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Physics of VLSI Devices (ECE-5018) Digital Assignment - II: M S G M S G
Physics of VLSI Devices (ECE-5018) Digital Assignment - II: M S G M S G
2. (a) calculate the built-in potential φbi of a Si p-n junction operating at 300 K for Na = 1014
and 1019 cm-3, with Nd = 1014,1015,1016, 1017,1018, and 1019 cm-3 in each case, and plot φbi vs.
Nd. (b) Plot the maximum electric field E0 vs. Nd for the junctions described in (a).
3. An abrupt Si p-n junction has Na = 1017 cm-3 on the p side and Nd = 1016 cm-3 on the n side. At
300 K, (a) calculate the Fermi levels, draw an equilibrium band diagram, and find φbi from
the diagram; (b) compare the result from (a) with φbi calculated from the expression we
derived.
4. Boron is implanted into an n-type Si sample (Nd = 1016 cm-3), forming an abrupt junction of
square cross section with area = 2 x 10-3 cm2. Assume that the acceptor concentration in the
p-type region is Na = 4 x 1018 cm-3. Calculate φbi, xn0, xp0, Q+, and E0 for this junction at
equilibrium (300 K).
5. In a p+n junction, the n side has a donor concentration 1016 cm-3. If ni = 1010 cm-3, the relative
dielectric constant ϵr = 12, Dn = 50 cm2/s, Dp = 20 cm2/s, and the electron and hole minority
carriers have lifetimes τ = 100 ns and 50 ns, respectively, and a forward bias of 0.6 V,
calculate the hole diffusion current density 2 µm from the depletion edge on the n side. If
we double the p+ doping, what effect will it have on this hole diffusion current?
6. A Si p+n junction has a donor doping of 5 X 10 16 cm-3 on the n side and a cross-sectional area
of 10-3 cm2. If τp = 1 µs and Dp = 10 cm2/s, calculate the current
with a forward bias of 0.5 V at 300 K.
7. A Si p-n junction with cross-sectional area A = 0.001 cm2 is formed with Na = 1015 cm-3, Nd =
1017 cm-3. Calculate:
(a) Built-in potential, φbi.
(b) Space-charge width at equilibrium (zero bias).
(c) Current with a forward bias of 0.5 V. Assume that the current is diffusion
dominated. Assume µn = 1500 cm2/V-s, µp = 450 cm2/V-s, τn = τp = 2.5 ms.
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Which carries most of the current, electrons or holes, and why? If you wanted
to double the electron current, what should you do?
8. A Si n+p junction has an area of 5 x 5 µm. Calculate the total junction capacitance associated
with this junction at an applied reverse bias of 2 V. Assume that the n+ region is doped 1020
cm-3 and the p doping is 1 X 1016 cm-3. If we forward bias this junction 0.5 V, what is the
electric field far from the junction on the p side, assuming a hole mobility of 250 cm2/V-s, an
electron mobility of 100 cm2/V-s, and a reverse saturation current density of 1 nA/cm2 for
this ideal diode?
9. Calculate the capacitance for the following Si n+p junction. Na = 1015 cm-3
Area = 0.001 cm2 Reverse bias = 1,5, and 10 V. Plot 1/C2 vs. Vr. Demonstrate that the slope
yields Na. Repeat calculations for Na = 1017 cm-3. Since the doping is not specified on the n+
side, use a suitable approximation.
10. We have a symmetric p-n silicon junction (Na = Nd= 1017 cm-3). If the peak electric field in the
junction at breakdown is 5 x 105 V/cm, what is the reverse breakdown voltage in this
junction?
11. We deposit a metal with a work function of 4.6 e V on Si (electron affinity of 4 eV)
and acceptor doping level of 1018 cm-3. Draw the equilibrium band diagram and
mark off the Fermi level, the band edges, and the vacuum level. Is this a Schottky
or ohmic contact, and why? By how much should the metal work function be altered
to change the type of contact? Explain with reference to the band diagram.
12. A Schottky barrier is formed between a metal having a work function of 4.3 eV
and p-type Si (electron affinity = 4 eV). The acceptor doping in the Si is 10 17 cm-3.
(a) Draw the equilibrium band diagram, showing a numerical value for Schottky barrier.
(b) Draw the band diagram with 0.3 V forward bias. Repeat for 2 V reverse bias.
13. Calculate the VT of a Si-P-channel MOS transistor for an n+-polysilicon gate with
silicon oxide thickness = 50 Å, Nd = 1 x 1018 cm- 3 and a fixed charge of 2 X 1010 q
C/cm2. Is it an enhancement- or depletion-mode device? What B dose is required to
change the VT to 0 V? Assume a shallow B implant.
14. A Si MOS capacitor has the high-frequency C–V curve shown below normalized to
the capacitance in strong accumulation. Determine the oxide thickness and substrate
doping assuming gate-to-substrate work function difference of-0.35 V.
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15. For a long channel n-MOSFET with VT = 1V, calculate the Vc required for an ID(sat.) of
0.1 mA and VD(sat.) of 5 V. Calculate the small-signal output conductance g and the
transconductance gm(sat.) at VD = 10 V. Sketch the cross section of this MOSFET, and
schematically show the inversion charge and depletion charge distributions for VD =
1V, 5 V, and 10 V. Recalculate the new I D for VG - VT = 3 V and VD = 4 V.
16. Calculate the VT of a Si n-channel MOSFET for a gate-to-substrate work function
difference φms = -1.5 eV, gate oxide thickness = 100 A, NA = 1018 cm-3, and fixed oxide
charge of 5 X 1010 q C/cm2, for a substrate bias of -2.5 V. At VT, what are the electron
and hole concentrations at the oxide-Si interface and deep in the substrate? Sketch a
labeled band diagram normal to the surface at VT, showing the Fermi potential.
17. Calculate the VT of a Si n-channel MOSFET for an n+-polysilicon gate with gate oxide
thickness = 100 A, NA = 1018 cm-3, and a fixed oxide charge of 5 X 1010 q C/cm2.
18. For a MOSFET with VT = 1V and W = 50 μm, L = 2 μm, calculate the drain current at
VG = 5 V, VD = 0.1 V. Repeat for VG = 3 V, VD = 5 V. Assume an electron channel
mobility μn = 200 cm2/V-s, and the substrate is connected to the source.
19. (a) Calculate the maximum space charge width and the maximum space charge
density (in p-type silicon, gallium arsenide, and germanium semiconductors of an
MOS structure. Let T = 300 K and assume NA = 1016 cm-3. (h) Repeat part (a) if T = 200
K.
20. Determine the metal-semiconductor work function difference φms in an MOS
structure with p-type silicon for the case when the gate is (a) aluminum. (b) n+
polysilicon. and (c) p+ polysilicon. Let NA = 6 x 1015 cm-3.
21. Consider an n+ polysilicon-silicon dioxide-n-type silicon MOS capacitor. Let
Nd = 1015 cm-3. Calculate the flat-band voltage for (a) Tox = 500 Å when fixed oxide
charge is (i) 1010 cm-2, (ii) 1011 cm-2, and (iii)5 x 1011 cm-2 (b). Repeat (a) when Tox =
250 A.
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the saturation region, the required rated current is ID(sat) = 6 mA when VGS = 5 V.
Determine the required W/L ratio. (b) A p-channel MOSFET has the same
requirements when VGS = 5V and has the same parameters as part (a) except μp =
300 cm2/V-s, and VT = -0.75 V. Determine the required W/L ratio.
33. An n-channel MOSFET has the following parameters:
Tox = 400 Å, NA = 5 x 1016 cm-3
VFB = -0.5 V, L = 2 μm
W = 10 μm, μn = 450 cm2/V-s.
Calculate the threshold voltage for the following values of source-to-body voltage:
VSB = 0, 1 V, 2 V and 4 V.
34. Consider a p-channel MOSFET with Tox = 600 Å and ND = 5 x 1016 cm-3. Determine the
body-to-source voltage VSB such that the shift in threshold voltage (ΔVT) from the VSB
= 0 is ΔVT = -1.5 V.
35. An NMOS device has the following parameters: n+ poly gate, T ox = 400 Å. NA =
1015 cm-3 and fixed oxide charge Qox = 5 x 1010 cm-2. (a) Determine VT. (b) Is it
possible to apply a VSB voltage such that VT = 0? If so, what is the value of VSB?