Black

Silicon
RCT i-BlackTex Technical Data

Process Inline saw damage etch, Black Silicon texturing & rear sidpo-
lishing

Throughput Up to 4200 w/h gross, 5 lanes

Conveyor Speed 0.5 - 2.6 m/min, nominal 2.4 m/min

Dimensions 11,400 x 2,200 x 2,120 mm³ (L x W x H)

Wafer size 156 x 156 ± 0.5mm, 156.75 x 156.75 ± 0.5mm, ≥ 150 µm

Etch depth range 3 – 6 µm/side

Bath lifetime > 700,000 wafers

Breakage rate < 0.1%