Polishing Pads: Quality Matters Newsletter

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PACE Technologies

Quality Matters
Newsletter Polishing Pads Volume III, I ssue 1
January 2004

by Donald Zipperian, Ph.D.

Polishing Pad Characteristics Inside this issue:

Oftenti mes the choi ce of the proper where surface finish i s more important than
polishing pad can be quite confusing. In flatness. High napped polishing pads are Polishing Pad 1
the past, choosing a polishin g cloth or ch aracterized by relatively l ower densiti es, Characteristics
polishing pads was primary based on trial lower hardness, greater thickness, hi gh
and error testing. More recently, with compressibility and low stiffness. Comm on Polishing Pad 2
the more critical polishing requirements abrasives used with h igh napped polishing Descriptions
for the semiconductor industry, data pads in clude alumina and colloidal silica.
storage market and fiber optics, the
polishing surface and characterizing the Low napp ed polishing pads find app licati ons Magnetic Backed 4
effect of the polishing process has b een in the coarser polishing steps and for Polishing Pads
examined more carefully. Thus the appli cations where specimen flatness,
performance of a poli shing pad is now especially across materials of vastl y different Company 4
characterized by its h ardness, thickness, hardness (e.g. coating or plating analysis, Information
density (porosi ty), comp ressibility, hardened steel s, etc.). The characteristics
texture, stiffness; and to a certain extent of a low napped pol ishing pad include:
its interaction wi th the abrasi ve or higher density, hi gher hardness, lower
polishing extender or lubricant. thickness, low compressibility, smoother
texture and higher stiffness. Common
In general, polishing pads for abrasi ves used on low napped poli shing pads
metallograph ic polishing are classified by include diamond, and/or col loidal silica in
the nap of the poli shing cloth. Hi gh the case of CMP (chemical mechani cal
napped pol ishing cloths ar e generally used planarization pol ishing processes).

H igh Napped Low Napped


Characteristic
Pol ishing Pads Po lishing Pads

Density Low High Considera tions for


proper Polishing Pad
Ha rdness Low High Selection
Thickness High Low -Sp ecimen fl atnes s
Compr essibility High Low -Specimen surface finis h
-Polishing abrasive
Texture Fiberous Flat / porous
-Specimen brittleness and
Stif fness (modulus) Low High hardnes s

H igh Napped Low Napped


Application
Po lishing Pads Po lishing Pads
Flatness v
Surface Finish v
Intermediate Polish ing v

Chemical Mechanical Polishin g v


Final Polishin g v v

1802 W. Grant Rd. Suite 102 • Tucson, AZ 85745 60090 USA


Toll Free: 888-PACE-654 • FAX: 520-882-6598
PACE@metallographic.com • www.metallographic.com
Quality Matters - Volume III, Issue 1 Page 2

Metal Mesh cloth - this is a wire mesh


material useful for coarse and intermediate
lapping/polishing. The texture of this wire
allows for the abrasive to become semi-
fixed; thus offering the advantage of
increased stock removal , while minimi zing
damage.

POLYPAD™ Polishing Pad - this cloth


is a low napped synthetic polyester polishing
pad whi ch has a similar action to a nylon
pad, with the ex ception that it is much
more durabl e. I t is used in the intermed iate
poli shing step s.

TEXPAN™ Polishing Pad - this is the


most commonly used polishi ng cloth material
for th e intermediate polishing steps.
TEXPAN™ Polis hing pad is a non-woven
low n apped polishing pad.

DACRON® Polishing Cloth - this is a


low napped polishing pad for polishi ng
prim arily with 1-15 micron diamond
abrasives. The DACRON® pad is the most
popular intermediate polishing pad in Europe
and is used mostly for polishing metals. Its
low nap provides it a very soft and gentle
polishing action.
Note: DACRON® is a registered trade name of
DUPONT® Corporation.

Black CHEM™ Polishing Pad - this i s a


porometric CMP polymer pad which has a
consistency similar to a rubber type of pad.
Black CHEM™ pad has a low nap but
behaves as an intemediate polishing pad with
a performance between low napp ed and high
napped pads.
Quality Matters - Volume III, Page 3

TRICOTE™ Polishing Cloth - this is a


tightly woven high napped suede final
pol ishi ng pad for metals and polymers. Thi s
cloth is very popular for fin al polishing with
alumina and coll oidal silica, especi ally for
p lated and coated specimens where edge
retention is cri tical.

M ICROPAD™ Polishing Cloth - this is


the most common high napped final polishi ng
pad for most metals and polymers. Its hi gh
nap provides it a very soft and gentle
polishi ng action.

M ICROPAD™ Extra Polishing Cloth -


this i s a premi um edition of the most
common hi gh napped final polishing cloth for
metals and p olymers. Its high nap provides it
a very soft and gentle polishing action.

NAPPAD™ Polishing Pad - this is


another high napped final polis hing pad useful
for most m etals and polymers. It has a higher
nap than MICROPAD™, providin g it with a
very gentle polishing action which is very
useful for polishing soft material s such as
copper, aluminun and austentite steels.

MOLTEC™ Polishing Pad - this is wool


poli shing cloth used for final poli shing an d has
a very high nap. It is most commonly used
for final polishing metals where edge
retenti on is a minor consideration.
Quality Matters - Volume III, Issue 1 Page 4

Polishing Cloth w/ PSA backing

MAGNEPADTM Magnetic Support Plate

MAGNETONTM Magnetic PSA Base

Working Plate

Working Plate MAGNEPAD TM Magneti c Polishing System using standard PSA


Magnetic plate Polishing backed polishing pads.
Pad (PSA)
MAGNETON TM
PSA base

PACE Technologies
1802 W. Grant Rd. Suite 102
Tucson , AZ 85745
Magnetic Polishing Pads www.metallographic.com

For ease of use, rapid chan ging and for storage convenience, Where Quality Meets Value
magnetic backed polishing pads are used. Thi s sys tem
consists of a magnetized PSA backed base which is Phone: 520-882-6598
permanently attached to the worki ng wheel vi a an adhesi ve Fax: 520-88-6599
or PSA backin g (see image and drawing above). Email: Pace@metallographic.com

Ei th er standard PSA backed polishing pads can attached to a


magnetic base plate or the polishing pads can be purchased For more information visit
with an flexibl e magnet backing already attached (see image our web site at
and drawing below). www.metallographic.com

Polishing Cloth w/ Magnetic backing

MAGNETONTM Magnetic PSA Base

Working Plate

Magnetic Polishing System wi th magnetic backing


on poli shing cloth.
Working Plate Polishing Pad
(with magnetic backing)
MAGNETON TM
PSA base

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