disabling slot-based


automatic equipping” procedure in Administration and Security,
323-1851-301.

If a pluggable is inserted in an unsupported circuit pack and automatic


equipping is enabled, an Autoprovisioning Mismatch - Pluggable alarm is
raised.

CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.

Prerequisites
• Ensure the last pluggable that occupied the circuit pack port and its related
facilities and cross-connects have been deleted.
• Ensure the plastic pluggable port protector has been removed.
• Ensure automatic equipping is enabled.

Step Action

1 Wear an appropriate ESD personal grounding device to dissipate


electrostatic charges. If you are wearing an antistatic wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2 Insert the pluggable in the correct circuit pack port in the shelf.
—end—

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Procedure 1-3
Routing fiber-optic cables and STM-1e coaxial cables
onto the 6500 shelf
Refer to the procedure on routing fiber-optical cables, and electrical cables, as
applicable, onto the 6500 shelf, in the Installation technical publication specific
to the respective 6500 shelf type.

—end—

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Procedure 1-4
Connecting or disconnecting fiber-optic cables to or
from circuit packs
Refer to the procedure on connecting or disconnecting fiber-optic cables to or
from circuit packs, in the Installation technical publication specific to the
respective 6500 shelf type.

—end—

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Procedure 1-5
Adding a facility to an equipment
Use this procedure to:
• add a facility that was manually deleted
• add a facility for a pluggable on which the facility is not auto-created

See Table 1-31 on page 1-129 for facilities that auto-provision and facilities
that must be manually provisioned.

Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration
drop-down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area, select the circuit pack or pluggable that will support
the facility.
5 Select the appropriate facility type from the Facility Type drop-down list if the
Facility Type drop-down list is enabled.
6 Click Add in the Facility area to open the Add facility dialog box.
7 If you are adding an OCn/STMn/STMnJ facility, select the facility type
(STM0J, OC3/STM1/STM1J, OC12/STM4/STM4J, OC48/STM16, or
OC192/STM64) from the Facility Type drop-down list.
Selecting the facility type automatically sets the port mode to the appropriate
mode.
8 Select the required parameters from the drop-down lists. See the following for
facility attribute descriptions:
• Table 1-37 on page 1-160 for OCn/STMn/STM0J/STM1J/STM4J facility
parameters
• Table 1-38 on page 1-163 for OTM2 facility parameters
• Table 1-40 on page 1-169 for AD facility parameters
9 Click OK to add the facility and close the Add facility dialog box.
—end—

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Table 1-31
Facilities supported on OC-n/STM-n circuit packs (Note 1)
Circuit pack Facilities on the circuit Pluggable Facilities on the pluggable (Note 2)
(Equipment) pack equipment

1xOC192/STM64 non-DWDM: • N/A • N/A


(10G) OC192/STM64 (auto),
NTK523BA/DA/FA/FB AD
NTK524BA/DA/FA/FB DWDM: OTM2
NTK526xx, (OC192/STM64) (auto)
NTK527xx (Note 3), AD
NTK526JA/JB
NTK527JA/JB DWDM AM1/AM2 or
L-band tunable: OTM2
(OC192/STM64, ADJ)
(auto) (Note 3), AD

2xOC-48/STM-16 • none • P2G5 • OC48/STM16 (auto), AD


SFP (2G5)
NTK516BA • PCWDMS • OC48/STM16 (auto), AD
NTK517BA

2xOC-48/STM-16 • none • P2G5 • OC48/STM16 (auto), AD


DPO (2G5)
NTK519BA
NTK520BA

8xOC-3/12/STM-1/4 • none • P155M • OC3/STM1/STM1J (auto), AD


SFP (155622M)
NTK513DA/MA • P622M • OC12/STM4/STM4J (auto), AD

• P155622M • OC3/OC12/STM1/STM4/STM1J
/STM4J, AD

• PCWDMS • OC3/OC12/STM1/STM4/STM1J
/STM4J, AD

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Table 1-31 (continued)


Facilities supported on OC-n/STM-n circuit packs (Note 1)

Circuit pack Facilities on the circuit Pluggable Facilities on the pluggable (Note 2)
(Equipment) pack equipment

• 16xOC-n/STM-n • none • P155M • OC3/STM1/STM1J (auto, Note 10)


5G/10G STS-1/HO (Note 7), AD
SFP (MRO)
NTK512FA • P622M • OC12/STM4/STM4J (auto, Note 10)
NTK512GA (Note 7), AD

• 16xOC-n/STM-n • P155622M • OC3/OC12/STM1/STM1J


5G/10G VT1.5/LO /STM4/STM4J (Note 7), AD
SFP (MRO)
NTK513FA • PCWDMS • OC48/OC3/OC12/STM1/STM1J
NTK513GA /STM4/STM4J/STM16 (Note 6,
Note 7), AD
• 8xOC-n/STM-n
(MRO) NTK511AA • P2G5 • OC48/STM16 (auto, Note 10)
(Note 6), AD

• PSFP • STM0J (Note 5), AD


(Note 4) • OC3/OC12/OC48/STM1/
STM4/STM16 (Note 6), AD

(2+8)xOC-n/STM-n • none • PCWDMS • OC48/STM16, AD


20G and OTN 20G
(MRO) (Note 8) • P2G5 • OC48/STM16 (auto, Note 10), AD
NTK521CA • P10GSEL • OC192/STM64 (auto, Note 10), AD
NTK521DA (Note 9)
NTK522CA
NTK522DA • P10GSOEL • OC192/STM64, AD
• OTM2 (OC192/STM64) (Note 3),
AD

• PXFP • OC192/STM64, AD
• OTM2 (OC192/STM64) (Note 3),
AD

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Table 1-31 (continued)


Facilities supported on OC-n/STM-n circuit packs (Note 1)

Circuit pack Facilities on the circuit Pluggable Facilities on the pluggable (Note 2)
(Equipment) pack equipment

Note 1: Refer to Table 1-12 on page 1-40, Table 1-13 on page 1-41, Table 1-16 on page 1-53, Table
1-19 on page 1-69, Table 1-22 on page 1-88, Table 1-23 on page 1-88, Table 1-24 on page 1-90 and
Table 1-27 on page 1-105 for supported pluggable modules for 2xOC-48/STM-16, 8xOC-3/12/STM-1/4,
16xOC-n/STM-n, and (2+8)xOC-n/STM-n circuit packs.
Note 2: The (auto) means the facility is auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities auto-created on the same port as the main facility or
equipment. These facilities inherit the primary state of the main facility/equipment and are auto-deleted
when the main facility/equipment is deleted.
Note 3: OTM2 TX and OTM2 RX facilities represent the TX and RX portions of the OTM2 facility.
Note 4: 160-9016-900 supports STM0J only. 160-9014-900 and 160-9015-900 do not support
OC12/STM4.
Note 5: STM0J is supported on PSFP pluggables that support the STM0J facility on ports 2 to 4 and
ports 6 to 8 of the 8xOC-n/STM-n circuit packs only.
Note 6: OC48/STM16 is supported on the 10G version of 16xOC-n/STM-n circuit packs only.
Note 7: SDH-J is supported on the 5G version of 16xOC-n/STM-n circuit packs and on the
8xOC-n/STM-n circuit packs only.
Note 8: 10G XFPs (P10GSEL, P10GSOEL, and PXFP) are supported on ports 1 and 2. 2.5G SFPs
(PCWDMS and P2G5) are supported on ports 3 to 10. The OTM2 facility is supported on the OTN
capable variant only.
Note 9: P10GSEL pluggables are supported in NTK521CAE5 and NTK522CAE5 variants only.
Note 10: On the 16xOC-n/STM-n circuit packs (NTK512FAE5, NTK513FAE5, NTK512GAE5,
NTK513GAE5) and (2+8)xOC-n/STM-n circuit packs (NTK521CAE5, NTK521DAE5, NTK522CAE5,
NTK522DAE5), this facility auto-provisions only if the Auto Facility Provisioning system parameter is set
to On in the Node Information application.

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Procedure 1-6
Editing facility parameters
Use this procedure to edit the facility parameters for a facility.

CAUTION
Risk of traffic loss
Editing some OTM2 parameters can affect traffic if the facility
is in-service.

Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration
drop-down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or pluggable whose facilities you want to edit.
5 Select the appropriate facility from the Facility Type drop-down list if more
than one facility type is supported.
6 In the Facility area, select the facility you want to edit.
7 Click Edit in the Facility area to open the Edit Facility dialog box.
8 Select the required parameters from the drop-down lists. See the following for
facility attribute descriptions:
• Table 1-37 on page 1-160 for OCn/STMn/STM0J/STM1J/STM4J facility
parameters
• Table 1-38 on page 1-163 for OTM2 facility parameters
• Table 1-40 on page 1-169 for AD facility parameters
• Table 1-41 on page 1-170 for ADJ facility parameters
9 Click OK.
—end—

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Procedure 1-7
Changing the protection scheme for a pair of facilities
Use this procedure to change the protection scheme for a pair of OCn/STMn
facilities from:
• 1+1/MSP linear to unprotected
• unprotected to 1+1/MSP linear
• unprotected to 2-Fiber BLSR/MS-SPRing
• 2-Fiber BLSR/MS-SPRing to unprotected
• unprotected to 4-Fiber BLSR/MS-SPRing/HERS
• 4-Fiber BLSR/MS-SPRing/HERS to unprotected

CAUTION
Risk of traffic loss
Changing the protection scheme is a service impacting
procedure.

The following apply when changing the protection scheme:


• The working and protection ports on an adjacent pair of multi-port traffic
circuit packs must be horizontally aligned. For example, if the working port
is on slot 1 port 3, then the protection port is on slot 2 port 3 (same port
number). This rule applies for all multi-port circuit packs operating in
protection pairs irrespective of protection scheme being utilized.
• For multiple port interface circuit packs, you can provision the ports to
have different protection schemes.
• You cannot change the protection scheme from unprotected to 1+1/MSP
linear if there are already cross-connects provisioned on the facility that
will become the protection facility.
• The BLSR/MS-SPRing scheme cannot be provisioned if there are already
cross-connects provisioned on either of the two facilities to be provisioned.
• The 2-Fiber BLSR/MS-SPRing protection scheme is only applicable to
OC-48/STM-16 and OC-192/STM-64 facilities.
• The 4-Fiber BLSR/MS-SPRing/HERS protection scheme is only
applicable to OC-192/STM-64 facilities on the 1xOC-192/STM-64 and
(2+8)xOC-n/STM-n circuit packs.
• For 1+1/MSP linear (including SDH-J), and BLSR/MS-SPRing protection
scheme, both working and protection OTM2 and OCn/STMn (STMnJ)
facilities must be set to the same port mode.

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Procedure 1-7 (continued)


Changing the protection scheme for a pair of facilities

Prerequisites
To perform this procedure, you must:
• ensure you have all the documentation relating to editing and deleting
cross-connects, editing a BLSR/MS-SPRing configuration, and changing
a facility state. Refer to the “Editing a path connection”, “Deleting path
connection”, and “Editing a BLSR/MS-SPRing/HERS ring map”
procedures in Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320 and Procedure 1-11, “Changing the primary state of a
facility” on page 1-150.
• use an account with a level 3 or higher UPC

Step Action

1 Select the required network element in the navigation tree.


2 If you are changing the protection scheme Then go to
from unprotected to 1+1/MSP linear step 3
from 1+1/MSP linear to unprotected step 4
from unprotected to BLSR/MS-SPRing/HERS step 5
from BLSR/MS-SPRing/HERS to unprotected step 6

3
CAUTION
Risk of traffic loss
Ensure cross-connects are not carrying traffic before
you delete them. Deleting a cross-connect that is
carrying traffic causes traffic loss.

Ensure that any 1WAYPR or 2WAYPR (UPSR/SNCP protected)


cross-connects that exist on the odd slot facility are changed to 1WAY or
2WAY (unprotected).
To change from protected (1WAYPR or 2WAYPR) to unprotected (1WAY or
2WAY), you must delete the protected cross-connects and re-add them as
unprotected cross-connects. Refer to the “Deleting path connections”
procedure in Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320 and Procedure 1-10, “Adding a path connection” on page
1-145.
Go to step 9.

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Procedure 1-7 (continued)


Changing the protection scheme for a pair of facilities

Step Action

4
CAUTION
Risk of traffic loss
If you place a facility out-of-service, you can cause a
loss of traffic.

Change the even slot facility in 1+1 protection to the out-of-service state. See
Procedure 1-11, “Changing the primary state of a facility” on page 1-150.
Go to step 9.
5
CAUTION
Risk of traffic loss
Ensure cross-connects are not carrying traffic before
you delete them. Deleting a cross-connect that is
carrying traffic causes traffic loss.

Delete cross-connects for the facilities that are in the unprotected


configuration. Refer to the “Deleting path connections” procedure in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
Go to step 9.
6
CAUTION
Risk of traffic loss
Ensure connections are not carrying traffic before you
delete them. Deleting a connection that is carrying
traffic causes traffic loss.

Delete connections for the facilities that are in a BLSR/MS-SPRing/HERS


configuration. Refer to the “Deleting path connections” procedure in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
7 Delete the APSIDs for facilities in the ring map of the
BLSR/MS-SPRing/HERS configuration. Refer to the “Editing a
BLSR/MS-SPRing/HERS ring map” procedure in Part 1 of Configuration -
Bandwidth and Data Services, 323-1851-320.
The APSIDs of the facilities must be deleted from the ring map at each
network element in the BLSR/MS-SPRing/HERS configuration.

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Procedure 1-7 (continued)


Changing the protection scheme for a pair of facilities

Step Action

8
CAUTION
Risk of traffic loss
If you place a facility out-of-service, you can cause a
loss of traffic.

Change the odd and even slot facilities in BLSR/MS-SPRing/HERS


protection to the out-of-service state. See Procedure 1-11, “Changing the
primary state of a facility” on page 1-150.
9 Select Protection Provisioning from the Protection drop-down menu to
open the Protection Provisioning application.
10 Select the appropriate facility type and shelf from the Type and Shelf
drop-down lists.
The provisioning data table opens.
11 Select an entry from the table.
When changing the protection scheme, provisioning the protection scheme
for one of the facilities in a pair automatically provisions the protection
scheme for the other facility in the pair.
12 Click Edit to open the Edit protection provisioning dialog box.
13 Select the radio button of the new protection scheme (Unprotected, 1+1
linear, MSP, 1+1 TPT, 2F BLSR/MS-SPRing, 4F BLSR/MS-SPRing, or
1+1).
14 If you are changing the protection scheme Then go to
from unprotected to 1+1/MSP linear step 15
from unprotected to BLSR/MS-SPRing/HERS step 16
from 1+1/MSP linear to unprotected step 19
from BLSR/MS-SPRing/HERS to unprotected step 19

15 Select the required remote standard (G-841, GR253, or EN300) if applicable.


You can change the Switch mode (Unidirectional or Bidirectional) and Route
diversity (On or Off). See the “Changing the protection parameters for a pair
of facilities or equipment” procedure in Part 2 of Configuration - Provisioning
and Operating, 323-1851-310.
Go to step 19.
16 Select the required remote standard (BLSR/MS-SPRing or HERS) if
applicable.
17 Select the required wait to restore ring time (0 to 12 minutes or Infinite) if
applicable.

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Procedure 1-7 (continued)


Changing the protection scheme for a pair of facilities

Step Action

18 Select the required wait to restore span time (0 to 12 minutes or Infinite) if


applicable.
19 Click OK.
20 Click Yes in the confirmation dialog box.
When changing the protection scheme from 1+1/MSP linear to unprotected,
any 1WAY or 2WAY connections that were provisioned exist only against the
working facility. If the existing connections are required to form part of new
UPSR/SNCP connections, delete the 1WAY or 2WAY connections and create
1WAYPR or 2WAYPR connections as required. Refer to the “Deleting path
connections” procedure in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320 and Procedure 1-10, “Adding a path connection” on
page 1-145.
21 Change the odd and even slots facility back to the in-service state if
applicable. See Procedure 1-11, “Changing the primary state of a facility” on
page 1-150.
22 Repeat this procedure to provision the same protection scheme on the
remaining nodes in the protection configuration if it has not been done.
23 Run the protection exerciser to detect potential protection misconfigurations.
See the “Running/inhibiting the exerciser” procedure in Part 2 of
Configuration - Provisioning and Operating, 323-1851-310.
—end—

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Procedure 1-8
Creating ring configurations
Use this procedure to create configurations for BLSR/MS-SPRing/HERS rings
for the following circuit packs:
• 1xOC-192/STM-64
• 2xOC-48/STM-16
• 16xOC-n/STM-n (OC48/STM16 facilities)
• (2+8)xOC-n/STM-n

You can save the configurations as ring configuration files to provide a starting
point or template for creating additional ring configurations. Refer to “Ring
APS configuration editor parameters” on page 1-183 for details on ring
parameters.

Note: This is a generic procedure to create a ring configuration for the


circuit packs listed above. For detailed information on ring configurations
and related procedures, refer to "BLSR/MS-SPRing APS configuration
files editing" (Chapter 1) and "BLSR/MS-SPRing APS provisioning"
(Chapter 2) in Part 1 of the Configuration - Bandwidth and Data Services,
323-1851-320.

Step Action

1 Select Ring APS Configuration Editor from the Tools menu to open the
Ring APS Configuration Editor application.
The Ring APS Configuration Editor application opens with no data if a
configuration file has not been previously opened with this session of Site
Manager. Otherwise, the latest configuration file will be displayed.
2 Type the name of the new ring in the Ring name field.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
3 Select the ring type of the new ring from the Ring type drop-down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
4 Click on the Add Node tool icon. (Once at least one node has been created,
you can also double click on the Add diamond, the diamond shaped icon on
the facility connecting line directly under the center of the node graphic.)
The Add Node dialog box appears.
5 Select the node type of the new ring from the Node type drop-down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.

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Procedure 1-8 (continued)


Creating ring configurations

Step Action

6 Type a node identifier in the Node field or select a node from the drop-down
list. The drop-down list displays all nodes Site Manager is currently logged in
to that have at least one pair of facilities that are BLSR/MS-SPRing/HERS
protected. You can type in any other node identifier, whether or not the node
is known to Site Manager.
When a node is selected from the Node drop down list, the entries in the
facility drop-down list(s) are updated. You should first define the node, then
the facilities, otherwise the user provided facility data is replaced whenever a
new node is selected. However, the facility entries are not affected if you type
the node name instead of selecting it from the drop down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
7 Type an APS identifier in the APS ID field or select an APS identifier from the
drop-down list.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
8 If in step 3 you selected the Ring type as Then go to
2 Fiber step 9
4 Fiber step 11

9 Type a facility identifier in the East facility linked to: Next node field or select
a facility from the drop-down list. The drop-down list displays all facilities Site
Manager knows to be an East facility (that is, a BLSR/MS-SPRing working
member of a 2-fiber group) and are associated with the node selected in the
Node field. You can type in any other facility identifier, whether or not it is
known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: “Next node” in the East facility linked to: Next node field changes to
the node name (for example, 6500-1, 6500-2, etc.) after the first node has
been entered. For example; East facility <facility-shelf-slot-port> linked to:
West of 6500-1. If the node is not the first node and the neighbor has no node
name or TID assigned to it but has an APS ID, the label appears as: East
facility <facility-shelf-slot-port> linked to: West of node with APSID<#>.
When you select a value in one of the facility drop-down lists, the other list
automatically adjusts to show the protection group mate facility. If you modify
both facilities, the automatic selection of the mate is disabled, but becomes
re-enabled if you select another node.
When you add the node information to the Nodes area, this facility appears
on right side of node and connects the node to the node below it in the Nodes
area. The last node in the Nodes area is connected to the first node.

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Procedure 1-8 (continued)


Creating ring configurations

Step Action

10 Type a facility identifier in the West facility linked to: Previous node field or
select a facility from the drop-down list. The drop-down list displays all
facilities Site Manager knows to be a West facility (that is, a
BLSR/MS-SPRing protection member of the 2-fiber group) and are
associated with the node selected in the Node field. You can type in any other
facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Previous node” in the West facility linked to: Previous node
field changes to the node name (for example, 6500-1, 6500-2, etc.) after the
first node has been entered. For example, West facility
<facility-shelf-slot-port> linked to: East of 6500-2. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label appears as: West facility <facility-shelf-slot-port> linked to: East
of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on left side of node and connects the node to the node above it in the Nodes
area. The first node in the Nodes area is connected to the last node.
Go to step 15.
11 Type a facility identifier in the Working east facility linked to: Next node
field or select a facility from the drop-down list. The drop-down list displays all
facilities Site Manager knows to be a Working east facility (that is, a
BLSR/MS-SPRing/HERS working member on the east side of a 4-fiber
group) and are associated with the node selected in the Node field. You can
type in any other facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Next node” in the Working east facility linked to: Next node
field changes to node name (for example, 6500-1, 6500-2, etc.) after the first
node has been entered. For example; Working east facility
<facility-shelf-slot-port> linked to: West of 6500-1. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label appears as: Working east facility <facility-shelf-slot-port> linked
to: West of node with APSID<#>.
When you select a value in one of the facility drop-down lists, the other lists
automatically adjust to show the available facilities.
When you add the node information to the Nodes area, this facility appears
on right side of node and connects the node to the node below it in the Nodes
area. The last node in the Nodes area is connected to the first node.

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Procedure 1-8 (continued)


Creating ring configurations

Step Action

12 Type a facility identifier in the Protection east facility linked to: Next node
field or select a facility from the drop-down list. The drop-down list displays all
facilities Site Manager knows to be a Protection east facility (that is, a
BLSR/MS-SPRing/HERS protection member on the east side of a 4-fiber
group) and are associated with the node selected in the Node field. You can
type in any other facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Next node” in the Protection east facility linked to: Next node
field changes to node name (for example, 6500-1, 6500-2, etc.) after the first
node has been entered. For example; Protection east facility
<facility-shelf-slot-port> linked to: West of 6500-2. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label appears as: Protection east facility <facility-shelf-slot-port> linked
to: West of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on right side of node and connects the node to the node below it in the Nodes
area. The last node in the Nodes area is connected to the first node.
13 Type a facility identifier in the Working west facility linked to: Previous
node field or select a facility from the drop-down list. The drop-down list
displays all facilities Site Manager knows to be a Working west facility (that is,
a BLSR/MS-SPRing/HERS working member on the west side of a 4-fiber
group) and are associated with the node selected in the Node field. You can
type in any other facility identifier, whether or not it is known to Site Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Previous node” in the Working west facility linked to: Previous
node field changes to node name (for example, 6500-1, 6500-2, etc.) after
the first node has been entered. For example, Working west facility
<facility-shelf-slot-port> linked to: East of 6500-1. If the node is not the first
node and the neighbor has no name or TID assigned to it but has an APS ID,
the label will appear as: Working west facility <facility-shelf-slot-port>
linked to: East of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on left side of node and connects the node to the node above it in the Nodes
area. The first node in the Nodes area is connected to the last node.

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Procedure 1-8 (continued)


Creating ring configurations

Step Action

14 Type a facility identifier in the Protection west facility linked to: Previous
node field or select a facility from the drop-down list. The drop-down list
displays all facilities Site Manager knows to be a Protection west facility (that
is, a BLSR/MS-SPRing/HERS protection member on the west side of a
4-fiber group) and are associated with the node selected in the Node field.
You can type in any other facility identifier, whether or not it is known to Site
Manager.
Refer to Table 1-47 on page 1-183 for parameter descriptions and options.
Note: The “Previous node” in the Protection west facility linked to:
Previous node field changes to node name (for example, 6500-1, 6500-2,
etc.) after the first node has been entered. For example; Protection west
facility <facility-shelf-slot-port> linked to: East of 6500-2. If the node is not
the first node and the neighbor has no name or TID assigned to it but has an
APS ID, the label appears as: Protection west facility
<facility-shelf-slot-port> linked to: East of node with APSID<#>.
When you add the node information to the Nodes area, this facility appears
on left side of node and connects the node to the node above it in the Nodes
area. The first node in the Nodes area is connected to the last node.
15 If you want to use the Add Node dialog box information Then go to
to add a new node to the configuration, and want to
add more nodes step 16
close the dialog step 18

16 Click on Apply.
The node appears in the Nodes area of the Ring APS Configuration Editor
application and the Add Node dialog box remains open.
17 If you want to add another node, return to step 6. Otherwise, go to step 18.
18 Click OK.
The Add Node dialog box closes, and the node appears in the Nodes area
of the Ring APS Configuration Editor application.
19 Save the configuration as described in the "Saving a ring configuration file"
procedure in Chapter 1 in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320.
20 Apply the configuration information to a node or nodes. Refer to the “Applying
ring configuration files to nodes” procedure in Chapter 1 in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.
—end—

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Procedure 1-9
Adding a new entry in the communications settings
Use this procedure to add a new entry (interface, circuit, router) in the
communications settings. For more information on these parameters and how
they apply to the DCN, refer to Part 4 of Planning, NTRN10DP.

Prerequisites
To perform this procedure, you must use an account with a level 3 UPC or
higher.

Step Action

1 Select the required network element in the navigation tree.


2 Select Comms Setting Management from the Configuration drop-down
menu to open the Comms Setting Management application.
3 Select the required tab.
4 Select the required shelf from the Shelf drop-down list.
5 Select the appropriate comms type from the Router type or Interface type
drop-down list.
6 Click Add to open the appropriate add dialog box.
7 Add the parameters as required (if appropriate). See the following for
parameters that can be added:
• Interfaces
— “Lower Layer DCC/GCC parameters” on page 1-172
• Routers
— “IISIS Router parameters” on page 1-175
— “IISIS Circuit parameters” on page 1-177
— “OSPF Router parameters” on page 1-178
— “OSPF Circuit parameters” on page 1-180
For the Add IISIS Router Parameters and the Add OSPF Router Parameters
dialogs, you have the option of adding distribution lists. To add a distribution
list, use the Add button in Redistribution section (lower section). A maximum
of 80 distribution lists can be added for each type of list. To delete a
distribution list, select the distribution list in the Redistribution section (lower
section) and select Delete.

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Procedure 1-9 (continued)


Adding a new entry in the communications settings

Step Action

8 If Then
the dialog allows more than one entry to be click Apply, go
added and you want to add another entry to step 7
otherwise go to step 9

9 Click OK.
—end—

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Procedure 1-10
Adding a path connection
Use this procedure to add a 1WAY, 1WAYPR, 2WAY, 2WAYPR, or 2WAYDPR
path connection to a network element for the following circuit packs:
• 1xOC-192/STM-64
• 2xOC-48/STM-16
• 8xOC-3/12/STM-1/4
• 16xOC-n/STM-n
• (2+8)xOC-n/STM-n protection channels of a 4-Fiber
BLSR/MS-SPRing/HERS

Note: This is a generic procedure to enter a path connection for the circuit
packs listed above. For detailed information on each connection type,
recommendations for use of connection types to support a particular
network configuration, and example networks, refer to "Path connections
management" in Chapter 3 in Part 1 of Configuration - Bandwidth and
Data Services, 323-1851-320.

If you want to add an SDH-SONET gateway or LO-HO connection using a


240/80 cross-connect circuit pack, refer to the “VC4-mapped VC3s
(SDH/SDH-J only)” section in Chapter 3 in Part 1 of Configuration - Bandwidth
and Data Services, 323-1851-320, for usage conditions.

Note: Immediately following SLAT and during the initial launch of the Path
Connections application in Site Manager, the Path Connections
application does not allow the creation of STS192c/STM64c path
connections. If you attempt to do so, a "No facilities found on the NE" error
message appears. You must acknowledge the error message and in order
to create STS192c/STM64c path connections, you must manually refresh
the Equipment & Facility Provisioning application in Site Manager.
Subsequent launches of the Path Connections application in Site
Manager allow you to create STS-192c/STM-64c path connections
without the need to manually refresh the Equipment & Facility
Provisioning application in Site Manager. Alternative to manually refresh
the Equipment & Facility Provisioning application in Site Manager and
after performing SLAT, you can logout and then log back into the same Site
Manager session to resolve the issue.

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Procedure 1-10 (continued)


Adding a path connection

Note: If you encounter a "Backplane bandwidth is fragmented" error


message during this procedure, refer to the “Backplane bandwidth
fragmentation” section and the “Backplane Bandwidth Query toolset”
sub-section in Chapter 3 in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320.

Prerequisites
To perform this procedure, you must:
• use an account with a level 3 or higher UPC
• have met all specific requirements for bandwidth management for path
connections in a BLSR/MS-SPRing/HERS configuration. Refer to the
"BLSR/MS-SPRing/HERS configuration requirements” section in
Chapter 3 in Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320.
• have met all specific requirements for bandwidth management for path
connections in a UPSR/SNCP ring configuration. Refer to the
“UPSR/SNCP ring requirements” section in Chapter 3 in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320.

Step Action

1 Select the required network element in the navigation tree.


2 Select Cross Connections: Path Connections from the Configuration
menu.
If this is the initial launch of the Path Connections application, no path
connections appear until you perform a Retrieve. Subsequent launches of
the Path Connections application display path connections based on the last
filter criteria.
3 Click Add to display the Add Cross-Connect dialog box.
4 If you Then go to
want to provision a Connection ID step 5
do not want to provision a Connection ID step 7

5 Click once in the Connection ID text field.


6 Type the connection identifier.
Refer to Table 1-48 on page 1-186 for supported options.
7 From the Rate drop-down list, select a signal rate.
Refer to Table 1-48 on page 1-186 for supported path connection rates.

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Procedure 1-10 (continued)


Adding a path connection

Step Action

8 From the Type drop-down list, select the connection type.


Refer to Table 1-49 on page 1-189 for supported path connection types.
9 For 1WAYPR/2WAYPR/2WAYDPR connection types in UPSR/SNCP
configurations, select the Revertive check box to enable revertive mode, if
required.
10 For 1WAYPR/2WAYPR/2WAYDPR connection types in UPSR/SNCP
configurations, specify the guard time, if required, in the Guard Time field.
11 If required, select the Auto Concatenation check box to enable auto
concatenation for the connection.
Note: Auto concatenation is only supported with certain cross-connect circuit
packs. Refer to the “SONET/SDH auto concatenation” section in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320 for details.
12 Select the required equipment, facility, AU3 or AU4 mapping, and payload
parameters from the drop-down lists for each of the following panels:
• From
• To
• Switch Mate (applicable to 1WAYPR, 2WAYPR, and 2WAYDPR
connections only)
• Destination Mate (applicable to 2WAYDPR connections only).
Refer to Table 1-50 on page 1-190 for equipment and facility parameters for
path connections and Table 1-49 on page 1-189 for allowable path
connections types between network configurations.
Site Manager automatically populates the available parameter fields after you
select the Rate and Type.
If only AU3 mapping is supported (when the port mode is SONET or an
STS3c/VC4 rate or above is selected), the AU3 and AU4 radio buttons do not
appear in the Add Cross-Connect dialog box.
If you want to bulk provision all VT1.5s/VC11s or VT2s/VC12s in an
STS/TUG-3 (K), select ALL in the VTG/TUG-2 (L) drop-down lists.
To add a connection that is to be carried as extra traffic on the protection
channels of a 2-Fiber BLSR/MS-SPRing, the Extra Traffic check box must
first be selected to enable selection of the protection channels.
To add a connection that is to be carried as extra traffic on the protection
channels of a 4-Fiber BLSR/MS-SPRing/HERS, select a facility on the
protection circuit pack in the From panel and another facility in the To panel.
When channels representing protection channels are selected, the Extra
Traffic check box is automatically selected and grayed out.

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Procedure 1-10 (continued)


Adding a path connection

Step Action

13 If Then go to
you want to create the connection on BLSR/MS-SPRing step 14
endpoints
the connection you are adding is to be carried as extra traffic on step 15
the protection channels of a 2-Fiber BLSR/MS-SPRing
the connection you are adding is to be carried as extra traffic on step 18
the protection channels of a 4-Fiber BLSR/MS-SPRing/HERS
otherwise step 18

14 If you Then
want to create a VT/VC access 2-Fiber check the VT
BLSR/MS-SPRing connection at the pass-through Access checkbox
node but you have not selected a VT/VC rate in step and go to step 18
7 (for example, you selected a STS/VC4 rate in step
7)
otherwise go to step 17
Note: For more information about the VT/VC accessed BLSR/MS-SPRing
feature, refer to the “VT/VC-accessed BLSR/MS-SPRing” section in
Chapter 3 of Part 1 of Configuration - Bandwidth and Data Services,
323-1851-320.

15 Select the Extra Traffic check box in the From and To panels, as required.
16 Select the required protection channel(s) from the payload parameters
drop-down lists.
Go to step 18.
17 Select the End NE A and End NE Z node from the APSIDs in the drop-down
lists in the BLSR/MS-SPRing Endpoints panel.
Note: These fields are available only if ENUT or Extra Traffic is not selected.
18 If you Then click
provision additional connections Apply
enter this connection and return to the main OK (Apply & Close)
connection screen

If you are adding a single path connection, the path connection is added. If
the path connection cannot be added, an error message appears.
If you are adding multiple path connections, the Multiple Cross Connect
Add Confirmation dialog box appears. Check that the multiple path
connections are correct, then click Yes. If the path connections cannot be
added, an error message appears.

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Procedure 1-10 (continued)


Adding a path connection

Step Action

19 If in step 18 you selected Then


Apply go to step 4
OK (Apply & Close) the procedure is complete.
When adding an add/drop connection to/from a
BLSR/MS-SPRing/HERS configuration, if you
provision the From endpoint on the add/drop port
and the To endpoint on the
BLSR/MS-SPRing/HERS add/drop port, the
From and To endpoints automatically swap. Click
Refresh to display the updated information.
—end—

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Procedure 1-11
Changing the primary state of a facility
Use this procedure to change the primary state of a facility.

CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a loss of
traffic.

In a 1xOC-192/STM-64 L-Band tunable, 1xOC-192/STM-64 DWDM or


1xOC-192/STM-64 AM1/AM2 DWDM tunable HO/LO circuit pack, putting the
OTM2 facility out-of-service or in-service causes the OC192/STM64 facility to
go out-of-service or in-service. However putting the OC192/STM64 facility
out-of-service or in-service has no effect on the OTM2 facility (although
putting the OC192/STM64 facility out-of-service may impact the traffic).

Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration
drop-down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or pluggable whose facility state you want to change.
5 Select the appropriate facility from the Facility Type drop-down list if more
than one facility type is supported.
6 In the Facility area, select the facility whose state you want to change.
7 Click Edit in the Facility area to open the Edit facility dialog box.

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Procedure 1-11 (continued)


Changing the primary state of a facility

Step Action

8 Select OOS or IS from the Primary state drop-down list.


CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.

9 Click OK.
10 If changing the primary state to OOS, click Yes in the warning dialog box.
—end—

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Procedure 1-12
Changing the primary state of a circuit pack or
pluggable
Use this procedure to change the primary state of a circuit pack or pluggable
to in-service or out-of-service.

You cannot change the primary state of a pluggable to in-service if the


associated circuit pack is out-of-service.

You must change the primary state of any related facilities to out-of-service
before changing the primary state of a circuit pack or pluggable to
out-of-service, see Procedure 1-11, “Changing the primary state of a facility”
on page 1-150.

Changing the primary state of a circuit pack automatically changes the


primary state of any provisioned pluggables on that circuit pack to the same
state.

Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration
drop-down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 If you are changing the primary state to Then go to
OOS step 5
IS step 6

5 Ensure any related facilities are out-of-service. See Procedure 1-11,


“Changing the primary state of a facility” on page 1-150.

CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.

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Procedure 1-12 (continued)


Changing the primary state of a circuit pack or pluggable

Step Action

6 Select the circuit pack or pluggable in the Equipment area.


7 Click Edit in the Equipment area to open the Edit Equipment dialog box.
8 Select IS or OOS from the Primary state drop-down list.
9 Click OK.
10 If you are changing the primary state to OOS, click Yes in the warning dialog
box.
—end—

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Procedure 1-13
Deleting a facility from an equipment
Use this procedure to delete a facility.

CAUTION
Risk of service interruption
If you delete a facility, you can cause a loss of traffic.

Facilities that are auto-created (facilities in brackets in Table 1-31 on page


1-129) when the main facility is created will be auto-deleted when the main
facility is deleted.

Prerequisites
To perform this procedure, you must
• ensure the end-to-end service to be deleted is not carrying traffic
• ensure the facility to be deleted is out-of-service and is not in maintenance
state
• delete the sub-network connection if provisioned on this facility. Refer to
the “Deleting a sub-network connection” procedure in Configuration -
Control Plane, 323-1851-330.
• delete the connections of the entire path. Refer to the “Deleting path
connections” procedure in Part 1 of Configuration - Bandwidth and Data
Services, 323-1851-320.
• delete the IISIS circuit or OSPF circuit and then the GCC or DCC if
provisioned on the facility to be deleted. Refer to the “Deleting an entry in
the communications settings” procedure in Part 1 of Configuration -
Provisioning and Operating, 323-1851-310.
• delete the timing reference if it is provisioned on the facility to be deleted.
Refer to the “Provisioning the network element timing mode and
references” procedure in Part 2 of Configuration - Provisioning and
Operating, 323-1851-310.
• ensure that the protection switching scheme on the facility to be deleted is
provisioned as unprotected. See Procedure 1-7, “Changing the protection
scheme for a pair of facilities” on page 1-133.
• ensure that no loopback exists on the facility. Refer to the
“Operating/releasing a loopback” procedure in Part 1 of Configuration -
Provisioning and Operating, 323-1851-310, to release a loopback if it
exists.

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Procedure 1-13 (continued)


Deleting a facility from an equipment

• for STM0J, OC3/STM1/STM1J and OC12/STM4/STM4J ports, ensure


that the port is not reserved for test access, refer to the “Test access and
connection loopback provisioning” chapter in Part 2 of Configuration -
Provisioning and Operating, 323-1851-310
• use an account with a level 3 or higher UPC

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration
drop-down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or pluggable whose facilities you want to delete.
5 Select the appropriate facility from the Facility Type drop-down list if more
than one facility type is supported.
6 In the Facility area, select the facility you want to delete.
7 Click Delete in the Facility area.
8 Click Yes in the warning dialog box.
—end—

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Procedure 1-14
Deleting a circuit pack or pluggable
Use this procedure to delete a circuit pack or pluggable equipment from the
list of provisioned equipment in the Equipment and Facility Provisioning
application. Deleting a circuit pack automatically deletes any provisioned
pluggables on that circuit pack.

Prerequisites
To perform this procedure, you must
• use an account with a level 3 or higher UPC
• delete all connections provisioned through the equipment,
Refer to the “Deleting path connections” procedure in Part 1 of
Configuration - Bandwidth and Data Services, 323-1851-320 on how to
delete a nodal connection.
• delete all facilities on the circuit pack or pluggable. See Procedure 1-13,
“Deleting a facility from an equipment” on page 1-154.
• put the circuit pack or pluggable to be deleted out-of-service. See
Procedure 1-12, “Changing the primary state of a circuit pack or
pluggable” on page 1-152.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration
drop-down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area, select the equipment (circuit pack or pluggable) you
want to delete.
5 Click Delete in the Equipment area.
6 Click Yes in the warning dialog box.
—end—

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Equipment and facility provisioning parameters


Table 1-32 to Table 1-34 on page 1-158 provide information on equipment and
facility primary and secondary states. Table 1-35 on page 1-159 to Table 1-41
on page 1-170 provide facility parameter information for the corresponding
facilities.

Table 1-32
Equipment and facility primary states
Primary State Description
IS In-service; no failure detected
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is partial failure)
OOS-AU Out-of-service - autonomous; failure detected
OOS-MA Out-of-service - maintenance; no failure detected (OOS for maintenance
for provisioning memory administration)
OOS-AUMA Out-of-service - autonomous - maintenance; failure detected
OOS-MAANR Out-of-service - maintenance - abnormal; partial failure detected

Table 1-33
Equipment secondary states

Secondary State Description


Active Equipment has connections established to the facilities it supports and the
connected facilities are in-service, or in-service connected facilities are on
the active traffic path in a protected connection
Fault detected Equipment failure detected
Idle No connections established to facilities supported on this equipment, all
connected facilities are out-of-service, or in-service connected facilities are
not on the active traffic path in a protected connection
Mismatched eqp. attribute Mismatched or unknown equipment detected in a provisioned slot
Supporting entity outage Supporting equipment has a failure (applicable to pluggables when
associated circuit pack is missing or has failed or is mismatched)
Unequipped Equipment is missing
Unknown Equipment cannot be identified

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Table 1-34
Facility secondary states
Secondary State Description
<null> Active, working state for UPSR/SNCP facility.
Working receiver Active OCn/STMn facility in the specified direction
Working transmitter
Protected Optical line in a BLSR/MS-SPRing protection scheme is protected
Hot standby Inactive facility in both directions (Hot standby)
Protection switch Protection switch inhibited. Lockout command issued on a line OCn/STMn.
inhibited
Disconnected Facility has no connections established.
Fault detected Facility failure detected
Supporting entity Supporting equipment (circuit pack):
outage • has a failure, or
• is missing, or
• is mismatched, or
• has an associated connection which is failed.
Loopback active Loopback (facility, terminal, or EFM remote) active on facility
Test The facility acts as a test access port if “Test” is selected. For more information
about test access, refer to the “Test access and connection loopback provisioning”
chapter in Part 2 of Configuration - Provisioning and Operating, 323-1851-310.
Applicable to STM0J, OC3/STM1/STM1J and OC12/STM4/STM4J facilities only.
Maintenance State Maintenance State is enabled. When in Maintenance State, a facility continues to
carry traffic if it can, but does not raise alarms, SNMP traps or Performance
Monitoring Threshold Crossing Alerts (PM TCAs).
Applies to facilities that support maintenance state. See Table 1-36 on page 1-159.
Maintenance state is applicable to these facilities only if they are in out-of-service
state.
Auto in-service AINS is enabled. Applies to facilities that support AINS. See Table 1-35 on page
1-159.

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Table 1-35
Facilities that support Automatic In-Service (AINS)

Equipment Facility type Default value Note


10G OC192/STM64 Enabled child facility (Note): STSn/VTn
OTM2 Disabled child facility (Note): OC192/STM64
155622M OC12/3/STM4/1/4J/ Enabled child facility (Note): STSn/VTn
1J
2G5 OC48/STM16 Enabled child facility (Note): STSn/VTn
MRO OC48/12/3/STM16/ Enabled child facility (Note): STSn/VTn
4/1/4J/1J/0J
OC192/STM64 Enabled child facility (Note): STSn/VTn
OTM2 Disabled child facility (Note): OC192/STM64,
STSn/VTn
Note: The child facility follows the AINS state of its parent facility.

Table 1-36
Facilities that support maintenance state

Equipment Facility type Note


10G OC192/STM64 child facility (Note): STSn/VTn
OTM2 child facility (Note): OC192/STM64
155622M OC12/3/STM4/1/4J/1J child facility (Note): STSn/VTn
2G5 OC48/STM16 child facility (Note): STSn/VTn
MRO OC48/12/3/STM16/4/1/4J/ child facility (Note): STSn/VTn
1J/0J
OC192/STM64 child facility (Note): STSn/VTn
OTM2 child facility (Note): OC192/STM64, STSn/VTn
Note: The child facility follows the Maintenance state of its parent facility. The only exception is the
OC192/STM64 child facility to the OTM2 parent facility on 10G and MRO, where the OC-192/STM-64
child facility can be placed into MT state independent of its parent.

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Facility parameters
OCn/STMn/STM0J/STM1J/STM4J facility parameters
Table 1-37
OCn/STMn/STM0J/STM1J/STM4J facility parameters

Parameter Options Description

Unit facility-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility. Read-only.
Primary state See “Equipment and Sets the primary state of the facility. Default reflects primary
facility primary state of associated equipment.
states” on page Note: IS and OOS are selectable.
1-157
Secondary See “Facility Displays the facility operational state.
State secondary states” on For STM0J, OC3/STM1/STM1J and OC12/STM4/STM4J
page 1-158 facilities, the Test state is editable.
The AINS state is editable.
The Maintenance state is editable.

Port mode • SONET Sets the port mode. By default, the port mode is set to the NE
• SDH mode. Automatically updated to reflect facility type selected.
• SDH-J Note 1: Each OCn/STMn port can also individually set to either
the SONET, or SDH, or SDH-J port mode by selecting the
appropriate facility type.
Note 2: Only the STM0J, OC3/STM1 and OC12/STM4 ports
can be set to SDH-J port mode.
Note 3: The OC192/STM64 port mode in a 1xOC-192/STM-64
L-Band tunable, 1xOC-192/STM-64 DWDM, or
1xOC-192/STM-64 AM1/AM2 DWDM tunable HO/LO circuit
pack follows the OTM2 port mode.
Note 4: The port mode is not editable, you must set the mode
during adding of the optical facility. Once set, to change the port
mode you must delete the facility and then add the facility again
with the correct port mode.

Signal mode • SONET (default for Sets the signal mode (SS bits).
SONET port mode)
• SDH (default for
SDH port mode)
• SDH-J (default for
SDH-J port mode)

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Table 1-37 (continued)


OCn/STMn/STM0J/STM1J/STM4J facility parameters

Parameter Options Description

Signal degrade • 1x10^-5 Sets the signal degrade threshold.


threshold • 1x10^-6 (default)
• 1x10^-7
• 1x10^-8
• 1x10^-9
Excessive bit • 1x10^-3 (default) Sets the excessive bit error threshold.
error threshold • 1x10^-4
• 1x10^-5
Automatic • Enabled (default for Enables/disables the automatic laser shutdown (ALS) feature.
laser shutdown SDH and SDH-J Note 1: If a port is not expected to receive a signal (for
modes) example, at drop ports in dual feed applications), you must
• Disabled (default for disable ALS for the port to prevent the associated transmit laser
SONET mode) being shut down.
Note 2: Automatic laser shutdown is not applicable to STM-1e
SFPs, you must set it to Disabled.
Note 3: For 1+1 TPT protection, set this parameter to Disabled.

Used as timing • Yes Displays whether the facility is being used as a timing
reference • No reference. Read-only.

Data • Yes Displays whether the facility is using a data communications


communication • No channel (DCC). Read-only.
channel
DUS Override • Disabled (default for Select the do not use for synchronization (DUS) override status.
SONET and SDH) Set to Enabled if you want to ignore received synchronization
• Enabled (default for status messages (SSM) when facility is used as a timing
SDH-J) reference port.

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Table 1-37 (continued)


OCn/STMn/STM0J/STM1J/STM4J facility parameters

Parameter Options Description

Unequip mode • STS1 Select the unequip mode.


• VC3 The only valid unequip mode for SONET port mode is STS1.
• VC4 The valid unequip modes for SDH and SDH-J port modes are
VC3 and VC4.
The default unequip mode for SDH port mode is VC4 and for
SDH-J port mode is VC3.

Customer string of up to 64 Used to identify a provisioned facility. It is the same as the


Defined Facility characters Common Language Facility Identifier (CLFI). The provisioned
Identifier value appears in the facility alarm report if the SP2 is equipped.

Enable OSRP • Yes Enables or disables OSRP control plane on the network links.
• No Applicable to the OC48/STM16 and OC192/STM64 facilities
only.
OSRP can be enabled on the network ports only. On the
add/drop access ports, OSRP must be disabled.

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OTM2 facility parameters


Note that not all OTM2 facilities support all the parameters in Table 1-38. See
Table 1-39 on page 1-167 for applicability.

Table 1-38
OTM2 facility parameters

Parameter Options/ranges Description


Unit facility-shelf-slot-port Displays the facility, shelf number, slot number, and
port number for the selected facility.
Primary State See “Equipment and Sets the primary state of the facility. Default reflects
facility primary states” on primary state of associated equipment.
page 1-157 IS and OOS are selectable.
Secondary State See “Facility secondary Displays the facility operational state.
states” on page 1-158 The AINS state is editable.
The Maintenance state is editable.
Rate 10.7G Displays the facility rate.
Optical System Up to 8 alphanumeric Sets the optical system identifier used by other
Identifier characters and applications for network topology building blocks to
underscore “_” build an optical network model including DWDM
transmit/receive elements.
Setting the optical system identifier in this dialog
overrides the default setting provisioned in the Node
Information application which is used when OTM2
facilities are auto-provisioned.
Tx Path Identifier 1 to 254 Sets the transmit path identifier which allows two
different transmitters with identical wavelengths in the
same network element to be identified uniquely in an
optical system.
Setting the transmit path identifier in this dialog
overrides the default setting provisioned in the Node
Information application which is used when OTM2
facilities are auto-provisioned.

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Table 1-38 (continued)


OTM2 facility parameters

Parameter Options/ranges Description


Tx Power (dBm) For 1xOC-192/STM-64 Sets the required line transmit optical power (provision
AM1/AM2 DWDM power with 0.1 incremental range).
tunable HO/LO: Tx power may auto-provision. See the “OTMn
• -10 dBm to +1.5 dBm wavelength and power auto-provisioning” section in
for AM1 (default Part 1 of Configuration - Provisioning and Operating,
-10.0 dBm) 323-1851-310 for more information.
• -10 dBm to +3.1 dBm Note: Since the power provisioning in Site Manager
for AM2 or AM off and LH 1600G have different granularity of 0.01 and
(default -10.0 dBm) 0.25 dBm respectively, in case of manual equalization
For 1xOC-192/STM-64 across the LH 1600G link, when the requested power
L-band tunable: provisioning ends in 0.25 or 0.75, you have to round it
• +3.1 dBm (read only) up or down to 0.2/ 0.3 or 0.7/ 0.8 to prevent any further
interoperation issue.
Tx Actual Power • Tx optical power Displays the measured line transmit optical power.
(dBm) • Unknown (if circuit Read-only.
pack not present) When the outgoing transmit optical power level for the
monitored port is out of range, the Tx Actual Power
parameter displays "OOR". The corresponding
OPT-OCH/OCH-OPT value in the Site Manager
Performance Monitoring application does not
display "OOR" when out of range; the lowest reading
is -45 dBm. Refer to Fault Management - Performance
Monitoring, 323-1851-520 for more information about
OPT-OCH/OCH-OPT values.
Tx SBS Dither • Off Sets the transmit Stimulated Brillouin Scattering (SBS)
• On dither setting. If On, a dither frequency applied to
transmitter to compensate for the non-linear effect of
Stimulated Brillouin Scattering. Normally Off in
Common Photonic Layer interworking systems and
On in 1600G interworking systems.
For the 10G L-band tunable circuit pack, the Tx SBS
dither is always off.
Tx AM Format • AM1 (default) Sets the Analog Maintenance (AM) format.
• AM2 AM1 and AM2 options are used for interworking with
• Off 1600G systems.

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Table 1-38 (continued)


OTM2 facility parameters

Parameter Options/ranges Description


Tx Wavelength (nm) • 1528.77 (93) to Sets the required line transmit wavelength. The
1565.09 (88), at number in brackets is the channel ID. Tx wavelength
50 GHz spacing may auto-provision. See the “OTMn wavelength and
(default 0)) for C-band power auto-provisioning” section in Part 1 of
• 1569.59 to 1605.74 at Configuration - Provisioning and Operating,
50 GHz spacing 323-1851-310 for more information.
(default 0) for 10G Tx Wavelength cannot be edited unless the facility is
L-band tunable OOS.
Tx Chirp • Positive Sets the chirp.
• Negative (default) For the 10G L-band tunable circuit pack, the Tx chirp
is always negative.
Tx FEC Format • Off Sets the transmit Tx FEC format setting:
• RS8 (ITU-T G.709 • G709 line ports (1xOC-192/STM-64 AM1/AM2
RS-8) DWDM tunable HO/LO and L-band tunable circuit
• Super concatenated packs): RS8, super concatenated FEC (SCFEC)
FEC (ITU-T G.975 I.4) (default), or Off.
• G709 line port (port 1 or port 2 of
(2+8)xOC-n/STM-n): RS8 (default), SCFEC, or Off.
• G709 line ports (1xOC-192/STM-64 DWDM circuit
packs): RS8 (default) or Off.
RS8 and SCFEC are the OTU FEC modes applied to
achieve greater margin on a given link.
Off state allows users to test the product for OTN
compliancy.
Rx Actual Power • Rx optical power Displays the measured line receive optical power.
(dBm) • Unknown (if circuit Read-only.
pack not present) When the incoming receive optical power level for the
monitored port is out of range, the Rx Actual Power
parameter displays "OOR". The corresponding
OPR-OCH/OCH-OPR value in the Site Manager
Performance Monitoring application does not
display "OOR" when out of range; the lowest reading
is -45 dBm. Refer to Fault Management - Performance
Monitoring, 323-1851-520 for more information about
OPR-OCH/OCH-OPR values.
The value may not be accurate if it is outside the
normal operating range.

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Table 1-38 (continued)


OTM2 facility parameters

Parameter Options/ranges Description


Rx FEC Format • Off Select the receive Rx FEC format setting:
• RS8 (ITU-T G.709 • G709 line ports (1xOC-192/STM-64 AM1/AM2
RS-8) DWDM tunable HO/LO and L-band tunable circuit
• Super concatenated packs): RS8, super concatenated FEC (SCFEC)
FEC (ITU-T G.975 I.4) (default), or Off.
• G709 line port (port 1 or port 2 of
(2+8)xOC-n/STM-n): RS8 (default), SCFEC, or Off.
• G709 line ports (1xOC-192/STM-64 DWDM circuit
packs): RS8 (default) or Off.
RS8 and SCFEC are the OTU FEC modes applied to
achieve greater margin on a given link.
Off state allows users to test the product for OTN
compliancy.
Pre-FEC Signal Fail -1.00 to 1.00 (default 0) Sets the threshold level for the Pre-FEC Signal Fail
Threshold (dBQ) alarm (applicable only when FEC is On). Can be
provisioned in 0.01 steps. 0 dBQ equates to 1x10^-15
post FEC errors.
This parameter cannot be edited unless the facility is
OOS.
Pre-FEC Signal Fail numeric value Displays the threshold level in BER for the Pre-FEC
Threshold (BER) Signal Fail alarm (applicable only when FEC is On).
Read-only.
Pre-FEC Signal • -1.00 to 2.00 (default Sets the threshold level for the Pre-FEC Signal
Degrade Threshold 0.5) for RS8 Degrade alarm (applicable only when FEC is On). Can
(dBQ) • -1.00 to 3.5 (default be provisioned in 0.01 steps.
0.5) for SCFEC
Pre-FEC Signal numeric value Displays the threshold level in BER for the Pre-FEC
Degrade Threshold Signal Degrade alarm (applicable only when FEC is
(BER) On). Read-only.
ODU TTI • Yes (default) Displays whether the trail trace identifier (TTI)
Termination • No message is transmitted at the line transmitter.

OTU Signal Degrade 1x10^-9 Displays the signal degrade threshold (applicable only
Threshold when Rx FEC Format is Off). Read-only.

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Table 1-38 (continued)


OTM2 facility parameters

Parameter Options/ranges Description


Port Mode • SONET (default for Select the mode of the port. Determines if SONET or
SONET NE mode) SDH terminology is used and whether bit (SONET) or
• SDH (default for SDH block (SDH) errors are used for performance
NE mode) monitoring.
You cannot edit the port mode. To change the port
mode you must delete the OTM2 facility and then
re-add it with the correct port mode.
Payload Type 00 to FF OPU Payload Type byte expected in the off-ramp
Expected (In HEX) direction for an OTM2 facility associated with an
OC192/STM64 or ETH10G client facility.
Note: If the expected and the received do not match,
an OPU PT Byte mismatch alarm is raised.
Payload Type 00 to FF OPU Payload Type byte transmitted in the on-ramp
Transmitted (In HEX) direction for an OTM2 facility associated with an
OC192/STM64 or ETH10G client facility.
Customer Defined string of up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2 is equipped.

Table 1-39
OTM2 facility parameter applicability

Equipment type 10G 10G MRO

Circuit pack 1xOC-192/ 1xOC-192/ STM-64 AM1/AM2 (2+8)xOC-n/STM-n


STM-64 DWDM DWDM tunable and L-band tunable OTN 20G

Port (Port 1) (Port 1) 1 or 2

Unit X X X

Primary State X X X

Secondary State X X X

Rate X

Optical System Identifier X X

Tx Path Identifier X X

Tx Power (dBm) X

Tx Actual Power (dBm) X X

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Table 1-39 (continued)


OTM2 facility parameter applicability

Equipment type 10G 10G MRO

Circuit pack 1xOC-192/ 1xOC-192/ STM-64 AM1/AM2 (2+8)xOC-n/STM-n


STM-64 DWDM DWDM tunable and L-band tunable OTN 20G

Port (Port 1) (Port 1) 1 or 2

Tx SBS Dither X X

Tx AM Format X (Note)
Tx Wavelength (nm) X X

Tx Chirp X

Tx FEC Format X X X

Rx Actual Power (dBm) X X

Rx FEC Format X X X

Pre-FEC Signal Fail X X


Threshold (dBQ)

Pre-FEC Signal Fail X X


Threshold (BER)
Pre-FEC Signal Degrade X
Threshold (dBQ)

Pre-FEC Signal Degrade X


Threshold (BER)

ODU TTI Termination X

OTU Signal Degrade X X


Threshold

Payload Type Expected X


(In HEX)

Payload Type X
Transmitted (In HEX)
Port Mode X X X

Customer Defined X X X
Facility Identifier

Note: Tx AM Format is not applicable to the 1xOC-192/STM-64 L-band tunable.

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AD facility parameters
Table 1-40
AD facility parameters
Parameter Options Description

Unit AD-shelf-slot-port Displays the facility AID.

Layer • Section and Line: Sets the autodiscovery layer.


SONET NE mode
• Section and MS: SDH
NE mode
• OTU: OTM facilities

Tx Tag string Sets the autodiscovery tag to transmit.


For layer Line and Section, the AD tag format is
<AD_2_MAC_shelf_slot_port_ME_1>, for example:
“AD_2_12:34:56:AA:AD:D6_001_000_010_000_003_ME_1”
For layer OTU, the AD tag format is
<AD_5,IP,TID,shelf-slot-port, netype>, for example:
“AD_5,12.35.48.75,OME-424,1-10-3,6500”

Rx Actual string Sets the received autodiscovery tag. The AD tag format is the
same as the Tx Tag.

Rx Reliability Reliable Sets the state of the received autodiscovery tag: autodiscov-
ery tag is being correctly received.

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ADJ facility parameters


Table 1-41
ADJ facility parameters
Parameters Options Description

Unit ADJ-shelf-slot-port Displays the facility, shelf number, slot number, and port
number for the selected facility.

Primary State See “Equipment and Displays the primary state of the facility. Read-only.
facility primary states” on
page 1-157
Adjacency Type TXRX Displays the type of the adjacency. Read-only.

Status • Unverified Displays current status of the adjacency facility.


• Derived • Unverified - The provisioned far end address has been
• Reliable set by the end-user. If an actual far end address exists,
it matches the provisioned far end address and has
• Unreliable been discovered through information received from the
far end shelf but has not been verified by any physical
connectivity.
• Derived - The provisioned far end address has been set
by the system. If an actual far end address exists, it
matches the provisioned far end address and has been
discovered through information received from the far
end shelf but has not been verified by any physical
connectivity.
• Reliable - The actual far end address matches the
provisioned far end address and has been discovered
through physical connectivity. The provisioned far end
address has been set by either the system or the
end-user.
• Unreliable - The actual far end address is detected and
it does not match the provisioned far end address or the
discovery validation has detected a mis-fibering.

Actual Far End string format Displays the actual far end address which is the detected
Address TID, shelf, slot, and port of the far end of the fiber.
Read-only.

Actual Far End See Note 2. Displays the option that each field of the far end address
Address Format represents. Read-only.

Expected Far End TID-shelf-slot-port Sets the provisioned far end address of the fiber
Address (Note 1) connection.

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Table 1-41 (continued)


ADJ facility parameters

Parameters Options Description

Expected Far End See Note 2. Sets the expected far end line receive and client receive
Address Format addresses format reported by the adjacency.
Customer Defined string of up to 64 Used to identify a provisioned facility. It is the same as
Facility Identifier characters the Common Language Facility Identifier (CLFI). The
provisioned value appears in the facility alarm report if
the SP2 is equipped.

Note 1: The Expected Far End Address is controlled by the Expected Far End Address Format
selection. If the Expected Far End Address Format is set to ‘NULL’, then the Expected Far End
Address is disabled; Otherwise, it is enabled.
Note 2: The Far End Address Format options are:
• NULL
• TID-SH-SL-PRT
• TID-SH-SL-SBSL-PRT

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DCC/GCC support and parameters


Table 1-42 on page 1-173 provides a list of the Lower Layer DCC/GCC
parameters.

Lower Layer DCC/GCC parameters


The Lower Layer DCC/GCC option provides a single table which displays the
DCC/GCC parameters for any OCn/STMn/STM0J/STM1J/STM4J/OTMn
facilities that have a lower layer DCC/GCC provisioned.

Use the Add button to provision new DCC/GCC circuits and the Delete button
to delete existing DCC/GCC circuits. The Edit button is only enabled for editing
the LAPD parameters. When adding a DCC/GCC circuit, consider the
following:
• A maximum of two line/MS DCC circuits are supported on each
8xOC-3/12/STM-1/4 circuit pack.
• On the (2+8)xOC-n/STM-n circuit pack, 8 x SDCC/RS DCC and 8 x
LDCC/MS DCC are available on the OCn/STMn facilities. Port 1 & Port 3
and Port 2 & Port 7 share the same SDCC/RS DCC and LDCC/MS DCC
as both ports cannot be provisioned at the same time.
• 2 x GCC0 and 2 x GCC1 are available on the OTM2 facilities of the
(2+8)xOC-n/STM-n OTN 20G circuit pack.
• Each end of the DCC/GCC circuit must be provisioned with the same
options.
• When adding a DCC circuit, the L2 Frame Size and L2 Side Role fields
only become available when the LAPD option is selected.
• When adding a DCC circuit, the Mate field only become available when
the Transparent option is selected.
• Once a new DCC/GCC circuit has been added, an IISIS or OSPF circuit
must be added for this port (except for a transparent DCC). See “IISIS
Circuit parameters” on page 1-177 and “OSPF Circuit parameters” on
page 1-180.
• You must delete the IISIS or OSPF circuit for the DCC/GCC circuit before
deleting the DCC/GCC circuit.
• Adding or deleting a lower layer DCC/GCC entry with its Protocol
parameter set to PPP, automatically adds or deletes an associated PPP
circuit with IP address of 0.0.0.0.

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For in-band communication between OSRP nodes, each facility on which


OSRP is enabled requires the Line/MS DCC channel to be allocated for
control plane communications (neighbor discovery, topology discovery,
routing and signaling). This LDCC channel requires the following parameters
and settings:
• Carrier = Line/MS
• Network Domain = SONET/SDH Control Plane
• Protocol = LAPD (automatically set for the SONET/SDH Control Plane
network domain)

No additional provisioning, such as IP address or OSPF/IISIS circuits, is


required on the LDCC channel for OSRP communications.

If OAM communications are also required between shelves containing OSRP


instances, the Section DCC (SDCC) channel must be used
(Network Domain = MCN), as control plane and OAM communications do not
share the same channel.

For more information about the control plane communications, refer to 6500
Packet-Optical Platform Control Plane Application Guide, NTRN71AA.

Table 1-42
Lower Layer DCC/GCC parameters

Parameter Options Description Addable/


Editable

Unit OCn/STMn/STM0J/S Displays all the provisioned Yes


TM1J/STM4J/OTMn OCn/STMn/STM0J/STM1J/STM4J/OTMn ports and
ports their DCC/GCC settings
OCn/STMn/STM0J/STM1J/STM4J/OTMn ports are
displayed in the following format:
OCn/STMn/STM0J/STM1J/STM4J/OTMn-shelf-
slot-port.

Carrier Section/RS, line/MS, Selects the carrier for the Section/ DCC, line DCC Yes
GCC0, GCC1 and GCC circuit, or GCC0 or GCC1.
Only applicable to OCn/STMn/OTMn ports.

Operation Section/RS, line/MS, Displays the status of the DCC/GCC circuit. No


Carrier GCC0, GCC1,
Disconnected

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Table 1-42 (continued)


Lower Layer DCC/GCC parameters

Parameter Options Description Addable/


Editable

Protocol LAPD, NDP, PPP Select the LAPD, PPP, or Transparent radio button Yes or No
(default), to set the protocol of the DCC circuit (PPP, LAPD, or depends
Transparent Transparent). Only PPP or NDP is supported for on facility
OTMn GCC ports and LAPD and Transparent and carrier
options are disabled.
L2 Frame Size 512 to 1492 (default
Sets the LAPD frame size (only applicable to LAPD). Yes for
1304) for MCN CAUTION MCN
9000 for No for
Each end of the DCC circuit must be provisioned SONET/
SONET/SDH Control with the same LAPD frame size. Defaults on
Plane SDH
different equipment types may be different. Control
Plane

L2 Side Role Automatic Displays the LAPD link mode (only applicable to No
LAPD).

Operation L2 Network, User, Displays the availability of L2 side role when adding No
Side Role Disconnected a DCC/GCC circuit (only applicable to LAPD).

Mate OCn/STMn/STM0J/S Sets the Mate DCC (another OCn/STMn/STMnJ Yes


TM1J/STM4J optical port) for the transparent DCC (only
applicable to the Transparent option).

FCS Mode 16 bit (default), 32 bit Sets the frame check sequence (FCS) mode. Only Yes
applicable to the Transparent protocol or the PPP
protocol when the carrier is Section/RS or line/MS.

Network MCN (default), Indicates the communications network domain. Yes or No


Domain SONET/SDH Control MCN for maintenance communications network, depends
Plane SONET/SDH Control Plane for OSRP control plane on facility
network. and carrier

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IISIS parameters
Table 1-43 provides a list of the IISIS Router parameters and Table 1-44 on
page 1-177 provides a list of the IISIS Circuit parameters.

IISIS Router parameters


The IISIS Router option has two tables.
• The upper Router table displays information about the IISIS router. Use
the Add button to add an IISIS router (only one allowed). Use the Delete
button to delete the existing IISIS router.
• The lower Redistribution table displays information about the redistribution
lists provisioned for the IISIS router. Use the Add button to add IISIS
redistribution list parameters. Use the Delete button to delete a
redistribution list.
Table 1-43
IISIS Router parameters

Parameter Options Description Addable/


Editable

Router table

Router Level Level 1 Sets the IISIS router level. Level 2 not supported in this No
release, option is always disabled.

L1 Priority 1 to 127 Sets the level 1 router priority. The L1 router assigned Yes
(default 64) the highest priority becomes the L1 designated router
for that LAN segment.

L2 Priority 1 to 127 Sets the level 2 router priority. The L2 router assigned No
(default 64) the highest priority becomes the L2 designated router
for that LAN segment.
Not supported in this release, option is disabled.

Route On (default), Off Sets whether routes (Off) or route summaries (On) are Yes
Summarization redistributed.

Redistribution table

Route OSPF Sets the IISIS router distribution list entries for the Yes
Redistribution/ Distribution, selected IISIS router.
List Static Distribution
(default)

IP Subnet Standard dot Sets the IP subnet address of the distribution list entry Yes
notation for the selected IISIS router.

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Table 1-43 (continued)


IISIS Router parameters

Parameter Options Description Addable/


Editable

Subnet Mask Standard dot Sets the subnet mask of the distribution list entry for the Yes
notation selected IISIS router.

Metric 1 to 63 Sets the metric (cost) of the distribution list entry for the Yes
selected IISIS router.

Metric Type External (default), Sets the metric type of the distribution list entry for the Yes
Internal selected IISIS router.

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IISIS Circuit parameters


The IISIS Circuit option has a single table. Use the Add button to provision
new IISIS circuits and the Delete button to delete existing IISIS circuits. You
must create an IISIS circuit on each provisioned interface you want IISIS to
run on (except Auto-tunnels and the RS-232 ports).

Table 1-44
IISIS Circuit parameters

Parameters Options Description Addable/


Editable

Unit OCn/STMn/STM0J/S Displays the available ports for an IISIS circuit. Yes
TM1J/STM4J/OTMn OCn/STMn/STM0J/STM1J/STM4J/OTMn ports are
ports displayed in the following format:
OCn/STMn/STM0J/STM1J/STM4J/OTMn-shelf
-slot-port
Only OCn/STMn/STM0J/STM1J/STM4J/OTMn ports
with lower layer DCC/GCC0/GCC1 provisioned are
available for selection.

Carrier Section/RS, line/MS, Displays the DCC channel used, section/RS, line/MS, Yes
GCC0, GCC1 GCC used, GCC0 or GCC1 (options available depend
on circuit pack type and function).

Circuit 1 to 63 Sets the circuit default metric used to calculate the Yes
Default best route. Default depends on type of interface as
Metric follows:
• OCn/STMn/STM0J/STM1J/STM4J/OTMn ports with
line/MS DCC/GCC0/GCC1 provisioned: 5
• OCn/EC1/STMn/STM0J/STM1J/STM4J ports with
section/RS DCC provisioned: 6
Select a higher value for a slower circuit.

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Table 1-44 (continued)


IISIS Circuit parameters

Parameters Options Description Addable/


Editable

Level 2 Only On, Off (default) Sets the status of level 2 only routing on the IISIS No
circuit.
Not supported in this release, On option is always
disabled.

3 Way On, Off (default) Sets the status of 3-way handshaking on the IISIS No
Handshake circuit.
Not supported in this release, On option is always
disabled.

Neighbour Off (default), IP, OSI, Sets the protocols supported on neighbour routers Yes
Protocols IP and OSI (overrides what the router advertises).
Supported Must be set to OSI if the lower layer DCC Protocol
Override parameter is set to LAPD.
When provisioning an IISIS circuit:
• on an optical DCC port connected to OSI managed
network elements (for example, Optical Metro 3000
and Optical Metro 4000), you must ensure that
neighbour protocol supported override parameter is
set to OSI.
• on an optical port connected to another 6500
network element, it is strongly recommended that the
lower layer DCC Protocol parameter be set to PPP
and the neighbour protocol supported override
parameter be set to Off.
The “IP” and “IP and OSI” options are not supported.

OSPF parameters
Table 1-45 on page 1-179 provides a list of the OSPF Router parameters and
Table 1-46 on page 1-180 provides a list of the OSPF Circuit parameters.

OSPF Router parameters


The OSPF Router option has two tables.
• The upper Router table displays information about the OSPF router. Use
the Add button to add an OSPF router. Use the Delete button to delete an
existing OSPF router.
• The lower Redistribution table displays information about the redistribution
lists provisioned for the OSPF router. Use the Add button to add OSPF
redistribution list parameters. Use the Delete button to delete a
redistribution list.

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Table 1-45
OSPF Router parameters
Parameter Options Description Addable
/Editable

Router

OSPF Router Standard dot notation Sets the router ID for the OSPF. Yes
Id It is recommended that the SHELF address (if
provisioned) is used as the OSPF Router Id.

Link State External (default), Sets the type of link state announcement used. Yes
Router, Summary This parameter is not used and can be left at the
default value (External).

Route ON (default), OFF Sets whether routes (off) or route summaries (On) are Yes
Summarization redistributed.

Autonomous ON, OFF (default) Sets the autonomous system border router (ASBR). Yes
System Border ASBR identifies whether an OSPF router can accept
Router input (route redistribution) from another autonomous
system such as IISIS, or static routes.

Opaque Filter ON, OFF (default) Enables or disables the OSPF Opaque LSA Flooding Yes
Control (OOLFC). OOLFC reduces the number of
Type 11 opaque LSAs containing AR and TR records
in the OSPF database for 6500 shelf that is part of an
OSPF network. Cannot be set to ON if ODBR or
DBRS is ON, and vice versa.

Shelf IP ON, OFF (default) Enables or disables shelf IP redistribution. Shelf IP Yes
Redistribution redistribution provides the ability to redistribute a
route to the local shelf IP into all OSPF areas that the
local shelf participates in. All NEs in these
participating OSPF areas will install the received
route into their local IP routing table. Only supported
in OSPF networks without a backbone.

Redistribution
Route IISIS Distribution, Sets the origin of the route(s) to be redistributed. Yes
Redistribution/ Static Distribution
List (default)

IP Subnet Standard dot notation Sets the IP subnet address for redistribution. Yes

Subnet Mask Standard dot notation Sets the subnet mask for redistribution. Yes
Metric 1 to 65535 Sets the metric for redistribution. Yes

Metric Type External (default), Sets the metric type for redistribution. Yes
Internal

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OSPF Circuit parameters


The OSPF Circuit option has two tables:
• The upper table displays information about the OSPF circuit. Use the Add
button to add an OSPF circuit. Use the Delete button to delete an existing
OSPF circuit.
• An OSPF circuit cannot be provisioned against a lower layer DCC with its
Protocol parameter set to LAPD.
• The lower Area List table displays information about the area lists
provisioned for the OSPF circuit.
Area lists are not supported in this release and the table will always be empty.
The area list fields and the Enter and Delete buttons on the Add OSPF Circuit
Parameters dialog box are disabled.

Table 1-46
OSPF Circuit parameters

Parameter Options Description Addable/


Editable

Unit OCn/STMn/STM0J/S Displays the Yes


TM1J/STM4J/OTMn OCn/STMn/STM0J/STM1J/STM4J/OTMn ports
ports available for OSPF.

Carrier Section/RS, line/MS, Sets the DCC/GCC on the OCn/STMn/OTMn port Yes
GCC0, GCC1 for the OSPF circuit.
Only applicable to OCn/STMn/OTMn ports.

Network Area Standard dot notation Sets the area (defaults to backbone area of 0.0.0.0). Yes

Cost 1 to 65534 Sets the cost of the route (reflects speed of Yes
(default 10) interface). Defaults are as follows:
• GCC0/1: 75
• section/RS DCC: 520
• line/MS DCC: 174

Area Default 1 to 16777215 Sets the cost of the route to the next area. No
Cost (default 1) Note: It is not supported in this release.
Dead Interval 1 to 65535 Sets the interval (in seconds) at which hello packets Yes
(default 40) must not be seen before neighbors declare the
router down.

Hello Interval 1 to 65535 Sets the interval (in seconds) between the hello Yes
(default 10) packets that the router sends on the interface.

Retransmit 1 to 3600 Sets the interval (in seconds) required between No


Interval (default 5) link-state advertisement retransmissions.
Note: It is not supported in this release.

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Table 1-46 (continued)


OSPF Circuit parameters

Parameter Options Description Addable/


Editable

Transmit 1 to 3600 (default 1) Sets the estimated time (in seconds) it takes to No
Delay transmit a link state update packet over this
interface.
Note: It is not supported in this release.

Priority 0 to 255 (default 1) Sets the router priority value used in multi-access Yes
networks for the election of the designated router (0
indicates that router is not eligible to become
designated router).

Area Off (default), NSSA, Sets whether the router is in a not so stubby area Yes
Stub (NSSA) or stub area. NSSA and Stub not supported
in this release.

Opaque Link On (default), Off Sets whether opaque link state advertisement Yes
State performs on the OSPF circuit.
Advertisement

Passive OSPF On, Off (default) Determines whether OSPF adjacency loss should Yes
Circuit be detected. If set to On, OSPF adjacency loss will
be ignored.

Authentication Null (default), Simple Sets the authentication type. Null means no Yes
Type Password, MD5 authentication.
Simple string of up to 8 Sets the password if authentication type is simple Yes
Password characters password.

Status Accepting, Rejecting Displays the status of the simple password No


authentication.

MD5 Identifier 0 to 255 Sets the identifier for the first MD5 key. Must be Yes
1 unique on an OSPF interface.

MD5 Key 1 string of up to 16 Sets the password for the first MD5 key. Yes
characters

Status 1 Accepting, Rejecting Displays the status of the authentication using MD5 No
Key 1.

MD5 Identifier 0 to 255 Sets the identifier for the second MD5 key. Must be Yes
2 unique on an OSPF interface.

MD5 Key 2 string of up to 16 Sets the password for the second MD5 key. Yes
characters

Status 2 Accepting, Rejecting Displays the status of the authentication using MD5 No
Key 2.

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Table 1-46 (continued)


OSPF Circuit parameters

Parameter Options Description Addable/


Editable

Area List
IP Subnet Standard dot notation Sets the IP subnet address of the OSPF area. No
Not supported in this release, field is disabled.
Subnet Mask Standard dot notation Sets the subnet mask of the OSPF area. No
Not supported in this release, field is disabled.

Result Displays the OPSF areas entered in the area list. Up No


to 10 OSPF area ranges can be configured.
Not supported in this release, field is disabled.

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Ring APS configuration editor parameters


Table 1-47 details the parameters associated with the Ring APS
configuration editor application for BLSR/MS-SPRing/HERS rings for
OC-n/STM-n circuit packs.

Table 1-47
Ring APS configuration editor parameters for OC-n/STM-n circuit packs

Parameter Options Description

Configuration file A character string Displays the name of the configuration file associated with the
name currently displayed ring.

Ring name Up to 40 characters Sets the ring name. The name cannot include the backslash (\)
and double quote (“) characters.

Ring type • 2 Fiber Sets the ring type.


• 4 Fiber

View ordered as All the nodes in the Sets the order in which the nodes of the selected ring appear in
provisioned data ring the Nodes area. The connections are shown from the point of
on view of the node selected from the drop-down list, with the
selected node at the top of the Nodes area. If a node does not
have a node identifier, only the APS ID appears in the
drop-down list.
The second node is the node connected to the east facility. If
the facility AIDs is not specified for the first node, then the
second node can be any of the two nodes connected to the first
node (a warning message appears at the bottom of the window
indicating that the list of nodes may not correspond to the order
that will be used at provisioning time). Both AIDs must be
specified before the node can be considered for provisioning.

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Table 1-47 (continued)


Ring APS configuration editor parameters for OC-n/STM-n circuit packs

Parameter Options Description

Nodes Displays a selectable graphical representation of the nodes


configured in the ring with their facility interconnections. The
nodes in the Nodes area are organized as set using the View
ordered as provisioned data on drop-down list.
The grey blocks in the center column of the Nodes area
represent the nodes in the ring. Each rectangular block includes
the node type, node name, and automatic protection switch
identifier (APS ID) associated with the protection group on the
node.
The facility identifiers for the facilities used by each node for ring
connectivity are depicted by white blocks on either side of node
and include the port orientation and facility identifier. The first
node in the Nodes area is connected to the last node.
For nodes running 6500 Release 3.0 or earlier software or if the
node identifier was not saved, some or all of the nodes but the
node the data was loaded from, may only display the APS ID.
The facility identifiers are only displayed for the node from
which the data was obtained.

Node type • DX Sets the node type.


• HDX 2 Fiber ring: DX, HDX, OM3500, 6100, 6500, and Unknown
• OM3500 4 Fiber ring: DX, HDX, 6500, and Unknown
• 6100
• 6500
• Unknown

Node Up to 20 Sets the node name.


alphanumeric
characters

APS ID • 0 to 15 for Sets the APS identifier.


16-node rings 24-node 2-Fiber BLSR/MS-SPRing configurations are
• 0 to 23 for supported only on the following circuit packs:
24-node rings 1xOC-192/STM-64 DWDM AM1/AM2, (2+8)xOC-n/STM-n
(OC-192/STM-64 line rate only), and 40G XCIF.
24-node 4-Fiber BLSR/MS-SPRing/HERS configurations are
supported only at the OC-192/STM-64 line rate, and only on the
following circuit packs: 1xOC-192/STM-64 DWDM AM1/AM2
and (2+8)xOC-n/STM-n.

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Table 1-47 (continued)


Ring APS configuration editor parameters for OC-n/STM-n circuit packs

Parameter Options Description

East facility Alphanumeric Sets the East facility (BLSR/MS-SPRing working member of a
linked to: string 2-fiber group) linked to the next node (appears on right side of
node in Node area).
When there is no node in the configuration, the linked to: field
shows “Next node”.
Note: Applicable when the Ring type selected is 2 Fiber.

West facility Alphanumeric Sets the West facility (BLSR/MS-SPRing protection member of
linked to: string a 2-fiber group) linked to the “previous node” (appears on left
side of node in Node area).
When there is no node in the configuration, the linked to: field
shows “Previous node”.
Note: Applicable when the Ring type selected is 2 Fiber.

Working east Alphanumeric Sets the Working east facility (BLSR/MS-SPRing/HERS


facility string working member on the east side of a 4-fiber group) linked to
linked to: the “next node” (appears on right side of node in Node area).
When there is no node in the configuration, the linked to: field
shows “Next node”.
Note: Applicable when the Ring type selected is 4 Fiber.

Protection east Alphanumeric Sets the Protection east facility (BLSR/MS-SPRing/HERS


facility string protection member on the east side of a 4-fiber group) linked to
linked to: the “next node” (appears on right side of node in Node area).
When there is no node in the configuration, the linked to: field
shows “Next node”.
Note: Applicable when the Ring type selected is 4 Fiber.
Working west Alphanumeric Sets the Working west facility (BLSR/MS-SPRing/HERS
facility string working member on the west side of a 4-fiber group) linked to
linked to: the “previous node” (appears on left side of node in Node area).
When there is no node in the configuration, the linked to: field
shows “Previous node”.
Note: Applicable when the Ring type selected is 4 Fiber.

Protection west Alphanumeric Sets the Protection west facility (BLSR/MS-SPRing/HERS


facility string protection member on the west side of a 4-fiber group) linked to
linked to: the “previous node” (appears on left side of node in Node area).
When there is no node in the configuration, the linked to: field
shows “Previous node”.
Note: Applicable when the Ring type selected is 4 Fiber.

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Path connections parameters


The following tables detail the OC-n/STM-n circuit pack parameters
associated with the Path Connections Site Manager application.

Table 1-48
Path Connections application parameters for OC-n/STM-n circuit packs
Parameter Description
Connection ID The connection identifier string is used to identify a provisioned path connection.
The path connection ID can contain a maximum of 64 characters, with the
exception of the \, “, and % characters.
For connections created by the SONET/SDH Control Plane, the connection
identifier string is assigned a network wide unique identifier, called a Network
Call Correlation Identification (NCCI).
For connections created by the OTN Control Plane, the connection identifier
string includes the Sub-Network Connection (SNC) name, in the format
Node ID_SNC Name_SNC reincarnation number.
Note: Support for 64 characters connection IDs is only supported from ONM
Release 6.0 onwards.

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Table 1-48 (continued)


Path Connections application parameters for OC-n/STM-n circuit packs
Parameter Description
Rate Select the rate as defined below:
• 1xOC-192/STM-64 circuit packs:
– VT1.5/VC11, VT2/VC12, and LO VC3 (VT1.5/LO circuit packs only)
– STS1/HO VC3, STS-3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
STS48c/VC4-16c, STS192c/VC4-64c
• 2xOC-64/STM-16 circuit packs:
– VT1.5/VC11, VT2/VC12, and LO VC3 (VT1.5/LO circuit packs only)
– STS1/HO VC3, STS-3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c,
STS48c/VC4-16c, STS192c/VC4-64c
• 8xOC-3/12/STM-1/4 circuit packs:
– VT1.5/VC11, VT2/VC12, and LO VC3 (VT1.5/LO circuit packs only)
– OC-12/STM-4 ports: STS1/HO VC3, STS-3c/VC4, STS12c/VC4-4c
• 8xOC-n/STM-n circuit packs
– VT1.5/VC11 and VT2/VC12
– STM-0J ports: LO VC3, STS1/HO VC3
– OC-3/STM-1 ports: LO VC3, STS1/HO VC3, STS3c/VC4
– OC-12/STM-4 ports: LO VC3, STS1/HO VC3, STS3c/VC4,
STS12c/VC4-4c
• 16xOC-n/STM-n circuit packs:
– VT1.5/VC11 and VT2/VC12 (VT1.5/LO circuit packs only)
– OC-3/STM-1 ports: LO VC3, STS1/HO VC3, STS-3c/VC4
– OC-12/STM-4 ports: LO VC3, STS1/HO VC3, STS-3c/VC4,
STS12c/VC4-4c
– OC-48/STM-16 ports: LO VC3, STS1/HO VC3, STS-3c/VC4,
STS12c/VC4-4c, STS24c/VC4-8c, STS48c/VC4-16c
• (2+8)xOC-n/STM-n circuit packs
– OC-48/STM-16 ports: VT1.5/VC11 (LO circuit pack variants only),
VT2/VC12 (LO circuit pack variants only), LO VC3, STS1/HO VC3,
STS-3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, STS48c/VC4-16c
– OC-192/STM-64 ports: VT1.5/VC11 (LO circuit pack variants only),
VT2/VC12 (LO circuit pack variants only), LO VC3, STS1/HO VC3,
STS-3c/VC4, STS12c/VC4-4c, STS24c/VC4-8c, STS48c/VC4-16c,
STS-192c/VC-4-64c

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Table 1-48 (continued)


Path Connections application parameters for OC-n/STM-n circuit packs
Parameter Description
Type Select the type as defined below:
• 1WAY (Unidirectional)
• 1WAYPR (Unidirectional Path Ring)
• 2WAY (Bidirectional)
• 2WAYPR (Bidirectional Path Ring)
• 2WAYDPR (Dual Bidirectional Path Ring)
Refer to Table 1-49 on page 1-189.
Revertive Select this checkbox to enable revertive mode. Applies to
1WAYPR/2WAYPR/2WAYDPR connections in UPSR/SNCP configurations.
Guard Time Specify the guard time. Range is 0 to 10 seconds in 100 millisecond increments.
Default is 0. Applies to 1WAYPR/2WAYPR/2WAYDPR connections in
UPSR/SNCP configurations.
From panel Select the Equipment, Facility, and channels for the From connection endpoints.
Refer to Table 1-50 on page 1-190.
Auto Concatenation Select this checkbox if the path connection is to be auto concatenated.
VT Access Select this checkbox if the path connection is a VT/VC-assigned
BLSR/MS-SPRing connection.
Extra Traffic (From Select this checkbox if the path connection From endpoint is to be carried on the
panel) protection channels of the BLSR/MS-SPRing/HERS configuration.
AU3 and/or AU4 For connection rates of VC11, VC12 or VC3 on SDH/SDH-J ports, you must
mapping radio buttons select the type of connection mapping as AU3 or AU4 to determine the High
Order container.
Timeslot numbers Each signal type requires that you assign a timeslot number to each parameter
(VT/STS/VC) in that signal type. You must enter a time slot number for the STS/VC. For VT1.5
and VT2, you must enter a timeslot number for VT, STS, and VC. For VC11 and
VC12, you must enter a timeslot number for AU4 (J), TUG-3 (K), TUG-2 (L), and
TU-12/TU-11 (M).
Site Manager automatically populates the available VT/STS/VC parameter fields
when you select the Rate and Type.
To panel Select the Equipment, Facility, and channels for the To connection endpoints.
Refer to Table 1-50 on page 1-190.
Extra Traffic (To Select this checkbox if the path connection To endpoint is to be carried on the
panel) protection channels of the BLSR/MS-SPRing/HERS configuration.
Switch mate panel Select the Switch Mate when creating 1WAYPR, 2WAYPR, or 2WAYDPR
connections. Refer to Table 1-49 on page 1-189.

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Table 1-48 (continued)


Path Connections application parameters for OC-n/STM-n circuit packs
Parameter Description
Destination mate Select the Destination Mate when making 2WAYDPR connections. Refer to
panel Table 1-49 on page 1-189.
The 2WAYDPR connection type is used for interconnecting UPSR/SNCP traffic.
The From and Switch Mate parameters apply to one UPSR/SNCP endpoint,
and the To and Destination Mate parameters apply to the other UPSR/SNCP
endpoint(s).
BLSR/MS-SPRing/ Select the starting endpoint (End NE A) and finishing endpoint (End NE Z) of the
HERS Endpoints path for BLSR/MS-SPRing/HERS connections.
panel Note: Only applicable to OC-192/STM-64 and OC-48/STM-16 ports.

Table 1-49
Path connection types for OC-n/STM-n circuit packs—supported From, To, Switch Mate, and
Destination Mate instances

Path From, Switch Mate To, Destination Mate


connection type

1WAY OC192/STM64, OC48/STM16, OC192/STM64, OC48/STM16,


OC12/STM4/STM4J, OC3/STM1/STM1J OC12/STM4/STM4J, OC3/STM1/STM1J

1WAYPR OC192/STM64, OC48/STM16, OC192/STM64, OC48/STM16,


OC12/STM4/STM4J, OC3/STM1/STM1J OC12/STM4/STM4J, OC3/STM1/STM1J

2WAY OC192/STM64, OC48/STM16, OC192/STM64, OC48/STM16,


OC12/STM4/STM4J, OC3/STM1/STM1J OC12/STM4/STM4J, OC3/STM1/STM1J
2WAYPR OC192/STM64, OC48/STM16, OC192/STM64, OC48/STM16,
OC12/STM4/STM4J, OC3/STM1/STM1J OC12/STM4/STM4J, OC3/STM1/STM1J

2WAYDPR OC192/STM64, OC48/STM16, OC192/STM64, OC48/STM16,


OC12/STM4/STM4J, OC3/STM1/STM1J OC12/STM4/STM4J, OC3/STM1/STM1J

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Table 1-50
Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
OC-192/STM-64 circuit packs (Note 1)
VT1.5/VC11 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts#-v shelf# = 1 to 254
and tg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 STM64-shelf#-slot#-port#-J#-K# 14-slot shelf
-L#-M# slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1 to 192
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 64
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
STS1/VC3 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
STM64-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1 to 192
J# (AU4) = 1 to 64
K# (TUG-3) = 1 to 3
STS3c/VC4 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1, 4, 7, 10, ..., 190
J# (AU4) = 1 to 64

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS12c/ 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-4c STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1, 13, 25, 37, ..., 181
J# (AU4) = 1, 5, 9, 13, ..., 61
STS24c/ 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-8c STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1, 25, 49, 73, ..., 169
J# (AU4) = 1, 9, 17, 25, ..., 57
STS48c/ 10G-shelf#-slot# OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-16c STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1
sts# = 1, 49, 97, 145
J# (AU4) = 1, 17, 33, 49
STS192c/ 10G-shelf#-slot# OC192-shelf#-slot#-port# shelf# = 1 to 254
VC4-64c STM64-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
2xOC-48/STM-16 circuit packs (Note 2)
VT1.5/VC11 P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts#- shelf# = 1 to 254
and PCWDMS-shelf#-slot#- vtg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 port# STM16-shelf#-slot#-port#-J#- 14-slot shelf
K#-L#-M# slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 2
sts# = 1 to 48
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 16
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
STS1/VC3 P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 2
sts# = 1 to 48
J# (AU4) = 1 to 16
K# (TUG-3) = 1 to 3
STS3c/VC4 P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 2
sts# = 1, 4, 7, 10, ..., 46
J# (AU4) = 1 to 16

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS12c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-4c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 2
sts# = 1, 13, 25, 37
J# (AU4) = 1, 5, 9, 13
STS24c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-8c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 2
sts# = 1, 25
J# (AU4) = 1, 9
STS48c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port# shelf# = 1 to 254
VC4-16c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 2
8xOC-3/12/STM-1/4 circuit packs
VT1.5/VC11 P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts#- shelf# = 1 to 254
and port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 P155M-shelf#-slot#-port# STM1-shelf#-slot#-port#-J#-K#- 14-slot shelf
PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
port# STM1J-shelf#-slot#-port#-J#- 31-38 for 32-slot shelf
K#-L#-M# port# = 1 to 8
sts# = 1 to 3
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
VT1.5/VC11 P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts#- shelf# = 1 to 254
and port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 P622M-shelf#-slot#-port# STM4-shelf#-slot#-port#-J#-K#- 14-slot shelf
PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
port# STM4J-shelf#-slot#-port#-J#- 31-38 for 32-slot shelf
K#-L#-M# port# = 1 to 8
sts# = 1 to 12
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
STS1/VC3 P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM1-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# STM1J-shelf#-slot#-port#-J#-K# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
sts# = 1 to 3
J# (AU4) = 1
K# (TUG-3) = 1 to 3
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J#-K# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
sts# = 1 to 12
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS3c/ P155622M-shelf#-slot#- OC3-shelf#-slot#-port# shelf# = 1 to 254
VC4 port# STM1-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# STM1J-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
sts# = 1, 4, 7, 10
J# (AU4) = 1 to 4
STS12c/ P155622M-shelf#-slot#- OC12-shelf#-slot#-port# shelf# = 1 to 254
VC4-4c port# STM4-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
8xOC-n/STM-n circuit packs
VT1.5/ PSFP-shelf#-slot#-port# STM0J-shelf#-slot#-port#-J#- shelf# = 1 to 254
VC11 K#-L#-M# slot# = 1 to 6 and 9 to 14 for
and 14-slot shelf
VT2/VC12 slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 2 to 4 and 6 to 8
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
PSFP-shelf#-slot#-port# OC3-shelf#-slot#-port#-sts#- shelf# = 1 to 254
P155622M-shelf#-slot#- vtg#-vt# slot# = 1 to 6 and 9 to 14 for
port# STM1-shelf#-slot#-port#-J#-K#- 14-slot shelf
P155M-shelf#-slot#-port# L#-M# slot# = 1-8, 11-18, 21-28, and
PCWDMS-shelf#-slot#- STM1J-shelf#-slot#-port#-J#- 31-38 for 32-slot shelf
port# K#-L#-M# port# = 1 to 8
sts# = 1 to 3
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
VT1.5/ P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts#- shelf# = 1 to 254
VC11 port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
and P622M-shelf#-slot#-port# STM4-shelf#-slot#-port#-J#-K#- 14-slot shelf
VT2/VC12 PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
port# STM4J-shelf#-slot#-port#-J#- 31-38 for 32-slot shelf
K#-L#-M# port# = 1 to 8
sts# = 1 to 12
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS1/VC3 P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM1-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# STM1J-shelf#-slot#-port#-J#-K# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
sts# = 1 to 3
J# (AU4) = 1
K# (TUG-3) = 1 to 3
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J#-K# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
sts# = 1 to 12
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
PSFP-shelf#-slot#-port# STM0J-shelf#-slot#-port#-sts#- shelf# = 1 to 254
J#-K# slot # = 1 to 6 and 9 to 14 for
14-slot shelf
slot # = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 2 to 4 and 6 to 8
sts# = 1
J# (AU4) = 1
K# (TUG-3) = 1

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS3c/VC4 P155622M-shelf#-slot#- OC3-shelf#-slot#-port# shelf# = 1 to 254
port# STM1-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# STM1J-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 8
sts# = 1, 4, 7, 10
J# (AU4) = 1 to 4
16xOC-n/STM-n 5G STS-1/HO SFP and 16xOC-n/STM-n 5G VT1.5/LO SFP circuit packs
VT1.5/ P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts#- shelf# = 1 to 254
VC11 port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
and P155M-shelf#-slot#-port# STM1-shelf#-slot#-port#-J#-K#- 14-slot shelf
VT2/ PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
VC12 port# STM1J-shelf#-slot#-port#-J#-K# 31-38 for 32-slot shelf
-L#-M# port# = 1 to 16
sts# = 1 to 3
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
VT1.5/ P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts#- shelf# = 1 to 254
VC11 port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
and P622M-shelf#-slot#-port# STM4-shelf#-slot#-port#-J#-K#- 14-slot shelf
VT2/ PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
VC12 port# STM4J-shelf#-slot#-port#-J#-K# 31-38 for 32-slot shelf
-L#-M# port# = 1 to 16
sts# = 1 to 12
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
VT1.5/ PSFP-shelf#-slot#-port# STM0J-shelf#-slot#-port#-sts#- shelf# = 1 to 254
VC11 J#-K# slot # = 1 to 6 and 9 to 14 for
and 14-slot shelf
VT2/ slot # = 1-8, 11-18, 21-28, and
VC12 31-38 for 32-slot shelf
port# = 2 to 4 and 6 to 8
sts# = 1
J# (AU4) = 1
K# (TUG-3) = 1

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS1/VC3 P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM1-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# STM1J-shelf#-slot#-port#-J#-K# 14-slot shelf
PCWDMS-shelf#-slot#- -L#-M# slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 3
J# (AU4) = 1
K# (TUG-3) = 1 to 3
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J#-K# 14-slot shelf
PCWDMS-shelf#-slot#- -L#-M# slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 12
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
STS1/VC3 PSFP-shelf#-slot#-port# STM0J-shelf#-slot#-port#-sts#- shelf# = 1 to 254
J#-K# slot # = 1 to 6 and 9 to 14 for
14-slot shelf
slot # = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 2 to 4 and 6 to 8
sts# = 1
J# (AU4) = 1
K# (TUG-3) = 1

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS3c/VC4 P155622M-shelf#-slot#- OC3-shelf#-slot#-port# shelf# = 1 to 254
port# STM1-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# STM1J-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1, 4, 7, 10
J# (AU4) = 1 to 4
STS12c/ P155622M-shelf#-slot#- OC12-shelf#-slot#-port# shelf# = 1 to 254
VC4-4c port# STM4-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# STM4J-shelf#-slot#-port#-J# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
16xOC-n/STM-n 10G STS-1/HO SFP and 16xOC-n/STM-n 10G VT1.5/LO SFP circuit packs (Note 2)
VT1.5/VC11 P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts#- shelf# = 1 to 254
and port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 P155M-shelf#-slot#-port# STM1-shelf#-slot#-port#-J#-K#- 14-slot shelf
PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 3
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
VT1.5/VC11 P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts#- shelf# = 1 to 254
and port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 P622M-shelf#-slot#-port# STM4-shelf#-slot#-port#-J#-K#- 14-slot shelf
PCWDMS-shelf#-slot#- L#-M# slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 12
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
P2G5-shelf#-slot#- OC48-shelf#-slot#-port#-sts#- shelf# = 1 to 254
port# vtg#-vt# slot# = 1 to 6 and 9 to 14 for
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J#- 14-slot shelf
port# K#-L#-M# slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 48
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 16
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS1/VC3 P155622M-shelf#-slot#- OC3-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM1-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 3
J# (AU4) = 1
K# (TUG-3) = 1 to 3
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 12
J# (AU4) = 1 to 4
K# (TUG-3) = 1 to 3
P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1 to 48
J# (AU4) = 1 to 16
K# (TUG-3) = 1 to 3

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS3c/VC4 P155622M-shelf#-slot#- OC3-shelf#-slot#-port# shelf# = 1 to 254
port# STM1-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P155M-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
P155622M-shelf#-slot#- OC12-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM4-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1, 4, 7, 10
J# (AU4) = 1 to 4
P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1, 4, 7, 10, ..., 46
J# (AU4) = 1 to 16
STS12c/ P155622M-shelf#-slot#- OC12-shelf#-slot#-port# shelf# = 1 to 254
VC4-4c port# STM4-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
P622M-shelf#-slot#-port# 14-slot shelf
PCWDMS-shelf#-slot#- slot# = 1-8, 11-18, 21-28, and
port# 31-38 for 32-slot shelf
port# = 1 to 16
P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1, 13, 25, 37
J# (AU4) = 1, 5, 9, 13

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS24c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-8c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 16
sts# = 1, 25
J# (AU4) = 1, 9
STS48c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port# shelf# = 1 to 254
VC4-16c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 to 16

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
(2+8)xOC-n/STM-n STS-1/VC-3 20G, (2+8)xOC-n/STM-n STS-1/VC-3 OTN 20G
(2+8)xOC-n/STM-n LO 20G, and (2+8)xOC-n/STM-n LO OTN 20G circuit packs (Note 1 and Note 2)
VT1.5/VC11 P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts#- shelf# = 1 to 254
and PCWDMS-shelf#-slot#- vtg#-vt# slot# = 1 to 6 and 9 to 14 for
VT2/VC12 port# STM16-shelf#-slot#-port#-J#- 14-slot shelf
K#-L#-M# slot# = 1-8, 11-18, 21-28, and
(LO circuit
packs only) 31-38 for 32-slot shelf
port# = 3 to 10
sts# = 1 to 48
vtg# = 1 to 7 or ALL
vt# = 1 to 4 (for VT1.5)
vt# = 1 to 3 (for VT2)
J# (AU4) = 1 to 16
K# (TUG-3) = 1 to 3
L# (TUG-2) = 1 to 7 or ALL
M# (TU-12) = 1 to 3
M# (TU-11) = 1 to 4
P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM64-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
sts# = 1 to 192
J# (AU4) = 1 to 64
K# (TUG-3) = 1 to 3

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS1/VC3 P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 3 to 10
sts# = 1 to 48
J# (AU4) = 1 to 16
K# (TUG-3) = 1 to 3
P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM64-shelf#-slot#-port#-J#-K# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
sts# = 1 to 192
J# (AU4) = 1 to 64
K# (TUG-3) = 1 to 3
STS3c/VC4 P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 3 to 10
sts# = 1, 4, 7, 10, ..., 46
J# (AU4) = 1 to 16
P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
sts# = 1, 4, 7, 10, ..., 190
J# (AU4) = 1 to 64

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS12c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-4c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 3 to 10
sts# = 1, 13, 25, 37
J# (AU4) = 1, 5, 9, 13
P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
sts# = 1, 13, 25, 37, ..., 181
J# (AU4) = 1, 5, 9, 13, ..., 61
STS24c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port#-sts# shelf# = 1 to 254
VC4-8c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 3 to 10
sts# = 1, 25
J# (AU4) = 1, 9
P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
sts# = 1, 25, 49, 73, ..., 169
J# (AU4) = 1, 9, 17, 25, ..., 57

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Table 1-50 (continued)


Equipment and facility parameters for path connections for OC-n/STM-n circuit packs
Rate Equipment Facility/channel Parameter values
STS48c/ P2G5-shelf#-slot#-port# OC48-shelf#-slot#-port# shelf# = 1 to 254
VC4-16c PCWDMS-shelf#-slot#- STM16-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 3 to 10
P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port#-sts# shelf# = 1 to 254
port# STM64-shelf#-slot#-port#-J# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
sts# = 1, 49, 97, 145
J# (AU4) = 1, 17, 33, 49
STS192c/ P10GSOEL-shelf#-slot#- OC192-shelf#-slot#-port shelf# = 1 to 254
VC4-64c port# STM64-shelf#-slot#-port# slot# = 1 to 6 and 9 to 14 for
PXFP-shelf#-slot#-port# 14-slot shelf
slot# = 1-8, 11-18, 21-28, and
31-38 for 32-slot shelf
port# = 1 or 2
Note 1: For 2-Fiber BLSR/MS-SPRing, you can provision channels (STS#/J#) 1 to 96 (SONET) or 1 to 32
(SDH) for OC-192/STM-64 facilities only as working channels. Channels 97 to 192 (SONET) or 33 to 64
(SDH) for OC-192/STM-64 facilities are protection channels or can be used to carry extra traffic.
Note 2: For 2-Fiber BLSR/MS-SPRing, you can provision channels (STS#/J#) 1 to 24 (SONET) or 1 to 8
(SDH) for OC-48/STM-16 facilities only as working channels. Channels 25 to 48 (SONET) or 9 to 16 (SDH)
for OC-48/STM-16 facilities are protection channels.

6500 Packet-Optical Platform OC-n/STM-n Circuit Packs


Release 11.2 323-1851-102.3 Standard Issue 1
Copyright© 2010-2016 Ciena® Corporation July 2016
6500 Packet-Optical Platform

OC-n/STM-n Circuit Packs

Copyright© 2010-2016 Ciena® Corporation. All rights reserved.

Release 11.2
Publication: 323-1851-102.3
Document status: Standard
Issue 1
Document release date: July 2016

CONTACT CIENA
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web site at www.ciena.com

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