CUSTOMER : .

DATE : 2016. 01. 29.

REV : 0.2 .

SPECIFICATIONS FOR APPROVAL

Top View Type White SMD LED

MODEL NAME : LEMWA31H70AM00

RoHS
Compliant

APPROVAL REMARK APPENDIX DESIGNED CHECKED APPROVED

2016.01.29 2016.01.29 2016.01.29
K. H. Yoo Y. D. Kim J. J. Yoon
 LGIT Confidential and Proprietary

T ABLE OF CONTENTS

1. Features --------------------- 2

2. Outline Dimensions --------------------- 2

3. Applications --------------------- 3

4. Absolute Maximum Ratings --------------------- 3

5. Electro-Optical Characteristics --------------------- 3~4

6. Bin Structures --------------------- 4~5

7. Typical Characteristic Curves --------------------- 6~7

8. Reliability Test Items and Conditions --------------------- 8~9

9. Packing and Labeling of Products --------------------- 10~13

10. Soldering Conditions --------------------- 14

11. Cautions on Use --------------------- 15~17

12. Disclaimers --------------------- 18

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1. Features
- Lighting Color : White
- Lead Frame Type LED Package : 3.40 x 3.40 x 2.37 (L x W x H) [Unit : mm]
- Viewing Angle : 120˚
- Chip Material : InGaN
- Soldering Methods : Reflow soldering
- ESD Withstand Voltage : Up to 8kV According to JESD22-A 114

2. Outline Dimensions
( Unit : mm )

③ ② ①

Anode Mark

Recommendable Soldering Pattern

(for Reflow Soldering)

Internal Circuit
Pad Configuration
Cathode Anode
① Anode Pad
③ ① ③ ② ①
② Thermal Pad
- +
③ Cathode Pad

Tolerances unless otherwise specified± 0.13 mm

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3. Applications
- Automotive Lighting(Day Rear Lamp, Fog Lamp, Exterior)

4. Absolute Maximum Ratings ( Ta=25℃)

Item Symbol Rating Unit
Forward Current If 700 mA
Pulse Forward Current*1) Ifp 700 mA
Operating Temperature Topr -40 ~ +125 ℃
Storage Temperature Tstg -40 ~ +125 ℃
Junction Temperature Tj 150 ℃
Soldering Temperature JEDEC-J-STD-020D
ESD Classification Class 3B (JESD22-A114)

*1) Pulse width = 1 kHz, duty cycle ≤ 10%

※ The stresses beyond those listed under absolute maximum ratings may cause permanent damages to the device.
These or any other conditions beyond those indicated under recommended operating conditions are not implied.
The exposure to the absolute maximum rated conditions may affect device reliability.
※ LEDs are not designed to be driven in reverse voltage.

5. Electro - Optical Characteristics

( Ta=25℃)

Item Symbol Condition Min. Typ. Max. Unit

Forward Voltage Vf If = 300mA 2.80 3.13 3.45 V
Luminous Flux Φv If = 300mA 100 122 157 lm

Color Coordinate Cx / Cy If = 300mA Refer to ‘6. Bin -

Structures

Viewing Angle 2Θ1/2 If = 300mA - 120 - deg

Thermal Resistance, Junction to

Rth j-s If = 300mA - - 7 °C/W
Solder Point

*1) Measured at Ta between 25℃ and 150℃.

※ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances.
Luminous Flux (Φv) : ±7%, Forward Voltage (Vf) : ±0.1V, Color Value : ±0.005, CRI Value : ±2,
※ Although all LEDs are tested by LG Innotek equipment, some values may vary slightly depending on the
conditions of the test equipment.

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5. Electro - Optical Characteristics

( Ta=25℃)
If (mA) Vf (V) Power (W) Φv (Im) lm/W
100 2.91 0.29 43 149
300 3.13 0.94 122 129
500 3.31 1.66 190 114
700 3.47 2.43 249 103

※ Φv values are for representative references only.

6. Bin Structures
 Forward Voltage Bins (@300mA)  Color Bins (@300mA)
Vf (V) Bin Cx Cy
Bin
Min. Max. 0.3200 0.3000
0 2.80 3.20 HC1 0.3250 0.3038
0.3250 0.3550
1 3.20 3.45
0.3200 0.3500
0.3250 0.3038
HC2 0.3300 0.3075
0.3300 0.3600
 Luminous Flux Bins (@300mA) 0.3250 0.3550
0.3300 0.3075
Φv (lm) 0.3350 0.3113
Bin HC3
Min. Max. 0.3350 0.3650
0.3300 0.3600
X2 100 112
0.3350 0.3113
X3 112 125 0.3400 0.3150
HC4
X4 125 140 0.3400 0.3700
0.3350 0.3650
X5 140 157
0.3400 0.3150
HC5 0.3450 0.3188
0.3450 0.3750
0.3400 0.3700
0.3450 0.3188
HC6 0.3500 0.3225
0.3500 0.3800
0.3450 0.3750

※ Bin structure: Please refer to the following example.

Bin Code : X4–HC1–1 (Φv Bin = X4, Color Bin = HC1, Vf Bin = 1)

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 LGIT Confidential and Proprietary

6. Bin Structures

Color Bin Structures

0.3900

0.3800

0.3700

0.3600

0.3500

0.3400
Cy

HC1 HC2 HC3 HC4 HC5 HC6

0.3300

0.3200

0.3100

0.3000

0.2900
0.3150 0.3200 0.3250 0.3300 0.3350 0.3400 0.3450 0.3500 0.3550
Cx

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7. Typical Characteristic Curves

 Forward Current vs. Forward Voltage  Relative Luminous Flux vs. Forward Current
Ta=25℃ Ta=25℃
700

200

Relative Luminous Flux [%]

Forward Current [mA]

500 150

100

300

50

100 0
2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 0 300 600

Forward Voltage [V] Forward Current [mA]

 Spectrum  Chromaticity Coordinate vs. Forward Current

Ta=25℃, If=300mA
Ta=25℃
100 0.354
Relative Spectral Power Distribution [%]

Cx
0.352
Cy
0.350
80
Chromaticity Coordinate

0.348

0.346
60
0.344

0.342
40
0.340

0.338
20
0.336

0.334
0 0.332
380 430 480 530 580 630 680 730 780 0 100 200 300 400 500 600 700
Wavelength [nm] Forward Current [mA]

 Radiation Characteristics
Ta 25℃, If = 300mA Ta 25℃, If = 300mA
X-X Y-Y
0 0
-30 30 -30 30

-60 60 -60 60

-90 90 -90 90
100 50 0 50 100 100 50 0 50 100

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 LGIT Confidential and Proprietary

7. Typical Characteristic Curves

 Luminous Flux vs. Temperature  Chromaticity Coordinate vs. Temperature

If=300mA If=300mA
0.355
Cx
100 0.350 Cy
0.345
Relative Luminous Flux [%]

Chromaticity Coordinate
80
0.340

60 0.335

0.330
40
0.325

0.320
20
0.315

0 0.310
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140

Case Temperature [℃] Case Temperature [℃]

 Forward Voltage vs. Temperature  Derating Curve

If=300mA
0.50
800
0.40
700
0.30
600
Maximum Current [mA]

0.20
ΔForward Voltage [V]

0.10 500

0.00 400

-0.10
300
Rthj-a= 7℃/W
-0.20
200 Rthj-a= 15℃/W
-0.30 Rthj-a= 20℃/W
100 Rthj-a= 25℃/W
-0.40

-0.50 0
0 20 40 60 80 100 120 140
-40 -20 0 20 40 60 80 100 120 140

Case Temperature [℃] Ambient Temperature [℃]

※ The ambient temperature values for each graph are obtained with LG Innotek equipment.

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 LGIT Confidential and Proprietary

8. Reliability Test Items and Conditions

8-1. Criteria for Judging the Damage

Criteria
Items Symbol Test Conditions
Min. Max.
Forward Voltage Vf If = 300mA Initial Value  0.8 Initial Value  1.2
Luminous Flux Φv If = 300mA Initial Value  0.8 -

• Using Stand MPCB Size is 25×25×1.6 mm3 (L×W×H) and Rth j-s ≒ 13.0℃/W (MCPCB)

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 LGIT Confidential and Proprietary

8. Reliability Test Items and Conditions

8-2. Reliability Tests

Test
No Items Test Conditions Hours Sample Size Ac/Re
/Cycles

Room Temperature Operating Life 1,000

1 Ta = 25℃, If = 700mA 77 pcs 0/1
(RTOL) Hours

High Temperature 1,000

2 Ta = 125℃, Tj = 150℃ 77 pcs 0/1
Operating Life (HTOL) Hours
Wet High Temperature Operating 1,000
3 85℃ / RH 85%, If = 700mA 77 pcs 0/1
Life (WHTOL) Hours
Low Temperature 1,000
4 Ta = -40℃, If = 700mA 77 pcs 0/1
Operating Life (LTOL) Hours

High Temperature 1,000

5 Ta = 125℃ 77 pcs 0/1
Storage Life (HTSL) Hours

Low Temperature 1,000

6 Ta = -40℃ 77 pcs 0/1
Storage Life (LTSL) Hours

-40 / 125 ℃, each 20 min, 1,000

7 Temperature Cycling (TC) 77 pcs 0/1
Transition <10s Cycles

-40 / 125 ℃, each 20 min, 30 500

Power and Temperature
8 min transfer, Power On/off 77 pcs 0/1
Cycle (PTC) Hours
each 2 min

100~2,000~100 ㎐, 20 G, 20
Vibration Variable
9 ㎨, Sweep time 5 min, X.Y.Z - 30 pcs 0/1
Frequency (VVF)
each axis

1500 G, 0.5 msec, 5 time, 3

10 Mechanical Shock (MS) 30 pcs 0/1
each 6 axis Times

HBM - ±8kV 3
11 ESD Characterization 30 pcs 0/1
(R1=10㏁,R2=1.5㏀,C=100㏂) Times

Test for solder conditions 260℃

13 Resistance to Solder Heat (RSH) for 10 sec on solder pads with - 30 pcs 0/1
solder iron

Test for solder conditions 215℃

14 Solderability (SD) - 10 pcs 0/1
for 3 sec on solder pads

Moisture Sensitivity Level MSL 2 Level 168

15 30 pcs 0/1
(MSL) (Pre treatment 85℃, 60%) Hours

※ All reliability tests are qualified (Cumulative test results obtained from testing performed in accordance with AEC-Q101)

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-1. Taping Outline Dimensions

 Reel
( Unit : mm )

 Packing Materials :
- Reel : Conductive PS (Black)
- Emboss Tape : Conductive PS (Black)
- Cover Tape : Conductive PET Base

 Tape

Polarity Direction in Pocket

- +
Cathode Anode

 Taping Arrangement

(End) (Start)

Unloaded Tape Mounted with LED Unloaded Tape Leading Part

(Min. 200mm) (1,000 pcs) (Min. 40mm) (150 ~ 600mm)

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-2. Label Structure

Products are packed in one bag of 1,000 pcs in one taping reel and a label is affixed on
each bag specifying Model , Rank, Quantity and Run number.

Silica gel
Label A
Label A

※. Label A
Specifying ‘Lot ID’, ‘Model Name’, ‘MES ID’, ‘RANK’, ‘Q’ty’, ‘Run No’, ‘Rank No.’

Lot ID : PPWS03R063M000101
Ver : 1.00

Model : LEMW31H70AM00 Q’ty : 1000[pcs]

MES ID : VD35F Run No : L00401-4517
40mm RANK : X3-HC5-0
LEMW31H70AM00=X3-HC5-0=L00401-4517

X3-HC5-0
P-J21-2 LG Innotek Co., Ltd.

 Run No. indication

1 2 3 4 5 6 7 8 9 10
Code Manufacture Manufacture Manufacture Manufacture TH # Serial No
Site Year Month Date
Paju :1 2014 : 4 1~9 : 1~9 ( 01~31) ( 00 ~ 99 ) ( 00 ~ ZZ )
Huizhou : 9 ··· 10 : A
2020 : 0 11 : B
2021 : 1 12 : C

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-2. Label Structure

※. Label C
Specifying ‘Customer’, ‘Date’, ‘Model Name’, ‘Quantity’, ‘Customer Part no’, ‘Outbox ID’,
‘LGIT Internal Model Name’

OutBox Customer 2015.05.22

LEMW31H70AM00
40mm HSO3525001

X3-HC5-0=1000

80mm
 Out Box ID. indication

1 2 3 4 5 6 7 8 9 10
Manufacture PKG Box Year Month Date Serial No
Site Site 2014 : 4 1~9 : 1~9 ( 01 ~ 31) ( 001 ~ 999 )
··· 10 : A
Paju :P PKG : S, P Inner Box : I
2020 : 0 11 : B
Huizhou : H Outer Box : O
2021 : 1 12 : C

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9. Packing and Labeling of Products

9-3. Packing Structures

Reeled products are packed in a sealed-off and moisture-proof aluminum bag with desiccants (silica
gel) and Humidity Indicator Card(HIC). Max four aluminum bags are packed in an inner box and four
inner boxes are packed in an outer box.

Label A
Label A Vacuum Packing

HIC

Silica gel

Label A

Pb-Free Mark

Tolerance : ±10mm

Sizes (mm)
Types
ⓒ ⓐ ⓑ ⓒ
Inner Box 227 82 258
Outer Box 530 240 280
ⓐ
ⓑ

Label C

ⓐ ⓑ Box No. of Total Q’ty

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 LGIT Confidential and Proprietary

10. Soldering Conditions

-. Reflow soldering method is recommended for LEDs assembly.

-. LG Innotek does not guarantee the performance of the LEDs assembled by dip soldering method.
-. Recommended Soldering Profile (according to JEDEC J-STD-020D)

Profile Feature Pb-Free Assembly Pb-Based Assembly

Preheat/Soak
Temperature Min(Tsmin) 150℃ 100℃
Temperature Max(Tsmax) 200℃ 150℃
Maximum time(ts) from Tsmin to Tsmax 60~120 seconds 60~120 seconds
Ramp-up rate (TL to Tp) 3℃/ second max. 3℃/ second max.
Liquidus temperature (TL) 217℃ 183℃
Time (tL) maintained above TL 60~150 seconds 60~150 seconds
Maximum peak package body temperature (Tp) 260℃ 235℃
Time(tp) within 5℃ of the specified temperature (Tc) 30 seconds 20 seconds
Ramp-down rate (Tp to TL) 6℃/second max. 6℃/second max.
Maximum Time 25℃ to peak temperature 8minutes max. 6minutes max.

-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs
although the recommended soldering conditions are specified in the above diagrams.
-. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The LEDs encapsulate silicone and have soft surfaces on the tops, which can easily
damaged by pressure. Precautions should be taken to avoid strong pressure on the
encapsulated part when leveraging the pick and place machines. The pick up nozzles should
not directly contact the silicone resin of the LEDs.
-. Reflow soldering should not be done more than two times.

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11. Cautions on Use

11-1. Moisture-Proof Package

-. The moisture in the SMD package may vaporize and expand during soldering.
-. The moisture can damage the optical characteristics of the LEDs due to the encapsulation.

11-2. During Storage

Conditions Temperature Humidity Time

Within 1 Year from

Before Opening Aluminum Bag 5℃ ~ 30℃ ＜ 50%RH
the Delivery Date
Storage
After Opening Aluminum Bag 5℃ ~ 30℃ ＜ 60%RH ≤ 672 hours

Baking 65 ± 5℃ ＜ 10%RH 10 ~ 24 hours

-. The LEDs should be stored in a clean environment. If the LEDs are stored for 3 months of more
after being shipped from LGIT, a sealed container with a nitrogen gas should be used for storage.
-. When storing the LEDs after opening aluminum bag, reseal with a moisture absorbent material
inside

11-3. During Usage

-. The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate,
etc.
-. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to
corrosive gases must be avoided during operation and storage.
-. The metal parts also can be affected not only by the corrosive gases emitted inside of
the end-products but by the gases penetrated from outside environment.
-. Extreme environments such as sudden ambient temperature changes or high humidity that can
cause condensation must be avoided.

11-4. Cleaning
-. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as
they may damage the resin of the LEDs.
-. Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following
conditions.
Cleaning Condition : IPA, 25℃ max. × 60sec max.
-. Ultrasonic cleaning is not recommended.
-. Pretests should be conducted with the actual cleaning process to validate that the process will not
damage the LEDs.

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11. Cautions on Use

11-5. Thermal Management

-. The thermal design of the end product must be seriously considered even from the beginning
stage.
-. The co-efficiency between the heat generation and the Thermal dissipation is affected by the thermal
resistance of the circuit boards and the density of the LED placements together with other
components.

11-6. Static Electricity

-. Wristbands and anti-electrostatic gloves are strongly recommended and all devices,
equipment and machineries must be properly grounded when handling the LEDs which are
sensitive against static electricity and surge.
-. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs.
-. Some unusual characteristics such as significant increase of current leakage, decrease of
turn-on voltage, or no operation at a low current can be occurred by damaged LEDs.

11-7. Recommended Circuit

-. The current through each LED must not exceed the absolute maximum rating when design the
circuits.
-. In general, there can be various forward voltages for LEDs. Different forward voltages in
parallel via a single resistor can result different forward currents to each LED, which also can
output different luminous flux values. In the worst case, the currents can exceed the absolute
maximum ratings which can stress the LEDs. Matrix circuit with a single resistor for each LED
is recommended to avoid the luminous flux fluctuations.

L1 L2 L3 L1 L2 L3 L1 L2 L3
RL1 RL2 RL3
RL

Fig.1 Recommended Circuit in Parallel Mode Fig.2 Abnormal Circuit

: Separate resistors must be used for each LED. Circuits to Avoid : The current through the LEDs may vary
due to the variation in LED forward voltage.

-. The driving circuits must be designed and operated by forward bias only so that the LEDs are
not to be operated by the reverse voltages while turned off, which can damage the LEDs.
-. Reverse voltage can damage the zener diode and cause destructions.
-. Constant-current operation by driver IC controller is recommended.

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11. Cautions on Use

11-9. Soldering Iron

-. The recommended condition is less than 5 seconds at 260℃.
-. The time must be shorter for the higher temperature. (+10℃ → -1sec).
-. The power dissipation of the soldering iron should be lower than 15W when the surface
temperature of the device should be controlled at or under 230℃.

11-10. Eye Safety Guidelines

-. Do not directly look at the light when the LEDs are on.
-. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with
optical instruments.

11-11. Manual Handling

-. Use anti-electrostatic tweezers to grab base of LED and do not apply mechanical
pressure on the surface of the encapsulant.

11-12. Precaution for use

-. VOCs(volatile organic compounds) possibly can be generated from the silicone encapsulant itself and
other material, such as glue (sealing material), coatings, O-ring and potting materials, etc.

-. VOCs (Volatile organic compounds) emitted from these materials can penetrate silicone encapsulants
of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of
Automotive Lamps (Day Time Running Lamp, Fog Lamp, etc.).

-. Using LEDs, be careful not to use materials (such as adhesives) emitting significant VOCs

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12. Disclaimers

-. LG Innotek is not responsible for any damages caused by any accidents or operational
environments exceeding the absolute maximum ratings.
-. Generally accepted electronic equipment must be used to operate the LEDs in this document.
-. Consultation with LG Innotek is recommended for unassured environments or operations to avoid
any possible malfunctions or damages of the products or risk of life or health.
-. Any unauthorized, without prior written consents from LG Innotek, disassembly is prohibited if
purposed for reverse-engineering. All defected LEDs must be reported to LG Innotek and not to be
disassembled or analyzed.
-. The product information can be modified and upgraded without prior notice.

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SPECIFICATION
MODEL LEMWA31H70AM00 DOCUMENT No. -
REG. DATE 2015.01.19 REV. No. 0.2
REV. DATE 2016.01.29 PAGE 18

Change History of Revision

Revision Date Contents of Revision Change Remark

0.0 15.01.19 - Establishment
0.1 15.08.21 - Typical Characteristic Curves Update 6,7page
0.2 16.01.29 - Specification change shipment 11page