ME 571 Reliability in Engineering Design

Module 1.2: Case Study

Ganesh Subbarayan
Professor, School of Mechanical Engineering
Purdue University
Solder Joint Fatigue Failure in Electronic
Assemblies
 Crack Growth in Solder Joints
CBGA 29mm, 1.27mm pitch, 483 pads
Accelerated thermal cycling (0-100oC)

Courtesy HDPUG

QFN, 0.5mm pitch, 64 I/Os, 4mm square

Accelerated thermal cycling (-40 to 125oC)

Courtesy TI
G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design
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 Approach
Material Characterization
250 2500
225 2250
200 2000
175 1750
Stress (MPa)

Strain rate (s-1)

150 1500
125 Stress-Strain 1250
100 Strain rate-Strain 1000
75 750
50 500
25 250
0 0
0.00 0.05 0.10 0.15 0.20 0.25 0.30
Strain

Constitutive Models Failure Experiments

1/ m
 − Q   σ 
ε = A exp
p
 sinh ξ 
 RT    s 

Failure Models

G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design

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 Failure Experiments

• Inducing Failure
– Accelerated Thermal Cycling
– Simulated Power Cycling
– Power Cycling
– Drop Test
– Vibration Test

• Failure Analysis
– Cross-section
– Dye and Pry
– X-ray, CSAM
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 Simulated Power Cycling Tester

• Thermo-electric (TE) or Peltier device

• Component affixed to TEC via thermal adhesive pads
• Temperature profile cycled
• Package electrical resistance measured

Test package

Thermal adhesive TEC

pad

Heat Sink

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 Temperature Profiles
120
10 Minute Hot Dwell
100 Board
Temperature (C)
Temperature
80
Measurements
60
Peltier
40

20

0
0 1 11 12 13
Hot Dwell
Time (min)
120

100
Three temperature profiles
80

Temperature ( oC)
– 0oC to 100oC
60
– Hold time at 100oC 40
Peltier Temperature
Board Temperature

– 10, 30, and 60 minute hot dwells 20

0
0 200 400 600 800 1000 1200 1400
-20
Time (s)
G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design
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 Weibull Probability Plots
Sn3.0Ag0.5Cu and Sn3.8Ag0.7Cu for 10, 30, 60 min Hot Dwell Times
10 Minute Hot Dwell 30 Minute Hot Dwell 60 Minute Hot Dwell

Simulated Power
Cycling Tester
Chan, D., Bhate, D., Subbarayan, G., Love, D., Sullivan, R., "Effects of Dwell Time on the Fatigue
Life of Sn3.8Ag0.7Cu and Sn3.0Ag0.5Cu Solder Joints during Simulated Power Cycling," in the
proceedings of the Electronics Components and Technology Conference (ECTC), Reno, NV, May
30- June 01, 2007.

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 Failure Analysis
Dye and Pry
Cross Section

Fracture
Morphology

P. Towashiraporn, G. Subbarayan, C.S. Desai, “A Hybrid

Model for Computationally Efficient Fatigue Fracture
Simulations at Microelectronic Assembly Interfaces.”
International Journal of Solids and Structures, v 42, p
4468-4483, 2005.

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 Approach
Material Characterization
250 2500
225 2250
200 2000
175 1750
Stress (MPa)

Strain rate (s-1)

150 1500
125 Stress-Strain 1250
100 Strain rate-Strain 1000
75 750
50 500
25 250
0 0
0.00 0.05 0.10 0.15 0.20 0.25 0.30
Strain

Constitutive Models Failure Experiments

1/ m
 − Q   σ 
ε = A exp
p
 sinh ξ 
 RT    s 

Failure Models

G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design

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 Empirical Fatigue Model
• Coffin-Manson Relation:
1
 C  m
Nf =  p 
 ∆ε 
• Frequency Modified
Coffin-Manson Relation
1
 C  1− k
m
Nf =  p  υ
 ∆ε 

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 Empirical Acceleration Factors
• Notion of relating tests in the lab to real-life/field conditions
– Typical relationship (Norris-Landzberg, 1969)

• Empirical model - constants and form specific to a material and geometry

– Assumption of constant ∆T/∆εp
– Modification (for SnPb, Lau and Pao, 1997)

– Estimate for SnAgCu (2005, Pan et.al. HP)

• Empirical approach with limited application across package types

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 Empirical Energy-Based Methods
• Fatigue is the result of “permanent work” or “damage” in every
cycle
• Measured by the inelastic energy dissipation density (energy
per unit volume)
W = ∫ σ ij ε ij dt
i
 i

• The inelastic work can be partitioned as:

W = ∫ σ ij dε + ∫ σ ij ε ij dt
i
 c p
ij

G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design

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 Inelastic Dissipation
• Inelastic dissipation
correlates with fatigue
life
σ

log N f = − log W i + log C

Vaynman, S. and McKeown (ECTC1991) 1 Wi
⇒ =
G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design
Nf C
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 Limitations of Empirical Models
k
 A 
Nf = 
 ∆W 

• Estimation of ∆W not apparent

– Interface averaging includes elements with insignificant
dissipation
– Damage not evaluated point-wise!

• Package construction/geometry dependent!

– Lack of true predictive capability
P. Towashiraporn, K. Gall, G. Subbarayan, W. McIlvanie, B.C. Hunter, D. Love, R.
Sullivan, “Powercycling Thermal Fatigue of Sn-Pb Solder Joints in a Chip-Scale
Package.” International Journal of Fatigue, v 26, p 497-510, 2004.

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 Weibull Material Degradation Model Weibull Probability Density Function
-3
x 10
1

0.9

0.8

0.7

0.6

f(x)
0.5

0.4

0.3

0.2

0.1

0
0 500 1000 1500 2000 2500 3000 3500
x

β
− x 
η 
F ( x) = 1 − e
Towashiraporn, P., Subbarayan, G., Desai, C.S., “A Hybrid Model for Computationally Efficient Fatigue Fracture Simulations
at Microelectronic Assembly Interfaces.” International Journal of Solids and Structures, v 42, p 4468-4483, 2005.

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 Hybrid Damage Model – SnPb Solder Joints
  ξ β 
D = 1 − exp −   
  ξc   N=2700

3.5E-02

Rate of damage change (1/cycle)

Anisothermal Test
3.0E-02
Isothermal Test
2.5E-02

2.0E-02
N=3,318
1.5E-02

1.0E-02

5.0E-03

0.0E+00
0 0.2 0.4 0.6 0.8 1

Normalized crack length

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 Challenges to Modeling Pb-Free (SnAgCu) Solders

• SnAgCu solder joints consist of a few randomly orientated large Sn grains

• Mechanical properties and coefficients of thermal expansion for Sn are anisotropic

Bieler et al. (2008)

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 Accounting for Microstructural Uncertainty

• Incorporating every microstructure feature for fracture modeling is not feasible

• The principle of maximum entropy can be utilized to maximally account for one’s
ignorance of microstructure

Bieler et al. (2008) Sundelin et al. (2008) Sundelin et al. (2008)

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 The Maximum Entropy Fracture Model (MEFM)

• Model inspired by two experimentally observed facts

– Cracks results from irreversible, dissipative processes
– Fracture has an inherent length-scale, time-scale, and/or spatial hierarchy influenced by
microstructural state

• Maximum Entropy Principle of Statistical Mechanics and Information Theory and the
is used to develop a fracture model that is least biased with regards to
microstructural uncertainty in lower levels of fracture

D. Bhate, K. Mysore, G. Subbarayan. “An Information Theoretic Argument on the

Form of Damage Accumulation in Solids,” Mechanics of Advanced Materials and
Structures, vol. 19, pp. 184-195, 2012 .

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 Hierarchy in Fracture Processes
Fracture in
Sea Sponge
Aizenberg et. al. (2005)

Fracture in
Solder Joint
Courtesy HDPUG

Fracture in
Latex Gel
Bohn et. al. (2005)
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 Theory: Information Hierarchy

ψ : Energy measure associated with fracture

Continuity
n

Monotonicity ψ = −k ∑ pi ln pi
i =1
Composition Shannon (1948), Information Theory

• Dominant crack path at modeled scale

• Multiple possible paths at lower scales
• Uncertainty
G. Subbarayan, Purdue Univ. ME 571 Reliability in Engineering Design
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 Theory: Maximum Entropy Principle
n
max ψ = −k ∑ pi ln pi
i =1
n
s.t. ∑p i =1
i =1
n
ψ (x) = ∑ψ (xi )pi
i =1

 ψ (xi ) 
pi = p0 exp  − 
 k

Maximally non-committal on microstructural uncertainty

Jaynes (1957), Statistical Mechanics
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 Theory: Damage Measure
t
 ψ ( xi ) 
D(t )
= ∫
0
f 0 exp  −
 k 
dt

Entropic Dissipation

Inelastic Dissipation rate

 W 
1 − exp  −
D= 
At constant rate of
dissipation
 ρ kT 

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 Model Parameter Characterization

D. Chan, G. Subbarayan, and L. Nguyen, “Maximum Entropy

G. Subbarayan, Purdue Univ.
Principle for Modeling Damage and Fracture in Solder
Joints: Enabling Life Predictions under Microstructural
Uncertainty,” Journal of Electronic Materials, vol. 41, no. 2,
pp. 398-411, 2012
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 Isothermal Cyclic Fatigue Tests on Sn3.8Ag0.7Cu
60

50

40

30

Load (N) 20

10

-10

-20

-30

-40
-0.005 0 0.005 0.01 0.015 0.02 0.025
Displacement (mm)
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 Thermal Cycling Test of WLCS Package
• 50 I/O chip scale packages
• Sn3.8Ag0.7Cu solder
• 0.3 mm pitch
Cross-sectional image of the wafer-level
CSP package

• 165 μm pad diameter

• 134 μm standoff height
• Accelerated thermal cycling Geometries of the UBM and two

• Failure analysis every 240 cycles

passivation layers

D. Chan, G. Subbarayan, and L. Nguyen, “Maximum Entropy Principle for Modeling Damage and
Fracture in Solder Joints: Enabling Life Predictions under Microstructural Uncertainty,” Journal of
Electronic Materials, vol. 41, no. 2, pp. 398-411, 2012

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 Observations of Crack Growth

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 Crack Growth Statistcs

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 Damage Accumulation at 4747 Cycles

Die Side
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 Fracture Progression of Critical Joint

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 Overall Fracture Growth at 4747 Cycles

Die Side
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 Comparison of Crack Lengths

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 Simulation vs. Experimental

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