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NDT014L N-Channel Logic Level Enhancement Mode Field Effect Transistor
NDT014L N-Channel Logic Level Enhancement Mode Field Effect Transistor
NDT014L
N-Channel Logic Level Enhancement Mode Field Effect Transistor
_________________________________________________________________________________
D D
G D S G S
NDT014L Rev.D
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
IS Maximum Continuous Drain-Source Diode Forward Current 2.3 A
VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 2.3 A (Note 2) 0.85 1.3 V
trr Reverse Recovery Time VGS = 0 V, IF = 2.3 A dIF/dt = 100 A/µs 140 ns
Notes:
T J −T A T J −T A
1. PD (t) = R θJA(t)
= R θJC+R θCA (t)
= I 2D(t) × R DS(ON)@T J RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the
solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is defined by users. For general reference: Applications on 4.5"x5" FR-4 PCB under still air environment, typical
RθJA is found to be:
a. 42oC/W with 1 in2 of 2 oz copper mounting pad.
b. 95oC/W with 0.066 in2 of 2 oz copper mounting pad.
c. 110oC/W with 0.0123 in2 of 2 oz copper mounting pad.
1a 1b 1c
NDT014L Rev.D
Typical Electrical Characteristics
10 2
VGS = 10V 5.0
DRAIN-SOURCE ON-RESISTANCE
, DRAIN-SOURCE CURRENT (A)
4.5
6.0 1.75
8 4.0
R DS(on) , NORMALIZED
VGS =3.0V
1.5
6 3.5
3.5
1.25
4.0
4 4.5
3.0 1 5.0
6.0
2
D
0.75 10
2.5
I
0 0.5
0 1 2 3 4 5 0 2 4 6 8 10
VDS, DRAIN-SOURCE VOLTAGE (V) I , DRAIN CURRENT (A)
D
1.75 2
I = 2.8A DRAIN-SOURCE ON-RESISTANCE V = 4.5V
D GS
TJ = 125°C
DRAIN-SOURCE ON-RESISTANCE
V GS = 4.5V 1.75
1.5
R DS(on) , NORMALIZED
R DS(ON) , NORMALIZED
1.5
1.25
1.25
25°C
1
1
0.75 -55°C
0.75
0.5 0.5
-50 -25 0 25 50 75 100 125 150 0 2 4 6 8 10
T , JUNCTION TEMPERATURE (°C)
J
I , DRAIN CURRENT (A)
D
1.2
GATE-SOURCE THRESHOLD VOLTAGE
10
T = -55°C
VDS = 5V J VDS = VGS
25°C I D = 250µA
8 1.1
VGS(th) , NORMALIZED
125°C
I D , DRAIN CURRENT (A)
6 1
4 0.9
2 0.8
0 0.7
0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 150
V , GATE TO SOURCE VOLTAGE (V) T , JUNCTION TEMPERATURE (°C)
GS J
NDT014L Rev.D
Typical Electrical Characteristics
1.12 10
I D = 250µA V GS = 0V
DRAIN-SOURCE BREAKDOWN VOLTAGE
T J = 125°C
1.04 0.1
25°C
1 0.01
-55°C
0.96
0.001
S
0.92
-50 -25 0 25 50 75 100 125 150 0.0001
0.2 0.4 0.6 0.8 1 1.2
T J , JUNCTION TEMPERATURE (°C)
V SD , BODY DIODE FORWARD VOLTAGE (V)
Figure 7. Breakdown Voltage Variation with Figure 8. Body Diode Forward Voltage Variation
Temperature. with Current and Temperature.
700 10
500 I D = 2.8A V DS = 5V
10V
, GATE-SOURCE VOLTAGE (V)
Ciss 8 20V
CAPACITANCE (pF)
200
Coss 6
100
50 4
Crss
f = 1 MHz
GS
20 V GS = 0V 2
V
10 0
0.1 0.2 0.5 1 2 5 10 20 40 60 0 2 4 6 8 10
V , DRAIN TO SOURCE VOLTAGE (V) Q , GATE CHARGE (nC)
DS g
V DD t on t off
t d(on) tr t d(off) tf
V IN RL
90% 90%
D V OUT
VGS VOUT
R GEN DUT
10% 10%
G
INVERTED
90%
S
V IN 50% 50%
10%
PULSE WIDTH
NDT014L Rev.D
Typical Thermal Characteristics
3.5
8
gFS, TRANSCONDUCTANCE (SIEMENS)
VDS = 5V
2
4
125°C
1.5
1b
2 1c
1 4.5"x5" FR-4 Board
o
TA = 2 5 C
Still Air
0.5
0 0 0.2 0.4 0.6 0.8 1
0 2 4 6 8 10
2oz COPPER MOUNTING PAD AREA (in 2 )
I , DRAIN CURRENT (A)
D
Figure 13. Transconductance Variation with Drain Figure 14. SOT-223 Maximum Steady- State
Current and Temperature. Power Dissipation versus Copper
Mounting Pad Area.
4 20
ID , STEADY-STATE DRAIN CURRENT (A)
10
10u
5 s
IT
IM 100
3 1a )L
I D , DRAIN CURRENT (A)
ON us
S(
RD
10
1 ms
1b 0.5 10
2 0m
s
1c 1s
VGS = 4.5V 10s
0.1 SINGLE PULSE DC
4 .5"x5" FR-4 Board
1 R θJA =See Note1c
T = 25 o C 0.05
A
Still Air
T A = 25°C
V = 4.5V
GS
0 0.01
0 0.1 0.2 0.3 0.4 0.5 0.1 0.5 1 2 5 10 30 50 80
2
2oz COPPER MOUNTING PAD AREA (in ) VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 15. Maximum Steady- State Drain Figure 16. Maximum Safe Operating Area.
Current versus Copper Mounting Pad
Area.
0.5 D = 0.5
TRANSIENT THERMAL RESISTANCE
0.2 0.2
R JA (t) = r(t) * R JA
r(t), NORMALIZED EFFECTIVE
θ θ
0.1 0.1 R JA = See Note 1 c
θ
0.05 0.05
P(pk)
0.02 0.02
0.01 t1
0.01 t2
0.005 TJ - TA = P * R (t)
Single Pulse θJA
Duty Cycle, D = t 1 / t 2
0.002
0.001
0.0001 0.001 0.01 0.1 1 10 100 300
t 1 , TIME (sec)
NDT014L Rev.D
SOT-223 Tape and Reel Data and Package Dimensions
SOT-223 Packaging
Configuration: Figure 1.0
Customized Label
Packaging Description:
SOT-223 parts are shipped in tape. The carrier tape is
made from a dissipative (carbon filled) polycarbonate
F63TNR Label resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
Antistatic Cover Tape These reeled parts in standard option are shipped with
2,500 units per 13" or 330cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). Other option comes in 500 units per 7" or
177cm diameter reel. This and some other options are
further described in the Packaging Information table.
These full reels are individually barcode labeled and
placed inside a standard intermediate box (illustrated in
figure 1.0) made of recyclable corrugated brown paper.
One box contains two reels maximum. And these boxes
are placed inside a barcode labeled shipping box which
Static Dissipative comes in different sizes depending on the number of parts
shipped.
Embossed Carrier Tape
F63TNR Label
F63TNR Label sample
184mm x 184mm x 47mm
LOT: CBVK741B019 QTY: 3000
Pizza Box for D84Z Option
FSID: PN2222A SPEC:
SOT-223 Tape Leader and Trailer
D/C1: D9842 QTY1: SPEC REV:
Configuration: Figure 2.0 D/C2: QTY2: CPN:
N/F: F (F63TNR)3
Carrier Tape
Cover Tape
Components
Trailer Tape Leader Tape
300mm minimum or 500mm minimum or
38 empty pockets 62 empty pockets
K0 W
E2
Wc B0
Tc
A0 P1 D1
Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
0.292
SOT-223 6.83 7.42 12.0 1.55 1.50 1.75 10.25 5.50 8.0 4.0 1.88
+/-
9.5 0.06
(12mm) +/-0.10 +/-0.10 +/-0.3 +/-0.05 +/-0.10 +/-0.10 min +/-0.05 +/-0.1 +/-0.1 +/-0.10 +/-0.025 +/-0.02
0.0130
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C). 0.5mm
20 deg maximum maximum
Typical
component
cavity 0.5mm
B0 center line maximum
Typical
Sketch A (Side or Front Sectional View) component Sketch C (Top View)
A0 center line
Component Rotation Component lateral movement
Sketch B (Top View)
SOT-223 Reel Configuration: Figure 4.0 Component Rotation
W1 Measured at Hub
Dim A
Max
Dim C
See detail AA
Dim D
W3 min
DETAIL AA
Reel
Tape Size Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
Option
7.00 0.059 512 +0.020/-0.008 0.795 5.906 0.488 +0.078/-0.000 0.724 0.469 – 0.606
12mm 7" Dia
177.8 1.5 13 +0.5/-0.2 20.2 150 12.4 +2/0 18.4 11.9 – 15.4
13.00 0.059 512 +0.020/-0.008 0.795 7.00 0.488 +0.078/-0.000 0.724 0.469 – 0.606
12mm 13" Dia
330 1.5 13 +0.5/-0.2 20.2 178 12.4 +2/0 18.4 11.9 – 15.4
1:1
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant into support device or system whose failure to perform can
the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in significant injury to the
user.
Definition of Terms
Advance Information Formative or This datasheet contains the design specifications for
In Design product development. Specifications may change in
any manner without notice.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.