PT CELESTICA ELECTRONICS BINTAN

Document Revision History

Doc. No. : CEB-EN-PF-0110-001 Title : Process Flow Chart
Diablo 2
Date : 11 November 2002

Written by : Alkaff Signature : Date :

Reviewed by : David Yeng Signature : Date :
Department : Engineering Total Pages : 2

REVISION HISTORY
Date Page Revision Description of Changes
11 November 2002 - 01 Initial release

APPROVAL
Name Designation Signature Date
David Yeng Engineering Section Manager
Agus Jaka Marsudi Production Section Manager
Sutrisno Snr. Quality Engineer

DCC ENDORSEMENT
Master Copy Issued / Reference / Obsoleted
CEB-QP-05-F01 REV. 02
 PROCESS MEASUREMENT QUALITY RECORD
CHEMICAL QUALITY RECORD
OPERATION EQUIPMENT PARAMETER SPEC. METHOD SAMPLING RESPONSIBLE
USED TITLE
TOP SIDE
1) Refrigerator
1) Temperature
Solder Paste Storage &
2) Thaw time Refer Work Instruction FIFO Daily Production
Handling Instruction
3) Time when cap
1) is openned once / shift QA Solder Paste Audit
Solder Paste Printing MPM Printer Composition :
Solder Paste 1) Printing pressure
2) Printing speed Refer Work Instruction Visual Once per Shift Engineering MPM Printer
3) Snap-off Parameter Checklist
4) Downstop
Z-600 Paste 1) Solder Paste Refer Work Instruction 5 boards 4X / shift QA ( X- R Chart )
- Visual
Height Checker 1) Thickness & Alignment
Refer to 100% Production -
1) Alignment Visual
Panasert / KME / Work Instruction 5 boards 4 X per shift QA C-Chart
SMT Placement Fuji Placement - 1) Component Customer Workmanship Visual 100% Feeder Verification
machine 1) Feeder Standard on Conversion & Production & QA Log Book
during part change
Profile Once a week/ Reflow Oven
1) Profile Profiling
Procedure Upon conversion Engineering Parameter Checklist
Reflow Soldering -
Vitronics / Soltec 1) Temp. Setting Refer to once / shift
Convection Oven 2) Conveyor Speed Work Instruction
Visual
2 x / shift or change QA Reflow Oven
model Parameter Checklist
1) Solderability and Customer Workmanship Visual 5 boards/ 4x per shift SPC C -Chart
component placement Standard

P-Chart
Customer Workmanship
1) Solder defects
Post Reflow Luxo Lamp 3X - Standard Visual Production Inspection
2) Comp defects 100%
Inspection Defects Recording
Sheet
SMT QA Buy Off Customer Workmanship AQL=0.65% QA SMT buy off report
Inspection Standard Visual
CEB-EN-PE -0110-001-C01 REV. 01
 PROCESS MEASUREMENT QUALITY RECORD
CHEMICAL QUALITY RECORD
OPERATION EQUIPMENT PARAMETER SPEC. METHOD SAMPLING RESPONSIBLE
USED TITLE
BOTTOM SIDE
1) Refrigerator
1) Temperature
Solder Paste Storage &
2) Thaw time Refer Work Instruction FIFO Daily Production
Handling Instruction
3) Time when Jar
1) is opened once / shift QA Solder Paste Audit
Solder Paste Printing MPM Printer Composition : 1) Paste alignment Refer Work Instruction Visual 100% Production -
Kester 244 Using 40 X magnification for Critical loc.
- Sn63/Pb37
- No Clean 1) Printing pressure Refer Work Instruction
2) Printing speed MPM Printer
Visual Once per Shift Engineering
3) Snap-off Parameter Checklist
4) Downstop
Z-600 Paste 1) Solder Paste Visual 5 boards 4X / shift QA ( X- R Chart )
-
Height Checker 1) Thickness & Alignment
Refer to 100% Production -
1) Alignment Visual
Panasert / Work Instruction 5 boards 4 X per shift QA C-Chart
SMT Placement KME / - 1) Component Customer Workmanship 100% Feeder Verification
Fuji Placement 1) Feeder Standard Visual on Conversion & Production & QA Log Book
machine during part change
Profile Once a week/ Reflow Oven
1) Profile Profiling
- Procedure Upon conversion Engineering Parameter Checklist
Vitronics / 1) Temp. Setting Refer to once / shift
Reflow Soldering
Soltec/ 2) Conveyor Speed Work Instruction Visual 2 x / shift or change QA Reflow Oven
Convection Oven model Parameter Checklist

P-Chart
1) Solder defects
Post Reflow Luxo Lamp 3X - Customer Workmanship Visual Production Inspection
2) Comp defects 100%
Inspection Standard Defects Recording
Sheet
1) Solderability and Customer Workmanship Visual 5 boards/ 4x per shift SPC C -Chart
component placement Standard
 Using 40 X Solderabilility- Customer Workmanship Visual 100% Production -
magnification Fine pitch component Standard
CEB-EN-PE -0110-001-C01 REV. 01

PROCESS MEASUREMENT QUALITY RECORD

CHEMICAL QUALITY RECORD
OPERATION EQUIPMENT PARAMETER SPEC. METHOD SAMPLING RESPONSIBLE
USED TITLE
1) Solder short Inspection
X-Ray Inspection Pony X-Ray M/C - 2) Missing ball Refer to Work Instruction Visual 10 PCS / lot Production Defects Recording
3) Void Sheet
SMT QA Buy Off - - - Customer workmanship AQL=0.65% QA SMT buy off report
Inspection Standard Visual
Depanelization JIG/PTS Router - Refer Work Instruction - 100% Production -
NIL
Manual Insertion Wave Pallet - Nil Refer Work Instruction Visual 100% Production -
Profile Once a week/ Reflow Oven
1) Profile Profiling
NIL Solder Bar Procedure Upon conversion Engineering Parameter Checklist
Soltec/ Tamura 1) Temp. Setting once / shift
Wave Soldering
Wave Soldering Thinner 2) Conveyor Speed Refer Work Instruction 2 x / shift or change QA Parameter Checklist
Visual
Nil M/C Flux model
Every hour Engineering Parameter Checklist
Post Wave Inspection - - - Refer Work Instruction Visual 100% Production -
1. Temp Setting
Manual Insertion Hakko 936 2.Poor Solder Joint
Manual Soldering Flux/Solder wire 3. Solder Splash Rever Work Instruction Visual 100% Production -
4. Excess Solder
1. Temp Setting
Manual Soldering Hakko 936 Flux/Solder wire 2.Poor Solder Joint Refer Work Instruction Visual 100% Production -
3. Solder Splash
4. Excess Solder
Inspection
VMI Inspection Luxo Lamp - - Customer workmanship Visual 100% Production Defects Recording
Standard Sheet
Label Printing Zebra 170 - - - Visual 100% Production Log Book
Labeling - - - Refer Work Instruction Visual 100% Production Log Book
Inspection
Final VMI Inspection Luxo Lamp - - Customer workmanship Visual 100% Production Defects Recording
Standard Sheet
Customer workmanship PCBA Out-Going
 Out-Going Inspection - - - Standard Visual AQL=0.4% QA Quality Audit Record
Scaning Scaner - Monitor Display Refer Work Instruction Visual 100% Production -

Shipment - - - - - - - -
CEB-EN-PE -0110-001-C01 REV. 01
 REF. DOC. # /
REMARKS

CEB-EN-PE-0000-001

CEB-QA-IP-0000-001

CEB-EN-SM-000-001

CEB-QA-IP-0000-002

CEB-EN-PE-0000-001
CEB QA-IP-0000-003

CEB-EN-PE-0000-002

CEB QA-IP-0000-004

CEB QA-IP-0000-005

CEB-EN-PE-0000-001

CEB-EN-PE-0000-016 F01

CEB QA-IA-0000-001
 REF. DOC. # /
REMARKS

CEB-EN-PE-0000-001

CEB-QA-IP-0000-001
-

CEB-EN-SM-000-001

CEB-QA-IP-0000-002

CEB-EN-PE-0000-001
CEB QA-IP-0000-003

CEB-EN-PE-0000-002

CEB QA-IP-0000-004

CEB-EN-PE-0000-001

CEB-EN-PE-0000-016 F01

CEB QA-IP-0000-005
 -

REF. DOC. # /
REMARKS

CEB-EN-PE-0000-016 F01

CEB QA-IA-0000-001

-
CEB-EN-PE-0000-002

CEB QA-IP-0000-004

-
-

CEB-EN-PE-0000-016 F01

-
-

CEB-EN-PE-0000-016 F01
CEB-QA-IA-0000-002
-

-
 A
Start

1. Use IPA to Remove paste.

2. Wash in Ultrasonic Cleaner. Removed PCB TAB
Solder Paste 3. Dry PCB using air gun.
4. Check using magnifying glass
Printing OK
Set Test Parameter
FAIL Fail Test

Solder Paste Printing Inspection Rework

PASS

Chip Placement Barcode Labelling

( Refer to Batch Picking Slip )

IC Placement

Pack
OK

FAIL Visual Inspection

Check using 10x Magnifying Glass Shipment
PASS

Reflow Oven
Rework if
any defect OK
Visual Inspection
Fail Check using 10x Magnifying Glass
Rework
IF any defect PASS

A Send to test Station

Prepared by : Alkaff Approved by :

Date : 01 March 2006 Page : 1 Model : DDRII UD1XTRNP
Doc. No : Revision : 0
Title : Process Flow Chart