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  • Semiconductor - RF Device - Test Handler System

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    Anthony Fajardo
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    This document summarizes the specifications of a test handler system for semiconductor packages. The system can handle packages from 2x2mm to 50x50mm in size with throughputs of 3,500 to 5,500 units per hour. It uses direct lead contact testing and has features like a built-in vacuum generator, precision positioning within 0.05mm, and electrical pressure control. The document compares the Genesem system features to competitors in areas like tray handling, indexing, and vacuum application.

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    Semiconductor _RF device_Test Handler System

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    This document summarizes the specifications of a test handler system for semiconductor packages. The system can handle packages from 2x2mm to 50x50mm in size with throughputs of 3,500 to 5,500 units per hour. It uses direct lead contact testing and has features like a built-in vacuum generator, precision positioning within 0.05mm, and electrical pressure control. The document compares the Genesem system features to competitors in areas like tray handling, indexing, and vacuum application.

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    34 views1 page

    Semiconductor - RF Device - Test Handler System

    Uploaded by

    Anthony Fajardo
    This document summarizes the specifications of a test handler system for semiconductor packages. The system can handle packages from 2x2mm to 50x50mm in size with throughputs of 3,500 to 5,500 units per hour. It uses direct lead contact testing and has features like a built-in vacuum generator, precision positioning within 0.05mm, and electrical pressure control. The document compares the Genesem system features to competitors in areas like tray handling, indexing, and vacuum application.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
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    of 1

    Semiconductor/

    RF device

    Test handler & tape/ reel


    Test Handler System
    • Handling packages: Logic semiconductor packages
    • Handling device size: 2x2 ˜50x50
    • Interface type: DIO, GPIB, RS-232C
    • Throughput:3,500 ˜ 5,500 UPH
    • Test methods: Bottom pin direct lead contact type
    • Test integration: O/S tester or logic tester system
    • Vacuum: Built-in vacuum generator
    • Device conversion time: <10 mins
    • Plug-in accuracy (position accuracy: +/-0.05mm
    • Plunger pressure control: Electrical regulator type
    • Docking type: hard lock type and vertical docking plane
    • Optional item : Hot plate & picker rotator
    * Model : 4para / 16para / 32para type

    Items Competitors Genesem type Remarks


    Tray elevator Air cylinder Servo motor Prevent package
    bouncing in tray
    Tray loading No lift, clamp Tray clamp (4 side) Can handle
    and lift base warpaged tray
    Tray unloading No tray pusher Tray pusher Enable output picker
    place devices in the tray
    • In-shuttle: dual shuttle pocket in good manner
    (4 devices handling) Index picker Applied 1 pump, sol Individual vacuum Maintain balanced
    vacuum ejector applied for pressure level and
    • In-shuttle sensor detect device each picker prevent vacuum error
    Tray cover block No tray cover block Tray cover block Prevent device and
    tilt (mis-aligned device placement)
    machine damage

    www.genesem.com

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